JP2019523367A - 閉鎖装置、閉鎖装置付き真空システム、及び閉鎖装置の操作方法 - Google Patents
閉鎖装置、閉鎖装置付き真空システム、及び閉鎖装置の操作方法 Download PDFInfo
- Publication number
- JP2019523367A JP2019523367A JP2018529294A JP2018529294A JP2019523367A JP 2019523367 A JP2019523367 A JP 2019523367A JP 2018529294 A JP2018529294 A JP 2018529294A JP 2018529294 A JP2018529294 A JP 2018529294A JP 2019523367 A JP2019523367 A JP 2019523367A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- sealing device
- flange
- sealing
- closure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 11
- 230000005291 magnetic effect Effects 0.000 claims abstract description 275
- 238000007789 sealing Methods 0.000 claims abstract description 249
- 230000000903 blocking effect Effects 0.000 claims abstract description 72
- 238000005339 levitation Methods 0.000 claims abstract description 29
- 230000007704 transition Effects 0.000 claims abstract description 7
- 230000006641 stabilisation Effects 0.000 claims description 25
- 238000011105 stabilization Methods 0.000 claims description 25
- 230000000087 stabilizing effect Effects 0.000 claims description 12
- 239000003381 stabilizer Substances 0.000 description 16
- 239000002245 particle Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 230000006698 induction Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
- F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
- F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
- F16K3/16—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together
- F16K3/18—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor with special arrangements for separating the sealing faces or for pressing them together by movement of the closure members
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
- F16K3/30—Details
- F16K3/316—Guiding of the slide
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K37/00—Special means in or on valves or other cut-off apparatus for indicating or recording operation thereof, or for enabling an alarm to be given
- F16K37/0025—Electrical or magnetic means
- F16K37/0041—Electrical or magnetic means for measuring valve parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Magnetic Bearings And Hydrostatic Bearings (AREA)
- Sliding Valves (AREA)
- Details Of Valves (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Linear Motors (AREA)
- Non-Mechanical Conveyors (AREA)
Abstract
Description
Claims (15)
- 真空チャンバ(101)に設けられ且つ開口(112)を含むフランジ(110)、
前記開口(112)を閉鎖するように構成された封鎖装置(120、220)、
前記封鎖装置または前記封鎖装置の一部を開放位置(I)から閉鎖位置(II)へと移行させるため、前記フランジ(110)と前記封鎖装置(120)との間に磁気閉鎖力を生成するように構成された第1の磁気装置(130)、及び
前記封鎖装置(120)を前記フランジ(110)と平行な第1の方向(T)にガイド構造に沿って非接触式で移送するように構成された磁気浮上システム(150)であって、前記第1の方向(T)を横切る第2の方向(X)に前記封鎖装置(120)を安定化するように構成された第2の磁気装置(160)を含む、磁気浮上システム(150)
を含む、閉鎖装置(100、200)。 - 前記第2の磁気装置(160)はパッシブ磁気安定化装置を備える、請求項1に記載の閉鎖装置。
- 前記第2の磁気装置(160)は、前記封鎖装置(120)の少なくとも1つの側面に固定された第1の複数の永久磁石(165)と、前記ガイド構造に固定された第2の複数の永久磁石(166)とを備える、請求項1または2に記載の閉鎖装置。
- 前記第2の磁気装置(160)は、前記封鎖装置の上部を安定化するための上部磁気安定化装置(161)と、前記封鎖装置の下部を安定化するための下部磁気安定化装置(162)のうちの少なくとも1つを備える、請求項1から3のいずれか一項に記載の閉鎖装置。
- 前記第2の磁気装置(160)は、前記封鎖装置を前記閉鎖位置(II)から前記開放位置(I)へと移行するように構成される、請求項1から4のいずれか一項に記載の閉鎖装置。
- 前記磁気浮上システム(150)は、前記封鎖装置を前記ガイド構造において非接触式で保持するように構成された第3の磁気装置(180)を備え、具体的には前記第3の磁気装置(180)が複数のアクティブ磁気ベアリング(184)を備える、請求項1から5のいずれか一項に記載の閉鎖装置。
- 前記第3の磁気装置(180)は、磁気アクチュエータ、及び前記封鎖装置(120)と前記ガイド構造との間の距離を測定するための距離センサを備え、前記磁気アクチュエータは制御ループで制御される、請求項6に記載の閉鎖装置。
