JP2019055450A - Processing device - Google Patents

Processing device Download PDF

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Publication number
JP2019055450A
JP2019055450A JP2017181135A JP2017181135A JP2019055450A JP 2019055450 A JP2019055450 A JP 2019055450A JP 2017181135 A JP2017181135 A JP 2017181135A JP 2017181135 A JP2017181135 A JP 2017181135A JP 2019055450 A JP2019055450 A JP 2019055450A
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Prior art keywords
motor
holding
cooling
motor bracket
wafer
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JP6994334B2 (en
Inventor
二郎 現王園
Jiro Genoen
二郎 現王園
乃力 劉
Dairyoku Ryu
乃力 劉
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2017181135A priority Critical patent/JP6994334B2/en
Priority to KR1020180101177A priority patent/KR102541671B1/en
Priority to CN201811079560.5A priority patent/CN109531428B/en
Priority to TW107132872A priority patent/TWI767058B/en
Publication of JP2019055450A publication Critical patent/JP2019055450A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

To replace and add a cooling mechanism without adjusting belt tension and shorten a work time.SOLUTION: A processing device includes holding means 2 for holding a wafer W. The holding means 2 has a holding table 20 for holding the wafer W, a rotary shaft 21 for rotating the holding table 20, a motor 24 for rotating the rotary shaft 21, transmission means 25 for transmitting rotating force of the motor 24 to the rotary shaft 21, and a cooling jacket 27 for cooling a motor bracket 26. The cooling jacket 27 has a cooling water passage which is brought into contact with the motor bracket 26 and passes cooling water therein, thereby enabling easy detachment of the cooling jacket 27 with respect to the motor bracket 26 without removing the motor bracket 26 together with the motor 24 from a device base 10, for instance. Therefore, adjustment of belt tension becomes unnecessary and a work time can be shortened.SELECTED DRAWING: Figure 2

Description

本発明は、保持テーブルに保持されたウェーハを研削加工する加工装置に関する。   The present invention relates to a processing apparatus for grinding a wafer held on a holding table.

ウェーハを研削する研削装置は、ウェーハを保持する保持テーブルと、保持テーブルを回転させるモータと、モータを取り付けるためのモータブラケットと、保持テーブルに保持されたウェーハを研削する研削砥石を環状に配設した研削ホイールとを少なくとも備えており、モータによって保持テーブルを回転させながら、保持テーブルが保持したウェーハを研削砥石で研削している（例えば、下記の特許文献１を参照）。   A grinding apparatus for grinding a wafer is provided with a holding table for holding a wafer, a motor for rotating the holding table, a motor bracket for mounting the motor, and a grinding wheel for grinding the wafer held on the holding table in an annular shape. The wafer held by the holding table is ground with a grinding wheel while the holding table is rotated by a motor (see, for example, Patent Document 1 below).

保持テーブルを回転させるモータは、回転動作するときに発熱するため、モータの熱が保持テーブルに伝達され保持テーブルの傾きを変化させたり、保持面の形状を変化させたりして、ウェーハの面内が均一な厚みに研削できないという問題がある。そのため、モータブラケットの内部に水路を設けて水を通水させ、モータの熱を遮断する冷却機構を備えるものがある。   Since the motor that rotates the holding table generates heat when it rotates, the heat of the motor is transmitted to the holding table, changing the tilt of the holding table or changing the shape of the holding surface. However, there is a problem that it cannot be ground to a uniform thickness. For this reason, there are some which are provided with a cooling mechanism for providing water passages inside the motor bracket to allow water to flow and shut off the heat of the motor.

特開２０１０−８９２３４号公報JP 2010-89234 A

しかし、水路に通水させる水の水質によって水路が塞がってしまうことがあり、この場合は、モータブラケットを交換する必要がある。例えば、保持テーブルをベルト伝達機構によって回転させている場合には、モータブラケットを交換するときにベルトが一度緩められベルトテンションを調整する必要があるため、作業時間がかかる。また、上記特許文献１に示した研削装置では、水路を有しないモータブラケットでモータを取り付けているため、後に冷却機構が必要になることがある。この場合においても、モータブラケットを交換するときにベルトテンションの調整が必要となり、作業時間がかかるという問題がある。   However, the water channel may be blocked by the quality of the water passing through the water channel, and in this case, the motor bracket needs to be replaced. For example, when the holding table is rotated by the belt transmission mechanism, it takes time to replace the motor bracket, because the belt is once loosened and the belt tension needs to be adjusted. In the grinding device shown in the above-mentioned patent document 1, since the motor is attached with a motor bracket having no water channel, a cooling mechanism may be necessary later. Even in this case, it is necessary to adjust the belt tension when exchanging the motor bracket, and there is a problem that it takes work time.

