CN104934515A - Flexible lamp sheet, processing process for flexible lamp sheet, illumination apparatus applying lamp sheet and manufacturing method - Google Patents
Flexible lamp sheet, processing process for flexible lamp sheet, illumination apparatus applying lamp sheet and manufacturing method Download PDFInfo
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- CN104934515A CN104934515A CN201510362880.1A CN201510362880A CN104934515A CN 104934515 A CN104934515 A CN 104934515A CN 201510362880 A CN201510362880 A CN 201510362880A CN 104934515 A CN104934515 A CN 104934515A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Abstract
The invention relates to a flexible lamp sheet, a processing process for the flexible lamp sheet, an illumination apparatus applying the lamp sheet and a manufacturing method, and solves the problems of unreasonable design and the like in the prior art. The flexible lamp sheet comprises a flexible substrate, wherein a control circuit is arranged on one side of the flexible substrate; a flexible insulated reflective layer capable of packaging the control circuit is further arranged on one side, provided with the control circuit, of the flexible substrate; a plurality of positioning through holes discretely arranged in the length direction of the control circuit are formed in the flexible insulated reflective layer; a plurality of LED chips discretely arranged in the length direction of the control circuit and corresponding to the positioning through holes in a one-to-one manner are arranged on the control circuit; the LED chips are positioned in the positioning through holes; and a flexible packaging structure capable of packaging the LED chips is arranged on one side, far away from the flexible substrate, of the flexible insulated reflective layer. The processing process for the flexible lamp sheet comprises the steps of: A, bonding; and B, packaging. The flexible lamp sheet has the advantage of high luminous brightness.
Description
Technical field
The invention belongs to lighting technical field, particularly relate to lighting device and manufacture method that a kind of flexible light sheet and processing technology thereof apply this lamp sheet.
Background technology
Light-emitting diode is referred to as LED.Along with the development of social technology, increasing LED is manufactured and apply.And the structure of existing LED chip is generally: rigid stent and the luminous element be arranged on rigid stent, luminous element is provided with LED chip, LED chip is connected with two gold threads, finally by packaging plastic, single led chip (luminous element) is encapsulated.This structure not only complex structure, and manufacturing cost is higher and manufacture process is loaded down with trivial details, and production efficiency is low, has a strong impact on the production efficiency of enterprise.For this reason, people have carried out long-term exploration, propose solution miscellaneous.
Such as, Chinese patent literature discloses a kind of flexible LED strip, [application number: 201320777944.0], comprise the soft light colloid of LED lamp and parcel LED lamp, described LED lamp is made up of the soft rectangle PVC adhesive tape of the fastening FPC of a being provided with flexible circuit board in surface, the FPC flexible circuit board of described soft rectangle PVC adhesive tape at least two parallel surfaces is welded with LED sheet, and described LED sheet welds in FPC flexible circuit board equably in SMT mode.This product is comprehensive carries out luminescence evenly, and result of use is outstanding, firm in structure while its pliability is strong, effectively guarantee internal wiring not easy fracture in use procedure, the inconvenience in production process in the past can be solved very well simultaneously, actively enhance productivity, thus reduce cost and consumption of raw materials.In addition, such as, Chinese patent literature also discloses a kind of flip LED, [application number: 201020284955.1], comprise electrode and the Sapphire Substrate that substrate surface be located at successively by substrate, described substrate surface both sides are respectively equipped with external electrode, and because Sapphire Substrate is connected with substrate by electrode, substrate serves the effect of support simultaneously, substrate surface is provided with external electrode, when encapsulating LED without the need to external lead wire separately, make volume-diminished, packaging density gets a promotion.
Above-mentioned scheme improves prior art to a certain extent, particularly eliminates gold thread, but above-mentioned scheme also at least exists following defect: complex structure and not easily manufacturing, and luminosity is low and useful life is short, poor practicability.
Summary of the invention
The object of the invention is for the problems referred to above, provide a kind of design more reasonable, the simple and flexible light sheet that brightness is high of structure.
Another object of the present invention is for the problems referred to above, provides a kind of technique simple and can improve the processing technology of the flexible light sheet of brightness.
Of the present invention also have an object to be for the problems referred to above, provides a kind of structure simple and the LED light device that brightness is high.
Another object of the present invention is for the problems referred to above, provides a kind of technique simple and can improve the manufacture method of the LED light device of brightness.
For achieving the above object, present invention employs following technical proposal: this flexible light sheet comprises flexible substrate, control circuit is provided with in the one side of flexible substrate, the one side being provided with control circuit at flexible substrate also has the flexible insulation reflector layer that described control circuit can be encapsulated, flexible insulation reflector layer is provided with some positioning through hole along the discrete arrangement of control circuit length direction, control circuit is provided with some along the discrete spread configuration of control circuit length direction and with described positioning through hole LED chip one to one, described LED chip is in described positioning through hole, described flexible insulation reflector layer is provided with the flexible package structure that described LED chip can be encapsulated away from the one side of flexible substrate.Flexible light sheet can be convenient to arbitrary cutting.Light source has flexible row, can bend arbitrarily, and thickness is thinner is less than 1 millimeter, high voltage, specular removal, high aobvious refers to, the high and reliability that improve in use procedure of packaging efficiency, secondly, and the low and long service life of thermal resistance.Secondly, the lamp plate shape of the application can also be rectangular sheet heater tab with locating means.
