JP2020053505A - Solid electrolytic capacitor and manufacturing method thereof - Google Patents

Abstract

To provide a solid electrolytic capacitor and a manufacturing method thereof which reduce or avoid the adverse effect of heat generated during laser welding between an anode wire and a girder member on an element body.SOLUTION: A solid electrolytic capacitor A1 includes a capacitor element 100 including an element body 200 and an anode wire 300 protruding therefrom, a cathode mounting terminal, and an anode mounting terminal 400 which is conductively connected to the anode wire 300 through a girder member 410, and in the girder member 410, a wall 411 extending in a direction intersecting with an axis L of an anode wire 300 is formed on a side closer to the element body 200 than a joint 430 between the girder member 410 and the anode wire 300.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a solid electrolytic capacitor and a method for manufacturing the same.

  A solid electrolytic capacitor is generally configured as a surface mount type. For example, as shown in Patent Document 1, a capacitor element having an element body including a porous sintered body and an anode wire protruding therefrom is anode mounted. It has a configuration in which the terminal and the cathode mounting terminal are electrically connected and then wrapped in a resin package. The anode wire is welded to the girder member arranged on the anode mounting terminal while being mounted thereon. The cathode formed on the outer surface of the element body is electrically connected to the cathode mounting terminal by a conductive adhesive or the like.

  The anode wire irradiates a high-power laser beam to a contact portion with the beam member, and is welded to the beam member by heat generated thereby. In recent years, the miniaturization of resin packages has progressed, and the welded portion between the beam member and the anode wire and the element body are close to each other. Therefore, heat generated by laser beam irradiation or laser light directed toward the element body due to reflection The heat generated on the surface of the element body may damage the element body.

JP-A-2017-59652

  The present invention has been conceived under the circumstances described above, and is a solid electrolytic capacitor in which heat generated at the time of laser welding between an anode wire and a girder member has a reduced or avoided adverse effect on an element body. And a method for producing the same.

  In order to solve the above problems, the present invention employs the following technical means.

  That is, the solid electrolytic capacitor provided by the first aspect of the present invention includes a capacitor element including an element body and an anode wire protruding from the element body, a cathode mounting terminal, and a conductive connection to the anode wire via a spar member. A solid electrolytic capacitor including: an anode mounting terminal, wherein the spar member is closer to the element body than a joint between the spar member and the anode wire, in a direction intersecting the axis of the anode wire. An extended wall portion is formed.

  In a preferred embodiment, a resin package that exposes each part of the cathode mounting terminal and the anode mounting terminal to an outer surface and wraps the capacitor element, the beam member, the cathode mounting terminal, and the anode mounting terminal is included.

  In a preferred embodiment, the resin package includes a first outer surface that exposes a part of each of the cathode mounting terminal and the anode mounting terminal, and a first outer surface opposite to the first outer surface. A second outer surface that is parallel, the anode wire extending parallel to the first outer surface and the second outer surface.

  In a preferred embodiment, the wall portion extends toward the second outer surface of the resin package, and a tip of the wall portion is closer to the second part than the joint between the beam member and the anode wire. Located on the outer side.

  In a preferred embodiment, the anode wire is joined to the girder member in a state of being seated in a groove provided in the girder member, and the wall portion is formed by a joint between the girder member and the anode wire. Also, on the element body side, one side or both sides of the anode wire extends toward the second outer surface of the resin package.

  In a preferred embodiment, the concave groove has a V-shape.

  In a preferred embodiment, the concave groove has a U-shape.

  In a preferred embodiment, a joint between the beam member and the anode wire is formed by laser welding.

  In a preferred embodiment, the wall portion is formed by a portion of the girder member remaining without being melted when a joint between the girder member and the anode wire is formed by laser welding.

