SG11201900902RA - Active/passive cooling system - Google Patents

Active/passive cooling system

Info

Publication number
SG11201900902RA
SG11201900902RA SG11201900902RA SG11201900902RA SG11201900902RA SG 11201900902R A SG11201900902R A SG 11201900902RA SG 11201900902R A SG11201900902R A SG 11201900902RA SG 11201900902R A SG11201900902R A SG 11201900902RA SG 11201900902R A SG11201900902R A SG 11201900902RA
Authority
SG
Singapore
Prior art keywords
cooling medium
international
primary cooling
condenser
evaporator
Prior art date
Application number
SG11201900902RA
Inventor
Paul Dinnage
Wei Fang
Original Assignee
Munters Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Munters Corp filed Critical Munters Corp
Publication of SG11201900902RA publication Critical patent/SG11201900902RA/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/19—Pressures
    • F25B2700/195—Pressures of the condenser
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21—Temperatures
    • F25B2700/2116—Temperatures of a condenser
    • F25B2700/21163—Temperatures of a condenser of the refrigerant at the outlet of the condenser

Abstract

r\" - ` 114 114 216 16 106 102 102 1 0 6 102 102 100 106 120 4 120 (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 08 February 2018 (08.02.2018) WIPO I PCT °mons °nolo omolomioomommoiflo ois (10) International Publication Number WO 2018/026478 Al (51) International Patent Classification: HO5K 7/20 (2006.01) GOOF 1/20 (2006.01) F28D 15/02 (2006.01) (21) International Application Number: PCT/US2017/041682 (22) International Filing Date: 12 July 2017 (12.07.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/369,957 02 August 2016 (02.08.2016) US 15/646,731 11 July 2017 (11.07.2017) US (71) Applicant: MUNTERS CORPORATION [US/US]; 16900 Jordan Road, Selma, TX 78154 (US). (72) Inventors: DINNAGE, Paul, A.; 27623 Bogen Road, New Braunfels, TX 78132 (US). FANG, Wei; 1934 Laurel Fld, San Antonio, TX 78260 (US). (74) Agent: WILLIAMSON, Mark, A. et al.; Fitzpatrick, Cel- la, Harper & Scinto, 1290 Avenue Of The Americas, New York, NY 10104-3800 (US). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3)) (54) Title: ACTIVE/PASSIVE COOLING SYSTEM (57) : An airstream cooling assembly includes an evaporator and a first and second condenser. The evaporator is configured to have a first airstream directed over its outer surface and to change the phase of a primary cooling medium from liquid to gas. The first condenser is configured to have a second airstream directed over its outer surface, transfer heat from the primary cooling medium, and change the phase of the primary cooling medium from gas to liquid. The second condenser is configured to accept a secondary cooling medium, and when accepting the secondary cooling medium, to receive the primary cooling medium from the evaporator, transfer heat from the primary cooling medium, and change the phase of the primary cooling medium from gas to liquid. The evaporator is configured to receive the primary cooling medium in the liquid phase from at least one of the first condenser and the second condenser.
SG11201900902RA 2016-08-02 2017-07-12 Active/passive cooling system SG11201900902RA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662369957P 2016-08-02 2016-08-02
US15/646,731 US11255611B2 (en) 2016-08-02 2017-07-11 Active/passive cooling system
PCT/US2017/041682 WO2018026478A1 (en) 2016-08-02 2017-07-12 Active/passive cooling system

Publications (1)

Publication Number Publication Date
SG11201900902RA true SG11201900902RA (en) 2019-02-27

Family

ID=61068889

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201900902RA SG11201900902RA (en) 2016-08-02 2017-07-12 Active/passive cooling system

Country Status (12)

