JP7446398B2 - Solid electrolytic capacitor and its manufacturing method - Google Patents

Description

The present invention relates to a solid electrolytic capacitor and a method for manufacturing the same.

Solid electrolytic capacitors are generally configured in a surface-mounted type, and as shown in Patent Document 1, for example, a capacitor element having an element body including a porous sintered body and an anode wire protruding from the element body is anode-mounted. It has a structure in which the terminal and the cathode mounting terminal are electrically connected and then wrapped in a resin package. The anode wire is welded to a girder member disposed on the anode mounting terminal while being placed on the girder member. The cathode formed by the outer surface of the element body is electrically connected to the cathode mounting terminal using a conductive adhesive or the like.

The anode wire is welded to the girder member by the heat generated by irradiating the contact portion with the girder member with a high-power laser beam. In recent years, the miniaturization of resin packages has progressed, and the welded part of the girder member and anode wire is close to the element body, so heat generated by laser beam irradiation or laser beam reflected toward the element body Heat generated on the surface of the element body may damage the element body.

JP 2017-59652 Publication

The present invention was conceived under the above circumstances, and is a solid electrolytic capacitor that reduces or avoids the adverse effects of heat generated during laser welding between an anode wire and a girder member on the element body. Its purpose is to provide a method for producing the same.

In order to solve the above problems, the present invention employs the following technical means.

That is, the solid electrolytic capacitor provided by the first aspect of the present invention includes a capacitor element including an element body and an anode wire protruding from the element body, a cathode mounting terminal, and the anode wire conductively connected to the anode wire via a spar member. a solid electrolytic capacitor, the solid electrolytic capacitor including an anode mounting terminal, the girder member having an anode mounted terminal on the element body side than the joint between the girder member and the anode wire in a direction intersecting the axis of the anode wire. It is characterized in that an extending wall portion is formed.

A preferred embodiment includes a resin package that encloses the capacitor element, the girder member, the cathode mounting terminal, and the anode mounting terminal while exposing a portion of each of the cathode mounting terminal and the anode mounting terminal to the outside.

In a preferred embodiment, the resin package has a first outer surface that exposes a portion of the cathode mounting terminal and the anode mounting terminal flush with each other, and a first outer surface on the opposite side of the first outer surface. and a parallel second outer surface, the anode wire extending parallel to the first outer surface and the second outer surface.

In a preferred embodiment, the wall portion extends toward the second outer surface of the resin package, and the tip of the wall portion is closer to the second outer surface than the joint between the girder member and the anode wire. It is located on the outside.

In a preferred embodiment, the anode wire is seated in a groove provided in the girder member and is joined to the girder member, and the wall portion is arranged such that the anode wire is connected to the girder member from the joint between the girder member and the anode wire. Also extends toward the second outer surface of the resin package on one or both sides of the anode wire on the element body side.

In a preferred embodiment, the groove has a V-shape.

In a preferred embodiment, the groove has a U-shape.

In a preferred embodiment, the joint between the girder member and the anode wire is formed by laser welding.

In a preferred embodiment, the wall portion is formed by a portion of the beam member that remains unmelted when the joint between the beam member and the anode wire is formed by laser welding.

A method for manufacturing a solid electrolytic capacitor provided by a second aspect of the present invention includes a capacitor element including an element body and an anode wire protruding from the element body, a cathode mounting terminal, and the anode wire conductively connected to the anode wire via a girder member. A method for manufacturing a solid electrolytic capacitor, comprising: an anode mounting terminal having an anode mounted terminal; and a method for manufacturing a solid electrolytic capacitor, in which the anode wire is bonded to the girder member by welding by laser irradiation, and the girder is placed closer to the element body than the laser irradiation part. It is characterized by providing a heat shielding wall integral with the member.

In a preferred embodiment, the heat shielding wall portion is previously formed on the girder member.

In a preferred embodiment, the heat shielding wall is formed by a portion of the girder member that remains unmelted by laser irradiation.

In a preferred embodiment, the solid electrolytic capacitor wraps around the capacitor element, the girder member, the cathode mounting terminal, and the anode mounting terminal by exposing a portion of the cathode mounting terminal and the anode mounting terminal to the outside. Includes resin packaging.

In a preferred embodiment, the resin package has a first outer surface that exposes a portion of the cathode mounting terminal and the anode mounting terminal flush with each other, and a first outer surface on the opposite side of the first outer surface. and a parallel second outer surface, the anode wire extending parallel to the first outer surface and the second outer surface.

In a preferred embodiment, the heat-shielding wall extends toward the second outer surface of the resin package, and the tip of the heat-shielding wall extends at the junction between the girder member and the anode wire. It is located closer to the second outer surface than the second outer surface.

In a preferred embodiment, the anode wire is joined to the girder member while seated in a groove provided in the girder member, and the heat shielding wall portion is located closer to the element body than the bonded portion. The anode wire extends toward the second outer surface of the resin package on one or both sides of the anode wire.

In a preferred embodiment, the groove has a V-shape.

In a preferred embodiment, the groove has a U-shape.

In a preferred embodiment, the laser irradiation is performed on a contact portion between the anode wire and the groove on one side or both sides of the anode wire.

Other features and advantages of the invention will become more apparent from the detailed description given below with reference to the drawings.

FIG. 1 is a plan view of a solid electrolytic capacitor according to a first embodiment of the present invention. FIG. 2 is a front view of the solid electrolytic capacitor shown in FIG. 1. FIG. FIG. 2 is a left side view of the solid electrolytic capacitor shown in FIG. 1. FIG. 2 is a cross-sectional view taken along line IV-IV in FIG. 1. FIG. FIG. 2 is a cross-sectional view taken along line VV in FIG. 1. FIG. 2 is a cross-sectional view taken along the line VI-VI in FIG. 1. FIG. FIG. 2 is a perspective view of a main part of the solid electrolytic capacitor shown in FIG. 1; FIG. 3 is a partially enlarged sectional view of a capacitor element. FIG. 2 is an explanatory diagram of a method for manufacturing the solid electrolytic capacitor shown in FIG. 1. FIG. FIG. 2 is an explanatory diagram of a method for manufacturing the solid electrolytic capacitor shown in FIG. 1. FIG. FIG. 2 is an explanatory diagram of a method for manufacturing the solid electrolytic capacitor shown in FIG. 1. FIG. FIG. 2 is an explanatory diagram of a method for manufacturing the solid electrolytic capacitor shown in FIG. 1. FIG. FIG. 2 is an explanatory diagram of a method for manufacturing the solid electrolytic capacitor shown in FIG. 1. FIG. 2 is a diagram showing a modification of the solid electrolytic capacitor shown in FIG. 1, and is a diagram corresponding to a cross section taken along line VI-VI in FIG. 1. FIG. FIG. 15 is a perspective view of a main part of the solid electrolytic capacitor shown in FIG. 14; 2 is a diagram showing another modification of the solid electrolytic capacitor shown in FIG. 1, and is a diagram corresponding to a cross section taken along line VI-VI in FIG. 1. FIG. FIG. 17 is a perspective view of essential parts of the solid electrolytic capacitor shown in FIG. 16; FIG. 3 is a longitudinal cross-sectional view of a solid electrolytic capacitor according to a second embodiment of the present invention. FIG. 19 is a perspective view of essential parts of the solid electrolytic capacitor shown in FIG. 18; 19 is an explanatory diagram of a method for manufacturing the solid electrolytic capacitor shown in FIG. 18. FIG.

Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

1 to 7 show a solid electrolytic capacitor A1 according to a first embodiment of the present invention. This solid electrolytic capacitor A1 includes a capacitor element 100, an anode mounting terminal 400, a cathode mounting terminal 500, a beam member 410, and a resin package 600.

Capacitor element 100 includes an element body 200 and an anode wire 300 protruding from element body 200. The element body 200 includes a porous sintered body 210, a dielectric layer 221, a solid electrolyte layer 222, and a conductive layer 223. A seepage prevention ring 230 is attached to the base of the anode wire 300.

As shown in FIGS. 4 and 5, the element body 200 is formed into a rectangular parallelepiped shape that reflects the shape of the porous sintered body 210. That is, the element main body 200 includes a bottom surface 205, an upper surface 206 that is spaced above the bottom surface 205 by a predetermined distance and parallel to the bottom surface 205, a first side surface 201 from which the anode wire 300 projects, and a top surface 206 that is parallel to the bottom surface 205. It has a second side surface 202 opposite to the first side surface 201, a third side surface 203 connecting the first side surface 201 and the second side surface 202, and a fourth side surface 204 on the opposite side. The anode wire 300 is rod-shaped with a circular cross section, and protrudes in parallel to the bottom surface 205, the top surface 206, and the third and fourth side surfaces 203 and 204 at approximately the center of the first side surface 201 in the width direction and height direction. . The anode wire 300 is made of the same material as the valve metal that constitutes the porous sintered body 210, which will be described later. The seepage prevention ring 230 is made of electrically insulating material, for example, fluororesin.

As shown in FIGS. 4, 5, and 8, the dielectric layer 221 is covered with a seepage prevention ring 230 on the first side surface 201 of the element body 200 from the inner surface of the pores 211 of the porous sintered body 210. It is formed over the bottom surface 205, the top surface 206, the second side surface 202, the third side surface 203, and the fourth side surface 204. The dielectric layer 221 is made of an oxide of the valve metal that constitutes the porous sintered body 210 . Examples of the valve metal forming the porous sintered body 210 include tantalum (Ta) and niobium (Nb). Therefore, examples of the material constituting the dielectric layer 221 include tantalum pentoxide and niobium pentoxide.

As shown in FIGS. 4, 5, and 8, the solid electrolyte layer 222 is laminated on the dielectric layer 221. A portion of the solid electrolyte layer 222 enters the pores 211 of the porous sintered body 210 and fills the pores 211 while covering the dielectric layer 221 within the pores 211. It covers the dielectric layer 221 on the surface. However, the direct conduction of the solid electrolyte layer 222 with the anode wire 300 is interrupted by the seepage prevention ring 230 on the first side surface 201 of the element body 200. The solid electrolyte layer 222 is made of, for example, manganese dioxide or a conductive polymer. During operation of the solid electrolytic capacitor A1, charges are held at the interface between the dielectric layer 221 and the solid electrolyte layer 222.

As shown in FIGS. 4, 5, and 8, the conductive layer 223 is laminated on the solid electrolyte layer 222 and is electrically connected to the solid electrolyte layer 222. The conductive layer 223 has, for example, a layered structure consisting of a graphite layer and a silver (Ag) layer. The conductive layer 223 is laminated on the solid electrolyte layer 222 on the surface of the element body 200, but in the same manner as described above for the solid electrolyte layer 222, the anode wire is prevented from seeping through the seepage prevention ring 230 on the first side surface 201 of the element body 200. 300 is cut off. This conductive layer 223 functions as a cathode layer.

As shown in FIGS. 4 and 5, in this embodiment, a protective layer 250 is formed on a part of the surface of the conductive layer 223. The protective layer 250 is made of a hard material such as Si, SiO ₂ , or Si ₃ N ₄ and is preferably formed densely with a thickness of 0.01 to 100 μm by sputtering. Since this protective layer 250 has an insulating property, it avoids a region of the surface of the conductive layer 223 to which a cathode mounting terminal 500 (to be described later) is connected, and protects the second side surface 202 and the third side surface of the element body 200. 203 , the fourth side surface 204 and the top surface 206 .

The anode mounting terminal 400 originates from the manufacturing frame and is made of a Ni-Fe alloy such as 42 alloy, and a portion thereof is exposed flush with the bottom surface (first outer surface) 605 of the resin package 600. . A beam member 410 made of the same material as the anode mounting terminal 400 is bonded to the anode mounting terminal 400 by, for example, a conductive adhesive 540. The beam member 410 has a longitudinal bar shape extending in a direction perpendicular to the axis L of the anode wire 300. The anode wire 300 is joined to the beam member 410 while being seated on its upper surface. The present invention is characterized by the joining structure and joining method between the beam member 410 and the anode wire 300, which will be described further below.

The cathode mounting terminal 500 is bonded to the bottom surface 205 of the element body 200 by, for example, a conductive adhesive 540, and a portion thereof is exposed flush with the bottom surface (first outer surface) 605 of the resin package 600. This cathode mounting terminal 500 also originates from the manufacturing frame and is made of a Ni--Fe alloy, such as 42 alloy.

The resin package 600 encloses the capacitor element 100, the anode mounting terminal 400, the beam member 410, and the cathode mounting terminal 500, and is made of, for example, epoxy resin. Preferably, glass frit is dispersed in the epoxy resin to maintain its mechanical strength. The resin package 600 has a rectangular parallelepiped shape that encloses the capacitor element 100. This resin package 600 has a bottom surface (first outer surface) 605, an upper surface (second outer surface) 606 that is spaced apart from the bottom surface 605 by a predetermined distance and parallel to the bottom surface 605, and a bottom surface 605 and an upper surface 606. A first side surface 601 that corresponds to and is parallel to the first side surface 201 of the element main body 200, a second side surface 602 that is parallel to the first side surface 601 on the opposite side of the first side surface 601, and It has a third side surface 603 and a fourth side surface 604 that correspond to and are parallel to the third side surface 203 and fourth side surface 204 of the element body 200, respectively. The anode mounting terminal 400 is exposed on one side of the bottom surface (first outer surface) 605 of the resin package 600, and the cathode mounting terminal 500 is exposed on the other side.

The anode wire 300 of the capacitor element 100 is seated in a groove 420 formed on the upper surface of the beam member 410 and is joined to the beam member 410 . In this embodiment, the groove 420 has a V-shape. The anode wire 300 and the girder member 410 are joined by laser welding by irradiating the vicinity of the contact area between the anode wire 300 and the inner surface of the groove 420 on both sides of the anode wire 300 with a high-power laser. It will be done. As a result, both the anode wire 300 and the girder member 410 are partially melted and solidified due to the high heat generated by the laser irradiation, and a joint portion 430 is formed.

A wall portion 411 extending in a direction intersecting the axis L of the anode wire 300 is formed in the beam member 410 closer to the element body 200 than the joint portion 430 . In this embodiment, the wall portion 411 is provided so as to extend upward from the upper surface of the beam member 410, that is, toward the upper surface (second outer surface) 606 of the resin package 600, integrally with the beam member 410. It is being In this embodiment, this wall portion 411 is formed integrally with the girder member 410 in advance, and since it is necessary to seat the anode wire 300 in the groove 420, this wall portion 411 also has a V-shaped groove 420. are formed in series. Therefore, the wall portion 411 extends upward on both sides of the anode wire 300 . Note that the height of this wall portion 411 is set so that it is higher than the joint portion 430 between the anode wire 300 and the beam member 410 (on the upper surface 606 side of the resin package 600). Note that the wall portion 411 may be formed separately and attached to an appropriate position on the upper surface of the girder member 410.

Next, an example of a method for manufacturing the solid electrolytic capacitor A1 according to the present embodiment will be described with reference to FIGS. 9 to 13.

First, a capacitor element 100 having the above configuration is prepared (FIG. 9). At this stage, the anode wires 300 of the capacitor elements 100 have extended to a sufficient length, and a plurality of capacitor elements 100 are suspended from a longitudinal support bar 730 by welding one end of the anode wires 300. has been done.

In this method example, the girder member 410 is joined to the anode wire 300 by welding at this stage. As described above, the girder member 410 and the anode wire 300 are joined by laser welding, which will be explained in detail below.

As already explained, the beam member 410 has a longitudinal bar shape, and its bottom surface is flat so as to be bonded to the top surface of the anode mounting terminal 400. A V-shaped groove 420 extending in the transverse direction of the girder member 410 is formed on the upper surface of the girder member 410, and the above-mentioned wall is formed in a portion close to the first side surface 201 of the element body 200 after bonding. A portion 411 is formed. This wall portion 411 is formed on both sides of the groove 420 with the groove 420 interposed therebetween.

Next, as shown in FIG. 10, the girder member 410 is held in an appropriate position using a suitable jig 800, and the anode wire 300 is positioned so as to fit into the groove 420. A laser beam S is irradiated toward the contact portion between the groove 300 and the inner surface of the groove 420. The region to which the laser beam S is irradiated is closer to the tip of the anode wire 300 than the wall portion 411 . Specifically, as shown in FIG. 10, the laser beam S is irradiated to two locations on both sides of the anode wire 300 that are closer to the tip of the anode wire 300 than the wall portion 411 in plan view. The heat generated by such laser beam irradiation melts and alloys both the anode wire 300 and the beam member 410, which solidifies to form a welded joint 430.

By the way, during the irradiation period of the laser beam S described above, high heat is radiated to the surroundings from the vicinity of the part that will become the joint 430, and the reflected light of the laser light S itself is radiated to the surroundings. Since the wall portion 411 is located between the first side surface 201 of the element body 200, this wall portion 411 functions as a heat shielding wall portion to avoid or reduce thermal damage to the surface of the element body 200 caused by the laser beam S. can do.

Next, as shown in FIG. 11, a protective layer 250 is formed to cover the surface of the element body 200 of the capacitor element 100, that is, the conductive layer 223. The protective layer 250 is formed by sputtering using a thin film of SiO ₂ or Si ₃ N ₄ while masking the region to which the cathode mounting terminal 500 is to be bonded.

Next, as shown in FIG. 12, the anode wire 300 is cut to a required length, and the capacitor element 100, on which the protective layer 250 has been formed and the girder member 410 is joined to the anode wire 300, is placed on a lead frame. 710, 720 using, for example, conductive adhesive 440, 540.

Next, as shown in FIG. 13, a resin package 600 is formed, and the capacitor element 100, the portion of the lead frames 710, 720 that will become the anode mounting terminal 400, and the cathode are placed inside the resin package 600. Wrap the portion that will become the mounting terminal 500. The resin package 600 can be formed by a transfer molding method. Finally, unnecessary portions of lead frames 710 and 720 are cut and removed to complete solid electrolytic capacitor A1.

According to the solid electrolytic capacitor A1 having the above configuration and the manufacturing method thereof, when laser welding the girder member 410 and the anode wire 300, adverse effects such as thermal damage caused to the element body 200 by the high heat generated during laser beam irradiation are reduced or avoided. Therefore, it is possible to prevent a decrease in product yield. This is a significant advantage in the manufacture of increasingly smaller solid electrolytic capacitors.

14 and 15 show a solid electrolytic capacitor A1 ₁ according to a modification of the solid electrolytic capacitor A1 according to the first embodiment.

This solid electrolytic capacitor A1 ₁ differs from the solid electrolytic capacitor A1 described above in the configuration of a wall portion 411 provided on a beam member 410. That is, as shown in the figure, the groove 421 provided between the wall portions 411 so as to be continuous with the groove 420 provided at the distal end of the girder member 410 has a height corresponding to the upper surface of the distal end of the girder member 410. It is V-shaped, but the upper part extends upward with a constant width. The width of the slit between the wall portions 411 thus formed is approximately the same as the outer diameter of the anode wire 300. The rest of the structure of this solid electrolytic capacitor A1 ₁ is the same as that of the solid electrolytic capacitor A1 described above.

In this solid electrolytic capacitor A1 ₁ , since the width between the walls 411 extending upwardly with the anode wire 300 sandwiched therebetween can be reduced, the heat and laser welding between the anode wire 300 and the girder member 410 can be reduced as described above. It is possible to enjoy the same advantages as described above for solid electrolytic capacitor A1 while increasing the efficiency of shielding reflected light from element body 200.

16 and 17 show a solid electrolytic capacitor A1 ₂ according to another modification of the solid electrolytic capacitor A1 according to the first embodiment.

This solid electrolytic capacitor A1 ₂ differs from the solid electrolytic capacitor A1 ₁ according to the above-mentioned modification in that the groove 420 extending from the upper surface of the tip of the girder member 410 to between the wall portions 411 is U-shaped; The structure is the same as that of the solid electrolytic capacitor A1 ₁ according to the above modification. The bottom of this groove 420 is preferably a cylindrical inner surface that corresponds to the outer peripheral surface of the anode wire 300.

In this solid electrolytic capacitor A1 ₂ , compared to the solid electrolytic capacitor A1 and solid electrolytic capacitor A1 ₁ in which the groove 420 provided in the girder member 410 is V-shaped, the groove 420 is
It is also possible to prevent heat and laser reflected light from reaching the element body 200 through the gap between the bottom of the wall 411 and the anode wire 300. Adverse effects on the element body 200 during laser welding with the girder member 410 can be more effectively reduced or avoided.

18 to 20 show a solid electrolytic capacitor A2 according to a second embodiment of the present invention. This solid electrolytic capacitor A2 differs from the solid electrolytic capacitor A1 according to the first embodiment in the form of the girder member 410, the form of the wall portion 411, and the structure and method of joining with the anode wire 300. That is, in the solid electrolytic capacitor A2 according to the present embodiment, the wall portion 411 is formed during laser welding of the beam member 410 and the anode wire 300, and the wall portion 411 thus formed is exposed to heat applied to the element body 200. Provide a shielding function to reduce or avoid adverse effects. The remaining configuration of this solid electrolytic capacitor A2 is basically the same as that of the solid electrolytic capacitor A1 according to the first embodiment.

The girder member 410 in the solid electrolytic capacitor A2 according to the present embodiment has a rod shape extending in a direction perpendicular to the axis L of the anode wire 300, like the one in the first embodiment, but like the one in the first embodiment The wall portion 411 is not formed in advance, and a V-shaped groove 422 extending in the transverse direction is simply formed on the upper surface.

The anode wire 300 is seated in a groove 422 formed on the upper surface of the beam member 410 and is joined to the beam member 410 . The anode wire 300 and the girder member 410 are joined by laser welding by irradiating laser light S to the vicinity of the contact area between the anode wire 300 and the inner surface of the groove 422 on both sides of the anode wire 300. (See FIG. 20). As a result, both the anode wire 300 and the girder member 410 are partially melted and solidified by the high heat generated by laser irradiation, forming a joint 430. In this embodiment, the irradiation position of the laser beam S is This is the distal end of the girder member 410 in the transverse direction. As a result, the inner surface of the groove 422 of the girder member 410 is partially melted and fills the bottom of the V-shape, and a recess 423 is formed on the inner surface of the groove 422 at the joint 430. At the rear in the lateral direction, that is, at the side closer to the first side surface 201 of the element main body 200, the V-shaped groove remains as it is, and this portion functions as a wall portion 411'.

Next, an example of a method for manufacturing the solid electrolytic capacitor A2 according to this embodiment will be described.

As described above with respect to an example of the manufacturing method for the solid electrolytic capacitor A1 according to the first embodiment, in this embodiment as well, a plurality of capacitor elements 100 each having an anode wire 300 extending with a sufficient length are connected to each other. The anode wire 300 is suspended by a longitudinal support bar 730 by welding one end thereof (see FIG. 9), but as in the first embodiment, at this stage, the girder member 410 and the anode wire 300 are , are joined by laser welding as follows.

That is, as shown in FIG. 20, the girder member 410 is held in a proper posture using a suitable jig 800, and the anode wire 300 is positioned so as to fit into the groove 422. In this state, the anode wire 300 is A laser beam S is irradiated toward the contact portion between the inner surface of the groove 422 and the inner surface of the groove 422 . The position where the laser beam S is irradiated is the tip end in the lateral direction of the beam member 410, and the laser beam S is not irradiated to the rear of the beam member 410 in the lateral direction, that is, an area close to the element body 200.

Then, at the irradiation position of the laser beam S, both the anode wire 300 and the girder member 410 are melted and alloyed by the heat generated due to the laser beam S, and this solidifies to form the joint portion 430. In the process, the inner surface of the groove 422 melts and a portion of the melted girder member material disappears, so that a recess 423 is formed on the inner surface of the groove 422 at the joint 430 . On the other hand, at the rear of the girder member 410 in the transverse direction, that is, at the side closer to the element main body 200, the form of the V-shaped groove 422 remains as it is, and this part becomes a wall part 411', and heat generated by laser beam irradiation is generated. Alternatively, it functions as a shielding wall portion that prevents the reflected light of the laser beam S from reaching the element body 200. Thereby, thermal damage to the surface of the element body 200 caused by the laser beam S can be avoided or reduced.

The subsequent manufacturing steps are the same as those described above with reference to FIGS. 11 to 13 for the solid electrolytic capacitor A1 according to the first embodiment.

The solid electrolytic capacitor A2 according to the present embodiment can also enjoy the same advantages as described above for the solid electrolytic capacitor according to the first embodiment.

Of course, the present invention is not limited to the embodiments and modifications described above, and all changes within the scope of each claim are included within the scope of the present invention.

That is, the present invention is characterized by the bonding structure and bonding method between the anode wire 300 and the girder member 410 in the solid electrolytic capacitors A1, A1 ₁ , A1 ₂ and A2, and the structure of the element body 200 and the resin The overall configuration of the manufactured package 600 is not limited in any way.

A1, A2 Solid electrolytic capacitor A1 ₁ , A1 ₂ Solid electrolytic capacitor L Axis line (of the anode wire)
S Laser beam 100 Capacitor element 200 Element body 201 First side 202 Second side 203 Third side 204 Fourth side 205 Bottom surface 206 Top surface 210 Porous sintered body 211 Pores 221 Dielectric layer 222 Solid electrolyte layer 223 Conductive layer 230 Seepage prevention ring 300 Anode wire 250 Protective layer 400 Anode mounting terminal 410 Girder member 411, 411' Wall portion 420 Groove 421 Groove 422 Groove 423 Recessed portion 430 Joint portion 440 Conductive adhesive 500 Cathode mounting terminal 540 Conductive Adhesive 600 Resin package 601 First side 602 Second side 603 Third side 604 Fourth side 605 Bottom surface (first outer surface)
606 Top surface (second outer surface)
710 Lead frame 720 Lead frame 730 Support bar 800 Jig

Claims (7)

A solid electrolytic capacitor comprising a capacitor element including an element body and an anode wire protruding from the element body, a cathode mounting terminal, and an anode mounting terminal electrically connected to the anode wire via a girder member,
The girder member is characterized in that a wall portion extending in a direction intersecting the axis of the anode wire is formed closer to the element body than the joint between the girder member and the anode wire, The joint between the girder member and the anode wire is formed by laser welding, and the wall portion is not melted when the joint between the girder member and the anode wire is formed by laser welding. A solid electrolytic capacitor formed by the remaining portion of the girder member . 2. The resin package according to claim 1, further comprising a resin package that encloses the capacitor element, the girder member, the cathode mounting terminal, and the anode mounting terminal while exposing a portion of the cathode mounting terminal and the anode mounting terminal to the outside. Solid electrolytic capacitor. The resin package has a first outer surface that exposes a portion of the cathode-mounted terminal and the anode-mounted terminal flush with each other, and a second outer surface that is parallel to the first outer surface on the opposite side of the first outer surface. 3. The solid electrolytic capacitor of claim 2, wherein the anode wire extends parallel to the first outer surface and the second outer surface. The wall portion extends toward the second outer surface of the resin package, and the tip of the wall portion is located closer to the second outer surface than the joint between the girder member and the anode wire. The solid electrolytic capacitor according to claim 3. The anode wire is seated in a groove provided in the girder member and joined to the girder member, and the wall portion is located closer to the element body than the joint between the girder member and the anode wire. 5. The solid electrolytic capacitor according to claim 4, wherein one or both sides of the anode wire extend toward the second outer surface of the resin package. 6. The solid electrolytic capacitor according to claim 5, wherein the groove is V-shaped. 6. The solid electrolytic capacitor according to claim 5, wherein the groove is U-shaped.

Images