WO2023119403A1 - Explosion-proof light-emitting diode unit - Google Patents

Explosion-proof light-emitting diode unit Download PDF

Info

Publication number
WO2023119403A1
WO2023119403A1 PCT/JP2021/047248 JP2021047248W WO2023119403A1 WO 2023119403 A1 WO2023119403 A1 WO 2023119403A1 JP 2021047248 W JP2021047248 W JP 2021047248W WO 2023119403 A1 WO2023119403 A1 WO 2023119403A1
Authority
WO
WIPO (PCT)
Prior art keywords
cover
emitting diode
heat sink
light
substrate
Prior art date
Application number
PCT/JP2021/047248
Other languages
French (fr)
Japanese (ja)
Inventor
徹 菱田
享平 津山
Original Assignee
星和電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 星和電機株式会社 filed Critical 星和電機株式会社
Priority to CN202180099883.4A priority Critical patent/CN117561615A/en
Priority to PCT/JP2021/047248 priority patent/WO2023119403A1/en
Priority to JP2023568807A priority patent/JPWO2023119403A1/ja
Priority to TW111110552A priority patent/TW202327128A/en
Publication of WO2023119403A1 publication Critical patent/WO2023119403A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the present invention relates to an explosion-proof light-emitting diode unit.
  • This type of explosion-proof light-emitting diode unit includes, as described in Japanese Patent Application Publication No. 2014-515191, "at least one light-emitting diode (LED), a heat sink coupled to the LED, and the LED at least in the light-emitting direction. a covering LED cover, said LED cover extending into the insertion recess of said heat sink, sealing the LEDs against an external, potentially explosive atmosphere. and surrounded within said insertion recess by potting material.
  • LED light-emitting diode
  • the present invention has been devised in view of the above circumstances, and aims to provide an explosion-proof light-emitting diode unit that is advantageous in terms of cost and can increase the degree of freedom in design.
  • a first explosion-proof light emitting diode unit includes at least one light emitting diode, a substrate on which the light emitting diode is mounted, a heat sink on which the substrate is attached, and a cover that covers the light emitting diode.
  • the heat sink has a mounting surface on which a substrate is mounted, and the cover includes a cover main body portion in which recesses for light-emitting diodes are formed to store the light-emitting diodes according to the mounting pattern of the light-emitting diodes; a cover provided so as to surround the cover main body with a gap as a resin filling portion; a plurality of connecting portions connecting the cover outer frame and the cover main body; A light emitting diode is formed by filling the resin filling portion with a resin material from between the connecting portions while the cover is connected to the heat sink at the screw connecting portion. It is sealed.
  • a second explosion-proof light emitting diode unit includes at least one light emitting diode, a substrate on which the light emitting diode is mounted, a heat sink on which the substrate is attached, and a cover that covers the light emitting diode.
  • the heat sink has a mounting surface on which the substrate is mounted, and a heat sink-side concave groove formed around the mounting surface so as to be one step lower than the mounting surface, and the cover includes a light emitting diode.
  • a third explosion-proof light-emitting diode unit comprises at least one light-emitting diode, a substrate on which the light-emitting diode is mounted, a heat sink on which the substrate is mounted, and a cover that covers the light-emitting diode.
  • the heat sink has a mounting surface on which the substrate is mounted, and a heat sink-side concave groove formed around the mounting surface so as to be one step lower than the mounting surface, and the cover includes a light emitting diode.
  • the cover main body has a light-emitting diode recess for storing the light-emitting diode according to the mounting pattern of the cover, and the cover peripheral part is formed one step lower than the cover main body, and the cover main body emits light.
  • the peripheral edge of the cover is positioned in the groove on the heat sink side of the heat sink, and the cover is fixed to the heat sink at least at the peripheral edge of the cover with fixing screws.
  • the light-emitting diode is sealed by filling.
  • the cover that covers the light-emitting diode is sealed with the filling resin material, so that the light-emitting diode can be reliably sealed.
  • the mounting surface of the heat sink is made flat, the degree of freedom in design is improved, and various substrates can be used. Therefore, there is an advantage that the overall cost can be significantly reduced.
  • FIG. 4A is a schematic plan view of a cover that constitutes the explosion-proof light emitting diode unit according to the first embodiment of the present invention
  • FIG. 4B is a schematic side view
  • (C) is a schematic bottom view
  • 1 is a schematic cross-sectional view showing a main part of an explosion-proof light emitting diode unit according to a first embodiment of the invention
  • FIG. 1 is a schematic perspective view of an explosion-proof light emitting diode unit according to a first embodiment of the present invention, with one cover not attached
  • FIG. 1 is a schematic, partially broken perspective view of an explosion-proof light emitting diode unit according to a first embodiment of the present invention
  • FIG. The cover outer frame on one side of one cover is removed so that the connecting part can be seen.
  • FIG. 6 is a schematic cross-sectional perspective view of a main part of an explosion-proof light emitting diode unit according to a second embodiment of the present invention
  • FIG. 4 is a schematic perspective view of an explosion-proof light emitting diode unit according to a second embodiment of the invention
  • FIG. 4 is a schematic cross-sectional view of an explosion-proof light emitting diode unit according to a second embodiment of the invention
  • FIG. 11 is a schematic cross-sectional perspective view of a main part of an explosion-proof light emitting diode unit according to a third embodiment of the present invention.
  • An explosion-proof light-emitting diode unit 3000 includes a plurality of light-emitting diodes 500, a substrate 100 on which the light-emitting diodes 500 are mounted, a heat sink 200 on which the substrate 100 is mounted, and the light-emitting diodes
  • the heat sink 200 has a mounting surface 210 on which the substrate 100 is mounted, and the cover 300 is adapted to the light emitting diode 500 mounting pattern.
  • the light emitting diode 500 is hermetically sealed by filling the resin filling portion 370 with the filling resin material 400 from between the connecting portions 360 while the light emitting diode 500 is connected to the heat sink 200 at the connecting portion 351 .
  • a plurality of light-emitting diodes 500 are mounted in a grid pattern on the substrate 100 constituting the explosion-proof light-emitting diode unit 3000 .
  • the substrate 100 constituting the explosion-proof light-emitting diode unit 3000 .
  • four substrates 100 are arranged in the shape of a square to form one explosion-proof light emitting diode unit 3000 .
  • notch portions 111 are formed to avoid fixing screws 450 for fixing the cover 300 together with the substrate 100 itself to the heat sink 200 which will be described later.
  • a substrate-side through hole 110 through which a fixing screw 450 penetrates is formed in the central portion of each side of the substrate 100 .
  • the notch 111 and the board-side through-hole 110 are formed at positions not overlapping the light-emitting diode 500 to be mounted.
  • the heat sink 200 to which the substrate 100 is attached is made of die-cast aluminum, for example, and occupies most of the explosion-proof light emitting diode unit 3000, and also functions as a body case of the explosion-proof light emitting diode unit 3000.
  • the heat sink 200 has a flat mounting surface 210 on which the substrate 100 is mounted, as shown in FIG. 2 and the like.
  • the mounting surface 210 is a portion on which the substrate 100 is mounted, it is formed flat. At the four corners of the mounting surface 210, heat sink side screw holes corresponding to fixing screws are opened at positions corresponding to the board side through holes of the board 100. As shown in FIG. Note that, of the mounting surface 210, a portion with which the filling resin material 400, which will be described later, is in contact is roughened to improve adhesion with the filling resin material 400. FIG. There are various methods for finishing a rough surface. For example, there is a method of matting a painted surface to form fine irregularities.
  • the cover 300 is made of a translucent synthetic resin.
  • a cover body portion 310 of the cover 300 has a substrate recess (not shown) for storing the substrate 100 placed on the placement surface 210 of the heat sink 200 . That is, a recess corresponding to the shape and size of the substrate 100 is formed as a substrate recess on the rear surface side of the cover body portion 310 .
  • a plurality of light-emitting diode recesses 511 corresponding to the layout pattern of the light-emitting diodes 500 mounted on the substrate 100 are formed in the substrate recesses of the cover body portion 310 . ing.
  • the light-emitting diode recess 511 is formed in a substantially dome shape that protrudes further toward the surface side than the substrate recess. It goes without saying that the pattern, size, etc. of the light-emitting diode recess 511 shown in FIG. 1C are merely examples, and the present invention is not limited to these.
  • a cover outer frame 350 is formed outside the cover body portion 310 of the cover 300 with a gap therebetween.
  • the cover main body 310 and the cover outer frame 350 are connected by a plurality of connecting portions 360 spaced apart from each other.
  • the gap between the cover main body 310 and the cover outer frame 350, more specifically, between the cover main body 310 and the cover outer frame 350, the lower surface 362 of the connecting portion 360 that connects them, and the mounting surface 210 of the heat sink 200 functions as a resin filling portion 370 which will be described later.
  • this connecting portion 360 is formed to be smaller than the thickness dimension of the cover body portion 310, as shown in FIG. Moreover, the connecting portion 360 has its upper surface 361 aligned with the upper edge of the cover outer frame 350 . Therefore, a gap is formed between the connecting portion 360 and the mounting surface 210 of the heat sink 200 . As described above, this gap becomes the gap between the cover main body 310, the cover outer frame 350, the lower surface 362 of the connecting portion 360 connecting them, and the mounting surface 210 of the heat sink 200, and corresponds to the resin filling portion 370. do.
  • the connecting portion 360 is formed in a wedge shape with a flat upper surface 361 and a lower surface 362 that protrudes downward.
  • the reason why the upper surface 361 of the connecting portion 360 is formed flat is that the minimum filling amount of the filling resin material 400 to be filled in the resin filling portion 370 can be easily grasped from the gap between the connecting portions 360 . That is, since the filling resin material 400 needs to be filled in the resin filling portion 370 at least until it reaches the upper surface 361 of the connecting portion 360, the filling resin material 400 is allowed to flow through the connecting portion by forming the upper surface 631 flat. This is to make it easier to grasp the state in which the upper surface 361 of 360 has not yet been reached.
  • the reason why the lower surface 362 of the connecting portion 360 is formed in a wedge shape that protrudes downward is as follows. That is, if the lower surface 362 of the connecting portion 360 is formed flat, the flow of the filling resin material 400 filling the resin filling portion 370 may become uneven at the portion of the lower surface 362 . If the flow of the resin material 400 becomes uneven, even though the filled resin material 400 greatly exceeds the upper surface 361 of the connecting portion 360 in one portion, the filled resin material 400 does not flow through the connecting portion in other portions. A situation may occur in which the upper surface 361 of 360 is not reached. In such a state, it may become impossible to reliably seal the light emitting diode 500 . However, when the lower surface 362 of the connecting portion 360 is formed in a wedge shape that protrudes downward, the filling resin material 400 smoothly flows along the shape of the lower surface 362 of the connecting portion 360. No such problem arises.
  • a total of eight screw connection portions 351 are formed on the outer surface of the cover outer frame 350 as shown in FIGS. 1(A) and 1(C).
  • the four screw connection portions 351 are formed at the four corners of the cover outer frame 350, and the remaining four screw connection portions 351 are formed at the central position of the cover outer frame 350, respectively.
  • the cover 300 is structurally connected and fixed to the heat sink 200 while covering the substrate 100 mounted on the mounting surface 210 of the heat sink 200 .
  • the above-described filling of the resin filling portion 370 with the filling resin material 400 is performed while the cover 300 is connected and fixed to the heat sink 200 .
  • a more detailed assembly procedure for this explosion-proof light emitting diode unit 3000 is as follows. First, the substrate 100 is placed on the mounting surface 210 of the heat sink 200, and the substrate 100 and the heat sink 200 are connected and fixed with fixing screws (not shown). In this state, a cable (not shown) of the light emitting diode 500 is electrically connected to a required location.
  • the heat sink 200 and the substrate 100 are covered with the cover 300 .
  • the board 100 is fitted into the board recess of the cover main body 310 of the cover 300, so that the cover 300 is naturally fitted in the set position.
  • the light emitting diode 500 mounted on the substrate 100 is securely housed in the light emitting diode recess 311 formed in the cover main body 310 .
  • the cover 300 is connected and fixed to the heat sink 200 by passing the eight screws 450 through the eight screw connecting portions 351 .
  • the filling resin material 400 is filled into the resin filling portion 370 between the cover main body portion 310 and the cover outer frame 350 from between the connecting portions 360 .
  • the resin filling portion 370 is filled with the filling resin material 400 until it reaches at least the upper surface 361 of all the connecting portions 360 .
  • the filling resin material 400 is cured according to the properties of the filling resin material 400 . If it is a type that cures by ultraviolet irradiation, it is irradiated with ultraviolet rays, and if it is a type that cures by heating, it is heated. Since the light-emitting diode 500 is sealed with the filling resin material 400, the explosion-proof light-emitting diode unit 3000 is an explosion-proof type.