Flexible substrate can bend at any angle, lightweight and can carry out cutting, highly versatile and cost is low; Owing to being provided with insulation protection reflector layer and heat can distribute by positioning through hole timely, heat radiation can be gone out by encapsulating structure further simultaneously, and thermal diffusivity is good and improve practicality; So that assembling, virtually can improve production efficiency, insulation protection and two reflective effects can be played owing to being provided with flexible insulation reflector layer, brightness can be improved further owing to being provided with positioning through hole.
In above-mentioned flexible light sheet, described flexible substrate is made up of transparent material or non-transparent material; Any one in the rounded substrate of flexible substrate, oval substrate, polygon substrate and strip substrate.Transparent material comprise in fluorescent material and polyalkylene imine film any one; Non-transparent material comprises fluorescent material.Polygon substrate comprises triangle, quadrangle etc.
In above-mentioned flexible light sheet, described flexible package structure comprises and is arranged on flexible insulation reflector layer away from the one side of flexible substrate and is positioned at least one flexible sizing sealing housing of flexible insulation reflector layer outer rim, and the one side being provided with flexible sizing sealing housing at flexible insulation reflector layer is also provided with the flexible package layer be arranged in described flexibility sizing sealing housing.Flexible sizing sealing housing has two effects of sizing and sealing.
In above-mentioned flexible light sheet, described flexible package layer is mixed by silicones and fluorescent material; Or be mixed by silicon rubber and fluorescent material; Be mixed again or by epoxy resin and fluorescent material.Flexible sizing sealing housing is made up of transparent or light transmissive material, and light transmissive material system comprises flexible clear materials and flexible opaque material.Further, flexible sizing sealing housing can also be made up of opaque material.
In above-mentioned flexible light sheet, described flexible package layer is plane away from the one side of flexible insulation reflector layer.Flexible sizing sealing housing is away from the one side of flexible insulation reflector layer and described planes align.Namely sealing can prevent dust or moisture from entering, and extends useful life further.
Alternatively scheme, in above-mentioned flexible light sheet, described flexible package structure also comprise packaging film, printing encapsulated layer, some glue encapsulated layer and spraying encapsulated layer in any one.
In above-mentioned flexible light sheet, described control circuit is etched circuit or is SMD circuit; Described LED chip be in flip LED chips and packed LED chip any one and described LED chip is arranged in series or connection in series-parallel is arranged.
In above-mentioned flexible light sheet, described flexible substrate comprises Flexible Main body and is connected to Flexible Main body side and at least one the flexible closure portion be connected as a single entity structure with Flexible Main body, described flexible insulation reflector layer comprises and covers the reflective main part of insulation on Flexible Main body and be connected to the reflective main part side of insulation and the reflective closure of insulation covered in flexible closure portion, the reflective main part of insulation and flexible closure portion are respectively equipped with positioning through hole, the reflective main part of described insulation and the reflective closure of insulation are connected as a single entity structure, described Flexible Main body peripheral side limit flushes with the circumferential side of the reflective main part of insulation, described flexible closure portion circumference side flushes with the circumferential side of the reflective closure of insulation, described flexibility sizing sealing housing quantity has two and is separately positioned in the reflective main part of insulation and the reflective closure of insulation, described flexible package number of plies amount has two and is separately positioned in described flexibility sizing sealing housing.
In above-mentioned flexible light sheet, the split of two flexible sizing sealing housings is arranged, and two flexible package layer splits are arranged.Split arranges and bending rear knee can be prevented not docile.
In above-mentioned flexible light sheet, described flexible substrate is provided with adhesion coating away from the one side of control circuit.
In above-mentioned flexible light sheet, described flexible substrate is provided with fluorescence coating away from the one side of flexible insulation reflector layer, and for the manufacture of the phosphor concentration of flexible package structure higher than the concentration of the fluorescent material for the manufacture of fluorescence coating.The program can form 360 ° of luminescences and brightness uniformity.
In above-mentioned flexible light sheet, described flexible substrate is polyalkylene imine film, and polyalkylene imine film is yellow transparent, and polyalkylene imine film is obtained by pyromellitic acid anhydride and diphenyldiamine.
The preparation method of this polyalkylene imine film is: after polyamic acid solution casting film-forming also stretches, high temperature imidizate;
Vitrification point temperature is: more than 280 DEG C (Upilex R), 385 DEG C (Kapton) and 500 DEG C (Upilex S);
The performance of polyalkylene imine film is as follows:
Relative density is 1.39 ~ 1.45,
When 20 DEG C, hot strength is 200MPa,
When 200 DEG C, hot strength is for being greater than 100MPa.
Polyalkylene imine film has outstanding high temperature resistant, radiation hardness, resistance to chemical attack and electrical insulation capability, can use for a long time in 250 ~ 280 DEG C of air.
Another scheme, flexible substrate is here fluorescence substrate.
In above-mentioned flexible light sheet, described positioning through hole and the circumference of LED chip form annular gap, flexible package layer is formed encapsulation blind hole, LED chip is mounted in encapsulation blind hole, flexible package layer is provided with can by described annular gap shutoff and annular closure part integrated with flexible package layer, and described annular closure part axial line overlaps with encapsulation blind hole axial line and this annular closure part is connected to the aperture place encapsulating blind hole.Annular closure part plays two effects of shutoff and optically focused.Insulation protection reflector layer can improve luminosity further in conjunction with annular closure part.
