JP2020056579A - 厚み計測装置 - Google Patents
厚み計測装置 Download PDFInfo
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- JP2020056579A JP2020056579A JP2018184903A JP2018184903A JP2020056579A JP 2020056579 A JP2020056579 A JP 2020056579A JP 2018184903 A JP2018184903 A JP 2018184903A JP 2018184903 A JP2018184903 A JP 2018184903A JP 2020056579 A JP2020056579 A JP 2020056579A
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- 230000003595 spectral effect Effects 0.000 claims abstract description 19
- 230000001678 irradiating effect Effects 0.000 claims abstract description 8
- 230000003287 optical effect Effects 0.000 claims description 101
- 239000013307 optical fiber Substances 0.000 claims description 35
- 239000000835 fiber Substances 0.000 claims description 15
- 229910052736 halogen Inorganic materials 0.000 claims description 7
- 150000002367 halogens Chemical class 0.000 claims description 7
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052753 mercury Inorganic materials 0.000 claims description 3
- 229910001507 metal halide Inorganic materials 0.000 claims description 3
- 150000005309 metal halides Chemical class 0.000 claims description 3
- 229910052724 xenon Inorganic materials 0.000 claims description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 104
- 238000005498 polishing Methods 0.000 description 53
- 238000007517 polishing process Methods 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
- G01J3/0208—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows using focussing or collimating elements, e.g. lenses or mirrors; performing aberration correction
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
- G01J3/0218—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows using optical fibers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4788—Diffraction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/45—Interferometric spectrometry
- G01J2003/451—Dispersive interferometric spectrometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
2:基台
3:研磨手段
30:スピンドルユニット
31:スピンドルハウジング
33:サーボモータ
34:移動基台
35:マウント
36:研磨工具
361:支持基台
362:研磨パッド
363:開口
4:研磨送り手段
5:厚み計測装置
7:チャックテーブル機構
70:チャックテーブル
71:カバー部材
10:ウエーハ
12:デバイス
14:保護テープ
20:回転軸
22:貫通路
50:光学系
51:集光器
511:集光レンズ
51A:第一の集光器
51B:第二の集光器
51C:第三の集光器
52:光源
521:第一の光源
522:第二の光源
53:光路
531a:第一の光路
531b:第一の分岐光路
532a:第二の光路
532b:第二の分岐光路
54:光分岐部
541:第一の光分岐部
542:第二の光分岐部
55:回析格子
551:第一の回析格子
552:第二の回析格子
56:イメージセンサー
58:ダイクロイックミラー
60:選択手段
62:シャッター
100:制御手段
110:演算手段
Claims (3)
- ウエーハを保持する保持手段と、該保持手段に保持されたウエーハに対して透過性を有する波長域の光を照射してウエーハの厚みを計測する厚み計測装置であって、
ウエーハに対して透過性を有する波長域の光を発する光源と、保持手段に保持されたウエーハに対して該光源が発した光を照射する集光器と、該光源と該集光器とを連通する光路と、該光路に配設され該保持手段に保持されたウエーハから反射した反射光を該光路から分岐する光分岐部と、該光分岐部によって分岐された反射光を波長毎に分光する回析格子と、該回析格子によって波長毎に分光された光の強度を検出し、分光干渉波形を生成するイメージセンサーと、該イメージセンサーが生成した分光干渉波形を演算して厚み情報を出力する演算手段と、を少なくとも含み、
該光源は、狭い波長帯域を有する第一の光源と、該第一の光源に対し広い波長帯域を有する第二の光源と、を備え、
該光路は、該第一の光源の光を伝送するシングルモード光ファイバからなる第一の光路と、該第二の光源の光を伝送するマルチモード光ファイバからなる第二の光路とを備え、
該光分岐部は、該第一の光路に装着される第一の光分岐部と、該第二の光路に装着される第二の光分岐部とを備え、
該回析格子は、該第一の光分岐部によって分岐した反射光を波長毎に分光する第一の回析格子と、該第二の光分岐部によって分岐した反射光を波長毎に分光する第二の回析格子とを備え、
比較的厚いウエーハの厚みを計測する際は、該第一の回析格子によって分光された光を該イメージセンサーに導き、比較的薄いウエーハの厚みを計測する際は、該第二の回析格子によって分光された光を該イメージセンサーに導く選択手段を備えた厚み計測装置。 - 該第一の光源は、SLD光源、ASE光源のいずれかであり、該第二の光源は、ハロゲン光源、LED光源、キセノン光源、水銀光源、メタルハライド光源のいずれかである請求項1に記載の厚み計測装置。
