JP2016186552A - Liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal display device with the higher reliability.SOLUTION: A liquid crystal display device includes: a first substrate; a second substrate disposed opposite to the first substrate; a liquid crystal layer disposed between the first substrate and the second substrate and including liquid crystal molecules; a first alignment film provided for the first substrate and aligning the liquid crystal molecules; and a sealing material for attaching the first substrate and the second substrate to each other. The first alignment film is an optical alignment film. The sealing material contains an epoxy resin without an acrylate skeleton and a resin with an acrylate skeleton. The storage elastic modulus of the sealing material is 1.0×10Pa or more and 1.5×10Pa or less. At least a part of the sealing material is in contact with the first alignment film.SELECTED DRAWING: Figure 3

Description

  Embodiments described herein relate generally to a liquid crystal display device.

  A liquid crystal display panel included in a liquid crystal display device includes two opposing substrates and a sealing material that seals the substrates together. In recent years, since a liquid crystal display device has become narrower, the area of a region where a sealing material is formed is reduced, and the sealing material is often disposed on an organic film such as an alignment film. For this reason, development of a sealing material capable of obtaining sufficient adhesion strength with respect to an organic film in a smaller area has been performed. Patent document 1 is disclosing about the sealing material formed with the curable resin composition for liquid crystal display elements which prescribed | regulated physical properties, such as a glass transition temperature and a linear expansion coefficient. Patent document 2 is disclosing about the sealing material characterized by not containing an inorganic filler.

JP 2005-234129 A JP 2010-85712 A

  When a photo-alignment film having a lower adhesion strength to the sealing material than the rubbing film is used for the alignment film, the conventional sealing material may cause a decrease in reliability due to peeling between the alignment film and the sealing material.

  An object of the present embodiment is to provide a liquid crystal display device with improved reliability.

According to this embodiment,
A first substrate; a second substrate disposed at a position opposite to the first substrate; a liquid crystal layer including liquid crystal molecules disposed between the first substrate and the second substrate; and the first substrate A liquid crystal display device comprising: a first alignment film that is formed and aligns the liquid crystal molecules; and a sealing material that bonds the first substrate and the second substrate, wherein the first alignment film is a photo-alignment film. The sealing material includes an epoxy resin having no acrylate skeleton and a resin having an acrylate skeleton, and the storage elastic modulus of the sealing material is 1.0 × 10 ⁷ Pa or more and 1.5 × There is provided a liquid crystal display device having a pressure of 10 ⁹ Pa or less and at least a part of the sealing material being in contact with the first alignment film.

FIG. 1 is a diagram schematically showing the liquid crystal display device according to the present embodiment. FIG. 2 is a diagram showing a cross section in the display region of the liquid crystal display device. FIG. 3 is a plan view of the first substrate from the normal direction of the main surface. FIG. 4 is a diagram illustrating a cross section of the first short side of the liquid crystal display device. FIG. 5 is a plan view of a modification of the first substrate. FIG. 6 is a list of sealing materials of the examples. FIG. 7 is a list of alignment films of the example. FIG. 8 is a diagram schematically illustrating an evaluation method of the example. FIG. 9 is a list of evaluation results of the examples.

  Hereinafter, the present embodiment will be described with reference to the drawings. It should be noted that the disclosure is merely an example, and those skilled in the art can easily conceive of appropriate changes while maintaining the gist of the invention are naturally included in the scope of the present invention. In addition, for the sake of clarity, the drawings may be schematically represented with respect to the width, thickness, shape, etc. of each part as compared to actual aspects, but are merely examples, and The interpretation is not limited. In addition, in the present specification and each drawing, components that perform the same or similar functions as those described above with reference to the previous drawings are denoted by the same reference numerals, and repeated detailed description may be omitted as appropriate. .

  Hereinafter, description will be given with reference to the drawings.

  FIG. 1 is a diagram schematically showing the liquid crystal display device according to the present embodiment.

  The liquid crystal display device DSP includes an active matrix type display panel PNL. The display panel PNL includes a first substrate SUB1, a second substrate SUB2 disposed opposite to the first substrate SUB1, and a liquid crystal layer LQ held between the first substrate SUB1 and the second substrate SUB2. Yes. The first substrate SUB1 and the second substrate SUB2 are bonded by a seal material SE in a state where a predetermined cell gap is formed between them. The liquid crystal layer LQ is held inside the cell gap between the first substrate SUB1 and the second substrate SUB2 and surrounded by the sealing material SE formed in a loop shape. The display panel PNL includes a display area ACT that displays an image on the inner side surrounded by the seal material SE. The display area ACT has, for example, a substantially rectangular shape and includes a plurality of pixels PX arranged in a matrix.

  The pixel PX includes a gate line G, a source line S, a switching element SW, a pixel electrode PE, and a common electrode CE. The gate line G extends along the first direction X. The source line S extends along a second direction Y that intersects the first direction X. The switching element SW is electrically connected to the gate line G and the source line S, and the pixel electrode PE is electrically connected to the switching element SW. The common electrode CE is opposed to the pixel electrode PE through the liquid crystal layer LQ. For example, the display panel PNL has a rectangular shape, the first direction X is a direction along the short side of the display panel PNL, and the second direction Y is a direction along the long side of the display panel PNL. .

  In the illustrated example, the first substrate SUB1 has a mounting portion MT that extends outward from the substrate end of the second substrate SUB2. A signal supply source for supplying signals necessary for driving the display panel PNL such as the driving IC chip 2 and the flexible printed circuit (FPC) substrate 3 is located in the PRP outside the display area ACT, and is mounted on the mounting portion MT. Has been implemented.

  FIG. 2 is a diagram showing a cross section in the display region of the liquid crystal display device.

  In this figure, as an example, an FFS (Fringe Field Switching) mode liquid crystal display device using a lateral electric field is shown. However, the display mode of the liquid crystal display device DSP in the present embodiment is not particularly limited, and other modes using a lateral electric field such as an IPS (In Plane Switching) mode, a TN (Twisted Nematic) mode, an ECB A mode that mainly uses a longitudinal electric field such as an (Electrically Controlled Birefringence) mode, an OCB (Optically Compensated Bend) mode, or a VA (Vertically Aligned) mode may be used.

  The liquid crystal display device DSP includes a first substrate SUB1, a second substrate SUB2, a liquid crystal layer LQ, a first optical element OD1, a second optical element OD2, and a backlight unit BL.