本発明は、上記の事情に鑑みてなされたもので、モータの回転力を保持テーブルに伝達する伝達機構の調整をすることなく冷却機構の交換及び追加を可能にするとともに、作業時間を短縮できるようにすることを目的とする。   The present invention has been made in view of the above circumstances, and enables the replacement and addition of the cooling mechanism without adjusting the transmission mechanism that transmits the rotational force of the motor to the holding table, and can shorten the work time. The purpose is to do so.

本発明は、ウェーハを保持する保持手段と、該ウェーハを加工する加工手段と、を備えた加工装置であって、該保持手段は、ウェーハを保持する保持テーブルと、該保持テーブルの中心を軸に回転させる回転軸と、該回転軸を回転自在に支持し装置基台に支持される保持ベースと、該保持ベースまたは装置基台に板状のモータブラケットを介して配設され該回転軸の回転動力源のモータと、該モータの回転力を該回転軸に伝達する伝達手段と、該モータブラケットを冷却する冷却ジャケットとを備え、 該冷却ジャケットは、該モータブラケットに接触させ内部に冷却水を通水させる冷却水路を備えた。   The present invention is a processing apparatus comprising a holding means for holding a wafer and a processing means for processing the wafer, the holding means having a holding table for holding the wafer and a center of the holding table. A rotating shaft that is rotated in a rotating manner, a holding base that rotatably supports the rotating shaft and that is supported by the device base, and a plate-like motor bracket that is disposed on the holding base or the device base. A motor serving as a rotational power source; transmission means for transmitting the rotational force of the motor to the rotating shaft; and a cooling jacket for cooling the motor bracket. The cooling jacket is brought into contact with the motor bracket and has cooling water therein. A cooling channel for allowing water to pass through was provided.

本発明に係る加工装置は、ウェーハを保持する保持手段を備え、保持手段は、ウェーハを保持する保持テーブルと、保持テーブルの中心を軸に回転させる回転軸と、回転軸を回転自在に支持し装置基台に支持される保持ベースと、保持ベースまたは装置基台に板状のモータブラケットを介して配設され回転軸の回転動力源のモータと、モータの回転力を回転軸に伝達する伝達手段と、モータブラケットを冷却する冷却ジャケットとを備え、 冷却ジャケットは、モータブラケットに接触させ内部に冷却水を通水させる冷却水路を備えたため、モータとともにモータブラケットを保持ベースまたは装置基台から取り外すことなく、モータブラケットに対する冷却ジャケットの着脱を容易に行える。したがって、伝達手段が例えばベルト伝達機構からなる場合には、ベルトテンションの調整することなく、冷却ジャケットの交換及び追加が可能となり、作業時間を短縮し得る。また、伝達手段が例えばギア伝達機構からなる場合においても、ギアのかみ合いを調整する必要がなくなり、上記同様に、作業時間を短縮し得る。   A processing apparatus according to the present invention includes a holding unit that holds a wafer. The holding unit supports a holding table that holds the wafer, a rotating shaft that rotates about the center of the holding table, and a rotating shaft that rotatably supports the rotating shaft. A holding base supported by the device base, a motor serving as a rotational power source for the rotating shaft disposed on the holding base or the device base via a plate-like motor bracket, and transmission for transmitting the rotational force of the motor to the rotating shaft Means and a cooling jacket for cooling the motor bracket, and the cooling jacket is provided with a cooling water passage that contacts the motor bracket and allows cooling water to flow inside, so that the motor bracket is removed from the holding base or the equipment base together with the motor. The cooling jacket can be easily attached to and detached from the motor bracket. Therefore, when the transmission means is composed of, for example, a belt transmission mechanism, it is possible to replace and add the cooling jacket without adjusting the belt tension, thereby shortening the working time. Further, even when the transmission means is composed of, for example, a gear transmission mechanism, it is not necessary to adjust the gear meshing, and the working time can be shortened as described above.

加工装置の構成を示す斜視図である。It is a perspective view which shows the structure of a processing apparatus. 保持手段の構成を示す断面図である。It is sectional drawing which shows the structure of a holding means. モータブラケットに冷却ジャケットが装着される前の状態を示す保持手段の斜視図である。It is a perspective view of the holding means showing a state before the cooling jacket is mounted on the motor bracket. 冷却ジャケットの構成を示す平面図である。It is a top view which shows the structure of a cooling jacket. モータブラケットに冷却ジャケットが装着された状態を示す保持手段の斜視図である。It is a perspective view of the holding means showing a state where a cooling jacket is mounted on the motor bracket.

