JP2020101630A - 光モジュール - Google Patents
光モジュール Download PDFInfo
- Publication number
- JP2020101630A JP2020101630A JP2018238683A JP2018238683A JP2020101630A JP 2020101630 A JP2020101630 A JP 2020101630A JP 2018238683 A JP2018238683 A JP 2018238683A JP 2018238683 A JP2018238683 A JP 2018238683A JP 2020101630 A JP2020101630 A JP 2020101630A
- Authority
- JP
- Japan
- Prior art keywords
- plc
- control board
- interposer
- chip
- planar lightwave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 title claims abstract description 66
- 230000010354 integration Effects 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 238000003491 array Methods 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- 238000009429 electrical wiring Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000010453 quartz Substances 0.000 description 7
- 239000013307 optical fiber Substances 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008033 biological extinction Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
- G02F1/31—Digital deflection, i.e. optical switching
- G02F1/313—Digital deflection, i.e. optical switching in an optical waveguide structure
- G02F1/3136—Digital deflection, i.e. optical switching in an optical waveguide structure of interferometric switch type
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
- G02F1/31—Digital deflection, i.e. optical switching
- G02F1/313—Digital deflection, i.e. optical switching in an optical waveguide structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/12—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00 electrode
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Optical Integrated Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
301 インターポーザ
301a リードピン(ヒンジ電極)
301b リードピン(ヒンジ電極)
302 光ファイバ
303 平面光波回路(PLC)
304 マッハツェンダー干渉計
305 制御基板
306 固定板
307 電極パッド
308 ねじ
309 ガイドピン
Claims (8)
- 光モジュールであって、
上面に電極パッドを有する平面光波回路と、
前記平面光波回路の駆動用の制御基板であり、前記平面光波回路の上面上に配置され、前記平面光波回路の前記上面に対向する下面に電気パッドを有する、前記制御基板と、
前記平面光波回路の前記上面と前記制御基板の前記下面との間に配置された電気仲介部品と、
を備え、
前記平面光波回路の電極パッドと前記制御基板の電極パッドとが前記電気仲介部品を介して接続されたことを特徴とする光モジュール。 - 前記電気仲介部品がリードピンを有することを特徴とする請求項1に記載の光モジュール。
- 前記リードピンの部分がバネ式であることを特徴とする請求項2に記載の光モジュール。
- 前記電気仲介部品を複数用いて、前記平面光波回路と前記制御基板とが電気接続することを特徴とする請求項1乃至3いずれか一項に記載の光モジュール。
- 前記平面光波回路、前記電気仲介部品及び前記制御基板のうち少なくとも一が複数の枚数からなることを特徴とする請求項1乃至4いずれか一項に記載の光モジュール。
- 前記電気仲介部品は、前記平面光波回路の複数と重なり、かつ、接続していることを特徴とする請求項1乃至4いずれか一項に記載の光モジュール。
- 複数の前記平面光波回路上に前記制御基板が重なり、
ねじは該平面光波回路間に配置されていることを特徴とする請求項6に記載の光モジュール。 - 前記電気仲介部品は、インターポーザであることを特徴とする請求項1乃至7いずれか一項に記載の光モジュール。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018238683A JP7119980B2 (ja) | 2018-12-20 | 2018-12-20 | 光モジュール |
US17/297,817 US11977315B2 (en) | 2018-12-20 | 2019-12-11 | Optical module |
PCT/JP2019/048463 WO2020129771A1 (ja) | 2018-12-20 | 2019-12-11 | 光モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018238683A JP7119980B2 (ja) | 2018-12-20 | 2018-12-20 | 光モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020101630A true JP2020101630A (ja) | 2020-07-02 |
JP7119980B2 JP7119980B2 (ja) | 2022-08-17 |
Family
ID=71102161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018238683A Active JP7119980B2 (ja) | 2018-12-20 | 2018-12-20 | 光モジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US11977315B2 (ja) |
JP (1) | JP7119980B2 (ja) |
WO (1) | WO2020129771A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021019349A1 (en) | 2019-07-30 | 2021-02-04 | Ricoh Company, Ltd. | Capturing unit and vehicle control unit |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020086163A (ja) * | 2018-11-27 | 2020-06-04 | Nttエレクトロニクス株式会社 | 光モジュール |
