JP2019062009A - 配線基板装置 - Google Patents
配線基板装置 Download PDFInfo
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- JP2019062009A JP2019062009A JP2017183549A JP2017183549A JP2019062009A JP 2019062009 A JP2019062009 A JP 2019062009A JP 2017183549 A JP2017183549 A JP 2017183549A JP 2017183549 A JP2017183549 A JP 2017183549A JP 2019062009 A JP2019062009 A JP 2019062009A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
上記した配線基板装置25によれば、はんだ17よりも融点が高いニッケルの端子16を採用するため、図3(b)の工程ではんだ17をリフローしても端子16は溶融しない。これにより、そのリフローの際に半導体素子20を押圧しても端子16が潰れなくなるため、端子16によって第1の配線基板1と半導体素子20との間隔が維持され、第1の配線基板1に半導体素子20が接触するのを防ぐことができる。
まず、本実施形態で使用する端子について説明する。
本実施形態では、くびれ部30cに溜められるはんだ31の量を第1実施形態よりも多くする。
本実施形態では、くびれ部30cの形状を第1実施形態とは異なる形状にする。
第1〜第3実施形態では、端子30を介して配線基板1に接続される部品として半導体素子20を用いたが、本実施形態ではその部品として配線基板を用いる。
Claims (7)
- 配線基板と、
前記配線基板の上に立設され、下端と上端との間にくびれ部が設けられた複数の端子と、
前記端子よりも融点が低く、かつ前記端子の表面を覆うはんだと、
を有する配線基板装置。 - 前記くびれ部は、断面視で幅が最も狭い幅狭部を有し、
前記下端から前記幅狭部に向かって前記端子の断面形状がテーパ状に細くなり、かつ前記幅狭部から前記上端に向かって前記端子の断面形状がテーパ状に広くなることを特徴とする請求項1に記載の配線基板装置。 - 前記配線基板は、
前記はんだを介して前記端子に接続された配線と、
前記端子の周囲の前記配線の上に形成されたソルダレジスト層とを備え、
前記幅狭部は、前記ソルダレジスト層の上面よりも高い位置にあることを特徴とする請求項2に記載の配線基板装置。 - 前記端子の側面に、前記下端から前記上端に延びる複数の溝が形成されたことを特徴とする請求項1乃至請求項3のいずれかに記載の配線基板装置。
- 前記端子は、
前記上端を含む上側板と、
前記下端を含む下側板と、
前記上側板と前記下側板とを接続する柱状部とを備え、
前記柱状部の幅が一定の幅を有することを特徴とする請求項1に記載の配線基板装置。 - 前記はんだを介して前記端子に接続された部品を更に有することを特徴とする請求項1乃至請求項5のいずれかに記載の配線基板装置。
- 前記部品は、半導体素子、又は前記配線基板とは別の配線基板であることを特徴とする請求項6に記載の配線基板装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017183549A JP7002263B2 (ja) | 2017-09-25 | 2017-09-25 | 配線基板装置 |
US16/137,017 US20190096792A1 (en) | 2017-09-25 | 2018-09-20 | Wiring substrate device |
US17/123,668 US11749590B2 (en) | 2017-09-25 | 2020-12-16 | Wiring substrate device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017183549A JP7002263B2 (ja) | 2017-09-25 | 2017-09-25 | 配線基板装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019062009A true JP2019062009A (ja) | 2019-04-18 |
JP2019062009A5 JP2019062009A5 (ja) | 2020-07-16 |
JP7002263B2 JP7002263B2 (ja) | 2022-01-20 |
Family
ID=65808294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017183549A Active JP7002263B2 (ja) | 2017-09-25 | 2017-09-25 | 配線基板装置 |
Country Status (2)
Country | Link |
---|---|
US (2) | US20190096792A1 (ja) |
JP (1) | JP7002263B2 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05152381A (ja) * | 1991-05-09 | 1993-06-18 | Hitachi Ltd | 電子部品搭載モジユール |
JP2010225598A (ja) * | 2009-03-19 | 2010-10-07 | Renesas Electronics Corp | 半導体部品及び半導体装置の製造方法 |
JP2010278139A (ja) * | 2009-05-27 | 2010-12-09 | Panasonic Corp | 半導体装置及びその製造方法 |
JP2011082482A (ja) * | 2009-09-11 | 2011-04-21 | Fujitsu Ltd | 電子装置、電子装置の製造方法及び電子機器 |
US20110303443A1 (en) * | 2010-06-10 | 2011-12-15 | Fujitsu Limited | Mount structure, electronic apparatus, stress relieving unit, and method of manufacturing stress relieving unit |
JP2014192177A (ja) * | 2013-03-26 | 2014-10-06 | Ngk Spark Plug Co Ltd | 配線基板 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR920022482A (ko) | 1991-05-09 | 1992-12-19 | 가나이 쯔도무 | 전자부품 탑재모듈 |
JP3344295B2 (ja) | 1997-09-25 | 2002-11-11 | イビデン株式会社 | 半田部材及びプリント配線板 |
DE69838586T2 (de) | 1997-06-04 | 2008-07-24 | Ibiden Co., Ltd., Ogaki | Lötelement für gedruckte leiterplatten |
JP2010267743A (ja) | 2009-05-13 | 2010-11-25 | Mitsubishi Electric Corp | 半導体装置と配線基板の接続構造 |
KR101912278B1 (ko) * | 2015-12-21 | 2018-10-29 | 삼성전기 주식회사 | 전자 부품 패키지 및 그 제조방법 |
-
2017
- 2017-09-25 JP JP2017183549A patent/JP7002263B2/ja active Active
-
2018
- 2018-09-20 US US16/137,017 patent/US20190096792A1/en not_active Abandoned
-
2020
- 2020-12-16 US US17/123,668 patent/US11749590B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05152381A (ja) * | 1991-05-09 | 1993-06-18 | Hitachi Ltd | 電子部品搭載モジユール |
JP2010225598A (ja) * | 2009-03-19 | 2010-10-07 | Renesas Electronics Corp | 半導体部品及び半導体装置の製造方法 |
JP2010278139A (ja) * | 2009-05-27 | 2010-12-09 | Panasonic Corp | 半導体装置及びその製造方法 |
JP2011082482A (ja) * | 2009-09-11 | 2011-04-21 | Fujitsu Ltd | 電子装置、電子装置の製造方法及び電子機器 |
US20110303443A1 (en) * | 2010-06-10 | 2011-12-15 | Fujitsu Limited | Mount structure, electronic apparatus, stress relieving unit, and method of manufacturing stress relieving unit |
JP2014192177A (ja) * | 2013-03-26 | 2014-10-06 | Ngk Spark Plug Co Ltd | 配線基板 |
Also Published As
Publication number | Publication date |
---|---|
US20190096792A1 (en) | 2019-03-28 |
US11749590B2 (en) | 2023-09-05 |
JP7002263B2 (ja) | 2022-01-20 |
US20210104454A1 (en) | 2021-04-08 |
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