JP2019197673A - Light emitting device, lighting device, and manufacturing method of light emitting device - Google Patents

Abstract

To inhibit damage of a sealing material.SOLUTION: A light emitting device 1 has a case 2 provided with a housing recessed part 20, and an LED mounting substrate 22 is disposed on a bottom surface 24 of the housing recessed part 20. The light emitting device 1 includes: a translucent sealing material 50 which fills the housing recessed part 20 and seals the LED mounting substrate 22; a translucent protective cover 4 provided on a surface 50A of the sealing material 50; and a support member 80 which is provided in the housing recessed part 20 and supports the protective cover 4. The support member 80 and the sealing material 50 have thermal expansion coefficients and elasticity moduli which are substantially equal between these components. The protective cover 4 is provided and forms a gap δ with the housing recessed part 20 while supported by the support member 80. The gap δ is filled with an adhesive 12 or the sealing material 50 having flexibility. The protective cover 4 is coupled to the housing recessed part 20 by the adhesive 12.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a light emitting device, a lighting device, and a method for manufacturing the light emitting device.

  Conventionally, a light-emitting device in which a substrate on which a light-emitting element is mounted is packaged in a package having an open top surface is known (see, for example, Patent Document 1, Patent Document 2, and Patent Document 3). Further, in Patent Document 3, the inside of the package is sealed with a sealing material, a notch is provided in the inner wall of the package along the upper surface opening, and a translucent plate such as a glass plate is fitted into the notch and fixed. A technique for sealing the inside of a package along the side surface of the translucent plate is shown.

JP, 2006-103636, A JP 2013-45606 A JP 2011-108889 A

  In the technique of Patent Document 3, when the sealing material inside the package and the translucent plate fitted and fixed in the upper surface opening of the package are in close contact with each other, the sealing material is used when the light emitting device is manufactured or used. Damage such as cracks may occur.

  An object of the present invention is to provide a light-emitting device, a lighting device, and a method for manufacturing the light-emitting device that can suppress damage to a sealing material.

  The present invention includes a mounting substrate on which a light emitting element is mounted, and a case provided with a housing recess for housing the mounting substrate, and the housing includes the housing substrate disposed on a bottom surface of the housing recess. A light-transmitting sealing material that fills the recess and seals the mounting substrate, a light-transmitting protection member provided on the surface of the sealing material, and the protection recess provided in the housing recess. A support member that supports the member, wherein the support member and the sealing material have substantially the same thermal expansion coefficient and elastic modulus, and the protection member is supported by the support member in a state of being protected. A gap is provided between the member and the housing recess, and the gap is filled with a flexible adhesive or the flexible sealing material, and the adhesive or the sealing material The protective member is coupled to the receiving recess by The features.

  According to the present invention, in the light emitting device, the support member is a columnar member extending from a bottom surface of the housing recess.

  In the light-emitting device according to the present invention, the support member has a frame shape on which the support member is placed, and a recess that connects the inside and the outside of the frame is provided at an edge portion that contacts the protection member. It is characterized by that.

  The present invention is characterized in that, in the light emitting device, the gap is provided between the protective member and the housing recess.

  According to the present invention, in the light emitting device, a wiring hole through which an electrical wiring electrically connected to the mounting board passes is penetrated in a bottom surface of the housing recess, and the mounting board closes the wiring hole. And

  According to the present invention, in the light emitting device, an insertion fitting that is hooked to a mounting surface of the mounting substrate and is electrically connected to the mounting surface by soldering is provided at a tip portion of the electric wiring. It is characterized by.

  The present invention provides an illuminating device characterized in that any one of the light emitting devices described above is provided in a light source.

  The present invention includes a mounting board on which a light emitting element is mounted, and a case provided with a housing recess for housing the mounting board, the mounting board is disposed on a bottom surface of the housing recess, and the mounting board is stored in the housing. In the method of manufacturing a light emitting device, which is sealed with a light-transmitting sealing material filled in the recess, and the light-transmitting protective member is disposed in the opening of the housing recess, the protection member is heated with the sealing material and the heat. In a state where it is supported by a support member having substantially the same expansion coefficient and elastic modulus, and is disposed with a gap between it and the accommodation recess, the sealing material of the accommodation recess is cured and sealed, and is flexible. The gap is filled with an adhesive having a property, or the gap is filled in the sealing with the flexible sealing material.