The processing technology of flexible light sheet comprises the steps:
A, bonding: by high temperature hot pressing mode by the glue heating between flexible substrate and control circuit and hot pressing thus make flexible substrate and control circuit be bonded together, flexible insulation reflector layer to be fixed on flexible substrate by mode of printing or high temperature hot pressing and on flexible insulation reflector layer, to be provided with some positioning through hole along the discrete spread configuration of control circuit length direction, LED chip is arranged in described positioning through hole one by one and is fixed on control circuit by glue, i.e. obtained semi-finished product; LED chip can be fixed on control circuit by conducting resinl;
B, encapsulation: be fixed on by semi-finished product in shaping mold cavity, then inject the packaging plastic being mixed with fluorescent material thus make flexible insulation reflector layer to be coated with the flexible package structure encapsulated by described LED chip in shaping mold cavity, i.e. obtained flexible light sheet finished product.
In the processing technology of above-mentioned flexible light sheet, described flexible package structure comprises and is arranged on flexible insulation reflector layer away from the one side of flexible substrate and is positioned at least one flexible sizing sealing housing of flexible insulation reflector layer outer rim, the one side being provided with flexible sizing sealing housing at flexible insulation reflector layer is also provided with the flexible package layer be arranged in described flexibility sizing sealing housing, first at flexible insulation reflector layer outer rim at least one flexible sizing sealing housing shaping, then in flexibility sizing sealing housing, the packaging plastic being mixed with fluorescent material encapsulated by LED chip is injected.
This LED light device, this LED light device is G4 lamp, G9 lamp, Lawn lamp, any one in bulb lamp and screen lamp, and LED light device comprises supporting body, be provided with at least a slice flexible light sheet on the carrier, described flexible light sheet comprises flexible substrate, this flexible substrate is made up of transparent material or non-transparent material, control circuit is provided with in the one side of flexible substrate, the one side being provided with control circuit at flexible substrate is also provided with the flexible insulation reflector layer that described control circuit can be encapsulated, flexible insulation reflector layer is provided with some positioning through hole along the discrete arrangement of control circuit length direction, control circuit is provided with some along the discrete spread configuration of control circuit length direction and with described positioning through hole LED chip one to one, described LED chip is in described positioning through hole, described flexible insulation reflector layer is provided with the flexible package structure that described LED chip can be encapsulated away from the one side of flexible substrate.
In above-mentioned LED light device, when LED light device is any one in G4 lamp, G9 lamp, Lawn lamp and screen lamp, described flexible light sheet pastes on the carrier.
Alternatively scheme, in above-mentioned LED light device, when LED light device is bulb lamp, at the two ends of flexible light sheet difference pad, described pad is connected with supporting body by syndeton.
In above-mentioned LED light device, described syndeton comprises the connecting hole be arranged on each pad; Or syndeton comprises the connector be arranged on each pad.
The manufacture method of this LED light device comprises the steps:
A, to get the raw materials ready:
Make supporting body;
Make flexible light sheet, the preparation technology of this flexible light sheet is as follows:
1., bond: by high temperature hot pressing mode by the glue heating between flexible substrate and control circuit and hot pressing thus make flexible substrate and control circuit be bonded together, flexible insulation reflector layer to be fixed on flexible substrate by mode of printing or high temperature hot pressing and on flexible insulation reflector layer, to be provided with some positioning through hole along the discrete spread configuration of control circuit length direction, LED chip is arranged in described positioning through hole one by one and is fixed on control circuit by glue, i.e. obtained semi-finished product;
2., encapsulation: semi-finished product are fixed in shaping mold cavity, then inject the packaging plastic being mixed with fluorescent material in shaping mold cavity thus make flexible insulation reflector layer to be coated with the flexible package structure encapsulated by described LED chip, be i.e. obtained flexible light sheet finished product.
B, assembling:
Described flexible light sheet is arranged on the carrier.
In the manufacture method of above-mentioned LED light device, in above-mentioned step A, flexible light sheet is pasted on the carrier.
Alternatively scheme, in the manufacture method of above-mentioned LED light device, in above-mentioned step A, at the two ends of flexible light sheet difference pad, described pad is fixed on the carrier by connecting hole or connector.
Compared with prior art, the invention has the advantages that:
1, design is more reasonable; owing to being provided with insulation protection reflector layer and heat can distribute by positioning through hole timely; the reflector layer of insulation protection simultaneously can reduce production difficulty in conjunction with positioning through hole; reach the advantage of enhancing productivity; also have; insulation protection reflector layer has insulation protection and two reflective effects, can improve luminosity further, practical.
2, flexible substrate can bend at any angle, lightweight and can carry out cutting, highly versatile and cost is low.
3, flexible package structure can bend at any angle, simultaneously can also by LED chip build-in and sealing, the high and long service life of structural strength.
4, structure is simple and be easy to manufacture, low cost of manufacture.
5, technique is simple and improve production efficiency, also improves heat dispersion simultaneously.
Accompanying drawing explanation
Fig. 1 is sectional structure schematic diagram provided by the invention.
Fig. 2 is detonation configuration schematic diagram provided by the invention.
Fig. 3 is structural representation provided by the invention.
Fig. 4 is flexible substrate structural representation provided by the invention.
Fig. 5 is flexible insulation reflection layer structure schematic diagram provided by the invention.
Fig. 6 is that flexible light sheet provided by the invention is rectangle structural representation.
Fig. 7 is the structural representation that the aperture place of encapsulation blind hole provided by the invention has annular closure part.
Fig. 8 provided by the inventionly has fluorescence layer structure schematic diagram.