  The first substrate SUB1 includes a first insulating substrate 10, a first insulating film 11, a common electrode CE, a second insulating film 12, a pixel electrode PE, a first alignment film AL1, and the like. The first insulating substrate 10 is formed of a material having optical transparency and insulating properties such as glass and resin. The first insulating film 11 is disposed above the first insulating substrate 10. The first insulating film 11 is made of an organic material such as acrylic resin. A common electrode CE is formed on the first insulating film 11. The common electrode CE is formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). The second insulating film 12 is disposed on the common electrode CE. The second insulating film 12 is formed of an inorganic material such as silicon oxide or silicon nitride.

  The pixel electrode PE is disposed on the second insulating film 12. That is, the pixel electrode PE is opposed to the common electrode CE with the second insulating film 12 interposed therebetween. A slit SLA is formed in the pixel electrode PE. The slit SLA penetrates the pixel electrode PE and exposes the second insulating film 12. The pixel electrode PE is made of a transparent conductive material such as ITO or IZO.

  The first alignment film AL1 covers the second insulating film 12 and the pixel electrode PE. In other words, the inorganic material layers such as the second insulating film 12 and the pixel electrode PE are in contact with the first alignment film AL1. The first alignment film AL1 is formed of a material exhibiting horizontal alignment and is disposed on the side of the first substrate SUB1 that is in contact with the liquid crystal layer LQ.

  The second substrate SUB2 includes a second insulating substrate 20, a light shielding layer BM, a first color filter CF1, a second color filter CF2, a third color filter CF3, an overcoat layer OC, a second alignment film AL2, and the like. The second insulating substrate 20 is made of a light transmissive and insulating material such as glass or resin.

  The light shielding layer BM is formed on the side of the second insulating substrate 20 facing the liquid crystal layer LQ. The light shielding layer BM is formed of a black resin material or a light shielding metal material having low light transmittance and low reflectance.

  The first color filter CF1, the second color filter CF2, and the third color filter CF3 are formed on the second insulating substrate 20 and the light shielding layer BM on the side facing the liquid crystal layer LQ. Adjacent ends of the color filters face the light shielding layer BM. Each color filter CF is disposed in each pixel PX. The first color filter CF1 is, for example, a blue color filter formed of a resin colored in blue. The second color filter CF2 is a green color filter formed of, for example, a resin colored green. The third color filter CF3 is, for example, a red color filter formed of a resin colored red. The first color filter CF1, the second color filter CF2, and the third color filter CF3 may be formed of a resin colored in other colors such as yellow, or are formed of a transparent resin that is not colored. May be. Further, the liquid crystal display device DSP may further include a fourth color filter.

  The overcoat layer OC covers each color filter. The overcoat layer OC inhibits impurities from entering the liquid crystal layer LQ from the second substrate SUB2. The overcoat layer OC is formed of, for example, a transparent resin material.

  The second alignment film AL2 covers the overcoat layer OC. The second alignment film AL2 is formed of an organic material exhibiting horizontal alignment, and is disposed on the surface in contact with the liquid crystal layer LQ of the second substrate SUB2. The first alignment film AL1 and the second alignment film AL2 are subjected to an alignment process. The first alignment film AL1 and the second alignment film AL2 are made of polyimide, for example, and correspond to an organic material layer. The first alignment film AL1 is a photo-alignment film that has been subjected to a photo-alignment process. The alignment process applied to the second alignment film AL2 may be a rubbing process, but is preferably a photo-alignment process as with the first alignment film AL1.

  Photo-alignment treatment is a photoisomerization type in which the geometrical arrangement in the molecule changes when irradiated with polarized ultraviolet rays, a photodimerization type in which chemical bonds are generated by ultraviolet rays in which molecular skeletons are polarized, and polarized ultraviolet rays. There is a photolytic type in which only the polymer chain aligned in that direction is cleaved and decomposed by irradiating and leaving the polymer chain in the direction perpendicular to the polarization direction. Among these, photodegradation type photo-alignment treatment is suitable for a polyimide photo-alignment film from the viewpoint of reliability and performance.

  For example, in preparing a photodegradable photo-alignment film, first, a polyimide precursor dissolved in various solvents is applied onto a substrate. The polyimide precursor is preferably a polyamic acid or a polyamic acid ester having the structural unit represented by (Chemical Formula 1). The polyamic acid or the polyamic acid ester may be used alone, but a plurality of types may be blended and used. In the formula, H represents a hydrogen atom, N represents a nitrogen atom, O represents an oxygen atom, A represents a tetravalent organic group, and D represents a divalent organic group. Examples of A include aromatic compounds such as a phenylene ring, naphthalene ring, and anthracene ring, alicyclic compounds such as cyclobutane, cyclopentane, and cyclohexane, and compounds in which a substituent is bonded to these compounds. Examples of D include aromatic compounds such as phenylene, biphenylene, oxybiphenylene, biphenyleneamine, naphthalene, and anthracene, alicyclic compounds such as cyclohexene and bicyclohexene, and compounds in which substituents are bonded to these compounds. . R1 and R2 represent hydrogen or an alkyl group having 6 or less carbon atoms. The polyamic acid or polyamic acid ester is expressed in trans form in (Chemical Formula 1), but may be in cis form.

It is more desirable that the polyamic acid or the polyamic acid ester includes one having a structural unit represented by (Chemical Formula 2) or (Chemical Formula 3). R3, R4, R5, and R6 are each a hydrogen atom, a halogeno group (fluoro group, chloro group, bromo group), a phenyl group, an alkyl group having 1 to 6 carbon atoms, or an alkoxy group having 1 to 6 carbon atoms. , — (CH ₂ ) _m —CH═CH ₂ , an atomic group containing a vinyl group, or — (CH ₂ ) _m —C≡CH an atomic group containing an alkynyl group One of them. However, m in said atomic group is 0, 1, or 2.

Ar in (Chemical Formula 2) and (Chemical Formula 3) represents an aromatic compound or a compound in which a substituent is bonded to the aromatic compound. The Ar desirably includes at least one of the following general formulas (4) to (14). However, each hydrogen atom of the aromatic ring in the general formulas (4) to (14) is independently a fluorine atom, a chlorine atom, a bromine atom, a phenyl group, an alkyl group having 1 to 8 carbon atoms, an alkoxy group, or a vinyl group. Alternatively, it may be substituted with an alkyl group. X represents an alkyl group having 1 to 8 carbon atoms, an alkoxy group, a vinyl group, an alkynyl group, or the following functional group (—O—, —CO—, — in the alkyl group having 0 to 8 carbon atoms). COO -, - S -, - SO -, - SO 2 -, - NH -, - N = N-, characterized in that it comprises a phenyl group), also Y is a phenyl or naphthyl group or anthracene group, or a pyrene group And each hydrogen atom of the aromatic ring is independently substituted with a fluorine atom, a chlorine atom, a bromine atom, a phenyl group, an alkyl group having 1 to 8 carbon atoms, an alkoxy group, a vinyl group, or an alkynyl group. It may be. And Z is the following functional groups _{(-CH 2 -, - CO 2} -, - NH -, - O -, - S -, - SO -, - SO 2 -) a and a hydrogen atom of the functional group is It may be substituted with a fluorine atom, a chlorine atom, a bromine atom, a phenyl group, an alkyl group having 1 to 8 carbon atoms, an alkoxy group, a vinyl group or an alkynyl group.

