JP6767837B2 - Cooling system - Google Patents
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- JP6767837B2 JP6767837B2 JP2016199896A JP2016199896A JP6767837B2 JP 6767837 B2 JP6767837 B2 JP 6767837B2 JP 2016199896 A JP2016199896 A JP 2016199896A JP 2016199896 A JP2016199896 A JP 2016199896A JP 6767837 B2 JP6767837 B2 JP 6767837B2
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- 238000001816 cooling Methods 0.000 title claims description 35
- 239000003507 refrigerant Substances 0.000 claims description 128
- 238000010438 heat treatment Methods 0.000 claims description 50
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- 238000001704 evaporation Methods 0.000 claims description 5
- 230000008020 evaporation Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 description 8
- 238000005219 brazing Methods 0.000 description 5
- 230000032258 transport Effects 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000010365 information processing Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- JVBXVOWTABLYPX-UHFFFAOYSA-L sodium dithionite Chemical compound [Na+].[Na+].[O-]S(=O)S([O-])=O JVBXVOWTABLYPX-UHFFFAOYSA-L 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
この発明は、たとえば半導体デバイスなどの電子部品からなる発熱体を冷却する冷却装置に関する。 The present invention relates to a cooling device for cooling a heating element made of an electronic component such as a semiconductor device.
この明細書および特許請求の範囲において、図２および図６の上下、左右を上下、左右というもとのとする。 Within the scope of this specification and claims, the top and bottom and left and right of FIGS. 2 and 6 are referred to as top and bottom and left and right.
たとえば、サーバ、ファイル装置、ネットワーク装置等の情報処理機器に用いられる半導体デバイスにおいては、近年、高集積化、処理能力の高速化、高機能化によって発熱量が極めて多くなっている。 For example, in semiconductor devices used in information processing devices such as servers, file devices, and network devices, the amount of heat generated has become extremely large in recent years due to high integration, high-speed processing capacity, and high functionality.
サーバにおいて、種々の半導体デバイスを冷却する冷却装置として、比較的発熱量の大きな半導体デバイスからの発熱を外部に輸送する複数のサーモサイフォンと、比較的発熱量の小さな半導体デバイスからの発熱をサーモサイフォンへ輸送する複数のヒートパイプと、複数のサーモサイフォンと熱的に接続され、半導体デバイスからの熱を外部に輸送するサーマルハイウェイと、外部に輸送された熱を筐体の外部へ輸送する凝縮器とから構成された冷却装置が知られている(特許文献１参照)。 In a server, as a cooling device for cooling various semiconductor devices, a plurality of thermosiphons that transport heat generated from a semiconductor device having a relatively large calorific value to the outside, and a thermosiphon that dissipate heat generated from a semiconductor device having a relatively small calorific value to the outside. A thermal highway that is thermally connected to multiple heat pipes to transport to and multiple thermosiphons to transport heat from semiconductor devices to the outside, and a condenser that transports heat transported to the outside to the outside of the housing. A cooling device composed of and is known (see Patent Document 1).
しかしながら、特許文献１記載の冷却装置においては、複数のサーモサイフォンやヒートパイプを必要とするので、コストが高くなるとともに、製造が困難であるという問題がある。 However, since the cooling device described in Patent Document 1 requires a plurality of thermosiphons and heat pipes, there is a problem that the cost is high and the manufacturing is difficult.
この発明の目的は、上記問題を解決し、特許文献１記載の冷却装置に比較してコストの安い冷却装置を提供することにある。 An object of the present invention is to solve the above problems and to provide a cooling device having a lower cost than the cooling device described in Patent Document 1.
本発明は、上記目的を達成するために以下の態様からなる。 The present invention comprises the following aspects in order to achieve the above object.
1)上下方向に広がった発熱体取付面を有するとともに、当該発熱体取付面に複数の発熱体取付部が上下方向に間隔をおいて設けられているベースを備えており、ベース内の上端寄りの部分および下端寄りの部分のうちいずれか一方に冷媒入口ヘッダ部が設けられるとともに、同他方に冷媒出口ヘッダ部が設けられ、ベース内に、冷媒入口ヘッダ部と冷媒出口ヘッダ部とを通じさせる複数の冷媒流路が、互いに離隔した状態で並列状となるように形成され、冷媒流路が、上下方向に間隔をおいて設けられて左右方向に延びる直線部および隣り合う直線部どうしを左右交互に連結する連結部からなる蛇行状であり、ベースの各発熱体取付部が、冷媒流路の各直線部と対応する位置に設けられており、発熱体取付部に取り付けられた発熱体が、冷媒流路内を流れる冷媒の蒸発潜熱により冷却されるようになっている冷却装置。 1) In addition to having a heating element mounting surface that extends in the vertical direction, the heating element mounting surface is equipped with a base in which a plurality of heating element mounting portions are provided at intervals in the vertical direction, near the upper end in the base. A refrigerant inlet header portion is provided in one of the portion and the portion near the lower end, and a refrigerant outlet header portion is provided in the other portion, and a plurality of refrigerant inlet header portions and refrigerant outlet header portions are passed through the base. The refrigerant flow paths are formed so as to be parallel to each other in a state of being separated from each other, and the refrigerant flow paths are provided at intervals in the vertical direction and extend in the left-right direction and the adjacent straight portions alternate left and right. Each heating element mounting portion of the base is provided at a position corresponding to each straight portion of the refrigerant flow path, and the heating element attached to the heating element mounting portion is formed in a serpentine shape. A cooling device that is cooled by the latent heat of evaporation of the refrigerant flowing in the refrigerant flow path.
2)ベースの冷媒流路の直線部に、インナーフィンが設けられている上記1)記載の冷却装置。 2) The cooling device according to 1) above, in which inner fins are provided in the straight part of the refrigerant flow path of the base.
3)ベースがアルミニウム製であり、冷媒として、アルミニウムに対して非腐食性を有する非水系冷媒が用いられる上記1)または2)記載の冷却装置。 3) The cooling device according to 1) or 2) above, wherein the base is made of aluminum and a non-aqueous refrigerant having non-corrosiveness to aluminum is used as the refrigerant.
上記1)〜3)の冷却装置によれば、上下方向に広がった発熱体取付面を有するとともに、当該発熱体取付面に複数の発熱体取付部が上下方向に間隔をおいて設けられているベースを備えており、ベース内の上端寄りの部分および下端寄りの部分のうちいずれか一方に冷媒入口ヘッダ部が設けられるとともに、同他方に冷媒出口ヘッダ部が設けられ、ベース内に、冷媒入口ヘッダ部と冷媒出口ヘッダ部とを通じさせる複数の冷媒流路が、互いに離隔した状態で並列状となるように形成され、冷媒流路が、上下方向に間隔をおいて設けられて左右方向に延びる直線部および隣り合う直線部どうしを左右交互に連結する連結部からなる蛇行状であり、ベースの各発熱体取付部が、冷媒流路の各直線部と対応する位置に設けられており、発熱体取付部に取り付けられた発熱体が、冷媒流路内を流れる冷媒の蒸発潜熱により冷却されるようになっているので、ベースの発熱体取付面の発熱体取付部に取り付けられた複数の発熱体をほぼ等しい温度となるように冷却することができる。すなわち、複数の冷媒流路が互いに離隔した状態で並列状となるように形成されており、冷媒入口ヘッダ部に流入し、各冷媒流路内を流れる冷媒の沸騰による蒸発潜熱により複数の発熱体を冷却するようになっていると、各冷媒流路で発生した気相冷媒は冷媒流路の上部を流れるとともに液相冷媒は冷媒流路の下部を流れることになり、しかも全冷媒流路を流れる冷媒は、冷媒出口ヘッダ部に至るまでの間に混じることはなく、各冷媒流路の上下間のみで温度差が生じるだけである。したがって、複数の発熱体をほぼ等しい温度となるように冷却することができる。さらに、複数のサーモサイフォンやヒートパイプが用いられている特許文献１記載の冷却装置に比較してコストが安くなる。 According to the cooling devices 1) to 3) above, the cooling device has a heating element mounting surface that extends in the vertical direction, and a plurality of heating element mounting portions are provided on the heating element mounting surface at intervals in the vertical direction. A base is provided, and a refrigerant inlet header portion is provided in one of a portion near the upper end and a portion near the lower end in the base, and a refrigerant outlet header portion is provided in the other, and a refrigerant inlet is provided in the base. A plurality of refrigerant flow paths through which the header portion and the refrigerant outlet header portion are passed are formed so as to be parallel to each other in a state of being separated from each other, and the refrigerant flow paths are provided at intervals in the vertical direction and extend in the left-right direction. It has a serpentine shape consisting of a straight part and a connecting part that connects adjacent straight parts alternately on the left and right, and each heating element mounting part of the base is provided at a position corresponding to each straight part of the refrigerant flow path, and generates heat. Since the heating element attached to the body mounting portion is cooled by the latent heat of evaporation of the refrigerant flowing in the refrigerant flow path, a plurality of heat generating elements attached to the heating element mounting portion on the heating element mounting surface of the base are generated. The body can be cooled to approximately the same temperature. That is, a plurality of refrigerant flow paths are formed so as to be parallel to each other in a state of being separated from each other, and a plurality of heating elements are generated by latent heat of evaporation due to boiling of the refrigerant flowing in the refrigerant inlet header portion and flowing in each refrigerant flow path. When the refrigerant is designed to be cooled, the gas-phase refrigerant generated in each refrigerant flow path flows in the upper part of the refrigerant flow path, and the liquid-phase refrigerant flows in the lower part of the refrigerant flow path. The flowing refrigerant does not mix up to the refrigerant outlet header portion, and only a temperature difference occurs between the upper and lower parts of each refrigerant flow path. Therefore, the plurality of heating elements can be cooled so as to have substantially the same temperature. Further, the cost is lower than that of the cooling device described in Patent Document 1 in which a plurality of thermosiphons and heat pipes are used.
上記2)の冷却装置によれば、ベースの発熱体取付部に取り付けられた発熱体の冷却効率が向上する。 According to the cooling device of 2) above, the cooling efficiency of the heating element attached to the heating element mounting portion of the base is improved.
上記3)の冷却装置によれば、ベースの軽量化を図った上で、発熱体から冷媒流路内を流れる冷媒への熱伝導性を向上させることができ、しかもベースの腐食が防止される。 According to the cooling device of 3) above, it is possible to improve the thermal conductivity from the heating element to the refrigerant flowing in the refrigerant flow path while reducing the weight of the base, and further prevent the base from corroding. ..
以下、この発明の実施形態を、図面を参照して説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
この明細書において、「アルミニウム」という用語には、純アルミニウムの他にアルミニウム合金を含むものとする。 In this specification, the term "aluminum" shall include aluminum alloys in addition to pure aluminum.
また、以下の説明において、上下方向および左右方向と直交する方向を前後方向とし、図３および図５の上側(図４の左側)を前、これと反対側を後というものとする。 Further, in the following description, the directions orthogonal to the vertical direction and the horizontal direction are defined as the front-rear direction, the upper side of FIGS. 3 and 5 (left side of FIG. 4) is referred to as the front, and the opposite side is referred to as the rear.
図１および図２は冷却装置の全体構成を示し、図３〜図５はその要部の構成を示す。 1 and 2 show the overall configuration of the cooling device, and FIGS. 3 to 5 show the configuration of the main part thereof.
図１および図２において、冷却装置(1)は、扁平な縦長直方体状のアルミニウム製ベース(2)を備えている。ベース(2)における上下方向および左右方向に広がりかつ互いに反対側を向いた前後両側面のうち少なくとも一面、ここでは前面が発熱体取付面(3)となっており、発熱体取付面(3)に複数の発熱体取付部(4)が上下方向に間隔をおいて設けられている。 In FIGS. 1 and 2, the cooling device (1) includes a flat, vertically elongated rectangular parallelepiped aluminum base (2). At least one of the front and rear side surfaces of the base (2) that spreads in the vertical and horizontal directions and faces opposite sides, here the front surface is the heating element mounting surface (3), and the heating element mounting surface (3) A plurality of heating element mounting portions (4) are provided at intervals in the vertical direction.
