JP2020004839A - Semiconductor workpiece transfer device - Google Patents

Abstract

To provide a semiconductor workpiece transfer device that prevents a semiconductor workpiece from being exposed to the atmosphere in a transport apparatus and suppresses an amount of use of an inert gas at the time.SOLUTION: A workpiece transfer robot 110 of a transfer device 100 is provided with a movable gas releasing arm 160 including a gas releasing nozzle 161 for releasing an inert gas. Regardless of a transfer position of a semiconductor workpiece 200 held by the hand 151 of the workpiece transfer movable arm 150 of the workpiece transfer robot 110, the movable gas releasing arm with an inert gas release mechanism follows, so that only a space between the movable gas releasing arm and the semiconductor workpiece is always kept filled with the inert gas.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a semiconductor work transfer device that grips and transfers a semiconductor work between a storage container that stores the semiconductor work and a processing device that performs processing on the semiconductor work.

  For example, a processing apparatus such as a semiconductor inspection processing apparatus used in a semiconductor manufacturing or inspection process is usually provided with a transfer device having a transfer mechanism. In such a processing apparatus, the storage container in which the semiconductor work is stored is disposed with respect to the transfer apparatus, and the transfer apparatus transfers the unprocessed semiconductor work from the storage container to the processing apparatus and / or processes the semiconductor work from the processing apparatus. The completed semiconductor work is transported to the storage container. At this time, a space between the processing device and the storage container, in which the semiconductor work is transferred by the transfer device, is defined as a local space in a room space in which the processing device, the transfer device, and the storage container are provided. The semiconductor work being transported, and the inside of the processing apparatus and the storage container which are opened when the semiconductor work is loaded and unloaded are not exposed to the room space atmosphere outside the local space, for example, the air atmosphere.

  Generally, a mini-environment device having a local clean environment used in a semiconductor factory handling 300 mm wafers corresponds to an example of operation in which a transfer device is provided in a local space. The transfer device provided in the local space has a transfer robot as a transfer mechanism, which takes out / stores the semiconductor work into / from the storage container, transfers / receives the semiconductor work to / from the pre-alignment unit that aligns the direction of the semiconductor work, and transfers the work to the processing device. The transfer robot carries out operation control of the handling arm thereof based on a command from the processing device.

  On the other hand, the storage container in which the semiconductor work is stored is usually sealed from the outside by a lid or the like that can be opened and closed by a storage container opening / closing device, and the inside of the container is filled with an inert gas. . As a result, a low humidity environment is created in the container of the containment container, and a chemical reaction such as oxidation of the contained semiconductor work and adhesion of moisture are prevented. Therefore, the same measures as in the container of the storage container are required for the local space where the semiconductor work is transferred by the transfer device.

  Therefore, as a conventional example of a transport device provided with such a measure, there is a transport device described in Patent Documents 1-4. Patent Literatures 1 and 2 disclose a configuration in which an entirety of a local space in which a semiconductor work is transferred by a transfer device is filled and circulated with an inert gas so that the semiconductor work being transferred is not exposed to the atmosphere. Patent Literature 3 and Patent Literature 4 disclose that a semiconductor workpiece in a local space is conveyed by a transfer robot instead of being filled with an inert gas and circulated in the local space where the semiconductor work is conveyed. There is disclosed a configuration in which an inert gas is blown to the nozzle.

JP 2017-5283 A JP-A-2006-162818 JP-A-11-150173 JP 2006-351864 A

  However, in the configuration described in Patent Literature 1 and Patent Literature 2 in which the entire local space in which the semiconductor work is transported by the transport device is filled and circulated with the inert gas, the entire local space is filled with the inert gas. It is presumed that the amount of use of the inert gas becomes enormous.

  Further, in the configurations described in Patent Documents 3 and 4, in which an inert gas is blown onto a transport path on which a semiconductor work in a local space is transported by a transport robot, a method of installing a gas ejection port on the transport path has been proposed. Although employed, for example, there is a difference in the amount and direction of gas blown from the gas ejection port to the semiconductor work even on the conveyance path, such as when the semiconductor work is at a position on the conveyance path away from the gas ejection port. In such a case, as a result, the possibility of exposure of the semiconductor work to the atmosphere increases. Specifically, when the pre-alignment unit is performing the alignment processing, or when carrying in / out the storage container or the processing apparatus, the possibility of the semiconductor work being exposed to the air increases.

  A semiconductor work transfer device according to the present disclosure has been made in view of the above-described problems, and has been made in consideration of the above-described problems, and has been made to prevent a semiconductor work from being exposed to the atmosphere in a transfer device and to suppress the use of an inert gas in that case. It is intended to provide a device.

  In the present disclosure, in order to solve the above-described problem, a movable arm for gas release with an inert gas release mechanism is installed on a robot of a transfer device, and the inert gas is provided at any transfer position during the transfer of the semiconductor work. A semiconductor work transfer device is proposed in which a gas discharge movable arm with a discharge mechanism follows, and only a space between the semiconductor work and a semiconductor work is always filled with an inert gas.

  A movable arm for gas release with an inert gas release mechanism can maintain the atmosphere around the surface of the semiconductor workpiece in a stable low humidity environment, thereby preventing exposure of the surface of the semiconductor workpiece to the atmosphere and preventing oxidation and moisture. Adhesion can be suppressed. In addition, since it is not necessary to fill the entirety of the local space where the semiconductor work is transported with the inert gas, the amount of the inert gas used can be suppressed.

  Furthermore, since the movable arm for gas release can be operated independently of the movable arm for workpiece transfer of the robot, for example, the movable arm for gas release is extended to the pre-alignment unit even during the alignment by the pre-alignment unit. By leaving it as it is, it becomes possible to prevent the semiconductor workpiece during the alignment from being exposed to the atmosphere.

  Further, problems, configurations, and effects other than those described above of the present disclosure will be apparent from the following description of the embodiments.

1 is a plan view of one embodiment of a semiconductor work transfer device according to the present disclosure. FIG. 2 is a plan view of a transfer robot in the semiconductor work transfer device shown in FIG. 1. FIG. 2 is a front view of a transfer robot in the semiconductor work transfer device illustrated in FIG. 1. FIG. 4 is a configuration explanatory view of a work transfer movable arm of the transfer robot illustrated in FIGS. 2A and 2B, and is a plan view of the work transfer movable arm. FIG. 4 is a configuration explanatory view of a work transfer movable arm of the transfer robot illustrated in FIGS. 2A and 2B, and is a plan view of the work transfer movable arm. FIG. 7 is an explanatory diagram of an operation when a semiconductor work is carried in by a work transfer movable arm as viewed from the front side of the transfer robot. FIG. 9 is an explanatory view of the operation when the semiconductor work is carried in by the work transfer movable arm, as viewed from the plane side of the transfer robot. FIG. 8 is an explanatory diagram of an operation when the semiconductor work is carried out by the work transfer movable arm as viewed from the front side of the transfer robot. FIG. 7 is an explanatory diagram of an operation when the semiconductor work is carried out by the work transfer movable arm as viewed from the plane side of the transfer robot. FIG. 4 is an explanatory diagram of a configuration of a movable arm for gas release of the transfer robot illustrated in FIGS. 2A and 2B, and is a plan view of the movable arm for gas release in a retracted state. FIG. 4 is an explanatory view of a configuration of a movable arm for gas release of the transfer robot shown in FIGS. 2A and 2B, and is a plan view of the movable arm for gas release in a forward state. It is one Example of the disk-shaped nozzle part of the gas discharge nozzle in which the gas ejection hole was formed. 5 is a flowchart illustrating a semiconductor work transfer process performed by the semiconductor work transfer apparatus according to the embodiment. FIG. 9 is an explanatory view of the operation of the movable gas discharging arm when the semiconductor work is carried into the pre-alignment unit, as viewed from the front side of the transfer robot. FIG. 8 is an explanatory view of the operation of the movable gas discharging arm when the semiconductor work is loaded into the pre-alignment unit, as viewed from the plane side of the transfer robot. It is a figure showing a modification of the gas discharge jet nozzle of the movable arm for gas discharge. FIG. 8 is a diagram illustrating a sensor interference escape operation of a gas discharge nozzle in a movable arm for transporting a workpiece. It is a front view of the transfer robot in the semiconductor work transfer device of another example. FIG. 11 is a plan view of a transfer robot in a semiconductor work transfer device according to another embodiment.

  An embodiment of a semiconductor work transfer device according to the present disclosure will be described with reference to the drawings.

  FIG. 1 is a plan view of one embodiment of a semiconductor work transfer device according to the present disclosure.

  The semiconductor work transfer device 100 of the present embodiment includes a work transfer robot 110 that transfers the semiconductor work 200 between the work storage container 300 and the processing device 400, and a pre-alignment unit that performs preliminary adjustment of the semiconductor work 200 in the direction of the substrate. 120 and a controller unit 130 for controlling each part of the transfer device.