Fig. 9 is Deng Pian confined explosion provided by the invention structural representation.
Figure 10 is another flexible substrate structural representation provided by the invention.
Figure 11 is another flexible insulation reflection layer structure schematic diagram provided by the invention.
Figure 12 is the first flexible light chip architecture schematic diagram provided by the invention.
Figure 13 is the second flexible light chip architecture schematic diagram provided by the invention.
Figure 14 is the structural representation that there is connecting hole at flexible light sheet two ends provided by the invention.
Figure 15 is the structural representation that there is connector at flexible light sheet two ends provided by the invention.
Figure 16 is G4 or G9 modulated structure schematic diagram provided by the invention.
Figure 17 is Lawn lamp structural representation provided by the invention.
Figure 18 is ball bulb lamp structure schematic diagram provided by the invention.
Figure 19 is lamp tube structure schematic diagram provided by the invention.
Figure 20 is the first screen lamp structural representation provided by the invention.
Figure 21 is the second screen lamp structural representation provided by the invention.
Figure 22 is circular lamp structural representation provided by the invention.
Figure 23 is spiral structural representation after flexible light sheet provided by the invention is installed.
In figure, flexible substrate 1, adhesion coating 11, fluorescence coating 12, Flexible Main body 1a, flexible closure portion 1b, control circuit 2, LED chip 21, flexible insulation reflector layer 3, positioning through hole 31, the reflective main part 3a that insulate, the reflective closure 3b that insulate, flexible package structure 4, flexible sizing sealing housing 41, flexible package layer 42, plane 42a, supporting body 5, flexible light sheet 6, connecting hole 61, connector 62.
Embodiment
Be below the specific embodiment of invention and by reference to the accompanying drawings, technical scheme of the present invention is further described, but the present invention be not limited to these embodiments.
Embodiment one
As Figure 1-3, this flexible light sheet comprises flexible substrate 1, and flexible substrate can bend at any angle, lightweight and can carry out cutting.Secondly, any one in the rounded substrate of flexible substrate 1, oval substrate, polygon substrate and strip substrate.Certainly, other shape passable.This flexible substrate 1 is made up of transparent material, prioritization scheme, and the flexible substrate 1 of the present embodiment is polyalkylene imine film, and polyalkylene imine film is yellow transparent, and polyalkylene imine film is obtained by pyromellitic acid anhydride and diphenyldiamine.
The preparation method of this polyalkylene imine film is: after polyamic acid solution casting film-forming also stretches, high temperature imidizate;
Vitrification point temperature is: more than 280 DEG C (Upilex R), 385 DEG C (Kapton) and 500 DEG C (Upilex S);
The performance of polyalkylene imine film is as follows:
Relative density is 1.39 ~ 1.45,
When 20 DEG C, hot strength is 200MPa,
When 200 DEG C, hot strength is for being greater than 100MPa.
Polyalkylene imine film has outstanding high temperature resistant, radiation hardness, resistance to chemical attack and electrical insulation capability, can use for a long time in 250 ~ 280 DEG C of air.
As shown in Fig. 1,3 and Fig. 7-9, be provided with control circuit 2 in the one side of flexible substrate 1, this control circuit 2 is etched circuit; Adhesion coating 11 is provided with away from the one side of control circuit 2 at flexible substrate 1, adhesion coating 11 can not certainly be set, between flexible substrate 1 and control circuit 2, be provided with glue layer, glue layer comprises epoxy glue, and epoxy glue is made flexible substrate 1 and control circuit 2 be fixed together after high temperature hot pressing.The one side being provided with control circuit 2 at flexible substrate 1 also has the flexible insulation reflector layer 3 that described control circuit 2 can be encapsulated, and insulation protection reflector layer 3 is made up of plastics or white oil and can be bent under external force.Insulation protection reflector layer have insulation protection control circuit, reflective and heat radiation three effects.
As shown in Fig. 1,3,5, flexible insulation reflector layer 3 is provided with some positioning through hole 31 along the discrete arrangement of control circuit 2 length direction, positioning through hole 31 has two effects of heat radiation and pre-determined bit, control circuit 2 is provided with some along the discrete spread configuration of control circuit 2 length direction and with described positioning through hole 31 LED chip 21 one to one, this LED chip 21 is flip LED chips and described LED chip 21 is arranged in series or connection in series-parallel is arranged, and described LED chip 21 is arranged in described positioning through hole 31.When using state, by the heat radiation of LED chip 21 self and the effect of insulation protection reflector layer 3 and positioning through hole 31, heat is distributed in air timely.This structure can be convenient to the fixing of bending and various shape.Such as, when flexible light sheet is fixed twist, S shape, C shape, any one in V-arrangement and W shape.Certainly can also be other shape.
The flexible package structure 4 that described LED chip 21 can be encapsulated is provided with away from the one side of flexible substrate 1 at flexible insulation reflector layer 3.As the optimized scheme of the present embodiment, as shown in Fig. 3 and Fig. 8-11, here flexible package structure 4 comprises and is arranged on flexible insulation reflector layer 3 away from the one side of flexible substrate 1 and is positioned at least one flexible sizing sealing housing 41 of flexible insulation reflector layer 3 outer rim, and the one side being provided with flexible sizing sealing housing 41 at flexible insulation reflector layer 3 is also provided with the flexible package layer 42 be arranged in described flexibility sizing sealing housing 41.Further, flexibility here sizing sealing housing 41 is made up of transparent or light transmissive material or opaque material, and described flexible package layer 42 is mixed by silicones and fluorescent material; Or be mixed by silicon rubber and fluorescent material; Be mixed again or by epoxy resin and fluorescent material.
