JP2019536277A - スマート衣料用テキスタイル電子デバイス - Google Patents

スマート衣料用テキスタイル電子デバイス Download PDF

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Publication number
JP2019536277A
JP2019536277A JP2019524408A JP2019524408A JP2019536277A JP 2019536277 A JP2019536277 A JP 2019536277A JP 2019524408 A JP2019524408 A JP 2019524408A JP 2019524408 A JP2019524408 A JP 2019524408A JP 2019536277 A JP2019536277 A JP 2019536277A
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JP
Japan
Prior art keywords
textile
connection means
electrical connection
electronic circuit
mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019524408A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019536277A5 (enExample
Inventor
ゴウテズ,マリオン
フロウイン,マーク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bioserenity SAS
Original Assignee
Bioserenity SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bioserenity SAS filed Critical Bioserenity SAS
Publication of JP2019536277A publication Critical patent/JP2019536277A/ja
Publication of JP2019536277A5 publication Critical patent/JP2019536277A5/ja
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/038Textiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/40Layered products comprising a layer of synthetic resin comprising polyurethanes
    • DTEXTILES; PAPER
    • D02YARNS; MECHANICAL FINISHING OF YARNS OR ROPES; WARPING OR BEAMING
    • D02GCRIMPING OR CURLING FIBRES, FILAMENTS, THREADS, OR YARNS; YARNS OR THREADS
    • D02G3/00Yarns or threads, e.g. fancy yarns; Processes or apparatus for the production thereof, not otherwise provided for
    • D02G3/44Yarns or threads characterised by the purpose for which they are designed
    • D02G3/441Yarns or threads with antistatic, conductive or radiation-shielding properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/6205Two-part coupling devices held in engagement by a magnet
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/77Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/78Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to other flexible printed circuits, flat or ribbon cables or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08Magnetic details
    • H05K2201/083Magnetic materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754Connector integrally incorporated in the printed circuit board [PCB] or in housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10401Eyelets, i.e. rings inserted into a hole through a circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1316Moulded encapsulation of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Professional, Industrial, Or Sporting Protective Garments (AREA)
JP2019524408A 2016-11-10 2017-11-10 スマート衣料用テキスタイル電子デバイス Pending JP2019536277A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
FR1660936 2016-11-10
FR1660936A FR3058610B1 (fr) 2016-11-10 2016-11-10 Dispositif electronique textile pour vetements intelligents
TW106139076 2017-11-09
TW106139076A TW201825012A (zh) 2016-11-10 2017-11-09 用於智慧服裝的紡織品電子設備
PCT/FR2017/053072 WO2018087489A1 (fr) 2016-11-10 2017-11-10 Dispositif électronique textile pour vêtements intelligents

Publications (2)

Publication Number Publication Date
JP2019536277A true JP2019536277A (ja) 2019-12-12
JP2019536277A5 JP2019536277A5 (enExample) 2020-11-12

Family

ID=57590693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019524408A Pending JP2019536277A (ja) 2016-11-10 2017-11-10 スマート衣料用テキスタイル電子デバイス

Country Status (7)

Country Link
US (1) US10905006B2 (enExample)
EP (1) EP3539363A1 (enExample)
JP (1) JP2019536277A (enExample)
CN (1) CN110115114A (enExample)
FR (1) FR3058610B1 (enExample)
TW (1) TW201825012A (enExample)
WO (1) WO2018087489A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7555053B2 (ja) * 2019-04-18 2024-09-24 パナソニックIpマネジメント株式会社 伸縮性デバイス
FR3096865B1 (fr) 2019-06-03 2021-06-04 Inst Mines Telecom Système électronique à monter sur un support souple, notamment textile
CA3165237A1 (en) * 2019-12-18 2021-06-24 Myant Inc. Method of manufacturing textile with conductive yarns and integrated electronics
JP7457498B2 (ja) * 2019-12-25 2024-03-28 ミャント インコーポレイテッド 電気コネクタ
US20210307170A1 (en) * 2020-03-30 2021-09-30 Sanctuary Cognitive Systems Corporation Sensory array for use with artificial skin and artificial skin with sensory array, useful in robotics
TWI732585B (zh) 2020-06-05 2021-07-01 三芳化學工業股份有限公司 導電薄膜及其製造方法
US11589459B2 (en) * 2020-12-23 2023-02-21 Nextiles, Inc. Connectors for integrating conductive threads to non-compatible electromechanical devices

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004513247A (ja) * 2000-10-16 2004-04-30 フォスター−ミラー・インク 電子回路を備えるように布地製品を製造するための方法および電気的に活性な繊維製品

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Publication number Priority date Publication date Assignee Title
JPH03260177A (ja) * 1990-03-02 1991-11-20 Toray Ind Inc 耐熱・耐薬品性に優れた繊維シート状物
GB9608847D0 (en) * 1996-04-30 1996-07-03 Pressac Ltd Method of mounting circuit components on a flexible substrate
US7462035B2 (en) * 2005-07-27 2008-12-09 Physical Optics Corporation Electrical connector configured as a fastening element
GB0606005D0 (en) * 2006-03-27 2006-05-03 Leftly Steven A Security device for textile products
DE102009005706A1 (de) 2009-01-22 2010-07-29 Winker Massivumformung Gmbh & Co. Kg Verfahren zum Herstellen von Rohlingen aus einem draht- oder stangenförmigen Halbzeug sowie Umformmaschine
DE202009005706U1 (de) * 2009-04-16 2009-07-30 Herrmann, Dieter, Dipl.-Ing. Verbindung und Kontaktierung von elektrisch leitfähigen Textilien
US9338915B1 (en) * 2013-12-09 2016-05-10 Flextronics Ap, Llc Method of attaching electronic module on fabrics by stitching plated through holes
CN105163491B (zh) * 2015-09-17 2018-03-06 北京代尔夫特电子科技有限公司 一种可穿戴电子设备的封装方法
CN107851932A (zh) * 2015-11-04 2018-03-27 谷歌有限责任公司 用于将嵌入在服装中的电子器件连接至外部装置的连接器
US11622722B2 (en) * 2016-03-09 2023-04-11 Peerbridge Health, Inc. System and method for monitoring conditions of a subject based on wireless sensor data
WO2017200949A1 (en) * 2016-05-16 2017-11-23 Google Llc Interactive fabric

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004513247A (ja) * 2000-10-16 2004-04-30 フォスター−ミラー・インク 電子回路を備えるように布地製品を製造するための方法および電気的に活性な繊維製品

Also Published As

Publication number Publication date
US10905006B2 (en) 2021-01-26
US20190373724A1 (en) 2019-12-05
FR3058610B1 (fr) 2018-11-16
WO2018087489A1 (fr) 2018-05-17
EP3539363A1 (fr) 2019-09-18
CN110115114A (zh) 2019-08-09
FR3058610A1 (fr) 2018-05-11
TW201825012A (zh) 2018-07-16

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