JP2019199646A5 - - Google Patents

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Publication number
JP2019199646A5
JP2019199646A5 JP2018096684A JP2018096684A JP2019199646A5 JP 2019199646 A5 JP2019199646 A5 JP 2019199646A5 JP 2018096684 A JP2018096684 A JP 2018096684A JP 2018096684 A JP2018096684 A JP 2018096684A JP 2019199646 A5 JP2019199646 A5 JP 2019199646A5
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Japan
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yoke
fixed
cathode
field distribution
magnetic field
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JP2018096684A
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English (en)
Japanese (ja)
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JP2019199646A (ja
JP7226759B2 (ja
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JP2018096684A 2018-05-18 2018-05-18 スパッタ装置用カソード Active JP7226759B2 (ja)

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Application Number Priority Date Filing Date Title
JP2018096684A JP7226759B2 (ja) 2018-05-18 2018-05-18 スパッタ装置用カソード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018096684A JP7226759B2 (ja) 2018-05-18 2018-05-18 スパッタ装置用カソード

Publications (3)

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JP2019199646A JP2019199646A (ja) 2019-11-21
JP2019199646A5 true JP2019199646A5 (enExample) 2021-07-26
JP7226759B2 JP7226759B2 (ja) 2023-02-21

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JP2018096684A Active JP7226759B2 (ja) 2018-05-18 2018-05-18 スパッタ装置用カソード

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JP (1) JP7226759B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7344929B2 (ja) * 2021-06-14 2023-09-14 キヤノントッキ株式会社 成膜装置、成膜方法、及び電子デバイスの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100072061A1 (en) * 2007-06-01 2010-03-25 Yamaguchi University Sputtering apparatus for forming thin film
US8663431B2 (en) * 2008-05-15 2014-03-04 Yamaguchi University Sputtering system for depositing thin film and method for depositing thin film

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