Prioritization scheme is plane 42a at the present embodiment flexible package layer 42 away from the one side of flexible insulation reflector layer 3.Flexible sizing sealing housing is away from the one side of flexible insulation reflector layer and described planes align.Namely sealing can prevent dust or moisture from entering, and extends the useful life of lamp sheet further.
During for the lamp sheet of the present embodiment is applied on G4 or G9 lamp, as shown in Fig. 3 and Fig. 8-11, the flexible substrate 1 of the present embodiment comprises Flexible Main body 1a and is connected to Flexible Main body 1a side and at least one the flexible closure portion 1b be connected as a single entity structure with Flexible Main body 1a, described flexible insulation reflector layer 3 comprises and covers insulation reflective main part 3a on Flexible Main body 1a and be connected to the reflective main part 3a side of insulation and the reflective closure 3b of insulation covered on flexible closure portion 1b, insulation reflective main part 3a and flexible closure portion 1b is respectively equipped with positioning through hole 31, described insulation reflective main part 3a and the reflective closure 3b of insulation is connected as a single entity structure, described Flexible Main body 1a circumference side flushes with the circumferential side of the reflective main part 3a of insulation, described flexible closure portion 1b circumference side flushes with the circumferential side of the reflective closure 3b of insulation, described flexibility sizing sealing housing 41 quantity has two and is separately positioned on the reflective main part 3a of insulation and the reflective closure 3b of insulation, described flexible package layer 42 quantity has two and is separately positioned in described flexibility sizing sealing housing 41.
Prioritization scheme, the split of two in the present embodiment flexible sizing sealing housings 41 is arranged, and two flexible package layer 42 splits are arranged.Split arrange can knee stickup more docile.
In addition, when flexible substrate 1 is made up of transparent material, be provided with fluorescence coating 12 at flexible substrate 1 away from the one side of flexible insulation reflector layer 3, and for the manufacture of the phosphor concentration of flexible package structure 4 higher than the concentration of the fluorescent material for the manufacture of fluorescence coating 12.Concentration difference can reach the identical effect of brightness, and brightness is more even.
The profile of the flexible light sheet of the present embodiment comprise in circular substrate, oval substrate, polygon substrate and strip substrate any one.As shown in Figure 6, flexible light sheet is rectangle.
Also have, as shown in Figure 7, the positioning through hole of the present embodiment and the circumference of LED chip form annular gap, flexible package layer is formed encapsulation blind hole, LED chip is mounted in encapsulation blind hole 42c, flexible package layer is provided with can by described annular gap shutoff and annular closure part 42b integrated with flexible package layer, and described annular closure part axial line overlaps with encapsulation blind hole axial line and this annular closure part is connected to the aperture place encapsulating blind hole.Insulation protection reflector layer 3 can improve luminosity further in conjunction with annular closure part.
As shown in figs. 1-11, in order to reach above-mentioned goal of the invention,
The processing technology of this flexible light sheet comprises the steps:
A, bonding: by high temperature hot pressing mode the glue between flexible substrate 1 and control circuit 2 heated and hot pressing thus flexible substrate 1 and control circuit 2 are bonded together, flexible insulation reflector layer 3 to be fixed on flexible substrate 1 by mode of printing or high temperature hot pressing and on flexible insulation reflector layer 3, to be provided with some positioning through hole 31 along the discrete spread configuration of control circuit 2 length direction, LED chip 21 is arranged in described positioning through hole 31 one by one and is fixed on control circuit 2 by glue, i.e. obtained semi-finished product;
B, encapsulation: semi-finished product are fixed in shaping mold cavity, then in shaping mold cavity, inject the packaging plastic being mixed with fluorescent material thus make flexible insulation reflector layer 3 to be coated with the flexible package structure 4 encapsulated by described LED chip 21, be i.e. obtained flexible light sheet finished product.
In above-mentioned step B, described flexible package structure 4 comprises and is arranged on flexible insulation reflector layer 3 away from the one side of flexible substrate 1 and is positioned at least one flexible sizing sealing housing 41 of flexible insulation reflector layer 3 outer rim, the one side being provided with flexible sizing sealing housing 41 at flexible insulation reflector layer 3 is also provided with the flexible package layer 42 be arranged in described flexibility sizing sealing housing 41, first at flexible insulation reflector layer 3 outer rim at least one flexible sizing sealing housing 41 shaping, then in flexibility sizing sealing housing 41, the packaging plastic being mixed with fluorescent material encapsulated by LED chip 21 is injected.
As shown in Figure 16-18 and Figure 20-21, in order to reach above-mentioned goal of the invention,
This LED light device is G4 lamp, G9 lamp, Lawn lamp, any one in bulb lamp and screen lamp, and LED light device comprises supporting body 5, as shown in figs. 12-15, supporting body 5 is provided with at least a slice flexible light sheet 6, described flexible light sheet 6 comprises flexible substrate 1, as shown in figs. 1-11, this flexible substrate 1 is made up of transparent material or non-transparent material, control circuit 2 is provided with in the one side of flexible substrate 1, the one side being provided with control circuit 2 at flexible substrate 1 is also provided with the flexible insulation reflector layer 3 that described control circuit 2 can be encapsulated, flexible insulation reflector layer 3 is provided with some positioning through hole 31 along the discrete arrangement of control circuit 2 length direction, control circuit 2 is provided with some along the discrete spread configuration of control circuit 2 length direction and with described positioning through hole 31 LED chip 21 one to one, described LED chip 21 is arranged in described positioning through hole 31, described flexible insulation reflector layer 3 is provided with the flexible package structure 4 that described LED chip 21 can be encapsulated away from the one side of flexible substrate 1.