  The semiconductor work transfer device 100 requires a work transfer space 101 in which the semiconductor work 200 is transferred by the work transfer robot 110 between the work storage container 300 and the processing device 400. The work transfer space 101 is defined by a partition wall 102 in the room where the semiconductor work transfer device 100 and the processing device 400 are installed, and is distinguished from the atmosphere outside the space, that is, the indoor atmosphere where the semiconductor work transfer device 100 and the like are installed. It is a local space. The work transfer robot 110 and the pre-alignment unit 120 are provided in the work transfer space 101. The partition wall 102 of the work transfer space 101 corresponds to a device housing of the semiconductor work transfer device 100.

  An apparatus-side work transfer port 104 is formed on one of the pair of partition walls 102 among these partition walls 102. The work transfer space 101 communicates with the processing apparatus transfer point 410 of the processing apparatus 400 via the apparatus-side work transfer port 104. As the processing apparatus transport point 410 of the processing apparatus 400, for example, a work exchange chamber or the like of a load lock mechanism provided in the processing apparatus 400 corresponds.

  On the other hand, a container-side work transfer port 103 is formed in the other of the pair of partition walls 102. The work transfer space 101 communicates with a work storage container 300 arranged outside the space via the container-side work transfer opening 103. In the illustrated example, the container-side work transfer ports 103 are provided with three container-side work transfer ports 103 along the moving direction (arrow ± y direction) of the work transfer robot 110 in the work transfer space 101. Then, three work storage containers 300 can be arranged corresponding to the three container-side work transfer ports 103, respectively.

  In the illustrated example, a storage container opening / closing device 140 is provided at each container-side work transfer port 103. Each storage container opening / closing device 140 includes a mechanism (not shown) for filling the inside of the work storage container 300 with an inert gas, in addition to a mechanism for opening and closing the container of the placed work storage container 300.

  In addition to the above-described configuration, the semiconductor work transfer apparatus 100 may include a buffer position for temporarily holding the semiconductor work 200, or may include a unit according to other uses.

  FIG. 2 is a schematic configuration diagram of a transfer robot in the semiconductor work transfer device shown in FIG. FIG. 2A is a plan view of the transfer robot, and FIG. 2B is a front view of the transfer robot.

  2, the work transfer robot 110 is provided in an apparatus housing defining the work transfer space 101, and includes a work transfer movable arm 150, a gas release movable arm 160, and a gas release mechanism 180. It has a turning mechanism, a lifting mechanism, and a traveling mechanism (all not shown).

  The swivel mechanism rotates the arm mounting base 171 to which the base end side of the work transfer movable arm 150 and the base end side of the gas discharge movable arm 160 are rotatably connected with respect to the apparatus base 172. Then, the work transfer movable arm 150 and the gas discharge movable arm 160 are rotated together with the arm mounting base 171 in the horizontal direction (arrow ± θ directions in FIGS. 1 and 2).

  The elevating mechanism raises and lowers the arm mounting base 171 to which the base end side of the work transfer movable arm 150 and the base end side of the gas discharge movable arm 160 are rotatably connected with respect to the apparatus base 172. The movable arm 150 for transporting the workpiece and the movable arm 160 for releasing gas are moved up and down integrally with the arm mounting base 171 in the vertical direction (that is, the ± z direction in FIGS. 1 and 2).

  The traveling mechanism unit moves the entire work transfer robot 110 including the apparatus base 172 in the work transfer space 101 along the direction in which the container side work transfer ports are arranged (arrows ± y directions in FIGS. 1 and 2). To move.

  In this embodiment, the pre-alignment unit 120 is disposed on one side in the work transfer space 101 along the direction in which the container-side work transfer ports 103 are arranged (the direction of the arrow y in FIG. 1), as shown in FIG. Have been.

  The pre-alignment unit 120 includes a rotatable alignment mechanism 121 having a work mounting surface, and a sensor 123 for detecting a substrate orientation of the semiconductor work 200 mounted on the work mounting surface 122 of the alignment mechanism 121. Before the semiconductor work 200 carried out of the storage container 300 is carried into the processing apparatus 400, the semiconductor work 200 to be carried in is preliminarily aligned with respect to the substrate, that is, preliminary adjustment of the substrate direction is performed.

  The work mounting surface 122 of the alignment mechanism 121 is provided with a vacuum suction hole (not shown) for holding the back surface of the mounted semiconductor work 200. The vacuum suction hole is connected to a vacuum suction source (not shown) through a suction path (not shown). The suction path is provided with a control valve for communicating / blocking the suction path, and can be opened / closed at an arbitrary timing to control suction / suction stop from the vacuum suction port.

  The sensor 123 aligns the semiconductor workpiece 200 mounted on the workpiece mounting surface 122 by the alignment mechanism 121 with a notch or V-notch or orientation flat formed in advance on the peripheral edge of the workpiece in order to align the substrate orientation of the semiconductor workpiece 200. Detect while rotating.

  The pre-alignment unit 120 adjusts the substrate orientation of the semiconductor work 200 when mounted on the work mounting surface 122 based on the rotational position of the work mounting surface 122 when the sensor 123 detects the work cutout. When the orientation of the substrate of the semiconductor work 200 does not match the orientation of the substrate of the semiconductor work 200 at the time of processing, the orientation of the substrate of the semiconductor work 200 mounted on the workpiece mounting surface 122 at the time of taking out the workpiece from the pre-alignment unit 120 is changed by the processing device 400. Adjust according to the substrate orientation at the time.

  Next, the configuration and operation of the work transfer movable arm 150 of the work transfer movable arm 150 and the gas release movable arm 160 of the work transfer robot 110 will be described with reference to FIGS.

  FIG. 3 is a configuration explanatory view of a movable arm for work transfer of the transfer robot. In FIG. 3, the movable arm for gas release is not shown for easy understanding of the movable arm for transporting the workpiece. FIG. 3A shows a plan view of the work transfer movable arm in the retracted state, and FIG. 3B shows a plan view of the work transfer movable arm in the advancing state (forward state).

  As shown in FIG. 3, the work transfer movable arm 150 is configured by connecting a hand 151 and a handling arm 155.

  The hand 151 has a U-shaped mounting portion 152 at the distal end that can enter the work below. The hand 151 has the flat work mounting surface including the U-shaped mounting portion 152 in contact with the substrate surface of the semiconductor work 200 on the side opposite to the processing target side, and holds the semiconductor work 200. The workpiece mounting surface of the hand 151 including the U-shaped mounting portion 152 is provided with a vacuum suction hole (not shown) for gripping the substrate surface of the semiconductor workpiece 200 on the side opposite to the processing target side. . The vacuum suction hole is connected to a vacuum suction source (not shown) through a suction path (not shown). The suction path is provided with a control valve for communicating / blocking the suction path, and can be opened and closed at an arbitrary timing to control suction / suction stop from the vacuum suction hole and control gripping / release of the work.

  The base end of the handling arm 155 is rotatably connected to the arm mounting base 171. The handling arm 155 has a joint structure that can freely bend and extend, and moves the hand 151 connected to the arm tip side in the horizontal direction (arrows ± r in FIGS. 3A and 3B) in accordance with the bending and extension of the indirect structure. Direction). Further, the hand 151 keeps the direction of the mounting portion 152 always in the traveling direction of the hand 151 (the arrow + r direction in FIGS. 3A and 3B) regardless of the degree of bending and extension of the joint structure of the handling arm 155. Is connected to the distal end arm of the handling arm 155 via the.

  Therefore, the direction of the hand 151 that moves linearly forward and backward along the horizontal plane (the direction of the arrow r in FIGS. 3A and 3B) is determined by setting the arm mounting base 171 to which the base end side of the handling arm 155 is connected by the turning mechanism. By rotating the work transfer robot 110 in the horizontal direction (in FIG. 3A and 3B, directions of arrows ± θ), the work transfer robot 110 is rotated with respect to the base 172, and adjusted in accordance with the amount of rotation. Thereby, the hand 151 is moved in the direction (+ x direction in FIG. 1A) in which the hand 151 faces the work storage container 300 via the container-side work transfer port 103 in the work transfer space 101 in FIG. In the direction in which the hand 151 faces the processing apparatus transfer point 410 of the processing apparatus 400 via the apparatus-side work transfer port (the −x direction (opposite to the + x direction in FIG. 1A)), the pre-alignment unit 120 (the + y direction in FIG. 1A).

  The height position (position along the z direction) of the hand 151 that linearly advances and retreats along the horizontal plane is adjusted by the lifting mechanism to the arm mounting base 171 to which the base end of the handling arm 155 is connected. It can be raised and lowered with respect to the table 172 and can be defined at a predetermined height position.

  In addition, the entire work transfer robot 110 including the apparatus base 172 is moved by the traveling mechanism to the horizontal movement position (movement position along the x direction and the y direction) of each of the container side work transfer ports 103 and the processing device 400. Of the pre-alignment unit 120 and the transfer point 410 of the processing device.

  Next, the loading / unloading operation of the semiconductor work 200 by the work transfer movable arm 150 will be described with reference to the drawings, taking loading / unloading to / from the pre-alignment unit 120 as an example.

  FIG. 4 is an explanatory diagram of an operation when a semiconductor work is carried in by the work transfer movable arm. FIG. 4A is a front view of the transfer robot when the semiconductor work is loaded, and FIG. 4B is a plan view of the transfer robot when the semiconductor work is loaded.

