JP2019175971A - Mounting substrate, electronic apparatus, and element cooling method - Google Patents

Abstract

To efficiently cool an element mounted on a substrate with a compact structure.SOLUTION: A mounting substrate 103 comprises: a first substrate 104 including a first main surface 108 of which at least a part is immersed in an insulation liquid cooling medium 102 in a state of crossing a horizontal direction; elements 105a to 105d mounted onto the first main surface 108 and immersed in the liquid cooling medium 102 that are the elements 105a to 105d mounted onto the first main surface 108 above elements 105c to 105f and immersed in the liquid cooling medium 102; and an induction part 106 extended between the elements 105a to 105d and the elements 105a to 105d so as to block a path in which babbles generated by evaporation of the liquid cooling medium 102 sucking heat from the elements 105c to 105f move to the element 105a to 105d.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a mounting substrate, an electronic device, and an element cooling method.

  Electronic devices such as servers are generally mounted with a mounting substrate that is a substrate on which a plurality of elements are mounted. Many elements generate heat during operation. For this reason, an electronic device may be equipped with a configuration for cooling the element during operation.

  For example, when a heat sink is mounted to cool an element, a relatively large heat sink is required to cool an element mounted at a high density. As a result, the electronic device becomes large.

  In addition, for example, a technique using a liquid refrigerant has been proposed in order to cool the element more efficiently than a heat sink.

  In the immersion cooling device described in Patent Document 1, a plurality of substrates on which a heating element is mounted are immersed in a low-boiling point refrigerant, and vapor generated by boiling is condensed in a condenser. In the immersion cooling apparatus described in Patent Document 1, adjacent substrates are arranged face to face or back to back, and an upward flow space of the refrigerant is defined between the substrates arranged face to face.

No. 3-9338

  Since the liquid refrigerant absorbs heat generated from the element and vaporizes, bubbles are generated in the liquid refrigerant. When a mounting board on which a plurality of elements are mounted is cooled with a liquid refrigerant, bubbles generated by heat from the element located below reach another element located above the element, and eventually Most of the element may be covered with bubbles. As described above, when a dry-out in which the another element cannot contact the liquid refrigerant occurs, the temperature of the another element may rapidly increase and break down.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a mounting substrate that can efficiently cool an element mounted on a substrate with a compact configuration.

In order to achieve the above object, a mounting board according to the first aspect of the present invention provides:
A first substrate including a first mounting surface that is at least partially immersed in an insulating liquid refrigerant in a state intersecting with the horizontal direction;
A first element mounted on the first mounting surface and immersed in the liquid refrigerant, the first element including a first heat radiation area from which heat is released during operation;
A second element mounted on the first mounting surface above the first element and immersed in the liquid refrigerant;
The first heat radiation area and the second heat radiation area are blocked so that bubbles generated by vaporization of the liquid refrigerant that has absorbed heat from the first heat radiation area are blocked from moving from the first heat radiation area to the second element. A first guiding portion extending between the device and the element.

An electronic device according to a second aspect of the present invention is:
A case in which an insulating liquid refrigerant is enclosed;
A first substrate including a first mounting surface disposed in the case, the first mounting surface being at least partially immersed in the liquid refrigerant in a state intersecting with a horizontal direction;
A first element mounted on the first mounting surface and immersed in the liquid refrigerant, the first element including a first heat radiation area from which heat is released during operation;
A second element mounted on the first mounting surface above the first element and immersed in the liquid refrigerant;
The first heat radiation area and the second heat radiation area are blocked so that bubbles generated by vaporization of the liquid refrigerant that has absorbed heat from the first heat radiation area are blocked from moving from the first heat radiation area to the second element. A first guiding portion extending between the device and the element.

The element cooling method according to the third aspect of the present invention is:
Immersing the first element and the second element mounted on the first mounting surface in an insulating liquid refrigerant in a state where the first mounting surface included in the first substrate intersects the horizontal direction;
Operating the first element to release heat from the first heat dissipation region included in the first element;
Generating bubbles by vaporization of the liquid refrigerant that has absorbed heat released from the first heat dissipation region;
The generation is performed by the first induction portion extending between the first heat dissipation region and the second element mounted above the first element on the first mounting surface and immersed in the liquid refrigerant. Shutting off the path through which the air bubbles move from the first heat dissipation area to the second element.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to cool efficiently the element mounted in the board | substrate with a compact structure.

In the electronic device which concerns on Embodiment 1 of this invention, it is the figure which looked at the cross section of the case where a mounting board | substrate is accommodated with a liquid refrigerant from the front. In the electronic device which concerns on Embodiment 1, it is the figure which looked at the cross section of the case where a mounting board | substrate is accommodated with a liquid refrigerant from the left. 6 is a flowchart for explaining an operation of the electronic apparatus according to the first embodiment. In the electronic device which concerns on Embodiment 1, it is a figure which shows the path | route where the bubble in a case is induced | guided | derived. FIG. 10 is an exploded perspective view showing a part of a mounting board according to Modification 1 in an enlarged manner. In the electronic device which concerns on the modification 2, it is the figure which looked at the cross section of the case where a mounting board | substrate is accommodated with a liquid refrigerant from the front. In the electronic device which concerns on the modification 3, it is the figure which looked at the cross section of the case where a mounting board | substrate is accommodated with a liquid refrigerant from the front. In the electronic device which concerns on the modification 4, it is the figure which looked at the cross section of the case where a mounting board | substrate is accommodated with a liquid refrigerant from the front. In the electronic device which concerns on the modification 5, it is the figure which looked at the cross section of the case where a mounting board | substrate is accommodated with a liquid refrigerant from the front. In the electronic device which concerns on Embodiment 2 of this invention, it is the figure which looked at the cross section of the case where a mounting board | substrate is accommodated with a liquid refrigerant from the front. In the electronic device which concerns on Embodiment 2, it is the figure which looked at the cross section of the case where a mounting board | substrate is accommodated with a liquid refrigerant from the left. In the electronic device which concerns on Embodiment 3 of this invention, it is the figure which looked at the cross section of the case where a mounting board | substrate is accommodated with a liquid refrigerant from the front. In the electronic device which concerns on Embodiment 3, it is the figure which looked at the cross section of the case where a mounting board | substrate is accommodated with a liquid refrigerant from the left. In the electronic device which concerns on Embodiment 4 of this invention, it is the figure which looked at the cross section of the case where a mounting board | substrate is accommodated with a liquid refrigerant from the front. In the electronic device which concerns on Embodiment 4, it is the figure which looked at the cross section of the case where a mounting board | substrate is accommodated with a liquid refrigerant from the left.