When LED light device is any one in G4 lamp, G9 lamp, Lawn lamp and screen lamp, described flexible light sheet 6 is attached on supporting body 5.Flexible light sheet 6 shape be attached on supporting body 5 can be any shape, such as: twist, S shape, C shape, any one in V-arrangement and W shape.As shown in figure 23, flexible light sheet 6 install after twist.
In order to reach above-mentioned goal of the invention,
The manufacture method of this LED light device comprises the steps:
A, to get the raw materials ready:
Make supporting body 5;
Make flexible light sheet 6, the preparation technology of this flexible light sheet 6 is as follows:
1., bond: the glue between flexible substrate 1 and control circuit 2 heat also hot pressing by high temperature hot pressing mode thus flexible substrate 1 and control circuit 2 are bonded together, flexible insulation reflector layer 3 to be fixed on flexible substrate 1 by mode of printing or high temperature hot pressing and on flexible insulation reflector layer 3, to be provided with some positioning through hole 31 along the discrete spread configuration of control circuit 2 length direction, LED chip 21 is arranged in described positioning through hole 31 one by one and is fixed on control circuit 2 by glue, i.e. obtained semi-finished product;
2., encapsulate: semi-finished product are fixed in shaping mold cavity, then in shaping mold cavity, inject the packaging plastic being mixed with fluorescent material thus make flexible insulation reflector layer 3 to be coated with the flexible package structure 4 encapsulated by described LED chip 21, be i.e. obtained flexible light sheet finished product.
B, assembling:
Described flexible light sheet 6 is arranged on supporting body 5.
In above-mentioned step A, flexible light sheet 6 is pasted onto on supporting body 5.
Embodiment two
The present embodiment with the structure of embodiment one and principle substantially identical, Gu therefore not to repeat here, and different place is: described flexible substrate 1 is made up of non-transparent material.Non-transparent material comprises fluorescent material etc.The one side being provided with adhesion coating 11 at flexible substrate 1 omits fluorescence coating 12.
Embodiment three
The present embodiment with the structure of embodiment one and principle substantially identical, Gu therefore not to repeat here, and different place is: described flexible package structure 4 also comprise in packaging film, printing encapsulated layer, some glue encapsulated layer and spraying encapsulated layer any one.
Embodiment four
The present embodiment with the structure of embodiment one and principle substantially identical, Gu therefore not to repeat here, and different place is: control circuit 2 is SMD circuit.
Embodiment five
The present embodiment with the structure of embodiment one and principle substantially identical, Gu therefore not to repeat here, and different place is: described LED chip 21 is packed LED chip.
Embodiment six
The present embodiment with the structure of embodiment one and principle substantially identical, Gu therefore not to repeat here, and different place is: as shown in Figure 14-15 and Figure 18, when LED light device is bulb lamp, at the two ends of flexible light sheet 6 difference pad, described pad is connected with supporting body 5 by syndeton.Particularly, syndeton here comprises the connecting hole 61 be arranged on each pad; Or syndeton comprises the connector 62 be arranged on each pad.
Embodiment seven
The present embodiment with the structure of embodiment one and principle substantially identical, Gu therefore not to repeat here, and different place is: as shown in Figure 19,22, and this LED light device can also be any one in fluorescent tube and circular lamp.
Specific embodiment described herein is only to the explanation for example of the present invention's spirit.Those skilled in the art can make various amendment or supplement or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present invention or surmount the scope that appended claims defines.
Although more employ the term such as flexible substrate 1, adhesion coating 11, fluorescence coating 12, Flexible Main body 1a, flexible closure portion 1b, control circuit 2, LED chip 21, flexible insulation reflector layer 3, positioning through hole 31, the reflective main part 3a that insulate, the reflective closure 3b that insulate, flexible package structure 4, flexible sizing sealing housing 41, flexible package layer 42, plane 42a, supporting body 5, flexible light sheet 6, connecting hole 61, connector 62 herein, do not get rid of the possibility using other term.These terms are used to be only used to describe and explain essence of the present invention more easily; The restriction that they are construed to any one additional is all contrary with spirit of the present invention.
Claims (18)
1. a flexible light sheet, it is characterized in that, this flexible light sheet comprises flexible substrate (1), control circuit (2) is provided with in the one side of flexible substrate (1), the one side being provided with control circuit (2) at flexible substrate (1) also has the flexible insulation reflector layer (3) that described control circuit (2) can be encapsulated, flexible insulation reflector layer (3) is provided with some positioning through hole (31) along the discrete arrangement of control circuit (2) length direction, control circuit (2) is provided with some along the discrete spread configuration of control circuit (2) length direction and with described positioning through hole (31) LED chip (21) one to one, described LED chip (21) is arranged in described positioning through hole (31), described flexible insulation reflector layer (3) is provided with the flexible package structure (4) that described LED chip (21) can be encapsulated away from the one side of flexible substrate (1).
2. flexible light sheet according to claim 1, is characterized in that, described flexible substrate (1) is made up of transparent material or non-transparent material; Any one in described flexible substrate (1) rounded substrate, oval substrate, polygon substrate and strip substrate.