  The polyamic acid or the polyamic acid ester applied on the substrate is heated at a temperature of, for example, 50 ° C. or higher and a large amount of the solvent is removed. By firing, the polyamic acid or the polyamic acid ester undergoes a ring-closing reaction to imidize. The polyimide film formed in this way becomes a photo-alignment film in which an alignment regulating force is generated on the surface by being irradiated with polarized ultraviolet rays.

  In addition, the photo-alignment film may contain polyimide derived from polyamic acid amide or polyamic acid alkylsilyl ester in addition to the above polyamic acid or polyamic acid ester. For the unit structures of the polyamic acid amide and the polyamic acid alkylsilyl ester, see, for example, the general formulas (102), (103), (113), and (114) described in paragraph (0022) of Japanese Patent No. 5150409. Can be.

  Therefore, it is desirable that the first alignment film AL1 formed of the photo-alignment film contains the polyamic acid or the polyimide derived from the polyamic acid ester. Since the first alignment film AL1 can reduce the thermal decomposition of the polyimide during the baking of the photo-alignment film, it can improve the alignment stability of the liquid crystal molecules LM. That is, the display quality of the liquid crystal display device DSP can be improved. A photoalignment film containing a polyimide derived from a polyamic acid amide and a polyamic acid alkylsilyl ester can achieve the same effect. Moreover, since the photo-alignment film containing the polyimide derived from polyamic acid can reduce its own specific resistance, it is possible to suppress the occurrence of an afterimage (burn-in) of the liquid crystal display device DSP. The same effect can be obtained for the second alignment film AL2 formed of the same optical alignment film as the first alignment film AL1.

  Further, the first alignment film AL1 and the second alignment film AL2 are formed by removing residues in the formation process of various additives such as silane coupling agents, crosslinking agents, leveling agents, antifoaming agents, and oxidizing agents, and residual solvents. May contain.

  The rubbing film formed by the rubbing treatment is formed in the same manner as the photo-alignment film until firing. After firing, the polyimide film is rubbed in a certain direction with a rubbing cloth such as a buff cloth, so that the polyimide polymer chain on the surface is oriented in that direction, and becomes a rubbing film in which an orientation regulating force is generated on the surface. . The photo-alignment film and the rubbing film are different from each other in terms of pretilt and polymer chain orientation. Specifically, a pretilt is generated in the liquid crystal molecules aligned by the rubbing film, whereas no pretilt is generated in the liquid crystal molecules aligned by the photoalignment film. For this reason, the photo-alignment film is suitably used for a horizontal electric field type liquid crystal display device. In the photo-alignment film, the polymer chains are aligned in the entire region in the film thickness direction irradiated with polarized ultraviolet rays, whereas in the rubbing film, the polymer chains are aligned only on the surface rubbed with the rubbing cloth. As a result, the photo-alignment film and the rubbing film have different retardation magnitudes in the direction perpendicular to the substrate (film thickness direction). For example, the retardation of the photo-alignment film is generally larger than 1 nm, and the retardation of the rubbing film is generally 1 nm or less. Thus, the polymer chains forming the photo-alignment film are aligned in one direction, and such a polymer chain has a weak film strength in a direction perpendicular to the direction in which the molecules are arranged. For this reason, such an alignment film tends to have a lower film strength than an alignment film including random polymer chains having no anisotropy. When the film strength of the alignment film is reduced, the adhesion strength between the alignment film and the sealing material formed thereon is weakened. Thus, due to the difference in the orientation of the polymer chains, the photo-alignment film tends to have lower adhesion strength with the sealing material than the rubbing film.

  The liquid crystal layer LQ is disposed between the first substrate SUB1 and the second substrate SUB2. The liquid crystal layer LQ includes liquid crystal molecules LM. The major axis of the liquid crystal molecule LM is aligned along the surfaces of the first alignment film AL1 and the second alignment film AL2 under the alignment regulating force of the first alignment film AL1 and the second alignment film AL2. That is, the liquid crystal molecules LM are initially aligned in parallel with the first substrate SUB1 and the second substrate SUB2.

  FIG. 3 is a plan view of the first substrate from the normal direction of the main surface. The third direction Z is a direction that intersects the first direction X and the second direction Y. In this figure, the third direction Z is a direction intersecting the first direction X and the second direction Y. The main surface 10a of the first substrate 10 is a surface extending in the first direction X and the second direction Y. The normal direction of the main surface 10a corresponds to the third direction Z.

  The first substrate SUB1 includes, for example, a first long side LS11, a second long side LS12, a first short side SS11, and a second short side SS12. The first long side LS11 extends in the second direction Y. The second long side LS12 extends in the second direction Y and faces the first long side LS11 in the first direction X. The first short side SS11 extends in the first direction X. The second short side SS12 extends in the first direction X and faces the first short side SS11 in the second direction Y. The mounting part MT is located in the vicinity of the second short side SS12.

  The first alignment film AL1 faces the main surface 10a in the third direction Z, and its end portions E11 to E14 are located in the peripheral region PRP. The end E11 is located near the first long side LS11, the end E12 is located near the second long side LS12, the end E13 is located near the first short side SS11, and the end E14 is the first It is located in the vicinity of the two short sides SS12. In the illustrated example, the end portions E11 to E14 do not face the corresponding sides of the first substrate SUB1 in the third direction Z. That is, the end E11 is located closer to the display area ACT than the first long side LS11. The same applies to the end portions E12 to E14. Further, it is desirable that the first alignment film AL1 does not extend to the mounting portion MT.

  However, in order to more uniformly form the alignment film in the display region ACT, each end of the first alignment film AL1 should be formed as close as possible to each corresponding side of the first substrate SUB1. Is desirable. This is because since the film is formed by coating, the thickness of the alignment film tends to be thick at the end. In recent years, the width of the peripheral region PRP has become narrow due to the narrowing of the frame. For example, the width of the peripheral region PRP on each side other than the second short side SS12 having the mounting part MT may be smaller than 1.5 mm. Therefore, the desirable first alignment film AL1 of this embodiment can suppress alignment disorder of liquid crystal molecules. The same applies to the second alignment film AL2.