  As shown in FIG. 4, when the semiconductor work 200 is carried into the pre-alignment unit 120, the work transfer movable arm 150 moves the hand 151 holding the semiconductor work 200 toward the pre-alignment unit 120. The handling arm 155 is moved forward with the height of the hand 151 held above the height of the work mounting surface 122 of the alignment mechanism 121 of the pre-alignment unit 120 while the carrying direction of the semiconductor work 200 is matched. Then, the hand 151 and the semiconductor work 200 are advanced (advanced) above the work mounting surface 122 of the alignment mechanism 121. Then, the hand 151 is arranged with respect to the alignment mechanism 121 so that the center of the semiconductor work 200 and the center of the work mounting surface 122 of the alignment mechanism 121 are coaxial (see (a) of FIGS. 4A and 4B).

  In this state, the work transfer robot 110 lowers the arm mounting base 171 with respect to the device base 172 by the elevating mechanism, and moves the height position of the U-shaped mounting part 152 of the hand 151 to the work mounting of the alignment mechanism 121. The mounting surface of the hand 151 is separated from the lower surface of the semiconductor work 200 so as to be positioned below the surface 122, and the semiconductor work 200 is mounted on the work mounting surface 122 of the alignment mechanism 121. Then, in a state where the arm mounting base portion 171 is lowered, the work transfer movable arm 150 extends the handling arm 155 to the rear side, retreats the hand 151 and the handling arm 155, and retreats from the pre-alignment unit 120 (FIG. 4A and 4B (see (b)).

  FIG. 5 is an explanatory diagram of an operation when the semiconductor work is carried out by the work transfer movable arm. FIG. 5A is a front view of the transfer robot when unloading the semiconductor work, and FIG. 5B is a plan view of the transfer robot when unloading the semiconductor work.

  As shown in FIG. 5, when the semiconductor work 200 is unloaded from the pre-alignment unit 120, the operation procedure of the work transfer movable arm 150 is reversed from that of the above-described loading. In other words, the work transfer movable arm 150 matches the direction (r direction) of the hand 151 holding the semiconductor work 200 with the unloading direction of the semiconductor work 200 with respect to the pre-alignment unit 120, and changes the height position of the hand 151. The holding arm 155 is extended forward while holding the hand 151 below the work mounting surface 122 of the alignment mechanism 121 of the pre-alignment unit 120, and the hand 151 is moved below the work mounting surface 122 of the alignment mechanism 121. The hand 151 is disposed with respect to the alignment mechanism 121 such that the center of the semiconductor work 200, that is, the center of the work mounting surface 122 of the alignment mechanism 121 is at a predetermined position on the mounting surface of the hand 151 (FIGS. 5A and 5B). Each (a)).

  In this state, the work transfer robot 110 raises the arm mounting base 171 with respect to the device base 172 by the elevating mechanism, and sets the height position of the U-shaped mounting part 152 of the hand 151 to the work mounting of the alignment mechanism 121. The lower surface of the semiconductor work 200 is separated from the work mounting surface 122 of the alignment mechanism 121 so as to be positioned above the height position of the surface 122, and the semiconductor work 200 is gripped by the hand 151. Then, with the arm mounting base 171 raised, the work transfer robot 110 extends the handling arm 155 of the work transfer movable arm 150 to the rear side, and retreats the hand 151 holding the semiconductor work 200 and the semiconductor work 200. Then, it is withdrawn from the pre-alignment unit 120 (see (b) of FIGS. 5A and 5B).

  When loading / unloading the semiconductor work 200 by the work transfer robot 110, the semiconductor work 200 is sucked by the vacuum suction holes provided on the work mounting surface of the hand 151, and the work is mounted on the alignment mechanism 121 of the pre-alignment unit 120. The suction / stop of the suction of the semiconductor work 200 by the vacuum suction holes provided on the surface is controlled at an appropriate timing that does not hinder the loading / unloading operation.

  Next, the configuration and operation of the movable arm 160 for gas release among the movable arm 150 for workpiece transfer and the movable arm 160 for gas release of the workpiece transfer robot 110 will be described with reference to FIGS.

  FIG. 6 is an explanatory diagram of a configuration of a movable arm for gas release of the transfer robot. In FIG. 6, the work transfer movable arm is not shown for easy understanding of the gas discharge movable arm. FIG. 6A shows a plan view of the movable gas discharging arm in a retracted state, and FIG. 6B shows a plan view of the movable gas discharging arm in a forward state.

  As shown in FIG. 6, the gas releasing movable arm 160 is configured by connecting a gas discharging nozzle 161 and a nozzle moving arm 165.

  The gas discharge nozzle 161 has a configuration in which a disk-shaped ejection portion 162 and a connection portion 163 protruding from the disk-shaped ejection portion 162 and extending therefrom are integrally formed. The board surface of the board-shaped ejection portion 162 is configured to be substantially equal to or larger than the board surface of the semiconductor work 200, so that the board face of the semiconductor work 200 can be covered when the board surface is overlapped with the semiconductor work 200. At the same time, it is possible to pass through transport ports such as the container-side workpiece transport port 103 and the apparatus-side workpiece transport port 104. Accordingly, in the illustrated example, the disk-shaped ejection portion 162 has a disk shape whose diameter is equal to or larger than the diameter of the semiconductor work 200. Further, the connecting portion 163 is configured to protrude in the radial direction of the board-shaped ejection portion 162. The board shape of the board-shaped ejection portion 162 is not limited to a circle as long as the board surface of the semiconductor work 200 can be covered and hidden, and a board shape other than a circle (for example, a square, an AND gate symbol shape, and the like). It is also possible to employ. In the gas discharge nozzle 161, one or a plurality of gas ejection holes 164 are formed on one surface of the board-shaped ejection portion 162.

FIG. 7 shows an embodiment of a disk-shaped nozzle portion of a gas discharge nozzle in which gas ejection holes are formed.
In the illustrated example, a plurality of (many) gas ejection holes 164 are arranged over the entire surface of the board-shaped ejection portion 162, and the gas discharge nozzle 161 can eject gas from the entire surface of the board-shaped ejection portion 162. I have. Accordingly, if the board surface on which the gas ejection holes 164 of the board-shaped ejection section 162 are formed is disposed so as to face the substrate surface of the semiconductor workpiece 200 on the side to be processed, the semiconductor work from the entire board surface of the board-shaped ejection section 162 can be obtained. The gas can be ejected toward the entire substrate surface of the processing target 200.

  Note that the arrangement of the gas ejection holes 164 on the board surface of the board-shaped ejection section 162 is not limited to the illustrated one as long as the entire area of the substrate surface on the processing target side of the opposed semiconductor work 200 can be covered with the ejected gas. The arrangement may not be the entire area as in the example. For example, a gas ejection hole is formed at the center of the board surface of the board-shaped ejection portion 162, and the space between the board surface of the board-shaped ejection portion 162 and the substrate surface of the semiconductor work 200 on the processing side is ejected from the gas ejection hole 164. May be filled with a gas that diffuses. Also, the direction of gas ejection from the gas ejection holes 164 is not limited to the direction perpendicular to the substrate surface of the semiconductor workpiece 200 on the processing target side, and the gas ejected from the gas ejection holes 164 may be flush with the surface of the plate-shaped ejection portion 162. Any gas ejection direction that easily fills the space between the semiconductor work 200 and the substrate surface on the processing target side may be used. Further, the gas covering the substrate surface of the semiconductor workpiece 200 on the processing target side is kept in the atmosphere in the workpiece transfer space 101 (the board surface of the plate-shaped ejection part 162 and the processing target of the semiconductor workpiece 200 during the transportation of the semiconductor workpiece 200). The atmosphere may be any direction as long as it is not easily replaced with the atmosphere outside the space between the substrate and the substrate.

  Inside the connection portion 163 of the gas discharge nozzle 161, a gas supply passage (not shown) communicating with each of the gas ejection holes 164 of the board-shaped ejection portion 162 is provided. One end of the gas supply passage is connected to the other end of the gas supply passage 168 connected to the supply source of the inert gas at the connection portion 163. The gas supply path 168 is provided with a control valve 169 for controlling the release of the inert gas from the gas discharge nozzle 161. The control valve 169 controls the supply of the inert gas to the gas discharge nozzle 161 based on the control signal from the controller unit 130, and controls the release of the inert gas from the gas discharge nozzle 161. The gas supply path 168 for supplying the inert gas to the gas discharge nozzle 161 and the control valve 169 constitute a gas discharge mechanism 180 together with the gas discharge nozzle 161.

  In this embodiment, the nozzle moving arm 165 is rotatably connected at its base end to an arm mounting base 171 together with the handling arm 155 of the work transfer movable arm 150. The nozzle moving arm 165 has a joint structure that can be freely bent and extended, and moves the gas discharge nozzle 161 connected to the distal end of the arm in a horizontal direction (in FIGS. 6A and 6B, according to the bending and extension of the joint structure). The structure is such that it can linearly move back and forth along the directions (arrows ± r directions). Further, the gas discharge nozzle 161 is maintained in the direction in which the direction of the gas discharge nozzle 161 is always kept in the advancing and retreating direction of the gas discharge nozzle 161 (indicated by the arrow + r in FIGS. 6A and 6B) irrespective of the degree of bending and extension of the joint structure of the nozzle moving arm 165. It is connected via a mechanism 166 to the distal arm of the nozzle movement arm 165.