- 該集光器は、シングルモード光ファイバとマルチモード光ファイバを並設して集光レンズを共用した第一の集光器、シングルモード光ファイバとマルチモード光ファイバをマルチコアファイバに連結させ集光レンズを共用した第二の集光器、シングルモード光ファイバとマルチモード光ファイバをダブルクラッドファイバに連結させ集光レンズを共用した第三の集光器のいずれかである請求項1、又は2に記載の厚み計測装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018184903A JP7103906B2 (ja) | 2018-09-28 | 2018-09-28 | 厚み計測装置 |
KR1020190107987A KR20200036739A (ko) | 2018-09-28 | 2019-09-02 | 두께 계측 장치 |
CN201910869121.2A CN110966944B (zh) | 2018-09-28 | 2019-09-16 | 厚度测量装置 |
US16/580,031 US10890433B2 (en) | 2018-09-28 | 2019-09-24 | Interferometric thickness measuring apparatus using multiple light sources coupled with a selecting means |
TW108134548A TWI830782B (zh) | 2018-09-28 | 2019-09-25 | 厚度測量裝置 |
DE102019214896.4A DE102019214896B4 (de) | 2018-09-28 | 2019-09-27 | Dickenmessvorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018184903A JP7103906B2 (ja) | 2018-09-28 | 2018-09-28 | 厚み計測装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020056579A true JP2020056579A (ja) | 2020-04-09 |
JP7103906B2 JP7103906B2 (ja) | 2022-07-20 |
Family
ID=69781640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018184903A Active JP7103906B2 (ja) | 2018-09-28 | 2018-09-28 | 厚み計測装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10890433B2 (ja) |
JP (1) | JP7103906B2 (ja) |
KR (1) | KR20200036739A (ja) |
CN (1) | CN110966944B (ja) |
DE (1) | DE102019214896B4 (ja) |
TW (1) | TWI830782B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020106277A (ja) * | 2018-12-26 | 2020-07-09 | 株式会社ディスコ | 厚み計測装置、及び厚み計測装置を備えた加工装置 |
KR20230017166A (ko) * | 2020-06-01 | 2023-02-03 | 엘지전자 주식회사 | 박막 특성 측정장치 |
US20230011748A1 (en) * | 2021-07-12 | 2023-01-12 | Applied Materials, Inc. | System and method to map thickness variations of substrates inmanufacturing systems |
DE102021124048A1 (de) * | 2021-09-16 | 2023-03-16 | Precitec Optronik Gmbh | Optische Dickenmessvorrichtung |
DE102022131700A1 (de) | 2022-11-30 | 2024-06-06 | Precitec Optronik Gmbh | Optische interferometrische Messvorrichtung und Verfahren |
CN117207056B (zh) * | 2023-11-07 | 2024-01-23 | 苏州博宏源机械制造有限公司 | 一种高精度晶片激光测厚装置及方法 |
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2018
- 2018-09-28 JP JP2018184903A patent/JP7103906B2/ja active Active
-
2019
- 2019-09-02 KR KR1020190107987A patent/KR20200036739A/ko not_active Application Discontinuation
- 2019-09-16 CN CN201910869121.2A patent/CN110966944B/zh active Active
- 2019-09-24 US US16/580,031 patent/US10890433B2/en active Active
- 2019-09-25 TW TW108134548A patent/TWI830782B/zh active
- 2019-09-27 DE DE102019214896.4A patent/DE102019214896B4/de active Active
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JP2017102139A (ja) * | 2015-11-30 | 2017-06-08 | 日本電信電話株式会社 | プローブファイバ及び光ファイバ側方入出力装置 |
JP2017125685A (ja) * | 2016-01-12 | 2017-07-20 | レーザーテック株式会社 | 厚さ測定装置及び厚さ分布測定装置 |
JP2018036212A (ja) * | 2016-09-02 | 2018-03-08 | 株式会社ディスコ | 厚み計測装置 |
JP2018063148A (ja) * | 2016-10-12 | 2018-04-19 | 株式会社ディスコ | 計測装置 |
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TWI830782B (zh) | 2024-02-01 |
CN110966944B (zh) | 2023-05-16 |
US10890433B2 (en) | 2021-01-12 |
US20200103220A1 (en) | 2020-04-02 |
DE102019214896B4 (de) | 2022-12-08 |
CN110966944A (zh) | 2020-04-07 |
TW202013358A (zh) | 2020-04-01 |
JP7103906B2 (ja) | 2022-07-20 |
DE102019214896A1 (de) | 2020-04-02 |
KR20200036739A (ko) | 2020-04-07 |
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