According to the present invention, when the light emitting device is manufactured or used for lighting, the force when the sealing material and the protective member are expanded and contracted by heat is the adhesive in the gap between the protective member and the housing recess. Is alleviated by. Thereby, generation | occurrence | production of damages, such as a crack which arises in the said sealing material, when a protection member peels from a sealing material is suppressed.
In the present invention, if the protective member occupies most of the housing recess, the airtightness can be significantly improved, and the light emitting element can be prevented from being deteriorated by the outside air.

It is a perspective view which shows the structure of the light-emitting device which concerns on embodiment of this invention. 4A and 4B are four-view diagrams illustrating a configuration of a light-emitting device, in which FIG. 3A is a front view, FIG. 3B is a side view, FIG. 3C is a rear view, and FIG. It is a figure which shows typically the structure of the III-III cross section of FIG. 2 (A). It is a disassembled perspective view of a light-emitting device. It is a top view which shows the structure of the electrical circuit provided in the LED mounting board. It is a perspective view which shows the structure of an insertion metal fitting. It is a figure which shows the manufacturing process of a light-emitting device. It is a figure which shows the manufacturing process of a light-emitting device. It is a perspective view which shows the structure of the explosion-proof type illuminating device which concerns on embodiment of this invention. It is a disassembled perspective view of the light-emitting device which concerns on the modification of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing a configuration of a light emitting device 1 according to the present embodiment. 2A and 2B are four views showing the structure of the light-emitting device 1. FIG. 2A is a front view, FIG. 2B is a side view, FIG. 2C is a rear view, and FIG. It is.
The light emitting device 1 is a device used as a light source of various lighting devices, and includes a case 2 and a transparent protective cover 4 as shown in FIGS. 1 and 2. The light emitting device 1 of the present embodiment is configured as an apparatus having an explosion-proof structure, and can be used in various plants and warehouses where flammable gas can be generated.

The case 2 is a container body having a rectangular parallelepiped shape with a small thickness and having a substantially rectangular accommodating recess 20 (FIG. 4) that emits light, and is a substance having excellent strength, corrosion resistance, and thermal conductivity (for example, an aluminum alloy). ). The case 2 is subjected to a surface treatment such as alumite treatment in order to improve the corrosion resistance. Further, the open end of the housing recess 20 serves as the emission opening 6 of the light emitting device 1, and the irradiation light is emitted from the emission opening 6.
A plurality of (four in the illustrated example) fixing pieces 8 projecting laterally are integrally provided on the outer surface of the case 2. Each of the fixing pieces 8 is formed with a screw hole 10 penetrating the front and back surfaces of the case 2, and a fixing screw is passed through each of the screw holes 10 to fix the light emitting device 1 to an illumination device or the like.

  As shown in FIG. 2C, a plurality of (two in the illustrated example) wiring holes 13 that are through holes are formed in the back surface 2B of the case 2, and the electric potential of the high potential line and the low potential line is formed. The wirings 14 are respectively passed through the wiring holes 13. These wiring holes 13 are hermetically sealed without gaps by being filled with the filler 16. For the filler 16, an insulating material is preferably used, and in this embodiment, an epoxy resin is used. In addition, you may provide the wiring hole 13 for connecting a ground wire in the case 2 separately.

The protective cover 4 is a member made of a hard material (for example, a glass material) having translucency and suitable for protection against physical contact, has a rectangular plate shape, and is accommodated It arrange | positions at the open end (namely, output opening 6) of the recessed part 20. As shown in FIG.
The protective cover 4 is formed in a substantially similar shape having a size slightly smaller than the planar view shape of the open end of the housing recess 20, and a gap δ is formed between the protection cover 4 and the housing recess 20 over the entire circumference of the protection cover 4. It is arranged with a gap. A gap δ between the edge 4A of the protective cover 4 and the housing recess 20 is filled with a flexible adhesive 12, and is hermetically sealed by the adhesive 12. The adhesive 12 is sealed with the protective cover 4. Is held in the case 2 so as not to fall off.

