JP2019528581A - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP2019528581A JP2019528581A JP2019532906A JP2019532906A JP2019528581A JP 2019528581 A JP2019528581 A JP 2019528581A JP 2019532906 A JP2019532906 A JP 2019532906A JP 2019532906 A JP2019532906 A JP 2019532906A JP 2019528581 A JP2019528581 A JP 2019528581A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (8)
- 基板処理装置であって、
チャンバー内に設けられ、かつ、旋回運動を行うように構成された第1の円盤であって、前記第1の円盤は、中心軸から特定の半径内に周期的に配列された複数の着座穴を備える、第1の円盤と、
それぞれ前記着座穴内に設けられ、かつ、前記第1の円盤の旋回運動に従って回旋および回転運動を行うように構成された複数の第2の円盤と、
前記第2の円盤の回転運動および前記第2の円盤への電気接続を可能にするように前記第2の円盤と前記着座穴との間に設けられた第1の回転式接続子構造と、
前記第2の円盤上に設けられ、かつ、前記第1の回転式接続子構造を通じて供給される電力を用いて基板を保持するように構成された静電チャックと、
前記第2の円盤に固定され、かつ、前記第2の円盤にトルクをかけるように構成された第1の磁気歯車と、
前記第1の磁気歯車と相互作用するが、旋回することを妨げられるように前記チャンバー内に設けられた第2の磁気歯車と、
を備える、基板処理装置。 - 前記第1の磁気歯車は、
前記第2の円盤と固定して連結された回転磁石支持板であって、前記回転磁石支持板は円形の円盤形状を有する、回転磁石支持板と、
交流磁化方向を有するように前記回転磁石支持板の周囲表面上に配列され、かつ、特定の距離だけ互いから離間された複数の第1の永久磁石と、
を備え、
前記第2の磁気歯車は、
前記チャンバーの底部表面と前記第1の円盤との間に設けられた固定磁石支持板であって、前記固定磁石支持板はワッシャーまたはドーナツ形状を有する、固定磁石支持板と、
交流磁化方向を有するように前記固定磁石支持板の周囲表面上に配列された複数の第2の永久磁石と、
を備え、
前記第1の永久磁石および前記第2の永久磁石は、前記第2の円盤の回転状態に応じて前記第2の円盤に引力または斥力をかけ、それにより前記第2の円盤を旋回させるように構成される、請求項1に記載の基板処理装置。 - 前記静電チャックは、
静電チャック本体と、
凹形状を有するように前記静電チャック本体の頂部表面内に形成された電極着座部分と、
前記電極着座部分を充填する絶縁部材と、
前記絶縁部材内に埋め込まれた一対の静電電極と、
を備える、請求項1に記載の基板処理装置。 - 前記一対の静電電極のそれぞれは、半円形形状または同心円状のワッシャー形状を有する、請求項3に記載の基板処理装置。
- 前記第1の円盤の中心軸から垂直に延在する第1の円盤中心軸と、
前記第1の円盤中心軸を包囲し、かつ、隔絶された状態で前記第1の円盤中心軸を密閉して封止するように設けられた蛇腹構造であって、前記蛇腹構造は、前記チャンバーの底部表面から前記チャンバーの外側まで延在する、蛇腹構造と、
前記蛇腹構造を通過し、かつ、前記第1の円盤中心軸の端部と軸連結されるように設けられた第2の回転式接続子構造であって、前記第2の回転式接続子構造は、前記第1の円盤中心軸の回転運動および前記第1の円盤中心軸への電気接続を可能にするように構成される、第2の回転式接続子構造と、
前記第1の円盤中心軸を回転させるように構成された回転駆動ユニットと、
のうち少なくとも1つをさらに備える、請求項1に記載の基板処理装置。 - 全くの垂直方向に前記第2の磁気歯車を移動させるように構成され、かつ、前記第1の磁気歯車の配列平面を前記第2の磁気歯車のそれと一致することを可能にするために用いられる磁気歯車垂直移動ユニットをさらに含み、
前記磁気歯車垂直移動ユニットは、
前記チャンバーの外側に配置され、かつ、直線運動を行うように構成された磁気歯車垂直駆動ユニットと、
前記磁気歯車垂直駆動ユニットを前記第2の磁気歯車に接続する接続棒と、
を備える、請求項1に記載の基板処理装置。 - 前記第1の回転式接続子構造は、
垂直方向に互いから離間された上部軸受けおよび下部軸受けと、
前記上部軸受けと前記下部軸受けとの間に設けられた集電環本体と、
前記集電環本体の外周囲表面上に配列された複数の集電環と、
前記集電環に電気的に接続されたブラシと、
を備える、請求項1に記載の基板処理装置。 - 前記静電チャックは、
静電チャック本体と、
前記静電チャック本体の頂部表面上に設けられた絶縁部材であって、前記絶縁部材はワッシャーまたはドーナツ形状を有する、絶縁部材と、
前記絶縁部材の頂部表面上に設けられた静電電極であって、前記静電電極はパターン化された形状を有する、静電電極と、
を備える、請求項1に記載の基板処理装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2016-0110879 | 2016-08-30 | ||
KR1020160110879A KR102669903B1 (ko) | 2016-08-30 | 2016-08-30 | 기판 처리 장치 |
PCT/KR2017/009107 WO2018043976A1 (en) | 2016-08-30 | 2017-08-22 | Substrate processing apparatus |
Publications (2)
Publication Number | Publication Date |
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JP2019528581A true JP2019528581A (ja) | 2019-10-10 |