  The ends E11 to E14 are illustrated in a straight line shape in this figure, but the shape is not limited, and a part thereof may be bent. Further, the end E11 may face at least a part of the first long side LS11 in the third direction Z. The same applies to the end E12 and the end E13.

  The sealing material SE is disposed above the main surface 10a along each side of the first substrate SUB1. In the illustrated example, the sealing material SE is opposed to the end E11, the end E12, and the end E13 of the first alignment film AL1 in the third direction Z. On the other hand, the sealing material SE extending along the second short side SS12 is located on the second short side SS12 side with respect to the end portion E14, but is located on the display region ACT side with respect to the end portion E14. It may be in contact with the end E14. That is, at least a part of the sealing material SE is in contact with the first alignment film AL1.

  As illustrated in FIG. 2, the first alignment film AL1 is formed on the inorganic material layer. Therefore, in the illustrated example, the sealing materials SE extending along the first long side LS11, the second long side LS12, and the first short side SS11 are respectively the end portions E11 to E13 of the first alignment film AL1, And in contact with the inorganic material layer exposed from the first alignment film AL1. When the sealing material SE is in contact with the inorganic material layer, the adhesion between the sealing material SE and the first substrate SUB1 is improved.

  The sealing material SE is, for example, a photocuring and thermosetting sealing material, and is formed by performing a curing process on a liquid curable resin composition. The curable resin composition contains a curable resin, a curing agent, an additive, and the like. The curing process in the photocuring / thermosetting combined type sealing material includes a photocuring process in which light such as ultraviolet rays is irradiated and a heated thermosetting process in random order. The curable resin composition is applied to one surface of substrates to be bonded by, for example, a dispensing method. Thereafter, the sealing material SE is cured by the above-described curing process in a state where the substrates are bonded to each other. The sealing material SE is, for example, a photocuring thermosetting combination type in which temporary curing is first performed by a photocuring process and then main curing is performed by a thermosetting process, but is not limited thereto. A photo-curing type or a thermosetting type may be used.

The storage elastic modulus of the sealing material SE after the curing treatment is 1.0 × 10 ⁷ Pa or more and 1.5 × 10 ⁹ Pa or less. When the storage elastic modulus is less than 1.0 × 10 ⁷ Pa, a sufficient function as the sealing material SE cannot be exhibited, and there is a possibility that a deviation occurs between the substrates to which the sealing material SE adheres. When the storage elastic modulus exceeds 1.5 × 10 ⁹ Pa, the stress is not sufficiently dispersed by the sealing material SE, and stress may concentrate on the interface between the sealing material SE and the substrate to cause peeling. Therefore, the storage elastic modulus of the sealing material SE is more desirably 1.0 × 10 ⁸ Pa or more and 1.5 × 10 ⁹ Pa or less. In addition, a storage elastic modulus can be measured by the method as described in an Example.

  The photocuring shrinkage rate in the photocuring step of the sealing material SE is desirably 0.1% or more and 3.8% or less. The photocuring shrinkage ratio is more preferably 1.5% or more and 3.8% or less, and further preferably 2.0% or more and 3.8% or less. In the case of a photocuring / thermosetting sealant, the total shrinkage of the photocuring shrinkage and the thermosetting shrinkage is preferably 0.1% or more and 3.8% or less, and more desirably. Is 1.5% or more and 3.8% or less, and more preferably 2.0% or more and 3.8% or less. If the photocuring shrinkage rate is less than 0.1%, the moisture permeability of the sealing material SE is too high, and moisture may enter the liquid crystal layer. If the shrinkage rate exceeds 3.8%, the substrate surface such as the first alignment film AL1 may be damaged by the shrinkage, and the adhesion strength between the substrates may be reduced. Therefore, the sealing material SE having a desirable shrinkage rate according to the present embodiment can suppress the occurrence of display unevenness due to impurities (moisture) in the liquid crystal layer, and can also suppress the occurrence of substrate displacement. The shrinkage rate can be measured by the method described in the examples.

  The glass transition temperature (Tg) of the sealing material SE is desirably 30 ° C. or higher and 140 ° C. or lower. Tg is more preferably 60 ° C. or higher and 120 ° C. or lower. If the Tg is less than 30 ° C., the sealing material SE may be softened and deformed under the usage environment of the liquid crystal display device. If Tg exceeds 140 ° C., the sealing material SE is too hard to sufficiently disperse the stress, and stress may concentrate on the interface between the sealing material SE and the substrate to cause peeling. Therefore, the sealing material SE having a desirable Tg according to the present embodiment can suppress the occurrence of substrate displacement. Tg is a value measured by differential scanning calorimetry (DSC) based on “Method of measuring plastic transition temperature” of JIS K7121. Specifically, it is measured by the method described in the examples.

  Such a sealing material SE having a desirable storage elastic modulus, photocuring shrinkage rate, and Tg according to this embodiment includes an epoxy resin having no acrylate skeleton and a resin having an acrylate skeleton as a curable resin. Yes. For example, an epoxy resin having no acrylate skeleton functions as a thermosetting resin, and a resin having an acrylate skeleton functions as a photocurable resin. An epoxy resin having no acrylate skeleton may function as a photocurable resin.

  The epoxy resin having no acrylate skeleton is not particularly limited, and can be appropriately selected from a glycidyl ether type epoxy resin, a glycidyl ester type epoxy resin, a glycidyl amine type epoxy resin, an alicyclic epoxy resin, and the like. . For example, the epoxy resin may be bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol type epoxy resin, propylene oxide-added bisphenol A type epoxy resin, resorcinol type epoxy resin, biphenyl type epoxy resin. , Sulfide type epoxy resin, ether type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, phenol novolac type epoxy resin, orthocresol novolac type epoxy resin, dicyclopentadiene novolac type epoxy resin, biphenyl novolac type epoxy resin, Glycidylamine type epoxy resin, alkyl polyol type epoxy resin, rubber-modified epoxy resin, glycidyl ester compound, bisphenol A Le A type episulfide resin or other epoxy resins. These epoxy resins not having an acrylate skeleton may be used alone or in combination of two or more.

  The resin having an acrylate skeleton is not particularly limited, and can be appropriately selected from polyester (meth) acrylate resins, epoxy (meth) acrylate resins, urethane (meth) acrylate resins, and the like. These resins having an acrylate skeleton may be used alone or in combination of two or more.