  An embodiment of the present invention will be described with reference to the drawings. In the following description, terms representing front, back, up, down, left, and right directions are used for explanation and are not intended to limit the present invention.

(Embodiment 1)
Electronic device 100 according to Embodiment 1 of the present invention is, for example, a computer including a configuration for cooling a plurality of elements 105 a to 105 f mounted on substrate 104 by liquid refrigerant 102. Such an electronic apparatus 100 includes a case 101, a liquid refrigerant 102, and a mounting substrate 103 as shown in FIGS. 1 and 2.

  The case 101 is a substantially rectangular parallelepiped hollow box-shaped member. The case 101 is configured so that the liquid refrigerant 102 filled therein does not leak to the outside. The case 101 may be appropriately provided with a mechanism (not shown) for condensing the vaporized liquid refrigerant 102 and returning it into the case as will be described in detail later.

  The liquid refrigerant 102 is an insulating and low boiling point liquid.

  The mounting substrate 103 is a substrate 104 on which a plurality of elements 105 a to 105 f are mounted, and is disposed in the case 101. The mounting substrate 103 includes a substrate 104, a plurality of elements 105a to 105f, a plurality of guide portions 106a to 106f, and a plurality of substrate through-hole portions 107a to 107f.

  Hereinafter, when the plurality of elements 105a to 105f are not particularly distinguished, they are also simply referred to as “elements 105”. Further, the plurality of guiding units 106a to 106f are also simply expressed as “guidance unit 106” unless they are particularly distinguished. The plurality of substrate through-hole portions 107a to 107f are also simply referred to as “substrate through-hole portions 107” unless they are particularly distinguished.

  The substrate 104 is a plate on which the element 105 is mounted by soldering or the like, and includes a first main surface 108 and a second main surface 109 that are parallel to each other.

  The first main surface 108 is a mounting surface on which the element 105 is mounted. In the present embodiment, the first main surface 108 is arranged in parallel with the vertical direction, and the whole is immersed in the liquid refrigerant 102. Note that at least a part of the first main surface 108 may be immersed in the liquid refrigerant 102 while intersecting the horizontal direction.

  The second main surface 109 is the back surface of the first main surface 108.

  Each of the elements 105 is mounted on the first main surface 108 and immersed in the liquid refrigerant 102.

  Each of the elements 105 is an element that generates heat during operation, and includes a heat dissipation region from which the heat is released. Each element 105 according to the present embodiment releases heat during operation from the whole. Therefore, the heat dissipation region according to the present embodiment is a surface excluding the surface exposed to the outside among the surfaces of each element 105, that is, the surface facing the first main surface 108.

  The guide portions 106a to 106f are flat members that are associated with the elements 105a to 105f and fixed to the first main surface 108 by an appropriate method such as soldering. Each of the guide portions 106a to 106f protrudes forward from the first main surface 108 above the associated elements 105a to 105f and extends to the left and right.

  Specifically, inductive units 106c to 106f according to the present embodiment are provided between associated elements 105c to 105f and elements 105a to 105d provided above associated elements 105c to 105f, respectively. The first main surface 108 is provided so as to protrude forward.

  Each of the guide portions 106c to 106f according to the present embodiment is larger than the associated elements 105c to 105f forward and protrudes forward from the first main surface 108. In addition, each of the guiding units 106c to 106f extends in the horizontal direction longer than or equal to the left and right lengths (widths) of the associated elements 105c to 105f. The upper part of 105f is covered.

  In this way, each of the guiding units 106c to 106f is provided so as to block the path of movement of bubbles from the associated elements 105c to 105f to the upper elements 105a to 105d.

  Here, the bubbles are generated by the vaporization of the liquid refrigerant 102 that has absorbed heat from the heat radiation area of the associated elements 105c to 105f. In addition, each of elements 105c to 105f according to the present embodiment corresponds to a first element. Each of the elements 105a to 105d provided above the elements 105c to 105f corresponds to a second element.

  More specifically, each of the guiding portions 106a to 106f includes a guiding surface 110 that faces the associated elements 105a to 105f. The guide surface 110 covers the upper portions of the elements 105a to 105f associated with the guide portions 106a to 106f including the guide surfaces 110, respectively.

  In the present embodiment, each of the guide surfaces 110 is inclined away from the first main surface 108 as it approaches the associated elements 105a to 105f, that is, downward and forward, from the first main surface 108. It sticks out. Each of the guide surfaces 110 according to the present embodiment is not inclined in the left-right direction. The left-right direction corresponds to the extending direction, which is the direction in which each of the guide portions 106 extends.

