JP2020105315A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2020105315A5 JP2020105315A5 JP2018244012A JP2018244012A JP2020105315A5 JP 2020105315 A5 JP2020105315 A5 JP 2020105315A5 JP 2018244012 A JP2018244012 A JP 2018244012A JP 2018244012 A JP2018244012 A JP 2018244012A JP 2020105315 A5 JP2020105315 A5 JP 2020105315A5
- Authority
- JP
- Japan
- Prior art keywords
- composition according
- curable composition
- group
- epoxy
- isocyanate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000002989 phenols Chemical class 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 8
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 6
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 6
- 125000003700 epoxy group Chemical group 0.000 claims description 5
- 239000012948 isocyanate Substances 0.000 claims description 5
- -1 isocyanate compound Chemical class 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- 239000002516 radical scavenger Substances 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 150000002513 isocyanates Chemical class 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000005266 casting Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- JOLVYUIAMRUBRK-UTOQUPLUSA-N Cardanol Chemical compound OC1=CC=CC(CCCCCCC\C=C/C\C=C/CC=C)=C1 JOLVYUIAMRUBRK-UTOQUPLUSA-N 0.000 description 2
- JOLVYUIAMRUBRK-UHFFFAOYSA-N 11',12',14',15'-Tetradehydro(Z,Z-)-3-(8-Pentadecenyl)phenol Natural products OC1=CC=CC(CCCCCCCC=CCC=CCC=C)=C1 JOLVYUIAMRUBRK-UHFFFAOYSA-N 0.000 description 1
- FDIPWBUDOCPIMH-UHFFFAOYSA-N 2-decylphenol Chemical compound CCCCCCCCCCC1=CC=CC=C1O FDIPWBUDOCPIMH-UHFFFAOYSA-N 0.000 description 1
- YLKVIMNNMLKUGJ-UHFFFAOYSA-N 3-Delta8-pentadecenylphenol Natural products CCCCCCC=CCCCCCCCC1=CC=CC(O)=C1 YLKVIMNNMLKUGJ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- FAYVLNWNMNHXGA-UHFFFAOYSA-N Cardanoldiene Natural products CCCC=CCC=CCCCCCCCC1=CC=CC(O)=C1 FAYVLNWNMNHXGA-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- PTFIPECGHSYQNR-UHFFFAOYSA-N cardanol Natural products CCCCCCCCCCCCCCCC1=CC=CC(O)=C1 PTFIPECGHSYQNR-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018244012A JP7119991B2 (ja) | 2018-12-27 | 2018-12-27 | 硬化性組成物及び電子機器 |
| PCT/JP2019/044990 WO2020137246A1 (ja) | 2018-12-27 | 2019-11-18 | 硬化性組成物及び電子機器 |
| DE112019006551.3T DE112019006551T5 (de) | 2018-12-27 | 2019-11-18 | Härtbare zusammensetzung und elektronische vorrichtung |
| CN201980085725.6A CN113228203A (zh) | 2018-12-27 | 2019-11-18 | 固化性组合物和电子设备 |
| US17/354,715 US20210317251A1 (en) | 2018-12-27 | 2021-06-22 | Curable composition and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018244012A JP7119991B2 (ja) | 2018-12-27 | 2018-12-27 | 硬化性組成物及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020105315A JP2020105315A (ja) | 2020-07-09 |
| JP2020105315A5 true JP2020105315A5 (https=) | 2021-01-28 |
| JP7119991B2 JP7119991B2 (ja) | 2022-08-17 |
Family
ID=71126558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018244012A Active JP7119991B2 (ja) | 2018-12-27 | 2018-12-27 | 硬化性組成物及び電子機器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20210317251A1 (https=) |
| JP (1) | JP7119991B2 (https=) |
| CN (1) | CN113228203A (https=) |
| DE (1) | DE112019006551T5 (https=) |
| WO (1) | WO2020137246A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7847055B2 (ja) * | 2022-08-02 | 2026-04-16 | サカタインクス株式会社 | ウレタン(メタ)アクリレート化合物、組成物、硬化物及びウレタン(メタ)アクリレート化合物の製造方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE790295A (fr) * | 1971-10-22 | 1973-04-19 | Bayer Ag | Matieres plastiques elastifiees |
| JPS5829817B2 (ja) * | 1974-05-16 | 1983-06-24 | 武田薬品工業株式会社 | フンマツジヨウジユシソセイブツ |
| JPS51145598A (en) * | 1975-06-09 | 1976-12-14 | Asahi Denka Kogyo Kk | Curable epoxy resin composition |
| JPS5936928B2 (ja) * | 1976-07-19 | 1984-09-06 | 旭電化工業株式会社 | 硬化性エポキシ樹脂組成物 |
| US4396753A (en) * | 1981-12-28 | 1983-08-02 | Ford Motor Company | Diblocked diisocyanate diurea oligomers and coating compositions comprising same |