  The polyester (meth) acrylate resin is a polymer of an ester compound obtained by reacting a compound having a hydroxyl group with (meth) acrylic acid. The ester compound is not particularly limited, and may be a monofunctional (meth) acrylic acid ester having one (meth) acryl group or a polyfunctional (meth) having two or more (meth) acryl groups. Acrylic ester may also be used. For example, as the ester compound, compounds described in paragraphs (0010) to (0012) of JP 2010-85712 A can be referred to. The polyester (meth) acrylate resin may be a copolymer formed of a plurality of ester compounds.

  The epoxy (meth) acrylate resin is not particularly limited, and examples thereof include a polymer obtained by reacting an epoxy resin and (meth) acrylic acid in the presence of a basic catalyst. The said epoxy resin is not specifically limited, For example, it can select suitably from the epoxy resin which does not have the said acrylate skeleton. The epoxy (meth) acrylate resin may be a copolymer formed of a plurality of epoxy resins or a plurality of (meth) acrylic acids.

  The (meth) acrylic acid derivative having a hydroxyl group is not particularly limited, and for example, the compound described in paragraph (0020) of JP-A-2010-85712 can be referred to. The (meth) acrylic acid derivative having a hydroxyl group may be used alone or in combination of two or more.

  Examples of the curing agent include a photoradical initiator for reacting a (meth) acryl group in a photocuring step, a thermal polymerization initiator for reacting an epoxy group in a thermosetting step, and the like. The photo radical initiator is not particularly limited. For example, radicals are generated when irradiated with ultraviolet rays such as an acetophenone compound, a benzophenone compound, a benzoin compound, a benzoin ether compound, an acylphosphine oxide compound, and a thioxanthone compound. Compound etc. are mentioned. The thermal polymerization initiator suitable for the epoxy group is not particularly limited, and examples thereof include hydrazide compounds, amine compounds, imidazole derivatives, guanidine derivatives, polyhydric phenol compounds, and acid anhydrides.

  Although content of the said photoradical initiator is not specifically limited, It is desirable that they are 0.1 mass part or more and 10 mass parts or less with respect to 100 mass parts of resin which has the said acrylate skeleton. If the content of the photo radical initiator is less than 0.1 parts by mass, the sealing material SE may not be sufficiently cured. Moreover, when content of a photoradical initiator exceeds 10 mass parts, there exists a possibility that the storage stability of curable resin composition may fall.

  Although content of the said thermal-polymerization initiator is not specifically limited, It is desirable that they are 1 mass part or more and 50 mass parts or less with respect to 100 mass parts of epoxy resins which do not have the said acrylate skeleton. If the content of the thermal polymerization initiator is less than 1 part by mass, the sealing material SE may not be sufficiently cured. Moreover, when content of a thermal-polymerization initiator exceeds 50 mass parts, there exists a possibility that the viscosity of curable resin composition may become high and applicability | paintability may be impaired. The content of the thermal polymerization initiator is more desirably 30 parts by mass or less.

  The melting point of the thermal polymerization initiator is desirably 100 ° C. or higher and 200 ° C. or lower. There exists a possibility that the storage stability of curable resin composition may fall that melting | fusing point is less than 100 degreeC. When the melting point exceeds 200 ° C., the heating temperature in the thermosetting process becomes high, and there is a possibility that deviation occurs between the substrates during the curing process of the sealing material SE.

  The average particle diameter of the thermal polymerization initiator is preferably in a range that does not affect the cell gap between the first substrate SUB1 and the second substrate SUB2, and more preferably 0.1 μm or more and 5 μm or less. There exists a possibility that the storage stability of curable resin composition may fall that an average particle diameter is less than 0.1 micrometer. When the average particle diameter exceeds 5 μm, the heating time in the thermosetting process becomes long, and there is a possibility that deviation occurs between the substrates during the curing process of the sealing material SE. In addition, the average particle diameter in this specification is a volume average particle diameter based on the light scattering method.

  The curing agent may further contain, for example, a thermal radical initiator for reacting the (meth) acryl group in the thermosetting process and a photopolymerization initiator for reacting the epoxy group in the photocuring process. The thermal radical initiator is not particularly limited, and examples thereof include peroxides and azo compounds. A photoinitiator is not specifically limited, For example, various photocationic initiators etc. are mentioned.

  Further, the sealing material SE may have a coupling agent for imparting adhesiveness.

  The sealing material SE preferably has a filler for the purpose of stress dispersion. The filler is not particularly limited, and examples thereof include inorganic fillers formed from inorganic materials such as synthetic silica, talc calcium carbonate, magnesium carbonate, and titanium carbonate, polyesters, polyurethanes, vinyl polymers, acrylic polymers, and the like. Organic fillers made of organic materials, or hybrid fillers of these organic materials and inorganic materials. From the viewpoint of adhesiveness with the organic material layer, the filler is preferably an organic filler. In addition, these fillers may be used independently and 2 or more types may be used together.

  The average particle diameter of the filler is not particularly limited as long as it does not affect the cell gap between the first substrate SUB1 and the second substrate SUB2, but is desirably 2 μm or less. Moreover, the compounding quantity of the said filler is although it does not specifically limit, It is desirable that it is 3 to 40 mass parts with respect to 100 mass parts of curable resin. When the blending amount is less than 3 parts by mass, the function as a filler is not sufficiently exhibited. If the blending amount exceeds 40 parts by mass, the viscosity of the curable resin composition increases, and the applicability may be impaired. The blending amount of the filler is more preferably 5 parts by mass or more and 30 parts by mass or less.

  The sealing material SE further includes a reactive diluent for adjusting the viscosity, a thixotropic agent for adjusting the thixotropy, a spacer for adjusting the cell gap, a curing accelerator, an antifoaming agent, and a leveling agent. And may have additives such as a polymerization inhibitor.

  FIG. 4 is a diagram illustrating a cross section of the first short side of the liquid crystal display device. Note that the plan view in the description of FIG. 4 means that the display panel PNL is viewed from the third direction Z.

  The display panel PNL includes a spacer SP and a protruding portion PJ. The spacer SP is formed on the second substrate SUB2, for example, and extends in the third direction Z from the second substrate SUB2 toward the first substrate SUB1. For example, the spacer SP has a columnar shape. The spacer SP is arranged to maintain a cell gap between the first substrate SUB1 and the second substrate SUB2. For this reason, the spacer SP is arranged not only in the seal region SER where the seal material SE is formed, but also in other peripheral regions PRP and the display region ACT. For example, the spacer SP is formed on the overcoat layer OC of the second substrate SUB2, and is surrounded by the second alignment film AL2 in plan view. The tip of the spacer SP may be in contact with the first substrate SUB1, or may not be in contact with it. The spacer SP is made of, for example, a resin material. When an acrylic resin is used as the resin material for forming the spacer SP, it is preferable because the affinity with the sealing material of the present invention is increased.

  The protrusion PJ is disposed, for example, in the seal region SER of the second substrate SUB2, and extends in the third direction Z from the second substrate SUB2 toward the first substrate SUB1. The protruding portion PJ may be formed at an end of the second substrate SUB2 (in the illustrated example, the first opposing short side SS21 of the second substrate SUB2 facing the first short side SS11). At this time, it is desirable that the tip of the protruding portion PJ is not in contact with the first substrate SUB1. This is to prevent the protrusion PJ from affecting the cell gap.

  The protrusions PJ formed in the seal region SER in the vicinity of the first short side SS11, the first long side LS11, and the second long side LS12 extend along the extending direction of each side and the seal material SE in plan view. Exist. In addition, about 2nd short side SS12 vicinity, it is arbitrary whether the protrusion part PJ is arrange | positioned in the area | region in which the sealing material SE was formed.

  In addition, the protrusion part PJ may be formed discontinuously in the extending direction of the sealing material SE, or may be formed continuously. Further, the protruding portion PJ may be formed on the first substrate SUB1 and may extend in the third direction Z from the first substrate SUB1 toward the second substrate SUB2. The protruding portion PJ is made of, for example, a resin material. When an acrylic resin is used as the resin material for forming the protruding portion PJ, it is desirable because the affinity with the sealing material of the present invention is increased. When the protrusion PJ is formed on the substrate on which the spacer SP is formed, the protrusion PJ is preferably formed of the same material as the spacer SP. At this time, the protrusion PJ can be formed in the same process as the spacer SP, and the number of processes required for manufacturing the liquid crystal display device DSP can be reduced.

  In the display panel PNL, in the peripheral region PRP, it is desirable that irregularities (grooves) are formed on the surface of the substrate on the side where the protrusions PJ are not formed at least among the surfaces of the substrates facing each other. Thereby, excessive wetting and spreading of the precursor of the first alignment film AL can be suppressed. More preferably, the unevenness is formed on both surfaces of the substrate facing each other. The unevenness is particularly preferably formed in the seal region SER. Thereby, it is possible to extend the first alignment film AL into the seal region SER and suppress the deterioration of display quality due to the change in the thickness of the alignment film.

  From the viewpoint of suppressing excessive wetting and spreading of the precursor of the alignment film, the unevenness formed on the surface of the substrate on which the protrusion PJ is not formed is formed on the surface of the substrate on the side where the protrusion PJ is formed. It is desirable that the step is larger than the unevenness, and it is also desirable that there are many steps. Further, in order to stop the alignment film from extending in the seal region SER, the uneven step formed on the surface in contact with the sealing material SE is larger than the uneven step formed on the surface in contact with the liquid crystal layer LQ. Is desirable.

  In the illustrated example, in the peripheral region PRP, the unevenness 111 is formed on the surface of the first substrate SUB1, and the unevenness 222 is formed on the surface of the second substrate SUB2. The unevenness 111 and 222 are formed in the seal region SER, and the unevenness 222 is formed on the surface on the display region ACT side from the protruding portion PJ. Note that the unevenness 111 may face the protruding portion PJ in the third direction Z.

  Further, it is desirable that the irregularities 111 and 222 extend along the extending direction of the protruding portion PJ and the sealing material SE in plan view. The irregularities 111 and 222 extending along the protruding portion PJ and the sealing material SE can suppress unevenness of wetting and spreading of the precursors of the first alignment film AL1 and the second alignment film AL2.

  In addition, the unevenness | corrugation 111 can be formed by changing the film thickness of the 1st insulating film 11, for example. In the illustrated example, since the first insulating film 11 is formed thick with an organic material, the unevenness 111 having a deep step can be formed. However, the unevenness 111 may be formed using, for example, the second insulating film 12 other than the first insulating film 11 of the first substrate SUB1. On the other hand, the unevenness 222 is formed, for example, by changing the film thickness of the overcoat layer OC. However, the unevenness 222 may be formed using a light shielding layer BM, a color filter CF, or the like other than the overcoat layer OC of the second substrate SUB2.

  From the viewpoint of suppressing wetting and spreading of the precursor of the alignment film, it is desirable that at least one recess 112 of the recesses and protrusions 111 penetrates the first insulating film 11 in the third direction Z. In the illustrated example, the recess 112 formed at a position closest to the first short side SS11 penetrates the first insulating film 11 in the third direction Z. Furthermore, the recess 112 may also penetrate the second insulating film 12 in the third direction Z. Note that the recess 112 penetrating the first insulating film 11 may be formed in the vicinity of the first long side LS11 or the second long side LS12.

  When the adhesion strength between the sealing material SE and the first alignment film AL1 is sufficiently good, there is a possibility that interface peeling may generally occur between the first alignment film AL1 and the base layer in contact with the first alignment film AL1. . However, in this drawing, in the region where the sealing material SE is formed, the second insulating film 12 which is the base layer is an inorganic material layer having better adhesion strength with the first alignment film AL1 than the organic material layer. Moreover, since the unevenness | corrugation 111 has many contact areas compared with the smooth surface, the adhesive strength of a base layer and 1st alignment film AL1 is improved. Therefore, the configuration is such that interface peeling is unlikely to occur between the sealing material SE and the base layer. Note that the underlying layer may be a transparent conductive material such as ITO (not shown). Even in such a case, the ITO serving as the base layer is an inorganic material layer having better adhesion strength with the first alignment film AL1 than the organic material layer.

  Since there is a possibility that the interface of each layer becomes a moisture intrusion path, it is desirable that the interfaces located at the end portions of the first substrate SUB1 and the second substrate SUB2 be as few as possible. Therefore, it is desirable that the protruding portion PJ is formed at the end E23 of the second alignment film AL2 in the vicinity of the first opposing short side SS21. This is because the protrusion PJ inhibits the wetting and spreading of the precursor of the alignment film in the coating process of the second alignment film AL2.

  The wetting and spreading of the precursor of the alignment film may be inhibited by, for example, the unevenness 222 other than the protruding portion PJ. For this reason, the protrusion part PJ does not need to be formed in the edge part E23. On the other hand, in the first substrate SUB1, wetting and spreading of the precursor of the alignment film of the first alignment film AL1 is inhibited by the unevenness 111.

  As a result, the interface between the second alignment film AL2 and the overcoat layer OC is located closer to the display area ACT than the first opposing short side SS21, and the interface between the first alignment film AL1 and the second insulating film 12 is the first It is located on the display area ACT side from the short side SS11. Therefore, the display panel PNL can suppress moisture intrusion from the first substrate SUB1 and the second substrate SUB2 into the liquid crystal layer LQ.

