CN109531428B - Processing device - Google Patents

Processing device Download PDF

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Publication number
CN109531428B
CN109531428B CN201811079560.5A CN201811079560A CN109531428B CN 109531428 B CN109531428 B CN 109531428B CN 201811079560 A CN201811079560 A CN 201811079560A CN 109531428 B CN109531428 B CN 109531428B
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China
Prior art keywords
holding
motor
motor bracket
cooling water
cooling jacket
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Application number
CN201811079560.5A
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Chinese (zh)
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CN109531428A (en
Inventor
现王园二郎
刘乃力
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Disco Corp
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Disco Corp
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Publication of CN109531428A publication Critical patent/CN109531428A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

Provided is a processing device, which can replace or add a cooling mechanism without adjusting the belt tension and can shorten the operation time. A processing device (1) is provided with a holding unit (2) for holding a wafer (W), and the holding unit is provided with: a holding table (20) for holding a wafer; a rotating shaft (21) which rotates the holding table; a motor (24) that rotates the rotating shaft; a transmission unit (25) that transmits the rotational force of the motor to the rotating shaft; and a cooling jacket (27) which cools the motor bracket (26), wherein the cooling jacket is in contact with the motor bracket and has a cooling water channel (272) for circulating cooling water (8) therein, so that the cooling jacket can be easily attached to and detached from the motor bracket without removing the motor bracket together with the motor from, for example, the device base (10). This eliminates the need to adjust the belt tension, and shortens the working time.