  • the upper surface 361 of the connecting portion 360 is flat in the above-described embodiment, it may be formed to swell in a substantially semicylindrical shape. Assuming that the top surface 361 is formed in a substantially semicylindrical shape, when the filling resin material 400 reaches the required amount, that is, the top surface 361 of the connecting portion 360 and then is further filled, the top surface 361 of the connecting portion 360 gradually fills the filling resin material 400 . Therefore, the exposed area of the upper surface 361 from the filling resin material 400 gradually decreases. If this event occurs, it can be confirmed at a glance that the filling amount of the filling resin material 400 has reached the required amount.
  • the explosion-proof light emitting diode unit 1000 includes a plurality of light emitting diodes 500, a heat sink 200 to which the substrate 100 of the substrate 100 on which the light emitting diodes are mounted, and the light emitting diodes 200.
  • the heat sink 200 includes a mounting surface 210 on which the substrate 100 is mounted, and a heat sink-side recessed groove 220 formed around the mounting surface 210 one step downward from the mounting surface 210.
  • the cover 300 includes a cover main body portion 310 formed with a light emitting diode recess 311 for storing the light emitting diode 500 according to the pattern of the light emitting diode 500, and a cover main body portion 310 that is one step lower than the cover main body portion 310. a filled recess 321 formed on the back side of the cover peripheral edge 320; and an injection port 322 communicating with the filled recess 321 from the surface side.
  • the cover peripheral edge portion 320 is positioned in the heat sink side concave groove 220 of the heat sink 200, and the light emitting diode 500 is sealed by the filling resin material 400 injected into the filling concave portion 321 from the inlet 322. It's becoming
  • a plurality of light emitting diodes 500 are mounted in a grid pattern on the substrate 100 that constitutes the explosion-proof light emitting diode unit 1000 .
  • the substrate 100 that constitutes the explosion-proof light emitting diode unit 1000 .
  • four substrates 100 are arranged in the shape of a square to form one explosion-proof light emitting diode unit 1000 .
  • substrate-side through holes 110 through which fixing screws 450 pass for fixing the cover 300 together with the substrate 100 itself to the heat sink 200 described later are formed.
  • the board-side through hole 110 is opened at a position not overlapping the light emitting diode 500 to be mounted.
  • the heat sink 200 to which the substrate 100 is attached is made of die-cast aluminum, for example, and occupies most of the explosion-proof light emitting diode unit 1000, and also functions as a body case of the explosion-proof light emitting diode unit 1000. 6 and the like, the heat sink 200 has a mounting surface 210 on which the substrate 100 is mounted, a heat sink side groove 220 formed around the mounting surface 210, and a heat sink side groove 220. is formed integrally with a wall portion 230 formed on the outer periphery of the .
  • the mounting surface 210 is a portion on which the substrate 100 is mounted, it is formed flat. At the four corners of the mounting surface 210 , heat sink side screw holes 240 corresponding to the fixing screws 450 are opened at positions corresponding to the board side through holes 110 of the board 100 .
  • the cover 300 is made of translucent synthetic resin.
  • a light emitting diode concave portion 311 corresponding to the arrangement position of the light emitting diode 500 mounted on the substrate 100 is formed.
  • the light-emitting diode concave portion 211 covers the light-emitting diode 500 mounted on the substrate 100, and is formed in a substantially dome shape that protrudes toward the surface side.
  • cover-side through-holes 330 through which fixing screws 450 for fixing the cover 300 to the heat sink 200 pass are formed. Therefore, if the substrate 100 is placed on the mounting surface 210 of the heat sink 200 and then the substrate 100 is covered with the cover 300, the substrate side through hole 110 and the cover side through hole 330 become coaxial, and the heat sink side screw of the heat sink 200 is mounted. It will correspond to hole 240 .
  • a substantially cylindrical tubular portion 331 is formed around the surface side of the cover-side through-hole 330 .
  • the cylindrical portion 331 is filled with a screw filling resin material 410 for sealing the cover-side through-hole 330 and the substrate-side through-hole 110 . part.
  • a plurality of injection ports 322 are formed in the cover peripheral edge portion 320 of the cover 300 so as to be continuous with the heat sink side recessed grooves 220 of the heat sink 200 .
  • the injection port 322 serves as a portion for injecting the filling resin material 400 into the filling concave portion 321 provided on the back side of the cover peripheral portion 320 .
  • the filling resin material 400 injected from the injection port 322 fills the space surrounded by the filling recess 321 of the cover 300 and the heat sink side recess groove 220 of the heat sink 200, and airtightly seals the space between the outside and the light emitting diode 500. By blocking, the light emitting diode 500 is sealed.
  • a gasket 470 is interposed between the heat sink side recessed groove 220 of the heat sink 200 and the cover 300 to further ensure sealing.
  • the contact with the filling resin material 400 is finished to have a rough surface to improve adhesion with the filling resin material 400 .
  • this rough surface finishing is the same as in the third embodiment, which will be described later.
  • There are various methods for finishing a rough surface For example, there is a method of matting a painted surface to form fine irregularities.
  • the explosion-proof light emitting diode unit 1000 having the above configuration is assembled as follows.
  • the substrate 100 on which the plurality of light emitting diodes 500 are mounted is placed on the mounting surface 210 of the heat sink 200 .
  • the substrate-side through holes 110 of the substrate 100 and the heat sink-side screw holes 240 of the heat sink 200 are aligned.
  • a cable (not shown) of the light emitting diode 500 is electrically connected to a required location.
  • the gasket 470 is positioned in the heat sink side groove 220 of the heat sink 200 .
  • the cover 300 is placed on the substrate 100 .
  • the cover body portion 310 of the cover 300 is positioned on the substrate 100
  • the cover peripheral edge portion 320 of the cover 300 is positioned on the heat sink side concave groove 220 of the heat sink 200 .
  • the cover side through holes 330 are aligned with the board side through holes 110 and the heat sink side screw holes 240 .
  • the light-emitting diode concave portion 311 formed on the back side of the cover body portion 310 of the cover 300 is aligned with the substrate light-emitting diode 500 mounted on the substrate 100 .
  • the fixing screws 450 are screwed into the heat sink side screw holes 240 of the heat sink 200 via the cover side through holes 330 and the board side through holes 110 .
  • the fixing screw 450 By screwing the fixing screw 450 , the substrate 100 and the cover 300 are structurally connected and fixed to the heat sink 200 .
  • the filling resin material 400 is injected from the injection port 322 of the cover 300 .
  • the injected filling resin material 400 fills the space surrounded by the filling recess 321 of the cover 300 and the heat sink side groove 220 of the heat sink 200 .
  • the filling resin material 400 reaches the injection port 322, so that the space is completely filled with the filling resin material 400.
  • the cylindrical portion 331 is filled with the filling resin material 410 for screws. Thereafter, the filling resin material 400 and the filling resin material 410 for screws are cured according to the properties of the filling resin material 400 and the filling resin material 410 for screws. If it is a type that cures by ultraviolet irradiation, it is irradiated with ultraviolet rays, and if it is a type that cures by heating, it is heated. Since the light emitting diode 500 is sealed by the filling resin material 400, the screw filling resin material 410, and the gasket 470, the explosion-proof light emitting diode unit 1000 is an explosion-proof type.
  • An explosion-proof light emitting diode unit 2000 includes a plurality of light emitting diodes 500, a substrate 100 on which the light emitting diodes 500 are mounted, a heat sink 200 on which the substrate 100 is attached, and the A cover 300 covering the light emitting diode 500 is provided, and the heat sink 200 is formed around the mounting surface 210 on which the substrate 100 is mounted and the mounting surface 210 which is lowered from the mounting surface 210 by one step.
  • the cover 3200 includes a cover main body 310 in which a light emitting diode recess 331 for housing the light emitting diode 500 is formed according to the mounting pattern of the light emitting diode 500, and the cover main body 310.
  • the cover peripheral edge portion 320 is formed one step lower than the portion 310 .
  • the cover peripheral edge portion 320 is positioned in the heat sink side concave groove 220 of the heat sink 200 , and the cover peripheral edge portion 320 300 is fixed to heat sink 200 with fixing screws 451 at least at cover peripheral edge portion 320, and light emitting diode 500 is sealed by filling filling resin material 430 into heat sink side concave groove 220 including fixing screws 451. It has become.
  • a substrate 100, a light emitting diode 500 mounted on this substrate 100, a cover 300, a heat sink 200, and the like are given the same reference numerals for explanation.
  • a substrate 100, a light emitting diode 500 mounted on this substrate 100, a cover 300, a heat sink 200, and the like are given the same reference numerals for explanation.
  • the explosion-proof light-emitting diode unit 2000 differs greatly from the explosion-proof light-emitting diode unit 1000 according to the above-described second embodiment in that the filling resin material 400 is filled in a closed place like the space described above. It is the point that the open area is filled instead of the open area.
  • the cover 300 is made of a translucent synthetic resin. As shown in FIG. 7 and the like, the cover 300 includes a cover main body portion 310 having a light emitting diode concave portion 311 formed on the back side, and a cover peripheral edge portion 320 formed around the cover main body portion 310 so as to be one step lower. have.
  • the cover peripheral edge portion 320 is lowered from the mounting surface 210 of the heat sink 200 by one step and fitted into the heat sink side concave groove 220 formed around the mounting surface 210 .
  • a plurality of cover main body side through holes 330 are formed in the cover main body section 310 at positions avoiding the light emitting diode recesses 311 .
  • the cover peripheral edge portion 320 is also provided with a plurality of cover peripheral edge portion side through holes 323 .
  • the difference from the explosion-proof light emitting diode unit 1000 according to the second embodiment is that a cover peripheral edge portion side through hole 323 is formed in the cover peripheral edge portion 320 .
  • the heat sink 200 is provided with heat sink side screw holes 240 at positions corresponding to the through holes 330 and 323 .
  • a plurality of light emitting diodes 500 are mounted on the substrate 100 in a grid like the explosion-proof light emitting diode unit 1000 according to the second embodiment.
  • four substrates 100 are arranged in a square square shape to form one explosion-proof light emitting diode unit.
  • a light emitting diode unit 2000 is used.
  • substrate-side through holes 110 through which fixing screws 450 for fixing the substrate 100 itself to the heat sink 200 pass are formed.
  • the board-side through hole 110 is opened at a position not overlapping the light emitting diode 500 to be mounted.
  • the cover main body side through hole 330, the board side through hole 110, and the corresponding heat sink side screw hole 240 are set to coincide with each other.
  • the heat sink side groove 220 of the heat sink 200 is provided with a heat sink side groove screw hole 221 corresponding to the cover peripheral edge side through hole 323 of the cover 300 .
  • the explosion-proof light emitting diode unit 2000 configured in this way is assembled as follows. First, the substrate 100 is mounted on the mounting surface 210 of the heat sink 200 . Then, the board-side through holes 110 of the board 100 and the corresponding heat sink-side screw holes 240 are aligned. In this state, a cable (not shown) of the light emitting diode 500 is electrically connected to a required location.
  • cover 300 is placed on substrate 100 . That is, the substrate 100 is covered with the cover body portion 310 of the cover 300 , and the cover peripheral edge portion 320 is positioned in the heat sink side groove 220 .
  • the cover main body side through holes 330 of the cover 300 and the board side through holes 110 of the board 100 are aligned with the heat sink side screw holes 240 of the heat sink 200, and the cover peripheral side through holes 323 of the cover 300 and the heat sink 200 are aligned. coincide with the heat sink side recessed screw holes 221 of .
  • Fixing screws 450 are screwed into the heat sink side screw holes 330 via the cover main body side through holes 330 and the board side through holes 110 .
  • the fixing screw 451 is screwed into the heat sink side recessed screw hole 221 via the cover peripheral portion through-hole 323 .
  • the substrate 100 and the cover 300 are structurally connected and fixed to the heat sink 200 by these two types of fixing screws 450 and 451 .
  • the heat sink side groove 220 is filled with the filling resin material 430 .
  • the filling resin material 430 is filled into the heat sink side recessed groove 220 , the cover peripheral edge portion 320 , the cover peripheral edge portion through hole 323 formed in the cover peripheral edge portion 320 , and the fixing screw 541 passing through the cover peripheral edge portion through hole 323 are covered. Since the body is covered with the filling resin material 430 and the light-emitting diode 500 is sealed, the explosion-proof light-emitting diode unit 2000 is an explosion-proof type.
  • the four substrates 100 are arranged on the heat sink 200 in a square grid pattern, but the present invention is not limited, and the substrates 100 can be arranged in any pattern. However, it goes without saying that it can be constructed from only one substrate 100 .
  • REFERENCE SIGNS LIST 100 substrate 200 heat sink 210 mounting surface 220 heat sink side concave groove 300 cover 310 cover main body 311 recess for light emitting diode 350 cover outer frame 351 screw connecting portion 360 connecting portion 370 resin filling portion 400 filling resin material 500 light emitting diode

