US3807493A
(en)
*
|
1971-09-28 |
1974-04-30 |
Kooltronic Fan Co |
Heat exchanger using u-tube heat pipes
|
US5333677A
(en)
*
|
1974-04-02 |
1994-08-02 |
Stephen Molivadas |
Evacuated two-phase head-transfer systems
|
US4216903A
(en)
*
|
1977-03-07 |
1980-08-12 |
Giuffre Anthony A |
Heat exchange system for recycling stack heat
|
US4314601A
(en)
*
|
1978-10-04 |
1982-02-09 |
Giuffre Anthony A |
Heat exchange system for recycling waste heat
|
US4476922A
(en)
|
1981-10-26 |
1984-10-16 |
Heilig Jr Glenn M |
Forced bilateral thermosiphon loop
|
EP0129257B1
(en)
*
|
1983-06-21 |
1996-11-06 |
Babcock-Hitachi Kabushiki Kaisha |
Heat exchanger
|
US5339893A
(en)
*
|
1992-05-08 |
1994-08-23 |
The United States Of America As Represented By The Secretary Of The Army |
Apparatus for containing toxic spills employing hybrid thermosyphons
|
US5921315A
(en)
|
1995-06-07 |
1999-07-13 |
Heat Pipe Technology, Inc. |
Three-dimensional heat pipe
|
US6119767A
(en)
*
|
1996-01-29 |
2000-09-19 |
Denso Corporation |
Cooling apparatus using boiling and condensing refrigerant
|
US6205803B1
(en)
|
1996-04-26 |
2001-03-27 |
Mainstream Engineering Corporation |
Compact avionics-pod-cooling unit thermal control method and apparatus
|
JPH10238972A
(ja)
|
1997-02-24 |
1998-09-11 |
Hitachi Ltd |
熱伝達装置
|
US6131647A
(en)
*
|
1997-09-04 |
2000-10-17 |
Denso Corporation |
Cooling system for cooling hot object in container
|
US6578629B1
(en)
|
1998-01-20 |
2003-06-17 |
Richard W. Trent |
Application of heat pipe science to heating, refrigeration and air conditioning systems
|
US6220337B1
(en)
*
|
1998-04-27 |
2001-04-24 |
Shi-Li Chen |
Heat pipe circuit type thermal battery
|
JP2000046423A
(ja)
*
|
1998-07-31 |
2000-02-18 |
Mitsubishi Electric Building Techno Service Co Ltd |
自然循環式冷房装置
|
US6591902B1
(en)
|
1998-12-29 |
2003-07-15 |
Richard W. Trent |
Apparatus for applying controllable, multipurpose heat pipes to heating, ventilation, and air conditioning systems
|
US6658874B1
(en)
*
|
1999-04-12 |
2003-12-09 |
Richard W. Trent |
Advanced, energy efficient air conditioning, dehumidification and reheat method and apparatus
|
US6519955B2
(en)
|
2000-04-04 |
2003-02-18 |
Thermal Form & Function |
Pumped liquid cooling system using a phase change refrigerant
|
JP2002013885A
(ja)
|
2000-06-28 |
2002-01-18 |
Twinbird Corp |
冷凍機用サーモサイフォン
|
TW556328B
(en)
*
|
2001-05-11 |
2003-10-01 |
Denso Corp |
Cooling device boiling and condensing refrigerant
|
CA2467692A1
(en)
*
|
2001-07-20 |
2003-02-13 |
Alma Technology Co., Ltd. |
Heat exchanger assembly and heat exchange manifold
|
US7093647B2
(en)
*
|
2001-12-27 |
2006-08-22 |
Showa Denko K.K. |
Ebullition cooling device for heat generating component
|
US6817097B2
(en)
*
|
2002-03-25 |
2004-11-16 |
Thermal Corp. |
Flat plate fuel cell cooler
|
US6550530B1
(en)
|
2002-04-19 |
2003-04-22 |
Thermal Corp. |
Two phase vacuum pumped loop
|
JP4214881B2
(ja)
*
|
2003-01-21 |
2009-01-28 |
三菱電機株式会社 |
気泡ポンプ型熱輸送機器
|
US7007501B2
(en)
*
|
2003-08-15 |
2006-03-07 |
The Boeing Company |
System, apparatus, and method for passive and active refrigeration of at least one enclosure
|
WO2005057097A2
(en)
|
2003-12-05 |
2005-06-23 |
Liebert Corporation |
Cooling system for high density heat load
|
US6917522B1
(en)
|
2003-12-29 |
2005-07-12 |
Intel Corporation |
Apparatus and method for cooling integrated circuit devices
|
US6988538B2
(en)
|
2004-01-22 |
2006-01-24 |
Hussmann Corporation |
Microchannel condenser assembly
|
US7958935B2
(en)
|
2004-03-31 |
2011-06-14 |
Belits Computer Systems, Inc. |
Low-profile thermosyphon-based cooling system for computers and other electronic devices
|
WO2006072244A1
(en)
*
|
2005-01-03 |
2006-07-13 |
Noise Limit Aps |
A multi-orientational cooling system with a bubble pump
|
WO2007000042A1
(en)
*
|
2005-06-27 |
2007-01-04 |
Fleming Mark A |
Refrigerator or freezer with enhanced efficiency
|
US20070209782A1
(en)
|
2006-03-08 |
2007-09-13 |
Raytheon Company |
System and method for cooling a server-based data center with sub-ambient cooling
|
MX2008012650A
(es)
*
|
2006-04-13 |
2009-01-16 |
Mitsubishi Electric Corp |
Aparato de enfriamiento y convertidor de energia.
|
GB2442743A
(en)
|
2006-10-12 |
2008-04-16 |
Energetix Group Ltd |
A Closed Cycle Heat Transfer Device
|
US7658079B2
(en)
*
|
2006-11-22 |
2010-02-09 |
Bailey Peter F |
Cooling system and method
|
US7832204B2
(en)
*
|
2006-12-18 |
2010-11-16 |
Ford Global Technologies, Llc |
Engine system including heat pipe
|
JP4432979B2
(ja)
*
|
2007-02-08 |
2010-03-17 |
株式会社デンソー |
排気熱回収システム
|
JP5405015B2
(ja)
*
|
2007-12-19 |
2014-02-05 |
ホシザキ電機株式会社 |
冷却装置
|
JP4658174B2
(ja)
|
2008-09-24 |
2011-03-23 |
株式会社日立製作所 |
電子装置
|
HUE029949T2
(en)
*
|
2008-11-03 |
2017-04-28 |
Guangwei Hetong Energy Tech (Beijing) Co Ltd |
With a microcircuit system, its manufacturing process and heat exchange system
|
US20100107658A1
(en)
|
2008-11-04 |
2010-05-06 |
Richard Erwin Cockrell |
Data center cooling device and method
|
US8033322B1
(en)
|
2008-11-07 |
2011-10-11 |
Trent Richard W |
Split heat recovery system
|
US20100204838A1
(en)
|
2009-02-12 |
2010-08-12 |
Liebert Corporation |
Energy efficient air conditioning system and method utilizing variable capacity compressor and sensible heat ratio load matching
|
JP2010190553A
(ja)
*
|
2009-02-20 |
2010-09-02 |
Hitachi Plant Technologies Ltd |
電子機器の冷却システム
|
US7969727B2
(en)
|
2009-04-29 |
2011-06-28 |
Hewlett-Packard Development Company, L.P. |
Cooling
|
US7903404B2
(en)
|
2009-04-29 |
2011-03-08 |
Hewlett-Packard Development Company, L.P. |
Data centers
|
WO2011035943A2
(en)
*
|
2009-09-28 |
2011-03-31 |
Abb Research Ltd |
Cooling module for cooling electronic components
|
US9271429B2
(en)
|
2010-04-12 |
2016-02-23 |
Fujikura Ltd. |
Cooling device, cooling system, and auxiliary cooling device for datacenter
|
US20110259573A1
(en)
*
|
2010-04-26 |
2011-10-27 |
Gac Corporation |
Cooling system
|
JP5351097B2
(ja)
*
|
2010-06-18 |
2013-11-27 |
株式会社日立製作所 |
冷媒循環装置
|
TW201040480A
(en)
|
2010-07-30 |
2010-11-16 |
Asia Vital Components Co Ltd |
Low-pressure circulation type thermosiphon device driven by pressure gradients
|
US9038404B2
(en)
|
2011-04-19 |
2015-05-26 |
Liebert Corporation |
High efficiency cooling system
|
US8773854B2
(en)
|
2011-04-25 |
2014-07-08 |
Google Inc. |
Thermosiphon systems for electronic devices
|
US9179574B2
(en)
|
2011-05-24 |
2015-11-03 |
International Business Machines Corporation |
Cooling unit for container-type data center
|
GB2493324A
(en)
|
2011-05-27 |
2013-02-06 |
Semper Holdings Ltd |
Cooling System with heat-exchanger mounted within a server cabinet
|
US9807908B2
(en)
|
2011-06-30 |
2017-10-31 |
Parker-Hannifin Corporation |
Pumped liquid cooling system using a phase change fluid with additional subambient cooling
|
JP5832190B2
(ja)
*
|
2011-07-25 |
2015-12-16 |
新日本空調株式会社 |
水冷媒冷凍システム
|
AU2012232967B2
(en)
|
2011-10-31 |
2015-01-15 |
Abb Technology Ag |
Cabinet with modules having a thermosiphon cooler arrangement
|
JP5615257B2
(ja)
*
|
2011-12-26 |
2014-10-29 |
三菱電機株式会社 |
流量監視装置及び流量監視システム
|
US9494371B2
(en)
|
