JP2019508256A5 - - Google Patents

Download PDF

Info

Publication number
JP2019508256A5
JP2019508256A5 JP2018546883A JP2018546883A JP2019508256A5 JP 2019508256 A5 JP2019508256 A5 JP 2019508256A5 JP 2018546883 A JP2018546883 A JP 2018546883A JP 2018546883 A JP2018546883 A JP 2018546883A JP 2019508256 A5 JP2019508256 A5 JP 2019508256A5
Authority
JP
Japan
Prior art keywords
range
laser
laser radiation
periodic arrangement
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018546883A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019508256A (ja
Filing date
Publication date
Priority claimed from GBGB1603991.9A external-priority patent/GB201603991D0/en
Application filed filed Critical
Publication of JP2019508256A publication Critical patent/JP2019508256A/ja
Publication of JP2019508256A5 publication Critical patent/JP2019508256A5/ja
Pending legal-status Critical Current

Links

JP2018546883A 2016-03-08 2017-03-08 セラミック表面における光電子収量及び／又は二次電子収量を低減する方法並びに対応する装置及び製品 Pending JP2019508256A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1603991.9 2016-03-08
GBGB1603991.9A GB201603991D0 (en) 2016-03-08 2016-03-08 Processing method and apparatus
PCT/GB2017/050621 WO2017153750A1 (en) 2016-03-08 2017-03-08 Method of reducing photoelectron yield and/or secondary electron yield of a ceramic surface; corresponding apparatus and product

Publications (2)

Publication Number Publication Date
JP2019508256A JP2019508256A (ja) 2019-03-28
JP2019508256A5 true JP2019508256A5 (cg-RX-API-DMAC7.html) 2020-02-06

Family

ID=55859181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018546883A Pending JP2019508256A (ja) 2016-03-08 2017-03-08 セラミック表面における光電子収量及び／又は二次電子収量を低減する方法並びに対応する装置及び製品

Country Status (11)

Country Link
US (1) US10994369B2 (cg-RX-API-DMAC7.html)
EP (1) EP3397421A1 (cg-RX-API-DMAC7.html)
JP (1) JP2019508256A (cg-RX-API-DMAC7.html)
KR (1) KR20190015180A (cg-RX-API-DMAC7.html)
CN (1) CN109070266B (cg-RX-API-DMAC7.html)
AU (1) AU2017231862A1 (cg-RX-API-DMAC7.html)
BR (1) BR112018067765A2 (cg-RX-API-DMAC7.html)
CA (1) CA3015159A1 (cg-RX-API-DMAC7.html)
GB (1) GB201603991D0 (cg-RX-API-DMAC7.html)
RU (1) RU2018135083A (cg-RX-API-DMAC7.html)
WO (1) WO2017153750A1 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119376192A (zh) * 2019-02-19 2025-01-28 Asml控股股份有限公司 激光粗加工：工程化突节顶部的粗糙度
CN111215399A (zh) * 2020-02-27 2020-06-02 长安大学 一种惰性离子清洗及热处理降低二次电子发射系数的方法