  The substrate through-hole portions 107a to 107f are provided in association with the elements 105a to 105f, respectively. Specifically, each of the substrate through-hole portions 107a to 107f is formed from the first main surface 108 between the associated elements 105a to 105f and the guiding portions 106a to 106f associated with the second main surface. A hole penetrating to 109 is formed. The holes formed by each of the substrate through-hole portions 107a to 107f may have a size that allows bubbles to pass through.

  So far, the configurations of the electronic device 100 and the mounting substrate 103 according to Embodiment 1 of the present invention have been described. From here, the operation | movement for cooling the element 105 in the electronic device 100 which concerns on this Embodiment is demonstrated.

  FIG. 3 is a flowchart for explaining an element cooling method of electronic apparatus 100 according to the first embodiment. As shown in the figure, the mounting substrate 103 is disposed in the case 101 (step S101). The liquid refrigerant 102 is injected into the case 101, and the mounting substrate 103 is immersed in the liquid refrigerant 102 (step S102).

  The case 101 is sealed so that the liquid refrigerant 102 does not leak out (step S103). Thereafter, the case 101 in which the mounting substrate 103 is sealed together with the liquid refrigerant is attached to a housing (not shown) of the electronic device 100 by an appropriate method. At this time, the substrate 104 is typically attached to a housing or the like so that the first main surface 108 is arranged along the vertical vertical direction as shown in FIG.

  The first main surface 108 is preferably attached so as to be used not only in the vertical direction but also in a state intersecting with the horizontal direction.

  As the electronic device 100 operates, the element 105 operates (step S104). As a result, the element 105 generates heat, and heat is released from each heat dissipation region of the element 105 (step S105).

  The heat released in step S <b> 105 is absorbed, and the liquid refrigerant 102 that mainly contacts each heat dissipation area of the element 105 is vaporized. Due to the vaporization of the liquid refrigerant 102, bubbles are generated in or near each heat dissipation region of the element 105 (step S106).

  When the bubbles generated in step S106 become large to some extent, they move away from the element 105 and generally move upward in the liquid refrigerant 102 as indicated by an arrow a1 in FIG. Here, as described above, the guiding unit 106 is provided so as to cover the upper side of the associated element 105. Therefore, the bubble moving upward hits the guiding unit 106 associated with the element 105 including the heat dissipation area where the bubble is generated.

  For example, bubbles generated by receiving heat from the heat radiation areas of the elements 105c to 105f strike the guiding portions 106 associated with the bubbles before reaching the upper elements 105a to 105d, respectively. Thus, the path | route for a bubble to move to each upper element 105a-105d by the guidance part 106 matched with the element 105c-105f is interrupted | blocked.

  Since the guide surface 110 included in the guide unit 106 faces the associated element 105, the bubble hits the guide surface 110 of the guide unit 106. The bubbles are guided along the guide surface 110 (step S107).

  As described above, the guide surface 110 according to the present embodiment is inclined so as to face downward and forward. Since the bubbles rise in the liquid refrigerant 102, they move upward and backward along the guide surface 110 as indicated by an arrow a2 in FIG.

  In the present embodiment, as described above, the through hole from the first main surface 108 to the second main surface 109 between the element 105 and the guiding portion 106 associated with each of the elements 105 is the substrate through hole portion 107. It is formed by. Therefore, the bubble that has moved upward and backward along the guide surface 110 passes through the through-hole in the substrate through-hole portion 107 and moves to the rear of the second main surface 109 as indicated by an arrow a2 in FIG. To do.

  The bubble rises behind the second main surface 109 as indicated by an arrow a3 in FIG. The bubbles are condensed by an appropriate method and returned to the liquid refrigerant 102. Steps S105 to S107 are repeated until the element operation (step S104) ends.

  So far, the first embodiment of the present invention has been described.

  According to the present embodiment, the guiding unit 106 is provided. Thereby, it is possible to almost eliminate the bubbles generated by the elements 105c to f located below to reach the other elements 105a to 105d located above the elements. Therefore, dry-out of the elements 105a to 105d can be suppressed. Therefore, the element 105 mounted on the substrate 104 can be efficiently cooled with a compact configuration. In addition, since the element 105 can be mounted on the substrate 104 at a high density, the electronic device 100 can be downsized.

  According to the present embodiment, the substrate through-hole portions 107c to 107f are provided. As a result, the bubbles generated by heat from the elements 105c to 105f located below are guided to the rear of the second main surface 109, and the bubbles reach the other elements 105a to 105d located above them. Can be reduced more reliably. Therefore, the dry out of the elements 105a to 105d can be more reliably suppressed. Therefore, the element 105 mounted on the substrate 104 can be cooled more efficiently with a compact configuration.

  The first embodiment may be modified as follows.

(Modification 1)
In the first embodiment, the example in which the substrate through-hole portion 107 is provided in the substrate 104 has been described. As shown in the perspective view of FIG. 5, the substrate through-hole portion 107 and the guide portion 106 may be provided on the substrate 204 by a guide member 211 including them.

  The guide member 211 is a member that is fixed to a mounting hole 212 provided in the substrate 204 by an appropriate method such as soldering as shown in FIG. As the mounting hole 212, for example, a hole generally provided for mounting a heat sink on the substrate 204 can be used.

  The guide member 211 includes a mounting plate part 213, a guide part 214, a fitting part 215, and a member through hole part 216.

  The attachment plate portion 213 is a flat plate-like portion attached to the first main surface 208 on which the element 105 is mounted on the substrate 204. The mounting plate portion 213 has a rectangular outer shape when viewed from the front, and is provided with a rectangular opening.