図１に示す加工装置１は、被加工物であるウェーハＷを研削加工する加工装置の一例である。加工装置１は、Ｙ軸方向に延在する装置基台１０を有している。加工装置１は、ウェーハＷを保持する保持手段２と、保持手段２に保持されたウェーハＷを研削する加工手段３と、加工手段３を保持手段２に対して接近及び離反する研削送り方向（Ｚ軸方向）に昇降させる昇降手段４とを備えている。   A processing apparatus 1 shown in FIG. 1 is an example of a processing apparatus for grinding a wafer W that is a workpiece. The processing apparatus 1 has an apparatus base 10 that extends in the Y-axis direction. The processing apparatus 1 includes a holding unit 2 that holds the wafer W, a processing unit 3 that grinds the wafer W held by the holding unit 2, and a grinding feed direction in which the processing unit 3 approaches and separates from the holding unit 2 ( Elevating means 4 for elevating in the Z-axis direction) is provided.

装置基台１０のＹ軸方向後部側には、コラム１１が立設されている。加工手段３は、コラム１１の前方において昇降手段４によって昇降可能に支持されている。加工手段３は、Ｚ軸方向の軸心を有するスピンドル３０と、スピンドル３０の外周を囲繞するスピンドルハウジング３１と、スピンドル３０の一端に取り付けられたモータ３２と、スピンドルハウジング３１を保持するホルダ３３と、マウント３４を介してスピンドル３０の下端に装着された研削ホイール３５と、研削ホイール３５の下部に環状に固着された複数の研削砥石３６とを備えている。モータ３２がスピンドル３０を回転させることにより、研削ホイール３５を所定の回転速度で回転させることができる。   A column 11 is erected on the rear side of the apparatus base 10 in the Y-axis direction. The processing means 3 is supported so as to be movable up and down by the lifting means 4 in front of the column 11. The processing means 3 includes a spindle 30 having an axis in the Z-axis direction, a spindle housing 31 that surrounds the outer periphery of the spindle 30, a motor 32 attached to one end of the spindle 30, and a holder 33 that holds the spindle housing 31. , A grinding wheel 35 attached to the lower end of the spindle 30 via the mount 34, and a plurality of grinding wheels 36 fixed to the lower part of the grinding wheel 35 in an annular shape. When the motor 32 rotates the spindle 30, the grinding wheel 35 can be rotated at a predetermined rotational speed.

昇降手段４は、Ｚ軸方向に延在するボールネジ４０と、ボールネジ４０の一端に接続されたモータ４１と、ボールネジ４０と平行に延在する一対のガイドレール４２と、内部に備えたナットがボールネジ４０に螺合するとともに側部がガイドレール４２に摺接する昇降板４３とを備えている。昇降板４３には、ホルダ３３が固定されている。そして、モータ４１がボールネジ４０を回動させることにより、一対のガイドレール４２に沿って昇降板４３とともに加工手段３をＺ軸方向に昇降させることができる。   The elevating means 4 includes a ball screw 40 extending in the Z-axis direction, a motor 41 connected to one end of the ball screw 40, a pair of guide rails 42 extending in parallel to the ball screw 40, and a nut provided inside the ball screw 40. And an elevating plate 43 which is screwed to 40 and whose side is in sliding contact with the guide rail 42. A holder 33 is fixed to the lifting plate 43. When the motor 41 rotates the ball screw 40, the processing means 3 can be lifted and lowered in the Z-axis direction along with the lift plate 43 along the pair of guide rails 42.

保持手段２は、ウェーハＷを保持する保持テーブル２０と、保持テーブル２０の中心を軸に回転させる回転軸２１と、回転軸２１を回転自在に支持し装置基台１０に支持される図２に示す保持ベース２２と、保持ベース２２または装置基台１０にモータブラケット２６を介して配設され回転軸２１の回転動力源のモータ２４と、モータ２４の回転力を回転軸２１に伝達する伝達手段２５と、モータブラケット２６を冷却する冷却ジャケット２７とを備えている。   The holding means 2 includes a holding table 20 that holds the wafer W, a rotating shaft 21 that rotates around the center of the holding table 20, and a rotating shaft 21 that is rotatably supported by the apparatus base 10 in FIG. 2. The holding base 22 shown, the holding base 22 or the apparatus base 10 via the motor bracket 26, the motor 24 as the rotational power source of the rotary shaft 21, and the transmission means for transmitting the rotational force of the motor 24 to the rotary shaft 21. 25 and a cooling jacket 27 for cooling the motor bracket 26.

保持テーブル２０の上面は、ウェーハＷを吸引保持する保持面２０ａとなっている。保持テーブル２０には、図示しない吸引源が接続されており、吸引源の吸引力を保持面２０ａに作用させることができる。保持テーブル２０の周囲は、カバー１２によって覆われている。図２に示すように、保持テーブル２０は、保持ベース２２に着脱自在に取り付けられる構成となっている。保持ベース２２は、装置基台１０に立設された支柱２３によって水平に支持されている。   The upper surface of the holding table 20 is a holding surface 20a that holds the wafer W by suction. A suction source (not shown) is connected to the holding table 20, and the suction force of the suction source can be applied to the holding surface 20a. The periphery of the holding table 20 is covered with a cover 12. As shown in FIG. 2, the holding table 20 is configured to be detachably attached to the holding base 22. The holding base 22 is horizontally supported by a column 23 erected on the apparatus base 10.

モータ２４の先端には、シャフト２４０が接続されている。本実施形態に示す装置基台１０の内部には、モータブラケット２６が固定される固定面１０１を有する取り付け穴１００が形成されている。固定面１０１には、シャフト２４０を貫通させるシャフト貫通孔１０２と、シャフト貫通孔１０２の周囲に第１のネジ６を螺合させる第１の雌ネジ１０３と、第２のネジ７を螺合させる第２の雌ネジ１０４とが形成されている。   A shaft 240 is connected to the tip of the motor 24. A mounting hole 100 having a fixing surface 101 to which the motor bracket 26 is fixed is formed inside the apparatus base 10 shown in the present embodiment. The fixing surface 101 is screwed with a shaft through hole 102 that penetrates the shaft 240, a first female screw 103 that screws the first screw 6 around the shaft through hole 102, and a second screw 7. A second female screw 104 is formed.

図３に示すように、伝達手段２５は、回転軸２１に接続された従動プーリ２５０と、モータブラケット２６を介してモータ２４に接続された駆動プーリ２５１と、従動プーリ２５０と駆動プーリ２５１とに巻かれたベルト２５２とにより構成されている。モータ２４のシャフト２４０の上端には駆動プーリ２５１が接続されている。モータ２４が駆動プーリ２５１を駆動させると、ベルト２５２が従動プーリ２５０を従動させて回転力を回転軸２１に伝達し、回転軸２１とともに保持テーブル２０を回転させることができる。回転軸２１に回転力を伝達する伝達手段２５としては、本実施形態に示したベルト伝達機構の構成に限定されるものではなく、ギア伝達機構によって伝達手段２５を構成してもよい。   As shown in FIG. 3, the transmission means 25 includes a driven pulley 250 connected to the rotating shaft 21, a driving pulley 251 connected to the motor 24 via the motor bracket 26, and the driven pulley 250 and the driving pulley 251. The belt 252 is wound around. A driving pulley 251 is connected to the upper end of the shaft 240 of the motor 24. When the motor 24 drives the drive pulley 251, the belt 252 drives the driven pulley 250 to transmit the rotational force to the rotating shaft 21, and the holding table 20 can be rotated together with the rotating shaft 21. The transmission means 25 that transmits the rotational force to the rotary shaft 21 is not limited to the configuration of the belt transmission mechanism shown in the present embodiment, and the transmission means 25 may be configured by a gear transmission mechanism.

モータブラケット２６は、例えば矩形板状に形成され、モータ２４のシャフト２４０を貫通させる貫通孔２６０と、貫通孔２６０の周囲に形成された複数（例えば２つ）の第１の挿入孔２６１と複数（例えば２つ）の第２の挿入孔２６２とを備えている。第１の挿入孔２６１は、図２に示した第１の雌ネジ１０３の位置に対応している。また、第２の挿入孔２６２は、第２の雌ネジ１０４の位置に対応している。   The motor bracket 26 is formed in, for example, a rectangular plate shape, and includes a through hole 260 through which the shaft 240 of the motor 24 passes, and a plurality of (for example, two) first insertion holes 261 and a plurality of holes formed around the through hole 260. (For example, two) second insertion holes 262 are provided. The first insertion hole 261 corresponds to the position of the first female screw 103 shown in FIG. The second insertion hole 262 corresponds to the position of the second female screw 104.

ここで、装置基台１０の内部にモータブラケット２６を介してモータ２４を取り付ける場合は、モータブラケット２６の貫通孔２６０及びシャフト貫通孔１０２にシャフト２４０を貫通させて装置基台１０の上面から突出させるとともに、モータブラケット２６を固定面１０１に当接させる。この状態で、第１のネジ６を第１の挿入孔２６１から挿入し第１の雌ネジ１０３に螺合させることにより、モータブラケット２６を固定面１０１に固定する。モータ２４を固定面１０１から取り外す場合には、上記取り付け動作の逆の動作を行えばよい。   Here, when the motor 24 is attached to the inside of the apparatus base 10 via the motor bracket 26, the shaft 240 is passed through the through hole 260 and the shaft through hole 102 of the motor bracket 26 and protrudes from the upper surface of the apparatus base 10. In addition, the motor bracket 26 is brought into contact with the fixed surface 101. In this state, the motor bracket 26 is fixed to the fixed surface 101 by inserting the first screw 6 through the first insertion hole 261 and screwing the first screw 6 into the first female screw 103. When the motor 24 is removed from the fixed surface 101, an operation reverse to the above-described attachment operation may be performed.

冷却ジャケット２７は、例えばＵ字形状に形成されており、その内側に開口２７０を有している。冷却ジャケット２７の端部２７ａ，２７ｂには、第２のネジ７を挿入させる挿入孔２７１がそれぞれ形成されている。挿入孔２７１の位置は、モータブラケット２６の第２の挿入孔２６２の位置に対応している。本実施形態に示す冷却ジャケット２７は、Ｕ字形状からなるため、モータ２４が冷却ジャケット２７の側面に接触するのを防ぐことができる。なお、冷却ジャケット２７は、モータ２４を囲繞できる形状であればよく、特にＵ字形状に限定されず、例えばコの字形状でもよい。   The cooling jacket 27 is formed, for example, in a U shape, and has an opening 270 inside thereof. Insertion holes 271 for inserting the second screw 7 are formed in the end portions 27a and 27b of the cooling jacket 27, respectively. The position of the insertion hole 271 corresponds to the position of the second insertion hole 262 of the motor bracket 26. Since the cooling jacket 27 shown in the present embodiment has a U-shape, the motor 24 can be prevented from coming into contact with the side surface of the cooling jacket 27. The cooling jacket 27 may be any shape that can surround the motor 24 and is not particularly limited to a U shape, and may be, for example, a U shape.

図４に示すように、冷却ジャケット２７の内部には、冷却水８を通水させる冷却水路２７２が形成されている。冷却ジャケット２７の端部２７ａ側の冷却水路２７２には、冷却水循環装置５から所定温度に調節された冷却水８を冷却水路２７２に供給する供給管２８が接続されている。また、冷却ジャケット２７の端部２７ｂ側の冷却水路２７２には、冷却水路２７２から冷却水８を排水する排水管２９が接続されている。冷却水循環装置５から供給管２８を通じて冷却水路２７２内に冷却水８を流入させると、冷却水８が冷却水路２７２に沿って流れていき、排水管２９から排水される。排水された冷却水８が冷却水循環装置５に流れ込むと、再度所定温度に調節されてから供給管２８に向けて送出される。
かかる冷却ジャケット２７は、常に冷却水８が冷却水路２７２内を循環するように構成されている。 As shown in FIG. 4, a cooling water passage 272 for passing the cooling water 8 is formed inside the cooling jacket 27. A supply pipe 28 that supplies the cooling water 8 adjusted to a predetermined temperature from the cooling water circulation device 5 to the cooling water path 272 is connected to the cooling water path 272 on the end 27 a side of the cooling jacket 27. Further, a drain pipe 29 that drains the cooling water 8 from the cooling water path 272 is connected to the cooling water path 272 on the end 27 b side of the cooling jacket 27. When the cooling water 8 is caused to flow into the cooling water passage 272 from the cooling water circulation device 5 through the supply pipe 28, the cooling water 8 flows along the cooling water passage 272 and is drained from the drain pipe 29. When the drained cooling water 8 flows into the cooling water circulation device 5, it is adjusted again to a predetermined temperature and then sent toward the supply pipe 28.
The cooling jacket 27 is configured such that the cooling water 8 always circulates in the cooling water channel 272.

