JP2019147203A - Frame for package substrate and method for grinding package substrate - Google Patents

Abstract

To provide a frame for a package substrate capable of reducing the cost of grinding processing by performing grinding processing of a package substrate without executing a large scale of alteration of a grinding device.SOLUTION: A frame for a package substrate 2 to be used during grinding a mold resin by holding a package substrate in which a region is covered with the mold resin except an end material region of the surface of the substrate including the end material regions at a peripheral part by suction by a chuck table includes: a disk-shaped frame body 4 having a diameter equal to or larger than the diameter of the suction surface of the chuck table provided with a circular suction surface for sucking a workpiece; opening parts 4d for exposing the mold resin of the package substrate formed on the frame body; and eaves parts 6 provided along the outer periphery of the opening parts to cover the end material regions.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a package substrate frame used when grinding a package substrate, and a package substrate grinding method using the package substrate frame.

  A device chip obtained by dividing a semiconductor wafer is mounted on a substrate, and the device chip is covered with a sealing material (mold resin) made of a resin to obtain a package substrate. Package devices manufactured from this package substrate are built in various electronic devices, and in recent years, with the downsizing and thinning of electronic devices, the package substrate is also required to be downsized and thinned. Therefore, a method of thinning the package substrate by grinding the mold resin of the package substrate with a grinding wheel is used.

  As a grinding apparatus for performing the grinding process, a grinding apparatus for grinding a disk-shaped workpiece such as a semiconductor wafer is widely used. By applying this grinding apparatus to the grinding of a package substrate, a new one can be obtained. The introduction of a grinding device is not necessary, and costs can be reduced. However, such a grinding apparatus is configured to grind a disk-shaped workpiece, and in order to use it for grinding a package substrate, for example, a chuck table or workpiece to hold the workpiece It is necessary to change the configuration of a transport unit for transporting an object in accordance with the shape of the package substrate.

  Patent Document 1 discloses a fixing jig for holding a package substrate when grinding the package substrate. In order to fix a package substrate in which a plurality of device chips are formed on a rectangular substrate, the fixing jig is arranged in a rectangular shape having a plurality of concave portions arranged corresponding to the positions of the device chips and connected to suction ports. A substrate is provided.

Japanese Patent Laying-Open No. 2015-85414

  When grinding a rectangular package substrate in plan view, for example, using a grinding device that is supposed to grind a disk-shaped workpiece such as a semiconductor wafer, a grinding device such as replacing the chuck table with the above-mentioned fixing jig Therefore, the cost of grinding processing increases.

  SUMMARY OF THE INVENTION The present invention has been made in view of such a problem, and a frame for a package substrate that can reduce the cost of the grinding process by performing the grinding process of the package substrate without making a major modification to the grinding apparatus. It is another object of the present invention to provide a grinding method for a package substrate using the package substrate frame.

  According to the present invention, when the mold substrate is ground by holding the package substrate in which the region excluding the end material region on the surface of the substrate having the end material region on the outer peripheral portion is covered with the mold resin by the chuck table. A frame for a package substrate for use in a disk-shaped frame main body having a diameter equal to or larger than the diameter of the suction surface of the chuck table provided with a circular suction surface for sucking a workpiece, and formed on the frame main body. There is provided a package substrate frame comprising: an opening for exposing the mold resin of the package substrate; and a flange provided along the outer periphery of the opening and covering the end material region.

  The package substrate frame according to the present invention may include a mark portion formed on the frame body and indicating the direction of the frame body.

  Further, according to the present invention, there is provided a grinding method for a package substrate using the above-described package substrate frame, wherein the mold resin is exposed to the surface side of the frame body from the opening, and the end material region is A frame unit forming step of positioning the package substrate so as to be covered by a flange and fixing the package substrate to the frame body by applying an adhesive tape to the back side of the frame body to form a frame unit; A grinding step of holding the frame unit by a chuck table and grinding the mold resin exposed to the surface side of the frame body from the opening by a grinding unit.

