JP2019176157A5 - - Google Patents
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- Publication number
- JP2019176157A5 JP2019176157A5 JP2019081609A JP2019081609A JP2019176157A5 JP 2019176157 A5 JP2019176157 A5 JP 2019176157A5 JP 2019081609 A JP2019081609 A JP 2019081609A JP 2019081609 A JP2019081609 A JP 2019081609A JP 2019176157 A5 JP2019176157 A5 JP 2019176157A5
- Authority
- JP
- Japan
- Prior art keywords
- tape
- sum
- base film
- semiconductor processing
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive Effects 0.000 claims 2
- 239000002390 adhesive tape Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 230000000930 thermomechanical Effects 0.000 claims 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 229920000554 ionomer Polymers 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
Claims (3)
前記基材フィルムは、アイオノマー樹脂を除く熱可塑性架橋樹脂からなり、
前記粘着テープは、ＭＤ方向における熱機械特性試験機により昇温時に測定した４０℃〜８０℃の間の１℃毎の熱変形率の微分値の総和と、ＴＤ方向における熱機械特性試験機により昇温時に測定した４０℃〜８０℃の間の１℃毎の熱変形率の微分値の総和との和がマイナス値であることを特徴とする半導体加工用テープ。 It has an adhesive tape having a base film and an adhesive layer formed on at least one surface side of the base film.
The base film is made of a thermoplastic crosslinked resin excluding ionomer resin.
The adhesive tape is prepared by the sum of the differential values of the thermal deformation rate for each 1 ° C. between 40 ° C. and 80 ° C. measured at the time of temperature rise by the thermomechanical property tester in the MD direction and the thermomechanical property tester in the TD direction. A tape for semiconductor processing, characterized in that the sum of the sum of the differential values of the thermal deformation rate for each 1 ° C. between 40 ° C. and 80 ° C. measured at the time of temperature rise is a negative value.
The semiconductor processing tape according to claim 1 or 2, wherein the tape is used for full-cut and half-cut blade dicing, laser dicing, or laser stealth dicing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019081609A JP6989562B2 (en) | 2018-03-28 | 2019-04-23 | Semiconductor processing tape |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018061063A JP6535118B1 (en) | 2018-03-28 | 2018-03-28 | Semiconductor processing tape |
| JP2019081609A JP6989562B2 (en) | 2018-03-28 | 2019-04-23 | Semiconductor processing tape |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018061063A Division JP6535118B1 (en) | 2018-03-28 | 2018-03-28 | Semiconductor processing tape |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019176157A JP2019176157A (en) | 2019-10-10 |
| JP2019176157A5 true JP2019176157A5 (en) | 2020-12-17 |
| JP6989562B2 JP6989562B2 (en) | 2022-01-05 |
Family
ID=79239765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019081609A Active JP6989562B2 (en) | 2018-03-28 | 2019-04-23 | Semiconductor processing tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6989562B2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012174945A (en) * | 2011-02-23 | 2012-09-10 | Furukawa Electric Co Ltd:The | Processing method of semiconductor wafer |
| CN104271694B (en) * | 2012-05-14 | 2017-03-22 | 琳得科株式会社 | Sheet having adhesive resin layer attached thereto, and method for producing semiconductor device |
| JP6306362B2 (en) * | 2014-02-13 | 2018-04-04 | リンテック株式会社 | Extensible sheet and laminated chip manufacturing method |
| JP6295135B2 (en) * | 2014-04-24 | 2018-03-14 | 日東電工株式会社 | Dicing die bond film |
-
2019
- 2019-04-23 JP JP2019081609A patent/JP6989562B2/en active Active
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