| JPS60262818A (ja) * | 1984-06-08 | 1985-12-26 | Idemitsu Petrochem Co Ltd | エポキシ樹脂組成物 |
| JPH0694496B2 (ja) * | 1986-02-21 | 1994-11-24 | 旭電化工業株式会社 | 硬化性組成物 |
| JP2620233B2 (ja) * | 1987-03-30 | 1997-06-11 | 旭電化工業株式会社 | 硬化性エポキシブロックドウレタン組成物 |
| DE68921092T2 (de) * | 1988-05-13 | 1995-08-03 | Nippon Paint Co Ltd | Hitzehärtende Harzzusammensetzung und Herstellung von hitzebeständigen Überzügen und Gegenständen auf der Basis dieser Zusammensetzung. |
| US4892756A (en) * | 1988-06-06 | 1990-01-09 | Lord Corporation | Flock adhesive composition |
| US4835226A (en) * | 1988-06-06 | 1989-05-30 | Lord Corporation | Flock adhesive composition |
| US5446077A (en) * | 1993-05-17 | 1995-08-29 | Nippon Paint Company, Ltd. | Oxazolidone ring-containing modified epoxy resins and cathodic electrodeposition paints containing same |
| IT1264960B1 (it) * | 1993-11-11 | 1996-10-17 | Eniricerche Spa | Composizioni isocianato/epossido polimerizzabili mediante microonde per applicazioni tecnicamente impegnative |
| CA2115533C (en) * | 1994-02-11 | 2002-06-18 | Hiroshi Uchida | Urethane modified epoxy resin compositions |
| KR100221035B1 (ko) * | 1996-03-01 | 1999-09-15 | 후지이 히로시 | 음극 전착도료 |
| DE19816570A1 (de) * | 1998-04-15 | 1999-10-21 | Bayer Ag | Reaktivsysteme und ihre Verwendung zur Herstellung von Beschichtungen, Klebstoffen, Dichtungsmassen, Vergußmassen oder Formteilen |
| JP3819254B2 (ja) | 2001-05-23 | 2006-09-06 | 新日鐵化学株式会社 | 熱硬化型塗料用硬化剤及び塗料組成物 |
| JP2008231142A (ja) | 2007-03-16 | 2008-10-02 | Nippon Paint Co Ltd | カチオン電着塗料組成物、補給用カチオン電着塗料組成物および電着塗料組成物の補給方法 |
| DE102010030924A1 (de) * | 2010-06-21 | 2011-12-22 | Endress + Hauser Flowtec Ag | Elektronik-Gehäuse für ein elektronisches Gerät bzw. damit gebildetes Gerät |
| JP5969405B2 (ja) * | 2013-01-30 | 2016-08-17 | 日立オートモティブシステムズ株式会社 | 車載用電子モジュール |
| MY174272A (en) * | 2013-08-23 | 2020-04-01 | Mitsui Chemicals Inc | Blocked isocyanate, coating composition, adhesive composition, and article |
-
2018
- 2018-12-27 JP JP2018244012A patent/JP7119991B2/ja active Active
-
2019
- 2019-11-18 DE DE112019006551.3T patent/DE112019006551T5/de not_active Ceased
- 2019-11-18 WO PCT/JP2019/044990 patent/WO2020137246A1/ja not_active Ceased
- 2019-11-18 CN CN201980085725.6A patent/CN113228203A/zh not_active Withdrawn
-
2021
- 2021-06-22 US US17/354,715 patent/US20210317251A1/en not_active Abandoned
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200801110A (en) | Resin composition for semiconductor encapsulation and semiconductor device | |
| MY143183A (en) | Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt | |
| RU2009123489A (ru) | Эпоксидные смолы, содержащие отверждающий агент на основе циклоалифатического диамина | |
| JP2013511604A (ja) | 強化エポキシ樹脂配合物 | |
| JP2017222881A5 (https=) | ||
| JP6864436B2 (ja) | 樹脂組成物、接着剤、硬化物、半導体装置 | |
| MY134219A (en) | Resin composition for encapsulating semiconductor chip and semiconductor device therewith | |
| RU2020110901A (ru) | Клеевые композиции на основе растворителей | |
| CA2913565A1 (en) | Formulated resin compositions for flood coating electronic circuit assemblies | |
| JP2020105315A5 (https=) | ||
| JP2019052315A5 (https=) | ||
| PH12022550995A1 (en) | Insulating resin composition, insulating resin cured body, layered body, and circuit base board | |
| AR114853A1 (es) | Composiciones adhesivas de dos componentes a base de silanos terminados en isocianatos y métodos para producirlas | |
| KR20110115635A (ko) | 저온 경화용 에폭시 도료 희석제 및 그 제조방법 | |
| JP2018188611A5 (https=) | ||
| JP2022501469A5 (https=) | ||
| MY137564A (en) | Resin composition for encapsulating semiconductor chip and semiconductor device therewith | |
| JP2011255639A5 (https=) | ||
| CO2021015714A2 (es) | Revestimiento protector de alta temperatura | |
| JP7119991B2 (ja) | 硬化性組成物及び電子機器 | |
| JP2008056857A5 (https=) | ||
| JPWO2022102489A5 (https=) | ||
| JP6702219B2 (ja) | 樹脂封止部品及びその製造方法 | |
| WO2020146044A3 (en) | Curable resin composition and fiber reinforced resin matrix composite material | |
| JP2017137407A5 (ja) | 電子デバイス |