ベース(2)内の上端寄りの左側部分に冷媒入口ヘッダ部(5)が設けられるとともに、ベース(2)内の下端寄りの右側部分に冷媒出口ヘッダ部(6)が設けられている。冷媒入口ヘッダ部(5)は、ベース(2)の左側面の上端寄りの部分から右方に向かって形成されて冷媒入口ヘッダ部(5)内に至る穴状の冷媒入口(7)を介してベース(2)の外部に通じさせられている。冷媒出口ヘッダ部(6)は、ベース(2)の右側面の下端寄りの部分から左方に向かって形成されて冷媒出口ヘッダ部(6)内に至る穴状の冷媒出口(8)を介して外部に通じさせられている。 A refrigerant inlet header (5) is provided on the left side of the base (2) near the upper end, and a refrigerant outlet header (6) is provided on the right side of the base (2) near the lower end. The refrigerant inlet header portion (5) is formed from a portion near the upper end of the left side surface of the base (2) toward the right through a hole-shaped refrigerant inlet (7) extending into the refrigerant inlet header portion (5). It is connected to the outside of the base (2). The refrigerant outlet header portion (6) is formed from a portion near the lower end of the right side surface of the base (2) toward the left through a hole-shaped refrigerant outlet (8) extending into the refrigerant outlet header portion (6). It is communicated to the outside.
ベース(2)内に、冷媒入口ヘッダ部(5)と冷媒出口ヘッダ部(6)とを通じさせる複数の冷媒流路(9)が、仕切壁(10)を介して互いに離隔した状態で並列状となるように形成されている。各冷媒流路(9)は、上下方向に間隔をおいて設けられて左右方向に延びる直線部(9a)、および隣り合う直線部(9a)どうしを左右交互に連結する連結部(9b)からなる蛇行状である。各冷媒流路(9)の直線部(9a)内には、左右方向に延びるインナーフィン(11)が設けられている。 In the base (2), a plurality of refrigerant flow paths (9) through which the refrigerant inlet header portion (5) and the refrigerant outlet header portion (6) pass are arranged in parallel in a state of being separated from each other via a partition wall (10). It is formed so as to be. Each refrigerant flow path (9) is provided from a straight portion (9a) that is provided at intervals in the vertical direction and extends in the left-right direction, and a connecting portion (9b) that connects adjacent straight portions (9a) alternately to the left and right. It is a meandering shape. Inner fins (11) extending in the left-right direction are provided in the straight portion (9a) of each refrigerant flow path (9).
ベース(2)の各発熱体取付部(4)は、冷媒流路(9)の各直線部(9a)と対応する位置に設けられている。そして、半導体デバイスなどからなる複数の発熱体(12)が、ベース(2)の発熱体取付面(3)の各発熱体取付部(4)に、左右方向に間隔をおいて取り付けられる。図１および図２に示す例では、各発熱体取付部(4)に、複数の発熱体(12)が１列となるように取り付けられているが、これに限定されるものではなく、各発熱体取付部(4)に、上下方向に間隔をおいて並んだ２以上の発熱体(12)からなる組が、左右方向に間隔をおいて複数取り付けられる場合もあり、あるいは１つの発熱体(12)と、上下方向に間隔をおいて並んだ２以上の発熱体(12)からなる組とが混ざり合うように左右方向に間隔をおいて取り付けられる場合もある。 Each heating element mounting portion (4) of the base (2) is provided at a position corresponding to each straight portion (9a) of the refrigerant flow path (9). Then, a plurality of heating elements (12) made of a semiconductor device or the like are attached to the heating element mounting portions (4) of the heating element mounting surface (3) of the base (2) at intervals in the left-right direction. In the examples shown in FIGS. 1 and 2, a plurality of heating elements (12) are attached to each heating element mounting portion (4) so as to form a row, but the present invention is not limited to this, and each heating element (12) is not limited to this. A set of two or more heating elements (12) arranged at intervals in the vertical direction may be attached to the heating element mounting portion (4) at intervals in the horizontal direction, or one heating element may be attached. In some cases, (12) and a set consisting of two or more heating elements (12) arranged at intervals in the vertical direction are mixed with each other at intervals in the horizontal direction.