  The guide portion 214 is a flat plate-like portion that is connected to the upper edge of the mounting plate portion 213 and bent toward the front and lower sides. The guiding unit 214 corresponds to the guiding unit 106 according to the first embodiment.

  The fitting portion 215 is a portion that extends rearward from the outer edge of the opening of the mounting plate portion 213. The fitting part 215 has a rectangular shape when viewed from the front. The fitting portion 215 is fitted into the mounting hole 212 and fixed.

  The member through-hole portion 216 communicates with the opening of the attachment plate portion 213 and forms a hole that penetrates the fitting portion 215 in the front-rear direction. The member through-hole portion 216 and the attachment hole portion 212 constitute what corresponds to the substrate through-hole portion 107 according to the first embodiment.

  Also according to this modification, it is possible to obtain the electronic device 100 and the mounting substrate 103 having the same configuration as in the first embodiment. Therefore, the same effects as those of the first embodiment are obtained.

(Modification 2)
In the first embodiment, the example in which one mounting substrate 103 is arranged in the case 101 has been described. However, a plurality of mounting boards 103 may be arranged in the case 101 as shown in the side sectional view of FIG.

  Electronic device 300 according to the present modification includes case 101 and liquid refrigerant 102 similar to those in the first embodiment, and a plurality of mounting boards 303a and 303b.

  Each of the mounting boards 303a and 303b has a configuration similar to that of the mounting board 103 according to the first embodiment.

  Specifically, each of the mounting substrates 303a includes a first substrate 304a, a first element 305a, and a first induction corresponding to the substrate 104, the element 105, the induction unit 106, and the substrate through-hole unit 107 according to the first embodiment. Part 306a and a first substrate through-hole part 307a. Each of such mounting boards 303a corresponds to a first mounting board. Of the main surfaces of each of the first substrates 304a, the first main surface 308a on which the first element 305a is mounted corresponds to the first mounting surface. Further, the back surface of the first main surface 308a is a second main surface 309a.

  Each of the mounting boards 303a is arranged in the case 101 with the first main surface 108 facing forward, like the mounting board 103 according to the first embodiment.

  In addition, each of the mounting substrates 303b includes a second substrate 304b, a second element 305b, and a second induction unit 306b corresponding to the substrate 104, the element 105, the induction unit 106, and the substrate through-hole unit 107 according to the first embodiment. The second substrate through hole 307b is provided. Each of such mounting boards 303b corresponds to a second mounting board. Of the main surfaces of each of the second substrates 304b, the first main surface 308b on which the second element 305b is mounted corresponds to the second mounting surface. Further, the back surface of the first main surface 308b is the second main surface 309b.

  Each of the mounting boards 303b is arranged in the case 101 with the first main surface 108 facing rearward, unlike the mounting board 103 according to the first embodiment.

  As shown in FIG. 6, the mounting boards 303a and 303b are arranged so that the first main surfaces 308a and 308b face each other, or the second main surfaces 309a and 309b face each other. Yes.

  By disposing in this way, bubbles generated on one of the mounting boards 303a and 303b are difficult to reach the other of the mounting boards 303a and 303b. Therefore, similarly to the first embodiment, the element 105 mounted on the substrate 104 can be efficiently cooled with a compact configuration. In addition, since the element 105 can be mounted on the substrate 104 at a high density, the electronic device 100 can be downsized.

(Modification 3)
In the first embodiment, the example in which the guide portions 106a to 106f and the substrate through-hole portions 107a to 107f are provided in association with the elements 105a to 105f has been described. However, one guiding portion 106 and substrate through-hole portion 107 may be provided in association with the plurality of elements 105.

  FIG. 7 is a view of a cross section of the case 101 included in the electronic apparatus 400 according to this modification as seen from the front. As shown in the figure, the mounting substrate 403 includes the same substrate 104 as in the first embodiment and a plurality of elements 105a to 105f. Further, the mounting substrate 403 includes guide portions 106c and 106d similar to those in the first embodiment, and substrate through-hole portions 107c and 107d.

  Further, as shown in the figure, the mounting substrate 403 according to this modification is different from the mounting substrate 103 according to the first embodiment, and the guide portions 106a to 106b, 106e to 106f, and the substrate through-hole portions 107a to 107b. , 107e to 107f.

  The guide portion 106c and the substrate through hole portion 107c are provided in association with the lower elements 105c and 105e. The guiding portion 106d and the substrate through hole portion 107d are provided in association with the lower elements 105d and 105f.

  Also by this, for example, bubbles generated in the elements 105c and 105e can be almost prevented from reaching the upper element 105a. Therefore, dry-out of the element 105a can be suppressed. The same applies to the element 105b. Therefore, the element 105 mounted on the substrate 104 can be efficiently cooled with a compact configuration. In addition, since the element 105 can be mounted on the substrate 104 at a higher density, the electronic device 100 can be further downsized.

(Modifications 4 and 5)
In the first embodiment, the example in which the guide portion 106 is a flat plate member provided on the first main surface 108 and inclined forward and downward has been described. However, the guiding unit is not limited to this.

  For example, FIG. 8 is a view of a cross section of the case 101 included in the electronic device 500 according to the modification 4 as viewed from the front. In the mounting substrate 503 according to the modified example 4, as shown in the figure, each of the guide portions 506a to 506f is formed of a bent flat plate. Each of the guide portions 506a to 506f is fixed to the substrate 504, for example, by soldering a protrusion that fits into the small hole SH provided in the substrate 504.

