JP2020068203A - 表示装置 - Google Patents
表示装置 Download PDFInfo
- Publication number
- JP2020068203A JP2020068203A JP2019190125A JP2019190125A JP2020068203A JP 2020068203 A JP2020068203 A JP 2020068203A JP 2019190125 A JP2019190125 A JP 2019190125A JP 2019190125 A JP2019190125 A JP 2019190125A JP 2020068203 A JP2020068203 A JP 2020068203A
- Authority
- JP
- Japan
- Prior art keywords
- display device
- region
- layer
- organic light
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims abstract description 137
- 239000010409 thin film Substances 0.000 claims abstract description 30
- 239000002346 layers by function Substances 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims description 19
- -1 polydimethylsiloxane Polymers 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 239000010408 film Substances 0.000 description 23
- 239000002585 base Substances 0.000 description 17
- 238000005452 bending Methods 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 229910052814 silicon oxide Inorganic materials 0.000 description 10
- 238000007789 sealing Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 239000011651 chromium Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000036961 partial effect Effects 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
Description
他の実施例の具体的な事項は、詳細な説明及び図面に含まれている。
Claims (15)
- 所定の軸に沿って折り畳まれ得る一つ以上の第1領域及び前記第1領域に隣接した第2領域を備えたベース層と、
前記ベース層の前記第2領域に積層された薄膜トランジスタ、有機発光素子及び機能層と、を含み、
前記第1領域は、前記第2領域に積層された薄膜トランジスタ、有機発光素子及び機能層に代えて充填層を含む、表示装置。 - 前記充填層は、前記第1領域に加えられる応力に耐えられる弾性力を有する、請求項1に記載の表示装置。
- 前記充填層は、50MPa以上200MPa以下の弾性係数を有する材料で形成されている、請求項2に記載の表示装置。
- 前記充填層が、前記第2領域の上部にも配されている、請求項1に記載の表示装置。
- 前記第1領域は、前記第2領域の薄膜トランジスタ、有機発光素子、及び機能層が食刻されて形成された領域である、請求項1に記載の表示装置。
- 前記第2領域には、表示領域及び該表示領域の両側端の非表示領域が含まれる、請求項1に記載の表示装置。
- 前記第2領域は、前記両側端の制御回路ブロックを含む、請求項6に記載の表示装置。
- 前記第1領域は、前記第1領域を挟んで互いに離隔された第2領域にあるピクセルの間を連結する導線を含む、請求項1に記載の表示装置。
- 前記導線は、前記第1領域の曲げ時または折り畳み時に加えられるストレスを低減する形状を有する、請求項8に記載の表示装置。
- 前記第1領域が、互いに異なる二方向に延びた、請求項1に記載の表示装置。
- 前記充填層は、液体状態、ゾル(sol)状態またはゲル(gel)状態の物質で形成されている、請求項1に記載の表示装置。
- 前記充填層が、ポリジメチルシロキサン(Polydimethylsiloxane)で構成されている、請求項11に記載の表示装置。
- 前記充填層は、13MPa以上14MPa以下の弾性率と50cps以上1000cps以下の粘度を有する材料で形成されている、請求項12に記載の表示装置。
- 前記充填層は、液晶分子をさらに含む、請求項11に記載の表示装置。
- 前記第2領域の機能層の最上層はバンクであり、
前記バンクの上部には、前記充填層の流動を制御する補助構造物が備えられた、請求項11に記載の表示装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2018-0126003 | 2018-10-22 | ||
KR20180126003 | 2018-10-22 | ||
KR10-2018-0156316 | 2018-12-06 | ||
KR1020180156316A KR20200045382A (ko) | 2018-10-22 | 2018-12-06 | 플렉서블 표시장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020068203A true JP2020068203A (ja) | 2020-04-30 |
JP6867461B2 JP6867461B2 (ja) | 2021-04-28 |
Family
ID=68342491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019190125A Active JP6867461B2 (ja) | 2018-10-22 | 2019-10-17 | 表示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11075347B2 (ja) |
EP (1) | EP3644370A1 (ja) |
JP (1) | JP6867461B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110992834A (zh) * | 2019-12-19 | 2020-04-10 | 京东方科技集团股份有限公司 | 一种显示面板和显示装置 |
CN113707007A (zh) * | 2020-05-21 | 2021-11-26 | 华为技术有限公司 | 一种显示面板和显示装置 |
KR20230016764A (ko) * | 2021-07-26 | 2023-02-03 | 삼성디스플레이 주식회사 | 표시장치 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006022273A2 (ja) * | 2004-08-24 | 2006-03-02 | Tohoku Device Co Ltd | 有機el素子と、有機el素子の保護膜及びその製法 |
JP2007136890A (ja) * | 2005-11-18 | 2007-06-07 | Casio Comput Co Ltd | 走査ヘッド及びドット照射素子 |
JP2015038609A (ja) * | 2013-07-19 | 2015-02-26 | 株式会社半導体エネルギー研究所 | 可撓性部品の支持具、および発光装置 |
JP2015129830A (ja) * | 2014-01-07 | 2015-07-16 | 株式会社ジャパンディスプレイ | 表示装置及び表示装置の製造方法 |
