JP2019516250A - エラストマーシール - Google Patents
エラストマーシール Download PDFInfo
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- JP2019516250A JP2019516250A JP2018558209A JP2018558209A JP2019516250A JP 2019516250 A JP2019516250 A JP 2019516250A JP 2018558209 A JP2018558209 A JP 2018558209A JP 2018558209 A JP2018558209 A JP 2018558209A JP 2019516250 A JP2019516250 A JP 2019516250A
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- Prior art keywords
- elastomeric seal
- seal
- elastomeric
- ink
- barrier material
- Prior art date
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- 229920001971 elastomer Polymers 0.000 title description 9
- 239000000806 elastomer Substances 0.000 title description 3
- 239000000463 material Substances 0.000 claims abstract description 37
- 230000005855 radiation Effects 0.000 claims abstract description 31
- 230000004888 barrier function Effects 0.000 claims abstract description 21
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 230000015556 catabolic process Effects 0.000 claims abstract description 14
- 238000006731 degradation reaction Methods 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 39
- 239000002245 particle Substances 0.000 claims description 12
- 239000002923 metal particle Substances 0.000 claims description 11
- 150000002484 inorganic compounds Chemical class 0.000 claims description 9
- 229910010272 inorganic material Inorganic materials 0.000 claims description 9
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- VXAUWWUXCIMFIM-UHFFFAOYSA-M aluminum;oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[Al+3] VXAUWWUXCIMFIM-UHFFFAOYSA-M 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 229920002313 fluoropolymer Polymers 0.000 claims description 3
- 239000004811 fluoropolymer Substances 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 239000006229 carbon black Substances 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000012636 effector Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229920001519 homopolymer Polymers 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 239000013536 elastomeric material Substances 0.000 description 28
- 230000008859 change Effects 0.000 description 17
- 239000000203 mixture Substances 0.000 description 15
- 238000007789 sealing Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 229920006169 Perfluoroelastomer Polymers 0.000 description 7
- 238000007906 compression Methods 0.000 description 7
- 230000006835 compression Effects 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 239000004971 Cross linker Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- BLTXWCKMNMYXEA-UHFFFAOYSA-N 1,1,2-trifluoro-2-(trifluoromethoxy)ethene Chemical compound FC(F)=C(F)OC(F)(F)F BLTXWCKMNMYXEA-UHFFFAOYSA-N 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 2
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 102220508341 E3 ubiquitin-protein ligase XIAP_Y75G_mutation Human genes 0.000 description 2
- 102220496254 Exocyst complex component 3-like protein_Y75N_mutation Human genes 0.000 description 2
- 102220633241 Hexokinase-4_G80A_mutation Human genes 0.000 description 2
- 102220636426 Hexokinase-4_G80D_mutation Human genes 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000008199 coating composition Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- -1 ethylene, propylene Chemical group 0.000 description 2
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- 102200015355 rs2185379 Human genes 0.000 description 2
- 102220105326 rs574337291 Human genes 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000007655 standard test method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000004636 vulcanized rubber Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 241000252254 Catostomidae Species 0.000 description 1
- 229920005479 Lucite® Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229950005499 carbon tetrachloride Drugs 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 102220198654 rs199566527 Human genes 0.000 description 1
- 102200029434 rs35423325 Human genes 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000008247 solid mixture Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
- F16J15/12—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing with metal reinforcement or covering
- F16J15/128—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing with metal reinforcement or covering with metal covering
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4409—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber characterised by sealing means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16J—PISTONS; CYLINDERS; SEALINGS
- F16J15/00—Sealings
- F16J15/02—Sealings between relatively-stationary surfaces
- F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
- F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
- F16J15/102—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing characterised by material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Sealing Material Composition (AREA)
- Gasket Seals (AREA)
- Laminated Bodies (AREA)
- Drying Of Semiconductors (AREA)
- Tires In General (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
Abstract
Description
インク組成物(組成物1および組成物2)を、表1の配合に従って調製した。
表2に示すように、組成物1および2を、厚さ50ミクロンのエラストマー材料の20×10×2mmのシートに塗布した。
重量変化率(%)=((初期重量−最終重量)/初期重量)×100
5:変更なし
4:わずかな変化
3:中程度の変化
2:中程度/重度の変化
1:重大な変化
Claims (15)
- 半導体製造装置に使用するためのエラストマーシールであって、
前記エラストマーシールの上面の少なくとも一部にインクを含み、
前記インクは、バリア材料を含み、
前記バリア材料は、紫外線(UV)放射から前記エラストマーシールの劣化を防止または低減するように動作可能であることを特徴とするエラストマーシール。 - 前記シールは、長尺状で、チャネルに嵌合可能な連続ループを含む請求項1に記載のエラストマーシール。
- 前記エラストマーシールは、下部と、上部とを含み、
前記下部は、摩擦嵌めによって前記チャネルに嵌合するように動作可能である請求項2に記載のエラストマーシール。 - 前記エラストマーシールの前記上部は、前記下部が嵌合可能である前記チャネルから突出し、
前記上面は、使用時に、前記UV放射に曝される請求項3に記載のエラストマーシール。 - 前記エラストマーシールは、単純な、O−リング、フェースシール、リップシール、D−シール、Xシール、T−シール、キャップシール、ワイパーシール、通電リップシールまたはスプリングシール、またはエンドエフェクターパッドまたは吸盤のようなエラストマー部品を取り扱うウエハである請求項1ないし4のいずれかに記載のエラストマーシール。
- 前記エラストマーシールは、高分子材料から形成され、
前記高分子材料は、1つ以上のフッ素ポリマー材料を含み、
前記フッ素ポリマー材料は、1つ以上のホモポリマー、または、フッ素を含むモノマーの組み合わせから誘導される1つ以上のコポリマーを含む請求項1ないし5のいずれかに記載のエラストマーシール。 - 前記バリア材料は、金属粒子を含む請求項1ないし6のいずれかに記載のエラストマーシール。
- 前記金属粒子は、アルミニウム、銀、ニッケル、チタン、亜鉛、金および銅の1または複数を含む請求項7に記載のエラストマーシール。
- 前記金属粒子は、フレークの形態で、前記インクに組み込まれる請求項7または8に記載のエラストマーシール。
- 前記金属粒子は、0.5〜75ミクロンの平均粒径を有する請求項7ないし9のいずれかに記載のエラストマーシール。
- 前記バリア材料は、無機化合物を含む請求項1ないし10のいずれかに記載のエラストマーシール。
- 前記無機化合物は、二酸化チタン、二酸化アルミニウム、カーボンブラックの1または複数を含む請求項11に記載のエラストマーシール。
- 前記無機化合物は、約0.1〜10ミクロンの平均粒径を有する請求項11または12に記載のエラストマーシール。
- 半導体製造装置に使用するためのエラストマーシールを形成する方法であって、
前記エラストマーシールの上面の少なくとも一部にインクを堆積させる工程を含み、
前記インクは、バリア材料を含み、
前記バリア材料は、紫外線(UV)放射から前記シールの劣化を防止または低減するように動作可能であることを特徴とするエラストマーシールを形成する方法。 - 紫外線(UV)放射によるエラストマーシールの劣化を防止または低減する方法であって、前記方法は、
前記エラストマーシールの上面の少なくとも一部にインクを堆積させる工程を含み、
前記インクは、バリア材料を含み、
前記バリア材料は、前記紫外線(UV)放射から前記エラストマーシールの劣化を防止または低減するように動作可能であることを特徴とするエラストマーシールの劣化を防止または低減する方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/GB2016/051305 WO2017191425A1 (en) | 2016-05-06 | 2016-05-06 | An elastomeric seal |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019516250A true JP2019516250A (ja) | 2019-06-13 |
JP6821704B2 JP6821704B2 (ja) | 2021-01-27 |
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US (1) | US11041567B2 (ja) |
EP (1) | EP3453047B1 (ja) |
JP (1) | JP6821704B2 (ja) |
CN (1) | CN109155267B (ja) |
MY (1) | MY188876A (ja) |
SG (1) | SG11201809796RA (ja) |
TW (1) | TWI722184B (ja) |
WO (1) | WO2017191425A1 (ja) |
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US3975292A (en) * | 1960-06-10 | 1976-08-17 | The United States Of America As Represented By The Secretary Of The Army | Method of screening infra-red radiation |
JPH05335101A (ja) * | 1992-06-01 | 1993-12-17 | Murata Mfg Co Ltd | 電子部品 |
JPH11274793A (ja) * | 1998-03-19 | 1999-10-08 | Porimatec Kk | 電磁波シールド用パッキンおよびその製造法 |
US6787221B2 (en) | 2000-03-24 | 2004-09-07 | Chemque Incorporated | Co-dispensed compositions for gaskets and other objects |
CN100563986C (zh) * | 2003-05-16 | 2009-12-02 | 杜邦唐弹性体公司 | 制备紫外光固化密封组件的方法 |
KR100808349B1 (ko) | 2003-11-21 | 2008-02-27 | 다이킨 고교 가부시키가이샤 | 밀봉재, 그의 제조방법 및 그를 갖는 액정·반도체 제조 장치 |
US8104770B2 (en) * | 2007-02-01 | 2012-01-31 | Parker-Hannifin Corporation | Semiconductor process chamber |
JP4855356B2 (ja) * | 2007-07-23 | 2012-01-18 | 三菱電線工業株式会社 | 密封構造体 |
US9290838B2 (en) * | 2012-06-08 | 2016-03-22 | Jefferson Science Associates, Llc | Anti-diffusion metal coated O-rings |
US9892945B2 (en) * | 2012-10-09 | 2018-02-13 | Nippon Valqua Industries, Ltd. | Composite seal |
FR3004106B1 (fr) * | 2013-04-05 | 2016-08-05 | Oreal | Composition contenant des particules composites filtrant les radiations uv de taille moyenne superieure a 0,1μm et des particules d'aerogel de silice hydrophobes |
JP2014214157A (ja) * | 2013-04-22 | 2014-11-17 | 日東電工株式会社 | エネルギー線硬化型自発巻回性粘着テープ |
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EP3453047A1 (en) | 2019-03-13 |
US11041567B2 (en) | 2021-06-22 |
TWI722184B (zh) | 2021-03-21 |
CN109155267B (zh) | 2024-01-26 |
TW201819671A (zh) | 2018-06-01 |
MY188876A (en) | 2022-01-12 |
SG11201809796RA (en) | 2018-12-28 |
EP3453047B1 (en) | 2022-04-06 |
JP6821704B2 (ja) | 2021-01-27 |
CN109155267A (zh) | 2019-01-04 |
US20190154155A1 (en) | 2019-05-23 |
WO2017191425A1 (en) | 2017-11-09 |
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