  For example, FIG. 9 is a view of a cross section of the case 101 included in the electronic apparatus 600 according to the modification 5 as viewed from the front. In the substrate 604 included in the mounting substrate 603 according to the modified example 5, as shown in the figure, the substrate through-hole portions 607a to 607f are shifted to the right from directly above the elements 105a to 105f associated therewith. The first main surface 108 is provided so as to penetrate from the first main surface 108 to the second main surface 109. And the guidance | induction parts 606a-606f are provided so that a bubble may be induced | guided | derived to the board | substrate through-hole part 607a-607f from the element 105a-105f matched with each.

  These modifications also provide the same effects as those of the first embodiment.

(Other variations)
For example, the substrate 104 may be provided with at least one set of elements 105 arranged vertically.

  In addition, for example, a plurality of guiding units 106 may be provided between at least one set of elements 105 arranged in the vertical direction.

  Further, for example, the substrate through hole 107 may not be provided. When the substrate through-hole portion 107 is provided, the substrate through-hole portion 107 penetrates from the first main surface 108 between the guide portion 106 and the element 105 associated therebelow to the second main surface 109. One or more may be provided.

  The other modifications illustrated here also have the same effects as those of the first embodiment.

(Embodiment 2)
In the first embodiment, the example in which the guide surface 110 is not inclined in the left-right direction has been described. In the present embodiment, an example in which the guide surface is inclined in the left-right direction will be described. In the present embodiment, an example in which the protrusions are provided on the substrate 104 so that the air bubbles guided to the side by the guide surface do not reach the side elements 105 will be described.

  As shown in FIGS. 10 and 11, an electronic device 700 according to the present embodiment includes a case 101 and a liquid refrigerant 102 that are the same as those in the first embodiment, and a mounting board 703 that replaces the mounting board 103 according to the first embodiment. Is provided. The mounting substrate 703 includes a plurality of elements 105a to 105f similar to those in the first embodiment, a substrate 704 in place of the substrate 104 and the plurality of guiding portions 106a to 106f according to the first embodiment, and a plurality of guiding portions 706a to 706f. Including.

  Hereinafter, when the plurality of guide portions 706a to 706f are not particularly distinguished, they are also simply referred to as “guide portions 706”.

  The substrate 704 does not have the substrate through-hole portions 107a to 107f. Except for this point, the substrate 704 is configured in the same manner as the substrate 104 according to the first embodiment.

  The plurality of guide portions 706a to 706f are configured in substantially the same manner as the guide portions 106a to 106f according to Embodiment 1, respectively.

  In other words, the plurality of guiding portions 706a to 706f are flat members fixed to the first main surface 108 in association with the elements 105a to 105f, respectively. And each of guidance | induction part 706a-706f is each of the upper direction of each of the corresponding | compatible element 105c-105f from the corresponding | compatible element 105c-105f similarly to each of the guidance | induction part 106c-106f which concerns on Embodiment 1. FIG. The element 105a to 105d is provided so as to block a path through which bubbles move.

  Similarly to each of guidance sections 106c to 106f according to Embodiment 1, each of guidance sections 706a to 706f includes a guidance surface 710 that opposes associated elements 105a to 105f and covers the top thereof.

  The difference between the guiding portion 706 according to the present embodiment and the guiding portion 106 according to the first embodiment is in the direction in which the guiding surfaces 710 and 110 are inclined, and each of the guiding surfaces 710 is inclined in the left-right direction. .

  Specifically, each of the guide surfaces 710 according to the present embodiment is inclined so as to move away from the associated elements 105a to 105f toward the right, that is, as viewed from the front. Each of the guide surfaces 110 according to the present embodiment is not inclined in the front-rear direction.

  The protruding portion 717 extends vertically from the first main surface 108 at a position separated from the elements 105c and 105e in the right direction and protrudes forward. In the present embodiment, the protrusion 717 is provided so as to extend vertically between the elements 105a, 105c, and 105e and the elements 105b, 105d, and 105f.

  Each of the guide surfaces 710 may be inclined upward as viewed from the front. In this case, it is preferable to extend vertically at positions spaced leftward from the elements 105d and 105f and protrude forward from the first main surface 108. As described above, the protrusion 717 is provided in a direction in which the distance between the guide surface 710 and the elements 105c and 105e is large. In other words, the guide surface 710 is inclined in a direction in which bubbles generated from the elements 105c and 105e associated with the guide portions 706c and 706e including the guide surfaces 710 are guided to the protrusion 717.

  So far, the configurations of the electronic device 700 and the mounting substrate 703 according to the second embodiment of the present invention have been described. From here, operation | movement of the electronic device 700 which concerns on this Embodiment is demonstrated.

  Also in the present embodiment, steps S101 to S106 are performed in the same manner as in the first embodiment with reference to FIG. The difference between the present embodiment and the first embodiment is in the path through which bubbles are induced in step S107.

  In the bubble guiding step according to the present embodiment (step S107), the bubbles that have hit the guiding surface 710 move rightward according to the inclination of the guiding surface 710 while rising in the liquid refrigerant 102.

  The bubble guided to the guide surface 710 of the guide portions 706d and 706f moves generally upward as it passes the right end of the guide surface 710. For this reason, the bubbles hardly reach the elements 105a and 105d located above the elements 105d and 105f associated with the guiding portions 706d and 706f, respectively.

  In addition, the bubble guided to the guide surface 710 of the guide portions 706c and 706e moves generally upward as it passes the right end of the guide surface 710.