Abstract

The present invention comprises a plurality of light-emitting diodes (500), a substrate (100) on which the light-emitting diodes (500) are mounted, a heat sink (200) to which the substrate (100) is attached, and a cover (300) covering the light-emitting diodes (500). The heat sink (200) has a placement surface (210) on which the substrate (100) is placed. The cover (300) has a cover body part (310) in which there is formed a light-emitting diode recess (311) for storing the light-emitting diodes (500), a cover outer frame (350) provided with a gap as a resin-filled part (370) between the cover outer frame and the cover body (310), a plurality of coupling parts (360) that couple the cover outer frame (350) and the cover body (310), and screw coupling parts (351) formed on the outer side surface of the cover (300). The light-emitting diodes (500) are sealed by coupling the cover (300) to the heat sink (200) and filling the resin-filled part (370) with a filler resin material (400) between the coupling parts (360).

Description

防爆型発光ダイオードユニットExplosion-proof light emitting diode unit
　本発明は、防爆型の発光ダイオードユニットに関する。 The present invention relates to an explosion-proof light-emitting diode unit.
　この種の防爆型の発光ダイオードユニットには，特表２０１４－５１５１９１号公報に記載された『少なくとも１つの発光ダイオード（ＬＥＤ）と、前記ＬＥＤに結合されたヒートシンクと、前記ＬＥＤを少なくとも発光方向に覆うＬＥＤカバーとを備えた防爆性ＬＥＤモジュールであって、前記ＬＥＤカバーは、前記ヒートシンクの挿入凹部内に延びていて、外部の、場合によっては爆発性の雰囲気に対してＬＥＤがシールされた状態で、注型材料によって前記挿入凹部内で取り囲まれた』ものがある。 This type of explosion-proof light-emitting diode unit includes, as described in Japanese Patent Application Publication No. 2014-515191, "at least one light-emitting diode (LED), a heat sink coupled to the LED, and the LED at least in the light-emitting direction. a covering LED cover, said LED cover extending into the insertion recess of said heat sink, sealing the LEDs against an external, potentially explosive atmosphere. and surrounded within said insertion recess by potting material.
特表２０１４－５１５１９１号公報Japanese Patent Publication No. 2014-515191
　しかしながら、上述した特表２０１４－５１５１９１号公報の記載の技術では、発光ダイオードを実装した基板が載置されるヒートシンクの冷却面（載置面）を平坦にすることが難しいため、コストの面で不利であった。
　また、ヒートシンクの冷却面に対応した形状の基板を使用することが必須となるので、設計の自由度が低くなるという問題もあった。
　さらに、ヒートシンクはダイキャスト、押出成形にて製造する必要があったため、これもコスト面や設計、構造の自由度の面から問題があった。 However, with the technique described in JP-T-2014-515191, it is difficult to flatten the cooling surface (mounting surface) of the heat sink on which the substrate on which the light-emitting diode is mounted is mounted. was a disadvantage.
Moreover, since it is essential to use a substrate having a shape corresponding to the cooling surface of the heat sink, there is also a problem that the degree of freedom in design is reduced.
Furthermore, since the heat sink had to be manufactured by die casting or extrusion molding, there were also problems in terms of cost, design, and structural flexibility.
　本発明は、上記事情に鑑みて創案されたもので、コスト面でも有利で、かつ設計の自由度を高めることができる防爆型発光ダイオードユニットを提供することを目的にしている。 The present invention has been devised in view of the above circumstances, and aims to provide an explosion-proof light-emitting diode unit that is advantageous in terms of cost and can increase the degree of freedom in design.
　本発明に係る第１の防爆型発光ダイオードユニットは、少なくとも１つの発光ダイオードと、この発光ダイオードが実装される基板と、この基板が取り付けられるヒートシンクと、前記発光ダイオードを覆うカバーとを備えており、前記ヒートシンクは、基板が載置される載置面を有しており、前記カバーは、発光ダイオードの実装パターンに応じて発光ダイオードを格納する発光ダイオード用凹部が形成されたカバー本体部と、このカバー本体部との間に樹脂充填部としての間隙を有して取り囲むように設けられたカバーと、このカバー外枠と前記カバー本体部とを連結する複数個の連結部と、前記カバー外枠の外側面に形成されたビス連結部とを有しており、前記カバーをビス連結部においてヒートシンクに連結した状態で連結部の間から樹脂材を樹脂充填部に充填することで発光ダイオードが密閉されるようになっている。 A first explosion-proof light emitting diode unit according to the present invention includes at least one light emitting diode, a substrate on which the light emitting diode is mounted, a heat sink on which the substrate is attached, and a cover that covers the light emitting diode. The heat sink has a mounting surface on which a substrate is mounted, and the cover includes a cover main body portion in which recesses for light-emitting diodes are formed to store the light-emitting diodes according to the mounting pattern of the light-emitting diodes; a cover provided so as to surround the cover main body with a gap as a resin filling portion; a plurality of connecting portions connecting the cover outer frame and the cover main body; A light emitting diode is formed by filling the resin filling portion with a resin material from between the connecting portions while the cover is connected to the heat sink at the screw connecting portion. It is sealed.
　本発明に係る第２の防爆型発光ダイオードユニットは、　少なくとも１つの発光ダイオードと、この発光ダイオードが実装される基板と、この基板が取り付けられるヒートシンクと、前記発光ダイオードを覆うカバーとを備えており、前記ヒートシンクは、基板が載置される載置面と、この載置面から一段下がって載置面の周囲に形成されたヒートシンク側凹溝とを有しており、前記カバーは、発光ダイオードの実装パターンに応じて発光ダイオードを格納する発光ダイオード用凹部が形成されたカバー本体部と、このカバー本体部より一段下がって形成されたカバー周縁部と、このカバー周縁部の裏面側に形成された充填凹部と、この充填凹部に表面側から連通する注入口とを有しており、カバー本体部で発光ダイオードを覆うとカバー周縁部はヒートシンクのヒートシンク側凹溝内に位置し、注入口から充填凹部内に注入された充填樹脂材によって発光ダイオードが密閉されるようになっている。 A second explosion-proof light emitting diode unit according to the present invention includes at least one light emitting diode, a substrate on which the light emitting diode is mounted, a heat sink on which the substrate is attached, and a cover that covers the light emitting diode. The heat sink has a mounting surface on which the substrate is mounted, and a heat sink-side concave groove formed around the mounting surface so as to be one step lower than the mounting surface, and the cover includes a light emitting diode. A cover main body portion in which a light emitting diode recess for storing a light emitting diode is formed according to the mounting pattern, a cover peripheral portion formed one step lower than the cover main body portion, and a cover peripheral portion formed on the back side of the cover peripheral portion. and an injection port communicating with the filling recess from the surface side. When the light emitting diode is covered with the cover main body, the peripheral edge of the cover is positioned in the groove of the heat sink on the side of the heat sink. The light-emitting diode is sealed with a filling resin material injected into the filling recess.
　本発明に係る第３の防爆型発光ダイオードユニットは、少なくとも１つの発光ダイオードと、この発光ダイオードが実装される基板と、この基板が取り付けられるヒートシンクと、前記発光ダイオードを覆うカバーとを備えており、前記ヒートシンクは、基板が載置される載置面と、この載置面から一段下がって載置面の周囲に形成されたヒートシンク側凹溝とを有しており、前記カバーは、発光ダイオードの実装パターンに応じて発光ダイオードを格納する発光ダイオード用凹部が形成されたカバー本体部と、このカバー本体部より一段下がって形成されたカバー周縁部とを有しており、カバー本体部で発光ダイオードを覆うとカバー周縁部はヒートシンクのヒートシンク側凹溝内に位置し、カバーは少なくともカバー周縁部においてヒートシンクに固定ビスで固定されており、前記固定ビスを含めてヒートシンク側凹溝に樹脂材を充填することで発光ダイオードが密閉されるようになっている。 A third explosion-proof light-emitting diode unit according to the present invention comprises at least one light-emitting diode, a substrate on which the light-emitting diode is mounted, a heat sink on which the substrate is mounted, and a cover that covers the light-emitting diode. The heat sink has a mounting surface on which the substrate is mounted, and a heat sink-side concave groove formed around the mounting surface so as to be one step lower than the mounting surface, and the cover includes a light emitting diode. The cover main body has a light-emitting diode recess for storing the light-emitting diode according to the mounting pattern of the cover, and the cover peripheral part is formed one step lower than the cover main body, and the cover main body emits light. When the diode is covered, the peripheral edge of the cover is positioned in the groove on the heat sink side of the heat sink, and the cover is fixed to the heat sink at least at the peripheral edge of the cover with fixing screws. The light-emitting diode is sealed by filling.
　本発明に係る防爆型発光ダイオードユニットは、発光ダイオードに被せられるカバーを充填樹脂材で密閉するので確実に発光ダイオードを密閉することができる。
　また、ヒートシンクの載置面を平坦にしたので、設計の自由度も向上するとともに、各種の基板を利用することができる。このため、全体のコストを大幅に低減することができるというメリットを有している。 In the explosion-proof light-emitting diode unit according to the present invention, the cover that covers the light-emitting diode is sealed with the filling resin material, so that the light-emitting diode can be reliably sealed.
In addition, since the mounting surface of the heat sink is made flat, the degree of freedom in design is improved, and various substrates can be used. Therefore, there is an advantage that the overall cost can be significantly reduced.
本発明の第１の実施の形態に係る防爆型発光ダイオードユニットを構成するカバーの図面であって、同図（Ａ）は概略的平面図、同図（Ｂ）は概略的側面図、同図（Ｃ）は概略的底面図である。FIG. 4A is a schematic plan view of a cover that constitutes the explosion-proof light emitting diode unit according to the first embodiment of the present invention; FIG. 4B is a schematic side view; (C) is a schematic bottom view. 本発明の第１の実施の形態に係る防爆型発光ダイオードユニットの要部を示す概略的断面図である。1 is a schematic cross-sectional view showing a main part of an explosion-proof light emitting diode unit according to a first embodiment of the invention; FIG. 本発明の第１の実施の形態に係る防爆型発光ダイオードユニットの概略的斜視図であって、１つのカバーが取り付けられていない状態の概略的斜視図である。1 is a schematic perspective view of an explosion-proof light emitting diode unit according to a first embodiment of the present invention, with one cover not attached; FIG. 本発明の第１の実施の形態に係る防爆型発光ダイオードユニットの一部破断概略的斜視図である。１個のカバーの１辺のカバー外枠を取り除いて連結部が見えるようにしている。1 is a schematic, partially broken perspective view of an explosion-proof light emitting diode unit according to a first embodiment of the present invention; FIG. The cover outer frame on one side of one cover is removed so that the connecting part can be seen. 本発明の第２の実施の形態に係る防爆型発光ダイオードユニットの要部の概略的断面斜視図である。FIG. 6 is a schematic cross-sectional perspective view of a main part of an explosion-proof light emitting diode unit according to a second embodiment of the present invention; 本発明の第２の実施の形態に係る防爆型発光ダイオードユニットの概略的斜視図である。FIG. 4 is a schematic perspective view of an explosion-proof light emitting diode unit according to a second embodiment of the invention; 本発明の第２の実施の形態に係る防爆型発光ダイオードユニットの概略的断面図である。FIG. 4 is a schematic cross-sectional view of an explosion-proof light emitting diode unit according to a second embodiment of the invention; 本発明の第３の実施の形態に係る防爆型発光ダイオードユニットの要部の概略的断面斜視図である。FIG. 11 is a schematic cross-sectional perspective view of a main part of an explosion-proof light emitting diode unit according to a third embodiment of the present invention;
　本発明の第１の実施に係る防爆型発光ダイオードユニット３０００は、複数個の発光ダイオード５００と、この発光ダイオード５００が実装される基板１００と、この基板１００が取り付けられるヒートシンク２００と、前記発光ダイオード５００を覆うカバー３００とを備えており、前記ヒートシンク２００は、前記基板１００が載置される載置面２１０を有しており、前記カバー３００は、発光ダイオード５００の実装パターンに応じて発光ダイオード５００を格納する発光ダイオード用凹部３１１が形成されたカバー本体部３１０と、このカバー本体部３１０との間に樹脂充填部３７０としての間隙を有して取り囲むように設けられたカバー外枠３５０と、このカバー外枠３５０と前記カバー本体部３１０とを連結する複数個の連結部３６０と、前記カバー３００の外側面に形成されたビス連結部３５１とを有しており、前記カバー３００をビス連結部３５１においてヒートシンク２００に連結した状態で連結部３６０の間から充填樹脂材４００を樹脂充填部３７０に充填することで発光ダイオード５００が密閉されるようになっている。 An explosion-proof light-emitting diode unit 3000 according to the first embodiment of the present invention includes a plurality of light-emitting diodes 500, a substrate 100 on which the light-emitting diodes 500 are mounted, a heat sink 200 on which the substrate 100 is mounted, and the light-emitting diodes The heat sink 200 has a mounting surface 210 on which the substrate 100 is mounted, and the cover 300 is adapted to the light emitting diode 500 mounting pattern. A cover main body portion 310 formed with a light-emitting diode concave portion 311 for housing 500, and a cover outer frame 350 provided so as to surround the cover main body portion 310 with a gap serving as a resin filling portion 370 between the cover main body portion 310 and the cover main body portion 310. , a plurality of connecting portions 360 connecting the cover outer frame 350 and the cover main body portion 310, and a screw connecting portion 351 formed on the outer surface of the cover 300, and the cover 300 is screwed. The light emitting diode 500 is hermetically sealed by filling the resin filling portion 370 with the filling resin material 400 from between the connecting portions 360 while the light emitting diode 500 is connected to the heat sink 200 at the connecting portion 351 .