  The method for manufacturing a solid electrolytic capacitor provided by the second aspect of the present invention includes a capacitor element including an element body and an anode wire protruding from the element body, a cathode mounting terminal, and conductively connected to the anode wire via a spar member. And a method of manufacturing a solid electrolytic capacitor including the anode mounting terminal, wherein, when joining the anode wire to the beam member by welding by laser irradiation, the beam is closer to the element body side than a laser irradiated portion. It is characterized in that a heat shielding wall portion integral with the member is provided.

  In a preferred embodiment, the heat shielding wall is formed in advance on the beam member.

  In a preferred embodiment, the heat shielding wall portion is formed by a portion of the beam member left unmelted by laser irradiation.

  In a preferred embodiment, the solid electrolytic capacitor exposes a part of each of the cathode mounting terminal and the anode mounting terminal to an outer surface and encloses the capacitor element, the girder member, the cathode mounting terminal, and the anode mounting terminal. Including resin package.

  In a preferred embodiment, the resin package includes a first outer surface that exposes a part of each of the cathode mounting terminal and the anode mounting terminal, and a first outer surface opposite to the first outer surface. A second outer surface that is parallel, the anode wire extending parallel to the first outer surface and the second outer surface.

  In a preferred embodiment, the heat-shielding wall portion extends toward the second outer surface of the resin package, and a tip of the heat-shielding wall portion is connected to the joint between the beam member and the anode wire. Portion is located closer to the second outer surface than the portion.

  In a preferred embodiment, the anode wire is joined to the spar member in a state of being seated in a concave groove provided in the spar member, and the heat shielding wall is closer to the element body than the joint. , One side or both sides of the anode wire extends toward the second outer surface of the resin package.

  In a preferred embodiment, the concave groove has a V-shape.

  In a preferred embodiment, the concave groove has a U-shape.

  In a preferred embodiment, the laser irradiation is performed on a contact portion between the anode wire and the groove on one side or both sides of the anode wire.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the drawings.

It is a top view of the solid electrolytic capacitor concerning a 1st embodiment of the present invention. FIG. 2 is a front view of the solid electrolytic capacitor shown in FIG. 1. FIG. 2 is a left side view of the solid electrolytic capacitor shown in FIG. 1. FIG. 4 is a sectional view taken along the line IV-IV in FIG. 1. FIG. 5 is a sectional view taken along line VV in FIG. 1. It is sectional drawing which follows the VI-VI line of FIG. FIG. 2 is a perspective view showing a main part of the solid electrolytic capacitor shown in FIG. 1. It is a partial expanded sectional view of a capacitor element. FIG. 2 is an explanatory diagram of a method for manufacturing the solid electrolytic capacitor shown in FIG. 1. FIG. 2 is an explanatory diagram of a method for manufacturing the solid electrolytic capacitor shown in FIG. 1. FIG. 2 is an explanatory diagram of a method for manufacturing the solid electrolytic capacitor shown in FIG. 1. FIG. 2 is an explanatory diagram of a method for manufacturing the solid electrolytic capacitor shown in FIG. 1. FIG. 2 is an explanatory diagram of a method for manufacturing the solid electrolytic capacitor shown in FIG. 1. FIG. 6 is a diagram showing a modification of the solid electrolytic capacitor shown in FIG. 1, and is a diagram corresponding to a cross section taken along line VI-VI in FIG. 1. FIG. 15 is a perspective view showing a main part of the solid electrolytic capacitor shown in FIG. 14. FIG. 6 is a diagram illustrating another modified example of the solid electrolytic capacitor illustrated in FIG. 1 and is a diagram corresponding to a cross section taken along line VI-VI in FIG. 1. FIG. 17 is a perspective view showing a main part of the solid electrolytic capacitor shown in FIG. 16. It is a longitudinal section of the solid electrolytic capacitor concerning a 2nd embodiment of the present invention. FIG. 19 is a perspective view showing a main part of the solid electrolytic capacitor shown in FIG. 18. FIG. 19 is an explanatory diagram of a method for manufacturing the solid electrolytic capacitor shown in FIG. 18.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 7 show a solid electrolytic capacitor A1 according to a first embodiment of the present invention. The solid electrolytic capacitor A1 includes a capacitor element 100, an anode mounting terminal 400, a cathode mounting terminal 500, a beam member 410, and a resin package 600.

