JP2020030789A - サーバシステム - Google Patents
サーバシステム Download PDFInfo
- Publication number
- JP2020030789A JP2020030789A JP2019004096A JP2019004096A JP2020030789A JP 2020030789 A JP2020030789 A JP 2020030789A JP 2019004096 A JP2019004096 A JP 2019004096A JP 2019004096 A JP2019004096 A JP 2019004096A JP 2020030789 A JP2020030789 A JP 2020030789A
- Authority
- JP
- Japan
- Prior art keywords
- motherboard
- connector
- housing
- server system
- connectors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims (10)
- 筐体と、
前記筐体内に取り付けられ、1または複数の中央処理装置用ソケット、および、1または複数のメモリチップ用ソケットを含むマザーボードと、
前記筐体内に取り付けられ、前記マザーボードに伝達可能に接続されるドーターボードであって、前記筐体の外側に直接的な外部接続用に構成される1または複数の入力/出力(I/O)コネクタを含む、ドーターボードと
を含み、
前記マザーボードは、前記筐体の外側に直接的な外部接続用に構成される(I/O)コネクタを有さない、サーバシステム。 - 前記マザーボードおよび前記ドーターボードは、ホットプラグ可能なコネクタによって伝達可能に連結される、請求項1記載のサーバシステム。
- 前記ホットプラグ可能なコネクタは、直線コネクタである、請求項2記載のサーバシステム。
- 前記ホットプラグ可能なコネクタは、直角コネクタである、請求項2記載のサーバシステム。
- 前記マザーボード、前記ドーターボード、または、これらの組合せは、ガイドピンを含む、請求項1記載のサーバシステム。
- 前記ドーターボードは、ガイドピンを含む、請求項5記載のサーバシステム。
- 前記I/Oコネクタは、1または複数のビデオコネクタ、パラレルポートコネクタ、シリアルポートコネクタ、ネットワークインタフェースコントローラ(NIC)コネクタ、および/または、ユニバーサルシリアルバス(USB)コネクタを含む、請求項1記載のサーバシステム。
- 前記筐体は、前面パネルおよび背面パネルを含み、
前記1または複数のI/Oコネクタは、前記背面パネルにおける1または複数の開口を通って延在する、請求項1記載のサーバシステム。 - 前記筐体は、前面パネルおよび背面パネルを含み、
前記1または複数のI/Oコネクタは、前記背面パネルにおける1または複数の開口と同じ面にある、請求項1記載のサーバシステム。 - 前記筐体は、前面パネルおよび背面パネルを含み、
前記1または複数のI/Oコネクタは、前記背面パネルにおける1または複数の開口と比較して、前記筐体内に凹設される、請求項1記載のサーバシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/108,931 US10624211B2 (en) | 2018-08-22 | 2018-08-22 | Motherboard with daughter input/output board |
US16/108,931 | 2018-08-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020030789A true JP2020030789A (ja) | 2020-02-27 |
JP6717987B2 JP6717987B2 (ja) | 2020-07-08 |
Family
ID=64901321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019004096A Active JP6717987B2 (ja) | 2018-08-22 | 2019-01-15 | サーバシステム |
Country Status (5)
Country | Link |
---|---|
US (1) | US10624211B2 (ja) |
EP (1) | EP3614815B1 (ja) |
JP (1) | JP6717987B2 (ja) |
CN (1) | CN110858092B (ja) |
TW (1) | TW202009632A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220104357A1 (en) * | 2020-09-30 | 2022-03-31 | Softiron Limited | Cableless Interconnect |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016121598A1 (de) * | 2016-11-10 | 2018-05-17 | Airbus Operations Gmbh | Basismodul und Luftfahrtcomputersystem mit dem Basismodul |
Family Cites Families (32)
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US516998A (en) * | 1894-03-20 | Watch-carrier for bicycles | ||
US5190480A (en) * | 1991-07-17 | 1993-03-02 | Foxconn International, Inc. | All-in-one interconnection assembly |
US5161998A (en) * | 1991-10-11 | 1992-11-10 | Amp Incorporated | Panel polarization feature |
US5444906A (en) * | 1993-09-02 | 1995-08-29 | The Whitaker Corporation | Machine for assembling a connector to the edge of a circuit board |