3. flexible light sheet according to claim 2, it is characterized in that, described flexible package structure (4) comprises and is arranged on flexible insulation reflector layer (3) away from the one side of flexible substrate (1) and is positioned at least one flexible sizing sealing housing (41) of flexible insulation reflector layer (3) outer rim, and the one side being provided with flexible sizing sealing housing (41) at flexible insulation reflector layer (3) is also provided with the flexible package layer (42) be arranged in described flexibility sizing sealing housing (41).
4. flexible light sheet according to claim 3, is characterized in that, described flexible package layer (42) is mixed by silicones and fluorescent material; Or be mixed by silicon rubber and fluorescent material; Be mixed again or by epoxy resin and fluorescent material.
5. flexible light sheet according to claim 2, is characterized in that, described flexible package structure (4) also comprises
encapsulationfilm, printing encapsulated layer, some glue encapsulated layer and spraying encapsulated layer in any one.
6. the flexible light sheet according to claim 1-5 any one, is characterized in that, described control circuit (2) is for etched circuit or be SMD circuit; Described LED chip (21) is for any one in flip LED chips and packed LED chip and described LED chip (21) is arranged in series or connection in series-parallel is arranged.
7. the flexible light sheet according to claim 3 or 4 or 5, it is characterized in that, described flexible substrate (1) comprises Flexible Main body (1a) and is connected to Flexible Main body (1a) side and at least one the flexible closure portion (1b) be connected as a single entity structure with Flexible Main body (1a); described flexible insulation reflector layer (3) comprises the reflective main part of insulation (3a) that covers on Flexible Main body (1a) and is connected to insulation reflective main part (3a) side and the reflective closure of insulation (3b) covered in flexible closure portion (1b), the reflective main part of insulation (3a) and flexible closure portion (1b) is respectively equipped with positioning through hole (31), the reflective main part of described insulation (3a) and the reflective closure of insulation (3b) are connected as a single entity structure, described Flexible Main body (1a) circumferential side flushes with the circumferential side of the reflective main part of insulation (3a), described flexible closure portion (1b) circumferential side flushes with the circumferential side of the reflective closure of insulation (3b), described flexibility sizing sealing housing (41) quantity has two and is separately positioned in the reflective main part of insulation (3a) and the reflective closure of insulation (3b), described flexible package layer (42) quantity has two and is separately positioned in described flexibility sizing sealing housing (41).
8. flexible light sheet according to claim 7, is characterized in that, two flexible sizing sealing housing (41) splits are arranged, and two flexible package layer (42) splits are arranged.
9. flexible light sheet according to claim 8, it is characterized in that, described flexible substrate (1) is provided with fluorescence coating (12) away from the one side of flexible insulation reflector layer (3), and for the manufacture of the phosphor concentration of flexible package structure (4) higher than the concentration of the fluorescent material for the manufacture of fluorescence coating (12).
10. a processing technology for flexible light sheet, is characterized in that, this processing technology comprises the steps:
A, bonding: the glue between flexible substrate (1) and control circuit (2) heated also hot pressing by high temperature hot pressing mode thus flexible substrate (1) and control circuit (2) are bonded together, flexible insulation reflector layer (3) is fixed on flexible substrate (1) by mode of printing or high temperature hot pressing and goes up and on flexible insulation reflector layer (3), be provided with some positioning through hole (31) along the discrete spread configuration of control circuit (2) length direction, LED chip (21) is arranged in described positioning through hole (31) one by one and is fixed on control circuit (2) by glue, i.e. obtained semi-finished product,
B, encapsulation: semi-finished product are fixed in shaping mold cavity, then in shaping mold cavity, inject the packaging plastic being mixed with fluorescent material thus make flexible insulation reflector layer (3) to be coated with the flexible package structure (4) encapsulated by described LED chip (21), be i.e. obtained flexible light sheet finished product.
The processing technology of 11. flexible light sheets according to claim 10, it is characterized in that, in above-mentioned step B, described flexible package structure (4) comprises and is arranged on flexible insulation reflector layer (3) away from the one side of flexible substrate (1) and is positioned at least one flexible sizing sealing housing (41) of flexible insulation reflector layer (3) outer rim, the one side being provided with flexible sizing sealing housing (41) at flexible insulation reflector layer (3) is also provided with the flexible package layer (42) be arranged in described flexibility sizing sealing housing (41), first flexible insulation reflector layer (3) outer rim at least one flexible sizing sealing housing (41) shaping, then in flexibility sizing sealing housing (41), the packaging plastic being mixed with fluorescent material encapsulated by LED chip (21) is injected.
12. 1 kinds of LED light device adopting the flexible light sheet in claim 1-11 described in any one to make, it is characterized in that, this LED light device is G4 lamp, G9 lamp, Lawn lamp, any one in bulb lamp and screen lamp, and LED light device comprises supporting body (5), supporting body (5) is provided with at least a slice flexible light sheet (6), described flexible light sheet (6) comprises flexible substrate (1), this flexible substrate (1) is made up of transparent material or non-transparent material, control circuit (2) is provided with in the one side of flexible substrate (1), the one side being provided with control circuit (2) at flexible substrate (1) is also provided with the flexible insulation reflector layer (3) that described control circuit (2) can be encapsulated, flexible insulation reflector layer (3) is provided with some positioning through hole (31) along the discrete arrangement of control circuit (2) length direction, control circuit (2) is provided with some along the discrete spread configuration of control circuit (2) length direction and with described positioning through hole (31) LED chip (21) one to one, described LED chip (21) is arranged in described positioning through hole (31), described flexible insulation reflector layer (3) is provided with the flexible package structure (4) that described LED chip (21) can be encapsulated away from the one side of flexible substrate (1).