Country Link
US (1) US11255611B2 (en)
EP (2) EP4030879B1 (en)
JP (1) JP7137555B2 (en)
KR (1) KR102448820B1 (en)
CN (1) CN109892029B (en)
AU (3) AU2017306949B2 (en)
CA (1) CA3032631C (en)
DK (1) DK3494766T3 (en)
ES (1) ES2913924T3 (en)
MX (1) MX2019001403A (en)
SG (1) SG11201900902RA (en)
WO (1) WO2018026478A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10260819B2 (en) * 2016-07-26 2019-04-16 Tokitae Llc Thermosiphons for use with temperature-regulated storage devices
US11839062B2 (en) 2016-08-02 2023-12-05 Munters Corporation Active/passive cooling system
TWI694563B (en) * 2017-09-28 2020-05-21 雙鴻科技股份有限公司 Liquid cooling system with dual loops
US10767891B2 (en) 2018-02-20 2020-09-08 Johnson Controls Technology Company Auxiliary heat exchanger
CN110366359B (en) * 2019-07-26 2020-11-03 天津神为科技有限公司 Fountain type double-circulation super computer cooling system
CN111352489B (en) * 2020-02-29 2021-05-25 苏州浪潮智能科技有限公司 Flowing boiling immersion type liquid cooling device
WO2021232136A1 (en) * 2020-05-22 2021-11-25 Nortek Air Solutions Canada, Inc. Blended operation mode for providing cooling to a heat load
US11835305B2 (en) * 2020-07-02 2023-12-05 Fang-Shou LEE Openable and closeable condensing apparatus
US20220225545A1 (en) * 2021-01-14 2022-07-14 Nvidia Corporation Intelligent dual purpose heat exchanger and fan wall for a datacenter cooling system
US20220232739A1 (en) * 2021-01-21 2022-07-21 Nvidia Corporation Intelligent cold plate system with active and passive features for a datacenter cooling system
US11612083B2 (en) * 2021-03-05 2023-03-21 Baidu Usa Llc System and method for phase-change cooling of an electronic rack
US11737246B2 (en) * 2021-04-27 2023-08-22 Quanta Computer Inc. Dual-radiator cooling device
KR20240037274A (en) * 2021-08-06 2024-03-21 문터스 코포레이션 Active/passive cooling system
SE2250290A1 (en) * 2022-01-06 2023-07-07 Munters Corp Active/passive cooling system with pumped refrigerant
DE102022116777B3 (en) * 2022-07-05 2023-10-26 Rittal Gmbh & Co. Kg Cooling device for control cabinet air conditioning and a corresponding control cabinet arrangement

Family Cites Families (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3807493A (en) * 1971-09-28 1974-04-30 Kooltronic Fan Co Heat exchanger using u-tube heat pipes
US5333677A (en) * 1974-04-02 1994-08-02 Stephen Molivadas Evacuated two-phase head-transfer systems
US4216903A (en) * 1977-03-07 1980-08-12 Giuffre Anthony A Heat exchange system for recycling stack heat
US4314601A (en) * 1978-10-04 1982-02-09 Giuffre Anthony A Heat exchange system for recycling waste heat
US4476922A (en) 1981-10-26 1984-10-16 Heilig Jr Glenn M Forced bilateral thermosiphon loop
DE3485375D1 (en) * 1983-06-21 1992-01-30 Babcock Hitachi Kk HEAT EXCHANGER.
US5339893A (en) * 1992-05-08 1994-08-23 The United States Of America As Represented By The Secretary Of The Army Apparatus for containing toxic spills employing hybrid thermosyphons
US5921315A (en) 1995-06-07 1999-07-13 Heat Pipe Technology, Inc. Three-dimensional heat pipe
US6119767A (en) * 1996-01-29 2000-09-19 Denso Corporation Cooling apparatus using boiling and condensing refrigerant
US6205803B1 (en) 1996-04-26 2001-03-27 Mainstream Engineering Corporation Compact avionics-pod-cooling unit thermal control method and apparatus
JPH10238972A (en) 1997-02-24 1998-09-11 Hitachi Ltd Heat transfer unit
US6131647A (en) * 1997-09-04 2000-10-17 Denso Corporation Cooling system for cooling hot object in container
US6578629B1 (en) 1998-01-20 2003-06-17 Richard W. Trent Application of heat pipe science to heating, refrigeration and air conditioning systems
US6220337B1 (en) * 1998-04-27 2001-04-24 Shi-Li Chen Heat pipe circuit type thermal battery
JP2000046423A (en) * 1998-07-31 2000-02-18 Mitsubishi Electric Building Techno Service Co Ltd Natural circulation cooling apparatus
US6591902B1 (en) 1998-12-29 2003-07-15 Richard W. Trent Apparatus for applying controllable, multipurpose heat pipes to heating, ventilation, and air conditioning systems
US6658874B1 (en) * 1999-04-12 2003-12-09 Richard W. Trent Advanced, energy efficient air conditioning, dehumidification and reheat method and apparatus
US6519955B2 (en) 2000-04-04 2003-02-18 Thermal Form & Function Pumped liquid cooling system using a phase change refrigerant
JP2002013885A (en) 2000-06-28 2002-01-18 Twinbird Corp Thermo-siphon for refrigerator
TW556328B (en) * 2001-05-11 2003-10-01 Denso Corp Cooling device boiling and condensing refrigerant
JP2004537705A (en) * 2001-07-20 2004-12-16 エイ・エル・エム・エイ テクノロジー コーポレーション リミテッド Heat exchanger and heat exchange manifold
EP1459379A4 (en) * 2001-12-27 2006-06-07 Showa Denko Kk Ebullition cooling device for heat generating component
US6817097B2 (en) * 2002-03-25 2004-11-16 Thermal Corp. Flat plate fuel cell cooler
US6550530B1 (en) 2002-04-19 2003-04-22 Thermal Corp. Two phase vacuum pumped loop
JP4214881B2 (en) * 2003-01-21 2009-01-28 三菱電機株式会社 Bubble pump type heat transport equipment
US7007501B2 (en) * 2003-08-15 2006-03-07 The Boeing Company System, apparatus, and method for passive and active refrigeration of at least one enclosure
EP1723371A2 (en) 2003-12-05 2006-11-22 Liebert Corporation Cooling system for high density heat load
US6917522B1 (en) 2003-12-29 2005-07-12 Intel Corporation Apparatus and method for cooling integrated circuit devices
US6988538B2 (en) 2004-01-22 2006-01-24 Hussmann Corporation Microchannel condenser assembly
US7958935B2 (en) 2004-03-31 2011-06-14 Belits Computer Systems, Inc. Low-profile thermosyphon-based cooling system for computers and other electronic devices
US20100061062A1 (en) * 2005-01-03 2010-03-11 Noise Limit Aps Multi-orientational cooling system with a bubble pump
WO2007000042A1 (en) * 2005-06-27 2007-01-04 Fleming Mark A Refrigerator or freezer with enhanced efficiency
US20070209782A1 (en) 2006-03-08 2007-09-13 Raytheon Company System and method for cooling a server-based data center with sub-ambient cooling
US7907408B2 (en) * 2006-04-13 2011-03-15 Mitsubishi Electric Corporation Cooling apparatus and power converter
GB2442743A (en) * 2006-10-12 2008-04-16 Energetix Group Ltd A Closed Cycle Heat Transfer Device
US7658079B2 (en) * 2006-11-22 2010-02-09 Bailey Peter F Cooling system and method
US7832204B2 (en) * 2006-12-18 2010-11-16 Ford Global Technologies, Llc Engine system including heat pipe
JP4432979B2 (en) * 2007-02-08 2010-03-17 株式会社デンソー Exhaust heat recovery system
JP5405015B2 (en) * 2007-12-19 2014-02-05 ホシザキ電機株式会社 Cooling system
JP4658174B2 (en) 2008-09-24 2011-03-23 株式会社日立製作所 Electronic equipment
US11022380B2 (en) * 2008-11-03 2021-06-01 Guangwei Hetong Energy Techology (Beijing) Co., Ltd Heat pipe with micro-pore tube array and heat exchange system employing the heat pipe
US20100107658A1 (en) 2008-11-04 2010-05-06 Richard Erwin Cockrell Data center cooling device and method
US8033322B1 (en) 2008-11-07 2011-10-11 Trent Richard W Split heat recovery system
US20100204838A1 (en) 2009-02-12 2010-08-12 Liebert Corporation Energy efficient air conditioning system and method utilizing variable capacity compressor and sensible heat ratio load matching
JP2010190553A (en) * 2009-02-20 2010-09-02 Hitachi Plant Technologies Ltd Cooling system for electronic apparatus
US7903404B2 (en) 2009-04-29 2011-03-08 Hewlett-Packard Development Company, L.P. Data centers
US7969727B2 (en) 2009-04-29 2011-06-28 Hewlett-Packard Development Company, L.P. Cooling
RU2524058C2 (en) * 2009-09-28 2014-07-27 Абб Рисерч Лтд Cooling module for cooling of electronic elements
US9271429B2 (en) 2010-04-12 2016-02-23 Fujikura Ltd. Cooling device, cooling system, and auxiliary cooling device for datacenter
US20110259573A1 (en) * 2010-04-26 2011-10-27 Gac Corporation Cooling system
JP5351097B2 (en) * 2010-06-18 2013-11-27 株式会社日立製作所 Refrigerant circulation device
TW201040480A (en) 2010-07-30 2010-11-16 Asia Vital Components Co Ltd Low-pressure circulation type thermosiphon device driven by pressure gradients
US9038404B2 (en) 2011-04-19 2015-05-26 Liebert Corporation High efficiency cooling system
US8773854B2 (en) 2011-04-25 2014-07-08 Google Inc. Thermosiphon systems for electronic devices
US9179574B2 (en) 2011-05-24 2015-11-03 International Business Machines Corporation Cooling unit for container-type data center
GB2493324A (en) 2011-05-27 2013-02-06 Semper Holdings Ltd Cooling System with heat-exchanger mounted within a server cabinet
EP2726798B1 (en) 2011-06-30 2017-11-22 Parker-Hannifin Corporation Pumped liquid cooling system using a phase change fluid with additional sub-ambient cooling
JP5832190B2 (en) * 2011-07-25 2015-12-16 新日本空調株式会社 Water refrigerant refrigeration system
AU2012232967B2 (en) 2011-10-31 2015-01-15 Abb Technology Ag Cabinet with modules having a thermosiphon cooler arrangement
JP5615257B2 (en) * 2011-12-26 2014-10-29 三菱電機株式会社 Flow monitoring device and flow monitoring system
US9494371B2 (en) 2011-12-28 2016-11-15 Liebert Corporation Pumped refrigerant cooling system with 1+1 to N+1 and built-in redundancy
WO2013157117A1 (en) 2012-04-19 2013-10-24 株式会社日立製作所 Computer provided with cooling system
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
US9500413B1 (en) 2012-06-14 2016-11-22 Google Inc. Thermosiphon systems with nested tubes
US9869519B2 (en) 2012-07-12 2018-01-16 Google Inc. Thermosiphon systems for electronic devices
DE102012108109B4 (en) * 2012-08-31 2014-04-10 Rittal Gmbh & Co. Kg Heat exchanger for cabinet cooling and a corresponding cooling arrangement
DE102012108110B4 (en) * 2012-08-31 2014-06-26 Rittal Gmbh & Co. Kg Cooling arrangement for arranged in an interior of a cabinet components
US20140137573A1 (en) 2012-11-21 2014-05-22 Liebert Corporation Expansion Valve Position Control Systems And Methods
US9140475B2 (en) 2012-12-07 2015-09-22 Liebert Corporation Receiver tank purge in vapor compression cooling system with pumped refrigerant economization
US20140163744A1 (en) 2012-12-07 2014-06-12 Liebert Corporation Fault detection in a cooling system with a plurality of identical cooling circuits
CN203010813U (en) 2012-12-11 2013-06-19 南京师范大学 Dividing wall type display heat exchange heat pipe type computer room air conditioner
US9049800B2 (en) 2013-02-01 2015-06-02 Dell Products L.P. Immersion server, immersion server drawer, and rack-mountable immersion server drawer-based cabinet
JP6090715B2 (en) 2013-02-15 2017-03-08 パナソニックＩｐマネジメント株式会社 Server cooling system
US9726418B2 (en) 2013-11-27 2017-08-08 Tokitae Llc Refrigeration devices including temperature-controlled container systems
US9913407B2 (en) 2014-04-28 2018-03-06 Vert.com Inc. Energy efficient vertical data center
US10364043B2 (en) * 2014-07-02 2019-07-30 Embraer S.A. Passive aircraft cooling systems and methods
US9777967B2 (en) * 2014-08-25 2017-10-03 J R Thermal LLC Temperature glide thermosyphon and heat pipe
US9552025B2 (en) 2014-09-23 2017-01-24 Google Inc. Cooling electronic devices in a data center
US9398731B1 (en) 2014-09-23 2016-07-19 Google Inc. Cooling electronic devices in a data center
WO2016053227A1 (en) 2014-09-29 2016-04-07 Hewlett Packard Enterprise Development Lp Fan controlled ambient air cooling of equipment in a controlled airflow environment
CN204268756U (en) * 2014-12-02 2015-04-15 苟仲武 A kind of compression heat pump device of improvement
CN204786939U (en) 2015-04-01 2015-11-18 广州汇安科技有限公司 Data center air conditioner cooling economizer system
US10448543B2 (en) 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
US10462935B2 (en) 2015-06-23 2019-10-29 Google Llc Cooling electronic devices in a data center
CN205014688U (en) 2015-09-15 2016-02-03 Tcl空调器(中山)有限公司 Heat exchanger and indirect heating equipment

Also Published As

Publication number Publication date
KR102448820B1 (en) 2022-09-28
DK3494766T3 (en) 2022-03-28
EP4030879B1 (en) 2024-04-03
EP3494766B1 (en) 2022-03-02
AU2021212117B2 (en) 2023-08-24
AU2017306949B2 (en) 2022-04-21
AU2021212117A1 (en) 2021-08-26
MX2019001403A (en) 2019-08-14
CA3032631A1 (en) 2018-02-08
CN109892029A (en) 2019-06-14
EP3494766A4 (en) 2020-04-08
ES2913924T3 (en) 2022-06-06
AU2023266235A1 (en) 2023-12-07
AU2017306949A1 (en) 2019-02-28
EP3494766A1 (en) 2019-06-12
KR20190035840A (en) 2019-04-03
EP4030879A1 (en) 2022-07-20
WO2018026478A1 (en) 2018-02-08
JP2019523384A (en) 2019-08-22
JP7137555B2 (en) 2022-09-14
CA3032631C (en) 2023-05-09
US20180038660A1 (en) 2018-02-08
US11255611B2 (en) 2022-02-22
CN109892029B (en) 2021-08-03

Similar Documents

Publication Publication Date Title
SG11201900902RA (en) Active/passive cooling system
SG11201907210YA (en) Policy communication via control plane signaling
SG11201809344QA (en) Process for synthesizing 2-hydroxy-6-((2-(1-isopropyl-1h-pyrazol-5-yl)-pyridin-3-yl)methoxy)benzaldehyde
SG11201809874SA (en) Systems and methods for locating a wireless device
SG11201907770YA (en) Systems and methods for determining a parking region of vehicles
SG11201810600WA (en) Fxr (nr1h4) modulating compounds
SG11201903480TA (en) Cell culture device system and methods of use thereof
SG11201808990QA (en) Compositions for topical application of compounds
SG11201804758QA (en) Aqueous pharmaceutical formulation comprising anti-pd-1 antibody avelumab
SG11201810466PA (en) Compositions and methods related to engineered fc constructs
SG11201805927YA (en) Spiroheptane salicylamides and related compounds as inhibitors of rock
SG11201804384UA (en) Geometric configurations for gastric residence systems
SG11201907023UA (en) Method of reducing neutropenia
SG11201906386XA (en) Combination therapy involving diaryl macrocyclic compounds
SG11201407233RA (en) Ethylene oligomerization process
SG11201809663WA (en) Acrylamide-based copolymers, terpolymers, and use as hydrate inhibitors
SG11201908456VA (en) Linker units and molecular constructs comprising same
SG11201901457TA (en) 2'-substituted-n6-substituted purine nucleotides for rna virus treatment
SG11201901873PA (en) Tablet compositions
SG11201806393QA (en) Use of gabaa receptor modulators for treatment of itch
SG11201809172WA (en) Crystalline forms of n-[2-(3-hydroxy-3-methylbutyl)-6-(2-hydroxypropan-2-yl)-2h-indazol-5-yl]-6-(trifluoromethyl)pyridine-2-carboxamide
SG11201901458RA (en) Systems and methods for removing fluid from a tray in an assembly line grow pod
SG11201805769UA (en) Universal access to an electronic wallet
SG11201803998PA (en) Systems and methods for updating sequence of services
SG11201903091VA (en) Quinoxaline compounds as type iii receptor tyrosine kinase inhibitors