JP2020077654A5 - - Google Patents

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Publication number
JP2020077654A5
JP2020077654A5 JP2018207908A JP2018207908A JP2020077654A5 JP 2020077654 A5 JP2020077654 A5 JP 2020077654A5 JP 2018207908 A JP2018207908 A JP 2018207908A JP 2018207908 A JP2018207908 A JP 2018207908A JP 2020077654 A5 JP2020077654 A5 JP 2020077654A5
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JP
Japan
Prior art keywords
mounting surface
edge ring
mounting
electrostatic chuck
mounting table
Prior art date
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Application number
JP2018207908A
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English (en)
Japanese (ja)
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JP7175160B2 (ja
JP2020077654A (ja
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Priority claimed from JP2018207908A external-priority patent/JP7175160B2/ja
Priority to JP2018207908A priority Critical patent/JP7175160B2/ja
Priority to TW108138377A priority patent/TW202032715A/zh
Priority to KR1020190139528A priority patent/KR102798648B1/ko
Priority to US16/672,704 priority patent/US20200144090A1/en
Priority to CN201911070184.8A priority patent/CN111146065A/zh
Publication of JP2020077654A publication Critical patent/JP2020077654A/ja
Publication of JP2020077654A5 publication Critical patent/JP2020077654A5/ja
Publication of JP7175160B2 publication Critical patent/JP7175160B2/ja
Application granted granted Critical
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JP2018207908A 2018-11-05 2018-11-05 基板処理装置 Active JP7175160B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018207908A JP7175160B2 (ja) 2018-11-05 2018-11-05 基板処理装置
TW108138377A TW202032715A (zh) 2018-11-05 2019-10-24 載置台及基板處理裝置
KR1020190139528A KR102798648B1 (ko) 2018-11-05 2019-11-04 배치대 및 기판 처리 장치
US16/672,704 US20200144090A1 (en) 2018-11-05 2019-11-04 Placing table and substrate processing apparatus
CN201911070184.8A CN111146065A (zh) 2018-11-05 2019-11-05 载置台和基板处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018207908A JP7175160B2 (ja) 2018-11-05 2018-11-05 基板処理装置

Publications (3)

Publication Number Publication Date
JP2020077654A JP2020077654A (ja) 2020-05-21
JP2020077654A5 true JP2020077654A5 (https=) 2021-09-16
JP7175160B2 JP7175160B2 (ja) 2022-11-18

Family

ID=70459897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018207908A Active JP7175160B2 (ja) 2018-11-05 2018-11-05 基板処理装置

Country Status (5)

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US (1) US20200144090A1 (https=)
JP (1) JP7175160B2 (https=)
KR (1) KR102798648B1 (https=)
CN (1) CN111146065A (https=)
TW (1) TW202032715A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7515310B2 (ja) * 2020-06-10 2024-07-12 東京エレクトロン株式会社 載置台、基板処理装置及び基板処理方法
JP7446176B2 (ja) * 2020-07-31 2024-03-08 東京エレクトロン株式会社 載置台及びプラズマ処理装置
CN114678246B (zh) * 2020-12-24 2025-10-14 中微半导体设备(上海)股份有限公司 用于电容耦合等离子处理器阻抗特性测量的测量装置和方法
JP7823461B2 (ja) * 2022-03-29 2026-03-04 住友大阪セメント株式会社 静電チャック装置
WO2024038832A1 (ja) * 2022-08-19 2024-02-22 東京エレクトロン株式会社 治具及び位置合わせ方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5805408A (en) * 1995-12-22 1998-09-08 Lam Research Corporation Electrostatic clamp with lip seal for clamping substrates
JP4592916B2 (ja) * 2000-04-25 2010-12-08 東京エレクトロン株式会社 被処理体の載置装置
WO2004095529A2 (en) * 2003-03-21 2004-11-04 Tokyo Electron Limited Method and apparatus for reducing substrate backside deposition during processing
JP4397271B2 (ja) * 2003-05-12 2010-01-13 東京エレクトロン株式会社 処理装置
US7713431B2 (en) * 2004-06-10 2010-05-11 Tokyo Electron Limited Plasma processing method
US20070283891A1 (en) * 2006-03-29 2007-12-13 Nobuyuki Okayama Table for supporting substrate, and vacuum-processing equipment
JP5317424B2 (ja) 2007-03-28 2013-10-16 東京エレクトロン株式会社 プラズマ処理装置
JP5357639B2 (ja) * 2009-06-24 2013-12-04 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
JP2011151263A (ja) * 2010-01-22 2011-08-04 Tokyo Electron Ltd エッチング方法、エッチング装置及びリング部材
JP2018107433A (ja) * 2016-12-27 2018-07-05 東京エレクトロン株式会社 フォーカスリング及び基板処理装置

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