Next, the internal structure of the light emitting device 1 will be described.
FIG. 3 is a diagram schematically showing the configuration of the III-III cross section of FIG. FIG. 4 is an exploded perspective view of the light emitting device 1.
As shown in FIGS. 3 and 4, a housing recess 20 is provided on the upper surface 2 </ b> A of the case 2. The housing recess 20 has a shape that is recessed in a columnar shape (in the present embodiment, a rectangular parallelepiped shape) from the upper surface 2A toward the back surface 2B of the case 2, and the inner side surface 20A of the housing recess 20 is the top surface 2A and the back surface 2B. The exit opening 6 and the bottom surface 24 have substantially the same size and shape. An LED mounting substrate 22 that is a light source of the light emitting device 1 is fixed to the bottom surface 24.

  The LED mounting substrate 22 is a substantially rectangular member made of ceramic having excellent electrical insulation and thermal conductivity in a plan view, and an electric circuit including a large number of LEDs 28 and electronic circuit components such as fuses and varistors on the surface thereof. Is provided. The back surface of the LED mounting substrate 22 is thermally coupled to the bottom surface 24 of the housing recess 20, and the heat generated by the LEDs 28 is transmitted from the LED mounting substrate 22 to the case 2 to be radiated.

  As shown in FIG. 3, the inside of the housing recess 20 is sealed with a sealing material 50 filled to a predetermined depth without a gap, and the mounting components (LED 28 and the like) of the LED mounting substrate 22 are sealed by the sealing material 50. ) Is protected. The sealing material 50 is made of a light-transmitting material that efficiently transmits the light of the LED 28 and is cured by heating. In this embodiment, a silicone resin is used.

  In the housing recess 20, the surface 50 </ b> A of the sealing material 50 is substantially flat, and the protective cover 4 is provided in contact with the surface 50 </ b> A of the sealing material 50.

Specifically, in the accommodation recess 20, support members 80 having a height D for supporting the protective cover 4 are provided at the four corners. Each support member 80 has the same size and shape, and the tip portion 80A is formed flat, and the protective cover 4 is directly placed on each tip portion 80A. These support members 80 are molded from the same material as the sealing material 50, and the thermal expansion coefficient and elastic modulus of the support member 80 are equal to those of the sealing material 50.
Note that the shape of the distal end portion 80A of the support member 80 may be a curved shape that bulges toward the emission opening 6, and the contact area between the support member 80 and the protective cover 4 can be reduced. Any material can be used for the support member 80 as long as it has substantially the same thermal expansion coefficient and elastic modulus as the sealing material 50.

  The sealing material 50 is filled in the housing recess 20 until at least the height D of the support member 80, that is, the height at which the back surface 4S2 of the protective cover 4 contacts the sealing material 50, and is cured by heating.

  A phosphor layer 52 is provided in the housing recess 20 so as to cover the upper side of each LED 28. The phosphor layer 52 is a layered member made of a phosphor that emits fluorescence upon receiving light from the LED 28, and is formed in a thin film on the back surface 4 </ b> S <b> 2 of the protective cover 4 in this embodiment.

  As described above, the protective cover 4 is disposed with a gap δ provided between the protective cover 4 and the housing recess 20 of the case 2 over the entire circumference of the edge 4A. As described above, the gap δ is filled with the adhesive 12, and the protective cover 4 is held in the housing recess 20 of the case 2 so as not to fall off by the adhesive 12 and the sealing material 50. For the adhesive 12, a material having flexibility in the cured state in addition to the adhesiveness is used, and in this embodiment, a silicone sealant is used. And since the adhesive agent 12 has a softness | flexibility, the damage of the sealing material 50 is suppressed, but this is mentioned later.

FIG. 5 is a plan view showing the configuration of the electric circuit 23 provided on the LED mounting substrate 22.
As shown in the figure, the electric circuit 23 includes a wiring pattern 26, and a plurality of electronic circuit components such as LEDs 28 are connected to the wiring pattern 26.
The LED 28 is a bare chip type light emitting element, and emits light of a predetermined color (blue in this embodiment). Each of the LEDs 28 is arranged in a grid at a predetermined interval from each other. In this arrangement, seven LEDs 28 arranged in series constitute one series circuit 30A, and eleven series circuits 30A arranged in parallel constitute one parallel circuit 30B.