  Capacitor element 100 includes an element body 200 and an anode wire 300 protruding from element body 200. The element body 200 includes a porous sintered body 210, a dielectric layer 221, a solid electrolyte layer 222, and a conductive layer 223. At the base of the anode wire 300, a stain prevention ring 230 is mounted.

  As shown in FIGS. 4 and 5, the element body 200 is formed in a rectangular parallelepiped shape reflecting the shape of the porous sintered body 210. That is, the element body 200 includes a bottom surface 205, an upper surface 206 that is separated from the bottom surface 205 by a predetermined distance and is parallel to the bottom surface 205, a first side surface 201 from which the anode wire 300 protrudes, It has a second side 202 opposite to the first side 201, a third side 203 connecting the first side 201 and the second side 202, and a fourth side 204 opposite thereto. The anode wire 300 has a rod shape with a circular cross section, and protrudes in parallel with the bottom surface 205, the top surface 206, and the third and fourth side surfaces 203 and 204 at a substantially central position in the width direction and the height direction of the first side surface 201. . The anode wire 300 is formed of the same material as a valve metal which is a material constituting a porous sintered body 210 described later. The seepage prevention ring 230 is made of, for example, fluororesin having electrical insulation properties.

  As shown in FIGS. 4, 5 and 8, the dielectric layer 221 is covered with a ring 230 for preventing swelling on the first side surface 201 of the element body 200 from the inner surface of the pores 211 of the porous sintered body 210. It is formed over a region that does not touch, a bottom surface 205, an upper surface 206, a second side surface 202, a third side surface 203, and a fourth side surface 204. The dielectric layer 221 is made of an oxide of a valve metal constituting the porous sintered body 210. Examples of the valve metal constituting the porous sintered body 210 include tantalum (Ta) and niobium (Nb). Therefore, the material forming the dielectric layer 221 includes tantalum pentoxide or niobium pentoxide.

  As shown in FIGS. 4, 5, and 8, the solid electrolyte layer 222 is formed on the dielectric layer 221. Part of the solid electrolyte layer 222 enters the pores 211 of the porous sintered body 210 and fills the pores 211 while covering the dielectric layer 221 in the pores 211. The surface covers the dielectric layer 221. However, direct conduction between the solid electrolyte layer 222 and the anode wire 300 is blocked by the swelling prevention ring 230 on the first side surface 201 of the element body 200. The solid electrolyte layer 222 is made of, for example, manganese dioxide or a conductive polymer. During the operation of the solid electrolytic capacitor A1, charges are held at the interface between the dielectric layer 221 and the solid electrolyte layer 222.

  As shown in FIGS. 4, 5, and 8, the conductive layer 223 is formed to be stacked on the solid electrolyte layer 222 and is electrically connected to the solid electrolyte layer 222. The conductive layer 223 has a layer structure including, for example, a graphite layer and a silver (Ag) layer. The conductive layer 223 is laminated on the solid electrolyte layer 222 on the surface of the element main body 200, and the anode wire is formed on the first side surface 201 of the element main body 200 by the swelling prevention ring 230, as described above for the solid electrolyte layer 222. Direct conduction with 300 is interrupted. This conductive layer 223 functions as a cathode layer.

As shown in FIGS. 4 and 5, in the present embodiment, a protective layer 250 is formed on a part of the surface of the conductive layer 223. The protective layer 250 is made of, for example, a hard material such as Si, SiO ₂ , or Si ₃ N _4, and is preferably formed densely with a thickness of 0.01 to 100 μm by a sputtering method. Since the protective layer 250 has an insulating property, the second side surface 202 and the third side surface of the element main body 200 are avoided on the surface of the conductive layer 223 except for a region to which a cathode mounting terminal 500 described later is connected. 203, a fourth side surface 204 and an upper surface 206.

