JP2020113588A - Electrostatic chuck - Google Patents

Abstract

To sufficiently improve uniformity of a temperature distribution of a front face of a plate-like member of an electrostatic chuck.SOLUTION: An electrostatic chuck comprises: a plate-like member having a first front face almost orthogonal to a first direction and a second front face on the side opposite to the first front face; a base member having a third front face, and arranged so that the third front face is opposite to the second front face of the plate-like member; and a joint part that is arranged between the second front face of the plate-like member and the third front face of the base member, and joints the plate-like member and the base member, and is a device for holding an object onto the first front face of the plate-like member. The base member is provided with a supply port that opens to a side face of the base member, and a coolant passage communicated with the supply port, and a whole of the supply port is arranged on an outer side from an outer peripheral edge of the first front face of the plate-like member in a view of a first direction.SELECTED DRAWING: Figure 3

Description

The technology disclosed in this specification relates to an electrostatic chuck.

Electrostatic chucks are used, for example, to hold wafers during semiconductor manufacturing. The electrostatic chuck includes a plate-shaped member having a substantially planar surface (hereinafter, referred to as “adsorption surface”) substantially perpendicular to a predetermined direction (hereinafter, referred to as “first direction”), a base member, and a plate-shaped member. A joining portion that joins the member and the base member, and a chuck electrode provided inside the plate-shaped member are provided. The electrostatic chuck uses an electrostatic attractive force generated by applying a voltage to the chuck electrode to attract and hold the wafer on the attracting surface of the plate-shaped member.

If the temperature distribution of the wafer held on the attracting surface of the electrostatic chuck becomes uneven, the accuracy of each process (deposition, etching, etc.) on the wafer may decrease. Is required to be as uniform as possible. Therefore, in the base member, a supply port and a discharge port, a supply port and a discharge port that are opened on a side surface (a surface that connects the outer edge of the surface facing the plate member and the outer edge of the surface opposite to the surface). And a refrigerant flow path connecting between the refrigerant flow path and the refrigerant flow path are formed, and the temperature of the adsorption surface of the plate-shaped member is controlled by supplying the refrigerant to the refrigerant flow path (for example, see Patent Document 1).

JP, 2008-251681, A

The temperature of the refrigerant in the refrigerant channel is the lowest at the supply port to which the refrigerant is supplied. Further, the refrigerant supplied from the supply port formed in the base member is likely to generate turbulent flow near the supply port. Therefore, in the conventional electrostatic chuck, the position overlapping the vicinity of the supply port on the suction surface of the plate-shaped member in the first direction is likely to be a low temperature singular point, and the temperature distribution on the suction surface is sufficiently uniform. There is a problem that it cannot be improved.

This specification discloses a technique capable of solving the above-mentioned problems.

The technology disclosed in this specification can be implemented, for example, in the following modes.

(1) An electrostatic chuck disclosed in the present specification is a plate-shaped member having a first surface substantially orthogonal to a first direction and a second surface opposite to the first surface. A base member having a third surface, the third surface being arranged so as to face the second surface of the plate member; the second surface of the plate member; A joint portion arranged between the third surface of the base member and joining the plate member and the base member, and holding an object on the first surface of the plate member. In the electrostatic chuck, the base member is provided with a supply port that opens to a side surface of the base member, and a coolant flow path that communicates with the supply port. The entire supply port is arranged outside the outer peripheral edge of the first surface of the plate-shaped member. Here, the temperature of the refrigerant in the refrigerant passage formed in the base member is the lowest at the supply port to which the refrigerant is supplied. Further, the refrigerant supplied from the supply port formed in the base member is likely to generate turbulent flow near the supply port. Further, in the configuration in which the supply port is formed on the lower surface of the base member, the staying time of the refrigerant becomes relatively long in the vicinity of the supply port in the refrigerant flow path in the first direction. Therefore, on the first surface of the plate-shaped member, the region overlapping the supply port in the first direction tends to be a low temperature singular point. In this electrostatic chuck, the supply port is opened on the side surface of the base member, and the coolant channel communicating with the supply port is formed in the base member. Further, when viewed in the first direction, the entire supply port is arranged outside the outer peripheral edge of the first surface of the plate-shaped member. Therefore, according to the present electrostatic chuck, it is possible to suppress the occurrence of a low temperature singularity on the first surface of the plate-shaped member due to the presence of the supply port, and as a result, the plate-shaped member The uniformity of the temperature distribution on the first surface of can be improved.