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834667A (cg-RX-API-DMAC7.html) * 1971-09-08 1973-05-21
JPH0640797A (ja) 1992-04-23 1994-02-15 Sumitomo Electric Ind Ltd ダイヤモンドの加工方法
JPH05325780A (ja) * 1992-05-14 1993-12-10 Nec Corp マイクロ波管用コレクタ電極の製造方法
US6518540B1 (en) * 1998-06-16 2003-02-11 Data Storage Institute Method and apparatus for providing ablation-free laser marking on hard disk media
JP4115051B2 (ja) * 1998-10-07 2008-07-09 キヤノン株式会社 電子線装置
US7838794B2 (en) 1999-12-28 2010-11-23 Gsi Group Corporation Laser-based method and system for removing one or more target link structures
AU2001251172A1 (en) 2000-03-30 2001-10-15 Electro Scientific Industries, Inc. Laser system and method for single pass micromachining of multilayer workpieces
JP4578710B2 (ja) * 2001-03-28 2010-11-10 独立行政法人科学技術振興機構 フェムト秒レーザー照射による分極反転構造の作成方法
GB0112234D0 (en) 2001-05-18 2001-07-11 Welding Inst Surface modification
JP2003303561A (ja) * 2002-04-10 2003-10-24 Canon Inc スペーサ、スペーサの製造方法および電子線装置
US9409254B2 (en) 2005-09-30 2016-08-09 Lawrence Livermore National Security, Llc Ablation layers to prevent pitting in laser peening
US8846551B2 (en) * 2005-12-21 2014-09-30 University Of Virginia Patent Foundation Systems and methods of laser texturing of material surfaces and their applications
US7628865B2 (en) 2006-04-28 2009-12-08 Asml Netherlands B.V. Methods to clean a surface, a device manufacturing method, a cleaning assembly, cleaning apparatus, and lithographic apparatus
US20080299408A1 (en) 2006-09-29 2008-12-04 University Of Rochester Femtosecond Laser Pulse Surface Structuring Methods and Materials Resulting Therefrom
US20080216926A1 (en) 2006-09-29 2008-09-11 Chunlei Guo Ultra-short duration laser methods for the nanostructuring of materials
JP5774277B2 (ja) 2007-01-23 2015-09-09 イムラ アメリカ インコーポレイテッド 超短レーザ微細テクスチャ印刷
DE102007018402A1 (de) * 2007-04-17 2008-10-23 Panasonic Electric Works Europe Ag Verfahren zum Einbringen einer Struktur in eine Oberfläche eines transparenten Werkstücks
WO2008156620A1 (en) * 2007-06-12 2008-12-24 Technolines, Llc High speed and high power laser scribing methods and systems
JP2010050138A (ja) * 2008-08-19 2010-03-04 Canon Machinery Inc 微細周期構造形成方法
CN102186672B (zh) 2008-10-22 2015-08-26 东洋制罐株式会社 具有微细周期结构的层压结构体
CA2756840C (en) 2009-03-30 2018-10-23 Boegli-Gravures S.A. Method and device for structuring the surface of a hard material coated solid body by means of a laser
US20110089039A1 (en) 2009-10-16 2011-04-21 Michael Nashner Sub-Surface Marking of Product Housings
EP2336810A1 (de) 2009-12-18 2011-06-22 Boegli-Gravures S.A. Verfahren und Vorrichtung zur Erzeugung von Farbmustern mittels Beugungsgitter
US8451873B2 (en) 2010-02-11 2013-05-28 Electro Scientific Industries, Inc. Method and apparatus for reliably laser marking articles
US8379678B2 (en) 2010-02-11 2013-02-19 Electro Scientific Industries, Inc. Method and apparatus for reliably laser marking articles
US8743165B2 (en) 2010-03-05 2014-06-03 Micronic Laser Systems Ab Methods and device for laser processing
WO2011123515A1 (en) 2010-03-30 2011-10-06 Sun Chemical Corporation A reversible piezochromic system, methods of making a reversible piezochromic system, and methods of using a reversible piezochromic system
US8389895B2 (en) 2010-06-25 2013-03-05 Electro Scientifix Industries, Inc. Method and apparatus for reliably laser marking articles
KR102088722B1 (ko) * 2010-07-12 2020-03-17 로핀-시나르 테크놀로지스 엘엘씨 레이저 필라멘테이션에 의한 재료 가공 방법
GB201011720D0 (en) 2010-07-13 2010-08-25 Univ Southampton Controlling the colours of metals: bas-relief and intaglio metamaterials
RU2447012C1 (ru) 2010-10-28 2012-04-10 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) Способ получения наноструктурированной поверхности сталей методом лазерно-плазменной обработки
US20130083500A1 (en) 2011-09-30 2013-04-04 Christopher D. Prest Interferometric color marking
JP2013111595A (ja) * 2011-11-28 2013-06-10 Shin Etsu Polymer Co Ltd 金型加工方法およびエンブレムの形成方法
EP2825347B1 (fr) 2012-03-12 2020-07-29 Rolex Sa Procédé de gravage d'un élément d'horlogerie
CN103304276B (zh) * 2012-03-14 2015-11-25 比亚迪股份有限公司 一种陶瓷基板表面金属化的方法及一种大功率led底座
PL222531B1 (pl) 2012-04-05 2016-08-31 Wrocławskie Centrum Badań Eit + Spółka Z Ograniczoną Sposób i system do kolorowego znakowania metali
US20140083984A1 (en) 2012-09-23 2014-03-27 Timothy Gerke Formation Of Laser Induced Periodic Surface Structures (LIPSS) With Picosecond Pulses
FR2996487B1 (fr) * 2012-10-08 2014-11-28 Snecma Procede de marquage en surface d'une piece de moteur a turbine a gaz par une representation graphique predefinie
GB201221184D0 (en) 2012-11-24 2013-01-09 Spi Lasers Uk Ltd Method for laser marking a metal surface with a desired colour
KR20150097475A (ko) * 2012-12-20 2015-08-26 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 미세기계가공에 의한 이미지 형성 방법
US9413137B2 (en) 2013-03-15 2016-08-09 Nlight, Inc. Pulsed line beam device processing systems using laser diodes
JP6079505B2 (ja) * 2013-08-26 2017-02-15 三菱マテリアル株式会社 接合体及びパワーモジュール用基板
CN103586578B (zh) 2013-11-14 2016-08-31 苏州图森激光有限公司 一种材料表面激光黑化或着色方法
FR3019074B1 (fr) * 2014-04-01 2016-04-15 Snecma Procede de marquage en surface d'une piece mecanique par une representation graphique predefinie avec effet de type holographique
GB2527291B (en) 2014-06-13 2021-01-13 Res & Innovation Uk Apparatus and methods relating to reduced photoelectron yield and/or secondary electron yield
ES2564054B1 (es) * 2014-09-16 2016-12-27 Consejo Superior De Investigaciones Científicas (Csic) Recubrimiento anti-multipactor
EP3031785B1 (de) * 2014-12-12 2018-10-17 Schott AG Verfahren zur herstellung eines glaskeramikelements mit strukturierter beschichtung
CN104741852B (zh) * 2015-03-19 2016-05-25 江苏大学 一种船用甲板焊接试验用可调式夹具
EP3274560A1 (en) * 2015-03-27 2018-01-31 Siemens Aktiengesellschaft Hybrid ceramic matrix composite components for gas turbines
JP6483247B2 (ja) * 2015-04-21 2019-03-13 トーカロ株式会社 溶射皮膜被覆部材の製造方法
BR112017027953A2 (pt) * 2015-06-24 2018-08-28 University Of Dundee método e aparelho para escurecimento, superfície tratada a laser, e, dispositivo.