Description

Processing device
Technical Field
The present invention relates to a processing apparatus for grinding a wafer held by a holding table.
Background
A grinding device for grinding a wafer at least comprises: a holding table for holding a wafer; a motor that rotates the holding table; a motor bracket for mounting a motor; and a grinding wheel in which a grinding wheel for grinding the wafer held by the holding table is annularly arranged, and the grinding device grinds the wafer held by the holding table by the grinding wheel while rotating the holding table by a motor (for example, refer to patent document 1 below).
The motor that rotates the holding table generates heat during the rotation operation, and therefore has the following problems: the heat of the motor is transferred to the holding table to change the inclination of the holding table or the shape of the holding surface, and thus the surface of the wafer cannot be ground to a uniform thickness. Therefore, there is a grinding apparatus including a cooling mechanism that provides a water path inside the motor bracket and blocks heat of the motor by introducing water.
Patent document 1: japanese patent laid-open publication No. 2010-89234
However, the water passage may be clogged due to the quality of the water flowing into the water passage, and in this case, the motor bracket needs to be replaced. For example, when the holding table is rotated by the belt transfer mechanism, the belt needs to be temporarily slackened and the belt tension needs to be adjusted when the motor bracket is replaced, which takes a long time for the work. In the grinding apparatus described in patent document 1, since the motor is mounted by the motor bracket having no water passage, a cooling mechanism may be required thereafter. In this case, there is also a problem that: when the motor bracket is replaced, the belt tension needs to be adjusted, which takes a long time.
Disclosure of Invention
The present invention has been made in view of the above circumstances, and an object thereof is to provide a machining device capable of replacing or adding a cooling mechanism without adjusting a transmission mechanism for transmitting a rotational force of a motor to a holding table, and capable of shortening a working time.
The present invention is a processing apparatus, including: a holding unit for holding a wafer; and a processing unit that processes the wafer, wherein the holding unit has: a holding table for holding a wafer; a rotating shaft that rotates around the center of the holding table; a holding base supported by the apparatus base and rotatably supporting the rotary shaft; a motor as a rotation power source of the rotation shaft, which is disposed on the holding base or the device base via a plate-shaped motor bracket; a transmission unit that transmits a rotational force of the motor to the rotating shaft; and a cooling jacket that cools the motor bracket, the cooling jacket being in contact with the motor bracket and having a cooling water passage in which cooling water flows.
The processing apparatus of the present invention includes a holding unit for holding a wafer, the holding unit including: a holding table for holding a wafer; a rotating shaft that rotates around the center of the holding table; a holding base supported by the device base and rotatably supporting the rotary shaft; a motor as a rotation power source of a rotation shaft, which is disposed on the holding base or the device base via a plate-shaped motor bracket; a transmission unit that transmits a rotational force of the motor to the rotating shaft; and a cooling jacket that cools the motor bracket, the cooling jacket being in contact with the motor bracket and having a cooling water channel for circulating cooling water therein, so that the cooling jacket can be easily attached to and detached from the motor bracket without removing the motor bracket together with the motor from the holding base or the device base. Therefore, in the case where the transfer unit is constituted by, for example, a belt transfer mechanism, the cooling jacket can be replaced or added without adjusting the belt tension, and the working time can be shortened. In addition, even when the transmission means is constituted by a gear transmission mechanism, for example, it is not necessary to adjust the meshing of the gears, and the working time can be shortened as described above.
Drawings
Fig. 1 is a perspective view showing the structure of a processing apparatus.
Fig. 2 is a sectional view showing the structure of the holding unit.
Fig. 3 is a perspective view showing the holding unit in a state before the cooling jacket is attached to the motor bracket.
Fig. 4 is a plan view showing the structure of the cooling jacket.
Fig. 5 is a perspective view showing the holding unit in a state after the cooling jacket is attached to the motor bracket.
Description of the reference symbols
1: a processing device; 10: a device base station; 100: mounting holes; 101: a fixed surface; 102: a shaft through hole; 103: a first internal thread; 104: a second internal thread; 11: a column; 12: a cover; 2: a holding unit; 20: a holding table; 20 a: a holding surface; 21: a rotating shaft; 22: a holding base; 23: a pillar; 24: an electric motor; 25: a transfer unit; 250: a driven pulley; 251: a driving pulley; 252: a belt; 26: a motor bracket; 260: a through hole; 261: a first insertion hole; 262: a second insertion hole; 27: a cooling jacket; 270: an opening; 271: an insertion hole; 272: a cooling water path; 28: providing a tube; 29: a drain pipe; 3: a processing unit; 30: a main shaft; 31: a spindle housing; 32: an electric motor; 33: supporting; 34: a mounting seat; 35: grinding the grinding wheel; 36: grinding the grinding tool; 4: a lifting unit; 40: a ball screw; 41: an electric motor; 42: a guide rail; 43: a lifting plate; 5: a cooling water circulating device; 6: a first screw; 7: a second screw; 8: and (5) cooling the water.
Detailed Description
A processing apparatus 1 shown in fig. 1 is an example of a processing apparatus that performs grinding processing on a wafer W as a processing target. The processing apparatus 1 includes an apparatus base 10 extending in the Y-axis direction. The processing apparatus 1 includes: a holding unit 2 for holding the wafer W; a processing unit 3 for grinding the wafer W held by the holding unit 2; and an elevating unit 4 that elevates the machining unit 3 in a grinding feed direction (Z-axis direction) that approaches and separates from the holding unit 2.
A column 11 is provided upright on the rear side in the Y axis direction of the apparatus base 10. The machining unit 3 is supported by the lifting unit 4 in front of the column 11 so as to be able to be lifted. The processing unit 3 includes: a main shaft 30 having an axis in the Z-axis direction; a spindle housing 31 surrounding an outer circumference of the spindle 30; a motor 32 attached to one end of the main shaft 30; a lug 33 that holds the spindle case 31; a grinding wheel 35 attached to the lower end of the spindle 30 via an attachment seat 34; and a plurality of grinding stones 36 bonded in a ring shape to a lower portion of the grinding wheel 35. The motor 32 rotates the spindle 30, thereby rotating the grinding wheel 35 at a predetermined rotational speed.
The lifting unit 4 has: a ball screw 40 extending in the Z-axis direction; a motor 41 connected to one end of the ball screw 40; a pair of guide rails 42 extending in parallel with the ball screw 40; and an elevating plate 43 having a nut therein screwed to the ball screw 40, and a side portion of the elevating plate 43 being in sliding contact with the guide rail 42. The bracket 33 is fixed to the elevating plate 43. The ball screw 40 is rotated by the motor 41, and the machining unit 3 can be moved up and down in the Z-axis direction along the pair of guide rails 42 together with the lifting plate 43.
The holding unit 2 has: a holding table 20 for holding the wafer W; a rotating shaft 21 that rotates about the center of the holding table 20; a holding base 22 shown in fig. 2, which is supported by the apparatus base 10 and rotatably supports the rotary shaft 21; a motor 24 as a rotation power source of the rotation shaft 21, which is disposed on the holding base 22 or the device base 10 via a motor bracket 26; a transmission unit 25 that transmits the rotational force of the motor 24 to the rotary shaft 21; and a cooling jacket 27 that cools the motor bracket 26.
The upper surface of the holding table 20 serves as a holding surface 20a for sucking and holding the wafer W. A suction source, not shown, is connected to the holding table 20, so that a suction force of the suction source can be applied to the holding surface 20 a. The periphery of the holding table 20 is covered with the cover 12. As shown in fig. 2, the holding table 20 is detachably attached to the holding base 22. The holding base 22 is supported horizontally by a support column 23 provided upright on the apparatus base 10.