13. LED light device according to claim 12, is characterized in that, when LED light device is any one in G4 lamp, G9 lamp, Lawn lamp and screen lamp, described flexible light sheet (6) is attached on supporting body (5).
14. LED light device according to claim 12, is characterized in that, when LED light device is bulb lamp, at the two ends of flexible light sheet (6) difference pad, described pad is connected with supporting body (5) by syndeton.
15. LED light device according to claim 14, is characterized in that, described syndeton comprises the connecting hole (61) be arranged on each pad; Or syndeton comprises the connector (62) be arranged on each pad.
The manufacture method of 16. 1 kinds of LED light device, is characterized in that, this method comprises the steps:
A, to get the raw materials ready:
Make supporting body (5);
Make flexible light sheet (6), the preparation technology of this flexible light sheet (6) is as follows:
1., bonding: the glue between flexible substrate (1) and control circuit (2) heated also hot pressing by high temperature hot pressing mode thus flexible substrate (1) and control circuit (2) are bonded together, flexible insulation reflector layer (3) is fixed on flexible substrate (1) by mode of printing or high temperature hot pressing and goes up and on flexible insulation reflector layer (3), be provided with some positioning through hole (31) along the discrete spread configuration of control circuit (2) length direction, LED chip (21) is arranged in described positioning through hole (31) one by one and is fixed on control circuit (2) by glue, i.e. obtained semi-finished product,
2., encapsulate: semi-finished product are fixed in shaping mold cavity, then in shaping mold cavity, inject the packaging plastic being mixed with fluorescent material thus make flexible insulation reflector layer (3) to be coated with the flexible package structure (4) encapsulated by described LED chip (21), be i.e. obtained flexible light sheet finished product.
B, assembling:
Described flexible light sheet (6) is arranged on supporting body (5).
The manufacture method of 17. LED light device according to claim 16, is characterized in that, in above-mentioned step A, flexible light sheet (6) is pasted onto on supporting body (5).
The manufacture method of 18. LED light device according to claim 16, it is characterized in that, in above-mentioned step A, at the two ends of flexible light sheet (6) difference pad, described pad is fixed on supporting body (5) by connecting hole (61) or connector (62).
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| CN201510362880.1A CN104934515B (en) | 2015-06-26 | 2015-06-26 | Flexible light piece and its processing technology apply the lighting device and manufacture method of the lamp piece |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109087986A (en) * | 2018-08-30 | 2018-12-25 | 佛山市国星半导体技术有限公司 | A kind of flexible LED device and preparation method thereof, LED filament |
| CN109155348A (en) * | 2016-05-20 | 2019-01-04 | 奥斯兰姆奥普托半导体有限责任公司 | Radiation-emitting component |
| WO2023119403A1 (en) * | 2021-12-21 | 2023-06-29 | 星和電機株式会社 | Explosion-proof light-emitting diode unit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1357331A2 (en) * | 2002-04-25 | 2003-10-29 | Yuan Lin | Flexible rod light device formed of chip on board based LED lamps and manufacturing method thereof |
| US20040223328A1 (en) * | 2003-05-09 | 2004-11-11 | Lee Kian Shin | Illumination unit with a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant |
| CN101198216A (en) * | 2008-01-07 | 2008-06-11 | 史杰 | Flexible circuit board of LED illumination array |
| CN201655800U (en) * | 2010-04-02 | 2010-11-24 | 江苏史福特光电科技有限公司 | Novel flexible circuit board of LED lighting array |
-
2015
- 2015-06-26 CN CN201510362880.1A patent/CN104934515B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1357331A2 (en) * | 2002-04-25 | 2003-10-29 | Yuan Lin | Flexible rod light device formed of chip on board based LED lamps and manufacturing method thereof |
| US20040223328A1 (en) * | 2003-05-09 | 2004-11-11 | Lee Kian Shin | Illumination unit with a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant |
| CN101198216A (en) * | 2008-01-07 | 2008-06-11 | 史杰 | Flexible circuit board of LED illumination array |
| CN201655800U (en) * | 2010-04-02 | 2010-11-24 | 江苏史福特光电科技有限公司 | Novel flexible circuit board of LED lighting array |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109155348A (en) * | 2016-05-20 | 2019-01-04 | 奥斯兰姆奥普托半导体有限责任公司 | Radiation-emitting component |
| CN109155348B (en) * | 2016-05-20 | 2021-10-15 | 奥斯兰姆奥普托半导体有限责任公司 | Radiation emitting assembly |
| CN109087986A (en) * | 2018-08-30 | 2018-12-25 | 佛山市国星半导体技术有限公司 | A kind of flexible LED device and preparation method thereof, LED filament |
| WO2023119403A1 (en) * | 2021-12-21 | 2023-06-29 | 星和電機株式会社 | Explosion-proof light-emitting diode unit |
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| CN104934515B (en) | 2018-03-27 |
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Denomination of invention: Flexible lamp sheet and its processing technology lighting device and manufacturing method applying the lamp sheet Effective date of registration: 20210205 Granted publication date: 20180327 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jiashan county subbranch Pledgor: Zhejiang Emitting Optoelectronic Technology Co.,Ltd. Registration number: Y2021330000125 |
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