(2) In the electrostatic chuck, a portion from the supply port to one-third of the entire length of the refrigerant channel in the extending direction of the refrigerant channel has an inflection point in the first direction view. A configuration that does not include the shape may be used. With the electrostatic chuck having such a configuration, it is possible to suppress the occurrence of turbulent flow even in the vicinity of the supply port where the temperature of the refrigerant is relatively low in the refrigerant flow path. Therefore, according to the present electrostatic chuck, it is possible to suppress the occurrence of a low temperature singularity point on the first surface of the plate-shaped member due to the turbulent flow of the refrigerant near the supply port, and as a result, the plate The uniformity of the temperature distribution on the first surface of the strip-shaped member can be improved more effectively.

(3) In the electrostatic chuck, the base member is formed with a discharge port that communicates with the coolant channel and that opens to a side surface of the base member. When viewed in the first direction, The entire discharge port may be arranged outside the outer peripheral edge of the first surface of the plate-shaped member. Here, the refrigerant supplied to the refrigerant passage of the base member is likely to cause turbulent flow even at its outlet. For this reason, on the first surface of the plate-shaped member, the region overlapping the outlet in the first direction tends to be a low temperature singular point. In the electrostatic chuck having the above configuration, as described above, the entire discharge port is arranged outside the outer peripheral edge of the first surface of the plate-shaped member in the first direction. Therefore, according to the electrostatic chuck of the present embodiment, it is possible to suppress the occurrence of a low temperature singularity point on the first surface of the plate-shaped member due to the existence of the discharge port, and as a result, The uniformity of temperature distribution on the first surface of the plate member can be improved more effectively.

The technology disclosed in the present specification can be realized in various forms, for example, a holding device, an electrostatic chuck, a vacuum chuck, a manufacturing method thereof, or the like. is there.

It is a perspective view which shows the external appearance structure of the electrostatic chuck 100 in 1st Embodiment roughly. It is explanatory drawing which shows roughly the XZ cross-section structure of the electrostatic chuck 100 in 1st Embodiment. It is explanatory drawing which shows roughly the XY cross-section structure of the electrostatic chuck 100 in 1st Embodiment. It is explanatory drawing which shows roughly the cross-sectional structure of a part of electrostatic chuck 100 in 1st Embodiment. It is explanatory drawing which shows roughly the cross-sectional structure of a part of electrostatic chuck 100 in 1st Embodiment. It is explanatory drawing which shows roughly the structure of the electrostatic chuck 100a of 2nd Embodiment.

A. First embodiment:
A-1. Structure of the electrostatic chuck 100:
FIG. 1 is a perspective view schematically showing an external configuration of the electrostatic chuck 100 according to the first embodiment, and FIG. 2 is an explanatory diagram schematically showing an XZ sectional configuration of the electrostatic chuck 100 according to the first embodiment. FIG. 3 is an explanatory diagram schematically showing the XY cross-sectional structure of the electrostatic chuck 100 in the first embodiment. 2 shows an XZ sectional configuration of the electrostatic chuck 100 at a position II-II in FIG. 3, and FIG. 3 shows an XY sectional configuration of the electrostatic chuck 100 at a position III-III in FIG. It is shown. 4 and 5 are explanatory views schematically showing a sectional configuration of a part of the electrostatic chuck 100 in the first embodiment. FIG. 4 shows a cross-sectional structure of a portion of the electrostatic chuck 100 at the position IV-IV in FIG. 3 parallel to the Z axis, and FIG. 5 shows electrostatic discharge at the position VV in FIG. A cross-sectional configuration of a portion of chuck 100 parallel to the Z-axis is shown. In each drawing, XYZ axes that are orthogonal to each other for specifying directions are shown. In this specification, the Z-axis positive direction is referred to as an upward direction and the Z-axis negative direction is referred to as a downward direction for convenience sake, but the electrostatic chuck 100 is actually installed in a direction different from such an orientation. May be done. The up-down direction corresponds to the first direction in the claims.

