JP2019140201A - Manufacturing method for electronic component, resin composition for temporary protection, and resin film for temporary protection - Google Patents

Abstract

To provide a novel manufacturing method for an electronic component having an electromagnetic shield.SOLUTION: A manufacturing method for an electronic component having an electromagnetic shield includes a pasting step of pasting a temporary protection material to a processed body having irregularities on a surface, a photo-curing step of curing the temporary protection material by light irradiation, a dicing step of individualizing the processed body and the temporary protection material, a shield step of forming a metal film at a part of an individualized processed body not pasted with the temporary protection material, and a peeling step of peeling the processed body on which the metal film is formed and the temporary protection material. The temporary protection material has a degree of elasticity of 1.5 MPa or less at 25°C, and is formed of a resin composition for temporary protection where the degree of elasticity is 3-100 MPa at 25°C after the light irradiation when an exposure value is 500 mJ/cmor more and breaking extension is 100% or less.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for producing an electronic component, and a temporary protective resin composition and a temporary protective resin film used in the method for producing an electronic component.

  As electronic devices such as smartphones and tablet PCs become multifunctional and globalized, the number of installed wireless systems is increasing. On the other hand, the clock frequency and data transmission speed of built-in lines are increasing, and noise in the frequency band used in those wireless systems is likely to occur. As a countermeasure against such noise, conventionally, an electromagnetic shield in which a circuit including a noise generation source is surrounded by a metal plate has been performed (see, for example, Patent Documents 1 and 2).

Japanese Patent No. 3824742 Japanese Patent Laid-Open No. 9-223761

  However, the technique described in the above patent document requires a large area for mounting. For this reason, depending on the circuit to be electromagnetically shielded, the height is increased, which is an impediment to the reduction in size and thickness of electronic devices.

Against this background, there has been proposed a new method for forming an electromagnetic shield by sputtering a metal serving as an electromagnetic shield material on a circuit including a noise generation source.
An electronic component provided with an electromagnetic shield includes a BGA (Ball Grid Array) package. In recent years, in addition to miniaturization and thinning of BGA packages and the like, the structure itself has become complicated, and it is required to form an electromagnetic shield at a desired portion even for such electronic components.

  This invention is made | formed in view of the said situation, and it aims at providing the new manufacturing method of the electronic component which has an electromagnetic shield. The present invention also provides a temporary protective resin composition for forming a temporary protective material used in the production method, and a temporary protective resin film formed by forming the temporary protective resin composition into a film shape. The purpose is to do.

  In order to solve the above-mentioned problems, the present inventors reviewed the manufacturing process of electronic components and conducted intensive research on the selection of the resin for the temporary protective material used in the process and the adjustment of the physical properties. And it discovered that it was very important for the solution of the said subject to use a specific manufacturing process in combination with a temporary protective material whose elastic modulus and elongation at break were appropriately controlled, and the present invention was completed. .

A first aspect of the present invention is a method for manufacturing an electronic component having an electromagnetic shield, the step of attaching a temporary protective material to a workpiece having irregularities on the surface, and curing the temporary protective material by light irradiation. A light curing step, a dicing step for separating the workpiece and the temporary protective material into individual pieces, and a shielding step for forming a metal film on a portion of the workpiece to be separated, where the temporary protective material is not attached, A peeling step of peeling the workpiece on which the metal film is formed and the temporary protective material, the temporary protective material has an elastic modulus at 25 ° C. of 1.5 MPa or less, and an exposure amount of 500 mJ / cm Provided is a production method formed from a temporary protective resin composition having an elastic modulus at 25 ° C. of 3 to 100 MPa and an elongation at break of 100% or less after light irradiation of ² or more.

  According to the present invention, a small electronic component having a metal film electromagnetic shield formed at a desired portion is manufactured.

In general, when a workpiece is bonded to an adhesive material such as a temporary protective material, a phenomenon called bleeding may occur in which the adhesive material protrudes from the end portion and wraps around the side surface of the workpiece.
When a metal film is formed on the workpiece with the bleed generated, a metal film is also formed on the bleed itself. Therefore, when the bleed is peeled off together with the temporary protective material, the metal film is formed on the side surface of the workpiece. Unexposed parts are exposed. Therefore, for example, even if an object that has been reduced in size by dicing or the like is prepared in advance and a metal film is formed by simply pasting the object to be processed and a temporary protective material, a desired electromagnetic shield is produced due to the influence of the bleed. It is difficult to obtain an electronic component having it.

  Therefore, it is conceivable to study a resin design that does not cause bleeding. However, if too much suppression of bleed is desired, the temporary protective material cannot sufficiently embed the unevenness of the workpiece. If the embedding property is insufficient, voids remain at the bonding interface, and voids are generated at the bonding interface due to swelling of the voids during heating when forming the metal film. As a result, a metal film is also formed on the portion to be protected by the temporary protective material.

  In order to deal with this problem, the present invention does not necessarily deal with the problem of bleeding that may occur on the side surface of the workpiece when the temporary protective material is pasted while ensuring the embedding of the unevenness by the temporary protective material. A device is devised in terms of process and resin physical properties so that it may not be necessary (can be ignored). First, in the present invention, at least a pasting process for pasting the workpiece and the temporary protective material is performed, and then a dicing process for separating the integrals of both is performed. By performing each step in this order, a sample for forming a metal film can be obtained avoiding the end of the workpiece that may cause bleeding. In addition, the temporary protective material used has a physical property of an elastic modulus at 25 ° C. of 1.5 MPa or less in the pasting step before curing, and an elastic modulus at 25 ° C. of 3 to 100 MPa and fracture in the dicing step after curing. It satisfies the physical property that the elongation is 100% or less. Therefore, not only sufficient embedding property before curing, but also excellent dicing property and releasability after curing can be achieved. In addition, that it is excellent in dicing property means that the burr | flash derived from a temporary protective material does not generate | occur | produce easily at the time of dicing. If the generation of burrs is not sufficiently suppressed, good metal film formation is inhibited.

  Thus, according to the present invention in which a specific manufacturing process and a specific temporary protective material are used in combination, a small electronic component in which an electromagnetic shield is formed at a desired location including a side surface can be obtained.

  In the production method of the present invention, the temporary protective resin composition includes (A) a (meth) acrylic copolymer having a reactive functional group, and (A) a (meth) acrylic copolymer having a reactive functional group It preferably has a weight average molecular weight of 10,000 to 1,000,000 and a glass transition temperature of -50 ° C to 50 ° C. In this case, the (A) (meth) acrylic copolymer having a reactive functional group is preferably a (meth) acryloyl group, vinyl group, allyl group, glycidyl group, alicyclic epoxy group. And at least one selected from the group consisting of oxetanyl groups. When the (meth) acrylic copolymer has these functional groups, the dicing property and the peelability of the temporary protective resin composition can be further improved.

  In the manufacturing method of this invention, it is preferable that the resin composition for temporary protection further contains (B) (meth) acrylic monomer. Thereby, the elastic modulus after being cured by irradiation with light can be further improved.

  In the manufacturing method of this invention, it is preferable that the resin composition for temporary protection further contains (C) radical photopolymerization initiator. Thereby, the elastic modulus after being cured by irradiation with light can be further improved.

  In the manufacturing method of this invention, it is preferable that the resin composition for temporary protection further contains (D) silicone compound. Thereby, the peelability of a to-be-processed object and temporary protection material can be improved more. In particular, the workpiece and the temporary protective material can be easily peeled off without using a solvent.

  In the production method of the present invention, the temporary protective material is preferably in the form of a film. Thereby, the handleability during the manufacturing process can be improved, and sputtering on the workpiece can be efficiently performed.

The present invention also includes a step of attaching a temporary protective material to a workpiece having irregularities on the surface, a photocuring step of curing the temporary protective material by light irradiation, and the workpiece and the temporary protective material as individual pieces. A dicing process, a shielding process for forming a metal film on a part of the work piece that has been separated into pieces, and a temporary protective material, and a work piece on which the metal film is formed and the temporary protective material are peeled off. A temporary protective resin composition for forming a temporary protective material, which is used in a method for producing an electronic component having an electromagnetic shield, and has an elastic modulus at 25 ° C. of 1.5 MPa or less The resin composition has an elastic modulus of 3 to 100 MPa and an elongation at break of 100% or less at 25 ° C. after light irradiation with an exposure amount of 500 mJ / cm ² or more.

  The temporary protective material formed from such a resin composition has an excellent low-temperature sticking property to the workpiece before curing, and is separated into pieces together with the workpiece after curing. It has good dicing properties (can be separated into pieces by reducing burrs) and releasability (it is possible to easily peel off the workpiece and temporary protective material).

  The temporary protective resin composition of the present invention includes (A) a (meth) acrylic copolymer having a reactive functional group, and (A) a (meth) acrylic copolymer having a reactive functional group is 10,000 to 1,000,000. And a glass transition temperature of -50 ° C to 50 ° C. In this case, the (A) (meth) acrylic copolymer having a reactive functional group is preferably a (meth) acryloyl group, vinyl group, allyl group, glycidyl group, alicyclic epoxy group. And at least one selected from the group consisting of oxetanyl groups. When the (meth) acrylic copolymer has these functional groups, the dicing property and the peelability of the temporary protective resin composition can be improved.

  The temporary protective resin composition of the present invention preferably further comprises (B) (meth) acrylic monomer. Thereby, the elastic modulus after being cured by irradiation with light can be further improved.

  The temporary protective resin composition of the present invention preferably further contains (C) a radical photopolymerization initiator. Thereby, the elastic modulus after being cured by irradiation with light can be further improved.

  The temporary protective resin composition of the present invention preferably further comprises (D) a silicone compound. Thereby, the peelability of a to-be-processed object and temporary protection material can be improved more. In particular, the workpiece and the temporary protective material can be easily peeled off without using a solvent.

  The present invention further provides a temporary protective resin film formed by forming the temporary protective resin composition into a film. If it is a film formed from the said resin composition for temporary protection, it not only has the said characteristic which the resin composition for temporary protection has but it is excellent also in the handleability in a manufacturing process. Moreover, by using the temporary protective resin film, sputtering to the workpiece can be efficiently performed.

  ADVANTAGE OF THE INVENTION According to this invention, the new manufacturing method of the electronic component which has an electromagnetic shield can be provided. Moreover, according to this invention, the temporary protection resin composition formed in the film form of the temporary protection resin composition for forming the temporary protection material used in the said manufacturing method, and the said temporary protection resin composition A film can be provided.

  The temporary protective resin composition or temporary protective resin film according to the present invention can be bonded with good embedding to a workpiece having irregularities on the surface, and after being cured by light irradiation, the workpiece is processed. It can be diced together with the body, and can be peeled off from the workpiece after dicing. As described above, according to the present invention, it is possible to finally obtain an electronic component having an electromagnetic shield at a desired portion while improving various characteristics in the process.

It is process schematic diagram which shows the manufacturing method which concerns on one Embodiment of this invention.

  Hereinafter, preferred embodiments of the present invention will be described in detail. However, the present invention is not limited to the following embodiments.

<Method for manufacturing electronic parts>
The method for manufacturing an electronic component according to the present embodiment is a method for manufacturing an electronic component having an electromagnetic shield, in which a temporary protection material is attached to a workpiece having irregularities on the surface, and the temporary protection material is irradiated with light. The photocuring step for curing by the step, the dicing step for separating the workpiece and the temporary protective material into individual pieces, and the shield for forming a metal film on the portion of the individual workpiece to be processed where the temporary protective material is not attached At least a process and a peeling process for peeling the workpiece on which the metal film is formed and the temporary protective material.

  Hereinafter, each step will be described with reference to the drawings as appropriate.

(Attaching process: FIG. 1 (A) to FIG. 1 (B))
In this step, the temporary protective material 20 is attached to the workpiece 10 having an uneven surface. As shown in FIG. 1A, the workpiece 10 includes a convex portion 2 on the substrate 1.

  The workpiece 10 is not particularly limited, and examples thereof include a BGA (Ball Grid Array) package, an LGA (Land Grid Array) package, and the like. In the case of a BGA package, specifically, a semiconductor substrate having a plurality of bumps (convex portions) on one surface and sealed on the other surface with a sealing material is exemplified. The bump height is about 5 to 300 μm.

  As the temporary protective material 20, a temporary protective resin film formed from a predetermined temporary protective resin composition described later can be used. The temporary protective resin film is a film-like temporary protective material. The film can be provided with a base film 30 such as a polyethylene terephthalate film on the surface opposite to the surface to be attached to the workpiece.

  A roll laminator, a vacuum laminator, or the like can be used for attaching the workpiece 10 and the temporary protective material 20. For example, when a vacuum laminator is used, a vacuum laminator LM-50 × 50-S (product name, manufactured by NPC Corporation), a vacuum laminator V130 (product name, manufactured by Nichigo Morton Co., Ltd.) or the like is used. Pressure 1.5 hPa or less (preferably 1 hPa or less), laminating temperature 25 to 180 ° C. (preferably 40 to 120 ° C.), laminating pressure 0.01 to 0.5 MPa (preferably 0.1 to 0.5 MPa), and Pasting can be performed under conditions of a holding time of 1 to 600 seconds (preferably 30 to 300 seconds).

(Curing process: FIG. 1 (C))
In this process, the temporary protective material 20 attached to the workpiece 10 is irradiated with light to cure the temporary protective material. Light irradiation can be performed from the side of the base film 30 on the surface opposite to the surface to which the temporary protective material 20 is attached. In the drawing, the hardened temporary protective material 20 is referred to as a temporary protective material 20c.

The light to be irradiated includes ultraviolet rays, and irradiation is performed so that the exposure amount (integrated irradiation amount) to the temporary protective material 20 is 500 mJ / cm ² or more. This is because if the exposure amount is less than 500 mJ / cm ² , the temporary protective material may be insufficiently cured. The upper limit of the exposure amount is not particularly limited, but can be about 3000 mJ / cm ² from the viewpoint of work efficiency. For the light irradiation, for example, a UV-330 HQP-2 type exposure machine (product name, manufactured by Oak Manufacturing Co., Ltd.) that can irradiate UV can be used.

(Dicing process: FIG. 1 (D))
In this step, dicing is performed on the integrated object of the workpiece 10 and the cured temporary protective material 20c, and the integrated object is separated into pieces. Specifically, the base film 30 is peeled off from the temporary protective material 20c and placed on the dicing tape 40, and separated into individual pieces using, for example, a fully automatic dicing saw DFD-6361 (product name, manufactured by DISCO Corporation). To do.

  In addition, in order to implement the shield process mentioned later, as shown in FIG.1 (E), the separated monolith is conveyed on the heat resistant adhesive tape 50, such as a polyimide tape.

(Shielding process and peeling process: FIG. 1 (F))
In this step, a metal film M serving as an electromagnetic shield is formed on at least a portion of the workpiece 10 to which the temporary protective material 20c is not attached, and then the metal film M is formed. The formed workpiece 10 and the temporary protective material 20c are peeled off.

The metal film M is formed using a known sputtering apparatus (for example, sputtering apparatus SDH series: product name, manufactured by ULVAC, Inc.), for example, a temperature of 60 to 150 ° C. and a pressure of 1 × 10 ⁻¹ Pa to 10 × 10 ^−1. The target metal can be made of copper or the like under the condition of Pa. The formed metal film M has a thickness of about 0.1 to 10 μm. Since the temporary protective material 20c is peeled off in this step, the metal film M may be formed on the surface of the temporary protective material 20c. In addition, as a formation method of the metal film M, a spray method, a plating method, a coating method, etc. other than said sputtering method are mentioned. However, the sputtering method is preferable from the viewpoint of easily forming a uniform and thin metal film M.

  The workpiece 10 on which the metal film M is formed is separated from the temporary protective material 20c by picking up the workpiece 10 with a predetermined collet C, for example. For example, die bonder BEST-02 (product name, manufactured by Canon Machinery Co., Ltd.) or the like can be used for the separation of the two.

  In the manufacturing method which concerns on this embodiment, what is formed from the predetermined resin composition for temporary protection shown below is used as a temporary protective material. Hereinafter, the temporary protective resin composition and the temporary protective resin film will be described.

<Temporary protection resin composition>
The temporary protective resin composition according to the present embodiment is a temporary protective resin composition for forming a temporary protective material used in the above-described method for manufacturing an electronic component having an electromagnetic shield. A resin composition having an elastic modulus of 1.5 MPa or less, an elastic modulus at 25 ° C. after light irradiation of 3 to 100 MPa, and an elongation at break of 100% or less after exposure to light of 500 mJ / cm ² or more. is there.

Specifically, the pasting step of attaching the temporary protective material to the workpiece having irregularities on the surface, the photocuring step of curing the temporary protective material by light irradiation, and the workpiece and the temporary protective material are singulated. A dicing process, a shield process for forming a metal film on a part of the work piece that has been separated into pieces, and a temporary protective material, and a work object on which the metal film is formed and the temporary protective material are peeled off. A temporary protection resin composition for forming a temporary protection material, which is used in a method for producing an electronic component having an electromagnetic shield, and having an elastic modulus at 25 ° C. of 1.5 MPa or less. And a resin composition having an elastic modulus of 3 to 100 MPa and an elongation at break of 100% or less at 25 ° C. after light irradiation with an exposure amount of 500 mJ / cm ² or more.

  If it is the resin composition for temporary protection which concerns on this embodiment, sufficient embedding before hardening and the outstanding dicing property after hardening can be made compatible. And by using the resin composition designed in this way in the said specific manufacturing process, the small electronic component by which the electromagnetic shield of the metal film was formed in the desired part can be manufactured.

  For example, a well-known support tape (back grind tape, dicing tape, etc.) is applied to a workpiece with surface irregularities exceeding a height of several hundred μm, such as a BGA package, with solder balls mounted on the circuit surface. In addition, it is difficult to embed irregularities and to peel the support tape from the surface of the workpiece after desired processing. This is especially true when the desired processing includes dicing. In the case of a conventionally known tape, the compatibility between the softness when affixed to a workpiece and the hardness that can withstand dicing are compatible with each other. It is not easy because the design is not focused on such characteristics. If a conventionally known support tape is used, there is a possibility that the unevenness on the surface of the workpiece cannot be sufficiently embedded and a gap is easily generated or dicing cannot be performed well due to insufficient hardness. If the embedding property and the dicing property are insufficient, an electromagnetic shield cannot be formed on a desired portion of the workpiece as described above.

  The temporary protective resin composition has an elastic modulus at 25 ° C. (elastic modulus before photocuring) of 1.5 MPa or less, so that the workpieces represented by the semiconductor elements are not damaged, and uneven A temporary protective material can be affixed to a to-be-processed body, without producing a space | gap at the time of embedding. From such a viewpoint, the elastic modulus is preferably 1.0 MPa or less, and more preferably 0.5 MPa or less. In addition, as a minimum of the said elasticity modulus, it can be 0.01 Mpa from a viewpoint of favorable sticking property.

The temporary protective resin composition has an elastic modulus at 25 ° C. (elastic modulus after photocuring) after light irradiation of 3 to 100 MPa after light irradiation with an exposure amount of 500 mJ / cm ² or more, and an elongation at break of 100%. By being below, when the integrated object of a to-be-processed object and temporary protection material is separated into pieces with a dicer, the burr | flash generation | occurrence | production derived from temporary protection material can be suppressed. A burr | flash here means the unnecessary protrusion which arises on a processed surface when a temporary protective material is diced. From such a viewpoint, the elastic modulus is preferably 5 to 80 MPa, and more preferably 10 to 50 MPa. The elongation at break is preferably 80% or less, and more preferably 50% or less. In addition, as a minimum of the said breaking elongation, it can be set to 1% from a viewpoint of favorable dicing property.

  The elongation at break can be measured using, for example, an autograph apparatus AGS-1000G (product name, manufactured by Shimadzu Corporation). Specifically, for example, measurement can be performed in accordance with the description of the examples.

  The elastic modulus can be measured using, for example, a dynamic viscoelastic device Rheogel-E4000 (product name, manufactured by UMB Co., Ltd.). Specifically, for example, measurement can be performed in accordance with the description of the examples.

  In the present embodiment, the temporary protective resin composition only needs to have the elastic modulus and elongation at break as described above, and the specific composition of the composition is not particularly limited. By appropriately controlling the elastic modulus before and after curing of the temporary protective resin composition and the elongation at break after curing, it can be bonded to the workpiece without generating voids, and the workpiece after peeling Dicing and peeling can be realized without substantially generating a residue on the surface. In the following, as an example, a main component composed of a (meth) acrylic copolymer having a reactive functional group, a (meth) acrylic monomer, a photoradical polymerization initiator as a photoreaction control component, and a silicone compound as a release component Although the aspect (photocurable resin composition) to which is added will be described, those skilled in the art can appropriately implement other modified aspects.

<(A) (Meth) acrylic copolymer having reactive functional group>
By properly selecting and blending a (meth) acrylic copolymer having a reactive functional group and a silicone compound, the releasability without prior application of the release component is improved and the generation of residues after peeling is suppressed. Can do. In the present specification, (meth) acryl is used to mean either acrylic or methacrylic.

  (A) component is methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, butoxyethyl (meth) acrylate as a copolymer component. , Isoamyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, heptyl (meth) acrylate, octylheptyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) Acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, stearyl (meth) acrylate Relate, behenyl (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, ethoxypolyethylene glycol (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, ethoxypolypropylene glycol (meth) acrylate, mono (2- (meth) acryloyloxy Aliphatic (meth) acrylates such as ethyl) succinate; cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, isobornyl (meth) ) Acrylate, mono (2- (meth) acryloyloxyethyl) tetrahydrophthalate, mono (2- (meth) acryloyloxyethyl) ) Alicyclic (meth) acrylates such as hexahydrophthalate; benzyl (meth) acrylate, phenyl (meth) acrylate, o-biphenyl (meth) acrylate, 1-naphthyl (meth) acrylate, 2-naphthyl (meth) acrylate, Phenoxyethyl (meth) acrylate, p-cumylphenoxyethyl (meth) acrylate, o-phenylphenoxyethyl (meth) acrylate, 1-naphthoxyethyl (meth) acrylate, 2-naphthoxyethyl (meth) acrylate, phenoxypolyethylene glycol (meth) Acrylate, nonylphenoxypolyethylene glycol (meth) acrylate, phenoxypolypropylene glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate 2-hydroxy-3- (o-phenylphenoxy) propyl (meth) acrylate, 2-hydroxy-3- (1-naphthoxy) propyl (meth) acrylate, 2-hydroxy-3- (2-naphthoxy) propyl ( Aromatic (meth) acrylates such as meth) acrylate; 2-tetrahydrofurfuryl (meth) acrylate, N- (meth) acryloyloxyethyl hexahydrophthalimide, 2- (meth) acryloyloxyethyl-N-carbazole, ω -Heterocyclic (meth) acrylates such as carboxy-polycaprolactone mono (meth) acrylate; glycidyl (meth) acrylate, α-ethylglycidyl (meth) acrylate, α-propylglycidyl (meth) acrylate, α-butylglycidyl (meta ) Acrylate, 2-methyl Glycidyl (meth) acrylate, 2-ethylglycidyl (meth) acrylate, 2-propylglycidyl (meth) acrylate, 3,4-epoxybutyl (meth) acrylate, 3,4-epoxyheptyl (meth) acrylate, α-ethyl- Ethylenically unsaturated groups such as 6,7-epoxyheptyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether And an epoxy group-containing compound; (2-ethyl-2-oxetanyl) methyl (meth) acrylate, (2-methyl-2-oxetanyl) methyl (meth) acrylate, 2- (2-ethyl-oxetanyl) ethyl (meth) Acrylate, -(2-methyl-2-oxetanyl) ethyl (meth) acrylate, 3- (2-ethyl-2-oxetanyl) propyl (meth) acrylate, 3- (2-methyl-2-oxetanyl) propyl (meth) acrylate, etc. A compound having an ethylenically unsaturated group and an oxetanyl group; a compound having an ethylenically unsaturated group and an isocyanate group such as 2- (meth) acryloyloxyethyl isocyanate; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl ( Compounds having an ethylenically unsaturated group and a hydroxyl group, such as (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate; Are combined as appropriate. It is possible to obtain a composition of interest by.

  Further, if necessary, styrene or maleimide compounds copolymerizable with the above-described monomers may be used. Examples of maleimide compounds include N-methylmaleimide, N-ethylmaleimide, N-propylmaleimide, N-isopropylmaleimide, N-butylmaleimide, N-isobutylmaleimide, N-2-methyl-2-propylmaleimide, N- Pentylmaleimide, N-2-pentylmaleimide, N-3-pentylmaleimide, N-2-methyl-1-butylmaleimide, N-2-methyl-2-butylmaleimide, N-3-methyl-1-butylmaleimide, N-3-methyl-2-butylmaleimide, N-hexylmaleimide, N-2-hexylmaleimide, N-3-hexylmaleimide, N-2-methyl-1-pentylmaleimide, N-2-methyl-2-pentyl Maleimide, N-2-methyl-3-pentylmaleimide, N-3-methyl- -Pentylmaleimide, N-3-methyl-2-pentylmaleimide, N-3-methyl-3-pentylmaleimide, N-4-methyl-pentylmaleimide, N-4-methyl-2-pentylmaleimide, N-2, 2-dimethyl-1-butylreimide, N-3,3-dimethyl-1-butylmaleimide, N-3,3-dimethyl-2-butylmaleimide, N-2,3-dimethyl-1-butylmaleimide, N-2 , 3-dimethyl-2-butylmaleimide, N-hydroxymethylmaleimide, N-1-hydroxyethylmaleimide, N-2-hydroxyethylmaleimide, N-1-hydroxy-1-propylmaleimide, N-2-hydroxy-1 -Propylmaleimide, N-3-hydroxy-1-propylmaleimide, N-1-hydroxy-2-propyl Reimide, N-2-hydroxy-2-propylmaleimide, N-1-hydroxy-1-butylmaleimide, N-2-hydroxy-1-butylmaleimide, N-3-hydroxy-1-butylmaleimide, N-4- Hydroxy-1-butylmaleimide, N-1-hydroxy-2-butylmaleimide, N-2-hydroxy-2-butylmaleimide, N-3-hydroxy-2-butylmaleimide, N-4-hydroxy-2-butylmaleimide N-2-methyl-3-hydroxy-1-propylmaleimide, N-2-methyl-3-hydroxy-2-propylmaleimide, N-2-methyl-2-hydroxy-1-propylmaleimide, N-1- Hydroxy-1-pentylmaleimide, N-2-hydroxy-1-pentylmaleimide, N-3-hydroxy- 1-pentylmaleimide, N-4-hydroxy-1-pentylmaleimide, N-5-hydroxy-1-pentylmaleimide, N-1-hydroxy-2-tilmaleimide, N-2-hydroxy-2-pentylmaleimide, N -3-hydroxy-2-pentylmaleimide, N-4-hydroxy-2-pentylmaleimide, N-5-hydroxy-2-pentylmaleimide, N-1-hydroxy-3-pentylmaleimide, N-2-hydroxy-3 -Pentylmaleimide, N-3-hydroxy-3-pentylmaleimide, N-1-hydroxy-2-methyl-1-butylmaleimide, N-1-hydroxy-2-methyl-2-butylmaleimide, N-1-hydroxy -2-methyl-3-butylmaleimide, N-1-hydroxy-2-methyl-4-butylmer Imido, N-2-hydroxy-2-methyl-1-butylmaleimide, N-2-hydroxy-2-methyl-3-butylmaleimide, N-2-hydroxy-2-methyl-4-butylmaleimide, N-2 -Hydroxy-3-methyl-1-butylmaleimide, N-2-hydroxy-3-methyl-2-butylmaleimide, N-2-hydroxy-3-methyl-3-butylmaleimide, N-2-hydroxy-3- Methyl-4-butylmaleimide, N-4-hydroxy-2-methyl-1-butylmaleimide, N-4-hydroxy-2-methyl-2-butylmaleimide, N-1-hydroxy-3-methyl-2-butyl Maleimide, N-1-hydroxy-3-methyl-1-butylmaleimide, N-1-hydroxy-2,2-dimethyl-1-propylmaleimide, -3-hydroxy-2,2-dimethyl-1-propylmaleimide, N-1-hydroxy-1-hexylmaleimide, N-1-hydroxy-2-hexylmaleimide, N-1-hydroxy-3-hexylmaleimide, N -1-hydroxy-4-hexylmaleimide, N-1-hydroxy-5-hexylmaleimide, N-1-hydroxy-6-hexylmaleimide, N-2-hydroxy-1-hexylmaleimide, N-2-hydroxy-2 -Hexylmaleimide, N-2-hydroxy-3-hexylmaleimide, N-2-hydroxy-4-hexylmaleimide, N-2-hydroxy-5-hexylmaleimide, N-2-hydroxy-6-hexylmaleimide, N- 3-hydroxy-1-hexylmaleimide, N-3-hydroxy-2-hexyluma Reimide, N-3-hydroxy-3-hexylmaleimide, N-3-hydroxy-4-hexylmaleimide, N-3-hydroxy-5-hexylmaleimide, N-3-hydroxy-6-hexylmaleimide, N-1- Hydroxy-2-methyl-1-pentylmaleimide, N-1-hydroxy-2-methyl-2-pentylmaleimide, N-1-hydroxy-2-methyl-3-pentylmaleimide, N-1-hydroxy-2-methyl -4-pentylmaleimide, N-1-hydroxy-2-methyl-5-pentylmaleimide, N-2-hydroxy-2-methyl-1-pentylmaleimide, N-2-hydroxy-2-methyl-2-pentylmaleimide N-2-hydroxy-2-methyl-3-pentylmaleimide, N-2-hydroxy-2-methyl- -Pentylmaleimide, N-2-hydroxy-2-methyl-5-pentylmaleimide, N-2-hydroxy-3-methyl-1-pentylmaleimide, N-2-hydroxy-3-methyl-2-pentylmaleimide, N 2-hydroxy-3-methyl-3-pentylmaleimide, N-2-hydroxy-3-methyl-4-pentylmaleimide, N-2-hydroxy-3-methyl-5-pentylmaleimide, N-2-hydroxy- 4-methyl-1-pentylmaleimide, N-2-hydroxy-4-methyl-2-pentylmaleimide, N-2-hydroxy-4-methyl-3-pentylmaleimide, N-2-hydroxy-4-methyl-4 -Pentylmaleimide, N-2-hydroxy-4-methyl-5-pentylmaleimide, N-3-hydroxy-2-methyl 1-pentylmaleimide, N-3-hydroxy-2-methyl-2-pentylmaleimide, N-3-hydroxy-2-methyl-3-pentylmaleimide, N-3-hydroxy-2-methyl-4-pentyl Maleimide, N-3-hydroxy-2-methyl-5-pentylmaleimide, N-1-hydroxy-4-methyl-1-pentylmaleimide, N-1-hydroxy-4-methyl-2-pentylmaleimide, N-1 -Hydroxy-4-methyl-3-pentylmaleimide, N-1-hydroxy-4-methyl, N-1-hydroxy-3-methyl-1-pentylmaleimide, N-1-hydroxy-3-methyl-2-pentyl Maleimide, N-1-hydroxy-3-methyl-3-pentylmaleimide, N-1-hydroxy-3-methyl-4-pentylmer Reimide, N-1-hydroxy-3-methyl-5-pentylmaleimide, N-3-hydroxy-3-methyl-1-pentylmaleimide, N-3-hydroxy-3-methyl-2-pentylmaleimide, N-1 -Hydroxy-3-ethyl-4-butylmaleimide, N-2-hydroxy-3-ethyl-4-butylmaleimide, N-2-hydroxy-2-ethyl-1-butylmaleimide, N-4-hydroxy-3- Ethyl-1-butylmaleimide, N-4-hydroxy-3-ethyl-2-butylmaleimide, N-4-hydroxy-3-ethyl-3-butylmaleimide, N-4-hydroxy-3-ethyl-4-butyl Maleimide, N-1-hydroxy-2,3-dimethyl-1-butylmaleimide, N-1-hydroxy-2,3-dimethyl-2-butylmer Imido, N-1-hydroxy-2,3-dimethyl-3-butylmaleimide, N-1-hydroxy-2,3-dimethyl-4-butylmaleimide, N-2-hydroxy-2,3-dimethyl-1- Butylmaleimide, N-2-hydroxy-2,3-dimethyl-3-butylmaleimide, N-2-hydroxy-2,3-dimethyl-4-butylmaleimide, N-1-hydroxy-2,2-dimethyl-1 -Butylmaleimide, N-1-hydroxy-2,2-dimethyl-3-butylmaleimide, N-1-hydroxy-2,2-dimethyl-4-butylmaleimide, N-2-hydroxy-3,3-dimethyl- 1-butylmaleimide, N-2-hydroxy-3,3-dimethyl-2-butylmaleimide, N-2-hydroxy-3,3-dimethyl-4-butylmaleimide N-1-hydroxy-3,3-dimethyl-1-butylmaleimide, N-1-hydroxy-3,3-dimethyl-2-butylmaleimide, N-1-hydroxy-3,3-dimethyl-4-butyl Alkylmaleimides such as maleimide; N-cyclopropylmaleimide, N-cyclobutylmaleimide, N-cyclopentylmaleimide, N-cyclohexylmaleimide, N-cycloheptylmaleimide, N-cyclooctylmaleimide, N-2-methylcyclohexylmaleimide, N- Cycloalkylmaleimides such as 2-ethylcyclohexylmaleimide and N-2-chlorocyclohexylmaleimide; aryls such as N-phenylmaleimide, N-2-methylphenylmaleimide, N-2-ethylphenylmaleimide and N-2-chlorophenylmaleimide Maleimide; and the like.

  Among these, it is preferable to use at least one selected from (meth) acrylic esters which are aliphatic esters of C8 to C23. Since the (meth) acrylic copolymer obtained by copolymerizing such monomer components has a low glass transition temperature, the low-temperature sticking property and peelability can be improved.

  For the synthesis of the component (A), radical polymerization can be used. Examples of the radical polymerization method include a solution polymerization method, a suspension polymerization method, and a bulk polymerization method. Among these, the synthesis using the solution polymerization method is such that the resin solution obtained by the polymerization can be blended as it is in addition to the economic efficiency, the high reaction rate, the ease of polymerization control, etc. This is preferable because of its simplicity.

  The (A) component (meth) acrylic copolymer preferably has a reactive functional group. Examples of the reactive functional group include at least one selected from the group consisting of a (meth) acryloyl group, a vinyl group, an allyl group, a glycidyl group, an alicyclic epoxy group, and an oxetanyl group. Among these, a (meth) acryloyl group is more preferable from the viewpoint of reactivity. By having such a functional group in the component (A), the functional group can react by irradiation with ultraviolet rays, an electron beam, and / or visible light, and thus the photosensitivity can be imparted to the resin composition.

  The method for imparting the reactive functional group is not particularly limited. For example, when synthesizing the above (meth) acrylic copolymer, a functional group capable of undergoing an addition reaction (for example, a hydroxyl group, a carboxyl group, an anhydrous maleic group). , A glycidyl group, an amino group, etc.) as a copolymerization component, a functional group capable of addition reaction is introduced into the (meth) acrylic copolymer, at least one ethylenically unsaturated group, A compound having a functional group (for example, an epoxy group, an oxetanyl group, an isocyanate group, a hydroxyl group, a carboxyl group, etc.) can be subjected to an addition reaction to give a reactive functional group to the (meth) acrylic copolymer. . In addition, as a method for introducing a reactive functional group into the component (A), a monomer having a reactive functional group can be used as a polymerization component.

  There is no restriction | limiting in particular as such a compound, Glycidyl (meth) acrylate, (alpha) -ethyl glycidyl (meth) acrylate, (alpha) -propyl glycidyl (meth) acrylate, (alpha) -butyl glycidyl (meth) acrylate, 2-methyl glycidyl (meta) ) Acrylate, 2-ethylglycidyl (meth) acrylate, 2-propylglycidyl (meth) acrylate, 3,4-epoxybutyl (meth) acrylate, 3,4-epoxyheptyl (meth) acrylate, α-ethyl-6,7 -Ethylenically unsaturated groups such as epoxy heptyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether Compounds having an epoxy group; (2-ethyl-2-oxetanyl) methyl (meth) acrylate, (2-methyl-2-oxetanyl) methyl (meth) acrylate, 2- (2-ethyl-2-oxetanyl) ethyl (meta ) Acrylate, 2- (2-methyl-2-oxetanyl) ethyl (meth) acrylate, 3- (2-ethyl-2-oxetanyl) propyl (meth) acrylate, 3- (2-methyl-2-oxetanyl) propyl ( Compounds having an ethylenically unsaturated group such as (meth) acrylate and an oxetanyl group; ethylenic groups such as methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloyloxyethyl isocyanate, m-isopropenyl-α, α-dimethylbenzyl isocyanate Unsaturated groups and iso Compounds having an ate group; ethylenic groups such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate and 2-hydroxybutyl (meth) acrylate Compounds having a saturated group and a hydroxyl group; (meth) acrylic acid, crotonic acid, cinnamic acid, succinic acid (2- (meth) acryloyloxyethyl), 2-phthaloylethyl (meth) acrylate, 2-tetrahydrophthalo Ethylenically unsaturated groups such as ylethyl (meth) acrylate, 2-hexahydrophthaloylethyl (meth) acrylate, ω-carboxy-polycaprolactone mono (meth) acrylate, 3-vinylbenzoic acid, 4-vinylbenzoic acid and the like A compound having a carboxyl group; .

  Among these, from the viewpoint of cost and / or reactivity, 2-methacryloyloxyethyl isocyanate, glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, ethyl isocyanate (meth) acrylate, 2-hydroxyethyl Using (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, (meth) acrylic acid, crotonic acid, 2-hexahydrophthaloylethyl (meth) acrylate, etc. ) It is preferable to react with an acrylic copolymer to give a reactive functional group. These compounds can be used alone or in combination of two or more. If necessary, a polymerization inhibitor may be used for the purpose of adding a catalyst for promoting the addition reaction or avoiding the cleavage of the double bond during the reaction. The component (A) is preferably a reaction product of a (meth) acrylic resin having a hydroxy group and at least one selected from 2-methacryloyloxyethyl isocyanate and 2-acryloyloxyethyl isocyanate.

  Examples of the solvent used for the solution polymerization include ketone organic solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ester organic solvents such as ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, and γ-butyrolactone; ethylene Polyhydric alcohol alkyl ether organic solvents such as glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, propylene glycol dimethyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether; ethylene Glycol monomethyl ether acetate, propire Glycol monomethyl ether acetate, diethylene polyhydric alcohol alkyl ether acetates such as monomethyl ether acetate; N, N- dimethylformamide, N, N- dimethylacetamide, an amide-based organic solvents such as N- methylpyrrolidone. These organic solvents can be used individually by 1 type or in combination of 2 or more types.

  The concentration of the (meth) acrylic monomer mixture at the start of solution polymerization is preferably 20 to 70% by mass, and more preferably 30 to 50% by mass. When the concentration of the (meth) acrylic monomer mixture is 30% by mass or more, it becomes easy to increase the molecular weight.

  (A) It is preferable that the glass transition temperature of a component is -50-50 degreeC. If the glass transition temperature is −50 ° C. or higher, it becomes easy to prevent the fluidity and tackiness of the temporary protective resin composition from becoming too high. Is better. On the other hand, when the glass transition temperature is 50 ° C. or lower, it becomes easy to ensure the fluidity and adhesiveness of the temporary protective resin composition. The embedding property of the projections and depressions (projections such as bumps) can be improved. In this respect, the glass transition temperature of the component (A) is more preferably −40 to 40 ° C., and further preferably −30 to 30 ° C. The glass transition temperature of component (A) is the midpoint glass transition temperature measured using DSC. Specifically, it is a midpoint glass transition temperature calculated by a method based on JIS K 7121 by measuring a change in calorie under conditions of a temperature rising rate of 10 ° C./min and a measurement temperature: −80 to 80 ° C.

  The weight average molecular weight of the component (A) is preferably 100,000 to 1,000,000. If the weight average molecular weight is 100,000 or more, the heat resistance and peelability of the temporary protection resin film formed from the temporary protection resin composition can be improved, and if it is 1000000 or less, the temporary protection resin film is used. The film formability and fluidity of the resin composition can be made better, and the unevenness embedding property on the surface of the workpiece can be made better. In this respect, the weight average molecular weight is more preferably 150,000 or more, further preferably 250,000 or more, more preferably 800,000 or less, and further preferably 500,000 or less. The weight average molecular weight is a polystyrene equivalent value using a standard polystyrene calibration curve by gel permeation chromatography (GPC).

<(B) (Meth) acrylic monomer>
By using the (meth) acrylic monomer, it is possible to suppress the generation of voids when embedding irregularities, and to improve the machinability during the dicing process.

  As the component (B) according to this embodiment, any of monofunctional (meth) acrylate, bifunctional (meth) acrylate, and trifunctional or higher polyfunctional (meth) acrylate can be used, and there is no particular limitation. Things can be used.

  As monofunctional (meth) acrylate, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, sec-butyl (Meth) acrylate, tert-butyl (meth) acrylate, butoxyethyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, heptyl (meth) acrylate, octyl heptyl (meth) ) Acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, lauryl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl ( Acrylate), pentadecyl (meth) acrylate, hexadecyl (meth) acrylate, stearyl (meth) acrylate, behenyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-chloro- 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, ethoxypolyethylene glycol (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, ethoxypolypropylene glycol (meth) acrylate, Aliphatic (meth) acrylates such as mono (2- (meth) acryloyloxyethyl) succinate; cyclopentyl (meth) acrylate , Cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, isobornyl (meth) acrylate, mono (2- (meth) acryloyloxyethyl) tetrahydrophthalate, Alicyclic (meth) acrylates such as mono (2- (meth) acryloyloxyethyl) hexahydrophthalate; phenyl (meth) acrylate, benzyl (meth) acrylate, o-biphenyl (meth) acrylate, 1-naphthyl (meth) Acrylate, 2-naphthyl (meth) acrylate, phenoxyethyl (meth) acrylate, p-cumylphenoxyethyl (meth) acrylate, o-phenylphenoxyethyl (meth) acrylate, 1-naphthoxy Siethyl (meth) acrylate, 2-naphthoxyethyl (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, nonylphenoxypolyethylene glycol (meth) acrylate, phenoxypolypropylene glycol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) Acrylate, 2-hydroxy-3- (o-phenylphenoxy) propyl (meth) acrylate, 2-hydroxy-3- (1-naphthoxy) propyl (meth) acrylate, 2-hydroxy-3- (2-naphthoxy) propyl ( Aromatic (meth) acrylates such as meth) acrylate; 2-tetrahydrofurfuryl (meth) acrylate, N- (meth) acryloyloxyethyl hexahydrophthalimide, 2- (meth) Acryloyl heterocyclic such oxyethyl -N- carbazole (meth) acrylate, these caprolactone modified products, and the like.

  Examples of the bifunctional (meth) acrylate include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, and polyethylene glycol di (meth). Acrylate, propylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, tetrapropylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, ethoxylated polypropylene glycol di (Meth) acrylate, 1,3-butanediol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, neopent Glycol di (meth) acrylate, 3-methyl-1,5-pentanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 2-butyl-2-ethyl-1,3-propanediol di (Meth) acrylate, 1,9-nonanediol di (meth) acrylate, 1,10-decanediol di (meth) acrylate, glycerin di (meth) acrylate, tricyclodecane dimethanol (meth) acrylate, ethoxylated 2- Aliphatic (meth) acrylates such as methyl-1,3-propanediol di (meth) acrylate; cyclohexanedimethanol (meth) acrylate, ethoxylated cyclohexanedimethanol (meth) acrylate, propoxylated cyclohexanedimethanol (meth) acrylate, Etoki Propoxylated cyclohexanedimethanol (meth) acrylate, tricyclodecane dimethanol (meth) acrylate, ethoxylated tricyclodecane dimethanol (meth) acrylate, propoxylated tricyclodecane dimethanol (meth) acrylate, ethoxylated propoxylated tri Cyclodecane dimethanol (meth) acrylate, ethoxylated hydrogenated bisphenol A di (meth) acrylate, propoxylated hydrogenated bisphenol A di (meth) acrylate, ethoxylated propoxylated hydrogenated bisphenol A di (meth) acrylate, ethoxylated water Alicyclic such as bisphenol F di (meth) acrylate, propoxylated hydrogenated bisphenol F di (meth) acrylate, ethoxylated propoxy hydrogenated bisphenol F di (meth) acrylate (Meth) acrylate; ethoxylated bisphenol A di (meth) acrylate, propoxylated bisphenol A di (meth) acrylate, ethoxylated propoxylated bisphenol A di (meth) acrylate, ethoxylated bisphenol F di (meth) acrylate, propoxylated bisphenol F di (meth) acrylate, ethoxylated propoxylated bisphenol F di (meth) acrylate, ethoxylated bisphenol AF di (meth) acrylate, propoxylated bisphenol AF di (meth) acrylate, ethoxylated propoxylated bisphenol AF di (meth) acrylate , Ethoxylated fluorene-type di (meth) acrylate, propoxylated fluorene-type di (meth) acrylate, ethoxylated propoxylated fluorene-type di (meth) acrylate Aromatic (meth) acrylates such as ethoxylated isocyanuric acid di (meth) acrylate, propoxylated isocyanuric acid di (meth) acrylate, ethoxylated propoxylated isocyanuric acid di (meth) acrylate, etc. These modified caprolactones; aliphatic (meth) acrylates such as neopentyl glycol type epoxy (meth) acrylate; cyclohexanedimethanol type epoxy (meth) acrylate, hydrogenated bisphenol A type epoxy (meth) acrylate, hydrogenated bisphenol F Type epoxy (meth) acrylate and other cycloaliphatic (meth) acrylates; resorcinol type epoxy (meth) acrylate, bisphenol A type epoxy (meth) acrylate, bisphenol F type epoxy (meth) acrylic Over DOO, bisphenol AF type epoxy (meth) acrylate, aromatic epoxy (meth) acrylates such as fluorene epoxy (meth) acrylate, urethane (meth) acrylate, and the like. Among these, it is preferable to use urethane (meth) acrylate.

  Examples of trifunctional or higher polyfunctional (meth) acrylates include trimethylolpropane tri (meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, propoxylated trimethylolpropane tri (meth) acrylate, and ethoxylated propoxylated trimethylol. Propane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, ethoxylated pentaerythritol tri (meth) acrylate, propoxylated pentaerythritol tri (meth) acrylate, ethoxylated propoxylated pentaerythritol tri (meth) acrylate, pentaerythritol tetra (Meth) acrylate, ethoxylated pentaerythritol tetra (meth) acrylate, propoxylated pentaerythritol tetra (meth) Aliphatic (meth) acrylates such as acrylate, ethoxylated propoxylated pentaerythritol tetra (meth) acrylate, ditrimethylolpropane tetraacrylate, dipentaerythritol hexa (meth) acrylate; ethoxylated isocyanuric acid tri (meth) acrylate, propoxylated isocyanuric Heterocyclic (meth) acrylates such as acid tri (meth) acrylate and ethoxylated propoxylated isocyanuric acid tri (meth) acrylate; modified caprolactone thereof; phenol novolac type epoxy (meth) acrylate, cresol novolak type epoxy (meth) Aromatic epoxy (meth) acrylates such as acrylate, urethane (meth) acrylate, and the like. Among these, aliphatic (meth) acrylates such as dipentaerythritol hexa (meth) acrylate are preferable.

  These compounds can be used individually or in combination of 2 or more types, and also can be used in combination with other polymerizable compounds.

  (B) As a compounding quantity (content in a resin composition) of a component, it is preferable that it is 30 mass parts or less with respect to 100 mass parts of said (A) component, and it is more preferable that it is 20 mass parts or less. preferable. When the blending amount of component (B) is within the above range, it is easy to achieve high elasticity after light irradiation and suppression of elongation at break. Therefore, it is more preferable to select the component (B) having a high elastic modulus after photocuring.

<(C) Photoradical polymerization initiator>
The component (C) is not particularly limited as long as the polymerization is initiated by irradiation with actinic rays such as ultraviolet rays and visible rays.

  There is no restriction | limiting in particular as (C) component, For example, benzoinketals, such as 2, 2- dimethoxy- 1, 2- diphenyl ethane- 1-one; 1-hydroxy cyclohexyl phenyl ketone, 2-hydroxy-2-methyl- 1-phenylpropan-1-one, 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1- {4 [4- Α-hydroxy ketones such as (2-hydroxy-2-methylpropionyl) benzyl] phenyl} -2-methylpropan-1-one; methyl phenylglyoxylate, ethyl phenylglyoxylate, 2- (2-hydroxyethoxy) ) Ethyl, 2- (2-oxo-2-phenylacetoxyethoxy) ethyl oxyphenylacetate, etc. Glyoxyester; 2-benzyl-2-dimethylamino-1- (4-morpholin-4-ylphenyl) -butan-1-one, 2-dimethylamino-2- (4-methylbenzyl) -1- ( 4-morpholin-4-ylphenyl) -butan-1-one, 1,2-methyl-1- [4- (methylthio) phenyl]-(4-morpholin) -2-ylpropan-1-one, etc. Α-aminoketone of 1,2-octanedione, 1- [4- (phenylthio), 2- (O-benzoyloxime)], ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H -Carbazol-3-yl], oxime esters such as 1- (O-acetyloxime); bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, bis (2,6-dimethoxy) Nzoyl) -2,4,4-trimethylpentylphosphine oxide, phosphine oxides such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide; 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (O-chlorophenyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4, 2,4,5-triarylimidazole dimers such as 5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer; benzophenone, N, N, N ′, N′-tetramethyl-4,4′-diaminobenzophenone, N, N, N ′, N′-tetraethyl-4,4 Benzophenone compounds such as -diaminobenzophenone and 4-methoxy-4'-dimethylaminobenzophenone; 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benz Anthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-methyl-1,4-naphthoquinone, 2 Quinone compounds such as 1,3-dimethylanthraquinone; benzoin ethers such as benzoin methyl ether, benzoin ethyl ether and benzoin phenyl ether; benzoin, methyl benzoin and ethyl benzoy Benzoin compounds such as benzyl; benzyl compounds such as benzyl dimethyl ketal; acridine compounds such as 9-phenylacridine and 1,7-bis (9,9′-acridinylheptane): N-phenylglycine, coumarin and the like .

  The above radical photopolymerization initiators can be used alone or in combination of two or more. Furthermore, it can also be used in combination with a suitable sensitizer.

  (C) As a compounding quantity of a component, it is preferable that it is 0.05-10 mass parts with respect to 100 mass parts of said (A) component. When the blending amount of the component (C) is within the above range, the reactivity of the component (A) and the component (B) can be sufficiently obtained when sufficient light irradiation is performed.

<(D) Silicone compound>
By properly selecting and blending a (meth) acrylic copolymer having a reactive functional group and a silicone compound, the releasability without prior application of the release component is improved and the generation of residues after peeling is suppressed. Can do.

  The component (D) may be any compound having a siloxane moiety, for example, an organopolysiloxane having no reactive functional group, an organopolysiloxane having a reactive functional group, a silicone-modified polyimide resin, and a silicone-modified polyamideimide resin. , Silicone-modified alkyd resin, straight silicone oil, non-reactive modified silicone oil, reactive modified silicone oil, and the like. Among these, a silicone resin having a reactive functional group is preferable from the viewpoint of the elastic modulus, peelability, and compatibility with the component (A) of the temporary protective resin film formed from the temporary protective resin composition. Examples of the reactive functional group include an epoxy group, an oxetanyl group, a carboxyl group, a hydroxy group, an amide group, an amino group, an acryloyl group, and among these, an acryloyl group is more preferable. These compounds can be used alone or in combination of two or more.

  As a compounding quantity of (D) component, it is preferable that it is 0.05-30 mass parts with respect to 100 mass parts of (A) component. (D) If the compounding quantity of a component is 0.05 mass part or more, the peelability of the temporary protection resin film formed from the temporary protection resin composition can be made favorable, and if it is 30 mass parts or less. For example, it can be firmly attached to the workpiece. From this viewpoint, the blending amount of the component (D) is more preferably 0.1 to 20 parts by mass, and further preferably 0.5 to 15 parts by mass with respect to 100 parts by mass of the component (A). preferable.

  The temporary protective resin composition according to the present embodiment can further contain an inorganic filler from the viewpoint of improving heat resistance and machinability.

  Examples of the inorganic filler include insulating fine particles and whiskers. Examples of the insulating fine particles include glass, silica, alumina, titanium oxide, carbon black, mica, and boron nitride. Among these, silica, alumina, titanium oxide, and boron nitride are preferable from the viewpoint of handleability, and silica, alumina, and boron nitride are more preferable. Examples of whiskers include aluminum borate, aluminum titanate, zinc oxide, calcium silicate, magnesium sulfate, and boron nitride. These compounds can be used individually by 1 type or in combination of 2 or more types.

  The inorganic filler preferably has an organic group on the surface. When the surface of the inorganic filler is modified with an organic group, the dispersibility in the organic solvent when preparing the temporary protective resin composition, and the temporary protective resin film formed from the temporary protective resin composition It becomes easy to improve adhesion and heat resistance.

  As an average particle diameter of an inorganic filler, 0.01-10 micrometers is preferable. When the average particle size is 0.01 μm or more, the fluidity of the temporary protective resin film formed from the temporary protective resin composition can be secured, so that the embedding property of protrusions such as bumps on the surface of the workpiece is improved. It can be made favorable, and it can suppress that an inorganic filler settles in the resin composition for temporary protection as it is 10 micrometers or less. From the same viewpoint, the average particle size of the inorganic filler is more preferably 0.05 to 5 μm, and particularly preferably 0.1 to 3 μm.

  It is preferable that the compounding quantity of an inorganic filler is 1-100 mass parts with respect to 100 mass parts of (A) component. If the blending amount is 1 part by mass or more, the heat resistance and machinability of the temporary protection resin film formed from the temporary protection resin composition can be improved, and if it is 100 parts by mass or less, temporary protection is achieved. Since the fluidity of the temporary protective resin film formed from the resin composition can be ensured, the embedding property of protrusions such as bumps on the surface of the workpiece can be improved. From the same viewpoint, the compounding amount of the inorganic filler is more preferably 3 to 70 parts by mass, and particularly preferably 5 to 50 parts by mass with respect to 100 parts by mass of the component (A).

  The temporary protective resin composition according to this embodiment may further contain an organic filler. Examples of the organic filler include carbon, rubber filler, silicone fine particles, polyamide fine particles, and polyimide fine particles. 50 mass parts or less are preferable with respect to 100 mass parts of (A) component, as for the compounding quantity of an organic filler, 40 mass parts or less are more preferable, and 30 mass parts or less are still more preferable.

  The temporary protective resin composition according to the present embodiment further includes so-called additives such as an antioxidant, an anti-yellowing agent, a colorant, a plasticizer, a stabilizer, and the like, if necessary. You may add in the ratio which does not give.

  The temporary protection resin composition according to this embodiment may be further diluted with an organic solvent as necessary. The organic solvent is not particularly limited as long as it can dissolve the resin composition. For example, ketone organic solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ethyl acetate, butyl acetate, methyl lactate, Ester-based organic solvents such as ethyl lactate and γ-butyrolactone; ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, propylene glycol dimethyl ether, diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, Polyhydric alcohol alkyl ether organic solvents such as diethylene glycol dimethyl ether; ethylene glycol Polyhydric alcohol alkyl ether acetates such as rumonomethyl ether acetate, propylene glycol monomethyl ether acetate and diethylene glycol monomethyl ether acetate; and amide organic solvents such as N, N-dimethylformamide, N, N-dimethylacetamide and N-methylpyrrolidone It is done. These organic solvents can be used individually by 1 type or in combination of 2 or more types.

  The solid content concentration of the temporary protective resin composition according to this embodiment is preferably 10 to 80% by mass.

  Particularly suitable aspects of the temporary protective resin composition according to this embodiment include (A) a (meth) acrylic copolymer having a reactive functional group, (B) a (meth) acrylic monomer, and (C) a photoradical. A composition containing a polymerization start and (D) a silicone compound, and from the viewpoint of obtaining an appropriate elastic modulus and releasability after light irradiation, the composition has (A) a reactive functional group ( The (meth) acrylic copolymer has a weight average molecular weight of 10,000 to 1,000,000 and a glass transition temperature of −50 ° C. to 50 ° C., and the reactive functional group is a (meth) acryloyl group, a vinyl group, an allyl group, a glycidyl group, It is at least one selected from the group consisting of an alicyclic epoxy group and an oxetanyl group, and (B) the (meth) acrylic monomer with respect to 100 parts by mass of the (A) (meth) acrylic copolymer. The total amount is 30 parts by mass or less, (C) the compounding amount at the start of radical photopolymerization is 0.05 to 10 parts by mass, and (D) the compounding amount of the silicone compound is 0.05 to 30 parts by mass. A composition.

<Temporary protective resin film (temporary protective material)>
The temporary protective resin film is obtained by forming the temporary protective resin composition containing the above-described components into a film shape. Specifically, a temporary protective resin film can be obtained by mixing and kneading the composition in an organic solvent to prepare a varnish, and applying the prepared varnish onto a base film and drying by heating. it can. The temporary protective resin film (temporary protective material) can have an elastic modulus before and after curing, an elongation at break after curing, and the like of the temporary protective resin composition.

  The above mixing and kneading can be performed by using a normal stirrer, a raking machine, a three-roller, a ball mill, or other disperser and appropriately combining them. The heat drying is not particularly limited as long as the organic solvent used is sufficiently volatilized, but can be usually performed by heating at 60 to 200 ° C. for 0.1 to 90 minutes.

  The organic solvent for preparing the varnish is not particularly limited as long as it can uniformly dissolve, knead or disperse the above components, and a conventionally known one can be used. It is preferable to use ethyl acetate, cyclohexanone, etc. in terms of fast drying speed and low price.

  The base film is not particularly limited as long as it transmits light during light irradiation. For example, a polyester film (polyethylene terephthalate (PET) film or the like), a polypropylene film (biaxially stretched polypropylene (OPP) film or the like), Examples thereof include a polyimide film, a polyetherimide film, a polyether naphthalate film, and a methylpentene film.

  The thickness of the temporary protective resin film is preferably equal to or less than the unevenness of the workpiece, preferably 5 to 300 μm, from the viewpoint of sufficiently embedding the unevenness of the workpiece surface. In addition, when the volume of a convex part is large, even if the thickness of the resin film for temporary protection is thinner than the height of a convex part, an unevenness | corrugation can fully be embedded.

  In addition, the thing of the state in which the resin film for temporary protection was provided on base materials films, such as a polyester film, can be called the resin film sheet for temporary protection. That is, the temporary protective resin film sheet can include a base film and the temporary protective resin film on the base film.

  As mentioned above, although the suitable embodiment of the manufacturing method of the electronic component which concerns on this invention, the resin composition for temporary protection used by the said method, and the resin film for temporary protection was described, this invention is not necessarily limited to embodiment mentioned above. However, it may be changed as appropriate without departing from the spirit of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to the following examples.

(Examples 1-5 and Comparative Examples 1-3)
Each component was mix | blended with the composition ratio (unit: mass part) shown in Table 1 and Table 2, and the resin composition for temporary protection of an Example and a comparative example was prepared. In addition, each component shown in Table 1 and Table 2 is as follows.

[(Meth) acrylic copolymer having reactive functional group]
To an autoclave with a capacity of 4000 ml equipped with a three-one motor, a stirring blade and a nitrogen introduction tube, 1000 g of ethyl acetate, 650 g of 2-ethylhexyl acrylate, 350 g of 2-hydroxyethyl acrylate, and 3.0 g of azobisisobutyronitrile were blended uniformly. Stir until. Thereafter, bubbling was performed at a flow rate of 100 ml / min for 60 minutes to degas dissolved oxygen in the system. The temperature was raised to 60 ° C. over 1 hour, and the temperature was raised and polymerized for 4 hours. Thereafter, the temperature was raised to 90 ° C. over 1 hour, further maintained at 90 ° C. for 1 hour, and then cooled to room temperature.

  Next, 1000 g of ethyl acetate was added to the autoclave and stirred for dilution. After adding 0.1 g of methoquinone as a polymerization inhibitor and 0.05 g of dioctyltin dilaurate as a urethanization catalyst, 100 g of 2-methacryloxyethyl isocyanate (Karenz MOI: product name, Showa Denko KK) was added. The mixture was reacted at 70 ° C. for 6 hours and then cooled to room temperature. Thereafter, ethyl acetate was added to adjust the non-volatile content in the acrylic resin solution to 35% by mass to obtain an acrylic resin solution having a (meth) acryloyl group as a reactive functional group.

(Measurement of weight average molecular weight)
The weight average molecular weight (standard polystyrene conversion) of the (meth) acrylic copolymer having a reactive functional group was measured using an HLC-8320GPC (product name, manufactured by Tosoh Corporation), an eluent flow rate of 1 mL / min, and a column temperature of 40. As a result of measurement under the condition of ° C, it was 42 × 10 ⁴ . Tetrahydrofuran was used as the eluent, and Gelpack GL-A150-S / GL-A160-S manufactured by Hitachi Chemical Co., Ltd. was used as the column.

(Measurement of glass transition temperature)
The glass transition temperature of the (meth) acrylic copolymer having a reactive functional group was measured using DSC8230 (product name, manufactured by Rigaku Corporation) at a rate of temperature increase of 10 ° C./min, measurement temperature: −80 to 80 ° C. It was -47 degreeC as a result of measuring on conditions of this. In addition, the glass transition temperature in this case is the intermediate point glass transition temperature calculated by the method based on JISK7121 from the calorie | heat amount change.

[(Meth) acrylic monomer]
U-6LPA (product name, Shin-Nakamura Chemical Co., Ltd., urethane acrylate).
U-200PA (product name, manufactured by Shin-Nakamura Chemical Co., Ltd., urethane acrylate).

[Photo radical polymerization initiator]
Irgacure 369 (product name, manufactured by BASF Corporation, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1).

[Silicone compound]
BYK-UV 3500 (product name, manufactured by Big Chemie Japan, Inc., acryloyl group-containing polyether-modified polydimethylsiloxane).

  Next, cyclohexanone was further added to the obtained temporary protective resin composition and mixed with stirring. Stirring was performed until each component became uniform to prepare a temporary protective resin composition varnish. The prepared varnish was filtered through a 100 mesh filter and vacuum degassed. The varnish after vacuum defoaming was applied onto a polyethylene terephthalate (PET) film that was a base film and was subjected to a release treatment with a thickness of 38 μm. The applied varnish was heat-dried in two stages of 90 ° C. for 5 minutes, followed by 140 ° C. for 5 minutes. Thus, a temporary protective resin film (temporary protective material) having a thickness of 200 μm formed on the base PET film was obtained.

<Evaluation of various physical properties>
Various physical properties of the obtained temporary protective resin film were evaluated. The evaluation results are shown in Tables 3 and 4.

[25 ° C elastic modulus before and after curing]
The 25 ° C. elastic modulus before and after curing of the temporary protective resin film was evaluated by the following method.
After removing the base PET film from the temporary protective resin film (thickness 200 μm) obtained above, the sample was cut into 4 mm width and 30 mm length to obtain a sample. This is set in a dynamic viscoelastic device Rheogel-E4000 (product name, manufactured by UMB Co., Ltd.), applied with a tensile load, measured at a frequency of 10 Hz and a heating rate of 3 ° C./min, and a measured value at 25 ° C. Recorded as the pre-cure modulus. On the other hand, using a UV-330 HQP-2 type exposure machine (product name, manufactured by Oak Manufacturing Co., Ltd.), UV exposure is applied to the temporary protective resin film with an exposure amount of 500 mJ / cm ² to cure the temporary protective resin film. I let you. The cured temporary protective resin film was subjected to the same test as described above, and the measured value at 25 ° C. was recorded as the elastic modulus after curing.

[25 ° C breaking elongation after curing]
Using a UV-330 HQP-2 type exposure machine (product name, manufactured by Oak Manufacturing Co., Ltd.), UV exposure was performed on the temporary protective resin film with an exposure amount of 500 mJ / cm ² to cure the temporary protective resin film. . A sample was cut out from the cured temporary protective resin film with a size of 1 cm width and 8 cm length. Using a Shimadzu autograph "AGS-1000G", the distance between the chucks was 50mm and the pulling speed was 300mm / min. Was recorded as the elongation at break after curing.

[Step embedding]
The step embedding property when the temporary protective resin film was attached to the workpiece was evaluated by the following method.
Grooves having a width of 40 μm and a depth of 40 μm were formed at intervals of 100 μm on the surface of a silicon mirror wafer (6 inches) having a thickness of 625 μm by blade dicing. Place on the stage of the vacuum laminator LM-50X50-S (product name, manufactured by NPC Corporation) so that the step of the silicon mirror wafer with steps formed in this way becomes the upper surface, while temporarily protecting resin The film was placed so as to face the side of the stepped silicon mirror wafer, and these were vacuum laminated under the conditions of atmospheric pressure 1.5 hPa, laminating temperature 80 ° C., laminating pressure 0.1 MPa, and holding time 2 minutes. Then, the state of the level | step difference embedding by the resin film for temporary protection was confirmed using the ultrasonic microscope Insight-300 (product name, Insight Co., Ltd. product). Specifically, a void portion was identified by performing color tone correction and two-gradation on an image photographed with an ultrasonic microscope using image processing software Adobe Photoshop (registered trademark). And the ratio (%) which a void part occupies was computed with the histogram. This operation was carried out at five different places, the average value was taken, and step embedding was evaluated according to the following criteria.
○: The void ratio was less than 5%.
X: The void ratio was 5% or more.

[Dicing]
The dicing property of the temporary protective resin film was evaluated by the following method.
A 625 μm thick silicon mirror wafer (6 inches) is used as the work piece, and the temporary protective resin film obtained above is attached thereto by roll lamination at 40 ° C., thereby providing a temporary protective resin film. A silicon mirror wafer was obtained. Then, using a UV-330 HQP-2 type exposure machine (product name, manufactured by Oak Manufacturing Co., Ltd.), the exposure amount is set to 500 mJ / cm ² and UV irradiation is performed on the temporary protection resin film from the temporary protection resin film side. went. Then, the base PET film is peeled off from the temporary protective resin film and attached to a dicing tape UC-353EP-110 (product name, manufactured by Furukawa Electric Co., Ltd.), and a full automatic dicing saw DFD-6361 (product name, Dicing was performed using DISCO Corporation to obtain a chip. The chip size was 10 mm × 10 mm. In addition, ZH05-SD4000-N1-70-BB (product name, manufactured by DISCO Corporation) was used for the blade, and the conditions were a blade height of 90 μm, a blade rotation speed of 40000 rpm, and a dicing speed of 55 mm / sec. The cutting method was single cut. The cross section of the temporary protective resin film in the chip after dicing was observed using a digital microscope VHX-S50 (product name, manufactured by Keyence Corporation). Observation was made at five different locations, and dicing properties were evaluated according to the following criteria.
○: No burrs of 5 μm or more appeared from the cross section.
X: Burr | flash of 5 micrometers or more appeared from the cross section.

[Peelability]
The peelability of the temporary protective resin film from the workpiece was evaluated by the following method.
A 10 mm × 10 mm chip produced by the dicing evaluation was transported and pasted onto a polyimide tape that is a heat-resistant adhesive tape. Then, in order to peel off the workpiece from the cured temporary protective resin film, a die bonder BEST-02 (product name, manufactured by Canon Machinery Co., Ltd.) is used. The collet size is 9 mm, the number of pins is 13 pins, and the pushing speed is 20 mm / sec. Pickup was carried out under conditions. Pickup was performed for 50 chips. The pickup success rate at this time was evaluated as peelability according to the following criteria.
○: Pickup success rate at a pin height of 300 nm was 98% or more.
X: Pickup success rate at a pin height of 300 nm was less than 98%.

[Electromagnetic shield formability]
The electromagnetic shield forming property (electromagnetic shielding forming property) of the workpiece was evaluated by the following method.
First, a 10 mm × 10 mm chip produced by dicing evaluation was transported and pasted onto a polyimide tape that is a heat-resistant adhesive tape. And about 1.8 micrometer copper was formed into a film on the conditions of temperature 60-150 degreeC and pressure 7 * 10 < ^-1 > Pa using sputtering device SDH series (product name, ULVAC, Inc.) with respect to a to-be-processed object. Thus, an electromagnetic shield was formed. Thereafter, in the same manner as in the case of peelability evaluation, the workpiece is peeled from the cured temporary protective resin film using a die bonder BEST-02 (product name, manufactured by Canon Machinery Co., Ltd.). A workpiece with a formed was obtained. The obtained workpiece was observed with a microscope, and the electromagnetic shield forming property was evaluated according to the following criteria.
○: Copper was formed on the entire surface other than the surface protected by the temporary protective resin film.
X: Copper was not formed on the entire surface other than the surface protected by the temporary protective resin film, or copper was also formed on the surface protected by the temporary protective resin film.

  As is clear from the results shown in Table 3 and Table 4, it was confirmed that in the examples, electronic components having electromagnetic shields at desired portions were finally obtained while various characteristics in the process were good. .

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2 ... Convex part, 10 ... Workpiece, 20, 20c ... Temporary protective material, 30 ... Base film, 40 ... Dicing tape, 50 ... Heat-resistant adhesive tape, M ... Metal film, C ... Collet.

Claims (14)

A method of manufacturing an electronic component having an electromagnetic shield,
A pasting step of attaching a temporary protective material to a workpiece having irregularities on the surface;
A photocuring step of curing the temporary protective material by light irradiation;
A dicing step for separating the workpiece and the temporary protection material;
A shielding step of forming a metal film on a portion of the workpiece that has been separated into pieces and the temporary protective material is not attached;
A peeling step of peeling the workpiece and the temporary protective material on which a metal film is formed,
The temporary protective material has an elastic modulus at 25 ° C. of 1.5 MPa or less, an exposure of 500 mJ / cm ² or more, an elastic modulus at 25 ° C. after light irradiation of 3 to 100 MPa, and an elongation at break of 100. The manufacturing method formed from the resin composition for temporary protection which is% or less.   The resin composition includes (A) a (meth) acrylic copolymer having a reactive functional group, and the (A) (meth) acrylic copolymer having a reactive functional group has a weight average molecular weight of 10,000 to 1,000,000 and The manufacturing method of Claim 1 which has a glass transition temperature of -50 degreeC-50 degreeC.   The production method according to claim 2, wherein the reactive functional group is at least one selected from the group consisting of a (meth) acryloyl group, a vinyl group, an allyl group, a glycidyl group, an alicyclic epoxy group, and an oxetanyl group. .   The manufacturing method as described in any one of Claims 1-3 in which the said resin composition further contains a (B) (meth) acryl monomer.   The manufacturing method as described in any one of Claims 1-4 with which the said resin composition further contains (C) radical photopolymerization initiator.   The manufacturing method as described in any one of Claims 1-5 in which the said resin composition further contains (D) silicone compound.   The manufacturing method as described in any one of Claims 1-6 whose said temporary protective material is a film form. A pasting step of attaching a temporary protective material to a workpiece having irregularities on the surface;
A photocuring step of curing the temporary protective material by light irradiation;
A dicing step for separating the workpiece and the temporary protection material;
A shielding step of forming a metal film on a portion of the workpiece that has been separated into pieces and the temporary protective material is not attached;
A temporary protection for forming the temporary protective material, which is used in a method of manufacturing an electronic component having an electromagnetic shield, comprising: a peeling step of peeling the workpiece on which the metal film is formed and the temporary protective material. A resin composition for
The elastic modulus at 25 ° C. is 1.5 MPa or less, the elastic modulus at 25 ° C. after light irradiation with an exposure amount of 500 mJ / cm ² or more is 3 to 100 MPa, and the elongation at break is 100% or less. Protective resin composition.   (A) a (meth) acrylic copolymer having a reactive functional group, wherein the (A) (meth) acrylic copolymer having a reactive functional group has a weight average molecular weight of 10,000 to 1,000,000 and −50 ° C. to 50 ° C. The resin composition for temporary protection according to claim 8, which has a glass transition temperature of ° C.   The temporary protection according to claim 9, wherein the reactive functional group is at least one selected from the group consisting of a (meth) acryloyl group, a vinyl group, an allyl group, a glycidyl group, an alicyclic epoxy group, and an oxetanyl group. Resin composition.   The resin composition for temporary protection as described in any one of Claims 8-10 which further contains (B) (meth) acryl monomer.   The resin composition for temporary protection as described in any one of Claims 8-11 which further contains (C) radical photopolymerization initiator.   (D) The resin composition for temporary protection as described in any one of Claims 8-12 which further contains a silicone compound.   The temporary protection resin film formed by forming the temporary protection resin composition as described in any one of Claims 8-13 in a film form.

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