As shown in FIG. 5, the wiring pattern 26 is provided with a pair of wiring connection lands 32 across the parallel circuit 30B. The wiring connection land 32 is a conductive part to which the electric wiring 14 is connected. The wiring connection land 32 is formed by a through hole 34A formed through the LED mounting substrate 22 and a conductive portion 34B such as a copper foil provided around the through hole 34A.
As shown in FIG. 4, the through hole 34 </ b> A of the wiring connection land 32 is provided at a position corresponding to the wiring hole 13 of the case 2. And each electric wiring 14 of a high potential line and a low potential line is inserted into the wiring hole 13 from the back surface 2B of the case 2, and each tip part 14A passes through the through hole 34A of the wiring connection land 32 and the LED mounting board 22 is inserted. And is electrically connected to the conductive portion 34B of the wiring connection land 32 by soldering.

FIG. 6 is a perspective view showing a configuration of the insertion fitting 36.
In the present embodiment, the electrical wiring 14 and the wiring connection land 32 are electrically connected using the insertion fitting 36.
More specifically, the tip portion 14A of the electrical wiring 14 is in a state in which the insulating film covering the surface is removed, and the conductive wire material 40, which is a core material, is exposed over a length of about 5 mm. At the time of connection to 22, the insertion fitting 36 is attached to the conducting wire 40. The insertion metal fitting 36 is a conductive metal fitting that is inserted into the through hole 34 </ b> A from the back surface side of the LED mounting board 22, reaches the surface of the LED mounting board 22, and is caught by the wiring connection land 32. Specifically, as shown in FIG. 6, the insertion fitting 36 includes a wire rod holding portion 42 and a land engaging portion 44.

The wire holding portion 42 is a member that extends along the conductive wire 40 and sandwiches the conductive wire 40 with the plurality of claw portions 42A, and is inserted into the through hole 34A from the back surface side of the LED mounting substrate 22. The land engaging portion 44 has a barb 44 </ b> A provided at the tip of the wire rod holding part 42, and the barb 44 </ b> A is engaged by being hooked on the mounting surface of the LED mounting board 22, and the conductive part 34 </ b> B of the wiring connection land 32. Connected. The return 44A has a shape bent in a J-shape, is pulled out from the through hole 34A to the surface side of the LED mounting substrate 22 and engages so as not to be pulled out from the surface, and is soldered to the conductive portion 34B of the wiring connection land 32. Connected electrically.
By attaching the insertion fitting 36 to the distal end portion 14A of the electric wiring 14, when the light emitting device 1 is manufactured, the insertion fitting 36 is inserted from the back side of the LED mounting board 22 and is easily engaged with the wiring connection land 32. be able to.

  In the electrical connection structure between the electrical wiring 14 and the wiring connection land 32 using the insertion fitting 36, the tip end portion 14A, that is, the conductive wire 40 and the wire holding portion 42 of the electrical wiring 14 are insulated by the filler 16. As a result, the electrical insulation required for the explosion-proof structure is secured. Further, the LED mounting substrate 22 is also insulated by being sealed with a sealing material 50, and a so-called charging unit is not provided through a space.

7 and 8 are diagrams showing a manufacturing process of the light emitting device 1.
In the manufacture of the light emitting device 1, first, the LED mounting substrate 22 on which the electric circuit 23 including the LEDs 28 is mounted is manufactured (step S1). A die bond or a wire bond can be suitably used for mounting the LED 28.

  Next, the LED mounting substrate 22 is fixed to the bottom surface 24 of the housing recess 20 of the case 2 using the heat conductive adhesive 60 (step S2). The heat conductive adhesive 60 is an adhesive excellent in heat conductivity and fixed by heating. For example, a high heat conductive silicone-based adhesive is suitably used. In step S <b> 2, the LED mounting substrate 22 is fixed to the bottom surface 24, so that the wiring holes 13 on the back surface 2 </ b> B of the case 2 are blocked by the LED mounting substrate 22.

  Next, the insertion fitting 36 is attached to the distal end portion 14 </ b> A of the electric wiring 14, and the insertion fitting 36 is inserted into the wiring hole 13 from the back surface 2 </ b> B of the case 2 and inserted from the back surface side of the LED mounting substrate 22. Then, the insertion fitting 36 is engaged with the electric circuit 23 of the LED mounting substrate 22, and the insertion fitting 36 is connected to the electric circuit 23 by soldering (step S3). Thereafter, the wiring hole 13 is filled with the filler 16, and the filler 16 is hardened to be hermetically sealed (step S4). An epoxy resin that is cured by heating is used for the filler 16.