The electrostatic chuck 100 is a device that attracts and holds an object (for example, a semiconductor wafer W) by electrostatic attraction, and holds a semiconductor wafer W (hereinafter, referred to as “wafer W”) in a vacuum chamber of a semiconductor manufacturing apparatus, for example. Used to fix. The electrostatic chuck 100 includes a plate-shaped member 10 and a base member 20, which are arranged side by side in a predetermined arrangement direction (the vertical direction (Z-axis direction in this embodiment)). The plate-shaped member 10 and the base member 20 are arranged such that the lower surface S2 (see FIG. 2) of the plate-shaped member 10 and the upper surface S3 of the base member 20 face each other in the above-mentioned arrangement direction with a joint portion 30 described later interposed therebetween. To be done. That is, the base member 20 is arranged such that the upper surface S3 of the base member 20 is located on the lower surface S2 side of the plate member 10.

The plate-shaped member 10 is a member having a substantially circular planar upper surface (hereinafter, referred to as “adsorption surface”) S1 that is substantially orthogonal to the arrangement direction (Z-axis direction) described above, and is made of, for example, ceramics. From the viewpoint of strength, wear resistance, plasma resistance, etc., it is preferable to use, for example, ceramics containing aluminum oxide (alumina, Al ₂ O ₃ ) or aluminum nitride (AlN) as a main component. In addition, the main component here means a component with the largest content ratio (weight ratio). The plate member 10 has a diameter of, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and the plate member 10 has a thickness of, for example, about 1 mm to 10 mm. The suction surface S1 of the plate member 10 corresponds to the first surface in the claims, and the lower surface S2 of the plate member 10 corresponds to the second surface in the claims in the Z-axis direction. Corresponds to the first direction in the claims. Further, in this specification, a direction orthogonal to the Z-axis direction is referred to as a “plane direction”.

As shown in FIG. 2, inside the plate-shaped member 10, a chuck electrode 40 formed of a conductive material (for example, tungsten, molybdenum, platinum, etc.) is arranged. The shape of the chuck electrode 40 as viewed in the Z-axis direction is, for example, a substantially circular shape. When a voltage is applied to the chuck electrode 40 from a power source (not shown), electrostatic attraction is generated, and the electrostatic attraction causes the wafer W to be attracted and fixed to the attraction surface S1 of the plate-shaped member 10.

Inside the plate-shaped member 10, a heater electrode 50 composed of a resistance heating element containing a conductive material (for example, tungsten, molybdenum, platinum, etc.) is also arranged. When a voltage is applied to the heater electrode 50 from a power source (not shown), the heater electrode 50 generates heat to warm the plate-shaped member 10 and warm the wafer W held on the suction surface S1 of the plate-shaped member 10. To be Thereby, control of the temperature distribution of the wafer W is realized.

The base member 20 is, for example, a circular flat plate member having the same diameter as the plate member 10 or a diameter larger than that of the plate member 10, and is made of, for example, metal (aluminum, aluminum alloy, or the like). The diameter of the base member 20 is, for example, about 220 mm to 550 mm (normally 220 mm to 350 mm), and the thickness of the base member 20 is, for example, about 20 mm to 40 mm. The upper surface S3 of the base member 20 corresponds to the third surface in the claims.

The base member 20 is joined to the plate member 10 by the joint portion 30 arranged between the lower surface S2 of the plate member 10 and the upper surface S3 of the base member 20. The joint portion 30 is made of a resin material (adhesive material) such as silicone resin, acrylic resin, or epoxy resin. The thickness of the joint portion 30 is, for example, about 0.1 mm to 1 mm. The joining portion 30 may be arranged on the entire lower surface S2 of the plate-shaped member 10, or may be arranged only on a part of the lower surface S2.

A coolant channel 200 is formed inside the base member 20. When a coolant (for example, a fluorine-based inert liquid, water, etc.) is flown through the coolant channel 200, the base member 20 is cooled, and heat is transferred between the base member 20 and the plate-shaped member 10 via the joint portion 30. The plate member 10 is cooled by (heat extraction), and the wafer W held on the suction surface S1 of the plate member 10 is cooled. Thereby, control of the temperature distribution of the wafer W is realized.

The configuration of the coolant flow path 200 of the base member 20 will be described in more detail. As shown in FIG. 3, a supply port 201 and a discharge port 202 are opened on the side surface S5 of the base member 20. More specifically, the supply port 201 and the discharge port 202 are entirely arranged outside the outer peripheral edge of the suction surface S1 of the plate-shaped member 10 when viewed in the Z-axis direction. The side surface S5 of the base member 20 is a surface that connects the outer edge of the upper surface S3 and the outer edge of the lower surface S4 of the base member 20.