　まず、この防爆型発光ダイオードユニット３０００を構成する基板１００には、複数個の発光ダイオード５００が碁盤目状に実装されている。例えば、この基板１００を図３に示すように田の字状に４個並べて一つの防爆型発光ダイオードユニット３０００としている。
　また、この基板１００の四隅には、基板１００自身とともにカバー３００を後述するヒートシンク２００に固定するための固定ビス４５０を避けるための略１／４円状の切欠き部１１１が形成されている。さらに、この基板１００の各辺の中央部分には固定ビス４５０が貫通する基板側貫通孔１１０が開設されている。かかる切欠き部１１１や基板側貫通孔１１０は、実装される発光ダイオード５００にかからない位置に開設されていることはいうまでもない。 First, a plurality of light-emitting diodes 500 are mounted in a grid pattern on the substrate 100 constituting the explosion-proof light-emitting diode unit 3000 . For example, as shown in FIG. 3, four substrates 100 are arranged in the shape of a square to form one explosion-proof light emitting diode unit 3000 .
Further, at the four corners of the substrate 100, notch portions 111 of approximately quarter circle shape are formed to avoid fixing screws 450 for fixing the cover 300 together with the substrate 100 itself to the heat sink 200 which will be described later. Further, a substrate-side through hole 110 through which a fixing screw 450 penetrates is formed in the central portion of each side of the substrate 100 . Needless to say, the notch 111 and the board-side through-hole 110 are formed at positions not overlapping the light-emitting diode 500 to be mounted.
　かかる基板１００が取り付けられるヒートシンク２００は、例えばアルミダイキャスト製であって、防爆型発光ダイオードユニット３０００の大部分を占めており、防爆型発光ダイオードユニット３０００の本体ケースとしての機能も果たしている。
　このヒートシンク２００は、図２等に示すように、基板１００が載置される平坦な載置面２１０を有している。 The heat sink 200 to which the substrate 100 is attached is made of die-cast aluminum, for example, and occupies most of the explosion-proof light emitting diode unit 3000, and also functions as a body case of the explosion-proof light emitting diode unit 3000.
The heat sink 200 has a flat mounting surface 210 on which the substrate 100 is mounted, as shown in FIG. 2 and the like.
　前記載置面２１０は、基板１００が載置される部分であるため、平坦に形成されている。この載置面２１０の四隅には、基板１００の基板側貫通孔に対応した位置に固定ビスに対応したヒートシンク側ビス孔が開設されている。
　なお、この載置面２１０のうち、後述する充填樹脂材４００が接する箇所は粗面に仕上げることで充填樹脂材４００との密着性を向上させている。
　粗面に仕上げるためには各種の方法があるが、例えば、塗装面を艶消しにすることで微小な凹凸を形成するという方法がある。 Since the mounting surface 210 is a portion on which the substrate 100 is mounted, it is formed flat. At the four corners of the mounting surface 210, heat sink side screw holes corresponding to fixing screws are opened at positions corresponding to the board side through holes of the board 100. As shown in FIG.
Note that, of the mounting surface 210, a portion with which the filling resin material 400, which will be described later, is in contact is roughened to improve adhesion with the filling resin material 400. FIG.
There are various methods for finishing a rough surface. For example, there is a method of matting a painted surface to form fine irregularities.
　カバー３００は、透光性を有する合成樹脂から構成されている。
　カバー３００のカバー本体部３１０は、ヒートシンク２００の載置面２１０に載置された基板１００を格納する基板用凹部（図示省略）を有している。すなわち、カバー本体部３１０の裏面側には、基板１００の形状、サイズに対応した凹みが基板用凹部として形成されているのである。
　また、このカバー本体部３１０の基板用凹部には、図１（Ｃ）に示すように、基板１００に実装された発光ダイオード５００の配置パターンに応じた複数個の発光ダイオード用凹部５１１が形成されている。この発光ダイオード用凹部５１１は、基板用凹部よりさらに表面側に向かって凸の略ドーム状に形成されることになる。
　なお、図１（Ｃ）に示した発光ダイオード用凹部５１１のパターン，サイズ等は一例であり、本発明がこれらに限定されるものでないことはいうまでもない。 The cover 300 is made of a translucent synthetic resin.
A cover body portion 310 of the cover 300 has a substrate recess (not shown) for storing the substrate 100 placed on the placement surface 210 of the heat sink 200 . That is, a recess corresponding to the shape and size of the substrate 100 is formed as a substrate recess on the rear surface side of the cover body portion 310 .
In addition, as shown in FIG. 1C, a plurality of light-emitting diode recesses 511 corresponding to the layout pattern of the light-emitting diodes 500 mounted on the substrate 100 are formed in the substrate recesses of the cover body portion 310 . ing. The light-emitting diode recess 511 is formed in a substantially dome shape that protrudes further toward the surface side than the substrate recess.
It goes without saying that the pattern, size, etc. of the light-emitting diode recess 511 shown in FIG. 1C are merely examples, and the present invention is not limited to these.
　カバー３００のカバー本体部３１０の外側には、カバー本体部３１０との間に間隙を有してカバー外枠３５０が形成されている。
　カバー本体３１０とカバー外枠３５０とは、一定間隔で離れて形成された複数個の連結部３６０によって連結されている。
　このカバー本体３１０とカバー外枠３５０との間の間隙、より詳しくはカバー本体３１０とカバー外枠３５０と、両者を連結する連結部３６０の下面３６２と、ヒートシンク２００の載置面２１０との間の間隙が後述する樹脂充填部３７０として機能する。 A cover outer frame 350 is formed outside the cover body portion 310 of the cover 300 with a gap therebetween.
The cover main body 310 and the cover outer frame 350 are connected by a plurality of connecting portions 360 spaced apart from each other.
The gap between the cover main body 310 and the cover outer frame 350, more specifically, between the cover main body 310 and the cover outer frame 350, the lower surface 362 of the connecting portion 360 that connects them, and the mounting surface 210 of the heat sink 200 functions as a resin filling portion 370 which will be described later.
　この連結部３６０の厚さ寸法は、図２に示すように、カバー本体部３１０の厚さ寸法より小さく形成されている。しかも連結部３６０は、その上面３６１がカバー外枠３５０の上縁と一致している。このため、連結部３６０とヒートシンク２００の載置面２１０との間には隙間が形成されることになる。この隙間は上述したように、カバー本体３１０とカバー外枠３５０と、両者を連結する連結部３６０の下面３６２と、ヒートシンク２００の載置面２１０との間の間隙となり、樹脂充填部３７０に相当する。 The thickness dimension of this connecting portion 360 is formed to be smaller than the thickness dimension of the cover body portion 310, as shown in FIG. Moreover, the connecting portion 360 has its upper surface 361 aligned with the upper edge of the cover outer frame 350 . Therefore, a gap is formed between the connecting portion 360 and the mounting surface 210 of the heat sink 200 . As described above, this gap becomes the gap between the cover main body 310, the cover outer frame 350, the lower surface 362 of the connecting portion 360 connecting them, and the mounting surface 210 of the heat sink 200, and corresponds to the resin filling portion 370. do.
　また、連結部３６０は、上面３６１が平坦に、かつ下面３６２が下側に向かって凸になったくさび状に形成されている。
　連結部３６０の上面３６１が平坦に形成されているのは、連結部３６０の間の隙間から樹脂充填部３７０に充填される充填樹脂材４００の最小充填量を把握しやすくするためである。すなわち、充填樹脂材４００は、少なくとも連結部３６０の上面３６１に達するまでは樹脂充填部３７０に充填される必要があるため、上面６３１を平坦に形成しておくことで充填樹脂材４００が連結部３６０の上面３６１にまだ達していない状態を把握しやすくするためである。 The connecting portion 360 is formed in a wedge shape with a flat upper surface 361 and a lower surface 362 that protrudes downward.
The reason why the upper surface 361 of the connecting portion 360 is formed flat is that the minimum filling amount of the filling resin material 400 to be filled in the resin filling portion 370 can be easily grasped from the gap between the connecting portions 360 . That is, since the filling resin material 400 needs to be filled in the resin filling portion 370 at least until it reaches the upper surface 361 of the connecting portion 360, the filling resin material 400 is allowed to flow through the connecting portion by forming the upper surface 631 flat. This is to make it easier to grasp the state in which the upper surface 361 of 360 has not yet been reached.
　一方、連結部３６０の下面３６２が、下側に向かって凸になったくさび状に形成されているのは、以下の理由による。
　すなわち、連結部３６０の下面３６２が平坦に形成されていたとすると、樹脂充填部３７０に充填される充填樹脂材４００の流れが下面３６２の部分で不均一になるおそれがあるためである。もし樹脂樹脂材４００の流れが不均一になると、ある部分では充填樹脂材４００が連結部３６０の上面３６１を大幅に超過しているにも関わらず、その他の部分では充填樹脂材４００が連結部３６０の上面３６１にまで達しないという事態が生じるおそれがある。かかる状態であると、発光ダイオード５００を確実に密閉することができなくなるそれがある。
　しかしながら、連結部３６０の下面３６２が下側に向かって凸になったくさび状に形成されていると、充填樹脂材４００は連結部３６０の下面３６２の形状に沿ってスムーズに流れるため、上述のような問題が生じないのである。 On the other hand, the reason why the lower surface 362 of the connecting portion 360 is formed in a wedge shape that protrudes downward is as follows.
That is, if the lower surface 362 of the connecting portion 360 is formed flat, the flow of the filling resin material 400 filling the resin filling portion 370 may become uneven at the portion of the lower surface 362 . If the flow of the resin material 400 becomes uneven, even though the filled resin material 400 greatly exceeds the upper surface 361 of the connecting portion 360 in one portion, the filled resin material 400 does not flow through the connecting portion in other portions. A situation may occur in which the upper surface 361 of 360 is not reached. In such a state, it may become impossible to reliably seal the light emitting diode 500 .
However, when the lower surface 362 of the connecting portion 360 is formed in a wedge shape that protrudes downward, the filling resin material 400 smoothly flows along the shape of the lower surface 362 of the connecting portion 360. No such problem arises.
　さらに、このカバー外枠３５０の外側面には、図１（Ａ）、（Ｃ）に示すように、合計８個のビス連結部３５１が形成されている。４個のビス連結部３５１はカバー外枠３５０の四隅に、残りの４個のビス連結部３５１はカバー外枠３５０の中央位置にそれぞれ形成されている。
　このビス連結部３５１を用いて、ヒートシンク２００の載置面２１０に載置された基板１００をカバーした状態でカバー３００をヒートシンク２００に構造的に連結固定するのである。
　もちろん、上述した充填樹脂材４００の樹脂充填部３７０への充填は、カバー３００をヒートシンク２００に連結固定した状態で行われる。 Further, a total of eight screw connection portions 351 are formed on the outer surface of the cover outer frame 350 as shown in FIGS. 1(A) and 1(C). The four screw connection portions 351 are formed at the four corners of the cover outer frame 350, and the remaining four screw connection portions 351 are formed at the central position of the cover outer frame 350, respectively.
By using the screw connecting portion 351 , the cover 300 is structurally connected and fixed to the heat sink 200 while covering the substrate 100 mounted on the mounting surface 210 of the heat sink 200 .
Of course, the above-described filling of the resin filling portion 370 with the filling resin material 400 is performed while the cover 300 is connected and fixed to the heat sink 200 .
　この防爆型発光ダイオードユニット３０００のより詳細な組立手順は以下の通りである。
　まず、基板１００をヒートシンク２００の載置面２１０に載置し、基板１００とヒートシンク２００とを固定ビス（図示省略）によって連結固定する。
　なお、この状態で発光ダイオード５００の図示しないケーブルは必要箇所に電気的に接続されるものとする。 A more detailed assembly procedure for this explosion-proof light emitting diode unit 3000 is as follows.
First, the substrate 100 is placed on the mounting surface 210 of the heat sink 200, and the substrate 100 and the heat sink 200 are connected and fixed with fixing screws (not shown).
In this state, a cable (not shown) of the light emitting diode 500 is electrically connected to a required location.
　さらに、ヒートシンク２００及び基板１００の上にカバー３００を被せる。
　その際、カバー３００のカバー本体部３１０の基板用凹みに基板１００が嵌まり込むので、カバー３００は設定された位置に自然と収まる。この状態では、カバー本体部３１０に形成された発光ダイオード用凹部３１１に基板１００に実装された発光ダイオード５００が確実に格納されることになる。 Furthermore, the heat sink 200 and the substrate 100 are covered with the cover 300 .
At this time, the board 100 is fitted into the board recess of the cover main body 310 of the cover 300, so that the cover 300 is naturally fitted in the set position. In this state, the light emitting diode 500 mounted on the substrate 100 is securely housed in the light emitting diode recess 311 formed in the cover main body 310 .
　カバー３００を８個のビス４５０を８個のビス連結部３５１に貫通させてヒートシンク２００へと連結固定する。
　この後、連結部３６０の間からカバー本体部３１０とカバー外枠３５０との間の樹脂充填部３７０に充填樹脂材４００を充填する。この充填に際しては、複数箇所から同時に樹脂材４００を充填することが望ましい。なぜならば、複数箇所から同時に充填することにより、樹脂充填部３７０に対してより均一な充填樹脂材４００の充填が可能になるためである。
　充填樹脂材４００は、少なくともすべての連結部３６０の上面３６１に達するまで樹脂充填部３７０に充填される。 The cover 300 is connected and fixed to the heat sink 200 by passing the eight screws 450 through the eight screw connecting portions 351 .
Thereafter, the filling resin material 400 is filled into the resin filling portion 370 between the cover main body portion 310 and the cover outer frame 350 from between the connecting portions 360 . At the time of this filling, it is desirable to fill the resin material 400 from a plurality of places at the same time. This is because, by simultaneously filling the resin filling portion 370 with the filling resin material 400 from a plurality of locations, it becomes possible to fill the resin filling portion 370 with the filling resin material 400 more uniformly.
The resin filling portion 370 is filled with the filling resin material 400 until it reaches at least the upper surface 361 of all the connecting portions 360 .
　その後、充填樹脂材４００の性質に応じて充填樹脂材４００の硬化作業を行う。紫外線照射によって硬化するタイプのものであれば紫外線照射を、加熱によって硬化するタイプのものであれば加熱を行うことになる。