- 前記封鎖装置(120)は、前記ガイド構造の頂部レール(182)の下方に懸吊されるように構成され、前記頂部レール(182)に前記複数のアクティブ磁気ベアリング(184)が取り付けられている、請求項6または7に記載の閉鎖装置。
- 前記複数のアクティブ磁気ベアリング(184)は、前記封鎖装置(220)、具体的には前記封鎖装置の頭部(222)に一体化されている、請求項6または7に記載の閉鎖装置。
- 前記磁気浮上システムは、前記封鎖装置(120)を前記ガイド構造に沿って前記第1の方向(T)に動かすための駆動装置(170)、具体的にはリニアモータをさらに備える、請求項1から9のいずれか一項に記載の閉鎖装置。
- 前記第1の磁気装置(160)は、前記封鎖装置(120)全体を前記開放位置(I)から前記閉鎖位置(II)へと移行するように構成され、具体的には前記封鎖装置(120)は1つの剛性部品として形成されている、請求項1から10のいずれか一項に記載の閉鎖装置。
- 前記封鎖装置(220)は、具体的には可撓接続部(225)を介して互いに対して可動な下部(221)と頭部(222)を備え、前記封鎖装置(220)を前記開放位置(I)から前記閉鎖位置(II)に移行することは、前記頭部(222)なしで、前記下部(221)を前記フランジ(110)に向けて動かすことを含む、請求項1から10のいずれか一項に記載の閉鎖装置。
- 真空チャンバ(101)、
前記真空チャンバ(101)の内壁または外壁に設けられ且つ開口(112)を含むフランジ(110)、
前記開口(112)を閉鎖するように構成された封鎖装置(120)、
前記封鎖装置(120)または前記封鎖装置の一部を開放位置(I)から閉鎖位置(II)へと移行させるため、前記フランジ(110)と前記封鎖装置(120)との間に磁気閉鎖力を生成するように構成された第1の磁気装置(130)、及び
前記封鎖装置(120)を前記フランジ(110)と平行な第1の方向(T)に非接触式で移送するように構成された磁気浮上システム(150)であって、前記第1の方向(T)を横切る第2の方向(X)に前記封鎖装置を安定化するように構成された第2の磁気装置(160)を備える、磁気浮上システム(150)
を備える、真空システム。 - 閉鎖装置(100、200)を操作する方法であって、
封鎖装置(120)を、真空チャンバ(101)に設けられ且つ開口(112)を含むフランジ(110)と平行な第1の方向(T)に非接触式で移送することと、
第2の磁気装置(160)によって、前記第1の方向(T)を横切る第2の方向(X)に前記封鎖装置(120)を磁気によって安定化させることと、
前記封鎖装置または前記封鎖装置の一部を、開放位置(I)から前記封鎖装置が前記開口を封止する閉鎖位置(II)へと移行させるため、第1の磁気装置(130)によって前記フランジ(110)と前記封鎖装置(120)との間に磁気閉鎖力を生成することと、
を含む、方法。 - 封鎖装置を、前記第2の磁気装置(160)によって生成された磁力によって、閉鎖位置(II)から開放位置(I)へと移行すること
をさらに含む、請求項14に記載の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2017/063998 WO2018224150A1 (en) | 2017-06-08 | 2017-06-08 | Closing device, vacuum system with closing device and method of operating a closing device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019523367A true JP2019523367A (ja) | 2019-08-22 |
JP6648280B2 JP6648280B2 (ja) | 2020-02-14 |
Family
ID=59093538
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018529294A Active JP6648280B2 (ja) | 2017-06-08 | 2017-06-08 | 閉鎖装置、閉鎖装置付き真空システム、及び閉鎖装置の操作方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6648280B2 (ja) |
KR (1) | KR102109335B1 (ja) |
CN (1) | CN109392303B (ja) |
TW (1) | TWI687614B (ja) |
WO (1) | WO2018224150A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220088760A (ko) * | 2020-03-11 | 2022-06-28 | 씨알알씨 칭다오 쓰팡 씨오., 엘티디. | 자기 부상 열차를 위한 선형 모터 및 자기 부상 열차 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7155999B2 (ja) * | 2018-12-20 | 2022-10-19 | 株式会社島津製作所 | 真空バルブおよびバルブ制御装置 |
DE102019123563A1 (de) * | 2019-09-03 | 2021-03-04 | Vat Holding Ag | Vakuumventil für das Be- und/oder Entladen einer Vakuumkammer |
KR20220106760A (ko) * | 2019-11-27 | 2022-07-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 자기 부상 시스템, 프로세싱 시스템, 및 캐리어를 운송하는 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150188399A1 (en) * | 2013-12-30 | 2015-07-02 | Samsung Display Co., Ltd. | Apparatus for transferring substrate |
JP2017523354A (ja) * | 2014-06-10 | 2017-08-17 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 真空室用の閉鎖またはエアロック装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4747577A (en) * | 1986-07-23 | 1988-05-31 | The Boc Group, Inc. | Gate valve with magnetic closure for use with vacuum equipment |
JPH03244777A (ja) * | 1990-02-21 | 1991-10-31 | Okamura Corp | 磁気浮上自走式懸垂引き戸 |
DE19601541A1 (de) * | 1995-01-27 | 1996-08-01 | Seiko Seiki Kk | In einer Vakuumumgebung einsetzbares Vertikaltransfersystem sowie dazugehöriges Absperrventilsystem |
JP2631356B2 (ja) * | 1995-01-27 | 1997-07-16 | セイコー精機株式会社 | ゲートバルブ装置 |