The coolant channel 200 is formed so as to connect the supply port 201 and the discharge port 202. More specifically, the refrigerant flow path 200 has a main flow path 220, a supply-side flow path 211, and a discharge-side flow path 212. The main flow channel 220 extends in a direction substantially parallel to the upper surface S3 of the base member 20 and is formed so as to connect the supply side flow channel 211 and the discharge side flow channel 212. In the electrostatic chuck 100 of the present embodiment, the main flow path 220 is formed in a spiral shape that is folded back near the center of the base member 20 when viewed in the Z-axis direction. In addition, the supply-side flow passage 211 extends in a stretching direction D (hereinafter, referred to as “supply-side peripheral stretching direction Df”) in a peripheral portion of the main flow passage 220 that is connected to the supply-side flow passage 211 when viewed in the Z-axis direction. , As viewed in the Y-axis direction, it is formed in a direction substantially parallel to the upper surface S3 of the base member 20 from the supply port 201 (the X-axis direction in this embodiment). More specifically, in the supply-side flow passage 211, an angle θi formed by a straight line L1 along the longitudinal direction of the supply-side flow passage 211 and a tangent line L2 of the base member 20 is 45° or less when viewed in the Z-axis direction. Are formed. Further, the discharge-side flow passage 212 extends in a stretching direction D (hereinafter, referred to as “discharge-side peripheral stretching direction De”) in a peripheral portion of the main flow passage 220 that is connected to the discharge-side flow passage 212 when viewed in the Z-axis direction. , As viewed in the Y-axis direction, it is formed in a direction substantially parallel to the upper surface S3 of the base member 20 from the discharge port 202 (X-axis direction in the present embodiment). That is, the supply-side flow path 211 and the discharge-side flow path 212 have a shape that does not include an inflection point when viewed in the Z-axis direction and the Y-axis direction.

Further, as shown in FIG. 3, a part of the main flow path 220 is arranged outside the outer peripheral edge of the suction surface S1 of the plate-shaped member 10 when viewed in the Z-axis direction. Specifically, a part (X1 portion in FIG. 3) of the main flow channel 220 adjacent to (connected to) the supply-side flow path 211 extending from the supply port 201 and a discharge-side flow path 212 extending from the discharge port 202 (connected). ) A part of the main flow path 220 (X2 portion in FIG. 3) is arranged outside the outer peripheral edge of the suction surface S1 of the plate member 10. In the present embodiment, the connection between the supply-side flow passage 211 and the main flow passage 220 and the connection between the discharge-side flow passage 212 and the main flow passage 220 are also closer to the outer peripheral edge of the suction surface S1 of the plate member 10. It is located outside.

Further, as shown in FIG. 4, it passes through the center of the supply port 201 and passes through a part of the main flow channel 220 adjacent to (connected to) the supply-side flow channel 211 extending from the supply port 201, as shown in FIG. In the cross section (for example, the cross section shown in FIG. 4 ), the supply-side flow passage 211 is connected to the main flow passage 220 at approximately the center in the height direction of the main flow passage 220 in the Z-axis direction. Similarly, as shown in FIG. 5, a part of the main flow channel 220 that is parallel to the Z-axis direction and passes through the center of the discharge port 202 and is adjacent to (connects to) the discharge-side flow channel 212 extending from the discharge port 202. In the cross section (for example, the cross section shown in FIG. 5) that passes through, the discharge-side flow passage 212 is connected to the main flow passage 220 at approximately the center in the height direction of the main flow passage 220 in the Z-axis direction. Therefore, the refrigerant supplied from the supply port 201 flows in the supply-side flow passage 211, the main flow passage 220, and the discharge-side flow passage 212 in a plane direction substantially parallel to the adsorption surface S1, and then from the discharge outlet 202. Is discharged. Further, as shown in FIG. 3, the supply-side flow passage 211 and the discharge-side flow passage 212 are connected to the main flow passage 220 at substantially the center in the width direction of the main flow passage 220 when viewed in the Z-axis direction.

As described above, in the electrostatic chuck 100 of the present embodiment, the main flow path 220 is formed in a spiral shape when viewed in the Z-axis direction, and the spiral shape has an inflection point IP near the center of the base member 20. Contains. In the present embodiment, the radius of curvature of the spiral shape is preferably 10 mm or more, and more preferably 20 mm or more. Further, in the present embodiment, in the entire length Lt of the refrigerant flow path 200 (that is, the length in the extending direction from the supply port 201 to the discharge port 202 in the Z-axis direction), from the supply port 201 to the inflection point IP. The length Lf is preferably longer than the length Le from the outlet 202 to the inflection point IP. In other words, the length Lf is preferably ½ or more of the total length Lt, and more preferably ⅓ or more of the total length Lt. That is, a portion from the supply port 201 to preferably ½ (more preferably ⅓) of the total length Lt of the refrigerant channel 200 in the extending direction of the refrigerant channel 200 is changed in the Z-axis direction when viewed. The shape does not include the bending point IP.

In the present embodiment, the main flow channel 220 has a dimension such that the width in the direction substantially orthogonal to the stretching direction when viewed in the Z-axis direction is 10 mm or more and 30 mm or less, and the height in the Z-axis direction is 10 mm or more, The length is preferably 30 mm or less, and the length along the extending direction of the main flow path 220 as viewed in the Z-axis direction is preferably 2000 mm or more and 6000 mm or less. Further, regarding the dimensions of the supply-side flow passage 211 and the discharge-side flow passage 212, the width in the direction substantially orthogonal to the stretching direction when viewed in the Z-axis direction is preferably 10 mm or more and 25 mm or less, and the height in the Z-axis direction. Is preferably 10 mm or more and 25 mm or less, and the length along the extending direction of the supply-side flow passage 211 and the discharge-side flow passage 212 in the Z-axis direction is preferably 15 mm or more and 50 mm or less. ..

In the base member 20 having such a configuration, for example, a groove having a shape corresponding to the main flow channel 220, the supply-side flow channel 211, and the discharge-side flow channel 212 is formed in one metal member (for example, an aluminum member), and It can be manufactured by joining a metal member and another metal member (for example, an aluminum member) in which any hole is not formed by, for example, welding.

A-2. Effects of the first embodiment:
As described above, the electrostatic chuck 100 of this embodiment has the plate-shaped member 10 having the attraction surface S1 that is substantially orthogonal to the Z-axis direction and the lower surface S2 opposite to the attraction surface S1, and the upper surface S3. A base member 20 having an upper surface S3 facing the lower surface S2 of the plate member 10, and a lower surface S2 of the plate member 10 and an upper surface S3 of the base member 20. The electrostatic chuck 100 includes a bonding portion 30 that bonds the member 10 and the base member 20, and holds an object (for example, a wafer W) on the attraction surface S1 of the plate-shaped member 10. Further, in the electrostatic chuck 100 of the present embodiment, the base member 20 is provided with the supply port 201 opening to the side surface S5 of the base member 20 and the coolant flow path 200 communicating with the supply port 201, and Z When viewed in the axial direction, the entire supply port 201 is arranged outside the outer peripheral edge of the suction surface S1 of the plate member 10.

Here, the temperature of the coolant in the coolant channel 200 formed in the base member 20 is the lowest near the supply port 201 to which the coolant is supplied. Further, the refrigerant supplied from the supply port 201 formed in the base member 20 is likely to cause turbulent flow near the supply port 201. Further, in the configuration in which the supply port 201 is formed on the lower surface S4 of the base member 20, the residence time of the refrigerant becomes relatively long in the vicinity of the supply port 201 inside the refrigerant flow path 200 when viewed in the Z-axis direction. Therefore, in the suction surface S1 of the plate-shaped member 10, the region overlapping the supply port 201 when viewed in the Z-axis direction is likely to be a low temperature singular point. In the electrostatic chuck 100 of the present embodiment, the supply port 201 is opened on the side surface S5 of the base member 20, and the coolant flow path 200 communicating with the supply port 201 is formed in the base member 20. Further, when viewed in the Z-axis direction, the entire supply port 201 is arranged outside the outer peripheral edge of the suction surface S1 of the plate-shaped member 10. Therefore, according to the electrostatic chuck 100 of the present embodiment, it is possible to suppress the occurrence of a low temperature singular point on the adsorption surface S1 of the plate-shaped member 10 due to the presence of the supply port 201, and as a result, The uniformity of the temperature distribution on the suction surface S1 of the plate member 10 can be improved.