A shaft 240 is connected to a tip end of the motor 24. The device base 10 shown in the present embodiment has a mounting hole 100 formed therein, and the device base 10 has a fixing surface 101 to which the motor bracket 26 is fixed. The fixing surface 101 is formed with: a shaft through hole 102 through which the shaft 240 passes; a first female screw 103 into which the first screw 6 is screwed around the shaft through hole 102; and a second internal thread 104 into which the second screw 7 is screwed.
As shown in fig. 3, the transfer unit 25 includes: a driven pulley 250 connected to the rotary shaft 21; a drive pulley 251 connected to the motor 24 via a motor bracket 26; and a belt 252 wound around the driven pulley 250 and the driving pulley 251. The driving pulley 251 is connected to the upper end of the shaft 240 of the motor 24. When the motor 24 drives the driving pulley 251, the belt 252 drives the driven pulley 250 to transmit the rotational force to the rotary shaft 21, thereby rotating the holding table 20 together with the rotary shaft 21. The transmission means 25 for transmitting the rotational force to the rotary shaft 21 is not limited to the belt transmission mechanism shown in the present embodiment, and the transmission means 25 may be configured by a gear transmission mechanism.
The motor bracket 26 is formed in a rectangular plate shape, for example, and includes: a through hole 260 through which the shaft 240 of the motor 24 passes; and a plurality of (e.g., two) first insertion holes 261 and a plurality of (e.g., two) second insertion holes 262 formed around the through-hole 260. The first insertion hole 261 corresponds to the position of the first internal thread 103 shown in fig. 2. In addition, the second insertion hole 262 corresponds to the position of the second internal thread 104.
Here, when the motor 24 is mounted inside the device base 10 via the motor bracket 26, the shaft 240 is inserted through the through hole 260 of the motor bracket 26 and the shaft through hole 102 to protrude from the upper surface of the device base 10, and the motor bracket 26 is brought into contact with the fixing surface 101. In this state, the first screw 6 is inserted through the first insertion hole 261 and screwed into the first female screw 103, thereby fixing the motor bracket 26 to the fixing surface 101. When the motor 24 is removed from the fixing surface 101, the operation opposite to the above-described mounting operation may be performed.
The cooling jacket 27 is formed in a U shape, for example, and has an opening 270 on the inner side thereof. Insertion holes 271 into which the second screws 7 are inserted are formed in the end portions 27a, 27b of the cooling jacket 27, respectively. The position of the insertion hole 271 corresponds to the position of the second insertion hole 262 of the motor bracket 26. Since the cooling jacket 27 shown in the present embodiment is formed in a U shape, the motor 24 can be prevented from contacting the side surface of the cooling jacket 27. The cooling jacket 27 is not particularly limited to a U shape as long as it can surround the motor 24, and may be, for example, "コ".
As shown in fig. 4, a cooling water passage 272 through which the cooling water 8 flows is formed inside the cooling jacket 27. A supply pipe 28 is connected to the cooling water passage 272 on the end 27a side of the cooling jacket 27, and the supply pipe 28 supplies the cooling water 8 adjusted to a predetermined temperature from the cooling water circulation device 5 to the cooling water passage 272. Further, a drain pipe 29 is connected to the cooling water passage 272 on the end 27b side of the cooling jacket 27, and the supply pipe 28 discharges the cooling water 8 from the cooling water passage 272. When the cooling water 8 is caused to flow from the cooling water circulation device 5 into the cooling water passage 272 through the supply pipe 28, the cooling water 8 flows along the cooling water passage 272 and is discharged from the drain pipe 29. When the discharged cooling water 8 flows into the cooling water circulation device 5, it is adjusted to a prescribed temperature again and then sent out toward the supply pipe 28. The cooling jacket 27 is configured to circulate the cooling water 8 through the cooling water passage 272 at all times.
When the cooling jacket 27 is attached to the motor bracket 26, as shown in fig. 5, the insertion hole 271 of the cooling jacket 27 is aligned with the second insertion hole 262 of the motor bracket 26, and the cooling jacket 27 is brought into contact with the lower surface of the motor bracket 26. Next, the second screws 7 are inserted into the insertion holes 271 and the second insertion holes 262, and screwed into the second female screws 104 of the device base 10 shown in fig. 2, thereby fixing the cooling jacket 27 to the motor bracket 26. Thereby, the motor 24 is positioned at the opening 270 in a state where the side surface of the motor 24 is surrounded by the cooling jacket 27. When the cooling jacket 27 is removed from the motor bracket 26, the cooling jacket 27 can be easily removed from the motor bracket 26 only by removing the second screws 7 from the insertion holes 271 and the second insertion holes 262. In the cooling jacket 27, the U-shaped inner surface is in contact with the outer surface of the columnar motor 24, so that the motor bracket 26 can be cooled and the motor 24 can be cooled.
Next, an operation example of the processing apparatus 1 shown in fig. 1 will be described. The wafer W is an example of a circular plate-shaped workpiece, and the material and the like are not particularly limited. When grinding the wafer W, the wafer W is sucked and held by the holding surface 20a which is acted upon by a suction source not shown, and the holding table 20 is moved to below the processing unit 3. Next, the motor 24 is driven to transmit the rotational force to the rotary shaft 21 via the transmission means 25, and the holding table 20 is rotated in a predetermined direction. The machining unit 3 lowers the machining unit 3 in a direction approaching the holding surface 20a of the holding table 20 by the lifting unit 4 while rotating the spindle 30 and rotating the grinding wheel 35 in a predetermined direction, and performs grinding until the wafer W reaches a predetermined thickness while being pressed by the grinding stone 36 which is lowered while rotating.
During grinding of the wafer W, the holding table 20 is continuously rotated, and therefore the motor 24 generates heat. Therefore, as shown in fig. 4, the cooling water circulation device 5 cools the motor 24 by always flowing the cooling water 8 through the cooling water passage 272 of the cooling jacket 27. That is, the periphery of the motor 24 is cooled by the cooling action of the cooling water 8 circulating in the cooling water passage 272 at all times, so that the heat of the motor 24 is removed and the holding table 20 is not thermally influenced. As the cooling water 8, for example, pure water or the like is used.
As described above, the processing apparatus 1 of the present invention includes: a holding unit 2 for holding the wafer W; and a processing unit 3 for processing the wafer W, wherein the holding unit 2 includes: a holding table 20 for holding the wafer W; a rotating shaft 21 that rotates around the center of the holding table 20; a holding base 22 supported by the apparatus base 10 and rotatably supporting the rotary shaft 21; a motor 24 as a rotation power source of the rotation shaft 21, which is disposed on the holding base 22 or the device base 10 via a plate-shaped motor bracket 26; a transmission unit 25 that transmits the rotational force of the motor 24 to the rotary shaft 21; and a cooling jacket 27 for cooling the motor bracket 26, wherein the cooling jacket 27 is in contact with the motor bracket 26 and has a cooling water passage 272 for circulating the cooling water 8 therein, so that the cooling jacket 27 can be easily attached to and detached from the motor bracket 26 without removing the motor bracket 26 together with the motor 24 from, for example, the apparatus base 10. This enables replacement and addition of the cooling jacket 27 without adjusting the belt tension of the belt 252, and thus the working time can be shortened. In addition, even when the transmission unit 25 is configured by a gear transmission mechanism, it is not necessary to adjust the meshing of gears, and the working time can be shortened.
The machining apparatus 1 according to the above embodiment has been described as a grinding apparatus, but is not limited to this configuration, and may be any machining apparatus that includes the motor 24 as a rotation drive source for holding the table 20 and that requires cooling of the motor 24 that generates heat by the cooling jacket 27. Therefore, for example, the present invention can be applied to a polishing apparatus and the like.