2011-12-28 |
2016-11-15 |
Liebert Corporation |
Pumped refrigerant cooling system with 1+1 to N+1 and built-in redundancy
|
JP5797329B2
(ja)
|
2012-04-19 |
2015-10-21 |
株式会社日立製作所 |
冷却システムを備えた電子計算機
|
US20130291555A1
(en)
|
2012-05-07 |
2013-11-07 |
Phononic Devices, Inc. |
Thermoelectric refrigeration system control scheme for high efficiency performance
|
US9500413B1
(en)
|
2012-06-14 |
2016-11-22 |
Google Inc. |
Thermosiphon systems with nested tubes
|
US9869519B2
(en)
|
2012-07-12 |
2018-01-16 |
Google Inc. |
Thermosiphon systems for electronic devices
|
DE102012108110B4
(de)
|
2012-08-31 |
2014-06-26 |
Rittal Gmbh & Co. Kg |
Kühlanordnung für in einem Innenraum eines Schaltschranks angeordnete Komponenten
|
DE102012108109B4
(de)
*
|
2012-08-31 |
2014-04-10 |
Rittal Gmbh & Co. Kg |
Wärmetauscher für die Schaltschrankkühlung und eine entsprechende Kühlanordnung
|
US20140137573A1
(en)
|
2012-11-21 |
2014-05-22 |
Liebert Corporation |
Expansion Valve Position Control Systems And Methods
|
US9140475B2
(en)
|
2012-12-07 |
2015-09-22 |
Liebert Corporation |
Receiver tank purge in vapor compression cooling system with pumped refrigerant economization
|
US20140163744A1
(en)
|
2012-12-07 |
2014-06-12 |
Liebert Corporation |
Fault detection in a cooling system with a plurality of identical cooling circuits
|
CN203010813U
(zh)
|
2012-12-11 |
2013-06-19 |
南京师范大学 |
间壁式显热交换热管型机房空调
|
US9049800B2
(en)
|
2013-02-01 |
2015-06-02 |
Dell Products L.P. |
Immersion server, immersion server drawer, and rack-mountable immersion server drawer-based cabinet
|
JP6090715B2
(ja)
|
2013-02-15 |
2017-03-08 |
パナソニックIpマネジメント株式会社 |
サーバー冷却システム
|
US9726418B2
(en)
|
2013-11-27 |
2017-08-08 |
Tokitae Llc |
Refrigeration devices including temperature-controlled container systems
|
CA2928808A1
(en)
|
2014-04-28 |
2015-12-07 |
Vert.com Inc. |
Energy efficient vertical data center
|
US10364043B2
(en)
*
|
2014-07-02 |
2019-07-30 |
Embraer S.A. |
Passive aircraft cooling systems and methods
|
WO2016032759A1
(en)
*
|
2014-08-25 |
2016-03-03 |
J R Thermal LLC |
Temperature glide thermosyphon and heat pipe
|
US9552025B2
(en)
|
2014-09-23 |
2017-01-24 |
Google Inc. |
Cooling electronic devices in a data center
|
US9398731B1
(en)
|
2014-09-23 |
2016-07-19 |
Google Inc. |
Cooling electronic devices in a data center
|
US10993353B2
(en)
|
2014-09-29 |
2021-04-27 |
Hewlett Packard Enterprise Development Lp |
Fan controlled ambient air cooling of equipment in a controlled airflow environment
|
CN204268756U
(zh)
*
|
2014-12-02 |
2015-04-15 |
苟仲武 |
一种改进的压缩式热泵装置
|
CN204786939U
(zh)
|
2015-04-01 |
2015-11-18 |
广州汇安科技有限公司 |
数据中心空调供冷节能系统
|
US10448543B2
(en)
|
2015-05-04 |
2019-10-15 |
Google Llc |
Cooling electronic devices in a data center
|
US10462935B2
(en)
|
2015-06-23 |
2019-10-29 |
Google Llc |
Cooling electronic devices in a data center
|
CN205014688U
(zh)
|
2015-09-15 |
2016-02-03 |
Tcl空调器(中山)有限公司 |
换热器以及换热设备
|