  A frame for a package substrate according to the present invention is formed in a disc shape having a diameter equal to or larger than a suction surface of a chuck table provided in a grinding apparatus, and accommodates a package substrate having an arbitrary shape and size. It can be held on the chuck table. As a result, it is possible to perform processing such as grinding a rectangular package substrate in a plan view using a grinding device that assumes grinding of a disk-shaped workpiece, and without making extensive modifications to the grinding device. The package substrate can be ground.

1A is a perspective view illustrating a configuration example of a package substrate frame, and FIG. 1B is a cross-sectional view illustrating a configuration example of a package substrate frame. 2A is a perspective view showing a state where the package substrate frame is mounted on the package substrate, and FIG. 2B is a cross-sectional view showing a state where the package substrate frame is mounted on the package substrate. is there. 3A is a perspective view showing the frame unit in a state where the package substrate frame is mounted on the package substrate, and FIG. 3B is a perspective view of the frame unit in the state where the package substrate frame is mounted on the package substrate. It is sectional drawing shown. It is a perspective view which shows the structural example of a grinding apparatus. It is a front view which shows a mode that a frame unit is conveyed by the conveyance unit. It is sectional drawing which shows a mode that mold resin is ground by the grinding unit. FIG. 7A is a perspective view showing a modification of the package substrate frame, and FIG. 7B is a cross-sectional view showing a modification of the package substrate frame. It is sectional drawing which shows the modification of a frame unit. It is sectional drawing which shows the state with which the frame unit was hold | maintained by the chuck table which has a convex part.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1A is a perspective view illustrating a configuration example of the package substrate frame 2 according to the present embodiment, and FIG. 1B is a cross-sectional view illustrating a configuration example of the package substrate frame 2. The package substrate frame 2 has a function of holding the package substrate on the chuck table by holding the package substrate together with the package substrate on the holding surface of the chuck table included in the grinding device when grinding the package substrate.

  In the following, as an example, a grinding device for grinding a disk-shaped workpiece such as a semiconductor wafer is provided, and a chuck table having a circular holding surface corresponding to the shape of the workpiece has a rectangular shape in plan view. A mode for holding the package substrate will be described. By using the package substrate frame 2 according to the present embodiment, a grinding device configured to grind a disk-shaped workpiece may be used for grinding a rectangular package substrate in plan view. It becomes possible.

  The package substrate frame 2 is formed of resin, metal, or the like, and includes a disk-shaped frame body 4 having a front surface 4a and a back surface 4b. On the back surface 4b side of the frame body 4, a rectangular recess 4c is formed in plan view. In a region located on the upper side of the recess 4c, an opening 4d that reaches the surface 4a of the frame body 4 and is rectangular in plan view is provided. The opening 4d is formed so that the width (the length in the Y-axis direction) and the depth (the length in the X-axis direction) are smaller than the recess 4c.

  Further, on the upper side of the concave portion 4c, a hook-shaped flange portion 6 protruding from the main body portion 4 toward the opening portion 4d is formed along the outer periphery of the opening portion 4d. In addition, a space 10 is formed inside the recess 4 c and is located below the flange 6 and surrounded by the frame body 4 and the flange 6.

  As will be described later, a part of the package substrate to be ground is accommodated in the recess 4c. In FIG. 1B, the frame body 4 has two recesses 4c and two openings 4d. The number of the recesses 4c and the openings 4d depends on the size of the frame body 4 and the size of the package substrate. Can be increased or decreased accordingly.

  When grinding the package substrate, the package substrate frame 2 is mounted on the package substrate. 2A is a perspective view showing a state in which the package substrate frame 2 is attached to the package substrate 11, and FIG. 2B is a state in which the package substrate frame 2 is attached to the package substrate 11. FIG. It is sectional drawing shown.

  The package substrate 11 includes a plate-like substrate 13 formed in a rectangular shape in plan view, and a plurality of device chips (not shown) mounted on the surface 13 a side of the substrate 13. The plurality of device chips mounted on the substrate 13 are made of resin and covered with a mold resin 15 that seals the plurality of device chips. Moreover, the board | substrate 13 has the end material area | region 17 in which the mold resin 15 is not formed in the outer peripheral part.

  The recess 4c of the frame body 4 is formed so that the thickness (the length in the Z-axis direction) substantially matches the thickness of the substrate 13 of the package substrate 11. Further, the recess 4 c is formed so that its width and depth are larger than those of the substrate 13.

  The opening 4d is formed so that the width is larger than the width of the mold resin 15 and smaller than the width of the substrate 13, and the depth is larger than the depth of the mold resin 15 and smaller than the depth of the substrate 13. The Furthermore, the opening 4 d is formed so that its thickness is smaller than the thickness of the mold resin 15.

  When grinding the package substrate 11, first, the package substrate frame 2 is mounted on the package substrate 11 to form a frame unit (frame unit forming step). Specifically, the front surface 13a side of the substrate 13 is inserted into the recess 4c from the back surface 4b side of the frame body 4, and the substrate 13 is accommodated in the recess 4c.

  In this state, the adhesive tape 12 formed of epoxy resin or the like is attached to the back surface 4b of the frame body 4 and the back surface 13b of the substrate 13. Thereby, the package substrate frame 2 and the package substrate 11 are fixed, and a frame unit is formed.

  FIG. 3A is a perspective view showing the frame unit 19 in a state where the package substrate frame 2 is mounted on the package substrate 11, and FIG. 3B is a cross-sectional view showing the frame unit 19. When the substrate 13 of the package substrate 11 is accommodated in the recess 4c (see FIG. 1B), a part of the upper side of the mold resin 15 passes from the opening 4d (see FIG. 1B) to the surface 4a of the frame body 4. It is exposed to the side and protrudes. Further, at least a part of the end material region 17 of the substrate 13 is accommodated in the space 10 so as to be covered with the flange portion 6, and is fixed in a state where the upper surface thereof is in contact with the flange portion 6.

  As shown in FIG. 3 (B), the adhesive tape 12 only needs to be affixed to the back surface 4b of the frame body 4 so as to cover at least the recess 4c. Good. By sticking the adhesive tape 12 only to a part of the back surface 4b of the frame body 4, the adhesive tape 12 can be saved.

  Although the example in which the package substrate 11 is rectangular in plan view has been described above, the present invention is not limited to this, and the package substrate 11 having an arbitrary size and shape can be used. Further, the size and shape of the recess 4 c and the opening 4 d can be changed as appropriate according to the package substrate 11. Therefore, the package substrate frame 2 can accommodate a package substrate 11 having an arbitrary shape and size.

  Further, as shown in FIGS. 1A, 2A, and 3A, the frame body 4 may be formed with a mark portion 4e indicating the direction of the frame body 4. By detecting the mark portion 4e with a sensor or the like, the orientation of the package substrate 11 on which the package substrate frame 2 is mounted can be grasped. The mark portion 4e can be used, for example, for adjusting the orientation of the frame unit 19 when the frame unit 19 is held by a chuck table of the grinding apparatus or when the frame unit 19 is accommodated in a cassette of the grinding apparatus.

  1A, 2A, and 3A show examples in which the mark portion 4e is a notch formed by cutting out the outer peripheral portion of the frame body 4, the mark portion 4e. There is no limitation on the forming method. For example, an orientation flat may be formed on the outer peripheral part of the frame body 4 as the mark part 4e, or a part of the frame body 4 may be colored and used as the mark part 4e. By providing notches and orientation flats on the outer periphery of the frame body 4, the frame unit 19 can be handled in the same manner as a semiconductor wafer.

  Next, the frame unit 19 having the package substrate frame 2 mounted on the package substrate 11 is held by the holding surface of the chuck table provided in the grinding apparatus, and is exposed to the surface 4a side of the frame body 4 from the opening 4d. The mold resin 15 protruding in this way is ground (grinding step). The package substrate 11 can be thinned by grinding the mold resin 15. Here, an example will be described in which a grinding device including a chuck table having a circular holding surface is used to hold a disk-shaped workpiece.

  Hereinafter, a configuration example of a grinding apparatus used for grinding the package substrate 11 will be described. FIG. 4 is a perspective view showing a configuration example of a grinding apparatus 20 capable of grinding a disk-shaped workpiece such as a semiconductor wafer.

  As shown in FIG. 4, the grinding apparatus 20 includes a base 22 that supports each component of the grinding apparatus 20. An opening 22a is formed on the front side of the upper surface of the base 22, and a transport unit 24 for transporting the frame unit 19 is provided in the opening 22a. Further, cassettes 26 a and 26 b that can accommodate a plurality of frame units 19 are provided in a region further forward of the opening 22 a.

  A position adjustment mechanism 28 for adjusting the position of the frame unit 19 is provided obliquely behind the opening 22a. The frame unit 19 carried out from the cassettes 26 a and 26 b by the transport unit 24 is disposed in the position adjustment mechanism 28, and the position thereof is adjusted by the position adjustment mechanism 28. At a position adjacent to the position adjusting mechanism 28, a transport unit 30 that holds and turns the frame unit 19 is disposed. The frame unit 19 disposed in the position adjustment mechanism 28 is transported by the transport unit 30.

  FIG. 5 is a front view illustrating a state in which the frame unit 19 is transported by the transport unit 30. The transport unit 30 includes a disk-shaped base 32 and a plurality of suction pads 34 that are provided on the lower surface side of the base 32 and suck the frame unit 19. The frame unit 19 is held by the transport unit 30 by sucking the upper surface 4 a of the main body frame 4 with the plurality of suction pads 34. The frame unit 19 is conveyed by moving the base 32 in this state.

  The mold resin 15 protrudes on the surface 4 a side of the frame body 4, and the suction pad 34 sucks the upper surface 4 a of the body frame 4 so as not to contact the mold resin 15. The number of suction pads 34 is not limited. For example, four suction pads 34 may be provided to suck and hold the four outer peripheral portions of the main body frame 4.

  A turntable 36 that is rotatable around a rotation axis parallel to the vertical direction is arranged behind the transport unit 30 shown in FIG. Three chuck tables 38 for sucking and holding the frame unit 19 are provided on the upper surface of the turntable 36. Note that the number of chuck tables 38 arranged on the turntable 36 is not necessarily limited to three.

  The conveyance unit 30 that sucks and holds the frame unit 19 with the suction pad 34 conveys the frame unit 19 to the chuck table 38 so that the frame unit 19 is disposed at a predetermined position of the chuck table 38. When the frame unit 19 is arranged on the chuck table 38, the frame unit 19 is used by using the mark portion 4e provided on the frame body 4 (see FIGS. 1A, 2A, and 3A). 19 directions can be determined.

  The chuck table 38 is connected to a rotation mechanism (not shown) such as a motor, and rotates around a rotation axis parallel to the vertical direction. The upper surface of the chuck table 38 is a holding surface that holds the frame unit 19. The holding surface is connected to a suction source (not shown) through a suction path (not shown) formed inside the chuck table 38. The frame unit 19 conveyed to the chuck table 38 is sucked by the negative pressure of the suction source that acts on the holding surface of the chuck table 38.

  Two columnar support structures 40 are provided behind the turntable 36. A Z-axis moving plate 44 is provided on the front side of the support structure 40 via a Z-axis moving mechanism 42. The Z-axis moving mechanism 42 includes a pair of Z-axis guide rails 46 parallel to the Z-axis direction, and a Z-axis moving plate 44 is slidably installed on the Z-axis guide rail 46.

  A nut portion (not shown) is provided on the rear surface side (back surface side) of the Z-axis moving plate 44, and a Z-axis ball screw 48 is screwed into the nut portion in parallel with the Z-axis guide rail 46. Yes. A Z-axis pulse motor 50 is connected to one end of the Z-axis ball screw 48. When the Z-axis ball screw 48 is rotated by the Z-axis pulse motor 50, the Z-axis moving plate 44 moves in the Z-axis direction along the Z-axis guide rail 46.

  A grinding unit 52 is provided on the front side of the Z-axis moving plate 44. The grinding unit 52 includes a spindle housing 54 fixed to the Z-axis moving plate 44. The spindle housing 54 rotatably supports a spindle 66 (see FIG. 6) that constitutes a rotation shaft.

  A grinding wheel 56 is attached to the lower end of the spindle. The grinding wheel 56 includes a cylindrical wheel base 70 (see FIG. 6) and a plurality of grinding wheels 72 (see FIG. 6) arranged in an annular shape on the lower surface of the wheel base 70.

  When the frame unit 19 is sucked and held by the chuck table 38, the turntable 36 rotates to position the frame unit 19 below the grinding unit 52. Thereafter, when the chuck table 38 and the grinding wheel 56 are rotated relative to each other, the grinding unit 52 is lowered and the grinding wheel of the grinding wheel 56 is brought into contact with the mold resin 15 of the frame unit 19. Is ground.

  At a position adjacent to the conveyance unit 30, a conveyance unit 58 that rotates while sucking and holding the ground frame unit 19 is provided. A cleaning mechanism 60 for cleaning the ground frame unit 19 carried out by the transport unit 58 is disposed in front of the transport unit 58. The frame unit 19 cleaned by the cleaning mechanism 60 is transported by the transport unit 24 and accommodated in the cassette 26b.

  It should be noted that the orientation of the frame unit 19 can be determined by grasping the orientation of the frame unit 19 with the mark portion 4e provided on the frame body 4 (see FIGS. 1A, 2A, and 3A). They can be accommodated in the cassette 26b.

  The package substrate 11 can be thinned by grinding the mold resin 15 formed on the package substrate 11 by the grinding unit 52 of the grinding apparatus 2. Hereinafter, details of the grinding of the mold resin 15 will be described. FIG. 6 is a cross-sectional view showing how the mold resin 15 is ground by the grinding unit 52.

  The upper surface of the chuck table 38 is a holding surface 38 a that holds the frame unit 19. The chuck table 38 is formed of porous ceramics or the like, and includes a disk-like suction part 62 that sucks the frame unit 19. The suction part 62 passes through a suction path 64 formed inside the chuck table 38. (Not shown). The upper surface of the suction part 62 is a circular suction surface 62a that sucks the workpiece, and the suction surface 62a constitutes a part of the holding surface 38a.

  With the frame unit 19 disposed so as to be in contact with the suction surface 62a, the negative pressure of the suction source is applied to the suction surface 62a, whereby the frame unit 19 is held in contact with the suction surface 62a.

  When the package substrate 11 is to be held directly by the holding surface 38 a of the chuck table 38, if the back surface of the package substrate 11 is smaller than the suction surface 62 a, a part of the suction surface 62 a is exposed without being covered by the package substrate 11. To do. Even if the negative pressure of the suction source is applied to the suction surface 62a in this state, the negative pressure leaks from a part of the exposed suction surface 62a and the package substrate 11 is not sufficiently fixed. For this reason, depending on the size and shape of the package substrate 11, it may be difficult to hold the package substrate 11 by the chuck table 38.

  Therefore, in the present embodiment, the frame body 4 having a size and shape capable of covering the entire suction surface 62a is configured to form the package substrate frame 2, and the frame unit 19 is configured by mounting this on the package substrate 11. To do. Specifically, the frame body 4 is formed so that its diameter is equal to or larger than the diameter of the suction surface 62a. For example, if the diameter of the frame body 4 is substantially the same as the holding surface 38a of the chuck table 38, the frame unit 19 can be handled in the same manner as a semiconductor wafer.

  Then, the frame unit 19 is arranged on the holding surface 38a of the chuck table 38 so as to cover the suction surface 62a. Accordingly, the negative pressure of the suction source can be reliably applied to the lower surface of the frame unit 19, and the package substrate 11 can be accurately sucked and held on the chuck table 38. Thus, by using the package substrate frame 2, the package substrate 11 can be held by the chuck table 38 regardless of its size and shape.

  Further, the package substrate 11 may be warped due to heat treatment or the like during the formation of the mold resin 15. When the mold resin 15 is ground in a state where the package substrate 11 is warped, only a part of the surface of the mold resin 15 is locally ground, and the thickness of the mold resin 15 may vary. Therefore, it is preferable to correct the warpage of the package substrate 11 when the mold resin 15 is ground.

  Here, when the package substrate 11 on which the package substrate frame 2 is mounted is held by the holding surface 38 a of the chuck table 38, the end material region 17 of the substrate 13 is pressed against the holding surface 38 a side by the flange portion 6. Therefore, the substrate 13 and the mold resin 15 are deformed so as to be arranged in parallel with the holding surface 38a, and the warpage of the package substrate 11 is eliminated. Thereby, grinding can be performed with high accuracy.

  A grinding unit 52 is disposed above the chuck table 38. A spindle 66 is accommodated in the spindle housing 54 (see FIG. 4) of the grinding unit 52, and a disc-shaped mount 68 is fixed to the lower end portion of the spindle 66.

  A grinding wheel 56 having substantially the same diameter as the mount 68 is mounted on the lower surface of the mount 68. The grinding wheel 56 includes a cylindrical wheel base 70 made of a metal material such as stainless steel or aluminum. A plurality of grinding wheels 72 are arranged on the lower surface of the wheel base 70.

  A rotation drive source (not shown) such as a motor is connected to the upper end side (base end side) of the spindle 66, and the grinding wheel 56 rotates in parallel with the vertical direction by the force generated from the rotation drive source. Rotate around an axis. A nozzle (not shown) for supplying a grinding liquid such as pure water to the frame unit 19 is provided in or near the grinding unit 52.

  When grinding the mold resin 15 of the package substrate 11, the chuck table 38 is moved below the grinding unit 52 while the frame unit 19 is held by the chuck table 38. Then, the chuck table 38 and the grinding wheel 56 are rotated to lower the spindle 66 while supplying the grinding liquid to the frame unit 19.

  When the grinding wheel 72 comes into contact with the mold resin 15, the mold resin 15 is ground. The lowering speed (lowering amount) of the spindle housing 54 is appropriately adjusted so that the lower surface of the grinding wheel 72 is pressed against the mold resin 15 with an appropriate force. In this way, the package substrate 11 can be thinned.

  As described above, the package substrate frame 2 according to the present embodiment can accommodate the package substrate 11 having a size and shape different from that of the chuck table 38 and hold the package substrate 11 on the chuck table 38. Accordingly, it is possible to perform processing such as grinding the rectangular package substrate 11 in a plan view using the grinding device 20 that assumes grinding of a disk-shaped workpiece, and the grinding device 20 can be modified significantly. The grinding of the package substrate 11 can be carried out without applying.

  Although FIG. 1 shows a configuration example in which the frame body 4 and the flange portion 6 are integrated, the frame body 4 and the separately manufactured flange portion 6 may be fixed to the frame body 4. FIG. 7A is a perspective view showing a modified example of the package substrate frame 2, and FIG. 7B is a cross-sectional view showing a modified example of the package substrate frame 2.

  In the package substrate frame 2 shown in FIGS. 7A and 7B, a plate-shaped flange 6 formed separately from the frame body 4 is fixed to the upper surface 4 a side of the frame body 4. The frame body 4 includes an opening 4f that reaches from the front surface 4a to the back surface 4b. In addition, the flange portion 6 is formed in a rectangular shape in a plan view with resin, metal, or the like, and includes an opening 6c that reaches the back surface 6b from the front surface 6a of the flange portion 6. The opening 4f and the opening 6c are formed in a rectangular shape in plan view.

  The flange portion 6 is formed so that the width and depth thereof are larger than the opening portion 4f formed in the frame body 4, and the opening portion 6c is formed so that the width and depth thereof are smaller than those of the opening portion 4f. The And the collar part 6 is fixed to the surface 4a side of the flame | frame main body 4 along the outer peripheral part of the opening part 4f so that the opening part 6c may overlap with the opening part 4f in planar view. In addition, there is no restriction | limiting in the method of fixing the collar part 6 to the frame main body 4. FIG. For example, the collar portion 6 can be fixed to the frame body 4 using an adhesive.

  The dimensions of the frame body 4 and the flange 6 are set according to the dimensions of the package substrate 11 accommodated in the package substrate frame 2. Specifically, the frame body 4 is formed so that the thickness thereof substantially matches the thickness of the substrate 13 of the package substrate 11. In the flange portion 6, the width of the opening 6 c is larger than the width of the mold resin 15 and smaller than the width of the substrate 13, and the depth of the opening 6 c is larger than the depth of the mold resin 15 and smaller than the depth of the substrate 13. Formed as follows. Further, the thickness of the flange portion 6 is less than the thickness of the mold resin 15.

  When the package substrate frame 2 is mounted on the package substrate 11, the substrate 13 is accommodated in the opening 4 f of the frame main body 4, and a part of the upper side of the mold resin 15 passes from the opening 6 c of the flange 6 to the surface of the frame main body 4. It is exposed and protrudes on the 4a side. That is, the opening 4f corresponds to the recess 4c in FIG. 1B, and the opening 6c corresponds to the opening 4d in FIG. Further, at least a part of the end material region 17 of the substrate 13 is accommodated in the space 10 so as to be covered with the flange portion 6, and is fixed in a state where the upper surface thereof is in contact with the flange portion 6.

  As described above, a plurality of package substrate frames 2 corresponding to package substrates 11 having various sizes and shapes can be formed without changing the dimensions of the frame body 4 by separately manufacturing the flange portion 6 from the frame body 4. Can be easily obtained.

  For example, a plurality of frame main bodies 4 having the same size and shape of the opening 4f and a plurality of flanges 6 having different sizes or shapes of the opening 6c are prepared. A plurality of package substrate frames 2 that can accommodate package substrates 11 having different dimensions are obtained by fixing the flanges 6 having different sizes or shapes of the openings 6c to the plurality of frame bodies 4, respectively. In this case, since it is not necessary to change the dimension of the frame body 4 according to the dimension of the package substrate 11, the manufacturing cost of the package substrate frame 2 can be reduced.

  2 shows the package substrate 11 in which the mold resin 15 that covers the device chip is formed on the surface 13a side of the plate-like substrate 13, the form of the package substrate 11 is not limited to this. For example, a flexible substrate may be used as the substrate 13, and device chips covered with mold resin may be mounted on both the front surface 13 a side and the back surface 13 b side of the substrate 13. FIG. 8 is a cross-sectional view showing a modified example of the frame unit 19 in which the package substrate frame 2 is mounted on the package substrate 11 different from FIG.

  The package substrate 11 of the frame unit 19 shown in FIG. 8 has a flexible flexible substrate 21 formed of resin or the like. A mold resin 23a that covers a device chip (not shown) mounted on the front surface 21a side is formed on the front surface 21a side of the flexible substrate 21, and a device mounted on the back surface 21b side on the back surface 21b side of the flexible substrate 21. A mold resin 23b that covers a chip (not shown) is formed. For example, a device chip having a function such as a sensor can be mounted on the front surface 21a side, and a device chip having a function such as a memory can be mounted on the back surface 21b side.

  When grinding the mold resin 23 a, first, the package substrate 11 is placed inside the recess 4 c of the frame body 4. The frame body 4 is formed so that its thickness is thinner than that of the package substrate 11. Then, with a part of the mold resin 23a protruding from the opening 4d of the frame body 4 toward the front surface 4a, the adhesive tape 12 is applied to the back surface 4b of the frame body 4 and the mold resin 23b to form the frame unit 19. To do.

  Thereafter, the frame unit 19 is held by the chuck table 38 of the grinding device 20 (see FIG. 6), and the mold resin 23a is ground and thinned. The molding resin 23b can be ground by the same method.

  Here, when the flexible substrate 21 having flexibility is used as the package substrate, when the mold resin 23a is ground, the end of the flexible substrate 21 is deformed and bent to the mold resin side 23a, which hinders the grinding process. There is. However, in this embodiment, as shown in FIG. 8, when the package substrate frame 2 is mounted on the package substrate 11, the flange portion 6 comes into contact with the end portion of the flexible substrate 21, and the end portion of the flexible substrate 21 is on the lower side (mold It is pressed against the resin 23b side). Therefore, it is possible to prevent the end portion of the flexible substrate 21 from being exposed to the mold resin 23a side, and it is possible to smoothly perform the grinding process.

  Further, the flange portion 6 of the package substrate frame 2 shown in FIG. 8 is formed in a shape in which the lower surface is inclined with respect to the surface 4a of the frame body 4 so as to become gradually thinner toward the opening 4d. Thereby, the area | region of the collar part 6 supported by the main body frame 4 increases, and the rigidity of the collar part 6 can be improved. This structure is particularly effective because, for example, when the mold resin 23a is relatively thin (eg, 100 μm or less) and the flange portion 6 needs to be designed to be thin, a reduction in rigidity of the flange portion 6 can be suppressed. is there.

  When the mold resin 23a is formed thin, instead of thinning the flange portion 6, by providing a convex portion on the chuck table that holds the frame unit 19, and disposing the package substrate 11 on the convex portion, Grinding can also be performed by increasing the apparent thickness of the mold resin 23a. FIG. 9 is a cross-sectional view showing a state in which the frame unit 19 is held by the chuck table 38 having the convex portions 38b.

  The chuck table 38 shown in FIG. 9 has a convex portion 38b that protrudes toward the holding surface 38a corresponding to the position where the package substrate 11 is held. The convex portion 38 b supports the package substrate 11 and is formed so that its width and depth are smaller than the concave portion 4 c of the frame body 4.

  When grinding the mold resin 23a, the frame unit 19 is held by the chuck table 38 so that the back surface side of the package substrate 11 is in contact with the convex portion 38b. At this time, the convex portion 38 b is disposed inside the concave portion 4 c of the frame body 4, and the package substrate 11 is disposed above the package substrate frame 2 by the thickness of the convex portion 38 b. Thereby, a part of the mold resin 23a is exposed from the opening 4c to the upper surface 4a side.

  Thus, by providing the convex part 38b on the chuck table 38, the mold resin 23a can be packaged without changing the thickness of the flange part 6 even when the mold resin 23a is formed relatively thin. The substrate frame 2 can be exposed.

  Although FIG. 9 shows an example in which the convex portion 38 b is constituted by a part of the chuck table 38, the convex portion 38 b separately manufactured from the chuck table 38 is fixed to the holding surface 38 a of the chuck table 38. May be.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

2 Frame for Package Substrate 4 Frame Main Body 4a Front 4b Back 4c Recess 4d Opening 4e Marking 4f Opening 6 Gutter 6a Front 6b Back 6c Opening 10 Space 12 Adhesive Tape 20 Grinding Device 22 Base 22a Opening 24 Transport Unit 26a , 26b Cassette 28 Position adjustment mechanism 30 Transport unit 32 Base 34 Suction pad 36 Turntable 38 Chuck table 38a Holding surface 38b Protruding portion 40 Support structure 42 Z-axis moving mechanism 44 Z-axis moving plate 46 Z-axis guide rail 48 Z-axis ball screw 50 Z-axis pulse motor 52 Grinding unit 54 Spindle housing 56 Grinding wheel 58 Transport unit 60 Cleaning mechanism 62 Suction part 62a Suction surface 64 Suction path 66 Spindle 68 Mount 70 Wheel base 72 Grinding wheel 1 package substrate 13 substrate 13a surface 13b back surface 15 mold resin 17 end material region 19 frame unit 21 the flexible substrate 23a, 23b molded resin

Claims (3)

Package substrate frame used when a mold substrate is ground by sucking and holding a package substrate in which a region excluding the end material region on the surface of the substrate having an end material region on the outer periphery is covered with a mold resin. Because
A disc-shaped frame body having a diameter equal to or larger than the diameter of the suction surface of the chuck table, which includes a circular suction surface for sucking a workpiece;
An opening formed in the frame body and exposing the mold resin of the package substrate;
A package substrate frame, comprising: a flange provided along the outer periphery of the opening and covering the end material region.   The package substrate frame according to claim 1, further comprising a mark portion formed on the frame body and indicating a direction of the frame body. A package substrate grinding method using the package substrate frame according to claim 1 or 2,
Position the package substrate so that the mold resin is exposed from the opening to the front side of the frame body, and the end material region is covered by the flange, and apply an adhesive tape to the back side of the frame body A frame unit forming step of fixing the package substrate to the frame body to form a frame unit;
A grinding step of holding the frame unit by the chuck table and grinding the mold resin exposed to the surface side of the frame body from the opening by a grinding unit.