DE102004027752A1 (de) * | 2004-06-08 | 2006-01-05 | Leybold Optics Gmbh | Schleusenvorrichtung |
KR101288599B1 (ko) * | 2007-05-29 | 2013-07-22 | 엘지디스플레이 주식회사 | 기판 이송 장치 |
US20140241848A1 (en) * | 2013-02-25 | 2014-08-28 | Varian Semiconductor Equipment Associates, Inc. | Electric switchable magnet slitvalve |
KR20150052996A (ko) * | 2013-11-07 | 2015-05-15 | 삼성디스플레이 주식회사 | 기판 이송 장치 및 이를 포함하는 박막 증착 장치 |
WO2016074758A1 (de) * | 2014-11-13 | 2016-05-19 | Vat Holding Ag | Vakuumventil |
-
2017
- 2017-06-08 JP JP2018529294A patent/JP6648280B2/ja active Active
- 2017-06-08 KR KR1020187017862A patent/KR102109335B1/ko active IP Right Grant
- 2017-06-08 WO PCT/EP2017/063998 patent/WO2018224150A1/en active Application Filing
- 2017-06-08 CN CN201780015220.3A patent/CN109392303B/zh active Active
-
2018
- 2018-05-25 TW TW107117834A patent/TWI687614B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150188399A1 (en) * | 2013-12-30 | 2015-07-02 | Samsung Display Co., Ltd. | Apparatus for transferring substrate |
JP2017523354A (ja) * | 2014-06-10 | 2017-08-17 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 真空室用の閉鎖またはエアロック装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220088760A (ko) * | 2020-03-11 | 2022-06-28 | 씨알알씨 칭다오 쓰팡 씨오., 엘티디. | 자기 부상 열차를 위한 선형 모터 및 자기 부상 열차 |
KR102663562B1 (ko) | 2020-03-11 | 2024-05-03 | 씨알알씨 칭다오 쓰팡 씨오., 엘티디. | 자기 부상 열차를 위한 선형 모터 및 자기 부상 열차 |
Also Published As
Publication number | Publication date |
---|---|
KR102109335B1 (ko) | 2020-05-12 |
CN109392303A (zh) | 2019-02-26 |
JP6648280B2 (ja) | 2020-02-14 |
KR20190087967A (ko) | 2019-07-25 |
WO2018224150A1 (en) | 2018-12-13 |
CN109392303B (zh) | 2020-09-15 |
TWI687614B (zh) | 2020-03-11 |
TW201903307A (zh) | 2019-01-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI687614B (zh) | 關閉裝置、具有關閉裝置之真空系統及操作一關閉裝置之方法 | |
KR101386685B1 (ko) | 기판 처리 장치 | |
WO2015056847A1 (en) | Magnetically levitated transportation apparatus | |
KR102155758B1 (ko) | 진공 프로세싱 시스템에서 디바이스를 비접촉식으로 운송하기 위한 장치 및 방법 | |
US11377310B2 (en) | Magnetic levitation system, base of a magnetic levitation system, vacuum system, and method of contactlessly holding and moving a carrier in a vacuum chamber | |
JP6440740B2 (ja) | 物体を保持、位置決めおよび/または移動させるための装置 | |
TWI687533B (zh) | 用於一基板之真空處理之設備、用於具有有機材料之裝置之製造的系統、及用以密封連接二壓力區域之一開孔之方法 | |
US20220208426A1 (en) | Magnetic levitation system, base and carrier of a magnetic levitation system, and method of levitating a carrier | |
TWI670789B (zh) | 用於一真空系統中使用之載體、用以真空處理之系統、及用於一基板之真空處理之方法 | |
KR101753216B1 (ko) | 자력조절장치 | |
TWI687361B (zh) | 磁浮系統、真空系統與運輸載體之方法 | |
KR101991497B1 (ko) | 자기 부상 이송 장치 | |
KR20230104686A (ko) | 캐리어 수송 시스템, 자기 안정화 유닛, 캐리어, 및 캐리어를 비접촉식으로 수송하기 위한 방법 | |
CN114600228A (zh) | 磁悬浮系统、处理系统和运输载体的方法 | |
CN115552582A (zh) | 用于在真空处理系统中运输装置的设备和方法 | |
KR20210011449A (ko) | 캐리어를 운송하기 위한 장치, 기판을 수직으로 프로세싱하기 위한 프로세싱 시스템, 및 캐리어의 운송 경로를 스위칭하는 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180807 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180807 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190903 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191202 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191217 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200115 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6648280 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |