JP2019066218A - Electronic component conveying device and electronic component inspection device - Google Patents

Abstract

To provide an electronic component conveying device and an electronic component inspection device with which, with a simple configuration, it is possible to accurately position a grasping unit with respect to a support unit.SOLUTION: Provided is an electronic component conveying device comprising an area in which an inspection unit that inspects an electronic component is placeable, a shuttle for conveying the electronic component, and a hand for conveying the electronic component from the shuttle to the inspection unit and conveying the same from the inspection unit to the shuttle. The hand includes a grasping unit for grasping the electronic component and a support unit for movably supporting the grasping unit, the grasping unit and the support unit being mutually in contact, each including a plurality of projections and recesses for positioning the grasping unit with respect to the support unit. The projections have a spherical shape, and the recesses have a slope surface inclined in a direction orthogonal to the direction of movement of the grasping unit.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electronic component conveyance device and an electronic component inspection device.

  2. Description of the Related Art Conventionally, a test apparatus for electrically testing an electronic component (part) such as an IC device or the like is known (see, for example, Patent Document 1). In the test apparatus described in Patent Document 1, when testing an IC device, the test apparatus hand transports the IC device to the measurement socket, places the IC device on the measurement socket, and performs the test. It is configured. The test device hand is arranged by suspending it on a rocking body that swings in order to press the IC device to the measurement socket following the inclination of the measurement socket and by hanging on the rocking body, and the X-axis, Y-axis and θ-axis direction And a floating body that floats on the The rocking body has, for example, a rubber film which is a film-like elastic member for rocking the rocking portion main body. Then, the rubber film is deformed by the supply of the air, and the floating body becomes movable in the X axis Y axis θ axis direction by this deformation.

Unexamined-Japanese-Patent No. 2003-262660

  However, in the test apparatus described in Patent Document 1, for example, when the IC device is pressed against the measuring socket or accelerated to transport the IC device, the idler is against the oscillator. Position could shift. If this positional deviation occurs, the IC device and the measuring socket are not in conductive contact with each other, which may make it difficult to conduct the test accurately.

  A configuration is also considered in which a camera (imaging unit) is mounted, positional deviation is detected by this camera, and the positional deviation is corrected by a piezoelectric element (piezo element) according to the detection result. However, also in this configuration, if displacement occurs after correction, as in the test apparatus described in Patent Document 1, the IC device and the measuring socket are not in conductive contact, and as a result, the test is accurately performed. May be difficult.

  The present invention has been made to solve at least a part of the above-mentioned problems, and can be realized as the following.

An electronic component transfer apparatus according to the present invention includes an inspection area in which an inspection unit for inspecting an electronic component can be disposed;
A shuttle for transporting the electronic component;
And a hand for transporting the electronic component from the shuttle to the inspection unit, and for transporting the electronic component from the inspection unit to the shuttle,
The hand is
A gripping unit that grips the electronic component;
And a support portion movably supporting the grip portion,
The grip portion and the support portion are in contact with each other and each have a plurality of convex portions and concave portions for positioning the grip portion with respect to the support portion.
The convex portion has a spherical shape,
The concave portion is characterized by having an inclined surface which is inclined with respect to a direction orthogonal to the moving direction of the grip portion.

  Thereby, the positioning part which positions a holding part correctly with respect to a support part can be easily comprised by several convex part and recessed part. And in the positioning state by this positioning part, even if an inertial force acts on the holding part holding the electronic component when the hand moves to accelerate and move, the holding part is displaced relative to the supporting part It can be prevented. Thus, for example, when performing an electrical inspection on an electronic component, the inspection unit capable of performing the inspection can be brought into conductive contact with the electronic component, and therefore, the electronic component can be accurately inspected. be able to.

An electronic component transfer apparatus according to the present invention includes an inspection area in which an inspection unit for inspecting an electronic component can be disposed;
A shuttle for transporting the electronic component;
And a hand for transporting the electronic component from the shuttle to the inspection unit, and for transporting the electronic component from the inspection unit to the shuttle,
The hand is
A gripping unit that grips the electronic component;
And a support portion movably supporting the grip portion,
The grip portion and the support portion are in contact with each other and each have a plurality of convex portions and concave portions for positioning the grip portion with respect to the support portion.
The convex portion has a spherical shape,
The recess may be conical.

  Thereby, the positioning part which positions a holding part correctly with respect to a support part can be easily comprised by several convex part and recessed part. And in the positioning state by this positioning part, even if an inertial force acts on the holding part holding the electronic component when the hand moves to accelerate and move, the holding part is displaced relative to the supporting part It can be prevented. Thus, for example, when performing an electrical inspection on an electronic component, the inspection unit capable of performing the inspection can be brought into conductive contact with the electronic component, and therefore, the electronic component can be accurately inspected. be able to.

  In the electronic component transfer apparatus according to the present invention, preferably, the grip portion is movable to a first position at which the convex portion and the concave portion are separated, and to a second position at which the convex portion and the concave portion are in contact with each other. .

  Thereby, in the first position, the positioning state of the gripping portion with respect to the support portion is released. Even if the inspection unit is slightly inclined when the grip unit presses the electronic component onto the inspection unit for inspecting the electronic component, for example, by releasing the positioning state, the posture of the grip unit is the electronic component in accordance with the inspection unit. You can lean with it. As a result, the electronic component and the inspection unit can be brought into conductive contact with each other, so that the electronic component can be inspected accurately.

  In the electronic component transfer apparatus of the present invention, it is preferable that the convex portion is provided on the support portion, and the concave portion is provided on the grip portion.

  Thus, for example, in the case where the convex portion is configured separately from the support portion, the convex portion can be stably and easily disposed on the support portion rather than the moving grip portion.

In the electronic component transfer apparatus of the present invention, the hand preferably includes a drive unit for moving the grip unit.
Thereby, the holding part can be moved at a desired timing.

  In the electronic component transfer apparatus according to the present invention, the drive unit is a pneumatic unit that moves the grip unit in one direction by supplying a working fluid, and an urging unit that biases the grip unit in the direction opposite to the one direction. It is preferable to have

  Thus, the drive unit can stably move the gripping unit with a simple configuration that switches between supply and stop of the working fluid.

  In the electronic component transfer apparatus of the present invention, it is preferable to include an imaging unit capable of imaging the electronic component held by the holding unit.

  Thus, it is possible to adjust (correct) the position and posture of the hand (gripping portion) according to the imaging result. For example, when the inspection unit performs an electrical inspection on the electronic component, the electronic component and the inspection unit can be in conductive contact with each other, and thus the inspection on the electronic component can be accurately performed.

An electronic component inspection apparatus according to the present invention includes: an inspection unit that inspects an electronic component;
A shuttle for transporting the electronic component;
And a hand for transporting the electronic component from the shuttle to the inspection unit, and for transporting the electronic component from the inspection unit to the shuttle,
The hand is
A gripping unit that grips the electronic component;
And a support portion movably supporting the grip portion,
The grip portion and the support portion are in contact with each other and each have a plurality of convex portions and concave portions for positioning the grip portion with respect to the support portion.
The convex portion has a spherical shape,
The concave portion is characterized by having an inclined surface which is inclined with respect to a direction orthogonal to the moving direction of the grip portion.

  Thereby, the positioning part which positions a holding part correctly with respect to a support part can be easily comprised by several convex part and recessed part. And in the positioning state by this positioning part, even if an inertial force acts on the holding part holding the electronic component when the hand moves to accelerate and move, the holding part is displaced relative to the supporting part It can be prevented. Thus, for example, when performing an electrical inspection on an electronic component, the inspection unit capable of performing the inspection can be brought into conductive contact with the electronic component, and therefore, the electronic component can be accurately inspected. be able to.

  In addition, the electronic component can be transported to the inspection unit, so that the inspection unit can inspect the electronic component. Moreover, the electronic component after an inspection can be conveyed from an inspection part.

An electronic component inspection apparatus according to the present invention includes: an inspection unit that inspects an electronic component;
A shuttle for transporting the electronic component;
And a hand for transporting the electronic component from the shuttle to the inspection unit, and for transporting the electronic component from the inspection unit to the shuttle,
The hand is
A gripping unit that grips the electronic component;
And a support portion movably supporting the grip portion,
The grip portion and the support portion are in contact with each other and each have a plurality of convex portions and concave portions for positioning the grip portion with respect to the support portion.
The convex portion has a spherical shape,
The recess may be conical.

  Thereby, the positioning part which positions a holding part correctly with respect to a support part can be easily comprised by several convex part and recessed part. And in the positioning state by this positioning part, even if an inertial force acts on the holding part holding the electronic component when the hand moves to accelerate and move, the holding part is displaced relative to the supporting part It can be prevented. Thus, for example, when performing an electrical inspection on an electronic component, the inspection unit capable of performing the inspection can be brought into conductive contact with the electronic component, and therefore, the electronic component can be accurately inspected. be able to.

  In addition, the electronic component can be transported to the inspection unit, so that the inspection unit can inspect the electronic component. Moreover, the electronic component after an inspection can be conveyed from an inspection part.

FIG. 1 is a schematic perspective view of the electronic component inspection device (first embodiment) of the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operation state of the electronic component inspection device shown in FIG. FIG. 3 is a side cross-sectional view of a vertical cross section of a device transfer head disposed in an inspection area of the electronic component inspection device shown in FIG. FIG. 4 is a side cross-sectional view of a vertical cross section of a device transfer head disposed in an inspection area of the electronic component inspection device shown in FIG. FIG. 5 is a vertical sectional side view sequentially showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. FIG. 6 is a vertical sectional side view sequentially showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. FIG. 7 is a vertical sectional side view sequentially showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. FIG. 8 is a vertical sectional side view sequentially showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. FIG. 9 is a side view in vertical section showing the operation of the device transfer head in the inspection area of the electronic component inspection apparatus shown in FIG. FIG. 10 is a vertical sectional side view sequentially showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. FIG. 11 is a vertical sectional side view sequentially showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. FIG. 12 is a vertical sectional side view sequentially showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. FIG. 13 is a vertical cross-sectional side view sequentially illustrating the operation of the device transfer head within the inspection region of the electronic component inspection device shown in FIG. FIG. 14 is a vertical sectional side view sequentially showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. FIG. 15 is a vertical sectional side view sequentially showing the operation of the device transfer head in the inspection area of the electronic component inspection device shown in FIG. FIG. 16 is a plan view of the device transfer head shown in FIG. FIG. 17 is a side sectional view of a vertical cross section of a device transfer head disposed in the inspection area of the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 18 is a cross-sectional view taken along the line AA in FIG. FIG. 19 is a view (plan view) viewed in the direction of arrow B in FIG. FIG. 20 is a plan view of a device transfer head disposed in the inspection area of the electronic component inspection device (third embodiment) of the present invention. FIG. 21 is a plan view of a device transfer head disposed in the inspection area of the electronic component inspection apparatus (fourth embodiment) of the present invention.

  Hereinafter, an electronic component conveyance device and an electronic component inspection device according to the present invention will be described in detail based on preferred embodiments shown in the attached drawings.

First Embodiment
Hereinafter, with reference to FIGS. 1-16, 1st Embodiment of the electronic component conveying apparatus and electronic component inspection apparatus of this invention is described. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are taken as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X axis and the Y axis is horizontal, and the Z axis is vertical. A direction parallel to the X axis is also referred to as "X direction (first direction)", a direction parallel to the Y axis is referred to as "Y direction (second direction)", and a direction parallel to the Z axis is referred to as " Also referred to as the Z direction (third direction). Also, the direction in which the arrows in each direction are directed is referred to as "positive", and the opposite direction is referred to as "negative". In addition, “horizontal” in the present specification is not limited to complete horizontal, and includes a state slightly inclined (for example, less than about 5 °) with respect to horizontal as long as transportation of the electronic component is not impeded. Also, the upper side in FIG. 1 and FIGS. 3 to 15 (the same applies to FIGS. 17 and 18), that is, the positive side in the Z-axis direction is “upper” or “upper” or lower side, ie, the negative side in the Z-axis direction. May be referred to as "below" or "below."

  The electronic component transfer apparatus 10 of the present invention has an appearance shown in FIG. The electronic component transfer apparatus 10 according to the present invention is a handler, and an inspection area A3 in which the inspection unit 16 for inspecting the electronic component can be disposed, a device supply unit 14 (shuttle) for transferring the electronic component, and a device recovery unit 18 And a hand unit 3 (hand) that transports the electronic component from the device supply unit 14 to the inspection unit 16 and transports the electronic component from the inspection unit 16 to the device recovery unit 18. The hand unit 3 (hand) has a grip 4 for gripping an electronic component, and a support 5 for movably supporting the grip 4. In addition, the gripping portion 4 and the supporting portion 5 have a plurality of convex portions 55 and concave portions 45 for positioning the gripping portion 4 with respect to the supporting portion 5 in contact with each other. Further, the convex portion 55 has a spherical shape, and the concave portion 45 has an inclined surface 451 which is inclined with respect to a direction orthogonal to the moving direction of the grip portion 4.

  Thereby, as described later, in the electronic component transfer apparatus 10, the positioning portion 8 is configured by the plurality of pairs of convex portions 55 and the concave portions 45, and the positioning portion 8 has a simple configuration. In addition, the positioning portion 8 can accurately position the gripping portion 4 with respect to the support portion 5.

  In the positioning state, for example, as shown in FIGS. 9 to 10, when the hand unit 3 accelerates to move to the Y axis direction positive side, an inertial force acts on the gripping portion 4 gripping the electronic component. Also, the gripping portion 4 can be prevented from being displaced with respect to the support portion 5. As a result, the electronic component and the inspection unit 16 described later can be brought into conductive contact with each other, so that the inspection of the electronic component can be performed accurately.

  Moreover, as shown in FIG. 2, the electronic component inspection apparatus 1 of this invention has the electronic component conveying apparatus 10, and also has the test | inspection part 16 which test | inspects an electronic component. That is, the electronic component inspection apparatus 1 of the present invention includes an inspection unit 16 that inspects an electronic component, a device supply unit 14 (shuttle) and a device recovery unit 18 (shuttle) that transport the electronic component, and a device supply unit And a hand unit 3 (hand) that conveys from the inspection unit 16 to the device recovery unit 18. The hand unit 3 (hand) has a grip 4 for gripping an electronic component, and a support 5 for movably supporting the grip 4. In addition, the gripping portion 4 and the supporting portion 5 have a plurality of convex portions 55 and concave portions 45 for positioning the gripping portion 4 with respect to the supporting portion 5 in contact with each other. Further, the convex portion 55 has a spherical shape, and the concave portion 45 has an inclined surface 451 which is inclined with respect to a direction orthogonal to the moving direction of the grip portion 4.

  Thereby, the electronic component inspection device 1 having the advantages of the electronic component transfer device 10 described above is obtained. In addition, the electronic component can be transported to the inspection unit 16, and the inspection unit 16 can perform the inspection on the electronic component. In addition, the electronic component after inspection can be transported from the inspection unit 16.

The configuration of each part will be described in detail below.
As shown in FIGS. 1 and 2, an electronic component inspection apparatus 1 having an electronic component transfer apparatus 10 transfers electronic components such as an IC device which is, for example, a BGA (Ball Grid Array) package, and the electronic components are transferred during the transfer process. Is an apparatus for inspecting / testing (hereinafter simply referred to as “inspection”) electrical characteristics of the In the following, for convenience of explanation, the case where an IC device is used as the electronic component will be representatively described, and this will be referred to as an "IC device 90". The IC device 90 has a flat plate shape in the present embodiment. The IC device 90 also has a plurality of terminals (electronic component side terminals) 902 arranged on the lower surface thereof in a matrix in plan view. Each terminal 902 has a hemispherical shape.

  As the IC device, in addition to the above-described ones, for example, “modules in which a plurality of IC devices are packaged into a plurality of modules“ LSI (Large Scale Integration) ”,“ CMOS (Complementary MOS) ”,“ CCD (Charge Coupled Device) ” IC, "crystal device", "pressure sensor", "inertial sensor (acceleration sensor)", "gyro sensor", "fingerprint sensor" and the like.

The electronic component inspection apparatus 1 (electronic component transfer apparatus 10) includes a tray supply area A1, a device supply area A2, an inspection area A3, a device recovery area A4, and a tray removal area A5. It is divided by each wall as described later. Then, IC device 90, from the tray supply area A1 to the tray removal area A5 via sequentially the respective regions in the arrow alpha ₉₀ direction, a check is made in the course of the inspection area A3. As described above, the electronic component inspection apparatus 1 includes the electronic component conveyance device 10 having the conveyance unit 25 that conveys the IC device 90 so as to pass through each area, the inspection unit 16 that performs the inspection in the inspection area A3, and the control unit It has 800 and so on. In addition, the electronic component inspection device 1 further includes a monitor 300, a signal lamp 400, and an operation panel 700.

  In the electronic component inspection apparatus 1, one in which the tray supply area A1 and the tray removal area A5 are disposed, that is, the lower side in FIG. 2 is the front side and one in which the inspection area A3 is disposed, that is, FIG. The upper side of is used as the back side.

  Further, the electronic component inspection device 1 is used by mounting in advance what is called a "change kit" which is replaced for each type of the IC device 90. The change kit includes a placement unit (electronic component placement unit) on which the IC device 90 (electronic component) is placed. In the electronic component inspection device 1 of the present embodiment, the placement units are installed at a plurality of places, and include, for example, a temperature adjustment unit 12 described later, a device supply unit 14 and a device recovery unit 18. In addition, in the placement unit (electronic component placement unit) on which the IC device 90 (electronic component) is placed, the tray 200 prepared by the user separately from the change kit as described above, and the recovery tray 19 and There is also an inspection unit 16.

  The tray supply area A1 is a feeding unit to which the tray 200 in which a plurality of untested IC devices 90 are arrayed is supplied. The tray supply area A1 can also be referred to as a mounting area on which a plurality of trays 200 can be stacked and mounted. In the present embodiment, in each tray 200, a plurality of recesses (pockets) are arranged in a matrix. The IC device 90 can be housed and placed one by one in each recess.

The device supply area A2 is an area in which the plurality of IC devices 90 on the tray 200 transported from the tray supply area A1 are transported and supplied to the inspection area A3. Further, tray conveyance mechanisms 11A and 11B for conveying the trays 200 one by one horizontally are provided so as to straddle the tray supply area A1 and the device supply area A2. The tray transfer mechanism 11A is a part of the transfer unit 25 and moves the tray 200 together with the IC device 90 placed on the tray 200 in the positive side in the Y direction, that is, in the direction of the arrow α _{11A in} FIG. be able to. As a result, the IC device 90 can be stably fed into the device supply area A2. Further, the tray transport mechanism 11B is a moving unit capable of moving the empty tray 200 in the negative side in the Y direction, that is, in the direction of the arrow α _11B in FIG. Thus, the empty tray 200 can be moved from the device supply area A2 to the tray supply area A1.

  The device supply area A2 is provided with a temperature control unit (soak plate (English notation: soak plate, Chinese notation (one example): temperature uniforming plate)) 12, a device transport head 13, and a tray transport mechanism 15 There is. In addition, a device supply unit 14 is provided which moves so as to straddle the device supply area A2 and the inspection area A3.

  The temperature control unit 12 is a mounting unit on which a plurality of IC devices 90 are mounted, and is referred to as a “soak plate” capable of collectively heating or cooling the mounted IC devices 90. By this soak plate, the IC device 90 before being inspected by the inspection unit 16 can be heated or cooled in advance, and the temperature can be adjusted to a temperature suitable for the inspection (high temperature inspection or low temperature inspection).

The temperature control part 12 as such a mounting part is being fixed. Thereby, the temperature of the IC device 90 on the temperature adjustment unit 12 can be stably adjusted.
Further, the temperature control unit 12 is grounded (grounded).

  In the configuration shown in FIG. 2, two temperature adjustment units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray conveyance mechanism 11A is conveyed to any one of the temperature adjustment units 12.

The device transport head 13 grips the IC device 90, and is supported movably in the X direction and the Y direction in the device supply area A2, and is also supported movably in the Z direction. The device transport head 13 is also a part of the transport unit 25 and transports the IC device 90 between the temperature adjustment unit 12 and the tray 200 carried in from the tray supply area A1, and the temperature adjustment unit 12 and a device to be described later The transfer of the IC device 90 to and from the supply unit 14 can be responsible. In FIG. 2, the movement of the device transfer head 13 in the X direction is indicated by an arrow _α13X , and the movement of the device transfer head 13 in the Y direction is indicated by an arrow _α13Y .

  The device supply unit 14 is a placement unit on which the IC device 90 whose temperature is adjusted by the temperature adjustment unit 12 is placed, and the “supply shuttle plate” can transport the IC device 90 to the vicinity of the inspection unit 16. Or it is simply called a "supply shuttle". The device supply unit 14 can also be part of the transport unit 25. The device supply unit 14 has a recess (pocket) 141 in which the IC device 90 is accommodated and placed (see, for example, FIG. 5).

Further, the device supply unit 14 as the placement unit is supported so as to be reciprocally movable (movable) along the X direction, that is, the direction of the arrow α ₁₄ between the device supply region A2 and the inspection region A3. As a result, the device supply unit 14 can stably transport the IC device 90 from the device supply area A2 to the vicinity of the inspection unit 16 of the inspection area A3. After being taken out by (hand unit 3), it is possible to return to the device supply area A2 again.

  In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the device supply unit 14 on the Y direction negative side is referred to as “device supply unit 14A”, and the device supply unit on the Y direction positive side 14 may be referred to as "device supply unit 14B". Then, the IC device 90 on the temperature adjustment unit 12 is transported to the device supply unit 14A or the device supply unit 14B in the device supply area A2. Further, the device supply unit 14 is configured to be able to heat or cool the IC device 90 placed on the device supply unit 14, as in the temperature adjustment unit 12. Thus, the temperature adjustment state of the IC device 90 whose temperature has been adjusted by the temperature adjustment unit 12 can be maintained, and the IC device 90 can be transported to the vicinity of the inspection unit 16 in the inspection area A3. Further, the device supply unit 14 is also grounded in the same manner as the temperature adjustment unit 12.

Tray transporting mechanism 15, the positive side of the X direction empty tray 200 in a state where all of the IC devices 90 is removed in the device supply area A2, i.e., a mechanism for conveying the arrow alpha ₁₅ direction. Then, after this conveyance, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray conveyance mechanism 11B.

  The inspection area A3 is an area for inspecting the IC device 90. In the inspection area A3, an inspection unit 16 for inspecting the IC device 90 and a device transport head 17 are provided.

  The device transfer head 17 is a part of the transfer unit 25 and is configured to be able to heat or cool the held IC device 90 as in the temperature control unit 12. The device transport head 17 has a hand unit 3 for gripping an IC device 90 (electronic component) as described later. Thus, the IC device 90 can be transported in the inspection area A3 while holding the temperature adjustment state by gripping the IC device 90 whose temperature adjustment state is maintained.

  Such a device transfer head 17 is supported so as to be reciprocally movable in the Y direction and the Z direction in the inspection area A3, and is a part of a mechanism called an "index arm". As a result, the device transfer head 17 can lift the IC device 90 from the device supply unit 14 carried in from the device supply area A2, transfer it onto the inspection unit 16, and place it.

In FIG. 2, the reciprocating movement of the device transport head 17 in the Y direction is indicated by an arrow α ₁₇ Y. Further, the device transport head 17 is supported so as to be capable of reciprocating in the Y direction, but is not limited to this, and may be supported so as to be capable of reciprocating in the X direction. Further, in the configuration shown in FIG. 2, two device transport heads 17 are disposed in the Y direction, and the device transport head 17 on the Y direction negative side is referred to as “device transport head 17A” and devices on the Y direction positive side. The transport head 17 may be referred to as "device transport head 17B". The device transfer head 17A can handle transfer from the device supply unit 14A of the IC device 90 to the test unit 16 in the test area A3, and the device transfer head 17B can be a device of the IC device 90 in the test area A3. The conveyance from the supply unit 14B to the inspection unit 16 can be taken.

  The inspection unit 16 (socket) is a placement unit (electronic component placement unit) for placing an IC device 90, which is an electronic component, and testing the electrical characteristics of the IC device 90. The inspection unit 16 has a recess (pocket) 161 in which the IC device 90 is stored and placed, and a plurality of probe pins (mounting portion side terminals) 162 are provided at the bottom of the recess 161 (a mounting portion side terminal) See, for example, FIG. 5). Then, the terminals 902 of the IC device 90 and the probe pins 162 are conductively connected, ie, brought into contact with each other, whereby the IC device 90 can be inspected. The inspection of the IC device 90 is performed based on a program stored in an inspection control unit provided in a tester connected to the inspection unit 16. The shape of the upper end of the probe pin 162 conforms to the shape of the terminal 902, and in the present embodiment, it has a crown shape adapted to the hemispherical terminal 902 (see, for example, FIG. 5).

  Like the temperature control unit 12, the inspection unit 16 can heat or cool the IC device 90 to adjust the IC device 90 to a temperature suitable for inspection.

  In addition, as shown in FIGS. 5 to 14, the electronic component inspection device 1 (electronic component transfer device 10) is an IC device 90 (electronic component) gripped by the grip portion 4 of the device transfer head 17 (hand unit 3). And an imaging unit 26 capable of imaging the image. The imaging unit 26 is disposed and fixed in the examination region A3. The imaging unit 26 is located between the inspection unit 16 and the device supply unit 14 (or the device recovery unit 18) stopped in the inspection area A3. As described above, the device supply unit 14 includes the device supply unit 14A and the device supply unit 14B. Therefore, there are imaging units 26 located between the inspection unit 16 and the device supply unit 14A, and those located between the inspection unit 16 and the device supply unit 14B. Hereinafter, the imaging unit 26 on the device supply unit 14A (device recovery unit 18A) side will be representatively described.

  The imaging unit 26 is configured of, for example, various cameras such as a CCD (Charge Coupled Devices) camera and a three-dimensional camera. The imaging unit 26 has an imaging direction facing upward, and can image the IC device 90 (see FIG. 9) gripped by the hand unit 3. By adjusting (correcting) the position and attitude of the hand unit 3 according to the imaging result, it is possible to conduct the terminals 902 of the IC device 90 and the probe pins 162 of the inspection unit 16 corresponding to the terminals 902. (See FIG. 11). Thereby, the inspection for the IC device 90 can be performed accurately.

  The method for adjusting the position and attitude of the hand unit 3 is not particularly limited. For example, a method of mounting a piezoelectric element (piezo element) on the hand unit 3 and driving the piezoelectric element may be mentioned. The piezoelectric element expands and contracts in its longitudinal direction by applying an alternating voltage. Then, the hand unit 3 can be moved in the X-axis direction or the Y-axis direction, or the hand unit 3 can be rotated about the Z-axis using this expansion and contraction operation. Thereby, the position and attitude of the hand unit 3 are adjusted. The constituent material of the piezoelectric element is not particularly limited, and lead zirconate titanate (PZT), quartz, lithium niobate, barium titanate, lead titanate, lead metaniobate, polyvinylidene fluoride, lead zinc niobate, scandium Various materials such as lead niobate can be used.

  The device recovery area A4 is an area in which the plurality of IC devices 90 which are inspected in the inspection area A3 and whose inspection is completed are recovered. In the device recovery area A4, a recovery tray 19, a device transport head 20, and a tray transport mechanism 21 are provided. A device recovery unit 18 is also provided that moves so as to straddle the inspection area A3 and the device recovery area A4. In addition, an empty tray 200 is also prepared in the device recovery area A4.

  The device recovery unit 18 is a placement unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed, and the IC device 90 can be transported to the device recovery area A4, and “recovery shuttle plate” or It is simply called "recovery shuttle". The device recovery unit 18 can also be part of the transport unit 25. The device recovery unit 18 has a recess (pocket) 181 in which the IC device 90 is accommodated and placed (see, for example, FIG. 11).

Further, the device recovery unit 18 is supported so as to be capable of reciprocating between the inspection region A3 and the device recovery region A4 in the X direction, that is, the arrow α ₁₈ direction. Further, in the configuration shown in FIG. 2, two device recovery units 18 are disposed in the Y direction as in the device supply unit 14, and the device recovery unit 18 on the Y direction negative side is “device recovery unit 18 A”. In other words, the device recovery unit 18 on the positive side in the Y direction may be referred to as a “device recovery unit 18B”. Then, the IC device 90 on the inspection unit 16 is transported to and mounted on the device recovery unit 18A or the device recovery unit 18B. The transport from the inspection unit 16 of the IC device 90 to the device recovery unit 18A is borne by the device transport head 17A, and the transport from the inspection unit 16 to the device recovery unit 18B is borne by the device transport head 17B. The device recovery unit 18 is also grounded as in the temperature control unit 12 and the device supply unit 14.

  The recovery tray 19 is a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed, and is fixed so as not to move in the device recovery area A4. As a result, even in the device recovery area A4 in which various movable parts such as the device transport head 20 are relatively large, the tested IC device 90 is stably placed on the recovery tray 19. It becomes. In the configuration shown in FIG. 2, three recovery trays 19 are arranged along the X direction.

  Further, three empty trays 200 are also arranged along the X direction. The empty tray 200 also becomes a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed. Then, the IC device 90 on the device recovery unit 18 that has moved to the device recovery area A4 is transported to and placed on any of the recovery tray 19 and the empty tray 200. As a result, the IC devices 90 are classified and collected for each inspection result.

The device transport head 20 is movably supported in the device recovery area A4 in the X and Y directions, and further has a portion movable in the Z direction. The device transport head 20 is a part of the transport unit 25 and can transport the IC device 90 from the device recovery unit 18 to the recovery tray 19 or the empty tray 200. Incidentally, in FIG. 2 shows the movement of the X-direction of the device carrying head 20 by the arrow alpha _20X, it shows a movement in the Y-direction of the device carrying head 20 by the arrow alpha _20Y.

Tray transfer mechanism 21, X-direction empty tray 200 is conveyed from the tray removal area A5 in the device collection region within A4, i.e., a mechanism for conveying the arrow alpha ₂₁ direction. Then, after this conveyance, the empty tray 200 will be disposed at a position where the IC device 90 is collected, that is, it can be any of the three empty trays 200.

  The tray removal area A5 is a removing unit from which the tray 200 in which the plurality of IC devices 90 in the inspected state are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

Further, a tray transport mechanism 22A and a tray transport mechanism 22B for transporting the trays 200 one by one in the Y direction are provided so as to straddle the device recovery area A4 and the tray removal area A5. The tray transport mechanism 22A is a part of the transport unit 25 and is a moving unit capable of reciprocating the tray 200 in the Y direction, that is, in the direction of the arrow α _22A . Thus, the inspected IC device 90 can be transported from the device recovery area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can move the empty tray 200 for collecting the IC device 90 in the positive side in the Y direction, that is, in the direction of the arrow α _22B . Thus, the empty tray 200 can be moved from the tray removal area A5 to the device recovery area A4.

  The control unit 800 includes, for example, the tray conveyance mechanism 11A, the tray conveyance mechanism 11B, the temperature adjustment unit 12, the device conveyance head 13, the device supply unit 14, the tray conveyance mechanism 15, the inspection unit 16, and the device conveyance. The operation of the head 17, the device recovery unit 18, the device transport head 20, the tray transport mechanism 21, the tray transport mechanism 22A, and the tray transport mechanism 22B can be controlled.

  The operator can set or confirm the operating conditions and the like of the electronic component inspection device 1 through the monitor 300. The monitor 300 has a display screen 301 configured of, for example, a liquid crystal screen, and is disposed on the front side upper portion of the electronic component inspection device 1. As shown in FIG. 1, a mouse stand 600 on which a mouse is placed is provided on the right side of the tray removal area A5 in the figure. This mouse is used when operating the screen displayed on the monitor 300.

  Further, an operation panel 700 is disposed at the lower right of FIG. 1 with respect to the monitor 300. The operation panel 700 instructs the electronic component inspection device 1 to perform a desired operation separately from the monitor 300.

  In addition, the signal lamp 400 can notify of the operation state of the electronic component inspection device 1 and the like by the combination of the light emitting colors. The signal lamp 400 is disposed on the top of the electronic component inspection device 1. A speaker 500 is built in the electronic component inspection device 1, and the operation state or the like of the electronic component inspection device 1 can also be notified by this speaker 500.

  In the electronic component inspection device 1, the space between the tray supply area A1 and the device supply area A2 is divided by the first partition wall 231, and the space between the device supply area A2 and the inspection area A3 is divided by the second partition wall 232 The third barrier rib 233 separates the inspection area A3 from the device recovery area A4, and the fourth barrier rib 234 separates the device recovery area A4 from the tray removal area A5. The fifth partition wall 235 also divides the device supply area A2 and the device recovery area A4.

  The outermost part of the electronic component inspection apparatus 1 is covered with a cover, and the cover includes, for example, a front cover 241, a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

  As shown in FIGS. 3 and 4, the device transfer head 17 has at least one hand unit 3 (hand). As shown in FIGS. 5 to 11, the hand unit 3 can grip the IC device 90 (electronic component) on the device supply unit 14 and transport the IC device 90 to the inspection unit 16. Further, as illustrated in FIGS. 11 to 15, after the inspection of the IC device 90, the hand unit 3 can grip the IC device 90 on the inspection unit 16 and transport the IC device 90 to the device recovery unit 18. In addition, the arrangement | positioning number of the hand unit 3 is not specifically limited.

As shown in FIGS. 3 and 4, the hand unit 3 has a grip 4, a support 5, a drive 6, and a detector 7. A lifting device and a rotating device (not shown) are disposed on the upper side of the hand unit 3. The elevating device is a device for raising and lowering the hand unit 3 in the Z-axis direction. Rotation device is a device for rotating the hand unit 3 to the central axis O ₄ around.

  The gripping portion 4 is a portion for gripping the IC device 90. The gripping unit 4 includes a pressing unit 41, a heating unit 42, and a suction unit 43.

  The pressing portion 41 has a cylindrical shape, and has a flange portion (upper flange portion) 411 whose outer diameter is expanded at the upper portion, and a flange portion (lower flange portion) 412 whose outer diameter is expanded at the lower portion. Have. In addition, the outer diameter may be the same as the flange part 411 and the flange part 412, and may differ. Further, on the outer peripheral portion of the flange portion 411, a rib (protruding portion) 413 which protrudes in a ring shape along the circumferential direction is formed.

  Below the flange portion 412 of the pressing portion 41, a heating portion 42 for heating the IC device 90 is fixed. The heating unit 42 has a cylindrical shape, and a heater 421 is incorporated therein. The operation of the heater 421 generates heat. This heat is transferred to the IC device 90 through the adsorption unit 43. Thereby, the IC device 90 can be heated and adjusted in advance to a temperature suitable for inspection. In addition to the heating unit 42, the holding unit 4 may have a cooling unit that cools the IC device 90.

  Below the heating unit 42, a suction unit 43 for holding the IC device 90 by suction is fixed. The suction unit 43 has a suction unit main body 431 and a suction pad (suction cup) 432. The suction portion main body 431 is formed with a first concave portion 433 opening in the lower surface of the suction portion main body 431 and a second concave portion 434 opening in the first concave portion 433 and having a depth deeper than the first concave portion 433. Further, a suction pad 432 is fixed to the second recess 434. The suction pad 432 is connected to one end side of a flow path 435 formed inside the suction portion main body 431. The other end side of the flow path 435 is connected to the pipe 44. The pipe 44 is connected to a vacuum pump via a solenoid valve (not shown). The solenoid valve can switch the pressure of the pipe 44 between negative pressure and atmospheric pressure. Then, when the pressure of the pipe 44 is a negative pressure, a suction force is generated on the suction pad 432, and the IC device 90 can be held by suction. In addition, when the pressure of the pipe 44 is atmospheric pressure, the IC device 90 can be released from the suction pad 432.

  The support portion 5 is a portion which supports the grip portion 4 so as to be movable between a first position (see FIG. 3) and a second position (see FIG. 4) below the first position. The support portion 5 has a base portion 51, a hollow support portion main body 52 located below the base portion 51, and a connection portion 53 located above the base portion 51. The base 51 is connected to the rotating device via a connecting portion 53. In the support portion main body 52, a through hole 522 communicating with the hollow portion 521 is formed. A portion between the flange portion 411 and the flange portion 412 of the pressing portion 41 is inserted into the through hole 522 with a gap. Further, the support portion 5 has a flow path 54 which is formed to penetrate the base portion 51 and the support portion main body 52 collectively. One end side of the flow path 54 is in communication with the hollow portion 521 of the support portion main body 52, and the other end side is connected to a pump (not shown) through a pipe.

  The hand unit 3 (hand) has a drive unit 6 that moves the grip 4 in the Z-axis direction. The driving unit 6 can move the gripping unit 4 to the first position or the second position at a desired timing.

  The driving unit 6 urges the gripping unit 4 upward (opposite to one direction) with the pneumatic unit 61 moving the gripping unit 4 downward (one direction) by supply of air (working fluid). And a biasing portion 62.

  The air pressure portion 61 is provided to divide the hollow portion 521 of the support portion main body 52 into upper and lower portions, and is connected to the diaphragm 63 to which the flange portion 411 of the pressing portion 41 is fixed And the pump. Then, the pump operates to supply air to the upper space surrounded by the diaphragm 63 and the support main body 52, whereby the pressure in the space rises. Thereby, the gripping portion 4 can move downward, that is, from the first position toward the second position, against the biasing force of the biasing portion 62.

  The biasing portion 62 is constituted by a coil spring disposed in the hollow portion 521 of the support portion main body 52. The coil spring is in a compressed state between the inner lower surface 523 of the support portion main body 52 and the rib 413 of the pressing portion 41. Thereby, the grip 4 is biased upward, that is, in a direction from the second position toward the first position. When the air pressure unit 61 is stopped, that is, when the supply of air is stopped, the gripping unit 4 is positioned at the first position by the biasing force of the biasing unit 62. When the grip 4 is in the first position, the diaphragm 63 may be in contact with the inner upper surface 524 of the support main body 52, but as shown in FIG. Preferably it is formed. Further, in this case, the hand unit 3 preferably has a restricting portion (stopper) that restricts the movement limit of the grip 4 to the first position.

  As described above, the driving unit 6 can stably move the gripping unit 4 with a simple configuration of switching between supply and stop of air.

  The detection unit 7 is a portion that detects the inclination of the gripping unit 4 with respect to the horizontal direction, that is, the XY plane. The detection unit 7 includes an optical sensor 71 fixed to the support unit 5 and a shielding plate 72 fixed to the grip unit 4, and these are arranged in pairs (one set). There is. In the present embodiment, the light sensor 71 and the shielding plate 72 are one set on the positive side in the X-axis direction (hereinafter referred to as “first set”) and one set on the negative side in the X-axis direction. Hereinafter, “the second set” will be described, one set on the Y axis direction positive side (hereinafter referred to as “the third set”), and one set on the Y axis direction negative side (hereinafter referred to as the “fourth set”). ing. And the inclination of the holding part 4 can be detected by the shielding state of the optical sensor 71 by the shielding board 72 of each group. In the present embodiment, the first set and the second set can detect the inclination (rotation) of the grip 4 around the Y axis, and the third set and the fourth set are the X axis of the grip 4 The inclination (rotation) around can be detected.

  As shown in FIG. 4, the hand unit 3 includes a positioning unit 8 that positions the gripping unit 4 at the second position with respect to the support unit 5. The positioning portion 8 is composed of a convex portion 55 provided on the support portion main body 52 of the support portion 5 and a concave portion 45 provided on the pressing portion 41 of the grip portion 4.

The convex portion 55 and the concave portion 45 are paired, and a plurality of pairs are arranged. As shown in FIG. 16, in the present embodiment, two sets of the convex portion 55 and the concave portion 45 are provided around the central axis O ₄ of the grip portion 4, that is, one on both left and right sides in the figure with respect to the central axis O ₄ . It is arranged in pairs. Then, as described above, when the gripping portion 4 is moved from the first position to the second position, the convex portion 55 and the concave portion 45 of each set are supplied with air by the operation of the driving portion 6 as described above. 55 can enter recess 45 and contact each other. Thereby, the movement of the gripping portion 4 in the second position is restricted with respect to the support portion 5 while the movement in the XY plane direction (horizontal direction) is restricted. Hereinafter, this state is referred to as "positioning state".

  As shown in FIG. 3 and FIG. 4, the convex portion 55 is formed to project on the inner lower surface 523 of the support portion main body 52 of the support portion 5 and has a spherical (ball-like) shape, that is, a spherical surface.

  On the other hand, the concave portion 45 is formed on the lower surface of the flange portion 411 of the pressing portion 41 of the grip portion 4 so as to face the convex portion 55. The recess 45 has an inclined surface 451 which is inclined in a direction orthogonal to the moving direction of the grip portion 4, that is, with respect to the XY plane direction, and has a conical shape in the present embodiment.

  With such a shape, when the grip portion 4 is positioned at the second position, the convex portion 55 and the concave portion 45 of each set can easily enter the concave portion 45, and thereafter, each other Contact. Thus, the positioning state is reproduced each time the grip 4 is positioned at the second position.

  As described above, in the electronic component inspection device 1 (the electronic component conveying device 10), the positioning portion 8 is configured by the plurality of pairs of convex portions 55 and the concave portions 45, and the positioning portion 8 has a simple configuration. . Further, the positioning portion 8 can accurately position the gripping portion 4 at the second position with respect to the support portion 5.

  Then, in the positioning state, for example, as shown in FIGS. 9 to 10, when the hand unit 3 accelerates to move to the Y axis direction positive side, an inertial force acts on the gripping portion 4 gripping the IC device 90. Even in this case, it is possible to prevent the gripping portion 4 from being displaced relative to the support portion 5. As a result, the correction state of the hand unit 3 according to the imaging result of the imaging unit 26 described above is maintained as it is, and thus each terminal 902 of the IC device 90 and the probe pin 162 of the inspection unit 16 corresponding to each terminal 902. Can be in conductive contact (see FIG. 11). Thereby, the inspection for the IC device 90 can be performed accurately.

  Further, as described above, the convex portion 55 is provided in the support portion main body 52 of the support portion 5, and the concave portion 45 is provided in the pressing portion 41 of the grip portion 4. Thereby, for example, when the convex portion 55 is configured separately from the support portion main body 52, the convex portion 55 is stably and easily disposed on the inner lower surface 523 of the support portion main body 52 than the moving grip portion 4 be able to.

  In addition, the gripping portion 4 is movable to a first position (see FIG. 3) at which the projection 55 and the recess 45 are separated, and to a second position (see FIG. 4) at which the projection 55 and the recess 45 contact. . Thereby, the positioning state is released at the first position. For example, when the holding unit 4 presses the IC device 90 against the inspection unit 16 by releasing the positioning state, even if the inspection unit 16 is slightly inclined with respect to the XY plane, the holding unit follows the inspection unit 16. The attitude of 4 can tilt with the IC device 90. As a result, the IC device 90 and the inspection unit 16 can be brought into conductive contact with each other, so that the inspection of the IC device 90 can be performed accurately.

  Next, the operation of the hand unit 3 (device transport head 17A) in the inspection area A3 will be described with reference to FIGS.

  As shown in FIG. 5, in the hand unit 3, the grip 4 is at the first position, and the IC device 90 is not gripped yet. Further, the hand unit 3 is in a state of facing the recess 141 immediately above the recess 141 of the device supply unit 14A. The IC device 90 is housed and placed in the recess 141.

  Next, as shown in FIG. 6, the gripping unit 4 is moved to the second position by operating the driving unit 6. At this time, as described above, the gripping unit 4 is positioned by the positioning unit 8. The operation of the drive unit 6 is continued until the state shown in FIG.

  Then, as shown in FIG. 7, the hand unit 3 is lowered until the suction unit 43 of the hand unit 3 (gripping unit 4) presses the IC device 90 placed on the device supply unit 14A. Then, by causing the suction unit 43 to generate a suction force in this state, the IC device 90 can be suctioned (held) by the suction unit 43. In addition, the gripping unit 4 receives the reaction force from the IC device 90, and moves upward from the second position. Thereby, the positioning state with respect to the holding part 4 is cancelled | released.

  Next, as shown in FIG. 8, the hand unit 3 is raised to the same height as the hand unit 3 in FIG. Thereby, the IC device 90 ascends with the hand unit 3. Moreover, since the holding part 4 is released from the said reaction force, it will return to a 2nd position again and will be in a positioning state.

  Next, as shown in FIG. 9, the hand unit 3 is moved to the Y direction positive side, that is, to the inspection unit 16 side, and temporarily stopped halfway. The stop position of the hand unit 3 is a position where the IC device 90 is located immediately above the imaging unit 26, and the imaging unit 26 is a position where imaging of the IC device 90 is possible. Then, the imaging unit 26 is operated at this position. Thereafter, as described above, the position and orientation of the hand unit 3 are corrected based on the imaging result.

  Next, as shown in FIG. 10, the hand unit 3 is further moved to the Y direction positive side, that is, the inspection unit 16 side, and is stopped immediately above the inspection unit 16.

  By the way, when the hand unit 3 is accelerated in an attempt to move the hand unit 3 to the Y axis direction positive side, an inertial force acts on the grip portion 4. The gripping portion 4 tries to move the IC device 90 to the Y axis direction negative side by this inertial force, but the movement to the Y axis direction negative side is restricted by the positioning state. As a result, it is possible to prevent the holding unit 4 from being displaced with respect to the support unit 5, and the correction state of the hand unit 3 is maintained as it is.

  Next, as shown in FIG. 11, the hand unit 3 is lowered until the IC device 90 is pressed against the inspection unit 16. Thus, the positioning state is maintained until the terminals 902 of the IC device 90 and the probe pins 162 of the inspection unit 16 corresponding to the terminals 902 are conductively contacted, and thus, the IC device 90 is accurately inspected. be able to.

  In addition, the gripping unit 4 receives the reaction force from the inspection unit 16 via the IC device 90, and moves upward from the second position. Thereby, the positioning state with respect to the holding part 4 is cancelled | released. Thus, even if the inspection unit 16 is slightly inclined with respect to the XY plane, the posture of the grip 4 can be inclined together with the IC device 90 following the inspection unit 16. As a result, the IC device 90 and the inspection unit 16 can be brought into conductive contact with each other, so that the inspection of the IC device 90 can be performed accurately.

  Further, the device supply unit 14A retracts from the inspection area A3, and instead, the device recovery unit 18A is located in the inspection area A3.

  Next, as shown in FIG. 12, the hand unit 3 is raised to the same height as the hand unit 3 in FIG. As a result, the IC device 90 after inspection rises with the hand unit 3. Moreover, the positioning state with respect to the holding part 4 is reproduced.

  Next, as shown in FIG. 13, the hand unit 3 is further moved to the Y direction negative side, that is, the device recovery unit 18A side, and is stopped immediately above the device recovery unit 18A.

  By the way, when the hand unit 3 is accelerated in an attempt to move the hand unit 3 to the Y axis direction negative side, an inertial force acts on the grip portion 4. The gripping portion 4 tries to move the IC device 90 to the Y axis direction positive side with this inertial force, but the movement to the Y axis direction positive side is restricted by the positioning state. Thereby, it can prevent that the holding part 4 shifts in position with respect to the support part 5.

  Next, as shown in FIG. 14, the hand unit 3 (the holding unit 4 in the positioning state) is lowered, and thereafter the suction unit 43 stops the generation of the suction force. As a result, the IC device 90 is released from the suction unit 43, and is accurately stored and placed in the recess 181 of the device recovery unit 18A.

  Next, as shown in FIG. 15, the hand unit 3 is raised to the same height as the hand unit 3 in FIG.

Second Embodiment
Hereinafter, although the second embodiment of the electronic component transfer apparatus and the electronic component inspection apparatus of the present invention will be described with reference to FIGS. 17 to 19, differences from the above-described embodiments will be mainly described, and the same matters will be described. Will omit the description.

  The present embodiment is the same as the first embodiment except that the shape of the recess of the positioning portion is different.

  As shown in FIGS. 17 to 19, in the present embodiment, the positioning unit 8 is in the direction orthogonal to the moving direction of the holding unit 4 in the concave portion 45 ′ of one of the two sets (the left side in the drawing). There are two inclined surfaces 452 inclined with respect to. Each inclined surface 452 extends in the Y-axis direction. The angle between the inclined surfaces 452 is not particularly limited, but is preferably the same as the apex angle of the conical inclined surface 451.

  For example, even if the flange portion 411 of the grip portion 4 expands and contracts due to a temperature change, and the positional relationship between the recess 45 and the recess 45 'changes in the Y-axis direction, the change is offset by the shape of the recess 45'. be able to. Thereby, the corresponding convex portion 55 can be intruded into and in contact with the concave portion 45, and the convex portion 55 corresponding to it can be intruded into and in contact with the concave portion 45 '. Is obtained.

Third Embodiment
The third embodiment of the electronic component conveyance device and the electronic component inspection device of the present invention will be described below with reference to FIG. 20, and differences from the above-described embodiment will be mainly described, and the same matters will be described. Omit.

  The present embodiment is the same as the first embodiment except that the numbers of depressions and projections forming the positioning portion are different.

As shown in FIG. 20, in this embodiment, the convex portion 55 and concave portion 45 constituting the positioning portion 8 are three pairs arranged at equal angular intervals to the central axis O ₄ around the grip portion 4. Thereby, the positioning accuracy is improved compared to the first embodiment.

Fourth Embodiment
Hereinafter, a fourth embodiment of the electronic component conveyance device and the electronic component inspection device of the present invention will be described with reference to FIG. 21, but differences from the above-described embodiments will be mainly described, and the same matters will be described. Omit.

  The present embodiment is the same as the third embodiment except that the numbers of depressions and projections forming the positioning portion are different.

As shown in FIG. 21, in this embodiment, the convex portion 55 and concave portion 45 constituting the positioning portion 8 is 4 pairs arranged at equal angular intervals to the central axis O ₄ around the grip portion 4. Thereby, the positioning accuracy is improved compared to the third embodiment.

  The electronic component transfer apparatus and the electronic component inspection apparatus according to the present invention have been described above with reference to the illustrated embodiment, but the present invention is not limited to this, and each component constituting the electronic component transfer apparatus and the electronic component inspection apparatus Can be replaced with any configuration that can perform the same function. Also, any component may be added.

  Further, the electronic component conveyance device and the electronic component inspection device of the present invention may be a combination of any two or more configurations (features) of the respective embodiments.

  In addition, although the imaging unit is fixed within the examination region, the present invention is not limited to this, and may be movable together with the device supply unit, for example.

  Moreover, although the working fluid used by the drive part which moves a holding part was air in said each embodiment, it is not limited to this, For example, liquid (oil) etc. may be sufficient.

  Moreover, although the pneumatic part of this drive part was a structure which has a diaphragm, it is not limited to this, For example, you may become a structure which has a velophram and a piston cylinder.

  In the first and second embodiments, there are two sets of the convex portion and the concave portion constituting the positioning portion, three sets in the third embodiment, and three sets in the fourth embodiment. However, the present invention is not limited to this, and may be, for example, five or more sets.

  Moreover, although the convex part was provided in the support part in the said each embodiment, and the concave part was provided in the holding part in the said each embodiment, the convex part and recessed part which comprise a positioning part are not limited to this, For example, a convex part It may be provided in the grip portion and the recess may be provided in the support portion.

  Moreover, although the convex part which comprises a positioning part was spherical shape in each said embodiment, it is not limited to this, For example, you may become columnar (cylindrical). When the convex portion is columnar (cylindrical), the concave portion is also columnar (cylindrical).

DESCRIPTION OF SYMBOLS 1 ... electronic component inspection apparatus, 10 ... electronic component conveyance apparatus, 11A ... tray conveyance mechanism, 11B ... tray conveyance mechanism, 12 ... temperature control part, 13 ... device conveyance head, 14 ... device supply part, 14A ... device supply part, 14B: Device supply part, 141: recessed part (pocket), 15: tray transfer mechanism, 16: inspection part, 161: recessed part (pocket), 162: probe pin (terminal on mounting portion side), 17: device transfer head, 17A ... device transport head, 17B ... device transport head, 18 ... device recovery unit, 18A ... device recovery unit, 18B ... device recovery unit, 181 ... recess (pocket), 19 ... recovery tray, 20 ... device transport head, 21 ... Tray transport mechanism, 22A: tray transport mechanism, 22B: tray transport mechanism, 231: first partition, 232: second partition, 2 3 ... 3rd partition, 234 ... 4th partition, 235 ... 5th partition, 241 ... Front cover, 242 ... Side cover, 243 ... Side cover, 244 ... Rear cover, 245 ... Top cover, 25 ... Transport part, 26 ... Imaging Part 3 Hand unit 4 Gripping part 41 Pressing part 411 Flange part 412 Flange part 413 Rib (projection part) 42 Heating part 421 Heater 43 Adsorption part 431 ... adsorption section main body, 432 ... adsorption pad (suction cup), 433 ... first recess, 434 ... second recess, 435 ... flow path, 44 ... piping, 45 ... recess, 45 'recess, 451 ... inclined surface, 452 ... Inclined surface, 5: support portion, 51: base portion, 52: support portion main body, 521: hollow portion, 522: through hole, 523: inner lower surface, 524: inner upper surface, 53: connection portion, 54: flow path, 55: Convex part, 6 ... driving Sections 61: air pressure portion 62: urging portion 63: diaphragm 7: 7: detection portion 71: light sensor 72: shielding plate 8: positioning portion 90: IC device 902: terminal (electronic component side Terminals, 200, trays, 300, monitors, 301, display screens, 400, signal lamps, 500, speakers, 600, mouse stands, 700, operation panels, 800, control units, A1: tray supply area, A2: device supply Area A3 inspection area A4 device recovery area A5 tray removal area O ₄ central axis α _{11 A} arrow α _{11 B} arrow α _{13 X} arrow α _{13 Y} arrow α ₁₄ arrow α ₁₄ arrow alpha _{15 ...} arrow, alpha _{17Y ...} arrows, alpha _{18 ...} arrow, alpha _{20X ...} arrows, alpha _{20Y ...} arrows, alpha _{21 ...} arrow, alpha _{22A ...} arrows, alpha _{22B ...} arrows, alpha _{90 ...} arrow

Claims (9)

An inspection area in which an inspection unit for inspecting an electronic component can be disposed;
A shuttle for transporting the electronic component;
And a hand for transporting the electronic component from the shuttle to the inspection unit, and for transporting the electronic component from the inspection unit to the shuttle,
The hand is
A gripping unit that grips the electronic component;
And a support portion movably supporting the grip portion,
The grip portion and the support portion are in contact with each other and each have a plurality of convex portions and concave portions for positioning the grip portion with respect to the support portion.
The convex portion has a spherical shape,
The said recessed part has an inclined surface inclined with respect to the direction orthogonal to the moving direction of the said holding part, The electronic component conveying apparatus characterized by the above-mentioned. An inspection area in which an inspection unit for inspecting an electronic component can be disposed;
A shuttle for transporting the electronic component;
And a hand for transporting the electronic component from the shuttle to the inspection unit, and for transporting the electronic component from the inspection unit to the shuttle,
The hand is
A gripping unit that grips the electronic component;
And a support portion movably supporting the grip portion,
The grip portion and the support portion are in contact with each other and each have a plurality of convex portions and concave portions for positioning the grip portion with respect to the support portion.
The convex portion has a spherical shape,
The said recessed part makes cone shape, The electronic component conveying apparatus characterized by the above-mentioned.   The electronic component conveying apparatus according to claim 1, wherein the grip portion is movable to a first position at which the convex portion and the concave portion are separated, and a second position at which the convex portion and the concave portion are in contact with each other.   The electronic component conveying apparatus according to claim 1, wherein the convex portion is provided in the support portion, and the concave portion is provided in the grip portion.   The electronic component transport apparatus according to claim 1, wherein the hand includes a drive unit that moves the grip unit.   The drive unit according to claim 5, further comprising: an air pressure unit that moves the grip unit in one direction by supplying a working fluid; and a biasing unit that biases the grip unit in a direction opposite to the one direction. Electronic Component Transporter.   The electronic component conveying apparatus according to claim 1, further comprising an imaging unit capable of imaging the electronic component held by the holding unit. An inspection unit that inspects electronic components;
A shuttle for transporting the electronic component;
And a hand for transporting the electronic component from the shuttle to the inspection unit, and for transporting the electronic component from the inspection unit to the shuttle,
The hand is
A gripping unit that grips the electronic component;
And a support portion movably supporting the grip portion,
The grip portion and the support portion are in contact with each other and each have a plurality of convex portions and concave portions for positioning the grip portion with respect to the support portion.
The convex portion has a spherical shape,
The said recessed part has an inclined surface inclined with respect to the direction orthogonal to the moving direction of the said holding part, The electronic component test | inspection apparatus characterized by the above-mentioned. An inspection unit that inspects electronic components;
A shuttle for transporting the electronic component;
And a hand for transporting the electronic component from the shuttle to the inspection unit, and for transporting the electronic component from the inspection unit to the shuttle,
The hand is
A gripping unit that grips the electronic component;
And a support portion movably supporting the grip portion,
The grip portion and the support portion are in contact with each other and each have a plurality of convex portions and concave portions for positioning the grip portion with respect to the support portion.
The convex portion has a spherical shape,
The said recessed part makes cone shape, The electronic component test | inspection apparatus characterized by the above-mentioned.

Images