　この充填樹脂材４００によって発光ダイオード５００が密閉されるため、この防爆型発光ダイオードユニット３０００は防爆タイプとなる。 After that, the filling resin material 400 is cured according to the properties of the filling resin material 400 . If it is a type that cures by ultraviolet irradiation, it is irradiated with ultraviolet rays, and if it is a type that cures by heating, it is heated.
Since the light-emitting diode 500 is sealed with the filling resin material 400, the explosion-proof light-emitting diode unit 3000 is an explosion-proof type.
　なお、上述した実施の形態では、連結部３６０の上面３６１は平坦であるとしたが、略蒲鉾状に盛り上がって形成されていてもよい。
　上面３６１が略蒲鉾状に形成されていたとすると、充填樹脂材４００が必要量、すなわち連結部３６０の上面３６１に達した後にさらに充填した場合、連結部３６０の上面３６１が徐々に充填樹脂材４００に埋もれていくことになるので、上面３６１が充填樹脂材４００から露出している面積が徐々に小さくなる。この事象が生じたならば、充填樹脂材４００の充填量が必要量に達したことを一目で確認することができる。 In addition, although the upper surface 361 of the connecting portion 360 is flat in the above-described embodiment, it may be formed to swell in a substantially semicylindrical shape.
Assuming that the top surface 361 is formed in a substantially semicylindrical shape, when the filling resin material 400 reaches the required amount, that is, the top surface 361 of the connecting portion 360 and then is further filled, the top surface 361 of the connecting portion 360 gradually fills the filling resin material 400 . Therefore, the exposed area of the upper surface 361 from the filling resin material 400 gradually decreases. If this event occurs, it can be confirmed at a glance that the filling amount of the filling resin material 400 has reached the required amount.
　本発明の第２の実施の形態に係防爆型発光ダイオードユニット１０００は、複数個の発光ダイオード５００と、この発光ダイオードが実装される基板１００の基板１００が取り付けられるヒートシンク２００と、前記発光ダイオード２００カバー３００とを備えており、前記ヒートシンク２００は、基板１００が載置される載置面２１０と、この載置面２１０から一段下がって載置面２１０の周囲に形成されたヒートシンク側凹溝２２０とを有しており、前記カバー３００は、発光ダイオード５００パターンに応じて発光ダイオード５００を格納する発光ダイオード用凹部３１１が形成されたカバー本体部３１０と、このカバー本体部３１０より一段下がって形成されたカバー周縁部３２０と、このカバー周縁部３２０の裏面側に形成された充填凹部３２１と、この充填凹部３２１に表面側から連通する注入口３２２とを有しており、カバー本体部３１０で発光ダイオード５００を覆うとカバー周縁部３２０はヒートシンク２００のヒートシンク側凹溝２２０内に位置し、注入口３２２から充填凹部３２１内に注入された充填樹脂材４００によって発光ダイオード５００が密閉されるようになっている。 The explosion-proof light emitting diode unit 1000 according to the second embodiment of the present invention includes a plurality of light emitting diodes 500, a heat sink 200 to which the substrate 100 of the substrate 100 on which the light emitting diodes are mounted, and the light emitting diodes 200. The heat sink 200 includes a mounting surface 210 on which the substrate 100 is mounted, and a heat sink-side recessed groove 220 formed around the mounting surface 210 one step downward from the mounting surface 210. The cover 300 includes a cover main body portion 310 formed with a light emitting diode recess 311 for storing the light emitting diode 500 according to the pattern of the light emitting diode 500, and a cover main body portion 310 that is one step lower than the cover main body portion 310. a filled recess 321 formed on the back side of the cover peripheral edge 320; and an injection port 322 communicating with the filled recess 321 from the surface side. When the light emitting diode 500 is covered, the cover peripheral edge portion 320 is positioned in the heat sink side concave groove 220 of the heat sink 200, and the light emitting diode 500 is sealed by the filling resin material 400 injected into the filling concave portion 321 from the inlet 322. It's becoming
　まず、この防爆型発光ダイオードユニット１０００を構成する基板１００には、複数個の発光ダイオード５００が碁盤目状に実装されている。例えば、この基板１００を図６に示すように田の字状に４個並べて一つの防爆型発光ダイオードユニット１０００としている。
　また、この基板１００の四隅には、基板１００自身とともにカバー３００を後述するヒートシンク２００に固定するための固定ビス４５０が貫通する基板側貫通孔１１０が開設されている。かかる基板側貫通孔１１０は、実装される発光ダイオード５００にかからない位置に開設されていることはいうまでもない。 First, a plurality of light emitting diodes 500 are mounted in a grid pattern on the substrate 100 that constitutes the explosion-proof light emitting diode unit 1000 . For example, as shown in FIG. 6, four substrates 100 are arranged in the shape of a square to form one explosion-proof light emitting diode unit 1000 .
Further, at the four corners of the substrate 100, substrate-side through holes 110 through which fixing screws 450 pass for fixing the cover 300 together with the substrate 100 itself to the heat sink 200 described later are formed. Needless to say, the board-side through hole 110 is opened at a position not overlapping the light emitting diode 500 to be mounted.
　かかる基板１００が取り付けられるヒートシンク２００は、例えばアルミダイキャスト製であって、防爆型発光ダイオードユニット１０００の大部分を占めており、防爆型発光ダイオードユニット１０００の本体ケースとしての機能も果たしている。
　このヒートシンク２００は、図６等に示すように、基板１００が載置される載置面２１０と、この載置面２１０の周囲に形成されるヒートシンク側凹溝２２０と、このヒートシンク側凹溝２２０のより外側周囲に形成された壁部２３０とが一体に形成されている。 The heat sink 200 to which the substrate 100 is attached is made of die-cast aluminum, for example, and occupies most of the explosion-proof light emitting diode unit 1000, and also functions as a body case of the explosion-proof light emitting diode unit 1000.
6 and the like, the heat sink 200 has a mounting surface 210 on which the substrate 100 is mounted, a heat sink side groove 220 formed around the mounting surface 210, and a heat sink side groove 220. is formed integrally with a wall portion 230 formed on the outer periphery of the .
　前記載置面２１０は、基板１００が載置される部分であるため、平坦に形成されている。この載置面２１０の四隅には、基板１００の基板側貫通孔１１０に対応した位置に固定ビス４５０に対応したヒートシンク側ビス孔２４０が開設されている。 Since the mounting surface 210 is a portion on which the substrate 100 is mounted, it is formed flat. At the four corners of the mounting surface 210 , heat sink side screw holes 240 corresponding to the fixing screws 450 are opened at positions corresponding to the board side through holes 110 of the board 100 .
　一方、前記カバー３００は、透光性を有する合成樹脂から構成されている。かかるカバー３００のカバー本体部３１０の裏面側、すなわち発光ダイオード５００に向かった面には、基板１００に実装された発光ダイオード５００の配置位置に対応した発光ダイオード用凹部３１１が形成されている。この発光ダイオード用凹部２１１は、基板１００に実装された発光ダイオード５００を覆うものであって、表面側に向かって凸の略ドーム状に形成されている。 On the other hand, the cover 300 is made of translucent synthetic resin. On the back side of the cover body portion 310 of the cover 300 , that is, on the surface facing the light emitting diode 500 , a light emitting diode concave portion 311 corresponding to the arrangement position of the light emitting diode 500 mounted on the substrate 100 is formed. The light-emitting diode concave portion 211 covers the light-emitting diode 500 mounted on the substrate 100, and is formed in a substantially dome shape that protrudes toward the surface side.
　また、このカバー３００の四隅、すなわち前記基板側貫通孔１１０に対応した位置には、カバー３００をヒートシンク２００に固定するための固定ビス４５０が貫通するカバー側貫通孔３３０が開設されている。
　従って、ヒートシンク２００の載置面２１０に基板１００を載置した後、当該基板１００をカバー３００で覆えば、基板側貫通孔１１０とカバー側貫通孔３３０とは同軸となり、ヒートシンク２００のヒートシンク側ビス孔２４０に対応することになる。 At the four corners of the cover 300 , that is, at positions corresponding to the board-side through-holes 110 , cover-side through-holes 330 through which fixing screws 450 for fixing the cover 300 to the heat sink 200 pass are formed.
Therefore, if the substrate 100 is placed on the mounting surface 210 of the heat sink 200 and then the substrate 100 is covered with the cover 300, the substrate side through hole 110 and the cover side through hole 330 become coaxial, and the heat sink side screw of the heat sink 200 is mounted. It will correspond to hole 240 .
　さらに、このカバー側貫通孔３３０の表面側周囲には略円筒形状の筒部３３１が形成されている。この筒部３３１は、固定ビス４５０で基板１００とカバー３００とをヒートシンク２００に固定したのち、カバー側貫通孔３３０と基板側貫通孔１１０とを密閉するためのビス用充填樹脂材４１０が充填される部分となる。 Further, a substantially cylindrical tubular portion 331 is formed around the surface side of the cover-side through-hole 330 . After fixing the substrate 100 and the cover 300 to the heat sink 200 with the fixing screws 450 , the cylindrical portion 331 is filled with a screw filling resin material 410 for sealing the cover-side through-hole 330 and the substrate-side through-hole 110 . part.
　また、このカバー３００のカバー周縁部３２０には、ヒートシンク２００のヒートシンク側凹溝２２０に連なる複数個の注入口３２２が開設されている。この注入口３２２は、カバー周縁部３２０の裏面側に設けられた充填凹部３２１に充填樹脂材４００を注入する部分となっている。　この注入口３２２から注入された充填樹脂材４００は、カバー３００の充填凹部３２１とヒートシンク２００のヒートシンク側凹溝２２０とによって囲まれた空間に充填され、外部と発光ダイオード５００との間を気密に遮断して発光ダイオード５００を密閉することになる。 In addition, a plurality of injection ports 322 are formed in the cover peripheral edge portion 320 of the cover 300 so as to be continuous with the heat sink side recessed grooves 220 of the heat sink 200 . The injection port 322 serves as a portion for injecting the filling resin material 400 into the filling concave portion 321 provided on the back side of the cover peripheral portion 320 . The filling resin material 400 injected from the injection port 322 fills the space surrounded by the filling recess 321 of the cover 300 and the heat sink side recess groove 220 of the heat sink 200, and airtightly seals the space between the outside and the light emitting diode 500. By blocking, the light emitting diode 500 is sealed.
　さらに、ヒートシンク２００のヒートシンク側凹溝２２０とカバー３００との間には、密閉性をより確実にするためのガスケット４７０が介在される。 Furthermore, a gasket 470 is interposed between the heat sink side recessed groove 220 of the heat sink 200 and the cover 300 to further ensure sealing.
　なお、充填樹脂材４００が接する箇所、例えば充填凹部３２１やヒートシンク側凹溝２２０は粗面に仕上げることで充填樹脂材４００との密着性を向上させている。なお、この粗面仕上げは、後述する第３の実施の形態でも同様である。
　粗面に仕上げるためには各種の方法があるが、例えば、塗装面を艶消しにすることで微小な凹凸を形成するという方法がある。 In addition, the contact with the filling resin material 400 , such as the filling recess 321 and the heat sink-side groove 220 , is finished to have a rough surface to improve adhesion with the filling resin material 400 . Note that this rough surface finishing is the same as in the third embodiment, which will be described later.
There are various methods for finishing a rough surface. For example, there is a method of matting a painted surface to form fine irregularities.
　上記構成の防爆型発光ダイオードユニット１０００は、以下のようにして組み立てられる。
　複数個の発光ダイオード５００が実装された基板１００をヒートシンク２００の載置面２１０に載置する。この際、基板１００の基板側貫通孔１１０と、ヒートシンク２００のヒートシンク側ビス孔２４０とを一致させる。
　なお、この状態で発光ダイオード５００の図示しないケーブルは必要箇所に電気的に接続されるものとする。
　基板１００のヒートシンク２００に対する設置と平行して、ヒートシンク２００のヒートシンク側凹溝２２０にガスケット４７０を位置させる。 The explosion-proof light emitting diode unit 1000 having the above configuration is assembled as follows.
The substrate 100 on which the plurality of light emitting diodes 500 are mounted is placed on the mounting surface 210 of the heat sink 200 . At this time, the substrate-side through holes 110 of the substrate 100 and the heat sink-side screw holes 240 of the heat sink 200 are aligned.
In this state, a cable (not shown) of the light emitting diode 500 is electrically connected to a required location.
In parallel with the placement of the substrate 100 on the heat sink 200 , the gasket 470 is positioned in the heat sink side groove 220 of the heat sink 200 .
　次に基板１００の上にカバー３００を載置する。カバー３００のカバー本体部３１０が基板１００に、カバー３００のカバー周縁部３２０がヒートシンク２００のヒートシンク側凹溝２２０にそれぞれ位置するようにする。さらに、カバー側貫通孔３３０は、前記基板側貫通孔１１０及びヒートシンク側ビス孔２４０に一致させる。
　これで、カバー３００のカバー本体部３１０の裏面側に形成された発光ダイオード用凹部３１１が、基板１００に実装された基板発光ダイオード５００に一致することになる。 Next, the cover 300 is placed on the substrate 100 . The cover body portion 310 of the cover 300 is positioned on the substrate 100 , and the cover peripheral edge portion 320 of the cover 300 is positioned on the heat sink side concave groove 220 of the heat sink 200 . Furthermore, the cover side through holes 330 are aligned with the board side through holes 110 and the heat sink side screw holes 240 .
As a result, the light-emitting diode concave portion 311 formed on the back side of the cover body portion 310 of the cover 300 is aligned with the substrate light-emitting diode 500 mounted on the substrate 100 .
　この状態を維持したまま、カバー側貫通孔３３０、基板側貫通孔１１０を介して固定ビス４５０をヒートシンク２００のヒートシンク側ビス孔２４０に螺合させる。
　この固定ビス４５０の螺合により、基板１００とカバー３００とはヒートシンク２００に対して構造的に連結固定されたことになる。 While maintaining this state, the fixing screws 450 are screwed into the heat sink side screw holes 240 of the heat sink 200 via the cover side through holes 330 and the board side through holes 110 .
By screwing the fixing screw 450 , the substrate 100 and the cover 300 are structurally connected and fixed to the heat sink 200 .
　次に発光ダイオード５００の密閉を完全にするために、カバー３００の注入口３２２から充填樹脂材４００を注入する。注入された充填樹脂材４００は、カバー３００の充填凹部３２１とヒートシンク２００のヒートシンク側凹溝２２０とで囲まれた空間に充填される。充填凹部３２１とヒートシンク側凹溝２２０とによって囲まれた空間に充填樹脂材４００が完全に充填されると、注入口３２２にまで充填樹脂材４００が及ぶため、前記空間が充填樹脂材４００によって完全に充填されたことが容易に判明する。
　なお、充填樹脂材４００の充填をより確実にするため、注入口３２２は複数箇所に設け、その複数の注入口３２２から充填樹脂材４００を同時に充填することが望ましい。 Next, in order to completely seal the light emitting diode 500 , the filling resin material 400 is injected from the injection port 322 of the cover 300 . The injected filling resin material 400 fills the space surrounded by the filling recess 321 of the cover 300 and the heat sink side groove 220 of the heat sink 200 . When the space surrounded by the filling recess 321 and the heat sink side groove 220 is completely filled with the filling resin material 400, the filling resin material 400 reaches the injection port 322, so that the space is completely filled with the filling resin material 400. It is easy to see that the
In addition, in order to ensure the filling of the filling resin material 400 more reliably, it is desirable to provide the injection ports 322 at a plurality of locations and to simultaneously fill the filling resin material 400 from the plurality of injection ports 322 .
　さらには、筒部３３１にビス用充填樹脂材４１０を充填する。
その後、充填樹脂材４００、ビス用充填樹脂材４１０の性質に応じて充填樹脂材４００、ビス用充填樹脂材４１０の硬化作業を行う。紫外線照射によって硬化するタイプのものであれば紫外線照射を、加熱によって硬化するタイプのものであれば加熱を行うことになる。
　この充填樹脂材４００とビス用充填樹脂材４１０、さらにはガスケット４７０によって発光ダイオード５００は密閉されるため、この防爆型発光ダイオードユニット１０００は防爆タイプとなる。 Furthermore, the cylindrical portion 331 is filled with the filling resin material 410 for screws.
Thereafter, the filling resin material 400 and the filling resin material 410 for screws are cured according to the properties of the filling resin material 400 and the filling resin material 410 for screws. If it is a type that cures by ultraviolet irradiation, it is irradiated with ultraviolet rays, and if it is a type that cures by heating, it is heated.
Since the light emitting diode 500 is sealed by the filling resin material 400, the screw filling resin material 410, and the gasket 470, the explosion-proof light emitting diode unit 1000 is an explosion-proof type.
　本発明の第３の実施の形態に係る防爆型発光ダイオードユニット２０００は、複数個の発光ダイオード５００と、この発光ダイオード５００が実装される基板１００と、この基板１００が取り付けられるヒートシンク２００と、前記発光ダイオード５００を覆うカバー３００とを備えており、前記ヒートシンク２００は、基板１００が載置される載置面２１０と、この載置面２１０から一段下がって載置面２１０の周囲に形成されたヒートシンク側凹溝２２０とを有しており、前記カバー３２００は、発光ダイオード５００の実装パターンに応じて発光ダイオード５００を格納する発光ダイオード用凹部３３１が形成されたカバー本体部３１０と、このカバー本体部３１０より一段下がって形成されたカバー周縁部３２０とを有しており、カバー本体部３１０で発光ダイオード５００を覆うとカバー周縁部３２０はヒートシンク２００のヒートシンク側凹溝２２０内に位置し、カバー３００は少なくともカバー周縁部３２０においてヒートシンク２００に固定ビス４５１で固定されており、前記固定ビス４５１を含めてヒートシンク側凹溝２２０に充填樹脂材４３０を充填することで発光ダイオード５００が密閉されるようになっている。 An explosion-proof light emitting diode unit 2000 according to the third embodiment of the present invention includes a plurality of light emitting diodes 500, a substrate 100 on which the light emitting diodes 500 are mounted, a heat sink 200 on which the substrate 100 is attached, and the A cover 300 covering the light emitting diode 500 is provided, and the heat sink 200 is formed around the mounting surface 210 on which the substrate 100 is mounted and the mounting surface 210 which is lowered from the mounting surface 210 by one step. The cover 3200 includes a cover main body 310 in which a light emitting diode recess 331 for housing the light emitting diode 500 is formed according to the mounting pattern of the light emitting diode 500, and the cover main body 310. The cover peripheral edge portion 320 is formed one step lower than the portion 310 . When the light emitting diode 500 is covered with the cover main body portion 310 , the cover peripheral edge portion 320 is positioned in the heat sink side concave groove 220 of the heat sink 200 , and the cover peripheral edge portion 320 300 is fixed to heat sink 200 with fixing screws 451 at least at cover peripheral edge portion 320, and light emitting diode 500 is sealed by filling filling resin material 430 into heat sink side concave groove 220 including fixing screws 451. It has become.
　なお、上述した第１、第２の実施の形態に係る防爆型発光ダイオードユニット３０００、１０００と実質的に同一の部材については同一の番号を付して説明を行う。
　例えば、基板１００、この基板１００に実装される発光ダイオード５００、カバー３００、ヒートシンク２００の如きである。 Note that the members that are substantially the same as those of the explosion-proof light emitting diode units 3000 and 1000 according to the above-described first and second embodiments are given the same reference numerals for explanation.
For example, a substrate 100, a light emitting diode 500 mounted on this substrate 100, a cover 300, a heat sink 200, and the like.
　かかる防爆型発光ダイオードユニット２０００が上述した第２の実施の形態に係る防爆型発光ダイオードユニット１０００と大きく相違する点は、充填樹脂材４００が上述の空間のように閉ざされた箇所に充填されるのではなく、開放された箇所に充填される点にある。 The explosion-proof light-emitting diode unit 2000 differs greatly from the explosion-proof light-emitting diode unit 1000 according to the above-described second embodiment in that the filling resin material 400 is filled in a closed place like the space described above. It is the point that the open area is filled instead of the open area.
　カバー３００は、透光性を有する合成樹脂から構成されている。
　かかるカバー３００は、図７等に示すように、発光ダイオード用凹部３１１が裏面側に形成されたカバー本体部３１０と、このカバー本体部３１０の周囲に一段下がって形成されたカバー周縁部３２０とを有している。カバー周縁部３２０は、ヒートシンク２００の載置面２１０から一段下がって載置面２１０の周囲に形成されたヒートシンク側凹溝２２０に嵌まり込むようになっている。 The cover 300 is made of a translucent synthetic resin.
As shown in FIG. 7 and the like, the cover 300 includes a cover main body portion 310 having a light emitting diode concave portion 311 formed on the back side, and a cover peripheral edge portion 320 formed around the cover main body portion 310 so as to be one step lower. have. The cover peripheral edge portion 320 is lowered from the mounting surface 210 of the heat sink 200 by one step and fitted into the heat sink side concave groove 220 formed around the mounting surface 210 .
　カバー本体部３１０には、発光ダイオード用凹部３１１を避けた位置に複数個のカバー本体側貫通孔３３０が開設されている。さらに、カバー周縁部３２０にも複数個のカバー周縁部側貫通孔３２３が開設されている。カバー周縁部３２０にカバー周縁部側貫通孔３２３が開設されている点が、上述した第２の実施の形態に係る防爆型発光ダイオードユニット１０００と異なる点である。
　もちろん、ヒートシンク２００には、両貫通孔３３０、３２３に対応した位置にヒートシンク側ビス孔２４０が開設されている。 A plurality of cover main body side through holes 330 are formed in the cover main body section 310 at positions avoiding the light emitting diode recesses 311 . Further, the cover peripheral edge portion 320 is also provided with a plurality of cover peripheral edge portion side through holes 323 . The difference from the explosion-proof light emitting diode unit 1000 according to the second embodiment is that a cover peripheral edge portion side through hole 323 is formed in the cover peripheral edge portion 320 .
Of course, the heat sink 200 is provided with heat sink side screw holes 240 at positions corresponding to the through holes 330 and 323 .
　なお，基板１００には，上述した第２の実施の形態に係る防爆型発光ダイオードユニット１０００と同様に、複数個の発光ダイオード５００が碁盤目状に実装されている。例えば、この基板１００を第１の実施の形態に係る防爆型発光ダイオードユニット３０００や第２の実施の形態に係る防爆型発光ダイオードユニット１０００と同様に田の字状に４個並べて一つの防爆型発光ダイオードユニット２０００としている。
　また、この基板１００の四隅には、基板１００自身をヒートシンク２００に固定するための固定ビス４５０が貫通する基板側貫通孔１１０が開設されている。かかる基板側貫通孔１１０は、実装される発光ダイオード５００にかからない位置に開設されていることはいうまでもない。
　もちろん、カバー本体側貫通孔３３０と、基板側貫通孔１１０と、それに対応するヒートシンク側ビス孔２４０とは一致するように設定されている。 A plurality of light emitting diodes 500 are mounted on the substrate 100 in a grid like the explosion-proof light emitting diode unit 1000 according to the second embodiment. For example, like the explosion-proof light emitting diode unit 3000 according to the first embodiment and the explosion-proof light emitting diode unit 1000 according to the second embodiment, four substrates 100 are arranged in a square square shape to form one explosion-proof light emitting diode unit. A light emitting diode unit 2000 is used.
Further, at the four corners of the substrate 100, substrate-side through holes 110 through which fixing screws 450 for fixing the substrate 100 itself to the heat sink 200 pass are formed. Needless to say, the board-side through hole 110 is opened at a position not overlapping the light emitting diode 500 to be mounted.
Of course, the cover main body side through hole 330, the board side through hole 110, and the corresponding heat sink side screw hole 240 are set to coincide with each other.
　また、ヒートシンク２００のヒートシンク側凹溝２２０には、カバー３００のカバー周縁部側貫通孔３２３に対応したヒートシンク側凹溝ビス孔２２１が開設されている。 Also, the heat sink side groove 220 of the heat sink 200 is provided with a heat sink side groove screw hole 221 corresponding to the cover peripheral edge side through hole 323 of the cover 300 .
　このように構成された防爆型発光ダイオードユニット２０００は、下のようにして組み立てられる。
　まず、基板１００をヒートシンク２００の載置面２１０に載置する。すると、基板１００の基板側貫通孔１１０とそれに対応するヒートシンク側ビス孔２４０とは一致する。
　なお、この状態で発光ダイオード５００の図示しないケーブルは必要箇所に電気的に接続されるものとする。 The explosion-proof light emitting diode unit 2000 configured in this way is assembled as follows.
First, the substrate 100 is mounted on the mounting surface 210 of the heat sink 200 . Then, the board-side through holes 110 of the board 100 and the corresponding heat sink-side screw holes 240 are aligned.
In this state, a cable (not shown) of the light emitting diode 500 is electrically connected to a required location.
　次に、カバー３００を基板１００に被せる。すなわち、カバー３００のカバー本体部３１０で基板１００を覆い、カバー周縁部３２０をヒートシンク側凹溝２２０に位置させる。この状態では、カバー３００のカバー本体側貫通孔３３０と基板１００の基板側貫通孔１１０とがヒートシンク２００のヒートシンク側ビス孔２４０と一致し、かつカバー３００のカバー周縁部側貫通孔３２３とヒートシンク２００のヒートシンク側凹溝ビス孔２２１とが一致する。 Next, cover 300 is placed on substrate 100 . That is, the substrate 100 is covered with the cover body portion 310 of the cover 300 , and the cover peripheral edge portion 320 is positioned in the heat sink side groove 220 . In this state, the cover main body side through holes 330 of the cover 300 and the board side through holes 110 of the board 100 are aligned with the heat sink side screw holes 240 of the heat sink 200, and the cover peripheral side through holes 323 of the cover 300 and the heat sink 200 are aligned. coincide with the heat sink side recessed screw holes 221 of .
　カバー本体側貫通孔３３０、基板側貫通孔１１０を介してヒートシンク側ビス孔３３０に固定ビス４５０を螺合する。それと同時に、カバー周縁部貫通孔３２３を介して固定ビス４５１をヒートシンク側凹溝ビス孔２２１に螺合する。
　この２種類の固定ビス４５０、４５１によって、基板１００及びカバー３００はヒートシンク２００に対して構造的に連結固定されたことになる。 Fixing screws 450 are screwed into the heat sink side screw holes 330 via the cover main body side through holes 330 and the board side through holes 110 . At the same time, the fixing screw 451 is screwed into the heat sink side recessed screw hole 221 via the cover peripheral portion through-hole 323 .
The substrate 100 and the cover 300 are structurally connected and fixed to the heat sink 200 by these two types of fixing screws 450 and 451 .
　さらに、充填樹脂材４３０をヒートシンク側凹溝２２０に充填する。
　この充填樹脂材４３０をヒートシンク側凹溝２２０に充填すると、カバー周縁部３２０と、カバー周縁部３２０に開設されたカバー周縁部貫通孔３２３と、カバー周縁部貫通孔３２３を貫通した固定ビス５４１までもが充填樹脂材４３０によって覆われ、発光ダイオード５００が密閉されるため、この防爆型発光ダイオードユニット２０００は防爆タイプとなる。 Further, the heat sink side groove 220 is filled with the filling resin material 430 .
When the filling resin material 430 is filled into the heat sink side recessed groove 220 , the cover peripheral edge portion 320 , the cover peripheral edge portion through hole 323 formed in the cover peripheral edge portion 320 , and the fixing screw 541 passing through the cover peripheral edge portion through hole 323 are covered. Since the body is covered with the filling resin material 430 and the light-emitting diode 500 is sealed, the explosion-proof light-emitting diode unit 2000 is an explosion-proof type.
　なお、上述した３つの実施例では、４個の基板１００をヒートシンク２００に田の字状に並べるとしたが、本発明は限定されることなく、任意のパターンで基板１００を配置することができるし、１個の基板１００のみから構成することができることはいうまでもない。 In the above-described three embodiments, the four substrates 100 are arranged on the heat sink 200 in a square grid pattern, but the present invention is not limited, and the substrates 100 can be arranged in any pattern. However, it goes without saying that it can be constructed from only one substrate 100 .
　１００　　基板
　２００　　ヒートシンク
　２１０　　載置面
　２２０　　ヒートシンク側凹溝
　３００　　カバー
　３１０　　カバー本体部
　３１１　　発光ダイオード用凹部
　３５０　　カバー外枠
　３５１　　ビス連結部
　３６０　　連結部
　３７０　　樹脂充填部
　４００　　充填樹脂材
　５００　　発光ダイオード REFERENCE SIGNS LIST 100 substrate 200 heat sink 210 mounting surface 220 heat sink side concave groove 300 cover 310 cover main body 311 recess for light emitting diode 350 cover outer frame 351 screw connecting portion 360 connecting portion 370 resin filling portion 400 filling resin material 500 light emitting diode