  In the illustrated example, the end E13 of the first alignment film AL1 faces the protruding portion PJ. This is because part of the unevenness 111 faces the protruding portion PJ, and the first alignment film AL1 is formed on the surface of the first substrate SUB1 along the unevenness 111. The end E23 of the second alignment film AL2 is located closer to the display area ACT than the protrusion PJ. That is, the distance between the end of the first substrate SUB1 and the end of the first alignment film AL1 in plan view is shorter than the distance between the end of the second substrate SUB2 and the end of the second alignment film AL2. The same applies to the vicinity of the first long side LS11 and the vicinity of the second long side LS12.

  The seal material SE extending along the first short side SS11 is in contact with, for example, the second alignment film AL2, the spacer SP, and the protrusion PJ formed on the second substrate SUB2 side. Further, the sealing material SE extending along the first short side SS11 is in contact with the first alignment film AL1 formed on the first substrate SUB1 side, and for example, the end E13 and the first alignment film AL1. Is in contact with the exposed inorganic material layer. Among these, the inorganic material layer is formed of an inorganic material. In contrast, the first alignment film AL1, the second alignment film AL2, the spacer SP, and the protruding portion PJ are formed of an organic material. That is, the area in contact with the organic material of the sealing material SE is larger than the area in contact with the inorganic material. The same applies to the sealing material extending along the first long side LS11 and the second long side LS12.

As described above, in this embodiment, the liquid crystal display device DSP includes an epoxy resin having no acrylate skeleton and a resin having an acrylate skeleton, and has a storage elastic modulus of 1.0 × 10 ⁷ Pa or more and 1.5 ×. The sealing material SE which is 10 ⁹ Pa or less is provided. As a result, the sealing material SE can obtain good adhesion strength even for the first substrate SUB1 including the first alignment film AL1 that is a photo-alignment film. Furthermore, even when the area in contact with the inorganic material is larger than the area in contact with the organic material, the sealing material can obtain good adhesion strength.

  As described above, according to the present embodiment, a liquid crystal display device DSP with improved reliability can be provided.

  Next, a modification of this embodiment will be described.

  FIG. 5 is a plan view of a modification of the first substrate.

  In the present embodiment, the end E11 is located on the first long side LS11, the end E12 is located on the second long side LS12, and the end E13 is located on the first short side SS11. This embodiment is different from the embodiment shown in FIG. Further, the present embodiment is different from the present embodiment illustrated in FIG. 3 in that the sealing material SE is located closer to the display area ACT than the first long side LS11, the second long side LS12, and the first short side SS11. Yes. That is, the sealing material SE does not face the end portions E11 to E13 in plan view.

  Also in such an embodiment, the sealing material SE can obtain a good adhesion strength to the first substrate SUB1, and can suppress the occurrence of substrate displacement. In addition, since the photo-alignment film is provided, the display quality of the liquid crystal display device DSP can be improved, and the occurrence of afterimage (burn-in) can be suppressed. In addition, the liquid crystal display device DSP can suppress a decrease in display quality due to a change in the thickness of the alignment film. That is, also in this embodiment, a liquid crystal display device DSP with improved reliability can be provided.

  Hereinafter, embodiments of the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.

<Seal material>
By mixing the resin described in the column of the configuration of the table shown in FIG. 6 as the curable resin, physical properties such as UV curing shrinkage, storage elastic modulus, and glass transition temperature (Tg) described in FIG. The sealing materials 1-6 which show this were adjusted. In each example, description of common contents such as a curing agent and various additives is omitted. The sealing materials 1 to 3 have the physical property conditions described in this embodiment (storage elastic modulus: 1.0 × 10 ⁷ Pa to 1.5 × 10 ⁹ , UV curing shrinkage: 0.1% to 3.8. %). On the other hand, the sealing materials 4 to 6 do not satisfy the physical property conditions described in the present embodiment.

<UV curing shrinkage>
The UV curing shrinkage rate in FIG. 6 means the photocuring shrinkage rate accompanying the irradiation of ultraviolet rays (UV) which is a photocuring process. The UV cure shrinkage was measured by the following method. That is, the curable resin composition of the sealing material shown in each example was applied to soda lime glass to a thickness of 100 μm, and ultraviolet light (light source: manufactured by Ushio Electric Co., Ltd., mercury xenon lamp, illuminance: 100 mW / mm) under nitrogen flow. The cured product was obtained by irradiating and curing with cm ² and integrated light quantity: 3000 mJ / cm ² .

In each example, an electronic balance (manufactured by Sartorius Co., Ltd.) equipped with a specific gravity measurement kit is used to measure the specific gravity of the curable resin composition before curing (specific gravity before curing) and the specific gravity of the cured product after curing (cured product specific gravity). Name: CPA224S) was measured under an environment of 25 ° C., and the curing shrinkage (unit:%) was calculated from the following formula based on the specific gravity difference before and after curing.
Curing shrinkage ratio (%) = (cured product specific gravity−specific gravity before curing) / specific gravity before curing × 100

<Storage modulus>
The storage elastic modulus in FIG. 6 was measured by the following method. That is, the curable resin composition of the sealing material shown in each example was applied to soda lime glass to a thickness of 100 μm, and ultraviolet light (light source: manufactured by Ushio Electric Co., Ltd., mercury xenon lamp, illuminance: 100 mW / mm) under nitrogen flow. cm ² , integrated light quantity: 3000 mJ / cm ² ) and cured. Thereafter, the storage elastic modulus (unit: Pa) of the cured product was measured using a rheometer (manufactured by Anton Paar, product name: MCR-301). The measurement conditions were a frequency of 1 Hz, a strain of 5%, and a temperature of 25 ° C.

<Glass transition temperature (Tg)>
The glass transition temperature in FIG. 6 was measured by the following method. That is, the curable resin composition of the sealing material shown in each example was applied to a smooth release film to a thickness of 100 μm, and ultraviolet rays (light source: Ushio Electric Co., Ltd., mercury xenon lamp, illuminance: 100 mW / cm ² , integrated light quantity: 3000 mJ / cm ² ) was irradiated to prepare a cured product. The cured product was peeled from the release film and cut into a size of 10 mg. Then, differential scanning calorimetry of 10 mg of the cured product using a differential scanning calorimeter (manufactured by Seiko Instruments Inc., product name: EXSTAR DSC6200) at a temperature rising temperature of 10 ° C./minute and a measurement temperature of −100 to 200 ° C. (DSC) was performed.

<Evaluation of adhesion strength>
For the sealing materials 1 to 6, the adhesion strength was evaluated by the following method.

(1) Sample preparation The alignment films 1 to 4 shown in FIG. 7 were formed on the surface of non-alkali glass (Asahi Glass AN-100) to prepare glass substrates 100 and 200. The polyamic acid in FIG. 7 has a structural unit represented by (Chemical Formula 15), and the polyamic acid ester in FIG. 7 has a structural unit represented by (Chemical Formula 16). The photo-alignment in FIG. 7 indicates that the alignment treatment was performed by irradiation with polarized ultraviolet rays (main wavelength: 254 nm). The rubbing in FIG. 7 indicates that the alignment treatment was performed by rubbing the surface of the polyimide film in a certain direction with a buff cloth attached to the rubbing roller.

A small amount of sealing materials 1 to 6 are dropped on the adhesive surface on which the alignment film of the 40 mm × 40 mm glass substrate 100 is formed, and the adhesive surface on which the alignment film of the 40 mm × 35 mm glass substrate 200 is formed is overlaid thereon. Then, the sealing materials 1 to 6 were spread over the entire surface of the glass substrate 200. In this state, ultraviolet rays (light source: manufactured by USHIO INC., Mercury xenon lamp, illuminance: 100 mW / cm ² , integrated light quantity: 3000 mJ / cm ² ) were irradiated. Then, it heated at 120 degreeC for 1 hour, and obtained the sample.

(2) Evaluation
A method for evaluating the adhesion strength between the alignment film and the sealing material is schematically shown in FIG. (A) is the top view which planarly viewed the state of experiment from the normal line direction of the main surface of a glass substrate. (B) is the side view which looked at the mode of experiment from the direction parallel to the main surface of a glass substrate. That is, the sample obtained in (1) was sandwiched and fixed by the holding jig 310. In that state, a force is applied to the terminal portion (5 mm × 40 mm) which is a region not facing the glass substrate 200 of the glass substrate 100 from the bonding surface side with the pressure pin 300, and the glass substrates 100 and 200 The magnitude of the force F when peeling occurred between the two was measured. The case where the force F was 30N or more was evaluated as “◯”, the case where the force F was 20N or more and less than 30N was evaluated as “Δ”, and the case where the force F was less than 20N was evaluated as “X”.

(3) Evaluation results
A list of evaluation results is shown in FIG. The columns arranged next to the table indicate the types of alignment films (alignment films 1 to 4) on the bonding surface. The vertical rows in the table indicate the types of sealing materials (sealing materials 1 to 6) for bonding the alignment films together. Examples 1-6 are the combination of the sealing materials 1-3 applicable to this invention, and a photo-alignment film | membrane. Comparative Examples 1 to 6 are combinations of the sealing materials 4 to 6 and the photo-alignment film that do not correspond to the present invention. In Reference Examples 1 to 12, the type of alignment film is a rubbing film. The adhesion strengths of Reference Examples 1 to 12 were “◯”, the adhesion strengths of Comparative Examples 1 to 6 were “Δ” or “x”, and the adhesion strengths of the examples were “◯”.

  From the evaluation result of the reference example, when the alignment film was a rubbing film, it was confirmed that the adhesion strength was sufficient for any of the sealing materials 1 to 6. On the other hand, from the evaluation results of the comparative example and the example, it was confirmed that when the alignment film is a photo-alignment film, sufficient adhesion strength cannot be obtained unless it is a sealing material corresponding to the present invention.

  From the above, according to the sealing material SE applied to the present embodiment, even when the sealing material is in contact with the photo-alignment film, the substrates can obtain good adhesion strength.

  In addition, although some embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

PNL ... display panel SUB1 ... first substrate 10 ... first insulating substrate 10a ... first main surface
DESCRIPTION OF SYMBOLS 11 ... 1st insulating film 12 ... 2nd insulating film AL1 ... 1st orientation film SE ... Sealing material
LS11 ... 1st long side LS12 ... 2nd long side SS11 ... 1st short side SS12 ... 2nd short side
E11 ... End E12 ... End E13 ... End E14 ... End
SUB2 ... second substrate 20 ... second insulating substrate BM ... light shielding layer OC ... overcoat
AL2 ... Second alignment film SP ... Spacer PJ ... Projection E23 ... End
SS21 ... first opposing short side 111 ... unevenness 222 ... unevenness ACT ... display area
PRP ... Peripheral area

Claims (9)

A first substrate; a second substrate disposed at a position opposite to the first substrate; a liquid crystal layer including liquid crystal molecules disposed between the first substrate and the second substrate; and the first substrate A liquid crystal display device comprising: a first alignment film that is formed and aligns the liquid crystal molecules; and a sealing material that bonds the first substrate and the second substrate;
The first alignment film is a photo-alignment film,
The sealing material includes an epoxy resin having no acrylate skeleton, and a resin having an acrylate skeleton,
The storage elastic modulus of the sealing material is 1.0 × 10 ⁷ Pa or more and 1.5 × 10 ⁹ Pa or less,
The liquid crystal display device, wherein at least a part of the sealing material is in contact with the first alignment film.   The liquid crystal display device according to claim 1, further comprising an inorganic material layer formed on the first substrate and in contact with the first alignment film. The first substrate includes a first long side, a second long side facing the first long side, a first short side, and a second short side facing the first short side,
The sealing material extending along the first long side, the second long side, and the first short side is in contact with an end portion of the first alignment film and an inorganic material layer exposed from the first alignment film. The liquid crystal display device according to claim 1 or 2.   4. The liquid crystal display device according to claim 3, wherein the seal material extending along the second short side does not face the first alignment film. 5. The liquid crystal display device further includes:
A second alignment film formed on the second substrate and aligning the liquid crystal molecules;
A protrusion extending from the second substrate toward the first substrate and extending along the extending direction of the sealing material in plan view,
The distance between the end of the first substrate and the end of the first alignment film in plan view is shorter than the distance between the end of the second substrate and the end of the second alignment film. 5. The liquid crystal display device according to any one of 1 to 4.   2. The protruding portion extending from one substrate of the second substrate or the first substrate to the other substrate, wherein the protruding portion is disposed in a region where the sealing material is formed. Liquid crystal display device.   7. The liquid crystal display device according to claim 6, wherein, of the first substrate and the second substrate, the substrate on which the protruding portion is not formed has irregularities formed on a surface in contact with the sealing material.   The liquid crystal display device according to claim 1, wherein the first alignment film includes polyamide acid or polyimide derived from polyamide acid ester.   9. The liquid crystal display device according to claim 1, wherein the photocuring shrinkage rate of the sealing material is 0.1% or more and 3.8% or less.

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