Further, in the electrostatic chuck 100 of the present embodiment, the portion from the supply port 201 to one-third of the total length Lt of the refrigerant flow channel 200 in the extending direction D of the refrigerant flow channel 200 is changed in the Z axis direction. The shape does not include the bending point IP. Therefore, it is possible to suppress the occurrence of turbulent flow even in the portion of the coolant flow path 200 near the supply port 201 where the coolant temperature is relatively low. Therefore, according to the electrostatic chuck 100 of the present embodiment, it is possible to suppress the occurrence of a low temperature singular point on the adsorption surface S1 of the plate member 10 due to the turbulent flow of the refrigerant near the supply port 201. As a result, the uniformity of the temperature distribution on the suction surface S1 of the plate member 10 can be improved more effectively.

Further, in the electrostatic chuck 100 of the present embodiment, the base member 20 is formed with the discharge port 202 communicating with the coolant flow path 200 and opening to the side surface S5 of the base member 20. The entire discharge port 202 is arranged outside the outer peripheral edge of the suction surface S1 of the plate member 10. Here, the refrigerant supplied to the refrigerant flow path 200 of the base member 20 is likely to cause turbulent flow even at the outlet 202 thereof. For this reason, in the suction surface S1 of the plate-shaped member 10, the region overlapping the outlet 202 when viewed in the Z-axis direction is likely to be a low temperature singular point. In the electrostatic chuck 100 of this embodiment, as described above, the entire discharge port 202 is arranged outside the outer peripheral edge of the suction surface S1 of the plate-shaped member 10 when viewed in the Z-axis direction. Therefore, according to the electrostatic chuck 100 of the present embodiment, it is possible to suppress the occurrence of a low temperature singular point on the suction surface S1 of the plate-shaped member 10 due to the existence of the discharge port 202. As a result, the uniformity of the temperature distribution on the suction surface S1 of the plate member 10 can be improved more effectively.

B. Second embodiment:
FIG. 6 is an explanatory diagram schematically showing the configuration of the electrostatic chuck 100a of the second embodiment. FIG. 6 shows an XY cross-sectional structure of the electrostatic chuck 100a according to the second embodiment, which corresponds to the cross section of FIG. 3 described above. In the following, of the configurations of the electrostatic chuck 100a of the second embodiment, the same configurations as the configurations of the electrostatic chuck 100 of the first embodiment described above will be denoted by the same reference numerals, and description thereof will be appropriately omitted. ..

As shown in FIG. 6, the configuration of the electrostatic chuck 100a of the second embodiment is different from the configuration of the electrostatic chuck 100 of the first embodiment described above in the shape of the base member 20 when viewed in the Z-axis direction. ing. Specifically, in the electrostatic chuck 100a of the second embodiment, the base member 20 is partially defective in a part of its outer periphery when viewed in the Z-axis direction. In the Z-axis direction, the defective portion (hereinafter referred to as “defective portion”) is located outside the suction surface S1 of the plate-shaped member 10, and the defective portion overlaps the suction surface S1. It doesn't happen.

The supply port 201 formed in the base member 20 opens in a region of the side surface S5 of the base member 20 that faces the defective portion. Further, in the electrostatic chuck 100a of the present embodiment, the region of the side surface S5 where the supply port 201 is opened is substantially orthogonal to the extending direction of the refrigerant flow path 200 (specifically, the supply-side flow path 211). The cross section to be performed is substantially parallel. Note that the supply port 201 and the discharge port 202 are arranged outside the outer peripheral edge of the attraction surface S1 of the plate-shaped member 10 as viewed in the Z-axis direction, as in the electrostatic chuck 100 of the first embodiment.

As described above, in the electrostatic chuck 100a of the second embodiment, when viewed in the Z-axis direction, the entire supply port 201 and discharge port 202 are arranged outside the outer peripheral edge of the suction surface S1 of the plate-shaped member 10. Therefore, it is possible to suppress the occurrence of a low temperature singular point on the adsorption surface S1 of the plate member 10 due to the existence of the supply port 201 and the discharge port 202, and as a result, the adsorption of the plate member 10 The uniformity of the temperature distribution on the surface S1 can be improved. Further, in the electrostatic chuck 100a of the second embodiment, when viewed in the Z-axis direction, a region of the side surface S5 of the base member 20 in which the supply port 201 is opened and the coolant flow path 200 (specifically, the supply flow path). Since the cross section of the side flow passage 211) that is substantially orthogonal to the extending direction is substantially parallel, it is easy to attach when the supply port 201 and the coolant supply source (not shown) are connected.