冷却装置のベース(2)は、冷媒入口ヘッダ部用凹所(14)、冷媒出口ヘッダ部用凹所(15)、複数の冷媒流路用凹所(16)、冷媒入口(7)および冷媒出口(8)が形成されるとともに、冷媒流路用凹所(16)の直線部(9a)となる部分の底面にインナーフィン(11)が立ち上がり状に一体に設けられている第１アルミニウム板(13)と、冷媒入口ヘッダ部用凹所(14)、冷媒出口ヘッダ部用凹所(15)および複数の冷媒流路用凹所(16)の開口を塞ぐように、両面にろう材層を有するアルミニウムブレージングシート(17)を利用して第１アルミニウム板(13)にろう材により接合されて第１アルミニウム板(13)の全体を覆う第２アルミニウム板(18)とからなる。なお、インナーフィン(11)の立ち上がり高さは、冷媒流路用凹所(16)の深さ、すなわち隣り合う冷媒流路用凹所(16)間の仕切壁(10)の高さと同一であり、インナーフィン(11)の突出端は、アルミニウムブレージングシート(17)を利用して第２アルミニウム板(18)にろう材により接合されている。そして、第２アルミニウム板(18)の外面がベース(2)の発熱体取付面(3)となっている。 The base (2) of the cooling device includes a recess for the refrigerant inlet header (14), a recess for the refrigerant outlet header (15), a recess for a plurality of refrigerant channels (16), a refrigerant inlet (7), and a refrigerant. A first aluminum plate in which an outlet (8) is formed and an inner fin (11) is integrally provided on the bottom surface of a portion of the recess (16) for a refrigerant flow path that becomes a straight portion (9a). (13) and brazing material layers on both sides so as to close the openings of the refrigerant inlet header recess (14), the refrigerant outlet header recess (15), and the plurality of refrigerant flow path recesses (16). It is composed of a second aluminum plate (18) which is joined to the first aluminum plate (13) by a brazing material and covers the entire first aluminum plate (13) by utilizing the aluminum brazing sheet (17) having the above. The rising height of the inner fin (11) is the same as the depth of the refrigerant flow path recess (16), that is, the height of the partition wall (10) between the adjacent refrigerant flow path recesses (16). Yes, the protruding end of the inner fin (11) is joined to the second aluminum plate (18) by a brazing material using an aluminum brazing sheet (17). The outer surface of the second aluminum plate (18) is the heating element mounting surface (3) of the base (2).
冷却装置(1)においては、アルミニウムに対して非腐食性を有しており、かつ発熱体取付部(4)に取り付けられた発熱体(12)から発せられる熱により蒸発するとともに、冷媒入口ヘッダ部(5)から冷媒出口ヘッダ部(6)に至るまでの間に完全に気相となることのない使用温度範囲が２０〜９０℃である非水系冷媒、たとえばハイドロフルオロカーボン、ハイドロフルオロオレフィン、ハイドロカーボン、ハイドロフルオロエーテルなどが用いられる。 In the cooling device (1), it is non-corrosive to aluminum and evaporates due to the heat generated from the heating element (12) attached to the heating element mounting portion (4), and the refrigerant inlet header. Non-aqueous refrigerants with an operating temperature range of 20 to 90 ° C. that does not completely become a gas phase between the part (5) and the refrigerant outlet header part (6), such as hydrofluorocarbons, hydrofluoroolefins, and hydros. Carbon, hydrofluoroether, etc. are used.