JP7055806B2 JP7055806B2 (ja) | 2022-04-18 |
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JP2019532906A Active JP7055806B2 (ja) | 2016-08-30 | 2017-08-22 | 基板処理装置 |
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US (1) | US11361984B2 (ja) |
JP (1) | JP7055806B2 (ja) |
KR (1) | KR102669903B1 (ja) |
CN (1) | CN109643641B (ja) |
TW (1) | TWI716632B (ja) |
WO (1) | WO2018043976A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102408889B1 (ko) * | 2017-06-16 | 2022-06-14 | 주성엔지니어링(주) | 기판 처리 장치 |
JP7209598B2 (ja) * | 2019-07-26 | 2023-01-20 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
CN112701075B (zh) * | 2021-03-24 | 2021-06-04 | 上海隐冠半导体技术有限公司 | 一种微动台、交接方法及运动设备 |
Citations (4)
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JP2003133233A (ja) * | 2001-10-23 | 2003-05-09 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2003347228A (ja) * | 2002-05-30 | 2003-12-05 | Renesas Technology Corp | 半導体装置の製造方法および熱処理装置 |
JP2013044047A (ja) * | 2011-08-26 | 2013-03-04 | Kobe Steel Ltd | 真空成膜装置 |
JP2016096220A (ja) * | 2014-11-13 | 2016-05-26 | 東京エレクトロン株式会社 | 成膜装置 |
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KR20120065841A (ko) * | 2010-12-13 | 2012-06-21 | 삼성전자주식회사 | 기판 지지 유닛과, 이를 이용한 박막 증착 장치 |
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-
2016
- 2016-08-30 KR KR1020160110879A patent/KR102669903B1/ko active IP Right Grant
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2017
- 2017-08-22 CN CN201780052825.XA patent/CN109643641B/zh active Active
- 2017-08-22 WO PCT/KR2017/009107 patent/WO2018043976A1/en active Application Filing
- 2017-08-22 US US16/328,273 patent/US11361984B2/en active Active
- 2017-08-22 JP JP2019532906A patent/JP7055806B2/ja active Active
- 2017-08-30 TW TW106129475A patent/TWI716632B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003133233A (ja) * | 2001-10-23 | 2003-05-09 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2003347228A (ja) * | 2002-05-30 | 2003-12-05 | Renesas Technology Corp | 半導体装置の製造方法および熱処理装置 |
JP2013044047A (ja) * | 2011-08-26 | 2013-03-04 | Kobe Steel Ltd | 真空成膜装置 |
JP2016096220A (ja) * | 2014-11-13 | 2016-05-26 | 東京エレクトロン株式会社 | 成膜装置 |
Also Published As
Publication number | Publication date |
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TWI716632B (zh) | 2021-01-21 |
KR20180024520A (ko) | 2018-03-08 |
US11361984B2 (en) | 2022-06-14 |
JP7055806B2 (ja) | 2022-04-18 |
CN109643641A (zh) | 2019-04-16 |
US20200335387A1 (en) | 2020-10-22 |
KR102669903B1 (ko) | 2024-05-28 |
TW201807740A (zh) | 2018-03-01 |
CN109643641B (zh) | 2023-06-23 |
WO2018043976A1 (en) | 2018-03-08 |
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