  The anode mounting terminal 400 is derived from a manufacturing frame and is made of, for example, a Ni-Fe alloy such as 42 alloy, and a part of the anode mounting terminal 400 is flush with the bottom surface (first outer surface) 605 of the resin package 600. . The spar member 410 formed of the same material as the anode mounting terminal 400 is joined to the anode mounting terminal 400 by, for example, a conductive adhesive 540. The spar member 410 has a long rod shape extending in a direction perpendicular to the axis L of the anode wire 300. The anode wire 300 is joined to the girder member 410 while being seated on the upper surface thereof. The present invention is characterized by a joining structure and a joining method between the beam member 410 and the anode wire 300, which will be further described later.

  The cathode mounting terminal 500 is joined to the bottom surface 205 of the element body 200 by, for example, a conductive adhesive 540, and a part of the cathode mounting terminal 500 is flush with the bottom surface (first outer surface) 605 of the resin package 600. The cathode mounting terminal 500 is also derived from the manufacturing frame, and is made of, for example, a Ni-Fe alloy such as 42 alloy.

  The resin package 600 encloses the capacitor element 100, the anode mounting terminal 400, the beam member 410, and the cathode mounting terminal 500, and is made of, for example, epoxy resin. Preferably, a glass frit is dispersed and mixed into the epoxy resin to maintain its mechanical strength. The resin package 600 has a rectangular parallelepiped shape surrounding the capacitor element 100. The resin package 600 includes a bottom surface (a first outer surface) 605, an upper surface (a second outer surface) 606 that is spaced apart from the bottom surface 605 by a predetermined distance and is parallel to the bottom surface 605, and a bottom surface 605 and an upper surface 606. Four side surfaces that connect them, that is, a first side surface 601 corresponding to and parallel to the first side surface 201 of the element body 200, a second side surface 602 opposite to and parallel to the first side surface 601; The element main body 200 has a third side surface 603 and a fourth side surface 604 corresponding to and corresponding to the third side surface 203 and the fourth side surface 204, respectively. The anode mounting terminal 400 is exposed on one side of the bottom surface (first outer surface) 605 of the resin package 600, and the cathode mounting terminal 500 is exposed on the other side.

  The anode wire 300 of the capacitor element 100 is joined to the spar member 410 in a state of being seated in a concave groove 420 formed on the upper surface of the spar member 410. In the present embodiment, the concave groove 420 has a V-shape. Bonding between the anode wire 300 and the spar member 410 is performed by laser welding by irradiating a high-power laser near the contact portion between the anode wire 300 and the inner surface of the concave groove 420 on both sides of the anode wire 300. Done. Thereby, both the anode wire 300 and the beam member 410 are partially melted and solidified by the high heat generated by the laser irradiation, and the joint 430 is formed.

  On the beam member 410, a wall portion 411 extending in a direction intersecting with the axis L of the anode wire 300 is formed closer to the element body 200 than the bonding portion 430 is. In the present embodiment, the wall portion 411 is provided so as to extend upward from the upper surface of the spar member 410, that is, toward the upper surface (second outer surface) 606 of the resin package 600, integrally with the spar member 410. Have been. In the present embodiment, the wall portion 411 is formed integrally with the beam member 410 in advance, and the anode wire 300 needs to be seated in the concave groove 420. Therefore, the V-shaped concave groove 420 is also provided in the wall portion 411. Are formed in series. Therefore, the wall 411 extends upward on both sides of the anode wire 300. The height of the wall portion 411 is set to be higher (on the upper surface 606 side of the resin package 600) than the joint portion 430 between the anode wire 300 and the beam member 410. Note that the wall 411 may be formed separately and attached to an appropriate position on the upper surface of the beam member 410.

  Next, an example of a method for manufacturing the solid electrolytic capacitor A1 according to the present embodiment will be described with reference to FIGS.

  First, the capacitor element 100 having the above configuration is prepared (FIG. 9). At this stage, the anode wires 300 of the capacitor element 100 are extended with a sufficient length, and the plurality of capacitor elements 100 are suspended from the longitudinal support bar 730 by welding one end of the anode wires 300 or the like. Have been.

  In this method example, at this stage, the beam member 410 is joined to the anode wire 300 by welding. As described above, the joining between the spar member 410 and the anode wire 300 is performed by laser welding, which will be described in detail below.

  As described above, the spar member 410 has a long rod shape, and the bottom surface thereof is a flat surface to be joined to the upper surface of the anode mounting terminal 400. A V-shaped concave groove 420 extending in the lateral direction of the beam member 410 is formed on the upper surface of the beam member 410, and the above-described wall is formed at a position near the first side surface 201 of the element body 200 after bonding. A part 411 is formed. The wall 411 is formed on both sides of the groove 420.

  Next, as shown in FIG. 10, the spar member 410 is held in an appropriate posture by using an appropriate jig 800, and the anode wire 300 is positioned so as to be fitted into the concave groove 420. The laser beam S is irradiated toward a contact portion between the groove 300 and the inner surface of the groove 420. The portion to be irradiated with the laser beam S is closer to the tip of the anode wire 300 than to the wall 411. Specifically, as shown in FIG. 10, the laser beam S is applied to two places on both sides of the anode wire 300 at the tip of the anode wire 300 relative to the wall 411 in plan view. By the heat generated by such laser beam irradiation, both the anode wire 300 and the beam member 410 are melted and alloyed, and are solidified to form a joint 430 by welding.

  By the way, during the irradiation period of the laser light S, high heat is radiated to the surroundings from the vicinity of the part to be the joint 430 and the reflected light of the laser light S itself is radiated to the surroundings. Since the wall portion 411 is located between the first side surface 201 of the element main body 200 and the wall portion 411, the wall portion 411 functions as a heat shielding wall portion, and avoids or reduces thermal damage to the surface of the element main body 200 by the laser beam S. can do.

Next, as shown in FIG. 11, a protective layer 250 is formed so as to cover the surface of the element body 200 of the capacitor element 100, that is, the conductive layer 223. The protective layer 250 is formed by a sputtering method using SiO ₂ , Si ₃ N ₄ , or the like as a thin film while masking a region where the cathode mounting terminal 500 is to be joined.

  Next, as shown in FIG. 12, the capacitor element 100 in which the anode wire 300 has been cut to a required length, the protective layer 250 has been formed, and the spar member 410 has been joined to the anode wire 300 is connected to a lead frame. For example, conductive adhesives 440 and 540 are provided on 710 and 720, respectively.

  Next, as shown in FIG. 13, a resin package 600 is formed, and inside the resin package 600, the capacitor element 100, a portion of the lead frames 710 and 720 to be the anode mounting terminal 400, and a cathode. The part to be the mounting terminal 500 is wrapped. The resin package 600 can be formed by a transfer molding method. Finally, unnecessary portions of the lead frames 710 and 720 are cut and removed to complete the solid electrolytic capacitor A1.

  According to the solid electrolytic capacitor A1 having the above-described configuration and the method of manufacturing the same, when laser welding the beam member 410 and the anode wire 300, the adverse effects such as thermal damage to the element body 200 due to high heat generated during laser beam irradiation are reduced or avoided. In addition, it is possible to prevent a decrease in product yield. This is a significant advantage in the manufacture of increasingly smaller solid electrolytic capacitors.

FIGS. 14 and 15 show a solid electrolytic capacitor A11 according to a modification of the solid electrolytic capacitor A1 according to the _first embodiment.

