TW201825012A - 用於智慧服裝的紡織品電子設備 - Google Patents

用於智慧服裝的紡織品電子設備 Download PDF

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Publication number
TW201825012A
TW201825012A TW106139076A TW106139076A TW201825012A TW 201825012 A TW201825012 A TW 201825012A TW 106139076 A TW106139076 A TW 106139076A TW 106139076 A TW106139076 A TW 106139076A TW 201825012 A TW201825012 A TW 201825012A
Authority
TW
Taiwan
Prior art keywords
textile
electrical connection
connection device
electronic circuit
mechanical
Prior art date
Application number
TW106139076A
Other languages
English (en)
Chinese (zh)
Inventor
馬可 弗洛因
馬瑞昂 構利茲
Original Assignee
法商百歐瑟瑞納提公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 法商百歐瑟瑞納提公司 filed Critical 法商百歐瑟瑞納提公司
Priority to JP2019524408A priority Critical patent/JP2019536277A/ja
Priority to EP17808546.0A priority patent/EP3539363A1/fr
Priority to US16/348,595 priority patent/US10905006B2/en
Priority to PCT/FR2017/053072 priority patent/WO2018087489A1/fr
Publication of TW201825012A publication Critical patent/TW201825012A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • D—TEXTILES; PAPER
    • D02—YARNS; MECHANICAL FINISHING OF YARNS OR ROPES; WARPING OR BEAMING
    • D02G—CRIMPING OR CURLING FIBRES, FILAMENTS, THREADS, OR YARNS; YARNS OR THREADS
    • D02G3/00—Yarns or threads, e.g. fancy yarns; Processes or apparatus for the production thereof, not otherwise provided for
    • D02G3/44—Yarns or threads characterised by the purpose for which they are designed
    • D02G3/441—Yarns or threads with antistatic, conductive or radiation-shielding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/6205—Two-part coupling devices held in engagement by a magnet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/78—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to other flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754—Connector integrally incorporated in the printed circuit board [PCB] or in housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Professional, Industrial, Or Sporting Protective Garments (AREA)
TW106139076A 2016-11-10 2017-11-09 用於智慧服裝的紡織品電子設備 TW201825012A (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019524408A JP2019536277A (ja) 2016-11-10 2017-11-10 スマート衣料用テキスタイル電子デバイス
EP17808546.0A EP3539363A1 (fr) 2016-11-10 2017-11-10 Dispositif électronique textile pour vêtements intelligents
US16/348,595 US10905006B2 (en) 2016-11-10 2017-11-10 Textile electronic device for smart clothing
PCT/FR2017/053072 WO2018087489A1 (fr) 2016-11-10 2017-11-10 Dispositif électronique textile pour vêtements intelligents

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1660936A FR3058610B1 (fr) 2016-11-10 2016-11-10 Dispositif electronique textile pour vetements intelligents
??1660936 2016-11-10

Publications (1)

Publication Number Publication Date
TW201825012A true TW201825012A (zh) 2018-07-16

Family

ID=57590693

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106139076A TW201825012A (zh) 2016-11-10 2017-11-09 用於智慧服裝的紡織品電子設備

Country Status (7)

Country Link
US (1) US10905006B2 (enExample)
EP (1) EP3539363A1 (enExample)
JP (1) JP2019536277A (enExample)
CN (1) CN110115114A (enExample)
FR (1) FR3058610B1 (enExample)
TW (1) TW201825012A (enExample)
WO (1) WO2018087489A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732585B (zh) * 2020-06-05 2021-07-01 三芳化學工業股份有限公司 導電薄膜及其製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7555053B2 (ja) * 2019-04-18 2024-09-24 パナソニックＩｐマネジメント株式会社 伸縮性デバイス
FR3096865B1 (fr) 2019-06-03 2021-06-04 Inst Mines Telecom Système électronique à monter sur un support souple, notamment textile
CA3165237A1 (en) * 2019-12-18 2021-06-24 Myant Inc. Method of manufacturing textile with conductive yarns and integrated electronics
JP7457498B2 (ja) * 2019-12-25 2024-03-28 ミャント インコーポレイテッド 電気コネクタ
US20210307170A1 (en) * 2020-03-30 2021-09-30 Sanctuary Cognitive Systems Corporation Sensory array for use with artificial skin and artificial skin with sensory array, useful in robotics
US11589459B2 (en) * 2020-12-23 2023-02-21 Nextiles, Inc. Connectors for integrating conductive threads to non-compatible electromechanical devices

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JPH03260177A (ja) * 1990-03-02 1991-11-20 Toray Ind Inc 耐熱・耐薬品性に優れた繊維シート状物
GB9608847D0 (en) * 1996-04-30 1996-07-03 Pressac Ltd Method of mounting circuit components on a flexible substrate
EP1335831B1 (en) * 2000-10-16 2011-01-05 Foster-Miller, Inc. Methods of manufacturing a fabric article including electronic circuitry and fabric articles
US7462035B2 (en) * 2005-07-27 2008-12-09 Physical Optics Corporation Electrical connector configured as a fastening element
GB0606005D0 (en) * 2006-03-27 2006-05-03 Leftly Steven A Security device for textile products
DE102009005706A1 (de) 2009-01-22 2010-07-29 Winker Massivumformung Gmbh & Co. Kg Verfahren zum Herstellen von Rohlingen aus einem draht- oder stangenförmigen Halbzeug sowie Umformmaschine
DE202009005706U1 (de) * 2009-04-16 2009-07-30 Herrmann, Dieter, Dipl.-Ing. Verbindung und Kontaktierung von elektrisch leitfähigen Textilien
US9338915B1 (en) * 2013-12-09 2016-05-10 Flextronics Ap, Llc Method of attaching electronic module on fabrics by stitching plated through holes
CN105163491B (zh) * 2015-09-17 2018-03-06 北京代尔夫特电子科技有限公司 一种可穿戴电子设备的封装方法
CN107851932A (zh) * 2015-11-04 2018-03-27 谷歌有限责任公司 用于将嵌入在服装中的电子器件连接至外部装置的连接器
US11622722B2 (en) * 2016-03-09 2023-04-11 Peerbridge Health, Inc. System and method for monitoring conditions of a subject based on wireless sensor data
WO2017200949A1 (en) * 2016-05-16 2017-11-23 Google Llc Interactive fabric

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI732585B (zh) * 2020-06-05 2021-07-01 三芳化學工業股份有限公司 導電薄膜及其製造方法
US11991823B2 (en) 2020-06-05 2024-05-21 San Fang Chemical Industry Co., Ltd. Conductive film and manufacturing method thereof

Also Published As

Publication number Publication date
US10905006B2 (en) 2021-01-26
US20190373724A1 (en) 2019-12-05
JP2019536277A (ja) 2019-12-12
FR3058610B1 (fr) 2018-11-16
WO2018087489A1 (fr) 2018-05-17
EP3539363A1 (fr) 2019-09-18
CN110115114A (zh) 2019-08-09
FR3058610A1 (fr) 2018-05-11

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