  Next, the support member 80 is fixed to the bottom surface 24 of the housing recess 20 (step S5). For fixing the support member 80, any fixing method such as adhesion or fitting can be used.

Then, the sealing material 50 is filled to the height D of the support member 80 in the housing recess 20 of the case 2 so that at least the back surface of the protective cover 4 contacts the sealing material 50 (step S6).
Next, the protective cover 4 in which the phosphor layer 52 is formed in advance on the back surface 4S2 is placed on the support member 80 such that a gap δ is provided between the entire circumference and the housing recess 20, and the housing is accommodated in that state. The sealing material 50 of the recess 20 is cured by heating, and the LED mounting substrate 22 is sealed (step S7). In step S7, when the protective cover 4 is placed on the sealing material 50, the extra sealing material 50 is released into the gap δ between the entire circumference of the protective cover 4 and the housing recess 20, and The layers are overlapped so as not to generate bubbles at the interface with the protective cover 4 to suppress light loss due to the bubbles.

  Finally, the adhesive 12 is filled in the gap δ around the entire circumference of the protective cover 4 and the adhesive 12 is cured, thereby coupling the protective cover 4 to the housing recess 20 so as not to drop off (step S8).

  According to this manufacturing method, since the protective cover 4 is supported by the support member 80, the protective cover 4 can be disposed at a predetermined position of the housing recess 20 while the sealing material 50 remains uncured. Thereby, in order to mount the protective cover 4 on the upper surface of the sealing material 50, it is not necessary to harden the sealing material 50, and the freedom degree of a manufacturing process is raised.

  In the above manufacturing process, since the wiring hole 13 is closed by the LED mounting substrate 22 in step S3, step S5 and subsequent steps are performed before the wiring hole 13 is closed by the filler 16 in step S4. The wiring hole 13 may be closed with the filler 16 at an appropriate timing.

  Here, in the structure of the light emitting device 1, the LED mounting substrate 22 is sealed with the sealing material 50, and the heat generated by the LED mounting substrate 22 is directly transmitted to the sealing material 50. For this reason, the sealing material 50 thermally expands due to heating during manufacture of the light-emitting device 1 (particularly, FIG. 8, step S7) and heat generation of the LED 28 during lighting, and contracts as the temperature decreases. Further, most of the receiving recess 20 is filled with the sealing material 50 without any gaps, and there is no space inside the receiving recess 20 to undergo deformation due to expansion and contraction of the sealing material 50. For this reason, when the sealing material 50 expands, the surface 50A of the sealing material 50 is bulged and deformed.

  At this time, for example, as in Patent Document 3 described above, if the protective cover 4 is fitted into the case 2 and fixed so as not to move, the force at the time of expansion and contraction of the sealing material 50 remains as it is. In addition, the sealing material 50 may be damaged. In particular, when the protective cover 4 is fixed to the surface 50A of the sealing material 50, the protective cover 4 cannot move. Therefore, when the sealing material 50 contracts, the protective cover 4 is attached to the surface 50A of the sealing material 50. This may cause cracks in the sealing material 50. Such damage to the sealing material 50 causes non-lighting due to disconnection of the wiring of the LED 28 and loss of light, leading to a reduction in efficiency.

  Further, in the present embodiment, the electrical circuit 23 is provided with a large number of LEDs 28 and these are arranged at a relatively narrow interval, so that heat generation per unit area is also increased. Specifically, the horizontal width La of the electric circuit 23 shown in FIG. 5 is about 65 mm, and the vertical width Lb is about 25 mm. The planar size of the LED 28 is about 1.0 mm × 1.5 mm. In the series circuit 30A, the LEDs 28 are arranged at an arrangement interval A1 of about 3 mm, and the series circuit 30A is arranged in parallel at an arrangement interval A2 of about 4 mm. Has been.

  Therefore, in the light emitting device 1 of the present embodiment, as described above, the protective cover 4 is coupled to the housing recess 20 of the case 2 by using the adhesive 12 that is a material having flexibility in the cured state in addition to the adhesiveness. is doing. As a result, the protective cover 4 can move in conjunction with the expansion and contraction of the sealing material 50 due to heat, and the protective cover 4 can maintain the connection with the housing recess 20 by the flexibility of the adhesive 12. As a result, the force applied to the sealing material 50 itself as the sealing material 50 expands and contracts is alleviated, and the protective cover 4 is not peeled off from the sealing material 50. Occurrence of damage such as cracks is suppressed.