  Then, in the gas releasing movable arm 160, the height position of the horizontal plane where the gas discharging nozzle 161 moves forward and backward linearly according to the bending / extension of the joint structure of the nozzle moving arm 165 (z axis in FIGS. 6A and 6B). The position in the horizontal direction is the height position of the horizontal plane (z axis in FIGS. 3A and 3B) in which the hand 151 moves linearly in accordance with the bending / extension of the joint structure of the handling arm 155 in the work transfer movable arm 150. The nozzle moving arm 165 is configured to be higher than the position (direction position). For example, the height position of the horizontal plane on which the board surface on one side of the gas discharge nozzle 161 in which the gas ejection holes 164 are formed linearly moves forward and backward is determined by the hand 151 serving as the mounting surface of the semiconductor arm 200 on the movable arm 150 for work conveyance. As shown in FIG. 2B, the height is higher than the height position of the horizontal plane in which the rectilinear movement is performed by a predetermined amount h, which is at least larger than the thickness (substrate thickness) of the semiconductor work 200. ing.

  Further, the gas discharge movable arm 160 has its nozzle movement arm 165 rotatably connected to an arm mounting base 171 together with the handling arm 155 of the work transfer movable arm 150. In the connection of the nozzle moving arm 165 to the arm mounting base 171, the moving direction (the direction of the arrow ± r in FIGS. 6A and 6B) of the gas discharge nozzle 161 that linearly moves forward and backward due to the bending and extension of the nozzle moving arm 165. The arm is set so as to coincide with the forward / backward direction (in FIG. 3A and 3B, the arrow ± r direction) of the hand 151 that linearly moves forward / backward due to the bending / extension of the handling arm 155 in the work transfer movable arm 150 shown in FIG. It is connected to the mounting base 171.

  Thereby, as shown in FIG. 2A, the direction of the gas discharge nozzle 161 that moves linearly forward and backward along the horizontal plane (the direction of the arrow r in FIGS. 6A and 6B) is the same as the hand 151 of the work transfer movable arm 150. Is adjusted by the amount of rotation of the arm mounting base 171 with respect to the device base 172 by the turning mechanism, so that even if the direction of the hand 151 of the movable arm 150 for work transfer in the work transfer space 101 changes, the movable arm for gas release is changed. The direction of the gas discharge nozzle 161 follows the direction of the hand 151, and always the direction of the hand 151 and the direction of the gas discharge nozzle 161 and the direction of linear movement of the hand 151 by the handling arm 155 and the nozzle movement arm. 165 can always coincide with the rectilinear moving direction of the gas discharge nozzle 161.

  Further, as shown in FIG. 2B, the height position of the horizontal plane on which the board surface on one side of the gas discharge nozzle 161 linearly advances and retreats is determined by the hand 151 serving as the mounting surface of the semiconductor work 200 on the work transfer movable arm 150. Since the height is higher by a predetermined amount h than the height position of the horizontal plane that linearly moves forward and backward, the position of the forward / backward moving position of the hand 151 by the handling arm 155 and the forward / backward moving position of the gas discharge nozzle 161 by the nozzle moving arm 165 are determined. Depending on the relationship, a part and the whole of the substrate surface on the processing target side of the semiconductor work 200 mounted on the hand 151 of the work transfer movable arm 150 is covered and concealed by the board-shaped ejection portion 162 of the gas discharge movable arm 160. Or exposed.

  Specifically, the handling arm 155 of the work transfer movable arm 150 is set to the rearward or forward side in the advance / retreat direction, while the nozzle moving arm 165 of the gas discharge movable arm 160 is also set to the rearward or forward side in the advance / retreat direction. By extending to the side, the hand 151 on which the semiconductor work 200 is mounted is moved by the board-shaped ejection part 162 of the gas discharge nozzle 161 at the rear side position or the front side position of the handling arm 155 and the nozzle moving arm 165 in the retreating direction. Can be obscured. Further, the handling arm 155 of the work transfer movable arm 150 is extended toward the rear side or the front side in the retreating direction, while the nozzle moving arm 165 of the gas discharge movable arm 160 is reversed in the forward or rearward direction. In the extended state, the hand 151 on which the semiconductor work 200 is mounted can be exposed from the board-shaped ejection portion 162 of the gas discharge nozzle 161 at the rear side position or the front side position of the handling arm 155 in the reciprocating direction, Correspondingly, the state in which the disk-shaped ejection portion 162 of the gas discharge nozzle 161 faces the hand 151 is released at the front side position or the rear side position of the gas discharge movable arm 160 in the advance / retreat direction.

  In addition, in the case of the present embodiment, the distance between the work mounting surface of the hand 151 in the movable arm 150 for work transfer and the board surface of the movable arm 160 for gas release on which the gas ejection holes 164 of the board-shaped ejection portion 162 are formed. Since the gas discharge movable arm 160 can always be held at a constant h, the gas discharge movable arm 160 moves on the parallel trajectory separated by the predetermined distance h from the movement trajectory of the hand 151 by the work transfer movable arm 150, and the gas discharge nozzle 161 can also be moved to follow the hand 151.

  In the semiconductor work transfer apparatus 100 of the present embodiment, the transfer of the semiconductor work 200 between the work storage container 300 and the processing apparatus 400 and the ejection / stop of the inert gas by the gas release mechanism 180 are performed by the controller unit 130. For example, it is performed according to the procedure shown in FIG.

  FIG. 8 is a flowchart illustrating a semiconductor work transfer process performed by the semiconductor work transfer apparatus according to the present embodiment.

  First, when the work storage container 300 is placed on the storage container opening / closing device 140, the storage container opening / closing device 140 fills the inside of the work storage container 300 with the inert gas, opens the work storage container 300, and transports the work. The robot 110 can take out the semiconductor work 200.

  Then, in the work transfer robot 110, the work transfer movable arm 150 advances the hand 151 into the work storage container 300, mounts the semiconductor work 200 on the hand 151, and then retreats the mount hand 151 with the semiconductor work 200 mounted thereon. Then, the semiconductor work 200 is taken out of the work storage container 300 into the work transfer space 101 (step S020).

  At this time, the work transfer robot 110 moves the gas discharge nozzle 161 to the retreat position of the hand 151 of the work transfer movable arm 150 from which the semiconductor work 200 is taken out from the work storage container 300 in advance. Then, it overlaps with the semiconductor work 200 taken out from the work storage container 300.

  Then, when the work transfer movable arm 150 starts moving the hand 151 into the work storage container 300, the timing of the start of the movement or the time until the semiconductor work 200 is mounted on the hand 151 and appears in the work transfer space 101. At an appropriate timing during this time, the controller unit 130 opens the control valve 169 to start the ejection of the inert gas from the gas ejection holes 164 formed in the disk-shaped ejection portion 162 of the gas ejection nozzle 161 (step S010). ).

  As a result, the atmosphere immediately below the gas discharge nozzle 161 of the gas discharge movable arm 160 where the semiconductor work 200 taken out of the work storage container 300 is located is replaced with an atmosphere filled with an inert gas. When the semiconductor work 200 mounted on the hand 151 of the work transfer movable arm 150 and taken out appears in the work transfer space 101, the substrate surface of the semiconductor work 200 on the processing target side has a gas discharge nozzle over its entire area. 161 is ejected from the entire surface of the board. As a result, the space between the substrate surface on the processing target side of the semiconductor work 200 and the lower surface of the gas discharge nozzle 161 is filled with the inert gas ejected from the gas ejection holes 164, and the low humidity environment is maintained. Is done.

  Then, the work transfer robot 110 transfers the semiconductor work 200 to the pre-alignment unit 120 with the semiconductor work 200 mounted on the hand 151 and gripped (step S030). During the transfer, in the work transfer robot 110, the gas discharge movable arm 160 covers and hides the substrate surface on the processing target side of the semiconductor work 200 mounted on the hand 151 of the work transfer movable arm 150 with the gas discharge nozzle 161. Following the workpiece transfer movable arm 150, the inert gas is injected from the gas ejection holes 164 to the substrate surface of the semiconductor workpiece 200 on the processing target side. As a result, even during the transfer of the semiconductor work 200 by the work transfer movable arm 150, the space between the substrate surface on the processing target side of the semiconductor work 200 and the lower surface of the gas discharge nozzle 161 is not filled with the gas discharged from the gas discharge hole 164. It will be filled with active gas. As a result, without exposing the entire work transfer space 101 with the inert gas, it is possible to prevent exposure of the substrate surface of the semiconductor work 200 on the processing side to the atmosphere and to establish a low-humidity environment, thereby suppressing oxidation and adhesion of moisture. .