C. Modification:
The technology disclosed in the present specification is not limited to the above-described embodiment, and can be modified into various forms without departing from the gist thereof, for example, the following modifications are also possible.

In the above-described embodiment, the discharge port 202 formed in the base member 20 adopts a configuration that opens on the side surface S5 of the base member 20, but the configuration is not limited to this, and a configuration that opens on the lower surface S4 of the base member 20. May be adopted. In such a configuration, the discharge port 202 is preferably opened in a region outside the outer peripheral edge of the suction surface S1 in the lower surface S4 of the base member 20 when viewed in the Z-axis direction.

In the above-described embodiment, the plate-shaped member 10 adopts a substantially columnar shape having the suction surface S1. However, the plate-shaped member 10 is not limited to this and has an outer periphery that is a portion where a notch is formed along the outer periphery of the plate-shaped member. A shape composed of a portion and an inner portion located inside the outer peripheral portion may be adopted. In other words, the shape is such that the thickness of the inner portion of the plate member (thickness in the Z-axis direction, the same applies hereinafter) is greater than the thickness of the outer peripheral portion by the amount of the notch formed in the outer peripheral portion. The shape of the plate-shaped member changes at the position of the boundary between the outer peripheral portion and the inner portion of the plate-shaped member. In the configuration in which the plate-shaped member 10 has the above-described shape, the supply port 201 formed in the base member 20 is arranged outside the outer peripheral edge of the inner part in the Z axis direction, and more preferably, the outer peripheral edge of the outer part. It is placed outside.

In the above-described embodiment, the coolant channel 200 formed in the base member 20 includes one inflection point IP when viewed in the Z-axis direction, but may include two or more inflection points. Further, in the above-described embodiment, the refrigerant flow path 200 has a portion from the supply port 201 to one-third of the total length Lt of the refrigerant flow path 200 in the extending direction D of the refrigerant flow path 200 when viewed in the Z-axis direction, The shape may include an inflection point.

In the above embodiment, the heater electrode 50 is arranged inside the plate-shaped member 10, but the heater electrode 50 does not necessarily have to be arranged inside the plate-shaped member 10.

In the above-described embodiment, the monopolar method in which one chuck electrode 40 is provided inside the plate-shaped member 10 is adopted, but the bipolar method in which the pair of chuck electrodes 40 is provided inside the plate-shaped member 10 is adopted. It may be adopted.

10: Plate-shaped member 20: Base member 30: Joining part 40: Chuck electrode 50: Heater electrode 100: Electrostatic chuck 100a: Electrostatic chuck 200: Refrigerant flow path 201: Supply port 202: Discharge port 211: Supply side flow path 212: Discharge side flow path 220: Main flow path D: Stretching direction De: Discharge side peripheral stretch direction Df: Supply side peripheral stretch direction IP: Inflection point L1: Straight line L2: Tangent line Le: Length Lf: Length Lt: Total length S1: Adsorption surface S2: Lower surface S3: Upper surface S4: Lower surface S5: Side surface W: Semiconductor wafer

Claims (3)

A plate-shaped member having a first surface substantially orthogonal to the first direction and a second surface opposite to the first surface;
A base member having a third surface, the base member being arranged so that the third surface faces the second surface of the plate-shaped member;
A joint portion arranged between the second surface of the plate member and the third surface of the base member, for joining the plate member and the base member;
And an electrostatic chuck for holding an object on the first surface of the plate-shaped member,
The base member is provided with a supply port that opens to a side surface of the base member, and a coolant channel that communicates with the supply port,
In the first direction view, the entire supply port is arranged outside the outer peripheral edge of the first surface of the plate-shaped member,
An electrostatic chuck characterized in that The electrostatic chuck according to claim 1,
A portion from the supply port to one-third of the entire length of the refrigerant channel in the extending direction of the refrigerant channel has a shape that does not include an inflection point in the first direction view,
An electrostatic chuck characterized in that The electrostatic chuck according to claim 1 or 2,
The base member is formed with a discharge port that communicates with the refrigerant flow path and that opens to a side surface of the base member,
When viewed in the first direction, the entire discharge port is arranged outside the outer peripheral edge of the first surface of the plate-shaped member,
An electrostatic chuck characterized in that

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