  In addition, since the gap δ between the edge 4A of the protective cover 4 and the housing recess 20 is provided over the entire circumference of the protective cover 4, the degree of freedom in the movement direction of the protective cover 4 is increased. As a result, regardless of the direction in which the force due to expansion and contraction of the sealing material 50 is applied to the protective cover 4, the protective cover 4 moves in a direction in which the force is relaxed, and the sealing material 50 is damaged. Can be more reliably prevented.

  Further, a support member 80 for supporting the protective cover 4 is provided in the housing recess 20, and this support member 80 has the same thermal expansion coefficient and elastic modulus as the sealing material 50. Therefore, when the sealing material 50 thermally expands due to heat generation of the LED mounting substrate 22 and contracts as the temperature decreases, the support member 80 also thermally expands similarly to the sealing material 50, or Due to the shrinkage, no defect occurs between the sealing material 50 and the support member 80.

FIG. 9 is a perspective view showing a configuration of the explosion-proof illumination device 70 according to the present embodiment.
The explosion-proof illumination device 70 is an illumination device configured as an explosion-proof structure, and includes the above-described light emitting device 1 and a base body 72 as shown in FIG.
The base body 72 is a container body that connects the light-emitting device 1 and a power line that supplies commercial power, and is molded by casting. The base body 72 has a substantially rectangular parallelepiped main body 74 and a set of cable glands 76 provided on the side surfaces of the main body 74, and the light emitting device 1 adheres the back surface 2 </ b> B of the case 2 to the upper surface of the main body 74. In this state, it is fixed with screws. A hole is formed in the upper surface of the main body 74, and the electric wiring 14 connected to the light emitting device 1 is drawn into the main body 74 through the hole.
The cable gland 76 is a member for drawing the power line into the main body 74. A power line drawn from the cable gland 76 to the main body 74 is connected to the electric wiring 14 of the light emitting device 1 inside the main body 74, and power is supplied to the light emitting device 1.

  Since the light-emitting device 1 has an explosion-proof structure as described above, an explosion-proof illumination device can be simply configured just by being fixed to the surface of the base body 72 as in the explosion-proof illumination device 70.

  In the explosion-proof illumination device 70, the entire circumference of the edge portion 4A of the protective cover 4 is flexible so as to cover the adhesive 12 filled in the gap δ of the light emitting device 1 from above. You may coat | cover with a property material (for example, aluminum tape etc.). Accordingly, the adhesive 12 does not deteriorate due to gas corrosion or the like depending on the use atmosphere, and the airtightness of the gap δ can be maintained.

  According to the embodiment described above, the following effects can be obtained.

In the light emitting device 1 according to the present embodiment, the protective cover 4 is disposed with a gap δ between the protective recess 4 and the housing recess 20, and the gap δ is filled with a flexible adhesive 12. The protective cover 4 is coupled to the housing recess 20.
Thereby, even when the sealing material 50 expands and contracts due to heat at the time of manufacturing or lighting of the light emitting device 1, the protective cover 4 maintains the coupling with the housing recess 20 according to the expansion and contraction force. Moreover, since the force applied to the sealing material 50 itself is reduced, the occurrence of damage such as cracks in the sealing material 50 can be suppressed.
Further, since the support recess 80 for supporting the protective cover 4 is provided in the storage recess 20, the protective cover 4 is placed in the storage recess 20 in a predetermined state while the sealing material 50 remains uncured when the light emitting device 1 is manufactured. Can be placed in position. Thereby, in order to mount the protective cover 4 on the upper surface of the sealing material 50, it is not necessary to harden the sealing material 50, and the freedom degree of a manufacturing process is raised.
Further, since the support member 80 has a thermal expansion coefficient and an elastic modulus substantially equal to those of the sealing material 50, when the sealing material 50 is thermally expanded or contracted, the support member 80 is also the same as the sealing material 50. Thermal expansion or contraction does not occur, and a defect does not occur between the sealing material 50 and the support member 80.