  Thereafter, the work transfer robot 110 mounts and stores the semiconductor work 200 on the mounting surface 122 of the alignment mechanism 121 of the pre-alignment unit 120. After the mounting, the work transfer robot 110 retreats the hand 151 of the work transfer movable arm 150 from the mounting surface 122 of the alignment mechanism 121 on which the semiconductor work 200 of the pre-alignment unit 120 is mounted. In this state, in the pre-alignment unit 120, the positioning of the semiconductor work 200 is performed (Step S040).

  FIG. 9 is an explanatory view of the operation of the gas discharge movable arm when the semiconductor work is carried into the pre-alignment unit. FIG. 9A is a front view of the transfer robot when the semiconductor work is loaded, and FIG. 9B is a plan view of the transfer robot when the semiconductor work is loaded.

  As shown in FIG. 9, when the semiconductor work 200 is carried into the pre-alignment unit 120, the work transfer movable arm 150 moves the hand 151 holding the semiconductor work 200 in the direction (r direction) with respect to the pre-alignment unit 120. The handling arm 155 is moved forward with the height of the hand 151 being kept higher than the height of the work mounting surface 122 of the alignment mechanism 121 of the pre-alignment unit 120 so that the carrying direction of the semiconductor work 200 is matched. The hand 151 and the semiconductor work 200 are advanced above the work mounting surface 122 of the alignment mechanism 121. Then, the hand 151 is arranged with respect to the alignment mechanism 121 so that the center of the semiconductor work 200 and the center of the work mounting surface 122 of the alignment mechanism 121 are coaxial (see (a) of FIGS. 9A and 9B).

  Here, if the direction (r direction) of the hand 151 holding the semiconductor work 200 by the work transfer movable arm 150 matches the direction in which the semiconductor work 200 is loaded into the pre-alignment unit 120, the work transfer The substrate surface on the processing target side of the semiconductor work 200 mounted on the hand 151 of the movable arm 150 is covered with a gas discharge nozzle 161, and an inert gas is injected from the gas ejection holes 164 to the substrate surface on the processing target side of the semiconductor work 200. Also in the movable arm 160 for gas release, the direction in which the gas discharge nozzle 161 moves linearly forward and backward coincides with the direction in which the semiconductor work 200 is carried in.

  Therefore, when the work transfer movable arm 150 advances the handling arm 155 to advance the hand 151 and the semiconductor work 200 above the work mounting surface 122 of the alignment mechanism 121, the gas discharge movable arm 160 also moves. In synchronization with the movable arm 150, the gas discharge nozzle 161 advances above the work mounting surface 122 of the alignment mechanism 121 while the substrate surface on the processing target side of the semiconductor work 200 is covered with the gas discharge nozzle 161 (see FIG. 9A and 9B, respectively (see (a)).

  Therefore, even when the semiconductor work 200 is loaded into the pre-alignment unit 120, the movable arm 160 for gas release holds the substrate surface on the processing target side of the semiconductor work 200 mounted on the hand 151 of the movable arm 150 for work transfer with the gas release nozzle. Since the inert gas is ejected from the gas ejection holes 164 to the substrate surface of the semiconductor workpiece 200 on the processing target side, the inert gas is ejected from the gas ejection holes 164 to the substrate surface of the semiconductor workpiece 200 on the processing target side and the lower surface of the gas discharge nozzle 161. Is filled with an inert gas.

  Then, in the work transfer robot 110, the arm mounting base 171 is lowered with respect to the device base 172 by the lifting mechanism, and the height position of the U-shaped mounting portion 152 of the hand 151 of the work transfer movable arm 150 is aligned. The semiconductor work 200 is placed on the work mounting surface 122 of the alignment mechanism 121 so as to be positioned below the work mounting surface 122 of the mechanism 121. At this time, when the arm mounting base 171 is lowered with respect to the device base 172 by the lifting mechanism, the gas discharge movable arm 160 has a plate surface on one side of the gas discharge nozzle 161 in which the gas discharge holes 164 are formed. The height position of the horizontal plane that moves linearly forward and backward also decreases.

  However, the height position of the horizontal plane on which the board surface on one side of the gas discharge nozzle 161 in which the gas ejection holes 164 are formed linearly advances and retreats depends on the hand 151 serving as the mounting surface of the semiconductor arm 200 on the movable arm 150 for work conveyance. As shown in FIG. 2B, the height is higher than a height (substrate thickness) of the semiconductor work 200 by a predetermined amount h, as shown in FIG. 2B. I have. Therefore, even when the semiconductor work 200 is placed on the work mounting surface 122 of the alignment mechanism 121 and the hand 151 of the work transfer movable arm 150 is in a height position such that the substrate surface of the semiconductor work 200 is separated, The gas discharge nozzle 161 of the movable gas discharge arm 160 can maintain a state in which the board surface on which the gas ejection holes 164 are formed does not come into contact with the semiconductor work 200 and remains separated. As a result, even after the semiconductor work 200 is placed on the work mounting surface 122 of the alignment mechanism 121, the inert gas can be continuously ejected from the gas ejection holes 164 to the substrate surface of the semiconductor work 200 on the processing side. ing.

  Then, only the handling arm 155 of the work transfer robot 110 holds the gas discharge nozzle 161 mounted on the work mounting surface 122 of the alignment mechanism 121 so as to cover the substrate surface of the semiconductor work 200 on the processing target side. The hand 151 is retracted, retracted from below the work mounting surface 122 of the alignment mechanism 121, and made to stand by (see (b) of FIGS. 9A and 9B). That is, in this case, the gas discharge movable arm 160 operates independently of the work transfer movable arm 150, and does not cause the gas discharge nozzle 161 to follow the hand 151 of the work transfer movable arm 150. The semiconductor device 200 is held so as to face the semiconductor work 200 placed on the work mounting surface 122 of the alignment mechanism 121.

  Therefore, even while the alignment of the semiconductor work 200 is being performed by the pre-alignment unit 120, the space between the substrate surface on the processing target side of the semiconductor work 200 and the lower surface of the gas discharge nozzle 161 is ejected from the gas ejection hole 164. Is filled with the inert gas. As a result, without exposing the entire surface of the pre-alignment unit 120 with the inert gas, it is possible to prevent the exposure of the substrate surface of the semiconductor work 200 on the processing side to the atmosphere and to achieve a low humidity environment, thereby suppressing oxidation and adhesion of moisture. it can.

  Returning to FIG. 8, when the positioning of the semiconductor work 200 is performed by the pre-alignment unit 120 (step S040), the semiconductor work 200 is taken out of the pre-alignment unit 120 by the work transfer robot 110 (step S040). S050). 9A and 9B, the hand 151 first retreats from below the work mounting surface 122 of the alignment mechanism 121 and waits during the alignment by the pre-alignment unit 120. The movable workpiece transfer arm 150 advances the hand 151 to return the hand 151 to a position below the work mounting surface 122 of the alignment mechanism 121. Then, the arm mounting base portion 171 is raised with respect to the device base 172 by the lifting mechanism, and the semiconductor work 200 is transferred from the work mounting surface 122 of the alignment mechanism 121 to the mounting surface of the hand 151 of the movable arm 150 for work transfer. I do. Thereafter, the hand 151 of the work transfer movable arm 150 and the gas discharge nozzle 161 of the gas discharge movable arm 160 are moved backward while being synchronized.

  After the semiconductor work 200 is taken out of the pre-alignment unit 120, the semiconductor work 200 is transported to the processing device 400 while being held by the hand 151 (step S060). During the transfer, in the work transfer robot 110, the gas discharge movable arm 160 covers and hides the substrate surface on the processing target side of the semiconductor work 200 mounted on the hand 151 of the work transfer movable arm 150 with the gas discharge nozzle 161. Following the workpiece transfer movable arm 150, the inert gas is injected from the gas ejection holes 164 to the substrate surface of the semiconductor workpiece 200 on the processing target side. Thus, even when the semiconductor workpiece 200 is being transported to the processing apparatus 400, the space between the substrate surface of the semiconductor workpiece 200 on the processing target side and the lower surface of the gas discharge nozzle 161 is filled with the inert gas ejected from the gas ejection holes 164. Will be filled with. As a result, without exposing the entire work transfer space 101 with the inert gas, it is possible to prevent exposure of the substrate surface of the semiconductor work 200 on the processing side to the atmosphere and to establish a low-humidity environment, thereby suppressing oxidation and adhesion of moisture. .

  Thereafter, the work transfer robot 110 mounts and stores the semiconductor work 200 at the processing device transfer point 410 of the processing device 400. For example, in the work transfer robot 110, the work transfer movable arm 150 moves the hand 151 on which the pre-aligned semiconductor work 200 is mounted to the processing device transfer point 410 in the processing device 400, and It is mounted on the transfer point 410. Then, in the work transfer robot 110, the work transfer movable arm 150 causes the hand 151 to move backward and the hand 151 to move out of the processing apparatus 400. In the meantime, in the present embodiment, the gas discharge movable arm 160 holds the gas discharge nozzle 161 at the retreat movement position after the semiconductor work 200 is taken out from the pre-alignment unit 120.