The solid electrolytic capacitor A1 _1, the configuration of the wall portion 411 provided on the beam member 410 is different from the solid electrolytic capacitor A1. That is, as shown in the figure, the concave groove 421 provided between the wall portions 411 so as to be continuous with the concave groove 420 provided at the distal end of the spar member 410 has a height corresponding to the upper surface of the distal end of the spar member 410. In the figure, the upper part extends upward with a certain width. The slit width between the walls 411 thus formed is substantially the same as the outer diameter of the anode wire 300. As other constitution of the solid electrolytic capacitor A1 ₁ is the same as the solid electrolytic capacitor A1 described above.

In the solid electrolytic capacitor A1 _1, since the width between the wall portion 411 extending upwardly across the anode wire 300 can be reduced, heat and laser when the laser welding between anode wire 300 and the beam member 410 as described above The same advantages as described above for the solid electrolytic capacitor A1 can be enjoyed while increasing the efficiency of shielding the reflected light from the element body 200.

16 and 17, showing a solid electrolytic capacitor A1 ₂ according to another modified example of the solid electrolytic capacitor A1 according to the first embodiment.

The solid electrolytic capacitor A1 _2, compared solid electrolytic capacitor A1 ₁ according to the modified example, except groove 420 leading between the wall portion 411 from the distal end side upper surface of the beam member 410 is U-shaped, the remaining configuration of the same solid electrolytic capacitor A1 ₁ according to the modification. It is preferable that the bottom of the concave groove 420 is a cylindrical inner surface corresponding to the outer peripheral surface of the anode wire 300.

In this solid electrolytic capacitor A1 _2, compared with the solid electrolytic capacitor A1 and solid electrolytic capacitor A1 ₁ the groove 420 is V-shaped to provide the spar member 410, the bottom and the anode wire 300 of the groove 420 Heat and laser reflected light from the gap can be prevented from reaching the element body 200. In addition to the effect of shielding the heat or laser reflected light by the wall portion 411, laser welding between the anode wire 300 and the beam member 410 can be prevented. Can be more effectively reduced or avoided.

  18 to 20 show a solid electrolytic capacitor A2 according to a second embodiment of the present invention. The solid electrolytic capacitor A2 differs from the solid electrolytic capacitor A1 according to the first embodiment in the form of the girder member 410, the form of the wall 411, the joining structure with the anode wire 300, and the joining method. That is, in the solid electrolytic capacitor A2 according to the present embodiment, the wall portion 411 is formed at the time of laser welding of the beam member 410 and the anode wire 300, and the wall portion 411 thus formed is heated by the heat applied to the element body 200. Provides a shielding function to reduce or avoid adverse effects. The remaining configuration of the solid electrolytic capacitor A2 is basically the same as the solid electrolytic capacitor A1 according to the first embodiment.

  The girder member 410 of the solid electrolytic capacitor A2 according to the present embodiment has a rod shape extending in a direction orthogonal to the axis L of the anode wire 300, as in the first embodiment, but is similar to that of the first embodiment. No wall portion 411 is formed in advance, and only a V-shaped groove 422 extending in the lateral direction is formed on the upper surface.

  The anode wire 300 is joined to the girder member 410 in a state of being seated in a concave groove 422 formed on the upper surface of the girder member 410. The joining between the anode wire 300 and the beam member 410 is performed by laser welding by irradiating the laser beam S to the vicinity of the contact portion between the anode wire 300 and the inner surface of the concave groove 422 on both sides of the anode wire 300. (See FIG. 20). Thereby, both the anode wire 300 and the girder member 410 are partially melted and solidified by the high heat generated by the laser irradiation, and the bonding portion 430 is formed. In the present embodiment, the irradiation position of the laser beam S is The leading end of the beam member 410 in the short direction. As a result, the inner surface of the concave groove 422 of the spar member 410 is partially melted to fill the bottom of the V-shape, and the concave portion 423 is formed on the inner surface of the concave groove 422 at the joint 430. A V-shaped groove is left behind in the lateral direction, that is, closer to the first side surface 201 of the element body 200, and this portion functions as a wall 411 '.