  In the light emitting device 1 of the present embodiment, the support member 80 is a columnar member extending from the bottom surface 24 of the housing recess 20. For this reason, when the protective cover 4 is placed on the uncured sealing material 50, bubbles generated on the back surface 4S2 of the protective cover 4 can be easily removed from between the support members 80 to the outside (gap δ). It is possible to prevent bubbles from being generated at the interface between the protective cover 4 and the sealing material 50.

  In the light emitting device 1 of the present embodiment, the gap δ is provided between the protective cover 4 and the housing recess 20 over the entire circumference, so that the protective cover 4 is expanded and contracted by the expansion and contraction of the sealing material 50. Regardless of the direction in which the force is applied, the sealing material 50 can move in a direction in which the force is relaxed.

  In the light emitting device 1 of the present embodiment, the wiring hole 13 through which the electric wiring 14 electrically connected to the LED mounting substrate 22 passes through the bottom surface 24 of the housing recess 20, and the LED mounting substrate 22 closes the wiring hole 13. Therefore, the airtightness of the accommodation recessed part 20 is improved. Further, at the time of manufacturing the light emitting device 1, it is not necessary to fill the wiring hole 13 with the filler 16 and close it before the sealing material 50 is filled into the housing recess 20, so that the degree of freedom in the manufacturing process is increased.

In the light emitting device 1 of the present embodiment, the front end portion 14A of the electrical wiring 14 is inserted from the back surface side of the LED mounting board 22, is caught on the surface of the electric circuit 23 of the LED mounting board 22, and cannot be pulled out from the surface. A mating fitting 36 is provided.
As a result, when the light emitting device 1 is manufactured, the plug 36 can be engaged with the electric circuit 23 simply by inserting the plug 36 into the wiring hole 13, so that the manufacture is facilitated.

  The above-described embodiment is merely an example of one aspect of the present invention, and can be arbitrarily modified and applied without departing from the gist of the present invention.

  In the above-described embodiment, the columnar support member 80 is exemplified, but the support member 180 may have a frame shape on which the protective cover 4 can be placed, for example, as shown in FIG. In this case, it is preferable that a plurality of recesses 181 that connect the inside and the outside of the frame are provided in the edge portion 180A with which the back surface 4S2 of the protective cover 4 contacts. By providing the concave portion 181, when the protective cover 4 is placed on the uncured sealing material 50, bubbles generated on the back surface 4 </ b> S <b> 2 of the protective cover 4 can be easily extracted from the inside of the support member 180 to the outside through the concave portion 181. It is possible to prevent bubbles from being generated at the interface between the protective cover 4 and the sealing material 50.

  In the above-described embodiment, the support member 80 and the protective cover 4 may be engaged with each other, and the protective cover 4 may be positioned in the housing recess 20 by the support member 80. Alternatively, a positioning member for positioning the protective cover 4 may be provided in the housing recess 20 separately from the support member 80. By positioning the protective cover 4, the gap δ can be reliably provided around the protective cover 4.

  In the embodiment described above, the configuration in which the gap δ around the protective cover 4 is filled with the adhesive 12 is illustrated. However, the present invention is not limited to this, and the sealing material 50 made of silicone resin has sufficient flexibility, so that the gap δ may be filled with the sealing material 50 instead of the adhesive 12. In this case, the sealing material 50 may be filled in the gap δ in place of the adhesive 12 in step S8 of FIG. Alternatively, when the sealing material 50 is filled in step S6, the sealing material 50 is filled so that the sealing material 50 overflows the gap δ and fills the gap δ when the protective cover 4 is placed in step S7. May be. In this case, the step S8 is omitted.

  In the above-described embodiment, the case where the sealing member 50 is filled (FIG. 8: step S6) after the support member 80 is provided in the housing recess 20 (FIG. 8: step S5) is illustrated, but the present invention is not limited thereto. . That is, the support member 80 may be provided in the housing recess 20 after the housing recess 20 is filled with the sealing material 50.

  In the embodiment described above, after filling the sealing material 50 (FIG. 8: step S6), the protective cover 4 is placed on and supported by the support member 80 (FIG. 8: step S7). After the cover 4 is supported by the support member 80, the sealing material 50 may be filled.

  In the embodiment described above, the protective cover 4 is formed in a substantially similar shape having a size slightly smaller than the planar view shape of the emission opening 6, so that there is a gap between the entire circumference of the protection cover 4 and the emission opening 6. δ is provided. However, the shape of the protective cover 4 is arbitrary as long as the gap δ is provided on the entire circumference of the protective cover 4.