Claims (1)

1. A processing apparatus, comprising:
a holding unit for holding a wafer; and
a processing unit for processing the wafer,
wherein, the first and the second end of the pipe are connected with each other,
the holding unit has:
a holding table for holding a wafer;
a rotating shaft that rotates around the center of the holding table;
a holding base supported by the device base and rotatably supporting the rotary shaft;
a motor as a rotation power source of the rotation shaft, which is disposed on the holding base or the device base via a plate-shaped motor bracket;
a transmission unit that transmits a rotational force of the motor to the rotating shaft; and
a cooling jacket for cooling the motor bracket,
the device base station is provided with an internal thread hole,
the motor bracket is provided with a long hole corresponding to the internal thread hole,
the cooling jacket is formed in a U-shape surrounding an outer side surface of the motor and contacting the motor bracket, the cooling jacket having: a cooling water path through which cooling water flows; an inflow port of the cooling water path, which is arranged at one end of the U shape; an outlet of the cooling water path, which is arranged at the other end of the U shape; and two insertion holes formed at the one end side and the other end side, respectively, and through which screws are passed,
a screw penetrating the insertion hole is screwed into a female screw hole of the device base by penetrating the long hole, and the cooling jacket and the motor bracket are screwed together by the screw.
CN201811079560.5A 2017-09-21 2018-09-17 Processing device Active CN109531428B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-181135 2017-09-21
JP2017181135A JP6994334B2 (en) 2017-09-21 2017-09-21 Processing equipment

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CN109531428A CN109531428A (en) 2019-03-29
CN109531428B true CN109531428B (en) 2022-06-24

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JP2023145215A (en) * 2022-03-28 2023-10-11 株式会社東京精密 Wafer processing device

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