Similar Documents

Publication Publication Date Title
RU2018102523A (ru) Способ и устройство для уменьшения фотоэлектронного выхода и/или выхода вторичных электронов
JP6220775B2 (ja) ピコ秒レーザパルスを用いた高いパルス繰り返し周波数でのレーザダイレクトアブレーション
Jasim et al. Process development and monitoring in stripping of a highly transparent polymeric paint with ns-pulsed fiber laser
JP2013519671A5 (cg-RX-API-DMAC7.html)
US9335637B2 (en) Laser-produced plasma EUV source with reduced debris generation utilizing predetermined non-thermal laser ablation
JP2018532595A5 (cg-RX-API-DMAC7.html)
JP2014129608A5 (cg-RX-API-DMAC7.html)
WO2015139636A1 (zh) 激光尾波场加速器及产生高亮度阿秒光脉冲的方法
Lickschat et al. Ablation of steel using picosecond laser pulses in burst mode
JP2007516083A5 (cg-RX-API-DMAC7.html)
JP2019508256A5 (cg-RX-API-DMAC7.html)
US11583957B2 (en) Laser processing method and laser processing apparatus
RU2018135083A (ru) Способ обработки и устройство
JP2012153977A5 (cg-RX-API-DMAC7.html)
Abdul Razab et al. Estimation of threshold fluence, absorption coefficient and thermal loading of car coated substrate in laser paint removal
Oh et al. A numerical study on ultra-short pulse laser-induced damage on dielectrics using the Fokker–Planck equation
NL2007473C2 (en) Method and apparatus for the generation of euv radiation from a gas discharge plasma.
US12005523B2 (en) Process for nanostructuring the surface of a material by laser
DE102020007017B4 (de) Verfahren zur Entfernung von Schmutzablagerungen an wenigstens einer geometrischen und mittels einer Mikrotechnik und/oder Nanotechnik hergestellten Struktur wenigstens eines Körpers und Verwendung eines ultrakurz gepulsten Lasers mit Pulsen im Burst-Modus
Chen et al. Laser-induced nanostructures on the zinc surface
GYOBU et al. Development of High Speed Selective Laser Paint Stripping Technology on Composite Material with Friendly Environment for Operators
WO2020038925A1 (en) Method for producing an implant, and implant produced by said method
EP3202523B1 (en) Overlay material for laser shock peening
Lima et al. Elimination of Lubricants from Aluminum Cold Rolled Products Using Short Laser Pulses
CN119855795A (zh) 具有功能化的表面的透明部件