  Next, an example of a method for manufacturing the solid electrolytic capacitor A2 according to the present embodiment will be described.

  As described above, as an example of the method of manufacturing the solid electrolytic capacitor A1 according to the first embodiment, in the present embodiment, similarly, a plurality of capacitor elements 100 in which the anode wire 300 extends with a sufficient length are used. Although one end of the anode wire 300 is hung on the longitudinal support bar 730 by welding or the like (see FIG. 9), the spar member 410 and the anode wire 300 are separated from each other at this stage as in the first embodiment. Then, they are joined by laser welding as follows.

  That is, as shown in FIG. 20, the spar member 410 is held in a proper posture by using an appropriate jig 800 and the like, and the anode wire 300 is positioned so as to be fitted into the concave groove 422. The laser beam S is emitted toward a contact portion between the groove and the inner surface of the concave groove 422. The position at which the laser beam S is irradiated is the forward end of the beam member 410 in the short direction, and the rear portion of the beam member 410 in the short direction, that is, the region close to the element body 200 is not irradiated with the laser beam S.

  Then, at the irradiation position of the laser beam S, both the anode wire 300 and the beam member 410 are melted and alloyed by the heat generated by the laser beam S, and this is solidified to form the joint portion 430. In the process, the inner surface of the concave groove 422 is melted and a part of the melted girder member material is lost, so that the concave portion 423 is formed in the inner surface of the concave groove 422 in the joint 430. On the other hand, at the rear of the beam member 410 in the short direction, that is, near the element body 200, the shape of the V-shaped concave groove 422 remains as it is, and this portion becomes the wall portion 411 ', and the heat generated by laser beam irradiation is generated. Alternatively, it functions as a shielding wall that hinders the reflected light of the laser light S from reaching the element body 200. Thus, thermal damage to the surface of the element body 200 due to the laser light S can be avoided or reduced.

  Subsequent manufacturing steps are the same as those described above with reference to FIGS. 11 to 13 for the solid electrolytic capacitor A1 according to the first embodiment.

  The solid electrolytic capacitor A2 according to the present embodiment can also enjoy the same advantages as those described above for the solid electrolytic capacitor according to the first embodiment.

  Of course, the present invention is not limited to the above-described embodiments and modified examples, and all modifications within the scope described in each claim are included in the scope of the present invention.

That is, the present invention provides a solid electrolytic capacitor _{A1, A1 1, A1 2,} A2, there than characterized the bonding structure and bonding method of the anode wire 300 and the beam members 410, the configuration and the device body 200, the resin The overall configuration of the package 600 is not limited at all.

A1, A2 solid electrolytic capacitor A1 _1, A1 ₂ solid electrolytic capacitor L axis (anode wires)
S Laser beam 100 Capacitor element 200 Element body 201 First side surface 202 Second side surface 203 Third side surface 204 Fourth side surface 205 Bottom surface 206 Top surface 210 Porous sintered body 211 Pores 221 Dielectric layer 222 Solid electrolyte layer 223 Conductive layer 230 Stain-up preventing ring 300 Anode wire 250 Protective layer 400 Anode mounting terminal 410 Beam members 411, 411 'Wall 420 Depression groove 421 Depression groove 422 Depression groove 423 Depressed part 430 Joint 440 Conductive adhesive 500 Cathode mounting terminal 540 Conductivity Adhesive 600 Resin package 601 First side 602 Second side 603 Third side 604 Fourth side 605 Bottom (first outer side)
606 Upper surface (second outer surface)
710 Lead frame 720 Lead frame 730 Support bar 800 Jig

Claims (19)

