JP2019121724A5 - - Google Patents

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Publication number
JP2019121724A5
JP2019121724A5 JP2018001664A JP2018001664A JP2019121724A5 JP 2019121724 A5 JP2019121724 A5 JP 2019121724A5 JP 2018001664 A JP2018001664 A JP 2018001664A JP 2018001664 A JP2018001664 A JP 2018001664A JP 2019121724 A5 JP2019121724 A5 JP 2019121724A5
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JP
Japan
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tray
processed
substrate
plasma processing
thickness
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JP2018001664A
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English (en)
Japanese (ja)
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JP6981652B2 (ja
JP2019121724A (ja
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Publication of JP2019121724A5 publication Critical patent/JP2019121724A5/ja
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JP2018001664A 2018-01-10 2018-01-10 プラズマ処理用基板トレイ Active JP6981652B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018001664A JP6981652B2 (ja) 2018-01-10 2018-01-10 プラズマ処理用基板トレイ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018001664A JP6981652B2 (ja) 2018-01-10 2018-01-10 プラズマ処理用基板トレイ

Publications (3)

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JP2019121724A JP2019121724A (ja) 2019-07-22
JP2019121724A5 true JP2019121724A5 (https=) 2020-10-22
JP6981652B2 JP6981652B2 (ja) 2021-12-15

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JP2018001664A Active JP6981652B2 (ja) 2018-01-10 2018-01-10 プラズマ処理用基板トレイ

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JP (1) JP6981652B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7349845B2 (ja) * 2019-08-13 2023-09-25 東京エレクトロン株式会社 基板処理システムにおける搬送方法
CN119370449A (zh) * 2024-11-05 2025-01-28 横店集团得邦照明股份有限公司 一种车载尾灯灯板多只装内衬及其实现方法

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