モータブラケット２６に冷却ジャケット２７を取り付ける場合は、図５に示すように、冷却ジャケット２７の挿入孔２７１とモータブラケット２６の第２の挿入孔２６２とを一致させ、モータブラケット２６の下面に冷却ジャケット２７を接触させる。続いて、第２のネジ７を挿入孔２７１と第２の挿入孔２６２とに挿入し、図２に示した装置基台１０の第２の雌ネジ１０４に螺合させて締結することにより、冷却ジャケット２７をモータブラケット２６に固定する。これにより、モータ２４を開口２７０に位置づけてモータ２４の側面を冷却ジャケット２７で囲繞した状態となる。冷却ジャケット２７をモータブラケット２６から取り外す場合は、第２のネジ７を挿入孔２７１及び第２の挿入孔２６２から取り外すだけで、冷却ジャケット２７を容易にモータブラケット２６から取り外すことができる。また、冷却ジャケット２７では、Ｕ字形状の内側面が円柱状のモータ２４の外側面に接触することにより、モータブラケット２６を冷却するとともにモータ２４を冷却することができる。   When the cooling jacket 27 is attached to the motor bracket 26, as shown in FIG. 5, the insertion hole 271 of the cooling jacket 27 and the second insertion hole 262 of the motor bracket 26 are made to coincide, and the cooling jacket 27 is attached to the lower surface of the motor bracket 26. 27 is brought into contact. Subsequently, the second screw 7 is inserted into the insertion hole 271 and the second insertion hole 262, and is screwed into the second female screw 104 of the device base 10 shown in FIG. The cooling jacket 27 is fixed to the motor bracket 26. As a result, the motor 24 is positioned in the opening 270 and the side surface of the motor 24 is surrounded by the cooling jacket 27. When removing the cooling jacket 27 from the motor bracket 26, the cooling jacket 27 can be easily detached from the motor bracket 26 simply by removing the second screw 7 from the insertion hole 271 and the second insertion hole 262. In the cooling jacket 27, the U-shaped inner surface contacts the outer surface of the cylindrical motor 24, whereby the motor bracket 26 can be cooled and the motor 24 can be cooled.

次に、図１に示した加工装置１の動作例について説明する。ウェーハＷは、円形板状の被加工物の一例であって、材質等が特に限定されない。ウェーハＷを研削加工する際には、図示しない吸引源の作用を受けた保持面２０ａでウェーハＷを吸引保持し、保持テーブル２０を加工手段３の下方に移動させる。続いて、モータ２４を駆動させて回転力を伝達手段２５によって回転軸２１に伝達し、保持テーブル２０を所定の方向に回転させる。加工手段３は、スピンドル３０を回転させることにより、研削ホイール３５を所定の方向に回転させながら、昇降手段４によって、加工手段３を保持テーブル２０の保持面２０ａに接近する方向に下降させ、回転しながら下降する研削砥石３６でウェーハＷを押圧しながら所定の厚みに至るまで研削加工する。   Next, an operation example of the processing apparatus 1 shown in FIG. 1 will be described. The wafer W is an example of a circular plate-like workpiece, and the material or the like is not particularly limited. When grinding the wafer W, the wafer W is sucked and held by the holding surface 20a that has received the action of a suction source (not shown), and the holding table 20 is moved below the processing means 3. Subsequently, the motor 24 is driven and the rotational force is transmitted to the rotary shaft 21 by the transmission means 25 to rotate the holding table 20 in a predetermined direction. The processing means 3 rotates the spindle 30 to lower the processing means 3 in the direction approaching the holding surface 20a of the holding table 20 by the elevating means 4 while rotating the grinding wheel 35 in a predetermined direction. While grinding the grinding wheel 36 while descending, the wafer W is pressed until it reaches a predetermined thickness.

ウェーハＷの研削中は、保持テーブル２０を回転させ続けるため、モータ２４が発熱する。そのため、図４に示すように、冷却水循環装置５が常に冷却ジャケット２７の冷却水路２７２に冷却水８を通水させることにより、モータ２４を冷却する。すなわち、冷却水路２７２内を循環する冷却水８の冷却作用によってモータ２４の周囲を常に冷却することにより、モータ２４の熱を除熱し、保持テーブル２０に熱影響を及ぼさないようにする。なお、冷却水８としては、例えば純水などが用いられる。   During grinding of the wafer W, the motor 24 generates heat to keep the holding table 20 rotating. Therefore, as shown in FIG. 4, the cooling water circulation device 5 always causes the cooling water 8 to flow through the cooling water passage 272 of the cooling jacket 27, thereby cooling the motor 24. That is, by constantly cooling the periphery of the motor 24 by the cooling action of the cooling water 8 circulating in the cooling water passage 272, the heat of the motor 24 is removed so that the holding table 20 is not affected. For example, pure water is used as the cooling water 8.

このように、本発明に係る加工装置１は、ウェーハＷを保持する保持手段２と、ウェーハＷを加工する加工手段３とを備え、保持手段２は、ウェーハＷを保持する保持テーブル２０と、保持テーブル２０の中心を軸に回転させる回転軸２１と、回転軸２１を回転自在に支持し装置基台１０に支持される保持ベース２２と、保持ベース２２または装置基台１０に板状のモータブラケット２６を介して配設され回転軸２１の回転動力源のモータ２４と、モータ２４の回転力を回転軸２１に伝達する伝達手段２５と、モータブラケット２６を冷却する冷却ジャケット２７とを備え、冷却ジャケット２７は、モータブラケット２６に接触させ内部に冷却水８を通水させる冷却水路２７２を備えたため、モータ２４とともにモータブラケット２６を例えば装置基台１０から取り外すことなく、モータブラケット２６に対する冷却ジャケット２７の着脱を容易に行うことができる。これにより、ベルト２５２のベルトテンションの調整をすることなく、冷却ジャケット２７の交換及び追加が可能となり、作業時間を短縮することができる。また、伝達手段２５がギア伝達機構からなる場合においても、ギアのかみ合いを調整する必要がなく、作業時間を短縮することができる。   As described above, the processing apparatus 1 according to the present invention includes the holding unit 2 that holds the wafer W and the processing unit 3 that processes the wafer W, and the holding unit 2 includes the holding table 20 that holds the wafer W, A rotating shaft 21 that rotates around the center of the holding table 20, a holding base 22 that rotatably supports the rotating shaft 21 and supported by the apparatus base 10, and a plate-like motor on the holding base 22 or the apparatus base 10 A motor 24 as a rotational power source of the rotary shaft 21 disposed via the bracket 26, a transmission means 25 for transmitting the rotational force of the motor 24 to the rotary shaft 21, and a cooling jacket 27 for cooling the motor bracket 26; Since the cooling jacket 27 includes a cooling water passage 272 that contacts the motor bracket 26 and allows the cooling water 8 to flow inside, the motor bracket 26 and the motor bracket 26 are illustrated. Without removing from the apparatus base 10, the attachment and detachment of the cooling jacket 27 for the motor bracket 26 can be easily performed. As a result, it is possible to replace and add the cooling jacket 27 without adjusting the belt tension of the belt 252, thereby shortening the working time. Further, even when the transmission means 25 is composed of a gear transmission mechanism, it is not necessary to adjust the meshing of the gear, and the working time can be shortened.

上記実施形態に示した加工装置１は、研削装置として説明したが、この構成に限定されず、保持テーブル２０の回転駆動源となるモータ２４を備え、発熱したモータ２４を冷却ジャケット２７で冷却する必要がある加工装置であればよい。したがって、例えば、研磨装置等にも本発明を適用することができる。   Although the processing apparatus 1 shown in the above embodiment has been described as a grinding apparatus, the present invention is not limited to this configuration. Any processing apparatus may be used. Therefore, for example, the present invention can be applied to a polishing apparatus or the like.

１：加工装置 １０：装置基台 １００：取り付け穴 １０１：固定面
１０２：シャフト貫通孔 １０３：第１の雌ネジ １０４：第２の雌ネジ
１１：コラム １２：カバー
２：保持手段 ２０：保持テーブル ２０ａ：保持面 ２１：回転軸 ２２：保持ベース
２３：支柱 ２４：モータ
２５：伝達手段 ２５０：従動プーリ ２５１：駆動プーリ
２５２：ベルト ２６：モータブラケット ２６０：貫通孔 ２６１：第１の挿入孔
２６２：第２の挿入孔
２７：冷却ジャケット ２７０：開口 ２７１：挿入孔 ２７２：冷却水路
２８：供給管 ２９：排水管
３：加工手段 ３０：スピンドル ３１：スピンドルハウジング ３２：モータ
３３：ホルダ ３４：マウント ３５：研削ホイール ３６：研削砥石
４：昇降手段 ４０：ボールネジ ４１：モータ ４２：ガイドレール ４３：昇降板
５：冷却水循環装置 ６：第１のネジ ７：第２のネジ ８：冷却水 1: Processing device 10: Device base 100: Mounting hole 101: Fixed surface 102: Shaft through hole 103: First female screw 104: Second female screw 11: Column 12: Cover 2: Holding means 20: Holding table 20a: holding surface 21: rotating shaft 22: holding base 23: support 24: motor 25: transmission means 250: driven pulley 251: driving pulley 252: belt 26: motor bracket 260: through hole 261: first insertion hole 262: Second insertion hole 27: Cooling jacket 270: Opening 271: Insertion hole 272: Cooling water channel 28: Supply pipe 29: Drain pipe 3: Processing means 30: Spindle 31: Spindle housing 32: Motor 33: Holder 34: Mount 35: Grinding wheel 36: Grinding wheel 4: Lifting means 40: Ball screw 41: Motor 42: Guide rail 3: the lifting plate 5: cooling water circulation apparatus 6: first screw 7: second screw 8: cooling water