  Then, when the work transfer movable arm 150 starts moving the hand 151 on which the semiconductor work 200 is mounted into the work storage container 300, the timing at which the semiconductor work 200 is accommodated in the processing apparatus 400, or After the transfer of the work 200 to the processing device transfer point 410, the controller unit 130 closes the control valve 169 at the timing when the hand 151 on which the semiconductor work 200 is not mounted appears in the work transfer space 101 (step S070). Then, the ejection of the inert gas from the gas ejection holes 164 formed in the disk-shaped ejection portion 162 of the gas discharge nozzle 161 is stopped (Step S080).

  On the other hand, while the unprocessed semiconductor work 200 is transferred from the work storage container 300 to the processing device 400 as described above, the transfer of the processed semiconductor work 200 from the processing device 400 to the work storage container 300 is performed in the same manner. This is performed, for example, as shown in steps S090 to S130 while maintaining the substrate surface of the workpiece 200 on the processing target side in a low humidity environment.

  That is, when removing the processed semiconductor work 200 from the processing apparatus 400, similarly to the case of removing the semiconductor work 200 from the work storage container 300, first, the processing apparatus 400 mounts the semiconductor work 200 on the hand 151 of the work transfer movable arm 150. Before the semiconductor work 200 extracted and taken out appears in the work transfer space 101 (step S100), the controller unit 130 opens the control valve 169 to release the gas formed in the plate-shaped ejection portion 162 of the gas discharge nozzle 161. The ejection of the inert gas from the ejection holes 164 is started (step S090).

  Then, the work transfer robot 110 transfers the semiconductor work 200 taken out of the processing apparatus 400 to the work storage container 300 in a state where the semiconductor work 200 is mounted on the hand 151 and gripped (step S110). During the transfer, in the work transfer robot 110, the gas discharge movable arm 160 covers and hides the substrate surface on the processing target side of the semiconductor work 200 mounted on the hand 151 of the work transfer movable arm 150 with the gas discharge nozzle 161. Following the workpiece transfer movable arm 150, the inert gas is injected from the gas ejection holes 164 to the substrate surface of the semiconductor workpiece 200 on the processing target side. As a result, without exposing the entire work transfer space 101 with the inert gas, it is possible to prevent exposure of the substrate surface of the semiconductor work 200 on the processing side to the atmosphere and to establish a low-humidity environment, thereby suppressing oxidation and adhesion of moisture. .

  Thereafter, the work transfer robot 110 mounts and stores the processed semiconductor work 200 in the work storage container 300 in the same manner as when mounting the semiconductor work 200 at the processing device transfer point 410 in the processing device 400. The unit 130 closes the control valve 169 to stop the ejection of the inert gas from the gas ejection holes 164 formed in the disc-shaped ejection portion 162 of the gas discharge nozzle 161 (Steps S120 and S130).

  According to the above operation, the semiconductor work transfer apparatus 100 of the present embodiment can perform the transfer, carry-out / load-in operation of the semiconductor work 200 in the local low-humidity environment in which the usage amount of the inert gas is suppressed. Also at that time, the semiconductor device 200 is mounted on the hand 151 when loading / unloading the semiconductor work 200 between the work storage container 300 or the processing apparatus 400 and the work transfer space 101 using the hand 151 of the work transfer movable arm 150. Since the inert gas is blown out from the gas discharge nozzle 161 of the movable gas discharge arm 160 before the semiconductor work 200 that has appeared in the work transfer space 101 or until the semiconductor work 200 is completely hidden from the work transfer space 101, during loading / unloading. The effect of suppressing oxidation and moisture adhesion in the inside is further improved.

  In addition, even while the positioning of the semiconductor work 200 is being performed by the pre-alignment unit 120 as described in step S040, an inert gas is discharged from the gas ejection holes 164 of the gas discharge nozzle 161 to process the semiconductor work 200. When the sensor 123 of the pre-alignment unit 120 and the gas discharge nozzle 161 interfere with each other in the process of filling the space between the substrate substrate surface with the inert gas with the gas discharge nozzle 161 as shown in FIG. As shown in FIG. 11, after the hand 151 of the work transfer movable arm 150 is retracted, the arm mounting base 171 is turned by a small amount with respect to the apparatus base 172, as shown in FIG. By moving the work transfer robot 110 horizontally, interference of the sensor 123 can be prevented.

FIG. 10 is a view showing a modified example of the gas discharge jet nozzle of the movable gas discharge arm.
FIG. 11 is a diagram showing a sensor interference evacuating operation of the gas discharge nozzle in the work transfer movable arm.

  Next, another embodiment of the semiconductor workpiece transfer device according to the present disclosure will be described with reference to the drawings. In the semiconductor work transfer device 100 of the above-described embodiment, the work transfer robot 110 has a configuration in which one work transfer movable arm 150 is provided for one gas discharge movable arm. In the semiconductor work transfer apparatus 100 of the present embodiment, the work transfer robot 110 has a configuration in which a plurality of work transfer movable arms 150 are provided for one gas discharge movable arm.

  In the semiconductor manufacturing process and the inspection process, the loading and unloading of the semiconductor work 200 are usually performed continuously. In this case, the semiconductor work transfer device 100 transfers the first semiconductor work 200 to the processing device 400 and then, while the processing device 400 is processing the first semiconductor work 200, the second semiconductor work 200. In order to reduce the transfer time of the second semiconductor work 200, it is preferable to prepare for transfer of the second semiconductor work 200. At this time, the processing time of the processing apparatus 400 for one semiconductor work 200 is longer than the processing time of the pre-alignment unit 120 for one semiconductor work 200. It is preferable to wait in a state where the positioning operation by the pre-alignment unit 120 is completed.

  In this case, the work transfer robot 110 provided with one work transfer movable arm 150 for one gas release movable arm 160 performs processing after the processing of the first semiconductor work 200 in the processing device 400 is completed. The processed first semiconductor work 200 is taken out of the apparatus 400 and stored in the work storage container 300. Then, the second semiconductor work 200 that has already been aligned by the pre-alignment unit 120 is taken out of the pre-alignment unit 120 and stored in the processing device 105. However, while the processed first semiconductor work 200 is being transported from the processing apparatus 400 to the work storage container 300, the second semiconductor work 200 waiting in the pre-alignment unit 120 is exposed to the atmosphere. turn into.

  Therefore, in the semiconductor work transfer device 100 of the present embodiment, the work transfer robot 110 has the second work transfer movable arm 150 (hereinafter, the first work transfer movable arm 150-1) and the second work transfer arm 150-1. When a transferable arm 150 (150-2) is added and the semiconductor work 200 is continuously loaded and unloaded, the first semiconductor work 200 is transferred to the processing device 400, and then the second semiconductor work 200 is transferred. In order to reduce the transfer time of the workpiece 200, the processing apparatus 400 processes the first semiconductor workpiece 200 without exposing the substrate surface of the processed side of the second semiconductor workpiece 200 to the atmosphere while processing the first semiconductor workpiece 200. Preparation for transport to the apparatus 400 can be performed.

  Hereinafter, a semiconductor workpiece transfer device 100 according to the present embodiment will be described with reference to the drawings. The semiconductor work transfer device 100 of the present embodiment is different from the semiconductor work transfer device 100 shown in FIG. 1 in the configuration of the work transfer robot 110, and accordingly, the control procedure of each unit by the controller unit 130 is partially different. Has the same or similar configuration as the semiconductor work transfer device 100 shown in FIG. 1, and therefore, the same or similar components as those of the semiconductor work transfer device 100 shown in FIG. Description is omitted.

  FIG. 12 is a schematic configuration diagram of a transfer robot in another embodiment of the semiconductor work transfer device according to the present disclosure. FIG. 12A is a front view of the transfer robot, and FIG. 12B is a plan view of the transfer robot.

  In FIG. 12, a work transfer robot 110 is provided in an apparatus housing defining a work transfer space 101, and includes a first work transfer movable arm 150-1 and a second work transfer movable arm 150-2. , A gas releasing movable arm 160, a gas releasing mechanism 180, and a turning mechanism, an elevating mechanism, and a traveling mechanism (all not shown).

  The second work transfer movable arm 150-2 includes a hand 151 having a mounting portion 152 and a hand 151 similarly to the first work transfer movable arm 150-1, that is, the work transfer movable arm 150 shown in FIG. Is provided with a handling arm 155 for moving the robot forward and backward. Both the first and second work transfer movable arms 150 (150-1 and 150-2) have an articulated structure that can be bent and extended, and the base ends are respectively attached to the arm mounting base 171 together. It is connected rotatably. Each handling arm 155 moves the hand 151 connected to the arm tip side linearly in the same direction along the horizontal direction (arrows ± r directions in FIGS. 12A and 12B) according to the bending / extension of the indirect structure. It can move forward and backward.

  In each of the first and second work transfer movable arms 150 (150-1 and 150-2), the hand 151 always sets the orientation of the mounting section 152 to the hand 151 regardless of the degree of bending or extension of the joint structure of the handling arm 155. 12A and 12B (indicated by the arrow + r in FIG. 12B), is connected to a distal arm of the handling arm 155 via a direction maintaining mechanism 156.