Claims (8)

  1. 　少なくとも１つの発光ダイオードと、この発光ダイオードが実装される基板と、この基板が取り付けられるヒートシンクと、前記発光ダイオードを覆うカバーとを具備しており、前記ヒートシンクは、基板が載置される載置面を有しており、前記カバーは、発光ダイオードの実装パターンに応じて発光ダイオードを格納する発光ダイオード用凹部が形成されたカバー本体部と、このカバー本体部との間に樹脂充填部としての間隙を有して取り囲むように設けられたカバーと、このカバー外枠と前記カバー本体部とを連結する複数個の連結部と、前記カバー外枠の外側面に形成されたビス連結部とを有しており、前記カバーをビス連結部においてヒートシンクに連結した状態で連結部の間から樹脂材を樹脂充填部に充填することで発光ダイオードが密閉されることを特徴とする防爆型発光ダイオードユニット。 It comprises at least one light-emitting diode, a substrate on which the light-emitting diode is mounted, a heat sink to which the substrate is attached, and a cover that covers the light-emitting diode, and the heat sink is a mount on which the substrate is mounted. The cover has a cover main body portion in which a light emitting diode recess for housing the light emitting diode according to the mounting pattern of the light emitting diode is formed, and a resin filling portion between the cover main body portion and the cover main body portion. A cover provided to surround with a gap, a plurality of connecting portions connecting the cover outer frame and the cover main body, and a screw connecting portion formed on the outer surface of the cover outer frame. wherein the light emitting diode is hermetically sealed by filling the resin filling portion with a resin material from between the connecting portions in a state where the cover is connected to the heat sink at the screw connecting portion. .
  2. 　前記連結部は、厚さ寸法がカバー本体部の厚さ寸法より小さく形成されており、樹脂材は、少なくとも連結部の上面に達するまで樹脂充填部に充填されることを特徴とする請求項１記載の防爆型発光ダイオードユニット。 2. A thickness dimension of the connecting portion is smaller than a thickness dimension of the cover body portion, and the resin filling portion is filled with the resin material until it reaches at least an upper surface of the connecting portion. Explosion-proof light-emitting diode unit as described.
  3. 　前記連結部は、上面が平坦に形成されていることを特徴とする請求項１又は２記載の防爆型発光ダイオードユニット。 The explosion-proof light-emitting diode unit according to claim 1 or 2, wherein the connecting portion has a flat upper surface.
  4. 　前記連結部は、下面が下側に向かって凸になったくさび状に形成されていることを特徴とする請求項１、２又は３記載の防爆型発光ダイオードユニット。 The explosion-proof light-emitting diode unit according to claim 1, 2 or 3, wherein the connecting portion is formed in a wedge shape with a lower surface convex downward.
  5. 　少なくとも１つの発光ダイオードと、この発光ダイオードが実装される基板と、この基板が取り付けられるヒートシンクと、前記発光ダイオードを覆うカバーとを具備しており、前記ヒートシンクは、基板が載置される載置面と、この載置面から一段下がって載置面の周囲に形成されたヒートシンク側凹溝とを有しており、前記カバーは、発光ダイオードの実装パターンに応じて発光ダイオードを格納する発光ダイオード用凹部が形成されたカバー本体部と、このカバー本体部より一段下がって形成されたカバー周縁部と、このカバー周縁部の裏面側に形成された充填凹部と、この充填凹部に表面側から連通する注入口とを有しており、カバー本体部で発光ダイオードを覆うとカバー周縁部はヒートシンクのヒートシンク側凹溝内に位置し、注入口から充填凹部内に注入された充填樹脂材によって発光ダイオードが密閉されることを特徴とする防爆型発光ダイオードユニット。 It comprises at least one light-emitting diode, a substrate on which the light-emitting diode is mounted, a heat sink to which the substrate is attached, and a cover that covers the light-emitting diode, and the heat sink is a mount on which the substrate is mounted. and a heat-sink-side concave groove formed around the mounting surface one step downward from the mounting surface, and the cover stores the light-emitting diode according to the mounting pattern of the light-emitting diode. a cover main body portion formed with a recess for use, a cover peripheral portion formed one step lower than the cover main body portion, a filling recess formed on the back side of the cover peripheral portion, and the filling recess communicating with the filling recess from the surface side. When the light emitting diode is covered with the cover main body, the peripheral edge of the cover is positioned in the recessed groove on the heat sink side of the heat sink, and the filling resin material injected into the filling recess from the filling port fills the light emitting diode. is hermetically sealed.
  6. 　前記カバーには自身をヒートシンクに固定するための固定ビスが貫通するカバー側貫通孔が開設されており、このカバー側貫通孔を介してヒートシンクに結合された固定ビスは、カバー側貫通孔に充填されるビス用充填樹脂材によって封止されることを特徴とする請求項５記載の防爆型発光ダイオードユニット。 The cover has a cover-side through-hole through which a fixing screw for fixing itself to the heat sink passes. The fixing screw coupled to the heat sink via the cover-side through-hole fills the cover-side through hole. 6. The explosion-proof light emitting diode unit according to claim 5, wherein the explosion-proof light emitting diode unit is sealed with a screw filling resin material.
  7. 　前記カバーのカバー周縁部とヒートシンクのヒートシンク側凹溝との間には、ガスケットが介在しており、このガスケットは前記充填凹部とは独立して存在していることを特徴とする請求項５又は６記載の防爆型発光ダイオードユニット。 6. A gasket is interposed between the cover peripheral edge portion of the cover and the heat sink side groove of the heat sink, and the gasket exists independently of the filling recess. 7. The explosion-proof light emitting diode unit according to 6.
  8. 　少なくとも１つの発光ダイオードと、この発光ダイオードが実装される基板と、この基板が取り付けられるヒートシンクと、前記発光ダイオードを覆うカバーとを具備しており、前記ヒートシンクは、基板が載置される載置面と、この載置面から一段下がって載置面の周囲に形成されたヒートシンク側凹溝とを有しており、前記カバーは、発光ダイオードの実装パターンに応じて発光ダイオードを格納する発光ダイオード用凹部が形成されたカバー本体部と、このカバー本体部より一段下がって形成されたカバー周縁部とを有しており、カバー本体部で発光ダイオードを覆うとカバー周縁部はヒートシンクのヒートシンク側凹溝内に位置し、カバーは少なくともカバー周縁部においてヒートシンクに固定ビスで固定されており、前記固定ビスを含めてヒートシンク側凹溝に樹脂材を充填することで発光ダイオードが密閉されることを特徴とする防爆型発光ダイオードユニット。 It comprises at least one light-emitting diode, a substrate on which the light-emitting diode is mounted, a heat sink to which the substrate is attached, and a cover that covers the light-emitting diode, and the heat sink is a mount on which the substrate is mounted. and a heat-sink-side concave groove formed around the mounting surface one step downward from the mounting surface, and the cover stores the light-emitting diode according to the mounting pattern of the light-emitting diode. The cover has a main body portion in which a concave portion is formed, and a peripheral edge portion of the cover is formed one step lower than the main body portion of the cover. The cover is positioned in the groove, and the cover is fixed to the heat sink at least at the peripheral edge of the cover with fixing screws, and the light emitting diode is sealed by filling the concave groove on the heat sink side, including the fixing screws, with a resin material. Explosion-proof light-emitting diode unit.
PCT/JP2021/047248 2021-12-21 2021-12-21 Explosion-proof light-emitting diode unit WO2023119403A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202180099883.4A CN117561615A (en) 2021-12-21 2021-12-21 Explosion-proof light-emitting diode unit
PCT/JP2021/047248 WO2023119403A1 (en) 2021-12-21 2021-12-21 Explosion-proof light-emitting diode unit
JP2023568807A JPWO2023119403A1 (en) 2021-12-21 2021-12-21
TW111110552A TW202327128A (en) 2021-12-21 2022-03-22 Explosion-proof light-emitting diode unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/047248 WO2023119403A1 (en) 2021-12-21 2021-12-21 Explosion-proof light-emitting diode unit

