JP2018063977A - Cooler - Google Patents
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- JP2018063977A JP2018063977A JP2016199896A JP2016199896A JP2018063977A JP 2018063977 A JP2018063977 A JP 2018063977A JP 2016199896 A JP2016199896 A JP 2016199896A JP 2016199896 A JP2016199896 A JP 2016199896A JP 2018063977 A JP2018063977 A JP 2018063977A
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- refrigerant
- heating element
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- element mounting
- cooling device
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- 239000003507 refrigerant Substances 0.000 claims description 122
- 238000010438 heat treatment Methods 0.000 claims description 48
- 238000001816 cooling Methods 0.000 claims description 32
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 230000009972 noncorrosive effect Effects 0.000 claims description 3
- 239000002826 coolant Substances 0.000 abstract description 9
- 238000005485 electric heating Methods 0.000 abstract 4
- 230000008878 coupling Effects 0.000 abstract 2
- 238000010168 coupling process Methods 0.000 abstract 2
- 238000005859 coupling reaction Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 description 8
- 238000005219 brazing Methods 0.000 description 5
- 239000012071 phase Substances 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 2
- 230000010365 information processing Effects 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000000017 hydrogel Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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Abstract
Description
この発明は、たとえば半導体デバイスなどの電子部品からなる発熱体を冷却する冷却装置に関する。 The present invention relates to a cooling device that cools a heating element made of an electronic component such as a semiconductor device.
この明細書および特許請求の範囲において、図２および図６の上下、左右を上下、左右というもとのとする。 In this specification and claims, the top and bottom, left and right in FIGS. 2 and 6 are referred to as top and bottom and left and right.
たとえば、サーバ、ファイル装置、ネットワーク装置等の情報処理機器に用いられる半導体デバイスにおいては、近年、高集積化、処理能力の高速化、高機能化によって発熱量が極めて多くなっている。 For example, in semiconductor devices used for information processing equipment such as servers, file devices, and network devices, in recent years, the amount of heat generated has been extremely large due to high integration, high processing speed, and high functionality.
サーバにおいて、種々の半導体デバイスを冷却する冷却装置として、比較的発熱量の大きな半導体デバイスからの発熱を外部に輸送する複数のサーモサイフォンと、比較的発熱量の小さな半導体デバイスからの発熱をサーモサイフォンへ輸送する複数のヒートパイプと、複数のサーモサイフォンと熱的に接続され、半導体デバイスからの熱を外部に輸送するサーマルハイウェイと、外部に輸送された熱を筐体の外部へ輸送する凝縮器とから構成された冷却装置が知られている(特許文献１参照)。 In a server, as a cooling device for cooling various semiconductor devices, a plurality of thermosiphons for transporting heat generated from a semiconductor device having a relatively large amount of heat generation to the outside, and a heat siphon for generating heat from a semiconductor device having a relatively small amount of heat generation Multiple heat pipes that are transported to and from a thermal highway that is thermally connected to multiple thermosiphons and that transports heat from the semiconductor device to the outside, and a condenser that transports the heat transported to the outside and outside the housing Is known (see Patent Document 1).
しかしながら、特許文献１記載の冷却装置においては、複数のサーモサイフォンやヒートパイプを必要とするので、コストが高くなるとともに、製造が困難であるという問題がある。
However, since the cooling device described in
この発明の目的は、上記問題を解決し、特許文献１記載の冷却装置に比較してコストの安い冷却装置を提供することにある。
An object of the present invention is to solve the above-described problems and provide a cooling device that is less expensive than the cooling device described in
本発明は、上記目的を達成するために以下の態様からなる。 In order to achieve the above object, the present invention comprises the following aspects.