  Then, between the first movable arm 150-1 for transporting the workpiece and the second movable arm 150-2 for transporting the workpiece, a height position where the hand 151 having the mounting portion 152 is arranged (FIG. 12A). , 12B in the z-axis direction). For example, the height position of the horizontal plane on which the lower surface (back surface of the mounting surface) of the hand 151 of the second work transfer movable arm 150-2 moves linearly is determined by the first work transfer movable arm 150-1. As shown in FIG. 2B, the mounting surface of the hand 151 is higher by at least a predetermined amount h than the height position of the horizontal plane in which the hand 151 moves linearly, as shown in FIG. 2B. It is configured to be. Thus, the first and second work transfer movable arms 150 (150-1 and 150-2) position the hands 151 so as to overlap each other in the same advancing and retreating direction of the hands 151, and prevent the hands 151 from overlapping. Can be located.

  On the other hand, the gas releasing movable arm 160 is configured by connecting a gas discharging nozzle 161 and a nozzle moving arm 165, similarly to the gas releasing movable arm 160 of the transfer robot shown in FIG.

  The nozzle moving arm 165 has an articulated structure that can be freely bent and extended. The first and second nozzles 165 are arranged so that the base end side of the nozzle moving arm 165 does not interfere with the bending / extending handling arm 155 of the work transfer movable arm 150. The base ends of the handling arms 155 of the two work transfer movable arms 150-1 and 150-2 are rotatably connected to an arm mounting portion 173 integrated with an arm mounting base portion 171 connected together. The nozzle moving arm 16 moves the gas discharge nozzle 161 connected to the arm tip side along the horizontal direction in accordance with the bending / extension of the indirect structure of the first and second movable workpiece transfer arms 150-1 and 150-2. The structure is such that each hand 151 can move linearly forward and backward in the same direction as the forward and backward directions of the hands 151 (arrows ± r directions in FIGS. 12A and 12B).

  The gas discharge nozzle 161 includes a direction maintaining mechanism 166 that always keeps the direction of the gas discharge nozzle 161 in the advancing / retreating direction (the arrow + r direction in FIGS. 6A and 6B), regardless of the degree of bending or extension of the joint structure of the handling arm 155. It is connected to the tip side arm of the nozzle moving arm 165 through the intermediary.

  In addition, the gas discharge movable arm 160 moves the gas discharge nozzle 161 to a higher position than the respective hands 151 of the first and second work transfer movable arms 150-1 and 150-2 (FIGS. 12A and 12B). (A position in the z-axis direction) at all times. For example, the height position of the horizontal plane on which the board surface on one side of the gas discharge nozzle 161 in which the gas ejection holes 164 are formed linearly advances and retreats is determined by the semiconductor work in the upper second work transfer movable arm 150-2. As shown in FIG. 12B, the predetermined amount h is at least larger than the height (substrate thickness) of the semiconductor work 200 as shown in FIG. It is configured to be higher by the minute. This allows the gas discharge nozzle 161 to move in the forward and backward movement directions when the hand 151 of the first work transfer movable arm 150-1 and the hand 151 of the second work transfer movable arm 150-1 overlap. Can be selectively positioned so as to overlap or not overlap with the hands 151 of both the first and second work transfer movable arms 150 (150-1 and 150-2). When the hand 151 of the first work transfer movable arm 150-1 and the hand 151 of the second work transfer movable arm 150-2 do not overlap, either one of the work transfer movable arm 150-1 Can be selectively positioned so as to overlap each other.

  Next, the operation of the semiconductor work transfer apparatus 100 of the present embodiment including the work transfer robot 110 having the above-described configuration will be described by taking as an example a case where the semiconductor work 200 is continuously loaded and unloaded.

  The work transfer robot 110 transfers the first semiconductor work 200 to the processing apparatus 400 and then transfers the second semiconductor work 200 to the work storage container 300 while the first semiconductor work 200 is being processed by the processing apparatus 400. And transported to the pre-alignment unit 120. To transfer the second semiconductor work 200 from the work storage container 300 to the pre-alignment unit 120, one of the first and second work transfer movable arms 150 (150-1, 2) is used. The work transfer movable arm 150 can be used. Preferably, when the processed semiconductor work 200 is transferred from the processing apparatus 400 to the work storage container 300 to be described later, the second work transfer arm 150 is mounted on the work transfer movable arm 150 on which the processed semiconductor work 200 is mounted. The use of the movable arm 150-2 can omit the adjustment of the height position of the work transfer movable arm.

  During the transfer from the work storage container 300 to the pre-alignment unit 120, the gas discharge nozzle 161 is positioned so as to overlap the hand 151 of the one work transfer movable arm 150, so that the gas of the gas discharge movable arm 160 is moved. The discharge nozzle 161 follows the hand 151 of the one work transfer movable arm 150. Accordingly, the space between the gas discharge nozzle 161 and the substrate surface of the second semiconductor workpiece 200 on the processing target side during the transfer is filled with the inert gas ejected from the gas discharge nozzle 161.

  During alignment of the second semiconductor work 200 by the pre-alignment unit 120, the gas discharge movable arm 160 is overlaid on the second semiconductor work 200 whose gas emission nozzle 161 is being aligned. As a result, even during the alignment of the second semiconductor work 200, the space between the substrate surface on the processing side of the second semiconductor work 200 and the gas discharge nozzle 161 does not blow out from the gas discharge nozzle 161. Filled with active gas.

  After the pre-alignment unit 120 completes the positioning operation of the second semiconductor work 200, the first and second work transfer movable arms 150 (150-1, 2), preferably the second work transfer The second semiconductor work 200 is taken out of the pre-alignment unit 120 by using the first hand 151 of the first work transfer movable arm 150-1 whose height is lower than the movable arm 150-2. It is transported to the processing device 400.

  During the transfer from the work storage container 300 to the processing apparatus 400, the gas discharge nozzle 161 is positioned so as to overlap with the hand 151 of the one work transfer movable arm 150, thereby releasing the gas from the gas discharge movable arm 160. The nozzle 161 follows the hand 151 of the first work transfer movable arm 150-1.

  Accordingly, the space between the gas discharge nozzle 161 and the substrate surface of the second semiconductor workpiece 200 on the processing target side during the transfer is filled with the inert gas ejected from the gas discharge nozzle 161. In this case, in the space between the substrate surface of the second semiconductor work 200 on the processing target side and the gas discharge nozzle 161, the mounting of the semiconductor work 200 is performed by the upper second work transfer movable arm 150-2. This also includes the height position of the horizontal plane on which the surface hand 151 moves linearly.

  Then, the second semiconductor workpiece 200 is preferably moved to the apparatus-side workpiece transport port 104, and then the height position of the second workpiece transport movable arm 150-2 in the advance / retreat movement direction of the hand 151 is set as follows. With the hand 151 of the first and second movable workpiece transfer arms 150 oriented in the loading direction of the processing apparatus 400, the first position is adjusted to the half play / unloading height position with respect to the processing apparatus transfer point 410 of the processing apparatus 400. In a state of being mounted on the hand 151 of the work transfer movable arm 150-1.

  As a result, even during this standby period, the space between the substrate surface of the second semiconductor work 200 on the processing target side and the gas discharge nozzle 161 is filled with the inert gas ejected from the gas discharge nozzle 161. I have.

  After the processing of the first semiconductor work 200 by the processing apparatus 105 is completed, the first semiconductor work 200 is transferred from the processing apparatus transfer point 410 of the processing apparatus 105 to the hand 151 by the second semiconductor work 200. Using the second work transfer movable arm 150-2 which is higher than the first transfer movable arm 150-1 mounted thereon, the first semiconductor work which has been processed in the hand. The first work transfer arm 410-1 is mounted on the first work transfer arm 150-1, and the height of the first work transfer movable arm 150-1 in the direction of movement of the hand 151 is processed. The first workpiece transfer movable arm 150-1 is gripped by the first hand 151 in accordance with the half play / unloading height position of the apparatus 400 with respect to the processing apparatus transfer point 410. It is, for accommodating the second sheet of the semiconductor workpiece has been finished alignment by the pre-alignment unit 120 to the processing unit conveying point 410 of the processing unit 400.

  As a result, the first semiconductor work 200 unloaded from the processing apparatus transfer point 410 of the processing apparatus 400 to the work transfer space 101 is processed by the second semiconductor work 200 filled with the inert gas. The first semiconductor work 200 taken out into the space between the substrate surface on the side and the gas discharge nozzle 161 and the substrate surface on the processing target side of the first semiconductor work 200 taken out does not newly eject from the gas discharge nozzle 161. The active gas can be sprayed. In addition, an inert gas ejected from the gas discharge nozzle 161 is applied to the substrate surface on the processing target side of the second semiconductor work 200 until the carry-out of the first semiconductor work 200 to the work transfer space 101 is completed. Even after the unloading of the first semiconductor work 200 into the work transfer space 101 is completed, the substrate surface of the second semiconductor work 200 on the processing target side and the first semiconductor work 200 can be sprayed. The space between the second semiconductor work 200 and the second semiconductor work 200 is filled with the inert gas from the time when the second semiconductor work 200 is taken out of the pre-alignment unit 120 from the gas discharge nozzle 161. Therefore, the substrate surface of the processing target side of the second semiconductor work 200 is also moved from the work transfer space 101 to the processing equipment of the processing apparatus 400. Until loading into the conveying point 410 is completed, it can be prevented atmospheric exposure.