Publications (1)

Publication Number Publication Date
WO2023119403A1 true WO2023119403A1 (en) 2023-06-29

Family

ID=86901617

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/047248 WO2023119403A1 (en) 2021-12-21 2021-12-21 Explosion-proof light-emitting diode unit

Country Status (4)

Country Link
JP (1) JPWO2023119403A1 (en)
CN (1) CN117561615A (en)
TW (1) TW202327128A (en)
WO (1) WO2023119403A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310138A (en) * 2005-04-28 2006-11-09 Matsushita Electric Ind Co Ltd Light emitting unit, lighting system and display device
JP2007184310A (en) * 2005-12-29 2007-07-19 Citizen Electronics Co Ltd Light emitting device
JP2007194188A (en) * 2005-12-22 2007-08-02 Matsushita Electric Works Ltd Spotlight
JP2014029967A (en) * 2012-07-31 2014-02-13 Toshiba Lighting & Technology Corp Semiconductor device and manufacturing method of the same
CN104934515A (en) * 2015-06-26 2015-09-23 浙江亿米光电科技有限公司 Flexible lamp sheet, processing process for flexible lamp sheet, illumination apparatus applying lamp sheet and manufacturing method
WO2016170843A1 (en) * 2015-04-20 2016-10-27 株式会社アスター Illumination device
JP2019197673A (en) * 2018-05-10 2019-11-14 岩崎電気株式会社 Light emitting device, lighting device, and manufacturing method of light emitting device
JP2021089863A (en) * 2019-12-05 2021-06-10 三菱電機株式会社 Luminaire

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310138A (en) * 2005-04-28 2006-11-09 Matsushita Electric Ind Co Ltd Light emitting unit, lighting system and display device
JP2007194188A (en) * 2005-12-22 2007-08-02 Matsushita Electric Works Ltd Spotlight
JP2007184310A (en) * 2005-12-29 2007-07-19 Citizen Electronics Co Ltd Light emitting device
JP2014029967A (en) * 2012-07-31 2014-02-13 Toshiba Lighting & Technology Corp Semiconductor device and manufacturing method of the same
WO2016170843A1 (en) * 2015-04-20 2016-10-27 株式会社アスター Illumination device
CN104934515A (en) * 2015-06-26 2015-09-23 浙江亿米光电科技有限公司 Flexible lamp sheet, processing process for flexible lamp sheet, illumination apparatus applying lamp sheet and manufacturing method
JP2019197673A (en) * 2018-05-10 2019-11-14 岩崎電気株式会社 Light emitting device, lighting device, and manufacturing method of light emitting device
JP2021089863A (en) * 2019-12-05 2021-06-10 三菱電機株式会社 Luminaire

Also Published As

Publication number Publication date
CN117561615A (en) 2024-02-13
TW202327128A (en) 2023-07-01
JPWO2023119403A1 (en) 2023-06-29

Similar Documents

Publication Publication Date Title
US8646701B2 (en) Moldable housing design for synthetic jet ejector
TWI532425B (en) Power supply and method for assembling the same
CN105492820B (en) By the assembling for the semiconductor lamp that the component independently manufactured is constituted
US10868412B2 (en) Cord grip with liquid drain
US11732854B2 (en) Trough-shaped lamp housing
WO2023119403A1 (en) Explosion-proof light-emitting diode unit
US9093615B2 (en) LED module, method for manufacturing the same, and LED channel letter including the same
JP5977635B2 (en) Sealing structure of casing and method of manufacturing casing having sealing structure
CN109417116B (en) LED lamp system
JP2012033884A (en) Package for semiconductor device, manufacturing method of the same and semiconductor device
US10352551B2 (en) LED module and method of sealing
KR102307086B1 (en) Lighting apparatus for encapsulation enclosure
CN110942728A (en) LED display module and display screen
US9915420B2 (en) Illuminating device with sealed optics
JP3241793U (en) Light-emitting module based on central reinforced fastening structure
JP2009266504A (en) Lighting fixture and assembling method thereof
EP4107424B1 (en) A light mixing chamber and a luminaire
JPWO2023119403A5 (en)
JP7394223B2 (en) electronic control unit
KR102301830B1 (en) Lighting apparatus for encapsulation enclosure
KR101254556B1 (en) Led module with silicon packing
US20200064544A1 (en) Light guide plate providing protection for electronics components of a printed circuit board
KR101173462B1 (en) Converter for light
KR100986143B1 (en) Led module
JP2019121732A (en) Electronic control device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21968840

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2023568807

Country of ref document: JP