JP2019510253A - 高分解能のフォトマスク又はレチクル及びその製造方法 - Google Patents
高分解能のフォトマスク又はレチクル及びその製造方法 Download PDFInfo
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Abstract
Description
Claims (20)
- 半導体回路をパターン形成するためのリソグラフィマスクであって、前記リソグラフィマスクは、
基板と、
前記基板上に配置され、前記基板と直接接触するパターン形成されたシフタ材料を有するインダイ領域であって、前記パターン形成されたシフタ材料は、側壁を有するフィーチャを含む、インダイ領域と、
前記基板上に配置され、前記インダイ領域を包囲し、前記基板と直接接触する吸収体層を有するフレーム領域と
を備えるリソグラフィマスク。 - 前記基板上に配置され、前記インダイ領域及び前記フレーム領域の隣接部分を有するダイフレームインターフェース領域をさらに備え、前記ダイフレームインターフェース領域は、下層上に配置される上層を有し、前記上層は、前記フレーム領域の前記吸収体層と同じ材料を含み、前記下層は、前記インダイ領域の前記パターン形成されたシフタ材料の層と同じ材料を含む、
請求項1に記載のリソグラフィマスク。 - 前記基板は、前記パターン形成されたシフタ層の前記フィーチャ間の位置にリセスされる、
請求項1又は2に記載のリソグラフィマスク。 - 前記パターン形成されたシフタ材料の前記フィーチャの前記側壁は、その上に側壁材料を有し、前記側壁材料は、前記吸収体層と同じ材料を含む、
請求項1から3のいずれか一項に記載のリソグラフィマスク。 - 前記基板は、石英である、
請求項1から4のいずれか一項に記載のリソグラフィマスク。 - 前記吸収体層は、クロムである、
請求項1から5のいずれか一項に記載のリソグラフィマスク。 - 前記パターン形成されたシフタ層の前記フィーチャの最上面は、前記ダイフレームインターフェース領域のフィーチャの最上面と異なり、かつ前記フレーム領域の前記フィーチャの最上面と異なる高さを有し、前記ダイフレームインターフェース領域の前記フィーチャの前記最上面の前記高さは、前記フレーム領域の前記フィーチャの前記最上面の前記高さと異なる、
請求項2に記載のリソグラフィマスク。 - シフタ層は、MoSi、SiN、SiON、MoSiN及びMoSiONから成る群から選択される材料を含む、
請求項1から7のいずれか一項に記載のリソグラフィマスク。 - フォトマスクを製造する方法であって、
基板上にシフタ層を形成する段階と、
前記シフタ層上に第1のパターン形成されたレジスト層を形成する段階と、
前記レジスト層により露出される前記シフタ層の領域を除去することによりパターン形成されたシフタ層を形成する段階であって、前記パターン形成されたシフタ層は、側壁を有するフィーチャを含む、段階と、
前記パターン形成されたシフタ層上と、前記基板上とに吸収体層を形成する段階と、
前記基板上に直接第1の部分と、前記パターン形成されたシフタ層の部分上に第2の部分とを有するパターン形成された吸収体層を形成すべく前記吸収体層をパターン形成する段階と
を備える方法。 - 前記シフタ層の前記フィーチャの前記側壁は、傾斜がつけられている、
請求項9に記載の方法。 - 前記吸収体層をパターン形成する段階は、前記吸収体層をエッチングする段階を有し、前記エッチングする段階は、前記パターン形成されたシフタ層の前記フィーチャの前記側壁に隣接する吸収体材料の側壁スペーサを残す、
請求項9又は10に記載の方法。 - 前記吸収体材料の前記側壁スペーサを除去する段階をさらに備える、
請求項11に記載の方法。 - 前記吸収体材料の前記側壁スペーサを除去する段階の間に前記基板をリセスする段階をさらに備える、
請求項12に記載の方法。 - 前記基板上に前記シフタ層を形成する段階は、石英基板上に前記シフタ層を形成する段階を有する、
請求項9から13のいずれか一項に記載の方法。 - フォトマスクを製造する方法であって、
基板上にシフタ層を形成する段階と、
前記シフタ層上にハードマスク層を形成する段階と、
前記ハードマスク層上に第1のパターン形成されたレジスト層を形成する段階と、
前記レジスト層により露出される前記ハードマスク層の領域を除去することによりパターン形成されたハードマスク層を形成する段階と、
前記ハードマスク層により露出される前記シフタ層の領域を除去することによりパターン形成されたシフタ層を形成する段階と、
前記パターン形成されたハードマスク層を除去する段階と、
前記ハードマスク層を除去する段階に続いて、前記パターン形成されたシフタ層上と、前記基板上とに吸収体層を形成する段階と、
前記基板上に直接第1の部分と、前記パターン形成されたシフタ層の部分上に第2の部分とを有するパターン形成された吸収体層を形成すべく前記吸収体層をパターン形成する段階と
を備える方法。 - 前記シフタ層のフィーチャの側壁は、傾斜がつけられている、
請求項15に記載の方法。 - 前記吸収体層を除去する段階は、前記吸収体層をエッチングする段階を有し、前記エッチングする段階は、前記シフタ層のフィーチャの側壁に隣接する吸収体材料の側壁スペーサを残す、
請求項15又は16に記載の方法。 - 前記吸収体材料の前記側壁スペーサを除去する段階をさらに備える、
請求項17に記載の方法。 - 前記吸収体材料の前記側壁スペーサを除去する段階の間に前記基板をリセスする段階をさらに有する、
請求項18に記載の方法。 - 前記基板上に前記シフタ層を形成する段階は、石英基板上に前記シフタ層を形成する段階を備える、
請求項15から19のいずれか一項に記載の方法。
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US10867853B2 (en) * | 2016-05-27 | 2020-12-15 | Intel Corporation | Subtractive plug and tab patterning with photobuckets for back end of line (BEOL) spacer-based interconnects |
CN110337715B (zh) | 2016-12-23 | 2023-08-25 | 英特尔公司 | 高级光刻和自组装装置 |
US11462436B2 (en) | 2017-11-30 | 2022-10-04 | Intel Corporation | Continuous gate and fin spacer for advanced integrated circuit structure fabrication |
US10707133B2 (en) | 2017-11-30 | 2020-07-07 | Intel Corporation | Trench plug hardmask for advanced integrated circuit structure fabrication |
US10796968B2 (en) | 2017-11-30 | 2020-10-06 | Intel Corporation | Dual metal silicide structures for advanced integrated circuit structure fabrication |