  After that, the processed first semiconductor work 200 held by the second hand 151 of the second work transfer movable arm 150-2 is stored in the storage container 102. During transfer from the processing apparatus 400 to the work storage container 300, the gas discharge nozzle 161 is positioned so as to overlap the hand 151 of the second work transfer movable arm 150-2 so that the gas discharge movable arm 160 The gas discharge nozzle 161 follows the hand 151 of the second work transfer movable arm 150-2. Accordingly, the space between the gas discharge nozzle 161 and the substrate surface of the first semiconductor work 200 on the processing target side during the transfer is filled with the inert gas ejected from the gas discharge nozzle 161.

  Similarly, by performing the same operation on the third and subsequent semiconductor workpieces 200 as in the case of the second semiconductor workpiece 200 and the first semiconductor workpiece 200, continuous operation in a low humidity environment is performed. The transported work and the unloading operation can be performed.

  Therefore, in the semiconductor workpiece transfer apparatus 100 of the present embodiment, when the loading / unloading of the semiconductor workpiece 200 is continuously performed, the second semiconductor workpiece 200 is processed by the processing apparatus 400 while the second workpiece 200 is being processed. Since the transfer preparation to the processing apparatus 400 can be performed without exposing the substrate surface of the semiconductor work 200 on the processing target side to the atmosphere, the transfer time of the semiconductor work 200 can be reduced. In addition, while the first processed semiconductor work 200 is unloaded from the processing apparatus 400 and the second unprocessed semiconductor work 200 is transferred into the processing apparatus 400 instead, the first and second semiconductor works 200 are also processed. Since the substrate surface side on the processing target side of each of the semiconductor works 200 is filled with the inert gas, the substrate surface is not exposed to the atmosphere.

  In both of the above-described embodiments, the start and stop of the ejection of the inert gas are performed by the controller unit 130 depending on whether the control valve 169 of the gas supply line 168 is open or closed. The flow rate of the inert gas ejected from the gas discharge nozzle 161 at the time can be controlled by the controller unit 130 in accordance with the state of transport of the semiconductor work 200 between the storage container and the processing apparatus.

  Specifically, when the work transfer movable arm 150 holding the semiconductor work 200 with the hand 151 moves in the work transfer space 101, the controller unit 130 is configured to move the semiconductor work 200 being transferred to the substrate surface side on the processing target side. In order to maintain the low humidity environment, the control valve 169 is fully opened to eject the inert gas. On the other hand, when the semiconductor work 200 is not moving in the work transfer space 101, such as during standby or during the alignment operation in the pre-alignment unit 120, the controller unit 130 determines the flow rate of the inert gas ejected from the gas discharge nozzle 161. Is controlled to a flow rate (for example, a flow rate of 50%) where the valve opening degree of the control valve 169 is appropriately reduced from the fully opened state. That is, the flow rate of the inert gas ejected from the gas discharge nozzle 161 is adjusted according to the moving speed of the work transfer movable arm 150 holding the semiconductor work 200 in the work transfer space 101.

  Further, even when the same semiconductor work 200 is being transferred, for example, when the work transfer movable arm 150 includes the first and second work transfer movable arms 150-1 and 150-2, the gas discharge The space between the gas discharge nozzle 161 of the movable arm 160 and the semiconductor work 200 mounted on the hand 151 is smaller than that of the first work transport movable arm 150-1. When the semiconductor work 200 is gripped and transported by the hand 151 of the first workpiece transfer nozzle 1501, the flow rate of the inert gas ejected from the gas discharge nozzle 161 is supplied to the hand 151 of the movable arm 150-1 for transporting the first workpiece. Is controlled to a flow rate which is appropriately reduced as compared with the case where the sheet is gripped and transported. That is, the flow rate of the inert gas ejected from the gas discharge nozzle 161 is adjusted according to the amount of space or the distance between the gas discharge nozzle 161 of the gas discharge movable arm 160 and the semiconductor work 200 mounted on the hand 151.

  In addition, when the semiconductor work 200 is loaded into and unloaded from the work storage container 300 or the processing apparatus 400, when the semiconductor work 200 is loaded, the semiconductor work 200 is mounted on the gas discharge nozzle 161 and the hand 151 of the gas discharge movable arm 160 by then. Since the space between the semiconductor work 200 and the semiconductor work 200 is filled with the inert gas, the flow rate is controlled to be appropriately reduced as compared with the time of carrying out. That is, the flow rate of the inert gas ejected from the gas discharge nozzle 161 is adjusted according to the difference in the transport process.

  As described above, without being limited to the specific example described above, by controlling the flow rate of the inert gas discharged from the gas discharge nozzle 161 according to the operation state of the transfer robot 106, the amount of the inert gas used can be further increased. Can be reduced.

  Note that the present invention is not limited to the above-described embodiment, and includes various modifications. For example, the above-described embodiments have been described in detail in order to explain the present invention in an easy-to-understand manner, and are not necessarily limited to those having all the described configurations.

  For example, regarding the configuration of the work transfer robot 110, in the above-described embodiment, the work transfer movable arm 150 and the gas discharge movable arm 160 are provided on a common mounting base that can be turned, moved up and down, and run. If the gas discharge nozzle 161 of the movable gas discharge arm 160 is held beforehand on the semiconductor work 200 mounted on the hand 151 of the movable work transfer arm 150 before transfer, the transfer in the work transfer space 101 can be performed. The semiconductor work in which the gas discharge nozzle 161 of the gas discharge movable arm 160 is mounted on the hand 151 of the work transfer movable arm 150 without the need to move the gas discharge movable arm 160 independently of the work transfer movable arm 150. 200 was adopted, but a movable arm 150 for work transfer and a gas discharge The arm 160 is provided with independent turning, lifting and lowering and traveling mechanisms so that the gas discharge nozzle 161 of the gas discharge movable arm 160 follows the semiconductor work 200 mounted on the hand 151 of the work transfer movable arm 150. It is also possible to adopt a configuration that moves independently.

  In addition, a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of one embodiment can be added to the configuration of another embodiment. Further, for a part of the configuration of each embodiment, it is possible to add, delete, or replace another configuration.

100 semiconductor work transfer device,
101 Work transfer space,
102 partition wall,
103 Container side work transfer port,
104 Device side work transfer port,
110 work transfer robot,
120 pre-alignment unit,
121 alignment mechanism,
122 Work mounting surface,
123 sensors,
130 controller unit,
140 containment opening and closing device,
150 Work transfer movable arm,
151 hands,
152 mounting part,
155 handling arm,
156 direction maintaining mechanism,
160 movable arm for gas release,
161 gas discharge nozzle,
162 disk-shaped ejection part,
163 connection,
164 gas vents,
165 nozzle moving arm,
166 direction maintaining mechanism,
167 Sensor interference escape,
168 gas supply path,
169 control valve,
171 arm mounting base,
172 equipment base,
173 arm mounting part,
180 gas release mechanism,
200 semiconductor work,
300 work container,
400 processing equipment,
410 Processing unit transfer point.

Claims (5)

A movable arm for transferring a work for moving a hand for holding a semiconductor work,
On a parallel trajectory separated by a predetermined distance from the movement trajectory of the hand by the work transfer movable arm, a gas discharge movable arm that moves a gas discharge nozzle that discharges an inert gas,
A control valve provided in a gas supply path to the gas discharge nozzle, for supplying / cutting off an inert gas to the gas discharge nozzle,
With
The control valve supplies an inert gas to the gas discharge nozzle when the work transfer movable arm moves the hand while holding the semiconductor work on the hand, and the gas discharge movable arm is Moving the gas discharge nozzle on the parallel trajectory following the movement of the hand,
Semiconductor work transfer device. The semiconductor work transport device according to claim 1,
In a state in which the gas discharge nozzle follows the movement of the hand, the gas discharge nozzle is held in a state where the gas discharge nozzle faces the semiconductor work with the gas discharge hole facing the semiconductor work held by the hand. , Semiconductor work transfer equipment. The semiconductor work transfer device according to claim 1 or 2, wherein:
When the semiconductor work is transferred to the pre-alignment unit, after the transfer of the semiconductor work to the pre-alignment unit is completed, the work transfer movable arm moves the hand not gripping the semiconductor work from the pre-alignment unit. Even in this case, the movable arm for gas release does not cause the gas discharge nozzle to follow the hand, but holds the gas discharge nozzle in a state of facing the semiconductor work remaining in the pre-alignment unit. The semiconductor work transfer device according to any one of claims 1 to 3,
The work transfer movable arm,
A first work transfer movable arm that moves a hand that holds the semiconductor work;
A second work transfer movable arm for moving a hand other than the hand on a parallel trajectory separated by a predetermined distance from a movement trajectory of the hand by the first work transfer movable arm;
A semiconductor work transfer device comprising: The semiconductor work transfer device according to any one of claims 1 to 3,
A flow control controller for controlling the flow rate of the inert gas discharged from the gas discharge nozzle by driving and controlling the control valve in accordance with the state of the work transfer movable arm and / or the gas discharge movable arm. There is a semiconductor work transfer device.

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