US5572400A (en) | 1994-09-28 | 1996-11-05 | Hewlett-Packard Co. | Printed circuit board form factor and mounting concept for computer or workstation input and output |
US5696669A (en) * | 1996-01-11 | 1997-12-09 | Molex Incorporated | Shielding system for PC cards |
JP4015729B2 (ja) | 1997-11-21 | 2007-11-28 | 株式会社日立製作所 | コンピュータ装置 |
US6166917A (en) * | 1998-01-07 | 2000-12-26 | 3Com Corporation | Techniques of assembling modular electronic equipment |
DE10126330C2 (de) * | 2001-05-30 | 2003-04-24 | Fujitsu Siemens Computers Gmbh | Einschubkarte |
JP2003288134A (ja) | 2002-03-28 | 2003-10-10 | Nec Corp | インタフェース接続装置 |
EP1732176A1 (en) * | 2005-06-08 | 2006-12-13 | Tyco Electronics Nederland B.V. | Electrical connector |
JP4543115B1 (ja) | 2009-03-06 | 2010-09-15 | 株式会社東芝 | 電子機器及びフレキシブルプリント配線板 |
CN101587363B (zh) * | 2009-07-03 | 2013-12-25 | 秦彪 | 笔记本式计算机及其主机盒与主板 |
CN201489395U (zh) | 2009-07-31 | 2010-05-26 | 研祥智能科技股份有限公司 | 一种主板、i/o扩展卡及工业计算机 |
CN201490382U (zh) | 2009-08-21 | 2010-05-26 | 精英电脑股份有限公司 | 连接接口的模块结构 |
US7924558B2 (en) * | 2009-08-31 | 2011-04-12 | International Business Machines Corporation | Insertion and rotation connector |
US8325488B2 (en) * | 2010-07-08 | 2012-12-04 | Tyco Electronics Corporation | Card module and module connector assembly |
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CN202383576U (zh) * | 2011-10-12 | 2012-08-15 | 美超微电脑股份有限公司 | 可变换托盘的服务器结构 |
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CN103149984A (zh) | 2011-12-07 | 2013-06-12 | 鸿富锦精密工业(深圳)有限公司 | 扩充卡固定装置 |
CN202748707U (zh) * | 2012-08-29 | 2013-02-20 | 浪潮集团有限公司 | 一种计算机主板通信转接板 |
CN202872825U (zh) | 2012-10-31 | 2013-04-10 | 上海斐讯数据通信技术有限公司 | 交换设备 |
CN104281230A (zh) * | 2013-07-08 | 2015-01-14 | 鸿富锦精密电子(天津)有限公司 | 电子装置及其扩展卡模组 |
CN203596014U (zh) | 2013-12-10 | 2014-05-14 | 浪潮电子信息产业股份有限公司 | 一种基于刀片系统的热插拔PCIe扩展I/O模块 |
TWM485441U (zh) | 2014-01-29 | 2014-09-01 | Ioi Technology Corp | 通用序列匯流排伺服器 |
CN203838698U (zh) | 2014-05-12 | 2014-09-17 | 浪潮电子信息产业股份有限公司 | 一种多功能io扩展卡 |
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-
2018
- 2018-08-22 US US16/108,931 patent/US10624211B2/en active Active
- 2018-10-24 TW TW107137630A patent/TW202009632A/zh unknown
- 2018-11-14 CN CN201811351407.3A patent/CN110858092B/zh active Active
- 2018-12-13 EP EP18212243.2A patent/EP3614815B1/en active Active
-
2019
- 2019-01-15 JP JP2019004096A patent/JP6717987B2/ja active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220104357A1 (en) * | 2020-09-30 | 2022-03-31 | Softiron Limited | Cableless Interconnect |
US11751332B2 (en) * | 2020-09-30 | 2023-09-05 | Softiron Limited | Cableless interconnect |
Also Published As
Publication number | Publication date |
---|---|
US20200068712A1 (en) | 2020-02-27 |
EP3614815B1 (en) | 2023-04-26 |
TW202009632A (zh) | 2020-03-01 |
CN110858092B (zh) | 2022-06-21 |
JP6717987B2 (ja) | 2020-07-08 |
EP3614815A1 (en) | 2020-02-26 |
US10624211B2 (en) | 2020-04-14 |
CN110858092A (zh) | 2020-03-03 |
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