WO2019108237A1 (en) | 2017-11-30 | 2019-06-06 | Intel Corporation | Fin patterning for advanced integrated circuit structure fabrication |
DE102018126911A1 (de) | 2017-11-30 | 2019-06-06 | Intel Corporation | Gate-Schnitt und Finnentrimmisolation für fortschrittliche Integrierter-Schaltkreis-Struktur-Fertigung |
US10734379B2 (en) | 2017-11-30 | 2020-08-04 | Intel Corporation | Fin end plug structures for advanced integrated circuit structure fabrication |
US10796951B2 (en) | 2017-11-30 | 2020-10-06 | Intel Corporation | Etch-stop layer topography for advanced integrated circuit structure fabrication |
US10756204B2 (en) | 2017-11-30 | 2020-08-25 | Intel Corporation | Fin trim isolation with single gate spacing for advanced integrated circuit structure fabrication |
US11899357B2 (en) | 2021-05-17 | 2024-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Lithography mask |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07219203A (ja) * | 1994-01-27 | 1995-08-18 | Fujitsu Ltd | 位相シフトマスクとその製造方法 |
JP2006171335A (ja) * | 2004-12-15 | 2006-06-29 | Samsung Electronics Co Ltd | 位相シフトマスク及びパターン形成方法 |
JP2010048860A (ja) * | 2008-08-19 | 2010-03-04 | Fujitsu Microelectronics Ltd | ハーフトーン位相シフトマスクの製造方法及び半導体装置の製造方法 |
JP2011215197A (ja) * | 2010-03-31 | 2011-10-27 | Hoya Corp | フォトマスク及びその製造方法 |
US20120164563A1 (en) * | 2010-12-23 | 2012-06-28 | Chang Ju Choi | High resolution phase shift mask |
CN103163726A (zh) * | 2011-12-09 | 2013-06-19 | 中国科学院微电子研究所 | 一种制作用于极紫外光刻的铬侧墙衰减型移相掩模的方法 |
JP2014211502A (ja) * | 2013-04-17 | 2014-11-13 | アルバック成膜株式会社 | 位相シフトマスクの製造方法および位相シフトマスク |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5382483A (en) * | 1992-01-13 | 1995-01-17 | International Business Machines Corporation | Self-aligned phase-shifting mask |
JP3339649B2 (ja) * | 1993-07-30 | 2002-10-28 | 大日本印刷株式会社 | ハーフトーン位相シフトフォトマスク用ブランクスの製造方法、及び、ハーフトーン位相シフトフォトマスクの製造方法 |
US5786114A (en) * | 1997-01-10 | 1998-07-28 | Kabushiki Kaisha Toshiba | Attenuated phase shift mask with halftone boundary regions |
US7264415B2 (en) * | 2004-03-11 | 2007-09-04 | International Business Machines Corporation | Methods of forming alternating phase shift masks having improved phase-shift tolerance |
KR101096248B1 (ko) * | 2009-05-26 | 2011-12-22 | 주식회사 하이닉스반도체 | 극자외선 위상반전마스크의 제조 방법 |
-
2016
- 2016-03-31 US US16/069,383 patent/US20190025694A1/en not_active Abandoned
- 2016-03-31 WO PCT/US2016/025269 patent/WO2017171794A1/en active Application Filing
- 2016-03-31 JP JP2018533733A patent/JP6714801B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07219203A (ja) * | 1994-01-27 | 1995-08-18 | Fujitsu Ltd | 位相シフトマスクとその製造方法 |
JP2006171335A (ja) * | 2004-12-15 | 2006-06-29 | Samsung Electronics Co Ltd | 位相シフトマスク及びパターン形成方法 |
JP2010048860A (ja) * | 2008-08-19 | 2010-03-04 | Fujitsu Microelectronics Ltd | ハーフトーン位相シフトマスクの製造方法及び半導体装置の製造方法 |
JP2011215197A (ja) * | 2010-03-31 | 2011-10-27 | Hoya Corp | フォトマスク及びその製造方法 |
US20120164563A1 (en) * | 2010-12-23 | 2012-06-28 | Chang Ju Choi | High resolution phase shift mask |
CN103163726A (zh) * | 2011-12-09 | 2013-06-19 | 中国科学院微电子研究所 | 一种制作用于极紫外光刻的铬侧墙衰减型移相掩模的方法 |
JP2014211502A (ja) * | 2013-04-17 | 2014-11-13 | アルバック成膜株式会社 | 位相シフトマスクの製造方法および位相シフトマスク |
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