1)上下方向に広がった発熱体取付面を有するとともに、当該発熱体取付面に複数の発熱体取付部が上下方向に間隔をおいて設けられているベースを備えており、ベース内の上端寄りの部分および下端寄りの部分のうちいずれか一方に冷媒入口ヘッダ部が設けられるとともに、同他方に冷媒出口ヘッダ部が設けられ、ベース内に、冷媒入口ヘッダ部と冷媒出口ヘッダ部とを通じさせる複数の冷媒流路が、互いに離隔した状態で並列状となるように形成され、冷媒流路が、上下方向に間隔をおいて設けられて左右方向に延びる直線部および隣り合う直線部どうしを左右交互に連結する連結部からなる蛇行状であり、ベースの各発熱体取付部が、冷媒流路の各直線部と対応する位置に設けられており、発熱体取付部に取り付けられた発熱体が、冷媒流路内を流れる冷媒の蒸発潜熱により冷却されるようになっている冷却装置。 1) A heating element mounting surface extending in the vertical direction is provided, and a base having a plurality of heating element mounting portions provided at intervals in the vertical direction is provided on the heating element mounting surface. A refrigerant inlet header portion is provided in one of the portion near the lower end and a portion near the lower end, a refrigerant outlet header portion is provided in the other, and a plurality of refrigerant inlet header portions and refrigerant outlet header portions are passed through the base. The refrigerant flow paths are formed in parallel with each other in a state of being separated from each other, and the refrigerant flow paths are provided with an interval in the vertical direction and extending in the left-right direction and adjacent straight portions alternately in the left-right direction. Each heating element mounting portion of the base is provided at a position corresponding to each linear portion of the refrigerant flow path, and the heating element attached to the heating element mounting portion is Refrigerant And which cooling device adapted to be cooled by evaporation latent heat of refrigerant flowing through the road.
2)ベースの冷媒流路の直線部に、インナーフィンが設けられている上記1)記載の冷却装置。 2) The cooling device according to 1) above, wherein an inner fin is provided in a straight portion of the base refrigerant flow path.
3)ベースがアルミニウム製であり、冷媒として、アルミニウムに対して非腐食性を有する非水系冷媒が用いられる上記1)または2)記載の冷却装置。 3) The cooling apparatus according to 1) or 2), wherein the base is made of aluminum, and a non-aqueous refrigerant that is non-corrosive to aluminum is used as the refrigerant.
上記1)〜3)の冷却装置によれば、上下方向に広がった発熱体取付面を有するとともに、当該発熱体取付面に複数の発熱体取付部が上下方向に間隔をおいて設けられているベースを備えており、ベース内の上端寄りの部分および下端寄りの部分のうちいずれか一方に冷媒入口ヘッダ部が設けられるとともに、同他方に冷媒出口ヘッダ部が設けられ、ベース内に、冷媒入口ヘッダ部と冷媒出口ヘッダ部とを通じさせる複数の冷媒流路が、互いに離隔した状態で並列状となるように形成され、冷媒流路が、上下方向に間隔をおいて設けられて左右方向に延びる直線部および隣り合う直線部どうしを左右交互に連結する連結部からなる蛇行状であり、ベースの各発熱体取付部が、冷媒流路の各直線部と対応する位置に設けられており、発熱体取付部に取り付けられた発熱体が、冷媒流路内を流れる冷媒の蒸発潜熱により冷却されるようになっているので、ベースの発熱体取付面の発熱体取付部に取り付けられた複数の発熱体をほぼ等しい温度となるように冷却することができる。すなわち、複数の冷媒流路が互いに離隔した状態で並列状となるように形成されており、冷媒入口ヘッダ部に流入し、各冷媒流路内を流れる冷媒の沸騰による蒸発潜熱により複数の発熱体を冷却するようになっていると、各冷媒流路で発生した気相冷媒は冷媒流路の上部を流れるとともに液相冷媒は冷媒流路の下部を流れることになり、しかも全冷媒流路を流れる冷媒は、冷媒出口ヘッダ部に至るまでの間に混じることはなく、各冷媒流路の上下間のみで温度差が生じるだけである。したがって、複数の発熱体をほぼ等しい温度となるように冷却することができる。さらに、複数のサーモサイフォンやヒートパイプが用いられている特許文献１記載の冷却装置に比較してコストが安くなる。
According to the cooling devices of 1) to 3) above, the heating device mounting surface is widened in the vertical direction, and a plurality of heating device mounting portions are provided on the heating device mounting surface at intervals in the vertical direction. A base is provided, a refrigerant inlet header portion is provided in one of the portion near the upper end and the portion near the lower end in the base, and a refrigerant outlet header portion is provided in the other, and the refrigerant inlet is provided in the base. A plurality of refrigerant flow paths that pass through the header part and the refrigerant outlet header part are formed in parallel with being separated from each other, and the refrigerant flow paths are provided at intervals in the vertical direction and extend in the horizontal direction. It has a meandering shape consisting of connecting portions that connect the straight portions and adjacent straight portions alternately to the left and right, and each heating element mounting portion of the base is provided at a position corresponding to each straight portion of the refrigerant flow path. Mount on the body mounting part Since the attached heating element is cooled by the latent heat of vaporization of the refrigerant flowing in the refrigerant flow path, a plurality of heating elements attached to the heating element mounting portion of the heating element mounting surface of the base are almost It can be cooled to achieve an equal temperature. In other words, the plurality of refrigerant flow paths are formed in parallel with being separated from each other, and flow into the refrigerant inlet header portion, and the plurality of heating elements by latent heat of vaporization caused by boiling of the refrigerant flowing in each refrigerant flow path When the refrigerant is cooled, the gas-phase refrigerant generated in each refrigerant channel flows through the upper part of the refrigerant channel and the liquid-phase refrigerant flows through the lower part of the refrigerant channel. The flowing refrigerant is not mixed before reaching the refrigerant outlet header part, and only a temperature difference is generated between the upper and lower sides of each refrigerant flow path. Therefore, the plurality of heating elements can be cooled so as to have substantially the same temperature. Furthermore, the cost is lower than the cooling device described in
上記2)の冷却装置によれば、ベースの発熱体取付部に取り付けられた発熱体の冷却効率が向上する。 According to the cooling device of 2) above, the cooling efficiency of the heating element mounted on the heating element mounting portion of the base is improved.
上記3)の冷却装置によれば、ベースの軽量化を図った上で、発熱体から冷媒流路内を流れる冷媒への熱伝導性を向上させることができ、しかもベースの腐食が防止される。 According to the cooling device of the above 3), it is possible to improve the thermal conductivity from the heating element to the refrigerant flowing in the refrigerant flow path while reducing the weight of the base, and the corrosion of the base is prevented. .
以下、この発明の実施形態を、図面を参照して説明する。 Embodiments of the present invention will be described below with reference to the drawings.
この明細書において、「アルミニウム」という用語には、純アルミニウムの他にアルミニウム合金を含むものとする。 In this specification, the term “aluminum” includes aluminum alloys in addition to pure aluminum.
また、以下の説明において、上下方向および左右方向と直交する方向を前後方向とし、図３および図５の上側(図４の左側)を前、これと反対側を後というものとする。 In the following description, the vertical direction and the direction perpendicular to the left-right direction are the front-rear direction, the upper side (left side in FIG. 4) in FIGS. 3 and 5 is the front, and the opposite side is the rear.
図１および図２は冷却装置の全体構成を示し、図３〜図５はその要部の構成を示す。 1 and 2 show the overall configuration of the cooling device, and FIGS. 3 to 5 show the configuration of the main part thereof.
図１および図２において、冷却装置(1)は、扁平な縦長直方体状のアルミニウム製ベース(2)を備えている。ベース(2)における上下方向および左右方向に広がりかつ互いに反対側を向いた前後両側面のうち少なくとも一面、ここでは前面が発熱体取付面(3)となっており、発熱体取付面(3)に複数の発熱体取付部(4)が上下方向に間隔をおいて設けられている。 1 and 2, the cooling device (1) includes a flat, vertically long rectangular aluminum base (2). At least one of the front and rear side surfaces extending in the vertical and horizontal directions and facing opposite sides of the base (2), here the front surface is the heating element mounting surface (3), and the heating element mounting surface (3) A plurality of heating element mounting portions (4) are provided at intervals in the vertical direction.
ベース(2)内の上端寄りの左側部分に冷媒入口ヘッダ部(5)が設けられるとともに、ベース(2)内の下端寄りの右側部分に冷媒出口ヘッダ部(6)が設けられている。冷媒入口ヘッダ部(5)は、ベース(2)の左側面の上端寄りの部分から右方に向かって形成されて冷媒入口ヘッダ部(5)内に至る穴状の冷媒入口(7)を介してベース(2)の外部に通じさせられている。冷媒出口ヘッダ部(6)は、ベース(2)の右側面の下端寄りの部分から左方に向かって形成されて冷媒出口ヘッダ部(6)内に至る穴状の冷媒出口(8)を介して外部に通じさせられている。 A refrigerant inlet header (5) is provided on the left side near the upper end in the base (2), and a refrigerant outlet header (6) is provided on the right side near the lower end in the base (2). The refrigerant inlet header (5) is formed through a hole-like refrigerant inlet (7) formed from the portion near the upper end of the left side surface of the base (2) toward the right to reach into the refrigerant inlet header (5). To the outside of the base (2). The refrigerant outlet header portion (6) is formed through a hole-shaped refrigerant outlet (8) formed from the portion near the lower end of the right side surface of the base (2) toward the left and into the refrigerant outlet header portion (6). To the outside.
ベース(2)内に、冷媒入口ヘッダ部(5)と冷媒出口ヘッダ部(6)とを通じさせる複数の冷媒流路(9)が、仕切壁(10)を介して互いに離隔した状態で並列状となるように形成されている。各冷媒流路(9)は、上下方向に間隔をおいて設けられて左右方向に延びる直線部(9a)、および隣り合う直線部(9a)どうしを左右交互に連結する連結部(9b)からなる蛇行状である。各冷媒流路(9)の直線部(9a)内には、左右方向に延びるインナーフィン(11)が設けられている。 In the base (2), a plurality of refrigerant flow paths (9) passing through the refrigerant inlet header portion (5) and the refrigerant outlet header portion (6) are arranged in parallel with being separated from each other via the partition wall (10). It is formed to become. Each refrigerant flow path (9) includes a linear portion (9a) provided in the vertical direction and extending in the left-right direction, and a connecting portion (9b) that alternately connects adjacent linear portions (9a) to the left and right. It is a meandering shape. Inner fins (11) extending in the left-right direction are provided in the straight line portion (9a) of each refrigerant channel (9).
ベース(2)の各発熱体取付部(4)は、冷媒流路(9)の各直線部(9a)と対応する位置に設けられている。そして、半導体デバイスなどからなる複数の発熱体(12)が、ベース(2)の発熱体取付面(3)の各発熱体取付部(4)に、左右方向に間隔をおいて取り付けられる。図１および図２に示す例では、各発熱体取付部(4)に、複数の発熱体(12)が１列となるように取り付けられているが、これに限定されるものではなく、各発熱体取付部(4)に、上下方向に間隔をおいて並んだ２以上の発熱体(12)からなる組が、左右方向に間隔をおいて複数取り付けられる場合もあり、あるいは１つの発熱体(12)と、上下方向に間隔をおいて並んだ２以上の発熱体(12)からなる組とが混ざり合うように左右方向に間隔をおいて取り付けられる場合もある。 Each heating element mounting portion (4) of the base (2) is provided at a position corresponding to each linear portion (9a) of the refrigerant flow path (9). Then, a plurality of heating elements (12) made of a semiconductor device or the like are attached to each heating element attachment portion (4) of the heating element attachment surface (3) of the base (2) at intervals in the left-right direction. In the example shown in FIG. 1 and FIG. 2, a plurality of heating elements (12) are attached to each heating element mounting portion (4) so as to form a single row. There may be a case where a plurality of sets of two or more heating elements (12) arranged at intervals in the vertical direction are attached to the heating element mounting portion (4) at intervals in the left-right direction, or one heating element. In some cases, (12) and a pair of two or more heating elements (12) arranged at intervals in the vertical direction are mixed at intervals in the left-right direction so as to be mixed.
冷却装置のベース(2)は、冷媒入口ヘッダ部用凹所(14)、冷媒出口ヘッダ部用凹所(15)、複数の冷媒流路用凹所(16)、冷媒入口(7)および冷媒出口(8)が形成されるとともに、冷媒流路用凹所(16)の直線部(9a)となる部分の底面にインナーフィン(11)が立ち上がり状に一体に設けられている第１アルミニウム板(13)と、冷媒入口ヘッダ部用凹所(14)、冷媒出口ヘッダ部用凹所(15)および複数の冷媒流路用凹所(16)の開口を塞ぐように、両面にろう材層を有するアルミニウムブレージングシート(17)を利用して第１アルミニウム板(13)にろう材により接合されて第１アルミニウム板(13)の全体を覆う第２アルミニウム板(18)とからなる。なお、インナーフィン(11)の立ち上がり高さは、冷媒流路用凹所(16)の深さ、すなわち隣り合う冷媒流路用凹所(16)間の仕切壁(10)の高さと同一であり、インナーフィン(11)の突出端は、アルミニウムブレージングシート(17)を利用して第２アルミニウム板(18)にろう材により接合されている。そして、第２アルミニウム板(18)の外面がベース(2)の発熱体取付面(3)となっている。 The base (2) of the cooling device includes a recess for a refrigerant inlet header (14), a recess for a refrigerant outlet header (15), a plurality of recesses for a refrigerant flow path (16), a refrigerant inlet (7), and a refrigerant A first aluminum plate in which an outlet (8) is formed and an inner fin (11) is integrally provided in a rising shape on the bottom surface of the portion that becomes the straight portion (9a) of the recess (16) for the refrigerant flow path (13) and a brazing filler metal layer on both sides so as to block the openings of the refrigerant inlet header recess (14), the refrigerant outlet header recess (15), and the plurality of refrigerant flow recesses (16). A second aluminum plate (18) covering the entire first aluminum plate (13) by joining the first aluminum plate (13) with a brazing material using an aluminum brazing sheet (17) having The rising height of the inner fin (11) is the same as the depth of the coolant channel recess (16), that is, the height of the partition wall (10) between the adjacent coolant channel recesses (16). The protruding end of the inner fin (11) is joined to the second aluminum plate (18) with a brazing material using an aluminum brazing sheet (17). The outer surface of the second aluminum plate (18) is a heating element mounting surface (3) of the base (2).
冷却装置(1)においては、アルミニウムに対して非腐食性を有しており、かつ発熱体取付部(4)に取り付けられた発熱体(12)から発せられる熱により蒸発するとともに、冷媒入口ヘッダ部(5)から冷媒出口ヘッダ部(6)に至るまでの間に完全に気相となることのない使用温度範囲が２０〜９０℃である非水系冷媒、たとえばハイドロフルオロカーボン、ハイドロフルオロオレフィン、ハイドロカーボン、ハイドロフルオロエーテルなどが用いられる。 The cooling device (1) is non-corrosive to aluminum and evaporates by heat generated from the heating element (12) attached to the heating element mounting portion (4), and is also used as a refrigerant inlet header. A non-aqueous refrigerant having a use temperature range of 20 to 90 ° C., such as hydrofluorocarbons, hydrofluoroolefins, hydrogels, which does not completely become a gas phase between the part (5) and the refrigerant outlet header part (6) Carbon, hydrofluoroether, etc. are used.
上述した冷却装置(1)において、液相冷媒が冷媒入口(7)を通して冷媒入口ヘッダ部(5)内に送り込まれ、複数の冷媒流路(9)に分流して各冷媒流路(9)内を冷媒出口ヘッダ部(6)に向かって流れる。そして、各発熱体取付部(4)に取り付けられた発熱体(12)は、冷媒流路(9)内を流れる冷媒の沸騰による蒸発潜熱により冷却される。ここで、複数の冷媒流路(9)が仕切壁(10)を介して互いに離隔した状態で並列状となるように形成されており、冷媒入口ヘッダ部(5)に流入し、各冷媒流路(9)内を流れる冷媒の沸騰による蒸発潜熱により複数の発熱体(12)を冷却するようになっていると、各冷媒流路(9)で発生した気相冷媒は冷媒流路(9)の上部を流れるとともに液相冷媒は冷媒流路(9)の下部を流れることになり、しかも全冷媒流路(9)を流れる冷媒は、冷媒出口ヘッダ部(6)に至るまでの間に混じることはなく、各冷媒流路(9)の上下間のみで温度差が生じるだけである。したがって、複数の発熱体(12)をほぼ等しい温度となるように冷却することができる。 In the cooling device (1) described above, the liquid-phase refrigerant is fed into the refrigerant inlet header portion (5) through the refrigerant inlet (7), and is divided into a plurality of refrigerant flow paths (9) to each refrigerant flow path (9). It flows toward the refrigerant outlet header (6). And the heat generating body (12) attached to each heat generating body attaching part (4) is cooled by the evaporative latent heat due to the boiling of the refrigerant flowing in the refrigerant flow path (9). Here, the plurality of refrigerant flow paths (9) are formed in parallel with being separated from each other via the partition wall (10), and flow into the refrigerant inlet header (5), When the plurality of heating elements (12) are cooled by evaporation latent heat due to boiling of the refrigerant flowing in the passage (9), the gas-phase refrigerant generated in each refrigerant passage (9) ) And the liquid refrigerant flows through the lower part of the refrigerant flow path (9), and the refrigerant flowing through the entire refrigerant flow path (9) passes through the refrigerant outlet header (6). There is no mixing, and only a temperature difference occurs between the upper and lower sides of each refrigerant channel (9). Therefore, the plurality of heating elements (12) can be cooled so as to have substantially the same temperature.
冷媒出口ヘッダ部(5)に流入した冷媒は、冷媒出口(8)を通って外部に流出し、冷媒中の気相冷媒が適当な凝縮手段により再液化された後、再度用いられる。 The refrigerant flowing into the refrigerant outlet header section (5) flows out through the refrigerant outlet (8), and is used again after the gas-phase refrigerant in the refrigerant is reliquefied by an appropriate condensing means.
図６はこの発明の冷却装置の他の実施形態を示す。 FIG. 6 shows another embodiment of the cooling device of the present invention.
図６に示す冷却装置(20)の場合、ベース(2)内の上端寄りの左側部分に冷媒入口ヘッダ部(5)が設けられるとともに、ベース(2)内の下端寄りの左側部分に冷媒出口ヘッダ部(6)が設けられている。冷媒入口ヘッダ部(5)は、ベース(2)の左側面の上端寄りの部分から右方に向かって形成されて冷媒入口ヘッダ部(5)内に至る穴状の冷媒入口(7)を介してベース(2)の外部に通じさせられている。冷媒出口ヘッダ部(6)は、ベース(2)の右側面の下端寄りの部分から左方に向かって形成されて冷媒出口ヘッダ部(6)内に至る穴状の冷媒出口(8)を介して外部に通じさせられている。したがって、ベース(2)内に、互いに離隔した状態で並列状となるように形成され、かつ冷媒入口ヘッダ部(5)と冷媒出口ヘッダ部(6)とを通じさせる複数の冷媒流路(9)の直線部(9a)の数は、上述した実施形態の冷却装置(1)の冷媒流路(9)の直線部の数よりも１つ大きくなっている。 In the cooling device (20) shown in FIG. 6, a refrigerant inlet header (5) is provided on the left side near the upper end in the base (2), and a refrigerant outlet is located on the left side near the lower end in the base (2). A header part (6) is provided. The refrigerant inlet header (5) is formed through a hole-like refrigerant inlet (7) formed from the portion near the upper end of the left side surface of the base (2) toward the right to reach into the refrigerant inlet header (5). To the outside of the base (2). The refrigerant outlet header portion (6) is formed through a hole-shaped refrigerant outlet (8) formed from the portion near the lower end of the right side surface of the base (2) toward the left and into the refrigerant outlet header portion (6). To the outside. Therefore, a plurality of refrigerant flow paths (9) formed in the base (2) so as to be parallel to each other in a state of being separated from each other and through the refrigerant inlet header portion (5) and the refrigerant outlet header portion (6). The number of straight portions (9a) is one larger than the number of straight portions of the refrigerant flow path (9) of the cooling device (1) of the above-described embodiment.
その他の構成は、上述した実施形態の冷却装置(1)と同様である。 Other configurations are the same as those of the cooling device (1) of the above-described embodiment.
上述した２つの実施形態において、ベース内の上端寄りの部分に冷媒入口ヘッダ部が設けられるとともに下端寄りの部分に冷媒出口ヘッダ部が設けられ、冷媒が上から下に流れるようになっているが、冷媒入口ヘッダ部と冷媒出口ヘッダ部とを通じさせる複数の冷媒流路が、互いに離隔した状態で並列状となるように形成されているので、上記とは逆に、ベース内の下端寄りの部分に冷媒入口ヘッダ部が設けられるとともに上端寄りの部分に冷媒出口ヘッダ部が設けられ、冷媒が下から上に流れるようになっていたとしても、複数の発熱体をほぼ等しい温度となるように冷却することが可能になる。 In the two embodiments described above, the refrigerant inlet header portion is provided in the portion near the upper end in the base and the refrigerant outlet header portion is provided in the portion near the lower end so that the refrigerant flows from top to bottom. Since the plurality of refrigerant flow paths through the refrigerant inlet header portion and the refrigerant outlet header portion are formed in parallel with being separated from each other, the portion near the lower end in the base, contrary to the above Even if the refrigerant inlet header is provided at the top and the refrigerant outlet header is provided near the upper end so that the refrigerant flows from the bottom to the top, the plurality of heating elements can be cooled to substantially the same temperature. It becomes possible to do.
この発明による冷却装置は、サーバ、ファイル装置、ネットワーク装置等の情報処理機器に用いられる半導体デバイスを冷却するのに好適に用いられる。 The cooling device according to the present invention is suitably used for cooling semiconductor devices used in information processing equipment such as servers, file devices, and network devices.
(1)(20)：冷却装置
(2)：ベース
(3)：発熱体取付面
(4)：発熱体取付部
(5)：冷媒入口ヘッダ部
(6)：冷媒出口ヘッダ部
(9)：冷媒流路
(9a)：直線部
(9b)：連結部
(11)：インナーフィン
(12)：発熱体
(1) (20): Cooling device
(2): Base
(3): Heating element mounting surface
(4): Heating element mounting part
(5): Refrigerant inlet header
(6): Refrigerant outlet header
(9): Refrigerant flow path
(9a): Straight section
(9b): Connection part
(11): Inner fin
(12): Heating element
Claims (3)
The cooling device according to claim 1 or 2, wherein the base is made of aluminum, and a non-aqueous refrigerant that is non-corrosive to aluminum is used as the refrigerant.
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|---|---|---|---|---|
| JP2001526841A (en) * | 1997-05-30 | 2001-12-18 | モトローラ・インコーポレイテッド | Electronic component cooling device |
| JP2003318341A (en) * | 2002-04-25 | 2003-11-07 | Matsushita Electric Ind Co Ltd | Cooling device for semiconductor element |
| US20060126294A1 (en) * | 2004-12-10 | 2006-06-15 | Barrett Faneuf | Systems to cool multiple electrical components |
| WO2010096355A2 (en) * | 2009-02-17 | 2010-08-26 | Parker Hannifin Corporation | Cooling system utilizing multiple cold plates |
| WO2013140761A1 (en) * | 2012-03-22 | 2013-09-26 | 日本電気株式会社 | Cooling structure for electronic substrate, and electronic device using same |
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| JP2001526841A (en) * | 1997-05-30 | 2001-12-18 | モトローラ・インコーポレイテッド | Electronic component cooling device |
| JP2003318341A (en) * | 2002-04-25 | 2003-11-07 | Matsushita Electric Ind Co Ltd | Cooling device for semiconductor element |
| US20060126294A1 (en) * | 2004-12-10 | 2006-06-15 | Barrett Faneuf | Systems to cool multiple electrical components |
| WO2010096355A2 (en) * | 2009-02-17 | 2010-08-26 | Parker Hannifin Corporation | Cooling system utilizing multiple cold plates |
| WO2013140761A1 (en) * | 2012-03-22 | 2013-09-26 | 日本電気株式会社 | Cooling structure for electronic substrate, and electronic device using same |
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