  However, the air bubbles may rise while moving further toward the right after passing the right end of the guide surface 710 due to the influence of the guide surface 710 of the guide portions 706c and 706e. Even if the bubbles move in this way, since the protrusions 717 are present, the bubbles almost reach the elements 105b and 105d located on the upper right side of the elements 105c and 105e associated with the guide portions 706d and 706f, respectively. do not do.

  Thereby, the bubbles generated in the elements 105c to 105f located below can hardly be prevented from reaching the other elements 105a to 105d located above. Similar to the first embodiment, steps S105 to S107 are repeated until the operation of the element (step S104) is completed.

  Since the present embodiment also includes the guiding portion 706, as in the first embodiment, bubbles generated in the elements 105c to f located below reach the other elements 105a to 105d located above each. You can almost eliminate it. Therefore, similarly to the first embodiment, the element 105 mounted on the substrate 104 can be efficiently cooled with a compact configuration. In addition, since the element 105 can be mounted on the substrate 104 at a high density, the electronic device 700 can be downsized.

  According to the present embodiment, the protrusion 717 is provided. Thereby, bubbles generated by heat from the elements 105c and 105e located below move according to the inclination direction of the guiding portion 706 and reach other elements 105b and 105d located on the side and above. Can be almost eliminated. Therefore, it is possible to efficiently cool the element 105 in which the elements 105 are arranged on the left and right and mounted on the substrate 104 with a compact configuration. In addition, since the element 105 can be mounted on the substrate 104 at a high density, the electronic device 700 can be downsized.

(Embodiment 3)
In the first embodiment, the example in which the guide surface 110 protrudes from the first main surface 108 so as to be inclined downward and forward is described. In the present embodiment, an example will be described in which the guide surface is inclined and protrudes from the first main surface 108 upward and forward.

  As shown in FIGS. 12 and 13, an electronic apparatus 800 according to the present embodiment includes a case 101 and a liquid refrigerant 102 similar to those in the first embodiment, and a mounting board 803 that replaces the mounting board 103 according to the first embodiment. Is provided. The mounting substrate 803 includes a plurality of elements 105a to 105f that are the same as those in the first embodiment, a substrate 704 that is the same as that in the second embodiment, and a plurality of guiding portions that replace the plurality of guiding portions 106a to 106f according to the first embodiment. 806a-806f.

  Hereinafter, when the plurality of guide portions 806a to 806f are not particularly distinguished, they are also simply referred to as “guide portions 806”.

  The plurality of guiding units 806a to 806f are configured in substantially the same manner as the guiding units 106a to 106f according to Embodiment 1, respectively.

  That is, the plurality of guide portions 806a to 806f are flat members fixed to the first main surface 108 in association with the elements 105a to 105f, respectively. In addition, in each of the guiding units 806a to 806f, as in each of the guiding units 106c to 106f according to the first embodiment, bubbles are generated from the associated elements 105c to 105f to the upper elements 105a to 105d. It is provided to block the moving route.

  Each of the guide portions 806a to 806f includes a guide surface 810 that faces the associated elements 105a to 105f and covers the top thereof, like each of the guide portions 106c to 106f according to the first embodiment.

  The difference between the guiding portion 806 according to the present embodiment and the guiding portion 106 according to the first embodiment is in the direction in which the guiding surfaces 810 and 110 are inclined.

  Specifically, each of the guide surfaces 7 according to the present embodiment is inclined first so as to move away from the first main surface 108 as it moves away from the associated elements 105a to 105f, that is, toward the upper front. It protrudes from the main surface 108. Each of the guide surfaces 810 according to the present embodiment is not inclined in the left-right direction.

  So far, the configurations of the electronic device 800 and the mounting substrate 803 according to Embodiment 3 of the present invention have been described. From here, operation | movement of the electronic device 800 which concerns on this Embodiment is demonstrated.

  Also in the present embodiment, steps S101 to S106 are performed in the same manner as in the first embodiment with reference to FIG. The difference between the present embodiment and the first embodiment is in the path through which bubbles are induced in step S107.

  In the bubble guiding step according to the present embodiment (step S107), the bubbles hitting the guiding surface 810 move forward according to the inclination of the guiding surface 810 while rising in the liquid refrigerant 102.

  The bubbles guided to the guide portions 806c to 806f move generally upward and forward according to the inclination of the guide surface 810. Each of the guide portions 806c to 806f protrudes forward from the elements 105a to 105d located above the associated elements 105c to 105f. For this reason, the bubbles guided to the guiding portions 806c to 806f move in the liquid refrigerant 102 in front of the elements 105a to 105d positioned above the bubbles. As a result, the bubbles hardly reach the elements 105a to 105d located above the elements 105c to 105f associated with the guiding portions 806c to 806f, respectively.

  Thereby, the bubbles generated in the elements 105c to 105f located below can hardly be prevented from reaching the other elements 105a to 105d located above. Similar to the first embodiment, steps S105 to S107 are repeated until the operation of the element (step S104) is completed.

  According to the present embodiment, the guiding unit 806 is provided. Thereby, the bubbles generated in the elements 105c to 105f located below can hardly be prevented from reaching the other elements 105a to 105d located above. Therefore, similarly to the first embodiment, the element 105 mounted on the substrate 104 can be efficiently cooled with a compact configuration. In addition, since the element 105 can be mounted on the substrate 104 at a high density, the electronic device 800 can be downsized.

(Embodiment 4)
In the first to third embodiments, the example in which each of the elements 105 is the heat dissipation region has been described. In the present embodiment, an example will be described in which the element includes a heat spreader (generally also referred to as an integrated heat spreader), and the heat spreader serves as a heat dissipation region.