A capacitor element including an element body and an anode wire projecting therefrom, a cathode mounting terminal, and an anode mounting terminal electrically connected to the anode wire via a spar member, a solid electrolytic capacitor including:
The solid member, wherein a wall extending in a direction intersecting with the axis of the anode wire is formed on the element body side from the joint between the beam member and the anode wire. Electrolytic capacitor.   2. The capacitor according to claim 1, further comprising a resin package that exposes a part of each of the cathode mounting terminal and the anode mounting terminal to an outer surface and wraps the capacitor element, the girder member, the cathode mounting terminal and the anode mounting terminal. 3. Solid electrolytic capacitor.   The resin package includes a first outer surface that exposes a part of each of the cathode mounting terminal and the anode mounting terminal in a plane, and a second outer surface that is opposite to the first outer surface and is parallel to the first outer surface. 3. The solid electrolytic capacitor according to claim 2, wherein the anode wire extends parallel to the first outer surface and the second outer surface. 4.   The wall portion extends toward the second outer surface of the resin package, and a tip of the wall portion is located closer to the second outer surface than a joint between the spar member and the anode wire. The solid electrolytic capacitor according to claim 3, wherein   The anode wire is joined to the girder member in a state of being seated in a groove provided in the girder member, and the wall portion is closer to the element body than a joint between the girder member and the anode wire. 5. The solid electrolytic capacitor according to claim 4, wherein one side or both sides of said anode wire extends toward said second outer surface of said resin package.   The solid electrolytic capacitor according to claim 5, wherein the concave groove has a V-shape.   The solid electrolytic capacitor according to claim 5, wherein the concave groove has a U-shape.   The solid electrolytic capacitor according to any one of claims 1 to 7, wherein a joint between the beam member and the anode wire is formed by laser welding.   9. The solid electrolytic device according to claim 8, wherein the wall portion is formed by a portion of the girder member remaining without melting when forming a joint between the girder member and the anode wire by laser welding. Capacitors. A capacitor element including an element body and an anode wire projecting therefrom, a cathode mounting terminal, and an anode mounting terminal electrically connected to the anode wire via a spar member, a method for manufacturing a solid electrolytic capacitor including:
When the joining of the anode wire to the beam member is performed by welding by laser irradiation, a heat shielding wall unit integrated with the beam member is provided on the element body side with respect to the laser irradiation unit. Manufacturing method of electrolytic capacitor.   The method for manufacturing a solid electrolytic capacitor according to claim 10, wherein the heat shielding wall is formed in advance on the beam member.   The method for manufacturing a solid electrolytic capacitor according to claim 10, wherein the heat shielding wall is formed by a portion of the beam member left unmelted by laser irradiation.   The solid electrolytic capacitor includes a resin package that exposes each part of the cathode mounting terminal and the anode mounting terminal to an outer surface, and wraps the capacitor element, the girder member, the cathode mounting terminal and the anode mounting terminal, A method for manufacturing a solid electrolytic capacitor according to claim 10.   The resin package includes a first outer surface that exposes a part of each of the cathode mounting terminal and the anode mounting terminal in a plane, and a second outer surface that is opposite to the first outer surface and is parallel to the first outer surface. 14. The method of claim 13, wherein the anode wire extends in parallel with the first outer surface and the second outer surface.   The heat-shielding wall extends toward the second outer surface of the resin package, and a tip of the heat-shielding wall is closer to the second part than the joint between the beam member and the anode wire. The method for manufacturing a solid electrolytic capacitor according to claim 14, which is located on an outer surface side.   The anode wire is joined to the girder member in a state of being seated in a concave groove provided in the girder member, and the heat shielding wall portion of the anode wire is closer to the element body than the joint portion. The method for manufacturing a solid electrolytic capacitor according to claim 15, wherein one or both sides extend toward the second outer surface of the resin package.   The method for manufacturing a solid electrolytic capacitor according to claim 16, wherein the concave groove has a V shape.   17. The method for manufacturing a solid electrolytic capacitor according to claim 16, wherein the concave groove has a U-shape.   19. The method for manufacturing a solid electrolytic capacitor according to claim 16, wherein the laser irradiation is performed on a contact portion between the anode wire and the concave groove on one side or both sides of the anode wire. .

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