  In the embodiment described above, the gap δ is provided on the entire circumference of the edge portion 4A of the protective cover 4, but the present invention is not limited to this. That is, if the protective cover 4 moves in response to the expansion and contraction of the sealing material 50 due to heat, and the occurrence of damage in the sealing material 50 can be suppressed, a part of the protective cover 4 is connected to the housing recess 20 of the case 2. You may touch.

  In the above-described embodiment, the phosphor layer 52 is provided on the back surface 4S2 of the protective cover 4. However, the phosphor layer 52 is between the LED 28 and the protective cover 4 and may be any portion as long as it covers the LED 28. Can be provided in position. For example, the phosphor layer 52 can be provided on the sealing material 50 as follows. That is, in step S6 of FIG. 8, after the sealing material 50 is filled in the housing recess 20 and before the sealing material 50 is cured, the material that becomes the source of the phosphor layer 52 is put into the sealing material 50. The sealing material 50 is diffused or precipitated in the form of a film, and in this state, the sealing material 50 is cured. Thereby, the phosphor layer 52 can be formed at a time together with the sealing by the sealing material 50, and the manufacturing process can be rationalized.

  In the above-described embodiment, the LED 28 is exemplified as the light emitting element. However, the present invention is not limited to this, and other elements such as a semiconductor laser element may be used.

1 Light Emitting Device 2 Case 4 Protective Cover (Protective Member)
6 Outgoing aperture (aperture)
12 Adhesive 13 Wiring hole 14 Electrical wiring 20 Housing recess 22 LED mounting board (mounting board)
23 Electrical circuit 24 Bottom surface of housing recess 28 LED (light emitting element)
36 Plug fitting 40 Conductive wire 44 Land engaging portion 44A Return 50 Sealing material 52 Phosphor layer 70 Explosion-proof illumination device (illumination device)
80, 180 Support member 181 Concave portion δ Clearance

Claims (8)

A mounting substrate mounted with a light emitting element;
A case provided with a housing recess for receiving the mounting substrate,
In the light emitting device in which the mounting substrate is disposed on the bottom surface of the housing recess,
A light-transmitting sealing material that fills the housing recess and seals the mounting substrate;
A translucent protective member provided on the surface of the sealing material;
A support member provided in the housing recess and supporting the protection member;
The support member and the sealing material have substantially the same thermal expansion coefficient and elastic modulus,
The protection member is provided with a gap between the protection member and the housing recess in a state supported by the support member,
The gap is filled with a flexible adhesive, or the flexible sealing material, and the protective member is coupled to the housing recess by the adhesive or the sealing material,
A light emitting device characterized by that.   The light emitting device according to claim 1, wherein the support member is a columnar member extending from a bottom surface of the housing recess. The support member is
A frame shape on which the support member is placed,
The edge that contacts the protective member is provided with a recess that connects the inside and outside of the frame.
The light-emitting device according to claim 1.   The light emitting device according to claim 1, wherein the gap is provided between the protective member and the housing recess.   5. The wiring hole through which an electrical wiring electrically connected to the mounting substrate passes through the bottom surface of the housing recess, and the mounting substrate closes the wiring hole. 6. A light emitting device according to any one of the above.   The plug of the electric wiring is provided at a tip portion of the electric wiring, which is hooked to a mounting surface of the mounting substrate and electrically connected to the mounting surface by soldering. Light-emitting device.   An illumination device comprising the light-emitting device according to claim 1 as a light source. A mounting board on which a light emitting element is mounted; and a case provided with a housing recess for receiving the mounting board. The mounting board is disposed on a bottom surface of the housing recess, and the mounting board is filled in the housing recess. In the method for manufacturing a light emitting device, which is sealed with a light-transmitting sealing material, and a light-transmitting protective member is disposed in the opening of the housing recess,
The housing recess is sealed in a state where the protection member is supported by a support member having substantially the same thermal expansion coefficient and elastic modulus as the sealing material, and is disposed with a gap between the protection member and the housing recess. Harden and seal the material,
A method for manufacturing a light emitting device, wherein the gap is filled with a flexible adhesive, or the gap is filled with the flexible sealing material during the sealing.

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