  As shown in FIGS. 14 and 15, an electronic device 900 according to the present embodiment includes a case 101 and a liquid refrigerant 102 that are the same as those in the first embodiment, and a mounting board 903 that replaces the mounting board 103 according to the first embodiment. Is provided.

  The mounting substrate 903 includes the same substrate 704 as in the second embodiment. Further, the mounting substrate 903 includes a plurality of elements 905a to 905f and a plurality of guiding parts 906a to 906f instead of the plurality of elements 105a to 105f and the plurality of guiding parts 106a to 106f according to the first embodiment.

  Hereinafter, when the plurality of elements 905a to 905f are not particularly distinguished, they are also simply referred to as “element 905”. In addition, the plurality of guiding units 906a to 906f are also simply expressed as “guidance unit 906” unless they are particularly distinguished.

  Each of the elements 905 is mounted on the first main surface 108 and immersed in the liquid refrigerant 102, similarly to the element 105 according to the first embodiment.

  Elements 905a to 905f according to the present embodiment include element bodies 918a to 918f and heat spreaders 919a to 919f, respectively.

  Hereinafter, when the plurality of element bodies 918a to 918f are not particularly distinguished, they are also simply referred to as “element bodies 918”. Further, the plurality of heat spreaders 919a to 919f are also simply referred to as “heat spreader 919” unless they are particularly distinguished.

  The element body 918 is an element that generates heat during operation. The heat spreader 919 is attached to the front surface of the element body 918 to form a heat dissipation area of the element 905. That is, in the element 905 according to the present embodiment, the heat generated by the element body 918 is generally released from the heat spreader 919.

  The heat spreader 919 according to the present embodiment is a flat plate-like portion that is generally rectangular when viewed from the front.

  The guide portions 906a to 906f are flat portions provided in association with the elements 905a to 905f, respectively. The guide portions 906a to 906f are connected to the upper side portions of the heat spreaders 919a to 919f, and protrude and extend forward. The guiding portions 906a to 906f extend to the left and right with a width larger than the width of the heat spreaders 919a to 919f of the associated elements 905c to 905f, respectively.

  As described above, each of the guiding units 906c to 906f according to the present embodiment includes the heat spreaders 919c to 919f of the associated elements 905c to 905f and the element 905a provided above the associated elements 905c to 905f. It extends between ~ 905d. Each of the guiding portions 906c to 906f is provided so as to block a path through which bubbles move from the associated elements 905c to 905f to the respective upper elements 905a to 905d.

  Note that the left and right lengths of the guiding portions 906a to 906f may be the same as the widths of the heat spreaders 919a to 919f of the associated elements 905c to 905f.

  More specifically, each of the guide portions 906a to 906f includes a guide surface 910 that faces front and lower. In the present embodiment, each of the guide surfaces 910 is inclined so as to move away from the first main surface 108 as it moves away from the associated element 8, that is, toward the upper front. Each of the guide surfaces 910 according to the present embodiment is not inclined in the left-right direction.

  So far, the configurations of the electronic device 900 and the mounting substrate 903 according to the fourth embodiment of the present invention have been described. From here, operation | movement of the electronic device 900 which concerns on this Embodiment is demonstrated.

  Also in the present embodiment, steps S101 to S104 are performed in the same manner as in the first embodiment with reference to FIG. The difference between the present embodiment and the first embodiment is in steps S105 to S107.

  In the present embodiment, heat is released from the heat spreader 919 that is the heat dissipation area of each element 905 (step S105).

  The heat released in step S105 is absorbed, and the liquid refrigerant 102 mainly contacting the front surface of each heat spreader 919 is vaporized. Due to the vaporization of the liquid refrigerant 102, bubbles are generated on the front surface of each heat spreader 919 or in the vicinity thereof (step S106).

  When the bubble generated here becomes large to some extent, it generally moves upward and hits the induction unit 106 connected to the heat spreader 919 that has released the heat that is the generation source.

  For example, bubbles generated by receiving heat from the heat spreader 919 of the elements 905c to 905f hit the guiding portions 906 associated therewith before reaching the upper elements 905a to 905d. Thus, the path | route for a bubble to move to each upper element 905a-905d by the guidance | induction part 906 matched with the elements 905c-905f is interrupted | blocked.

  Since the guide surface 910 included in the guide portion 906 protrudes forward from the front surface of the heat spreader 919 above the heat spreader 919, the bubbles hit the guide surface 910. The bubbles are then guided along the guide surface 110 of the guide unit 106 (step S107).

  As described above, the guide surface 910 according to the present embodiment is inclined so as to go upward. Since the bubbles rise in the liquid refrigerant 102, they move upward and forward along the guide surface 110. Each of the guiding portions 906c to 906f protrudes forward from the elements 905a to 905d positioned above the associated elements 905c to 905f, respectively. For this reason, the air bubbles guided to the guiding portions 906c to 906f move in the liquid refrigerant 102 in front of the elements 905a to 905d positioned above the air bubbles. As a result, the bubbles hardly reach the elements 905a to 905d located above the elements 905c to 905f associated with the guide portions 906c to 906f, respectively.

  Thereby, the bubbles generated in the elements 905c to 905f positioned below can be almost prevented from reaching the other elements 905a to 905d positioned above the elements 905c to 905f. Similar to the first embodiment, steps S105 to S107 are repeated until the operation of the element (step S104) is completed.

  According to the present embodiment, the guide unit 906 is provided. Thereby, the bubbles generated in the elements 905c to 905f positioned below can be almost prevented from reaching the other elements 905a to 905d positioned above the elements 905c to 905f. Therefore, similarly to the first embodiment, the element 905 mounted on the substrate 104 can be efficiently cooled with a compact configuration. In addition, since the element 905 can be mounted on the substrate 104 with high density, the electronic device 900 can be downsized.

  Although embodiments and modifications of the present invention have been described, the present invention is not limited to these. For example, the present invention includes a form in which some or all of the embodiments and modifications described so far are appropriately combined, and a form in which the form is appropriately changed.

  INDUSTRIAL APPLICABILITY The present invention is useful for a substrate on which a plurality of elements are mounted, an electronic device on which such a substrate is mounted, and for cooling a plurality of elements in those substrates and electric devices.

100, 300, 400, 500, 600, 700, 800, 900 Electronic device 101 Case 102 Liquid refrigerant 103, 303a, 303b, 403, 503, 603, 703, 803, 903 Mounting substrate 104, 204, 504, 604, 704 Substrate 105a to 105f, 905a to 905f Element 106a to 106f, 506a to 506f, 606a to 606f, 706a to 706f, 806a to 806f, 906a to 906f Guide portion 107a to 107f, 607a to 607f Substrate through hole portion 108, 308a First Main surface 109, 309a Second main surface 110, 710, 810, 910 Guide surface 304a First substrate 304b Second substrate 305a First element 305b Second element 306a First guide portion 306b Second guide portion 307a First substrate penetration Hole 307b first Two substrate through-hole portions 717 Projection portions 918a to 918f Element main bodies 919a to 919f Heat spreader

Claims (10)

A first substrate including a first mounting surface that is at least partially immersed in an insulating liquid refrigerant in a state intersecting with the horizontal direction;
A first element mounted on the first mounting surface and immersed in the liquid refrigerant, the first element including a first heat radiation area from which heat is released during operation;
A second element mounted on the first mounting surface above the first element and immersed in the liquid refrigerant;
The first heat radiation area and the second heat radiation area are blocked so that bubbles generated by vaporization of the liquid refrigerant that has absorbed heat from the first heat radiation area are blocked from moving from the first heat radiation area to the second element. A mounting board comprising: a first guiding portion extending between the element. The mounting board according to claim 1, wherein the first guide portion is provided so as to protrude from the first mounting surface. The mounting according to claim 2, further comprising a substrate through-hole portion penetrating from between the first element on the first mounting surface and the first guiding portion to a back surface of the first mounting surface. substrate. The mounting substrate according to claim 2, wherein the first guide portion includes a guide surface that faces the first element and is inclined in an extending direction in which the first guide portion extends. And further including a protrusion protruding from the first mounting surface at a position spaced in the extending direction with respect to the first element and the second element,
The mounting board according to claim 4, wherein the inclined surface is inclined in a direction in which the bubbles are guided to the protrusions. The mounting substrate according to claim 2, wherein the first guiding portion includes a guiding surface that is inclined so as to be separated from the first mounting surface as being separated from the first element. The first element is
A first element body;
A heat spreader attached to the first element body and forming the first heat dissipation region;
The mounting substrate according to claim 1, wherein the first guiding portion extends while being connected to the heat spreader. A case in which an insulating liquid refrigerant is enclosed;
A first substrate including a first mounting surface disposed in the case, the first mounting surface being at least partially immersed in the liquid refrigerant in a state intersecting with a horizontal direction;
A first element mounted on the first mounting surface and immersed in the liquid refrigerant, the first element including a first heat radiation area from which heat is released during operation;
A second element mounted on the first mounting surface above the first element and immersed in the liquid refrigerant;
The first heat radiation area and the second heat radiation area are blocked so that bubbles generated by vaporization of the liquid refrigerant that has absorbed heat from the first heat radiation area are blocked from moving from the first heat radiation area to the second element. An electronic device comprising: a first guiding portion extending between the device and the device. A second substrate including a second mounting surface disposed in the case, the second mounting surface being at least partially immersed in the liquid refrigerant in a state intersecting with a horizontal direction;
A third element mounted on the second mounting surface and immersed in the liquid refrigerant, the second element including a second heat radiation area from which heat is released during operation;
A fourth element mounted on the second mounting surface above the third element and immersed in the liquid refrigerant;
The second heat radiating region and the fourth heat dissipating region are blocked so that bubbles generated by vaporization of the liquid refrigerant that has absorbed heat from the third heat radiating region move from the second heat radiating region to the fourth element. A second guiding portion extending between the device and the device,
The first guiding portion and the second guiding portion are provided so as to protrude from the first mounting surface and the second mounting surface, respectively.
The first substrate includes a first substrate through-hole portion penetrating from the first element on the first mounting surface to the back surface of the first mounting surface from between the first element and the first guide portion.
The second substrate includes a second substrate through-hole portion penetrating from between the third element on the second mounting surface and the second guiding portion to the back surface of the second mounting surface,
The first substrate and the second substrate are arranged such that the back surfaces of the first substrate and the second substrate face each other, or the first mounting surface and the second mounting surface face each other. 9. The electronic apparatus according to claim 8, wherein Immersing the first element and the second element mounted on the first mounting surface in an insulating liquid refrigerant in a state where the first mounting surface included in the first substrate intersects the horizontal direction;
Operating the first element to release heat from the first heat dissipation region included in the first element;
Generating bubbles by vaporization of the liquid refrigerant that has absorbed heat released from the first heat dissipation region;
The generation is performed by the first induction portion extending between the first heat dissipation region and the second element mounted above the first element on the first mounting surface and immersed in the liquid refrigerant. Shutting off the path of the bubble that has moved from the first heat dissipation region to the second element. An element cooling method, comprising:

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