CN115877505B (zh) * | 2023-01-06 | 2023-05-16 | 之江实验室 | 一种硅基光电子芯片及电子设备 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006259682A (ja) * | 2005-02-18 | 2006-09-28 | Sony Corp | 光電複合装置、それに用いられるicソケットおよび光導波路、光導波路結合チップ、並びにそれを用いた電子機器 |
WO2010050087A1 (ja) * | 2008-10-31 | 2010-05-06 | パナソニック株式会社 | 積層型半導体装置及びその製造方法 |
JP2010540941A (ja) * | 2007-09-26 | 2010-12-24 | フォームファクター, インコーポレイテッド | コンポーネントの組立て及び位置合わせ |
JP2011169670A (ja) * | 2010-02-17 | 2011-09-01 | Advanced Systems Japan Inc | プローブ装置 |
JP2016148753A (ja) * | 2015-02-12 | 2016-08-18 | 古河電気工業株式会社 | ベアモジュールおよび光モジュールの製造方法 |
US20160299361A1 (en) * | 2015-04-07 | 2016-10-13 | Lumentum Operations Llc | High bandwidth rf or microwave interconnects for optical modulators |
JP2017187521A (ja) * | 2016-04-01 | 2017-10-12 | 住友大阪セメント株式会社 | 光変調器 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US5160270A (en) * | 1989-06-13 | 1992-11-03 | General Datacomm, Inc. | Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards |
JP5180341B2 (ja) * | 2011-04-19 | 2013-04-10 | 日本電信電話株式会社 | 光部品 |
EP3602621B1 (en) * | 2017-03-29 | 2024-05-01 | Telefonaktiebolaget LM Ericsson (publ) | Chip-carrier socket for microfluidic-cooled three-dimensional electronic/photonic integrated circuits |
US11107799B1 (en) * | 2018-12-21 | 2021-08-31 | Psiquantum, Corp. | Hybrid system including photonic and electronic integrated circuits and cooling plate |
-
2018
- 2018-12-20 JP JP2018238683A patent/JP7119980B2/ja active Active
-
2019
- 2019-12-11 US US17/297,817 patent/US11977315B2/en active Active
- 2019-12-11 WO PCT/JP2019/048463 patent/WO2020129771A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006259682A (ja) * | 2005-02-18 | 2006-09-28 | Sony Corp | 光電複合装置、それに用いられるicソケットおよび光導波路、光導波路結合チップ、並びにそれを用いた電子機器 |
JP2010540941A (ja) * | 2007-09-26 | 2010-12-24 | フォームファクター, インコーポレイテッド | コンポーネントの組立て及び位置合わせ |
WO2010050087A1 (ja) * | 2008-10-31 | 2010-05-06 | パナソニック株式会社 | 積層型半導体装置及びその製造方法 |
JP2011169670A (ja) * | 2010-02-17 | 2011-09-01 | Advanced Systems Japan Inc | プローブ装置 |
JP2016148753A (ja) * | 2015-02-12 | 2016-08-18 | 古河電気工業株式会社 | ベアモジュールおよび光モジュールの製造方法 |
US20160299361A1 (en) * | 2015-04-07 | 2016-10-13 | Lumentum Operations Llc | High bandwidth rf or microwave interconnects for optical modulators |
JP2017187521A (ja) * | 2016-04-01 | 2017-10-12 | 住友大阪セメント株式会社 | 光変調器 |
Non-Patent Citations (2)
Title |
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APOSTOLOPOULOS, DIMITRIOS, ET AL.: "Photonic intergration enabling new multiplexing concepts in optical board-to-board and rack-to-rack", PROC. SPIE 8991, OPTICAL INTERCONNECTS XIV, vol. 89910D, JPN7020000199, 8 March 2014 (2014-03-08), US, ISSN: 0004700971 * |
YANG,YAN, ET AL.: "3D silicon photonics packaging based on TSV interposer for high density on-board optics module", 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), JPN6020002683, 31 May 2016 (2016-05-31), US, pages 483 - 489, ISSN: 0004700972 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021019349A1 (en) | 2019-07-30 | 2021-02-04 | Ricoh Company, Ltd. | Capturing unit and vehicle control unit |
Also Published As
Publication number | Publication date |
---|---|
WO2020129771A1 (ja) | 2020-06-25 |
US11977315B2 (en) | 2024-05-07 |
JP7119980B2 (ja) | 2022-08-17 |
US20210397065A1 (en) | 2021-12-23 |
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