WO2018110529A1 (ja) * | 2016-12-16 | 2018-06-21 | Dic株式会社 | 表示素子用封止材料組成物、及び、それを用いた表示素子 |
US20180197484A1 (en) * | 2017-01-10 | 2018-07-12 | Samsung Display Co., Ltd. | Display device |
JP2019082553A (ja) * | 2017-10-30 | 2019-05-30 | 株式会社ジャパンディスプレイ | 表示装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9229481B2 (en) * | 2013-12-20 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
KR102513997B1 (ko) | 2016-02-04 | 2023-03-24 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102586046B1 (ko) | 2016-03-31 | 2023-10-10 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR102578589B1 (ko) * | 2016-09-30 | 2023-09-14 | 엘지디스플레이 주식회사 | 플렉서블 표시장치 |
KR20180042485A (ko) * | 2016-10-17 | 2018-04-26 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
KR102601500B1 (ko) | 2016-11-11 | 2023-11-15 | 삼성디스플레이 주식회사 | 표시장치 및 이를 포함하는 전자장치 |
KR20180067754A (ko) | 2016-12-12 | 2018-06-21 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102562900B1 (ko) * | 2018-02-02 | 2023-08-04 | 삼성디스플레이 주식회사 | 가요성 표시장치 및 터치감지 표시장치 |
-
2019
- 2019-10-10 US US16/598,970 patent/US11075347B2/en active Active
- 2019-10-17 JP JP2019190125A patent/JP6867461B2/ja active Active
- 2019-10-22 EP EP19204584.7A patent/EP3644370A1/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006022273A2 (ja) * | 2004-08-24 | 2006-03-02 | Tohoku Device Co Ltd | 有機el素子と、有機el素子の保護膜及びその製法 |
JP2007136890A (ja) * | 2005-11-18 | 2007-06-07 | Casio Comput Co Ltd | 走査ヘッド及びドット照射素子 |
JP2015038609A (ja) * | 2013-07-19 | 2015-02-26 | 株式会社半導体エネルギー研究所 | 可撓性部品の支持具、および発光装置 |
JP2015129830A (ja) * | 2014-01-07 | 2015-07-16 | 株式会社ジャパンディスプレイ | 表示装置及び表示装置の製造方法 |
WO2018110529A1 (ja) * | 2016-12-16 | 2018-06-21 | Dic株式会社 | 表示素子用封止材料組成物、及び、それを用いた表示素子 |
US20180197484A1 (en) * | 2017-01-10 | 2018-07-12 | Samsung Display Co., Ltd. | Display device |
JP2019082553A (ja) * | 2017-10-30 | 2019-05-30 | 株式会社ジャパンディスプレイ | 表示装置 |
Also Published As
Publication number | Publication date |
---|---|
US11075347B2 (en) | 2021-07-27 |
JP6867461B2 (ja) | 2021-04-28 |
EP3644370A1 (en) | 2020-04-29 |
US20200127217A1 (en) | 2020-04-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102633501B1 (ko) | 폴더블 표시장치 | |
KR102511049B1 (ko) | 터치 디스플레이 패널 | |
CN113126806B (zh) | 触摸显示装置 | |
KR102598831B1 (ko) | 스트레처블 표시장치 | |
US11093065B2 (en) | Display device | |
US11195888B2 (en) | Display device | |
JP6867461B2 (ja) | 表示装置 | |
US11552132B2 (en) | Display device and method of manufacturing the same | |
US11602053B2 (en) | Display device | |
KR102569727B1 (ko) | 표시장치 | |
CN111916479A (zh) | 显示装置 | |
US11150753B2 (en) | Display device including a touch detecting unit having an insulating pattern | |
KR20200126473A (ko) | 표시 장치 | |
CN113126804B (zh) | 触摸显示装置 | |
KR20180121256A (ko) | 폴더블 표시장치 | |
KR102533228B1 (ko) | 유기발광 표시장치 | |
KR20200052167A (ko) | 폴더블 표시장치 | |
US11251256B2 (en) | Display apparatus | |
KR102510942B1 (ko) | 유기발광 표시장치 | |
KR102538361B1 (ko) | 유기발광 표시장치 | |
KR20200045382A (ko) | 플렉서블 표시장치 | |
US20220238627A1 (en) | Display device | |
KR102455499B1 (ko) | 표시장치 | |
KR20220043560A (ko) | 플렉서블 표시장치 | |
KR20220089019A (ko) | 터치 표시 패널 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191018 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20201013 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201218 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210119 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210302 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210406 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210408 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6867461 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |