JP2019078785A - Sealant for display - Google Patents
Sealant for display Download PDFInfo
- Publication number
- JP2019078785A JP2019078785A JP2017203287A JP2017203287A JP2019078785A JP 2019078785 A JP2019078785 A JP 2019078785A JP 2017203287 A JP2017203287 A JP 2017203287A JP 2017203287 A JP2017203287 A JP 2017203287A JP 2019078785 A JP2019078785 A JP 2019078785A
- Authority
- JP
- Japan
- Prior art keywords
- component
- sealant
- compound
- sealing agent
- displays
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000565 sealant Substances 0.000 title claims abstract description 74
- 230000009477 glass transition Effects 0.000 claims abstract description 16
- 238000000691 measurement method Methods 0.000 claims abstract description 4
- -1 acrylic compound Chemical class 0.000 claims description 72
- 150000001875 compounds Chemical class 0.000 claims description 68
- 239000003795 chemical substances by application Substances 0.000 claims description 67
- 238000007789 sealing Methods 0.000 claims description 59
- 239000004973 liquid crystal related substance Substances 0.000 claims description 47
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 36
- 239000004593 Epoxy Substances 0.000 claims description 32
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 29
- 239000002245 particle Substances 0.000 claims description 18
- 239000005062 Polybutadiene Substances 0.000 claims description 12
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 12
- 125000003700 epoxy group Chemical group 0.000 claims description 12
- 229920002857 polybutadiene Polymers 0.000 claims description 12
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 claims description 8
- 239000011256 inorganic filler Substances 0.000 claims description 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 8
- 239000012766 organic filler Substances 0.000 claims description 8
- 239000007870 radical polymerization initiator Substances 0.000 claims description 8
- 229920001971 elastomer Polymers 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 150000007524 organic acids Chemical class 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 239000005060 rubber Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000003999 initiator Substances 0.000 claims description 2
- 229930185605 Bisphenol Natural products 0.000 claims 1
- 230000035699 permeability Effects 0.000 abstract description 17
- 238000012360 testing method Methods 0.000 abstract description 12
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 3
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 15
- 239000000758 substrate Substances 0.000 description 14
- 239000007983 Tris buffer Substances 0.000 description 13
- 238000001723 curing Methods 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 229920000139 polyethylene terephthalate Polymers 0.000 description 12
- 239000005020 polyethylene terephthalate Substances 0.000 description 12
- 239000010408 film Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 229920003986 novolac Polymers 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 8
- 210000004027 cell Anatomy 0.000 description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 8
- 239000010419 fine particle Substances 0.000 description 7
- 229920002799 BoPET Polymers 0.000 description 6
- 229910001507 metal halide Inorganic materials 0.000 description 6
- 150000005309 metal halides Chemical class 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000003112 inhibitor Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000010526 radical polymerization reaction Methods 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 4
- CSFWPUWCSPOLJW-UHFFFAOYSA-N lawsone Chemical compound C1=CC=C2C(=O)C(O)=CC(=O)C2=C1 CSFWPUWCSPOLJW-UHFFFAOYSA-N 0.000 description 4
- 125000005395 methacrylic acid group Chemical group 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- QCBSYPYHCJMQGB-UHFFFAOYSA-N 2-ethyl-1,3,5-triazine Chemical compound CCC1=NC=NC=N1 QCBSYPYHCJMQGB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229930192627 Naphthoquinone Natural products 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000001588 bifunctional effect Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000004927 clay Substances 0.000 description 3
- 229910052570 clay Inorganic materials 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 239000011859 microparticle Substances 0.000 description 3
- 150000002791 naphthoquinones Chemical class 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 229920001195 polyisoprene Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ZNGSVRYVWHOWLX-KHFUBBAMSA-N (1r,2s)-2-(methylamino)-1-phenylpropan-1-ol;hydrate Chemical compound O.CN[C@@H](C)[C@H](O)C1=CC=CC=C1.CN[C@@H](C)[C@H](O)C1=CC=CC=C1 ZNGSVRYVWHOWLX-KHFUBBAMSA-N 0.000 description 2
- MFEWNFVBWPABCX-UHFFFAOYSA-N 1,1,2,2-tetraphenylethane-1,2-diol Chemical compound C=1C=CC=CC=1C(C(O)(C=1C=CC=CC=1)C=1C=CC=CC=1)(O)C1=CC=CC=C1 MFEWNFVBWPABCX-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- OVJHMJJVXOJMBB-UHFFFAOYSA-N 2-(1,3-dioxo-3a,4,5,6,7,7a-hexahydroisoindol-2-yl)ethyl prop-2-enoate Chemical compound C1CCCC2C(=O)N(CCOC(=O)C=C)C(=O)C21 OVJHMJJVXOJMBB-UHFFFAOYSA-N 0.000 description 2
- AGXAFZNONAXBOS-UHFFFAOYSA-N 2-[[3-(oxiran-2-ylmethyl)phenyl]methyl]oxirane Chemical compound C=1C=CC(CC2OC2)=CC=1CC1CO1 AGXAFZNONAXBOS-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 2
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 2
- OBGBGHKYJAOXRR-UHFFFAOYSA-N 2-methoxy-1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C(OC)=CC(=O)C2=C1 OBGBGHKYJAOXRR-UHFFFAOYSA-N 0.000 description 2
- LAQYHRQFABOIFD-UHFFFAOYSA-N 2-methoxyhydroquinone Chemical compound COC1=CC(O)=CC=C1O LAQYHRQFABOIFD-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- RDFQSFOGKVZWKF-UHFFFAOYSA-N 3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O RDFQSFOGKVZWKF-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- MJVAVZPDRWSRRC-UHFFFAOYSA-N Menadione Chemical compound C1=CC=C2C(=O)C(C)=CC(=O)C2=C1 MJVAVZPDRWSRRC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011258 core-shell material Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 229940091173 hydantoin Drugs 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 125000000018 nitroso group Chemical group N(=O)* 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 150000004967 organic peroxy acids Chemical class 0.000 description 2
- 235000010292 orthophenyl phenol Nutrition 0.000 description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- LGYJSPMYALQHBL-UHFFFAOYSA-N pentanedihydrazide Chemical compound NNC(=O)CCCC(=O)NN LGYJSPMYALQHBL-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 229920002742 polystyrene-block-poly(ethylene/propylene) -block-polystyrene Polymers 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000010186 staining Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- MDJZGXRFYKPSIM-JCYAYHJZSA-N (2r,3r)-2,3-dihydroxybutanedihydrazide Chemical compound NNC(=O)[C@H](O)[C@@H](O)C(=O)NN MDJZGXRFYKPSIM-JCYAYHJZSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 1
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- ROFVGYAMRSGUSQ-UHFFFAOYSA-N 1-(2-bromoethyl)piperazine;hydrobromide Chemical compound Br.BrCCN1CCNCC1 ROFVGYAMRSGUSQ-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
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- 239000000178 monomer Substances 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- IFZUFHWISBKFJP-UHFFFAOYSA-N n'-[4-[dimethoxy(methyl)silyl]oxybutyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)OCCCCNCCN IFZUFHWISBKFJP-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 238000010943 off-gassing Methods 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- CABDEMAGSHRORS-UHFFFAOYSA-N oxirane;hydrate Chemical compound O.C1CO1 CABDEMAGSHRORS-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 150000003053 piperidines Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- CZPZWMPYEINMCF-UHFFFAOYSA-N propaneperoxoic acid Chemical compound CCC(=O)OO CZPZWMPYEINMCF-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N pyridine Substances C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 239000011369 resultant mixture Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000013076 target substance Substances 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 235000019303 thiodipropionic acid Nutrition 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- JREYOWJEWZVAOR-UHFFFAOYSA-N triazanium;[3-methylbut-3-enoxy(oxido)phosphoryl] phosphate Chemical compound [NH4+].[NH4+].[NH4+].CC(=C)CCOP([O-])(=O)OP([O-])([O-])=O JREYOWJEWZVAOR-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 239000004474 valine Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
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- C09J11/08—Macromolecular additives
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- C09J147/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Adhesives based on derivatives of such polymers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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Abstract
Description
本発明は、フレキシブルディスプレイや湾曲形状のディスプレイにも適用できるディスプレイ用封止剤に関する。より詳細には、ガラス転移温度と弾性率において特定の関係を満たすディスプレイ用封止剤に関する。このディスプレイ用封止剤は、柔軟性と低透湿性を両立できるものである為、特にフレキシブルディスプレイや湾曲形状のディスプレイ用封止剤として有用である。 The present invention relates to a sealing agent for a display that can be applied to a flexible display or a curved display. More particularly, the present invention relates to a sealing agent for display satisfying a specific relationship in glass transition temperature and elastic modulus. The display sealing agent is compatible with flexibility and low moisture permeability, and is particularly useful as a flexible display or a curved display sealing agent.
ディスプレイ用封止剤とは、例えば液晶用シール剤、有機ELディスプレイ用封止剤やタッチパネル用接着剤等を挙げることができる。これらの材料として共通していることは、優れた硬化性を有しながら、アウトガスが少なく、表示素子にダメージを与えないという特性が要求される点である。
また最近では、湾曲した形状のディスプレイや、フレキシブル性に富んだディスプレイが開発され製品化されている。こういったディスプレイに使用される基板は、従来のガラスのような剛直なものに代わって、プラスチックフィルムのような柔軟なものが使用されている(特許文献1)。
こういった背景から、ディスプレイ用封止剤には基板等のたわみに追従するような、すなわち硬化後においても柔軟であるという性質が要求されつつある。
Examples of the display sealant include liquid crystal sealants, organic EL display sealants, and touch panel adhesives. Common to these materials is that they are required to have excellent curability, low outgassing and no damage to the display element.
In recent years, curved displays and flexible displays have been developed and commercialized. As a substrate used for such a display, a flexible substrate such as a plastic film is used instead of a rigid substrate such as a conventional glass (Patent Document 1).
From such a background, the sealant for display is required to have the property of following the deflection of a substrate or the like, that is, to be flexible even after curing.
一方、硬化物の柔軟性を高めるためには、硬化物の架橋密度を下げることが有効な手段である。しかし、架橋密度が下がると透湿性を悪化させるのが通常である。これはネットワークの緩い部分から水分が浸入する為であると考えられる。従って、低透湿性を担保する為には、架橋密度を下げずに柔軟性を高めるか、架橋密度は下げるが透湿性を悪化させないという相反する特性の実現が必要となる。 On the other hand, in order to enhance the flexibility of the cured product, it is an effective means to lower the crosslink density of the cured product. However, it is normal to deteriorate the moisture permeability as the crosslink density decreases. This is considered to be due to the infiltration of water from the loose part of the network. Therefore, in order to secure low moisture permeability, it is necessary to increase the flexibility without lowering the crosslinking density or to realize the contradictory characteristics of lowering the crosslinking density but not deteriorating the moisture permeability.
従来、接着強度向上の観点から、柔軟性を有する表示素子用接着剤の開発は行われてきた(特許文献2)。しかし、上記の柔軟な基板に適応するための十分な性能を備えたものは未だ実現していない。 Heretofore, development of an adhesive for display elements having flexibility has been carried out from the viewpoint of improving adhesive strength (Patent Document 2). However, one with sufficient performance to adapt to the above flexible substrate has not been realized yet.
本発明は、フレキシブルディスプレイや湾曲形状のディスプレイに適用可能な程度に柔軟性を有し、更には低透湿性にも優れる封止剤を提案するものである。 The present invention proposes a sealant that is flexible to the extent that it can be applied to a flexible display or a curved display, and is also excellent in low moisture permeability.
本発明者らは、鋭意検討の結果、ガラス転移温度と弾性率において特定の関係を満たすディスプレイ用封止剤が、柔軟性と低透湿性に非常に優れることを見出し、本発明に至った。
なお、本明細書中、「(メタ)アクリル」とは「アクリル及び/又はメタクリル」を意味し、「(メタ)アクリロイル基」とは「アクリロイル基及び/又はメタクリロイル基」を意味する。また、「液晶滴下工法用液晶シール剤」を単に「液晶シール剤」又は「シール剤」と記載する場合もある。
The inventors of the present invention, as a result of intensive studies, have found that a sealing agent for a display satisfying a specific relationship in glass transition temperature and elastic modulus is extremely excellent in flexibility and low moisture permeability, and has led to the present invention.
In the present specification, "(meth) acrylic" means "acrylic and / or methacrylic", and "(meth) acryloyl group" means "acryloyl and / or methacryloyl group". Moreover, "liquid crystal sealing agent for liquid crystal dropping method" may be described simply as "liquid crystal sealing agent" or "seal agent".
即ち本発明は、
[1]動的粘弾性測定法で測定した硬化物のガラス転移温度が90℃以上であり、またテンシロン万能試験機で測定した22℃での弾性率が2000MPa以下であるディスプレイ用封止剤、
[2]成分(A):同質量のビスフェノールA型エポキシメタクリレートと90℃において加熱混合し、22℃で1時間静置しても白濁しない又は成分の分離を起こさない化合物、を含有する前項[1]に記載のディスプレイ用封止剤、
[3]前記成分(A)が、液状ゴムである前項[2]に記載のディスプレイ用封止剤、
[4]前記成分(A)が、分子内にエポキシ基を有するポリブタジエン化合物である前項[2]又は[3]に記載のディスプレイ用封止剤、
[5]前記成分(A)が、分子内に、反応性二重結合を有する化合物である前項[2]乃至[4]のいずれか一項に記載のディスプレイ用封止剤、
[6]前記成分(A)の数平均分子量が、500以上10000以下である前項[2]乃至[5]のいずれか一項に記載のディスプレイ用封止剤、
[7]更に、成分(B)硬化性化合物を含有する前項[1]乃至[6]のいずれか一項に記載のディスプレイ用封止剤、
[8]前記成分(B)が、成分(B−1)(メタ)アクリル化合物である前項[7]に記載のディスプレイ用封止剤、
[9]前記成分(B)が、成分(B−1)(メタ)アクリル化合物と成分(B−2)エポキシ化合物の混合物である前項[7]に記載のディスプレイ用封止剤、
[10]前記成分(B−1)が、エポキシ(メタ)アクリレートである前項[8]又は[9]に記載のディスプレイ用封止剤、
[11]更に、成分(C)チオール化合物を含有する前項[1]乃至[10]のいずれか一項に記載のディスプレイ用封止剤、
[12]更に、成分(D)有機フィラーを含有する前項[1]乃至[11]のいずれか一項に記載のディスプレイ用封止剤、
[13]前記成分(D)が、ウレタン微粒子、アクリル微粒子、スチレン微粒子、スチレンオレフィン微粒子、及びシリコーン微粒子からなる群より選択される1又は2以上の有機フィラーである前項[12]に記載のディスプレイ用封止剤、
[14]更に、成分(E)無機フィラーを含有する前項[1]乃至[13]のいずれか一項に記載のディスプレイ用封止剤、
[15]更に、成分(F)シランカップリング剤を含有する前項[1]乃至[14]のいずれか一項に記載のディスプレイ用封止剤、
[16]更に、成分(G)熱硬化剤を含有する前項[1]乃至[15]のいずれか一項に記載のディスプレイ用封止剤、
[17]前記成分(G)が有機酸ヒドラジド化合物である前項[16]に記載のディスプレイ用封止剤、
[18]更に、成分(H)光ラジカル重合開始剤を含有する前項[1]乃至[17]のいずれか一項に記載のディスプレイ用封止剤、
[19]更に、成分(I)熱ラジカル重合開始剤を含有する前項[1]乃至[18]のいずれか一項に記載のディスプレイ用封止剤、
[20]前項[1]乃至[19]のいずれか一項に記載のディスプレイ用封止剤を用いた液晶シール剤、
[21]前項[20]に記載の液晶シール剤を用いて接着された液晶表示セル、
に関するものである。
That is, the present invention
[1] A sealing agent for a display, wherein the glass transition temperature of the cured product measured by the dynamic viscoelasticity measurement method is 90 ° C. or more, and the elastic modulus at 22 ° C. measured by the Tentiron universal tester is 2000 MPa or less
[2] Component (A): The compound containing the same mass of bisphenol A epoxy methacrylate at 90 ° C. by heating and mixing, and leaving at 22 ° C. for 1 hour does not cause white turbidity or causes separation of the components. [1] The sealant for display according to
[3] The sealant for a display according to [2], wherein the component (A) is a liquid rubber,
[4] The sealant for a display according to the above [2] or [3], wherein the component (A) is a polybutadiene compound having an epoxy group in the molecule,
[5] The sealant for a display according to any one of [2] to [4], wherein the component (A) is a compound having a reactive double bond in the molecule,
[6] The sealant for a display according to any one of [2] to [5], wherein the number average molecular weight of the component (A) is 500 or more and 10000 or less.
[7] The sealant for a display according to any one of [1] to [6], further comprising a component (B) a curable compound,
[8] The sealant for a display according to the above [7], wherein the component (B) is a component (B-1) (meth) acrylic compound
[9] The sealant for a display according to the above [7], wherein the component (B) is a mixture of a component (B-1) (meth) acrylic compound and a component (B-2) epoxy compound,
[10] The sealant for a display according to the above item [8] or [9], wherein the component (B-1) is an epoxy (meth) acrylate,
[11] The sealant for a display according to any one of the above [1] to [10], further comprising a component (C) a thiol compound,
[12] The sealant for a display according to any one of [1] to [11], further comprising a component (D) an organic filler.
[13] The display according to the above [12], wherein the component (D) is one or more organic fillers selected from the group consisting of urethane particles, acryl particles, styrene particles, styrene olefin particles, and silicone particles. Sealant,
[14] The sealant for a display according to any one of [1] to [13], further comprising a component (E) an inorganic filler
[15] The sealant for a display according to any one of [1] to [14], further comprising a component (F) a silane coupling agent,
[16] The sealant for display according to any one of [1] to [15], further comprising a component (G) a thermosetting agent.
[17] The sealant for a display according to the above item [16], wherein the component (G) is an organic acid hydrazide compound,
[18] The sealant for a display according to any one of [1] to [17], further comprising a component (H) a photoradical polymerization initiator,
[19] The sealant for a display according to any one of [1] to [18], further comprising a component (I) a thermal radical polymerization initiator,
[20] A liquid crystal sealant using the sealant for a display according to any one of the above [1] to [19],
[21] A liquid crystal display cell bonded using the liquid crystal sealing agent according to the preceding item [20],
It is about
本発明のディスプレイ用封止剤は、柔軟性と低透湿性を両立できるものである為、特にフレキシブルディスプレイや湾曲形状のディスプレイ用封止剤として有用である。 The sealant for a display of the present invention is compatible with flexibility and low moisture permeability, and is particularly useful as a sealant for a flexible display or a curved display.
[動的粘弾性測定法で測定した硬化物のガラス転移温度が90℃以上]
本発明のディスプレイ用封止剤の硬化物のガラス転移温度(以下、単に「Tg」ともいう。)は、90℃以上である。
このガラス転移温度の測定は、実施例及び比較例で製造した液晶シール剤について、ポリエチレンテレフタレート(PET)フィルムに挟み、厚み100μmの薄膜としたものに、メタルハライドランプ(ウシオ電機株式会社製)にて3000mJ/cm2(100mW/cm2で30秒)の紫外線を照射して硬化させた後、120℃のオーブンに40分間投入して硬化させた。その後、PETフィルムをはがしシール剤硬化膜を50mm×5mmの短冊状にカットしてサンプル片とした。このサンプル片を動的粘弾性測定装置(DMS−6100:エスアイアイ・ナノテクノロジー社製)の引っ張りモードにて周波数10Hz、昇温温度2℃/分の条件で測定を行った。損失弾性率と貯蔵弾性率との比(JIS K 7244−1)から損失係数Tanδが得られ、得られた損失係数Tanδが最大値となる温度をガラス転移温度とした。本発明においてガラス転移温度は90℃以上であることが好ましく、より好ましくは100℃以上、更に好ましくは120℃以上である。ガラス転移温度が高いことは高温環境下においても、機械的性質の変化が小さく信頼性に優れるからである。
[Glass transition temperature of cured product measured by dynamic viscoelasticity measurement method is 90 ° C or higher]
The glass transition temperature (hereinafter, also simply referred to as “Tg”) of the cured product of the display sealing agent of the present invention is 90 ° C. or higher.
The measurement of the glass transition temperature was carried out by using a metal halide lamp (manufactured by Ushio Electric Co., Ltd.) on a liquid crystal sealing agent manufactured in Examples and Comparative Examples, sandwiched between polyethylene terephthalate (PET) films and made into thin films with a thickness of 100 μm. After curing by irradiation with ultraviolet light of 3000 mJ / cm 2 (30 seconds at 100 mW / cm 2 ), it was placed in an oven at 120 ° C. for 40 minutes to cure. Thereafter, the PET film was peeled off and the cured sealing agent film was cut into strips of 50 mm × 5 mm to obtain sample pieces. The sample piece was measured under the conditions of a frequency 10 Hz and a temperature elevation temperature of 2 ° C./min in a tension mode of a dynamic viscoelasticity measuring apparatus (DMS-6100: manufactured by SII Nano Technology Inc.). The temperature at which the loss coefficient Tan δ is obtained from the ratio of the loss elastic modulus to the storage elastic modulus (JIS K 7244-1) and the obtained loss coefficient Tan δ is the maximum value is taken as the glass transition temperature. In the present invention, the glass transition temperature is preferably 90 ° C. or more, more preferably 100 ° C. or more, and still more preferably 120 ° C. or more. The high glass transition temperature is because the change in mechanical properties is small and the reliability is excellent even in a high temperature environment.
[テンシロン万能試験機で測定した22℃での弾性率が2000MPa以下]
本発明のディスプレイ用封止剤の硬化物の22℃での弾性率は、2000MPa以下である。
このガラス転移温度の測定は、実施例及び比較例で製造した液晶シール剤について、ポリエチレンテレフタレート(PET)フィルムに挟み、厚み100μmの薄膜としたものに、メタルハライドランプ(ウシオ電機株式会社製)にて3000mJ/cm2(100mW/cm2で30秒)の紫外線を照射して硬化させた後、120℃のオーブンに40分間投入して硬化させた。その後、PETフィルムをはがしシール剤硬化膜をダンベル状試験片(全体長75mm、全体幅10mm、狭い平行部分の長さ50mm、幅5mm)にカットしサンプル片とした。得られた試験片について、テンシロン万能試験機(株式会社エー・アンド・デイ製、RTG−1210)を用いて、室温(22℃)下、試験速度5mm/分で引張試験を行い、比例限度内の引張応力とひずみの結果から弾性率を算出した。弾性率は後述する屈曲性試験とともに柔軟性を示す値となり、2000MPa以下であることが好ましく、より好ましくは1500MPa以下である。
[Elastic modulus at 22 ° C measured with Tensilon Universal Tester is 2000 MPa or less]
The elastic modulus at 22 ° C. of the cured product of the sealant for a display of the present invention is 2000 MPa or less.
The measurement of the glass transition temperature was carried out by using a metal halide lamp (manufactured by Ushio Electric Co., Ltd.) on a liquid crystal sealing agent manufactured in Examples and Comparative Examples, sandwiched between polyethylene terephthalate (PET) films and made into thin films with a thickness of 100 μm. After curing by irradiation with ultraviolet light of 3000 mJ / cm 2 (30 seconds at 100 mW / cm 2 ), it was placed in an oven at 120 ° C. for 40 minutes to cure. Thereafter, the PET film was peeled off and the cured sealant film was cut into a dumbbell-shaped test piece (total length 75 mm, overall width 10 mm, narrow parallel portion length 50 mm, width 5 mm) to obtain a sample piece. The obtained test piece was subjected to a tensile test at a test speed of 5 mm / min at room temperature (22 ° C.) using a TENSILON universal testing machine (RTG-1210, manufactured by A & D Co., Ltd.). The modulus of elasticity was calculated from the results of tensile stress and strain. The elastic modulus is a value showing flexibility along with a flexibility test described later, and is preferably 2000 MPa or less, more preferably 1500 MPa or less.
[(A)同質量のビスフェノールA型エポキシメタクリレートと90℃において加熱混合し、22℃で1時間静置しても白濁しない又は成分の分離を起こさない化合物]
本発明のディスプレイ用封止剤は、成分(A):同質量のビスフェノールA型エポキシメタアクリレートと90℃において加熱混合し、22℃で1時間静置しても白濁しない又は成分の分離を起こさない化合物(以下、単に「成分(A)」ともいう。)を含有する場合が好ましい。なお、同質量とは、ビスフェノールA型エポキシメタクリレートと化合物の質量が同じであることを意味する。また、90℃において加熱混合する時間は1時間以内であることが好ましく、より好ましくは30分以内である。
硬化性樹脂と相互に相溶しない化合物を用いて高ガラス転移温度と低弾性率を実現する方法(例えば、高ガラス転移温度は樹脂の硬化物特性により、低弾性率は相溶していない当該化合物の特性により、実現する方法)はあるが、本発明の特徴の一つは、そういった相溶しない化合物に頼らず低弾性率を実現し、結果として柔軟性と低透湿性を両立させる点にある。
ここでビスフェノールA型エポキシメタクリレートは、ビスフェノールA型エポキシ化合物のエポキシ基を95mol%以上メタクリルエステル化したものであれば、極性が大きく変わることはなく、例えば、RE−310S(日本化薬株式会社製)やYD8125(新日鉄住金化学株式会社製)のエポキシ基の100mol%をメタクリルエステル化したもので試験をすることができる。なお、メタクリルエステル化は公知の手法を用いて容易に行うことが可能である。ビスフェノールA型エポキシメタクリレートは、作業性の観点から粘度は低い方が好ましく、原料となるエポキシ樹脂のエポキシ当量は200g/eq以下であることが好ましい。
[(A) a compound which is mixed with the same mass of bisphenol A epoxy methacrylate at 90 ° C. by heating and left at 22 ° C. for 1 hour for causing no white turbidity or causing separation of components]
The sealing agent for a display of the present invention is mixed with the component (A): bisphenol A epoxy methacrylate of the same mass by heating at 90 ° C. and left at 22 ° C. for 1 hour to cause white turbidity or cause separation of the components. It is preferable to contain a non-compound (hereinafter, also simply referred to as "component (A)"). The same mass means that the mass of the compound is the same as that of the bisphenol A epoxy methacrylate. The heating and mixing time at 90 ° C. is preferably within 1 hour, more preferably within 30 minutes.
A method of realizing a high glass transition temperature and a low elastic modulus by using a compound incompatible with the curable resin (for example, the high glass transition temperature is not compatible with the low elastic modulus due to the cured product characteristics of the resin) Depending on the characteristics of the compound, there is a method to realize, but one of the features of the present invention is to realize a low elastic modulus without relying on such incompatible compounds, and as a result to achieve both flexibility and low moisture permeability. is there.
Here, as long as the bisphenol A epoxy methacrylate is obtained by methacrylic esterifying the epoxy group of the bisphenol A epoxy compound in an amount of 95 mol% or more, the polarity does not change significantly, and, for example, RE-310S (manufactured by Nippon Kayaku Co., Ltd. And 100 mol% of epoxy groups of YD 8125 (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) can be tested with methacryl ester. Methacrylic esterification can be easily performed using a known method. The viscosity of the bisphenol A type epoxy methacrylate is preferably low from the viewpoint of workability, and the epoxy equivalent of the epoxy resin as a raw material is preferably 200 g / eq or less.
前記成分(A)は、液状ゴムである場合が好ましい。液状ゴムとは、常温で液状であるゴム性化合物であり、例えばポリブタジエンやポリイソプレン等を挙げることができる。
また、当該成分(A)は、分子内にエポキシ基を有するポリブタジエン又はポリイソプレン化合物である場合が好ましい。この化合物は、柔軟性を有しながら、エポキシ基の開環反応により低透湿性を実現できる。従来、ポリブタジエンやポリイソプレンは末端二重結合を用いて反応させるものが主であるが、ラジカル反応では反応性が速い一方で、十分な架橋が得られず、透湿を悪化させるものと考えられる。
The component (A) is preferably a liquid rubber. The liquid rubber is a rubbery compound which is liquid at normal temperature, and examples thereof include polybutadiene and polyisoprene.
Further, the component (A) is preferably a polybutadiene or polyisoprene compound having an epoxy group in the molecule. This compound can realize low moisture permeability by the ring opening reaction of the epoxy group while having flexibility. Conventionally, polybutadiene and polyisoprene are mainly reacted by using a terminal double bond, but while the reactivity is fast in radical reaction, sufficient crosslinking can not be obtained, and it is thought that moisture permeability is deteriorated. .
前記エポキシ基を有するポリブタジエン化合物とは、ブタジエン骨格に含まれる炭素−炭素二重結合の少なくとも一部がエポキシ化されることによって、分子内にエポキシ基が導入された化合物である。エポキシ化ポリブタジエン化合物は、特に制限されないが、主鎖の両末端に、水素原子、ヒドロキシ基、カルボキシ基、シアノ基、ヒドロキシエチル基などのヒドロキシアルキル基を有しているものが挙げられる。
更に成分(A)としては、分子内に更に反応性二重結合を有する化合物が好ましい。上記ラジカル効果の速反応性のメリットも生かしながら、硬化物特性はエポキシ基の開環反応によって得るという設計となり、より有益である。
The polybutadiene compound having an epoxy group is a compound in which an epoxy group is introduced in the molecule by epoxidizing at least a part of a carbon-carbon double bond contained in a butadiene skeleton. The epoxidized polybutadiene compound is not particularly limited, and examples thereof include those having a hydroxyalkyl group such as a hydrogen atom, a hydroxy group, a carboxy group, a cyano group or a hydroxyethyl group at both ends of the main chain.
Furthermore, as the component (A), a compound further having a reactive double bond in the molecule is preferable. The cured product properties are designed to be obtained by the ring opening reaction of epoxy groups while taking advantage of the rapid reactivity of the radical effect, which is more useful.
エポキシ化ポリブタジエン化合物としては、下記式(1)で示される繰り返し単位と、下記式(2)で示される繰り返し単位を有する化合物、あるいは下記式(3)で示される繰り返し単位又は下記式(4)で示される繰り返し単位を有する化合物が挙げられる。 As the epoxidized polybutadiene compound, a compound having a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (2), or a repeating unit represented by the following formula (3) or the following formula (4) The compound which has a repeating unit shown by these is mentioned.
エポキシ化ポリブタジエン化合物としては、下記式(5)で示される化合物又は下記式(6)で示される化合物が好ましい。 As the epoxidized polybutadiene compound, a compound represented by the following formula (5) or a compound represented by the following formula (6) is preferable.
エポキシ基を有するポリブタジエン化合物は、ポリブタジエン樹脂にエポキシ化剤を反応させることによって得ることができる。原料であるポリブタジエン樹脂において、二重結合部位の立体構造は、シス−1,4、トランス−1,4、トランス−1,2、シス−1,2のいずれであってもよい。また、それらの比率は任意でよい。エポキシ化剤としては、過酢酸、過ギ酸、過安息香酸、トリフルオロ過酢酸、過プロピオン酸などの有機過酸類、過酸化水素、t−ブチルヒドロパーオキサイド、クメンヒドロパーオキサイドなどの有機ヒドロパーオキサイド類などを使用できる。有機過酸としては、目的物のオキシラン酸素濃度を高めるため、実質的に水を含まないもの(例えば、水分含有量で0.8重量%以下)が好ましい。上記エポキシ化剤の中でも、工業的に安価に入手でき、且つ安定度の高い点から、過酢酸が特に好ましい。 A polybutadiene compound having an epoxy group can be obtained by reacting a polybutadiene resin with an epoxidizing agent. In the polybutadiene resin which is the raw material, the steric structure of the double bond site may be any of cis-1,4 trans-1,4, trans-1,2, cis-1,2. Also, their ratio may be arbitrary. As the epoxidizing agent, organic peracids such as peracetic acid, formic acid, perbenzoic acid, trifluoroperacetic acid, perpropionic acid, etc., hydrogen peroxide, organic hydroperoxides such as t-butyl hydroperoxide, cumene hydroperoxide, etc. Oxides can be used. As the organic peracid, in order to increase the oxirane oxygen concentration of the target substance, one substantially free of water (for example, 0.8% by weight or less in water content) is preferable. Among the above-mentioned epoxidizing agents, peracetic acid is particularly preferable from the viewpoint of low cost industrial availability and high stability.
また、 前記エポキシ化ポリジエン樹脂の数平均分子量は、ディスプレイ用封止剤からの発ガスや、液晶周辺材料、例えば液晶シール剤として用いる場合の液晶汚染性低減の観点から、成分下限は500が好ましく、更に好ましくは750、特に好ましくは1000である。
また、ハンドリング性の観点から、成分(A)の数平均分子量の上限は10000が好ましく、更に好ましくは8000、特に好ましくは6000である。
Further, the number-average molecular weight of the epoxidized polydiene resin is preferably 500 as the lower limit of the component from the viewpoint of gas emission from a sealing agent for display and liquid crystal peripheral material such as liquid crystal staining when used as a liquid crystal sealing agent More preferably, it is 750, and particularly preferably 1000.
The upper limit of the number average molecular weight of the component (A) is preferably 10,000, more preferably 8,000, and particularly preferably 6,000, from the viewpoint of handling.
成分(A)としては、例えばJP−100、JP−200、JP−400(いずれも日本曹達株式会社(製))、エポリード PB3600、エポリード PB4700(いずれも株式会社ダイセル(製))、BF−1000(株式会社ADEKA(製))、Ricon657(クレイバレー社(製))として市場から入手することができる。 As component (A), for example, JP-100, JP-200, JP-400 (all are Nippon Soda Co., Ltd. (made)), Epolide PB3600, Epolide PB4700 (all are Daicel Co., Ltd.), BF-1000 They can be obtained from the market as (ADEKA (made)) and Ricon 657 (made by Clay Valley (made)).
[(B)硬化性化合物]
本発明のディスプレイ用封止剤は、成分(B)硬化性化合物(以下、単に「成分(B)」ともいう。)を含有する場合が好ましい。
[(B) curable compound]
The case where the sealing agent for displays of the present invention contains a component (B) curable compound (hereinafter, also simply referred to as "component (B)") is preferable.
[(B−1)(メタ)アクリル化合物]
成分(B)としては、光や熱等によって硬化する化合物であれば特に限定されないが、成分(B−1)(メタ)アクリル化合物(以下、単に成分(B−2)ともいう。)である場合が好ましい。ここで「(メタ)アクリル」とは「アクリル」及び/又は「メタクリル」を意味する。(以下同様。)成分(B−1)としては、例えば、(メタ)アクリルエステル化合物、エポキシ(メタ)アクリレート化合物等が挙げられる。このうち、好ましくはエポキシ(メタ)アクリレート化合物である。
(メタ)アクリルエステル化合物の具体例としては、N−アクリロイルオキシエチルヘキサヒドロフタルイミド、アクリロイルモルホリン、2−ヒドロキシプロピル(メタ)アクリレート、4−ヒドロキシブチル(メタ)アクリレート、シクロヘキサン−1,4−ジメタノールモノ(メタ)アクリレート、テトラヒドロフルフリル(メタ)アクリレート、フェノキシエチル(メタ)アクリレート、フェニルポリエトキシ(メタ)アクリレート、2−ヒドロキシ−3−フェニルオキシプロピル(メタ)アクリレート、o−フェニルフェノールモノエトキシ(メタ)アクリレート、o−フェニルフェノールポリエトキシ(メタ)アクリレート、p−クミルフェノキシエチル(メタ)アクリレート、イソボニル(メタ)アクリレート、トリブロモフェニルオキシエチル(メタ)アクリレート、ジシクロペンタニル(メタ)アクリレート、ジシクロペンテニル(メタ)アクリレート、ジシクロペンテニルオキシエチル(メタ)アクリレート、1,4−ブタンジオールジ(メタ)アクリレート、1,6−ヘキサンジオールジ(メタ)アクリレート、1,9−ノナンジオールジ(メタ)アクリレート、トリシクロデカンジメタノール(メタ)アクリレート、ビスフェノールAポリエトキシジ(メタ)アクリレート、ビスフェノールAポリプロポキシジ(メタ)アクリレート、ビスフェノールFポリエトキシジ(メタ)アクリレート、エチレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、トリス(アクリロキシエチル)イソシアヌレート、ペンタエリスリトールテトラ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、ジペンタエリスリトールペンタ(メタ)アクリレート、トリペンタエリスリトールヘキサ(メタ)アクリレート、トリペンタエリスリトールペンタ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、トリメチロールプロパンポリエトキシトリ(メタ)アクリレート、ジトリメチロールプロパンテトラ(メタ)アクリレート、ネオペンチルグリコールとヒドロキシピバリン酸のエステルジアクリレートやネオペンチルグリコールとヒドロキシピバリン酸のエステルのε−カプロラクトン付加物のジアクリレート等のモノマー類を挙げることができる。好ましくは、N−アクリロイルオキシエチルヘキサヒドロフタルイミド、フェノキシエチル(メタ)アクリレート、ジシクロペンテニルオキシエチル(メタ)アクリレートを挙げることができる。
エポキシ(メタ)アクリレート化合物は、エポキシ化合物と(メタ)アクリル酸との反応により公知の方法で得られる。原料となるエポキシ化合物としては、特に限定されるものではないが、2官能以上のエポキシ化合物が好ましく、例えば、レゾルシンジグリシジルエーテル、ビスフェノールA型エポキシ化合物、ビスフェノールF型エポキシ化合物、ビスフェノールS型エポキシ化合物、フェノールノボラック型エポキシ化合物、クレゾールノボラック型エポキシ化合物、ビスフェノールAノボラック型エポキシ化合物、ビスフェノールFノボラック型エポキシ化合物、脂環式エポキシ化合物、脂肪族鎖状エポキシ化合物、グリシジルエステル型エポキシ化合物、グリシジルアミン型エポキシ化合物、ヒダントイン型エポキシ化合物、イソシアヌレート型エポキシ化合物、トリフェノールメタン骨格を有するフェノールノボラック型エポキシ化合物、その他、カテコール、レゾルシノール等の二官能フェノール類のジグリシジルエーテル化物、二官能アルコール類のジグリシジルエーテル化物、およびそれらのハロゲン化物、水素添加物などが挙げられる。これらのうち液晶汚染性の観点から、ビスフェノールA型エポキシ化合物やレゾルシンジグリシジルエーテルが好ましい。また、エポキシ基と(メタ)アクリロイル基との比率は限定されるものではなく、工程適合性の観点から適切に選択される。
成分(B)は単独で用いても良いし、2種類以上を混合しても良い。本発明のディスプレイ用封止剤において、成分(B)を使用する場合には、ディスプレイ用封止剤の総量中、通常10〜80質量%、好ましくは20〜70質量%である。
[(B-1) (meth) acrylic compound]
The component (B) is not particularly limited as long as it is a compound which is cured by light, heat and the like, but it is the component (B-1) (meth) acrylic compound (hereinafter, also simply referred to as component (B-2)). The case is preferred. Here, "(meth) acrylic" means "acrylic" and / or "methacrylic". Examples of the component (B-1) include (meth) acrylic ester compounds and epoxy (meth) acrylate compounds. Among these, an epoxy (meth) acrylate compound is preferable.
Specific examples of (meth) acrylic ester compounds include N-acryloyloxyethyl hexahydrophthalimide, acryloyl morpholine, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, cyclohexane-1,4-dimethanol Mono (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, phenoxyethyl (meth) acrylate, phenylpolyethoxy (meth) acrylate, 2-hydroxy-3-phenyloxypropyl (meth) acrylate, o-phenylphenol monoethoxy Meta) acrylate, o-phenylphenol polyethoxy (meth) acrylate, p-cumyl phenoxyethyl (meth) acrylate, isobonyl (meth) acrylate, tribromophenyl Nyloxyethyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyl oxyethyl (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6 -Hexanediol di (meth) acrylate, 1, 9 nonane diol di (meth) acrylate, tricyclodecane dimethanol (meth) acrylate, bisphenol A polyethoxy di (meth) acrylate, bisphenol A polypropoxy di (meth) acrylate, bisphenol F polyethoxy di (meth) acrylate, ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, tris (acryloxyethyl) isocyanurate, pentaerys Tall tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tripentaerythritol penta (meth) acrylate, trimethylolpropane tri (meth) Acrylate, trimethylolpropane polyethoxy tri (meth) acrylate, ditrimethylol propane tetra (meth) acrylate, ester diacrylate of neopentyl glycol and hydroxypivalic acid, and ε-caprolactone adduct of neopentyl glycol and ester of hydroxypivalic acid Monomers such as diacrylate can be mentioned. Preferably, N-acryloyloxyethyl hexahydrophthalimide, phenoxyethyl (meth) acrylate, and dicyclopentenyl oxyethyl (meth) acrylate can be mentioned.
The epoxy (meth) acrylate compound is obtained by the reaction of an epoxy compound and (meth) acrylic acid by a known method. The epoxy compound as the raw material is not particularly limited, but is preferably a difunctional or higher epoxy compound, for example, resorcinol diglycidyl ether, bisphenol A epoxy compound, bisphenol F epoxy compound, bisphenol S epoxy compound , Phenol novolac epoxy compound, cresol novolac epoxy compound, bisphenol A novolac epoxy compound, bisphenol F novolac epoxy compound, alicyclic epoxy compound, aliphatic chain epoxy compound, glycidyl ester epoxy compound, glycidyl amine epoxy Compound, hydantoin type epoxy compound, isocyanurate type epoxy compound, phenol novolac type epoxy compound having triphenolmethane skeleton, and the like Catechol, bifunctional phenols diglycidyl ethers of resorcinol and the like, bifunctional alcohols diglycidyl ethers of, and their halides, and the like hydrogenated product. Among them, bisphenol A epoxy compounds and resorcin diglycidyl ether are preferable from the viewpoint of liquid crystal contamination. Moreover, the ratio of an epoxy group and a (meth) acryloyl group is not limited, It selects suitably from a viewpoint of process compatibility.
Component (B) may be used alone or in combination of two or more. When the component (B) is used in the sealant for a display of the present invention, it is usually 10 to 80% by mass, preferably 20 to 70% by mass in the total amount of the sealant for a display.
[(B−2)エポキシ化合物]
本発明の態様として、上記成分(B)中に、さらに成分(B−2)エポキシ化合物(以下、単に成分(B−2)ともいう。)が含有される場合がさらに好ましい。
エポキシ化合物としては特に限定されるものではないが、2官能以上のエポキシ化合物が好ましく、例えば、レゾルシンジグリシジルエーテル、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノールAノボラック型エポキシ樹脂、ビスフェノールFノボラック型エポキシ樹脂、脂環式エポキシ樹脂、脂肪族鎖状エポキシ樹脂、グリシジルエステル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、ヒダントイン型エポキシ樹脂、イソシアヌレート型エポキシ樹脂、トリフェノールメタン骨格を有するフェノールノボラック型エポキシ樹脂、その他、カテコール、レゾルシノール等の二官能フェノール類のジグリシジルエーテル化物、二官能アルコール類のジグリシジルエーテル化物、およびそれらのハロゲン化物、水素添加物などが挙げられる。これらのうち液晶汚染性の観点から、ビスフェノールA型エポキシ樹脂やレゾルシンジグリシジルエーテルが好ましい。
成分(B−2)は単独で用いても良いし、2種類以上を混合しても良い。本発明のディスプレイ用封止剤において、成分(B−2)を使用する場合には、ディスプレイ用封止剤総量中、通常5〜50質量%、好ましくは5〜30質量%である。
[(B-2) epoxy compound]
In a preferred embodiment of the present invention, the component (B) further contains the component (B-2) epoxy compound (hereinafter, also simply referred to as the component (B-2)).
The epoxy compound is not particularly limited, but is preferably a difunctional or higher epoxy compound, for example, resorcinol diglycidyl ether, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy Epoxy resin, cresol novolac type epoxy resin, bisphenol A novolac type epoxy resin, bisphenol F novolac type epoxy resin, alicyclic epoxy resin, aliphatic chain epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, hydantoin type Epoxy resin, isocyanurate type epoxy resin, phenol novolac type epoxy resin having triphenolmethane skeleton, other, bifunctional functional groups such as catechol and resorcinol Diglycidyl ethers of Nord acids, difunctional alcohols diglycidyl ethers of, and their halides, and the like hydrogenated product. Among them, bisphenol A epoxy resin and resorcin diglycidyl ether are preferable from the viewpoint of liquid crystal contamination.
The component (B-2) may be used alone or in combination of two or more. When the component (B-2) is used in the sealant for a display of the present invention, the total amount of the sealant for a display is usually 5 to 50% by mass, preferably 5 to 30% by mass.
[(C)チオール化合物]
本発明のディスプレイ用封止剤は、成分(C)チオール化合物(以下、単に成分(C)ともいう。)を含有しても良い。成分(C)は成分(A)のエポキシ基とも、反応性二重結合とも反応する為、添加することが非常に有用である。
成分(C)としては、分子内にチオール基を有する化合物であれが特に限定されるものではないが、保存安定性と反応性の観点から2級チオール基を有するチオール化合物が好ましい。
また、チオール基の数は、分子内に2以上有するもの(多官能チオール化合物)が好ましく、更に好ましくは3官能又は4官能である。
本発明のディスプレイ用封止剤を電子部品用封止剤として用いる場合、発ガスの抑制等の観点から、チオール化合物のチオール当量は80以上が好ましく、更に好ましくは100以上である。また、分子量は、好ましくは250以上であり、更に好ましくは500以上である。
成分(C)は単独で用いても良いし、2種類以上を混合しても良い。本発明のディスプレイ用封止剤において、成分(C)を使用する場合には、ディスプレイ用封止剤総量中、通常0.1〜30質量%、好ましくは0.5〜20質量%である。
[(C) thiol compound]
The sealant for a display of the present invention may contain component (C) a thiol compound (hereinafter, also simply referred to as component (C)). Component (C) reacts with both the epoxy group of component (A) and the reactive double bond, so it is very useful to add it.
The component (C) is not particularly limited as long as it is a compound having a thiol group in the molecule, but a thiol compound having a secondary thiol group is preferable from the viewpoint of storage stability and reactivity.
The number of thiol groups is preferably two or more in the molecule (polyfunctional thiol compound), and more preferably trifunctional or tetrafunctional.
When the sealing agent for a display of the present invention is used as a sealing agent for electronic components, the thiol equivalent of the thiol compound is preferably 80 or more, more preferably 100 or more, from the viewpoint of suppression of gas generation and the like. Further, the molecular weight is preferably 250 or more, more preferably 500 or more.
Component (C) may be used alone or in combination of two or more. When the component (C) is used in the sealant for a display of the present invention, it is usually 0.1 to 30% by mass, preferably 0.5 to 20% by mass, based on the total amount of the sealant for a display.
[(D)有機フィラー]
本発明のディスプレイ用封止剤は、成分(D)有機フィラー(以下、単に成分(D)ともいう。)を含有しても良い。上記有機フィラーとしては、例えばウレタン微粒子、アクリル微粒子、スチレン微粒子、スチレンオレフィン微粒子及びシリコーン微粒子が挙げられる。なおシリコーン微粒子としてはKMP−594、KMP−597、KMP−598(信越化学工業製)、トレフィルRTME−5500、9701、EP−2001(東レダウコーニング社製)が好ましく、ウレタン微粒子としてはJB−800T、HB−800BK(根上工業株式会社)、スチレン微粒子としてはラバロンRTMT320C、T331C、SJ4400、SJ5400、SJ6400、SJ4300C、SJ5300C、SJ6300C(三菱化学製)が好ましく、スチレンオレフィン微粒子としてはセプトンRTMSEPS2004、SEPS2063が好ましい。
これら有機フィラーは単独で用いても良いし、2種類以上を併用しても良い。また2種類以上を用いてコアシェル構造としても良い。これらのうち、好ましくは、アクリル微粒子、シリコーン微粒子である。
上記アクリル微粒子を使用する場合、2種類のアクリルゴムからなるコアシェル構造のアクリルゴムである場合が好ましく、特に好ましくはコア層がn−ブチルアクリレートであり、シェル層がメチルメタクリレートであるものが好ましい。これはゼフィアックRTMF−351としてアイカ工業株式会社から販売されている。
また、上記シリコーン微粒子としては、オルガノポリシロキサン架橋物粉体、直鎖のジメチルポリシロキサン架橋物粉体等があげられる。また、複合シリコーンゴムとしては、上記シリコーンゴムの表面にシリコーン樹脂(例えば、ポリオルガノシルセスキオキサン樹脂)を被覆したものがあげられる。これらの微粒子のうち、特に好ましいのは、直鎖のジメチルポリシロキサン架橋粉末のシリコーンゴム又はシリコーン樹脂被覆直鎖ジメチルポリシロキサン架橋粉末の複合シリコーンゴム微粒子である。これらのものは、単独で用いても良いし、2種類以上を併用しても良い。また、好ましくは、ゴム粉末の形状は、添加後の粘度の増粘が少ない球状が良い。本発明のディスプレイ用封止剤において、成分(D)を使用する場合には、ディスプレイ用封止剤の総量中、通常5〜50質量%、好ましくは5〜40質量%である。
[(D) Organic filler]
The display sealing agent of the present invention may contain component (D) an organic filler (hereinafter, also simply referred to as component (D)). Examples of the organic filler include urethane particles, acryl particles, styrene particles, styrene olefin particles, and silicone particles. In addition, as silicone microparticles, KMP-594, KMP-597, KMP-598 (made by Shin-Etsu Chemical Co., Ltd.), Trefil RTM E-5500, 9701, EP-2001 (made by Toray Dow Corning) are preferable, and as urethane microparticles, JB- 800T, HB-800BK (Kegami Kogyo Co., Ltd.), preferred as styrene fine particles are Lavalon RTM T320C, T331C, SJ4400, SJ5400, SJ6400, SJ4300C, SJ5300C, SJ6300C (Mitsubishi Chemical), and as styrene olefin fine particles is Septon RTM SEPS 2004, SEPS 2063 is preferred.
These organic fillers may be used alone or in combination of two or more. Moreover, it is good also as core-shell structure using 2 or more types. Among these, acrylic fine particles and silicone fine particles are preferable.
When using the said acryl fine particle, the case where it is an acryl rubber of the core-shell structure which consists of 2 types of acryl rubber is preferable, Especially preferably, a thing whose core layer is n-butyl acrylate and whose shell layer is methyl methacrylate is preferable. This is marketed by Aika Industry Co., Ltd. as Zefiac RTM F-351.
Further, as the above-mentioned silicone fine particles, there can be mentioned organopolysiloxane crosslinked powder, linear dimethylpolysiloxane crosslinked powder and the like. Moreover, as composite silicone rubber, what coated silicone resin (for example, polyorgano silsesquioxane resin) on the surface of the said silicone rubber is mention | raise | lifted. Among these fine particles, particularly preferred are silicone rubber of linear dimethylpolysiloxane crosslinked powder or complex silicone rubber microparticles of silicone resin-coated linear dimethylpolysiloxane crosslinked powder. These may be used alone or in combination of two or more. Also, preferably, the shape of the rubber powder is spherical with less thickening of viscosity after addition. When the component (D) is used in the sealant for a display of the present invention, the total amount of the sealant for a display is usually 5 to 50% by mass, preferably 5 to 40% by mass.
[(E)無機フィラー]
本発明のディスプレイ用封止剤は、成分(E)無機フィラー(以下、単に成分(E)ともいう。)を含有しても良い。本発明で含有する無機フィラーとしては、シリカ、シリコンカーバイド、窒化珪素、窒化ホウ素、炭酸カルシウム、炭酸マグネシウム、硫酸バリウム、硫酸カルシウム、マイカ、タルク、クレー、アルミナ、酸化マグネシウム、酸化ジルコニウム、水酸化アルミニウム、水酸化マグネシウム、珪酸カルシウム、珪酸アルミニウム、珪酸リチウムアルミニウム、珪酸ジルコニウム、チタン酸バリウム、硝子繊維、炭素繊維、二硫化モリブデン、アスベスト等が挙げられ、好ましくは溶融シリカ、結晶シリカ、窒化珪素、窒化ホウ素、炭酸カルシウム、硫酸バリウム、硫酸カルシウム、マイカ、タルク、クレー、アルミナ、水酸化アルミニウム、珪酸カルシウム、珪酸アルミニウムが挙げられるが、好ましくはシリカ、アルミナ、タルクである。これら無機フィラーは2種以上を混合して用いても良い。
無機フィラーの平均粒子径は、大きすぎると狭ギャップの液晶セル製造時に上下ガラス基板の貼り合わせ時のギャップ形成がうまくできない等の不良要因となるため、2000nm以下が適当であり、好ましくは1000nm以下、さらに好ましくは300nm以下である。また好ましい下限は10nm程度であり、さらに好ましくは100nm程度である。粒子径はレーザー回折・散乱式粒度分布測定器(乾式)(株式会社セイシン企業製;LMS−30)により測定することができる。
本発明のディスプレイ用封止剤において、無機フィラーを使用する場合には、液晶シール剤の総量中、通常5〜50質量%、好ましくは5〜40質量%である。
[(E) Inorganic filler]
The sealant for a display of the present invention may contain component (E) an inorganic filler (hereinafter, also simply referred to as component (E)). As the inorganic filler contained in the present invention, silica, silicon carbide, silicon nitride, boron nitride, calcium carbonate, magnesium carbonate, barium sulfate, calcium sulfate, mica, talc, clay, alumina, magnesium oxide, zirconium oxide, aluminum hydroxide Magnesium hydroxide, calcium silicate, aluminum silicate, lithium aluminum silicate, zirconium silicate, barium titanate, glass fiber, carbon fiber, molybdenum disulfide, asbestos, etc., preferably fused silica, crystalline silica, silicon nitride, nitrided Boron, calcium carbonate, barium sulfate, calcium sulfate, mica, talc, clay, alumina, aluminum hydroxide, calcium silicate and aluminum silicate can be mentioned, with preference given to silica, alumina and talc. These inorganic fillers may be used as a mixture of two or more.
If the average particle diameter of the inorganic filler is too large, it may be a defect factor such that the gap formation at the time of bonding of the upper and lower glass substrates can not be performed well when producing a narrow gap liquid crystal cell. More preferably, it is 300 nm or less. The lower limit is preferably about 10 nm, and more preferably about 100 nm. The particle diameter can be measured by a laser diffraction / scattering type particle size distribution measuring device (dry type) (manufactured by Seishin Enterprise Co., Ltd .; LMS-30).
When an inorganic filler is used in the sealant for a display of the present invention, it is usually 5 to 50% by mass, preferably 5 to 40% by mass, in the total amount of the liquid crystal sealing agent.
[(F)シランカップリング剤]
本発明のディスプレイ用封止剤は、成分(F)シランカップリング剤(以下、単に成分(F)ともいう。)を添加して、接着強度や耐湿性の向上を図ることができる。
成分(F)としては、3−グリシドキシプロピルトリメトキシシラン、3−グリシドキシプロピルメチルジメトキシシラン、3−グリシドキシプロピルメチルジエトキシシラン、2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、N−フェニル−γ−アミノプロピルトリメトキシシラン、N−(2−アミノエチル)3−アミノプロピルメチルジメトキシシラン、N−(2−アミノエチル)3−アミノプロピルメチルトリメトキシシラン、3−アミノプロピルトリエトキシシラン、3−メルカプトプロピルトリメトキシシラン、ビニルトリメトキシシラン、N−(2−(ビニルベンジルアミノ)エチル)3−アミノプロピルトリメトキシシラン塩酸塩、3−メタクリロキシプロピルトリメトキシシラン、3−クロロプロピルメチルジメトキシシラン、3−クロロプロピルトリメトキシシラン等が挙げられる。これらのシランカップリング剤はKBMシリーズ、KBEシリーズ等として信越化学工業株式会社等によって販売されている為、市場から容易に入手可能である。本発明のディスプレイ用封止剤において、成分(F)を使用する場合には、ディスプレイ用封止剤総量中、0.05〜3質量%が好適である。
[(F) Silane coupling agent]
Component (F) a silane coupling agent (hereinafter, also simply referred to as component (F)) can be added to the sealant for a display of the present invention to improve adhesion strength and moisture resistance.
As the component (F), 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 2- (3,4-epoxycyclohexyl) ethyl tritrile Methoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N- (2-aminoethyl) 3-aminopropylmethyldimethoxysilane, N- (2-aminoethyl) 3-aminopropylmethyltrimethoxysilane, 3- Aminopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, vinyltrimethoxysilane, N- (2- (vinylbenzylamino) ethyl) 3-aminopropyltrimethoxysilane hydrochloride, 3-methacryloxypropyltrimethoxysilane, 3-chloropropyl Chill dimethoxysilane, 3-chloropropyl trimethoxy silane, and the like. Since these silane coupling agents are sold by Shin-Etsu Chemical Co., Ltd. as KBM series, KBE series etc., they are easily available from the market. When the component (F) is used in the sealant for a display of the present invention, 0.05 to 3% by mass of the total sealant for a display is preferable.
[(G)熱硬化剤]
本発明のディスプレイ用封止剤は、成分(G)熱硬化剤(以下、単に成分(G)ともいう。)を含有しても良い。成分(G)は非共有電子対や分子内のアニオンによって、求核的に反応するものであって、例えば多価アミン類、多価フェノール類、有機酸ヒドラジド化合物等を挙げる事ができる。ただしこれらに限定されるものではない。これらのうち有機酸ヒドラジド化合物が特に好適に用いられる。例えば、芳香族ヒドラジドであるテレフタル酸ジヒドラジド、イソフタル酸ジヒドラジド、2,6−ナフトエ酸ジヒドラジド、2,6−ピリジンジヒドラジド、1,2,4−ベンゼントリヒドラジド、1,4,5,8−ナフトエ酸テトラヒドラジド、ピロメリット酸テトラヒドラジド等をあげることが出来る。また、脂肪族ヒドラジド化合物であれば、例えば、ホルムヒドラジド、アセトヒドラジド、プロピオン酸ヒドラジド、シュウ酸ジヒドラジド、マロン酸ジヒドラジド、コハク酸ジヒドラジド、グルタル酸ジヒドラジド、アジピン酸ジヒドラジド、ピメリン酸ジヒドラジド、セバシン酸ジヒドラジド、1,4−シクロヘキサンジヒドラジド、酒石酸ジヒドラジド、リンゴ酸ジヒドラジド、イミノジ酢酸ジヒドラジド、N,N’−ヘキサメチレンビスセミカルバジド、クエン酸トリヒドラジド、ニトリロ酢酸トリヒドラジド、シクロヘキサントリカルボン酸トリヒドラジド、1,3−ビス(ヒドラジノカルボノエチル)−5−イソプロピルヒダントイン等のヒダントイン骨格、好ましくはバリンヒダントイン骨格(ヒダントイン環の炭素原子がイソプロピル基で置換された骨格)を有するジヒドラジド化合物、トリス(1−ヒドラジノカルボニルメチル)イソシアヌレート、トリス(2−ヒドラジノカルボニルエチル)イソシアヌレート、トリス(1−ヒドラジノカルボニルエチル)イソシアヌレート、トリス(3−ヒドラジノカルボニルプロピル)イソシアヌレート、ビス(2−ヒドラジノカルボニルエチル)イソシアヌレート等をあげることができる。硬化反応性と潜在性のバランスから好ましくは、イソフタル酸ジヒドラジド、マロン酸ジヒドラジド、アジピン酸ジヒドラジド、トリス(1−ヒドラジノカルボニルメチル)イソシアヌレート、トリス(1−ヒドラジノカルボニルエチル)イソシアヌレート、トリス(2−ヒドラジノカルボニルエチル)イソシアヌレート、トリス(3−ヒドラジノカルボニルプロピル)イソシアヌレートであり、特に好ましくはトリス(2−ヒドラジノカルボニルエチル)イソシアヌレートである。
成分(G)は単独で用いても良いし、2種類以上を混合しても良い。本発明のディスプレイ用封止剤において、成分(G)を使用する場合には、ディスプレイ用封止剤総量中、通常0.1〜10質量%、好ましくは1〜5質量%である。
[(G) heat curing agent]
The display sealing agent of the present invention may contain component (G) a thermosetting agent (hereinafter, also simply referred to as component (G)). The component (G) is reacted nucleophilically by a noncovalent electron pair or an anion in the molecule, and examples thereof include polyhydric amines, polyhydric phenols, organic acid hydrazide compounds and the like. However, it is not limited to these. Among these, organic acid hydrazide compounds are particularly preferably used. For example, aromatic hydrazide terephthalic acid dihydrazide, isophthalic acid dihydrazide, 2,6-naphthoic acid dihydrazide, 2,6-pyridine dihydrazide, 1,2,4-benzenetrihydrazide, 1,4,5,8-naphthoic acid Tetrahydrazide, pyromellitic acid tetrahydrazide and the like can be mentioned. And aliphatic hydrazide compounds such as form hydrazide, acetohydrazide, propionic acid hydrazide, oxalic acid dihydrazide, malonic acid dihydrazide, succinic acid dihydrazide, glutaric acid dihydrazide, glutaric acid dihydrazide, adipic acid dihydrazide, pimelic acid dihydrazide, sebacic acid dihydrazide, 1,4-cyclohexanedihydrazide, tartaric acid dihydrazide, malic acid dihydrazide, iminodiacetic acid dihydrazide, N, N'-hexamethylene bissemicarbazide, citric acid trihydrazide, nitriloacetic acid trihydrazide, cyclohexane tricarboxylic acid trihydrazide, 1,3-bis ( Hydantoin skeletons such as hydrazino carbonoethyl) -5-isopropyl hydantoin, preferably valine hydantoin skeleton (where the carbon atom of the hydantoin ring is Dihydrazide compounds having a skeleton substituted with a propyl group, tris (1-hydrazinocarbonylmethyl) isocyanurate, tris (2-hydrazinocarbonylethyl) isocyanurate, tris (1-hydrazinocarbonylethyl) isocyanurate, tris Examples thereof include (3-hydrazinocarbonylpropyl) isocyanurate, bis (2-hydrazinocarbonylethyl) isocyanurate and the like. Preferably, from the balance of curing reactivity and latency, isophthalic acid dihydrazide, malonic acid dihydrazide, adipic acid dihydrazide, tris (1-hydrazinocarbonylmethyl) isocyanurate, tris (1-hydrazinocarbonylethyl) isocyanurate, tris ( 2-hydrazinocarbonylethyl) isocyanurate, tris (3-hydrazinocarbonylpropyl) isocyanurate, particularly preferably tris (2-hydrazinocarbonylethyl) isocyanurate.
The component (G) may be used alone or in combination of two or more. When the component (G) is used in the sealant for a display of the present invention, the total amount of the sealant for a display is usually 0.1 to 10% by mass, preferably 1 to 5% by mass.
[(H)光ラジカル重合開始剤]
本発明のディスプレイ用封止剤は、成分(H)光ラジカル重合開始剤(以下、単に成分(H)ともいう。)を含有しても良い。光ラジカル重合開始剤としては、紫外線や可視光の照射によって、ラジカルや酸を発生し、連鎖重合反応を開始させる化合物であれば特に限定されないが、例えば、ベンジルジメチルケタール、1−ヒドロキシシクロヘキシルフェニルケトン、ジエチルチオキサントン、ベンゾフェノン、2−エチルアンスラキノン、2−ヒドロキシ−2−メチルプロピオフェノン、2−メチル−〔4−(メチルチオ)フェニル〕−2−モルフォリノ−1−プロパン、2,4,6−トリメチルベンゾイルジフェニルホスヒンオキサイド、カンファーキノン、9−フルオレノン、ジフェニルジスルヒド等を挙げることができる。具体的には、IRGACURERTM 651、184、2959、127、907、369、379EG、819、784、754、500、OXE01、OXE02、DAROCURERTM1173、LUCIRINRTM TPO(いずれもBASF社製)、セイクオールRTMZ、BZ、BEE、BIP、BBI(いずれも精工化学株式会社製)等を挙げることができる。
また、液晶汚染性の観点から、分子内に(メタ)アクリル基を有するものを使用する事が好ましく、例えば2−メタクリロイルオキシエチルイソシアネートと1−[4−(2−ヒドロキシエトキシ)−フェニル]−2−ヒドロキシ−2メチル−1−プロパン−1−オンとの反応生成物が好適に用いられる。この化合物は国際公開第2006/027982号記載の方法にて製造して得ることができる。
本発明のディスプレイ用封止剤において、成分(H)を使用する場合には、ディスプレイ用封止剤総量中、通常0.001〜3質量%、好ましくは0.002〜2質量%である。
[(H) radical photopolymerization initiator]
The sealant for a display of the present invention may contain component (H) photoradical polymerization initiator (hereinafter, also simply referred to as component (H)). The photo radical polymerization initiator is not particularly limited as long as it is a compound which generates a radical or an acid upon irradiation with ultraviolet light or visible light to initiate a chain polymerization reaction. For example, benzyl dimethyl ketal, 1-hydroxycyclohexyl phenyl ketone Diethylthioxanthone, benzophenone, 2-ethylanthraquinone, 2-hydroxy-2-methylpropiophenone, 2-methyl- [4- (methylthio) phenyl] -2-morpholino-1-propane, 2,4,6- Trimethyl benzoyl diphenyl phosphine oxide, camphor quinone, 9-fluorenone, diphenyl dishydride etc. can be mentioned. Specifically, IRGACURE RTM 651, 184, 2959, 127, 907, 369, 379 EG, 819, 784, 754, 500, OXE01, OXE02, DAROCURE RTM 1173, LUCIRIN RTM TPO (all manufactured by BASF Corporation), Seikoll RTM Z, BZ, BEE, BIP, BBI (all manufactured by Seiko Instruments Inc.) and the like can be mentioned.
Further, from the viewpoint of liquid crystal staining, it is preferable to use one having a (meth) acryl group in the molecule, for example, 2-methacryloyloxyethyl isocyanate and 1- [4- (2-hydroxyethoxy) -phenyl]- The reaction product with 2-hydroxy-2 methyl-1-propan-1-one is preferably used. This compound can be obtained by preparation according to the method described in WO 2006/027982.
When the component (H) is used in the sealant for display of the present invention, it is usually 0.001 to 3% by mass, preferably 0.002 to 2% by mass in the total amount of the sealant for display.
[(I)熱ラジカル重合開始剤]
本発明のディスプレイ用封止剤は、成分(I)熱ラジカル重合開始剤(以下、単に「成分(I)」ともいう。)を含有して、硬化速度、硬化性を向上することができる。
熱ラジカル重合開始剤は、加熱によりラジカルを生じ、連鎖重合反応を開始させる化合物であれば特に限定されないが、有機過酸化物、アゾ化合物、ベンゾイン化合物、ベンゾインエーテル化合物、アセトフェノン化合物、ベンゾピナコール等が挙げられ、ベンゾピナコールが好適に用いられる。例えば、有機過酸化物としては、カヤメックRTMA、M、R、L、LH、SP−30C、パーカドックスCH−50L、BC−FF、カドックスB−40ES、パーカドックス14、トリゴノックスRTM22−70E、23−C70、121、121−50E、121−LS50E、21−LS50E、42、42LS、カヤエステルRTMP−70、TMPO−70、CND−C70、OO−50E、AN、カヤブチルRTMB、パーカドックス16、カヤカルボンRTMBIC−75、AIC−75(化薬アクゾ株式会社製)、パーメックRTMN、H、S、F、D、G、パーヘキサRTMH、HC、TMH、C、V、22、MC、パーキュアーRTMAH、AL、HB、パーブチルRTMH、C、ND、L、パークミルRTMH、D、パーロイルRTMIB、IPP、パーオクタRTMND(日油株式会社製)などが市販品として入手可能である。
[(I) thermal radical polymerization initiator]
The sealant for a display of the present invention can improve the curing speed and the curability by containing the component (I) thermal radical polymerization initiator (hereinafter, also simply referred to as "component (I)").
The thermal radical polymerization initiator is not particularly limited as long as it generates a radical by heating to initiate chain polymerization reaction, but organic peroxides, azo compounds, benzoin compounds, benzoin ether compounds, acetophenone compounds, benzopinacol, etc. Preferably, benzopinacol is used. For example, as organic peroxides, Kayamec RTM A, M, R, L, LH, SP-30C, Percadox CH-50L, BC-FF, Cadox B-40 ES, Percadox 14, Trigonox RTM 22-70E, 23-C70, 121, 121-50E, 121-LS50E, 21-LS50E, 42, 42LS, Kayaester RTM P-70, TMPO-70, CND-C70, OO-50 E, AN, Kayabutyl RTM B, Perka Dox 16 Kayacaron RTM BIC-75, AIC-75 (manufactured by Kayaku Akzo Co., Ltd.), Permec RTM N, H, S, F, D, G, Perhexa RTM H, HC, TMH, C, V, 22, MC, Percure RTM AH, AL, HB, Perbutyl RTM H, C, ND, L , Percumyl RT H, D, PEROYL RTM IB, IPP, Perocta RTM ND (manufactured by NOF Corporation) and the like are commercially available.
また、アゾ化合物としては、VA−044、086、V−070、VPE−0201、VSP−1001(和光純薬工業株式会社製)等が市販品として入手可能である。 Moreover, as an azo compound, VA-044, 086, V-070, VPE-0201, VSP-1001 (made by Wako Pure Chemical Industries Ltd.) etc. are available as a commercial item.
成分(I)の含有量としては、ディスプレイ用封止剤の総量中、0.0001〜10質量%であることが好ましく、さらに好ましくは0.0005〜5質量%であり、0.001〜3質量%が特に好ましい。 The content of the component (I) is preferably 0.0001 to 10% by mass, more preferably 0.0005 to 5% by mass, based on the total amount of the sealing agent for display, and 0.001 to 3%. % By weight is particularly preferred.
[その他成分]
本発明のディスプレイ用封止剤には、さらに必要に応じて、有機酸やイミダゾール等の硬化促進剤、ラジカル重合防止剤、顔料、レベリング剤、消泡剤、溶剤などの添加剤を配合することができる。
[Other ingredients]
The sealant for a display of the present invention may further be blended with additives such as a curing accelerator such as an organic acid and imidazole, a radical polymerization inhibitor, a pigment, a leveling agent, an antifoamer, and a solvent, as necessary. Can.
[硬化促進剤]
上記硬化促進剤としては、有機酸やイミダゾール等を挙げることができる。
有機酸としては、有機カルボン酸や有機リン酸等が挙げられるが、有機カルボン酸である場合が好ましい。具体的には、フタル酸、イソフタル酸、テレフタル酸、トリメリット酸、ベンゾフェノンテトラカルボン酸、フランジカルボン酸等の芳香族カルボン酸、コハク酸、アジピン酸、ドデカン二酸、セバシン酸、チオジプロピオン酸、シクロヘキサンジカルボン酸、トリス(2−カルボキシメチル)イソシアヌレート、トリス(2−カルボキシエチル)イソシアヌレート、トリス(2−カルボキシプロピル)イソシアヌレート、ビス(2−カルボキシエチル)イソシアヌレート等を挙げることができる。
また、イミダゾール化合物としては、2−メチルイミダゾール、2−フェニルイミダゾール、2−ウンデシルイミダゾール、2−ヘプタデシルイミダゾール、2−フェニル−4−メチルイミダゾール、1−ベンジル−2−フェニルイミダゾール、1−ベンジル−2−メチルイミダゾール、1−シアノエチル−2−メチルイミダゾール、1−シアノエチル−2−フェニルイミダゾール、1−シアノエチル−2−ウンデシルイミダゾール、2,4−ジアミノ−6(2’−メチルイミダゾール(1’))エチル−s−トリアジン、2,4−ジアミノ−6(2’−ウンデシルイミダゾール(1’))エチル−s−トリアジン、2 ,4−ジアミノ−6(2 ’−エチル−4−メチルイミダゾール(1’))エチル−s−トリアジン、2,4− ジアミノ−6(2’−メチルイミダゾール(1 ’))エチル−s−トリアジン・イソシアヌル酸付加物、2−メチルイミダゾールイソシアヌル酸の2:3付加物、2−フェニルイミダゾールイソシアヌル酸付加物、2−フェニル−3,5−ジヒドロキシメチルイミダゾール、2−フェニル−4−ヒドロキシメチル−5−メチルイミダゾール、1−シアノエチル−2−フェニル−3,5−ジシアノエトキシメチルイミダゾール等が挙げられる。
本発明のディスプレイ用封止剤において、硬化促進剤を使用する場合には、ディスプレイ用封止剤の総量中、通常0.1〜10質量%、好ましくは1〜5質量%である。
[Hardening accelerator]
Examples of the curing accelerator include organic acids and imidazoles.
As an organic acid, although an organic carboxylic acid, an organic phosphoric acid, etc. are mentioned, the case where it is an organic carboxylic acid is preferable. Specifically, aromatic carboxylic acids such as phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, benzophenone tetracarboxylic acid, furandicarboxylic acid, succinic acid, adipic acid, dodecanedioic acid, sebacic acid, thiodipropionic acid And cyclohexanedicarboxylic acid, tris (2-carboxymethyl) isocyanurate, tris (2-carboxyethyl) isocyanurate, tris (2-carboxypropyl) isocyanurate, bis (2-carboxyethyl) isocyanurate and the like. .
In addition, as an imidazole compound, 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl -2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 2,4-diamino-6 (2′-methylimidazole (1 ′ )) Ethyl-s-triazine, 2,4-diamino-6 (2′-undecylimidazole (1 ′)) ethyl-s-triazine, 2,4-diamino-6 (2′-ethyl-4-methylimidazole (1 ′)) Ethyl-s-triazine, 2,4-diamino-6 (2′- Methylimidazole (1 ')) ethyl-s-triazine isocyanuric acid adduct, 2: 3 adduct of 2-methylimidazole isocyanuric acid, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-3,5-dihydroxymethyl Examples include imidazole, 2-phenyl-4-hydroxymethyl-5-methylimidazole, 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole and the like.
When a curing accelerator is used in the sealant for a display of the present invention, it is usually 0.1 to 10% by mass, preferably 1 to 5% by mass in the total amount of the sealant for a display.
[ラジカル重合防止剤]
上記ラジカル重合防止剤としては、光ラジカル重合開始剤や熱ラジカル重合開始剤等から発生するラジカルと反応して重合を防止する化合物であれば特に限定されるものではなく、キノン系、ピペリジン系、ヒンダードフェノール系、ニトロソ系等を用いることができる。具体的には、ナフトキノン、2−ヒドロキシナフトキノン、2−メチルナフトキノン、2−メトキシナフトキノン、2,2,6,6−テトラメチルピペリジン−1−オキシル、2,2,6,6−テトラメチル−4−ヒドロキシピペリジン−1−オキシル、2,2,6,6,−テトラメチル−4−メトキシピペリジン−1−オキシル、2,2,6,6−テトラメチル−4−フェノキシピペリジン−1−オキシル、ハイドロキノン、2−メチルハイドロキノン、2−メトキシハイドロキノン、パラベンゾキノン、ブチル化ヒドロキシアニソール、2,6−ジ−t−ブチル−4−エチルフェノール、2,6−ジ−t−ブチルクレゾール、ステアリルβ−(3,5−ジ−t−ブチル−4−ヒドロキシフェニル)プロピオネート、2,2’−メチレンビス(4−エチル−6−t−ブチルフェノール)、4,4’−チオビス−3−メチル−6−t−ブチルフェノール)、4,4’−ブチリデンビス(3−メチル−6−t−ブチルフェノール)、3,9−ビス[1,1−ジメチル−2−[β―(3−t−ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオニルオキシ[エチル]、2,4,8,10−テトラオキサスピロ[5,5]ウンデカン、テトラキス−[メチレン−3−(3’,5’−ジ−t−ブチル−4’−ヒドロキシフェニルプロピオネート)]メタン、1,3,5−トリス(3’,5’−ジ−t−ブチル−4’−ヒドロキシベンジル)−sec−トリアジン−2,4,6−(1H,3H,5H)トリオン、パラメトキシフェノール、4−メトキシ−1−ナフトール、チオジフェニルアミン、N−ニトロソフェニルヒドロキシアミンのアルミニウム塩、商品名アデカスタブLA−81、商品名アデカスタブLA−82(株式会社アデカ製)等が挙げられるが、これらに限定されるものではない。これらのうちナフトキノン系、ハイドロキノン系、ニトロソ系ピペラジン系のラジカル重合防止剤が好ましく、ナフトキノン、2−ヒドロキシナフトキノン、ハイドロキノン、2,6−ジ−t−ブチル−P−クレゾール、ポリストップ7300P(伯東株式会社製)が更に好ましく、ポリストップ7300P(伯東株式会社製)が最も好ましい。
ラジカル重合防止剤の含有量としては本発明のディスプレイ用封止剤総量中、0.0001〜1質量%が好ましく、0.001〜0.5質量%が更に好ましく、0.01〜0.2質量%が特に好ましい。
[Radical polymerization inhibitor]
The radical polymerization inhibitor is not particularly limited as long as it is a compound which reacts with radicals generated from photo radical polymerization initiators, thermal radical polymerization initiators, etc. to prevent polymerization, and quinones, piperidines, Hindered phenol type, nitroso type etc. can be used. Specifically, naphthoquinone, 2-hydroxynaphthoquinone, 2-methylnaphthoquinone, 2-methoxynaphthoquinone, 2,2,6,6-tetramethylpiperidine-1-oxyl, 2,2,6,6-tetramethyl-4 -Hydroxypiperidine-1-oxyl, 2,2,6,6-tetramethyl-4-methoxypiperidine-1-oxyl, 2,2,6,6-tetramethyl-4-phenoxypiperidine-1-oxyl, hydroquinone 2-Methylhydroquinone, 2-methoxyhydroquinone, parabenzoquinone, butylated hydroxyanisole, 2,6-di-t-butyl-4-ethylphenol, 2,6-di-t-butylcresol, stearyl β- (3 5-Di-t-butyl-4-hydroxyphenyl) propionate, 2,2'-methylenebis 4-ethyl-6-t-butylphenol), 4,4'-thiobis-3-methyl-6-t-butylphenol), 4,4'-butylidenebis (3-methyl-6-t-butylphenol), 3,9 -Bis [1,1-dimethyl-2- [β- (3-t-butyl-4-hydroxy-5-methylphenyl) propionyloxy [ethyl], 2,4,8,10-tetraoxaspiro [5,5 5] Undecane, tetrakis- [methylene-3- (3 ′, 5′-di-t-butyl-4′-hydroxyphenyl propionate)] methane, 1,3,5-tris (3 ′, 5′-di) -T-Butyl-4'-hydroxybenzyl) -sec-triazine-2,4,6- (1H, 3H, 5H) trione, paramethoxyphenol, 4-methoxy-1-naphthol, thiodiphenylamine, N- Toro Seo aluminum salts of phenyl hydroxy amine, trade name ADK STAB LA-81, but such trade name ADK STAB LA-82 (manufactured by KK ADEKA) and the like, but is not limited thereto. Among them, naphthoquinone type, hydroquinone type and nitroso type piperazine type radical polymerization inhibitors are preferable, and naphthoquinone, 2-hydroxynaphthoquinone, hydroquinone, 2,6-di-t-butyl-P-cresol, polystop 7300P (Shinto stock More preferably manufactured by company, and most preferably Polystop 7300P (manufactured by Shoto Co.).
The content of the radical polymerization inhibitor is preferably 0.0001 to 1% by mass, more preferably 0.001 to 0.5% by mass, and still more preferably 0.01 to 0.2% of the total amount of the sealing agent for a display of the present invention. % By weight is particularly preferred.
本発明のディスプレイ用封止剤を得る方法の一例としては、次に示す方法がある。まず、成分(B)(成分(B−1)と成分(B−2)を用いる場合には、その混合物)に、成分(A)及び必要に応じて成分(H)を加熱溶解する。次いで室温まで冷却後、必要に応じて成分成分(C)、成分(D)、成分(E)、成分(F)、成分(G)、成分(I)、消泡剤、及びレベリング剤、溶剤等を添加し、公知の混合装置、例えば3本ロール、サンドミル、ボールミル等により均一に混合し、金属メッシュにて濾過することにより本発明のディスプレイ用封止剤を製造することができる。 As an example of the method for obtaining the sealing agent for a display of the present invention, there are the following methods. First, the component (A) and, if necessary, the component (H) are heated and dissolved in the component (B) (when using the component (B-1) and the component (B-2), a mixture thereof). Then, after cooling to room temperature, component (C), component (D), component (E), component (F), component (G), component (I), an antifoaming agent, and a leveling agent, a solvent, if necessary The sealing agent for a display of the present invention can be produced by uniformly mixing with a known mixing device such as a 3-roll mill, a sand mill, a ball mill etc. and filtering through a metal mesh.
また、本発明のディスプレイ用封止剤は、液晶表示セル用接着剤、有機EL用接着剤として、特に液晶シール剤として非常に有用である。本発明のディスプレイ用封止剤を液晶シール剤として用いた場合の、液晶表示セルについて、以下に例を示す。 In addition, the sealant for a display of the present invention is very useful as an adhesive for liquid crystal display cells and an adhesive for organic EL, particularly as a liquid crystal sealant. An example is shown below about a liquid crystal display cell at the time of using the sealing agent for displays of this invention as a liquid-crystal sealing agent.
本発明の液晶表示セル用接着剤を用いて製造される液晶表示セルは、基板に所定の電極を形成した一対の基板を所定の間隔に対向配置し、周囲を本発明の液晶シール剤でシールし、その間隙に液晶が封入されたものである。封入される液晶の種類は特に限定されない。ここで、基板とはガラス、石英、プラスチック、シリコン等からなる少なくとも一方に光透過性がある組み合わせの基板から構成される。その製法としては、本発明の液晶シール剤に、グラスファイバー等のスペーサ(間隙制御材)を添加後、該一対の基板の一方にディスペンサー、またはスクリーン印刷装置等を用いて該液晶シール剤を塗布した後、必要に応じて、80〜120℃で仮硬化を行う。その後、該液晶シール剤の堰の内側に液晶を滴下し、真空中にてもう一方のガラス基板を重ね合わせ、ギャップ出しを行う。ギャップ形成後、90〜130℃で30分〜2時間硬化することにより本発明の液晶表示セルを得ることができる。また光熱併用型として使用する場合は、紫外線照射機により液晶シール剤部に紫外線を照射させて光硬化させる。紫外線照射量は、好ましくは500〜6000mJ/cm2、より好ましくは1000〜4000mJ/cm2である。その後必要に応じて、90〜130℃で30分〜2時間硬化することにより本発明の液晶表示セルを得ることができる。このようにして得られた本発明の液晶表示セルは、液晶汚染による表示不良が無く、接着性、耐湿信頼性に優れたものである。スペーサとしては、例えばグラスファイバー、シリカビーズ、ポリマービーズ等があげられる。その直径は、目的に応じ異なるが、通常2〜8μm、好ましくは4〜7μmである。その使用量は、本発明の液晶シール剤100質量部に対し通常0.1〜4質量部、好ましくは0.5〜2質量部、更に、好ましくは0.9〜1.5質量部程度である。 In a liquid crystal display cell manufactured using the adhesive for liquid crystal display cell of the present invention, a pair of substrates having a predetermined electrode formed on the substrate is disposed opposite to each other at a predetermined distance, and the periphery is sealed with the liquid crystal sealant of the present invention The liquid crystal is sealed in the gap. The type of liquid crystal to be enclosed is not particularly limited. Here, the substrate is composed of a combination of light transmitting property to at least one of glass, quartz, plastic, silicon and the like. As the manufacturing method, after adding a spacer (space control material) such as glass fiber to the liquid crystal sealing agent of the present invention, the liquid crystal sealing agent is applied to one of the pair of substrates using a dispenser or a screen printing apparatus. After curing, temporary curing is performed at 80 to 120 ° C., if necessary. Thereafter, liquid crystal is dropped on the inner side of the ridge of the liquid crystal sealing agent, the other glass substrate is superposed in vacuum, and the gap is taken out. After forming the gap, the liquid crystal display cell of the present invention can be obtained by curing at 90 to 130 ° C. for 30 minutes to 2 hours. In the case of using as a light and heat combination type, the liquid crystal sealing agent portion is irradiated with ultraviolet light by an ultraviolet light irradiator and light curing is performed. UV irradiation dose is preferably 500~6000mJ / cm 2, more preferably 1000~4000mJ / cm 2. Thereafter, the liquid crystal display cell of the present invention can be obtained by curing at 90 to 130 ° C. for 30 minutes to 2 hours as required. The liquid crystal display cell of the present invention thus obtained is free from display defects due to liquid crystal contamination, and is excellent in adhesion and moisture resistance. As a spacer, glass fiber, a silica bead, a polymer bead etc. are mention | raise | lifted, for example. The diameter varies depending on the purpose, but is usually 2 to 8 μm, preferably 4 to 7 μm. The amount thereof used is usually about 0.1 to 4 parts by mass, preferably 0.5 to 2 parts by mass, and more preferably about 0.9 to 1.5 parts by mass with respect to 100 parts by mass of the liquid crystal sealing agent of the present invention is there.
本発明のディスプレイ用封止剤は、柔軟性と低透湿性を両立するものである為、フレキシブル基板等が用いられ、かつ耐湿信頼性の要求される分野の接着剤用途の使用に非常に適するものである。例えば液晶シール剤、有機EL用封止剤、タッチパネル用接着剤である。 The sealant for a display of the present invention is compatible with flexibility and low moisture permeability, so that a flexible substrate or the like is used, and it is very suitable for use in an adhesive application in a field requiring moisture reliability and reliability. It is a thing. For example, a liquid crystal sealing agent, a sealant for an organic EL, and an adhesive for a touch panel.
以下、実施例により本発明を更に詳細に説明するが、本発明は実施例に限定されるものではない。尚、特別の記載のない限り、本文中「部」及び「%」とあるのは質量基準である。 Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to the examples. In the following description, "part" and "%" are based on mass unless otherwise specified.
[実施例1〜10、比較例1〜4]
下記表1に示す割合で成分(B)(成分(B−1)と成分(B−2)を用いる場合には、その混合物)に、成分(A)、成分(H)を90℃で加熱溶解させた後、室温まで冷却し、成分(C)、成分(D)、成分(E)、成分(F)、成分(G)、成分(I)を添加し、攪拌した後、3本ロールミルにて分散させ、金属メッシュ(635メッシュ)で濾過し、液晶シール剤実施例1〜10を調製した。また、成分(A)を除いて、比較例1、2を調整し、比較例3、4は成分(A)を変えて、成分(A’)を用い、それぞれ調製した。
[Examples 1 to 10, Comparative Examples 1 to 4]
The component (A) and the component (H) are heated at 90 ° C. to the component (B) (when using the component (B-1) and the component (B-2) in the ratio shown in Table 1 below, a mixture thereof) After dissolving, the mixture is cooled to room temperature, and component (C), component (D), component (E), component (F), component (G) and component (I) are added and stirred, and then three-roll mill The resultant mixture was dispersed at room temperature and filtered through a metal mesh (635 mesh) to prepare Liquid Crystal Sealant Examples 1 to 10. Further, Comparative Example 1 and 2 were prepared except for the component (A), and the comparative examples 3 and 4 were prepared using the component (A ′) while changing the component (A).
[弾性率測定]
実施例及び比較例で製造した液晶シール剤について、ポリエチレンテレフタレート(PET)フィルムに挟み、厚み100μmの薄膜としたものに、メタルハライドランプ(ウシオ電機株式会社製)にて3000mJ/cm2(100mW/cm2で30秒)の紫外線を照射して硬化させた後、120℃のオーブンに40分間投入して硬化させた。その後、PETフィルムをはがしシール剤硬化膜をダンベル状試験片(全体長75mm、全体幅10mm、狭い平行部分の長さ50mm、幅5mm)にカットしサンプル片とした。得られた試験片について、テンシロン万能試験機( 株式会社エー・アンド・デイ製、RTG−1210)を用いて、室温(22℃)下、試験速度5mm/分で引張試験を行い、比例限度内の引張応力とひずみの結果から弾性率を算出した。結果を表1と表2に示す。
[Elasticity measurement]
The liquid crystal sealing agents manufactured in Examples and Comparative Examples were sandwiched between polyethylene terephthalate (PET) films and made into thin films with a thickness of 100 μm using a metal halide lamp (made by Ushio Electric Co., Ltd.) 3000 mJ / cm 2 (100 mW / cm (2 ) for 30 seconds) and then cured by being placed in an oven at 120 ° C. for 40 minutes. Thereafter, the PET film was peeled off and the cured sealant film was cut into a dumbbell-shaped test piece (total length 75 mm, overall width 10 mm, narrow parallel portion length 50 mm, width 5 mm) to obtain a sample piece. The obtained test pieces were subjected to a tensile test at room temperature (22 ° C.) at a test speed of 5 mm / min using a TENSILON universal testing machine (RTG-1210, manufactured by A & D Co., Ltd.). The modulus of elasticity was calculated from the results of tensile stress and strain. The results are shown in Tables 1 and 2.
[ガラス転移温度(Tg)]
実施例及び比較例で製造した液晶シール剤について、ポリエチレンテレフタレート(PET)フィルムに挟み、厚み100μmの薄膜としたものに、メタルハライドランプ(ウシオ電機株式会社製)にて3000mJ/cm2(100mW/cm2で30秒)の紫外線を照射して硬化させた後、120℃のオーブンに40分間投入して硬化させた。その後、PETフィルムをはがしシール剤硬化膜を50mm×5mmの短冊状にカットしサンプル片とした。このサンプル片を動的粘弾性測定装置(DMS−6100:エスアイアイ・ナノテクノロジー社製)の引っ張りモードにて周波数10Hz、昇温温度2℃/分の条件で測定を行った。損失弾性率と貯蔵弾性率との比(JIS K 7244−1)から損失係数Tanδが得られ、得られた損失係数Tanδが最大値となる温度をガラス転移温度(Tg)とした。結果を表1と表2に示す。
[Glass transition temperature (Tg)]
The liquid crystal sealing agents manufactured in Examples and Comparative Examples were sandwiched between polyethylene terephthalate (PET) films and made into thin films with a thickness of 100 μm using a metal halide lamp (made by Ushio Electric Co., Ltd.) 3000 mJ / cm 2 (100 mW / cm (2 ) for 30 seconds) and then cured by being placed in an oven at 120 ° C. for 40 minutes. Thereafter, the PET film was peeled off and the cured sealing agent film was cut into strips of 50 mm × 5 mm to obtain sample pieces. The sample piece was measured under the conditions of a frequency 10 Hz and a temperature elevation temperature of 2 ° C./min in a tension mode of a dynamic viscoelasticity measuring apparatus (DMS-6100: manufactured by SII Nano Technology Inc.). The temperature at which the loss coefficient Tan δ is obtained from the ratio of the loss elastic modulus to the storage elastic modulus (JIS K 7244-1) and the obtained loss coefficient Tan δ is the maximum value is taken as the glass transition temperature (Tg). The results are shown in Tables 1 and 2.
[透湿度]
実施例及び比較例で製造した液晶シール剤について、ポリエチレンテレフタレート(PET)フィルムに挟み、厚み100μmの薄膜としたものに、メタルハライドランプ(ウシオ電機株式会社製)にて3000mJ/cm2(100mW/cm2で30秒)の紫外線を照射して硬化させた後、120℃のオーブンに40分間投入して硬化させた。その後、PETフィルムをはがしサンプルとした。サンプルの60℃90%での透湿度を透湿度測定機(Lessy社製:L80−5000)にて測定した。結果を表1と表2に示す。
Moisture Permeability
The liquid crystal sealing agents manufactured in Examples and Comparative Examples were sandwiched between polyethylene terephthalate (PET) films and made into thin films with a thickness of 100 μm using a metal halide lamp (made by Ushio Electric Co., Ltd.) 3000 mJ / cm 2 (100 mW / cm (2 ) for 30 seconds) and then cured by being placed in an oven at 120 ° C. for 40 minutes. Thereafter, the PET film was peeled off and used as a sample. The moisture permeability at 60 ° C. and 90% of the sample was measured with a moisture permeability measuring device (Lessy: L80-5000). The results are shown in Tables 1 and 2.
[屈曲性]
実施例及び比較例で製造した液晶シール剤について、ポリエチレンテレフタレート(PET)フィルムに挟み、厚み100μmの薄膜としたものに、メタルハライドランプ(ウシオ電機株式会社製)にて3000mJ/cm2(100mW/cm2で30秒)の紫外線を照射して硬化させた後、120℃のオーブンに40分間投入して硬化させた。その後、PETフィルムをはがしシール剤硬化膜を50mm×5mmの短冊状にカットしサンプル片とした。得られたサンプルを2mmΦの棒に巻き付け、10秒間固定した。試験片が割れていないものを○、試験片が割れたものを×として評価した。結果を表1と表2に示す。
[Flexibility]
The liquid crystal sealing agents manufactured in Examples and Comparative Examples were sandwiched between polyethylene terephthalate (PET) films and made into thin films with a thickness of 100 μm using a metal halide lamp (made by Ushio Electric Co., Ltd.) 3000 mJ / cm 2 (100 mW / cm (2 ) for 30 seconds) and then cured by being placed in an oven at 120 ° C. for 40 minutes. Thereafter, the PET film was peeled off and the cured sealing agent film was cut into strips of 50 mm × 5 mm to obtain sample pieces. The obtained sample was wound around a 2 mm 棒 rod and fixed for 10 seconds. The sample in which the test pieces were not broken was evaluated as ○, and the one in which the test pieces were cracked was evaluated as x. The results are shown in Tables 1 and 2.
[描画性]
実施例及び比較例で製造された液晶シール剤各100gにスペーサとして直径5μmのグラスファイバー1g(PF−50S;日本電気硝子株式会社製)を添加して混合撹拌脱泡を行い、シリンジに充填した。ITO透明電極付きガラス基板に先にシリンジに充填した液晶シール剤をディスペンサー(SHOTMASTER300:武蔵エンジニアリング株式会社製)を使って、シールパターン及びダミーシールパターンの塗布を行い、描画可能でシールの直線形状がきれいなものを○、描画可能ではあるがシールの直線形状が汚いものを△、描画不可能なものを×として評価した。結果を表1と表2に示す。
[Drawability]
1 g of glass fiber with a diameter of 5 μm (PF-50S; made by Nippon Electric Glass Co., Ltd.) was added as a spacer to 100 g of each of the liquid crystal sealing agents manufactured in Examples and Comparative Examples to carry out mixing, stirring and degassing, and filled in a syringe . A seal pattern and a dummy seal pattern are applied using a dispenser (SHOTMASTER 300: manufactured by Musashi Engineering Co., Ltd.) with a liquid crystal sealing agent previously filled in a syringe on a glass substrate with an ITO transparent electrode, and drawing is possible. A clean one was evaluated as ○, a drawable but dirty linear shape of the seal was evaluated as Δ, and a non-drawable one as x. The results are shown in Tables 1 and 2.
[相溶性評価]
成分(A)と同質量のビスフェノールA型エポキシメタクリレートとを90℃において1時間加熱混合し、22℃で1時間静置した。混合物の静置後の状態を、○は相溶している、△はわずかに白濁している、×は白濁している、または分離している、として相溶性を評価した。相溶しない成分は成分(A’)として、表1と表2に示す。相溶性評価の結果を表3に示す。
[Compatibility evaluation]
Component (A) was mixed with the same mass of bisphenol A epoxy methacrylate at 90 ° C. for 1 hour, and allowed to stand at 22 ° C. for 1 hour. The state after the mixture was allowed to stand was evaluated as ○ is compatible, Δ is slightly turbid, x is turbid or segregated. The incompatible components are shown in Table 1 and Table 2 as Component (A '). The results of the compatibility evaluation are shown in Table 3.
表1に示されるように、実施例1〜10のディスプレイ用封止剤は、描画性にも優れ柔軟性が高く、それでいて透湿度も低い値を示している。従って、本発明のディスプレイ用封止剤は、フレキシブル基板等に使用される接着剤として、優れた特性を有することが確認された。 As shown in Table 1, the sealing agent for displays of Examples 1 to 10 is excellent in the drawing property and high in flexibility, and yet the moisture permeability is also low. Therefore, it was confirmed that the sealing agent for a display of the present invention has excellent properties as an adhesive used for a flexible substrate or the like.
本発明のディスプレイ用封止剤は、描画性にも優れ、柔軟性と低透湿性を両立できるものである為、電子部品用接着剤、特にディスプレイ用封止剤として有用である。 The sealing agent for a display of the present invention is excellent in drawing property and compatible with flexibility and low moisture permeability, and thus is useful as an adhesive for electronic parts, particularly as a sealing agent for a display.
Claims (21)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017203287A JP7136536B2 (en) | 2017-10-20 | 2017-10-20 | display sealant |
TW107130343A TW201923016A (en) | 2017-10-20 | 2018-08-30 | Sealant for displayer |
KR1020180118197A KR102641805B1 (en) | 2017-10-20 | 2018-10-04 | Sealant for display and liquid crystal sealing agent using the same, and liquid crystal display cell |
CN201811196557.1A CN109694682B (en) | 2017-10-20 | 2018-10-15 | Encapsulant for display |
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JP2017203287A JP7136536B2 (en) | 2017-10-20 | 2017-10-20 | display sealant |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2021516267A (en) * | 2017-12-28 | 2021-07-01 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA | Epoxy composition |
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- 2018-08-30 TW TW107130343A patent/TW201923016A/en unknown
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- 2018-10-15 CN CN201811196557.1A patent/CN109694682B/en active Active
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JPS62133106A (en) * | 1985-11-29 | 1987-06-16 | Showa Denko Kk | Highly elastic yarn |
JP2000171804A (en) * | 1998-12-05 | 2000-06-23 | Dainippon Printing Co Ltd | Liquid crystal display device and its manufacture |
JP2000258780A (en) * | 1999-03-05 | 2000-09-22 | Mitsubishi Electric Corp | Liquid crystal display device and its production |
JP2005054164A (en) * | 2003-07-24 | 2005-03-03 | Sekisui Chem Co Ltd | Photo- and heat-curable resin composition, sealing agent for liquid crystal display element, opening-sealing agent for the liquid crystal display element, vertically-conducting material for the liquid crystal display element, and liquid crystal display device |
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JP2021516267A (en) * | 2017-12-28 | 2021-07-01 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA | Epoxy composition |
JP7154301B2 (en) | 2017-12-28 | 2022-10-17 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | epoxy composition |
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CN109694682A (en) | 2019-04-30 |
KR102641805B1 (en) | 2024-02-27 |
CN109694682B (en) | 2023-03-17 |
KR20190044497A (en) | 2019-04-30 |
JP7136536B2 (en) | 2022-09-13 |
TW201923016A (en) | 2019-06-16 |
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