上述した冷却装置(1)において、液相冷媒が冷媒入口(7)を通して冷媒入口ヘッダ部(5)内に送り込まれ、複数の冷媒流路(9)に分流して各冷媒流路(9)内を冷媒出口ヘッダ部(6)に向かって流れる。そして、各発熱体取付部(4)に取り付けられた発熱体(12)は、冷媒流路(9)内を流れる冷媒の沸騰による蒸発潜熱により冷却される。ここで、複数の冷媒流路(9)が仕切壁(10)を介して互いに離隔した状態で並列状となるように形成されており、冷媒入口ヘッダ部(5)に流入し、各冷媒流路(9)内を流れる冷媒の沸騰による蒸発潜熱により複数の発熱体(12)を冷却するようになっていると、各冷媒流路(9)で発生した気相冷媒は冷媒流路(9)の上部を流れるとともに液相冷媒は冷媒流路(9)の下部を流れることになり、しかも全冷媒流路(9)を流れる冷媒は、冷媒出口ヘッダ部(6)に至るまでの間に混じることはなく、各冷媒流路(9)の上下間のみで温度差が生じるだけである。したがって、複数の発熱体(12)をほぼ等しい温度となるように冷却することができる。 In the cooling device (1) described above, the liquid-phase refrigerant is sent into the refrigerant inlet header portion (5) through the refrigerant inlet (7), is divided into a plurality of refrigerant flow paths (9), and each refrigerant flow path (9). It flows through the inside toward the refrigerant outlet header (6). Then, the heating element (12) attached to each heating element mounting portion (4) is cooled by the latent heat of vaporization due to the boiling of the refrigerant flowing in the refrigerant flow path (9). Here, a plurality of refrigerant flow paths (9) are formed so as to be in parallel in a state of being separated from each other via a partition wall (10), flow into the refrigerant inlet header portion (5), and each refrigerant flow. When a plurality of heating elements (12) are cooled by latent heat of evaporation due to boiling of the refrigerant flowing in the passage (9), the vapor-phase refrigerant generated in each refrigerant flow path (9) is the refrigerant flow path (9). ), The liquid-phase refrigerant flows through the lower part of the refrigerant flow path (9), and the refrigerant flowing through the entire refrigerant flow path (9) reaches the refrigerant outlet header portion (6). It does not mix, and only a temperature difference occurs between the upper and lower parts of each refrigerant flow path (9). Therefore, the plurality of heating elements (12) can be cooled so as to have substantially the same temperature.
冷媒出口ヘッダ部(5)に流入した冷媒は、冷媒出口(8)を通って外部に流出し、冷媒中の気相冷媒が適当な凝縮手段により再液化された後、再度用いられる。 The refrigerant that has flowed into the refrigerant outlet header portion (5) flows out through the refrigerant outlet (8), and the vapor-phase refrigerant in the refrigerant is reliquefied by an appropriate condensing means and then used again.
図６はこの発明の冷却装置の他の実施形態を示す。 FIG. 6 shows another embodiment of the cooling device of the present invention.
図６に示す冷却装置(20)の場合、ベース(2)内の上端寄りの左側部分に冷媒入口ヘッダ部(5)が設けられるとともに、ベース(2)内の下端寄りの左側部分に冷媒出口ヘッダ部(6)が設けられている。冷媒入口ヘッダ部(5)は、ベース(2)の左側面の上端寄りの部分から右方に向かって形成されて冷媒入口ヘッダ部(5)内に至る穴状の冷媒入口(7)を介してベース(2)の外部に通じさせられている。冷媒出口ヘッダ部(6)は、ベース(2)の右側面の下端寄りの部分から左方に向かって形成されて冷媒出口ヘッダ部(6)内に至る穴状の冷媒出口(8)を介して外部に通じさせられている。したがって、ベース(2)内に、互いに離隔した状態で並列状となるように形成され、かつ冷媒入口ヘッダ部(5)と冷媒出口ヘッダ部(6)とを通じさせる複数の冷媒流路(9)の直線部(9a)の数は、上述した実施形態の冷却装置(1)の冷媒流路(9)の直線部の数よりも１つ大きくなっている。 In the case of the cooling device (20) shown in FIG. 6, the refrigerant inlet header portion (5) is provided on the left side portion near the upper end in the base (2), and the refrigerant outlet is provided on the left side portion near the lower end in the base (2). A header part (6) is provided. The refrigerant inlet header portion (5) is formed from a portion near the upper end of the left side surface of the base (2) toward the right through a hole-shaped refrigerant inlet (7) extending into the refrigerant inlet header portion (5). It is connected to the outside of the base (2). The refrigerant outlet header portion (6) is formed from a portion near the lower end of the right side surface of the base (2) toward the left through a hole-shaped refrigerant outlet (8) extending into the refrigerant outlet header portion (6). It is communicated to the outside. Therefore, a plurality of refrigerant flow paths (9) are formed in the base (2) so as to be parallel to each other in a state of being separated from each other, and pass through the refrigerant inlet header portion (5) and the refrigerant outlet header portion (6). The number of straight portions (9a) of the above-described embodiment is one larger than the number of straight portions of the refrigerant flow path (9) of the cooling device (1) of the above-described embodiment.
その他の構成は、上述した実施形態の冷却装置(1)と同様である。 Other configurations are the same as those of the cooling device (1) of the above-described embodiment.
上述した２つの実施形態において、ベース内の上端寄りの部分に冷媒入口ヘッダ部が設けられるとともに下端寄りの部分に冷媒出口ヘッダ部が設けられ、冷媒が上から下に流れるようになっているが、冷媒入口ヘッダ部と冷媒出口ヘッダ部とを通じさせる複数の冷媒流路が、互いに離隔した状態で並列状となるように形成されているので、上記とは逆に、ベース内の下端寄りの部分に冷媒入口ヘッダ部が設けられるとともに上端寄りの部分に冷媒出口ヘッダ部が設けられ、冷媒が下から上に流れるようになっていたとしても、複数の発熱体をほぼ等しい温度となるように冷却することが可能になる。 In the two embodiments described above, the refrigerant inlet header portion is provided in the portion near the upper end and the refrigerant outlet header portion is provided in the portion near the lower end in the base so that the refrigerant flows from top to bottom. Since a plurality of refrigerant flow paths through which the refrigerant inlet header portion and the refrigerant outlet header portion are passed are formed so as to be parallel to each other in a state of being separated from each other, contrary to the above, a portion near the lower end in the base. A refrigerant inlet header is provided and a refrigerant outlet header is provided near the upper end to cool a plurality of heating elements so that the temperatures are substantially equal even if the refrigerant flows from the bottom to the top. It becomes possible to do.
この発明による冷却装置は、サーバ、ファイル装置、ネットワーク装置等の情報処理機器に用いられる半導体デバイスを冷却するのに好適に用いられる。 The cooling device according to the present invention is suitably used for cooling semiconductor devices used in information processing devices such as servers, file devices, and network devices.
(1)(20)：冷却装置
(2)：ベース
(3)：発熱体取付面
(4)：発熱体取付部
(5)：冷媒入口ヘッダ部
(6)：冷媒出口ヘッダ部
(9)：冷媒流路
(9a)：直線部
(9b)：連結部
(11)：インナーフィン
(12)：発熱体
(1) (20): Cooling device
(2): Base
(3): Heating element mounting surface
(4): Heating element mounting part
(5): Refrigerant inlet header
(6): Refrigerant outlet header
(9): Refrigerant flow path
(9a): Straight line part
(9b): Connecting part
(11): Inner fin
(12): Heating element
Claims (3)
複数の冷媒流路は冷媒入口ヘッダ部より分流して形成され、
冷媒流路が、上下方向に間隔をおいて設けられて左右方向に延びる直線部および隣り合う直線部どうしを左右交互に連結する連結部からなる蛇行状であり、ベースの各発熱体取付部が、冷媒流路の各直線部と対応する位置に設けられており、発熱体取付部に取り付けられた発熱体が、冷媒流路内を流れる冷媒の蒸発潜熱により冷却されるようになっている冷却装置。 It has a heating element mounting surface that extends in the vertical direction, and also has a base in which a plurality of heating element mounting portions are provided at intervals in the vertical direction on the heating element mounting surface, and a portion of the base near the upper end. A refrigerant inlet header portion is provided in one of the portions near the lower end and a refrigerant outlet header portion is provided in the other, and a plurality of refrigerants are allowed to pass through the refrigerant inlet header portion and the refrigerant outlet header portion in the base. The flow paths are formed so as to be parallel to each other in a state of being separated from each other.
A plurality of refrigerant flow paths are formed by splitting from the refrigerant inlet header portion.
The refrigerant flow path has a serpentine shape consisting of a straight portion that is provided at intervals in the vertical direction and extends in the left-right direction and a connecting portion that connects adjacent straight portions alternately to the left and right, and each heating element mounting portion of the base is formed. , It is provided at a position corresponding to each straight part of the refrigerant flow path, and the heating element attached to the heating element mounting portion is cooled by the latent heat of evaporation of the refrigerant flowing in the refrigerant flow path. apparatus.
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