Claims (1)

ウェーハを保持する保持手段と、該ウェーハを加工する加工手段と、を備えた加工装置であって、
該保持手段は、ウェーハを保持する保持テーブルと、
該保持テーブルの中心を軸に回転させる回転軸と、
該回転軸を回転自在に支持し装置基台に支持される保持ベースと、
該保持ベースまたは装置基台に板状のモータブラケットを介して配設され該回転軸の回転動力源のモータと、
該モータの回転力を該回転軸に伝達する伝達手段と、
該モータブラケットを冷却する冷却ジャケットとを備え、
該冷却ジャケットは、該モータブラケットに接触させ内部に冷却水を通水させる冷却水路を備えた加工装置。 A processing apparatus comprising a holding means for holding a wafer and a processing means for processing the wafer,
The holding means includes a holding table for holding a wafer;
A rotating shaft that rotates about the center of the holding table;
A holding base that rotatably supports the rotating shaft and is supported by an apparatus base;
A motor of a rotational power source of the rotary shaft disposed on the holding base or the apparatus base via a plate-like motor bracket;
Transmitting means for transmitting the rotational force of the motor to the rotating shaft;
A cooling jacket for cooling the motor bracket,
The cooling jacket includes a cooling water passage that is in contact with the motor bracket and allows cooling water to flow inside.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111734799A (en) * 2020-07-20 2020-10-02 上海陛通半导体能源科技股份有限公司 Rotary device capable of removing radial force, heater rotary system and semiconductor equipment

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023145215A (en) * 2022-03-28 2023-10-11 株式会社東京精密 Wafer processing device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05285781A (en) * 1992-04-10 1993-11-02 Sony Corp Air spindle unit
JP2003025198A (en) * 2001-07-10 2003-01-29 Sharp Corp Chamfering device and chamfered board
JP2008006535A (en) * 2006-06-29 2008-01-17 Nidec Sankyo Corp Industrial robot
JP2016112635A (en) * 2014-12-12 2016-06-23 Ｔｏｗａ株式会社 Cutting device and cutting method
JP2017042875A (en) * 2015-08-27 2017-03-02 株式会社ディスコ Grinding device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657455A (en) * 1984-11-16 1987-04-14 Cemtronics Concrete machine tools
JP3449505B2 (en) * 1995-02-23 2003-09-22 株式会社ディスコ Setup method in polishing machine
DE102005044832A1 (en) * 2005-09-20 2007-03-22 Siemens Ag Electric machine
TW200827086A (en) * 2006-12-28 2008-07-01 Hiwin Tech Corp Cooling device of linear module
JP5318517B2 (en) 2008-10-10 2013-10-16 株式会社ディスコ Chuck table mechanism
JP5335448B2 (en) * 2009-01-19 2013-11-06 株式会社ディスコ Processing equipment
CN101820197A (en) * 2009-02-27 2010-09-01 鸿富锦精密工业（深圳）有限公司 Motor mounting seat
JP2011051027A (en) * 2009-08-31 2011-03-17 Nagase Integrex Co Ltd Connecting flange
TWM389601U (en) * 2010-04-01 2010-10-01 Prec Machinery Res & Dev Ct Motor fixing plate with heat dissipating features
CN101924415A (en) * 2010-08-27 2010-12-22 湘潭市长航电机有限公司 Water-cooled motor
CN202114607U (en) * 2011-06-08 2012-01-18 云南蓝晶科技股份有限公司 Glazing machine for crystal plate
JP2013123309A (en) * 2011-12-09 2013-06-20 Fanuc Ltd Electric motor cooling plate improving heat radiation performance
CN203574480U (en) * 2013-10-10 2014-04-30 苏州上金数控科技有限公司 Spindle motor cooling seat
CN204992883U (en) * 2015-09-02 2016-01-20 东莞市启航精密数控设备有限公司 Liquid cooling type motor cabinet

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05285781A (en) * 1992-04-10 1993-11-02 Sony Corp Air spindle unit
JP2003025198A (en) * 2001-07-10 2003-01-29 Sharp Corp Chamfering device and chamfered board
JP2008006535A (en) * 2006-06-29 2008-01-17 Nidec Sankyo Corp Industrial robot
JP2016112635A (en) * 2014-12-12 2016-06-23 Ｔｏｗａ株式会社 Cutting device and cutting method
JP2017042875A (en) * 2015-08-27 2017-03-02 株式会社ディスコ Grinding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111734799A (en) * 2020-07-20 2020-10-02 上海陛通半导体能源科技股份有限公司 Rotary device capable of removing radial force, heater rotary system and semiconductor equipment

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