CN109531428A - Processing unit (plant) - Google Patents
Processing unit (plant) Download PDFInfo
- Publication number
- CN109531428A CN109531428A CN201811079560.5A CN201811079560A CN109531428A CN 109531428 A CN109531428 A CN 109531428A CN 201811079560 A CN201811079560 A CN 201811079560A CN 109531428 A CN109531428 A CN 109531428A
- Authority
- CN
- China
- Prior art keywords
- motor
- coolant jacket
- motor bracket
- cooling water
- processing unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Processing unit (plant) is provided, does not adjust the replacement and addition for being just able to carry out cooling body with tension, and the activity duration can be shortened.Processing unit (plant) (1) has the holding unit (2) kept to chip (W), and holding unit, which includes, keeps workbench (20), keeps to chip；Rotary shaft (21) makes to keep worktable rotary；Motor (24), rotates rotary shaft；Transfer unit (25), is transferred to rotary shaft for the rotary force of motor；And coolant jacket (27), it cools down motor bracket (26), coolant jacket contacts with motor bracket and in the internal cooling water channel (272) with circulation cooling water (8), thus removed together with motor from such as device base station (10) not by motor bracket and the handling that can easily be done coolant jacket relative to motor bracket.It does not need to carry out the adjustment with tension as a result, the activity duration can be shortened.
Description
Technical field
The present invention relates to processing unit (plant)s, carry out grinding to the chip for keeping workbench to be kept.
Background technique
The grinding attachment being ground to chip at least has: keeping workbench, keeps to chip；Motor,
It makes to keep worktable rotary；Motor bracket is used to install motor；And grinding emery wheel, it is annularly equipped with pair
The grinding grinding tool that the chip for keeping workbench to be kept is ground, which passes through motor on one side makes to keep workbench
Rotation is on one side ground (for example, referring to following patent documents the chip for keeping workbench to be kept using grinding grinding tool
1)。
Make the motor for keeping worktable rotary that can generate heat when carrying out spinning movement, therefore there are following problems: electronic
The heat of machine, which is transferred to, to be kept workbench and the inclination for keeping workbench is made to change or the shape of retaining surface is made to change, from
And lead to not be ground to uniform thickness in the face by chip.Therefore, has the grinding attachment for having cooling body, the cooling
Mechanism is arranged water route and is passed through water in the inside of motor bracket separates the heat of motor.
Patent document 1: Japanese Unexamined Patent Publication 2010-89234 bulletin
But sometimes due to be passed through the water quality of the water in water route and make water line block, in this case, motor is needed replacing
Bracket.For example, when replacing motor bracket, needing to make in the case where making to keep worktable rotary by band transmission mechanism
Band temporarily relaxation simultaneously adjusts band tension, therefore spends the activity duration.In addition, in the grinding attachment shown in above patent document 1,
Motor is installed using the motor bracket without water route, therefore needs cooling body sometimes after.In this case,
There are following problems: needing to adjust band tension when replacing motor bracket, spends the activity duration.
Summary of the invention
The present invention has been made in view of the above-described circumstances, and an object thereof is to provide processing unit (plant)s, not to by the rotation of motor
Turn power and be transferred to that the transmission mechanism of workbench is kept to be adjusted the replacement and addition for being just able to carry out cooling body, and it can
Shorten the activity duration.
The present invention is processing unit (plant), includes the holding unit kept to chip；And the chip is processed
Processing unit, wherein the holding unit includes holding workbench, keeps to chip；Rotary shaft, with the holding
The center of workbench is that axis is rotated；Pedestal is kept, device base station is supported in, which is pivotally supported as rotation certainly
Such as；The motor of rotating power source as the rotary shaft is disposed in the holding pedestal by the motor bracket of plate
Or device base station；The rotary force of the motor is transferred to the rotary shaft by transfer unit；And coolant jacket, it is electronic to this
Machine bracket is cooled down, which contacts with the motor bracket and in the internal cooling water channel with circulation cooling water.
Processing unit (plant) of the invention has the holding unit kept to chip, and holding unit includes holding workbench,
It keeps chip；Rotary shaft, to keep the center of workbench to be rotated as axis；Pedestal is kept, is supported in
Device base station, rotary shaft is rotatably supported；The motor of rotating power source as rotary shaft, by the electricity of plate
Motivation bracket and be disposed in and keep pedestal or device base station；The rotary force of motor is transferred to rotary shaft by transfer unit；With
And coolant jacket, motor bracket is cooled down, coolant jacket contacts with motor bracket and has circulation cooling in inside
The cooling water channel of water, therefore just can be easy together with motor from keeping pedestal or device base station to remove not by motor bracket
Ground carries out handling of the coolant jacket relative to motor bracket.Therefore, the case where transfer unit is for example made of band transmission mechanism
Under, it is just able to carry out the replacement and addition of coolant jacket without the adjustment with tension, the activity duration can be shortened.In addition, passing
It passs in the case that unit is for example made of gear transmission mechanism, is adjusted without the engagement to gear, as described above,
The activity duration can be shortened.
Detailed description of the invention
Fig. 1 is the perspective view for showing the structure of processing unit (plant).
Fig. 2 is the cross-sectional view for showing the structure of holding unit.
Fig. 3 is the perspective view for showing the holding unit for the state being installed on coolant jacket before motor bracket.
Fig. 4 is the top view for showing the structure of coolant jacket.
Fig. 5 is the perspective view for showing the holding unit for the state being installed on coolant jacket after motor bracket.
Label declaration
1: processing unit (plant)；10: device base station；100: mounting hole；101: stationary plane；102: axis through hole；In 103: the first
Screw thread；104: the second internal screw threads；11: column；12: cover；2: holding unit；20: keeping workbench；20a: retaining surface；21: rotation
Axis；22: keeping pedestal；23: pillar；24: motor；25: transfer unit；250: driven pulley；251: driving pulley；252:
Band；26: motor bracket；260: through hole；261: the first insertion holes；262: the second insertion holes；27: coolant jacket；270: opening；
271: insertion hole；272: cooling water channel；28: pipe is provided；29: drainpipe；3: processing unit；30: main shaft；31: main shaft housing；
32: motor；33: rest；34: mounting base；35: grinding emery wheel；36: grinding grinding tool；4: lifting unit；40: ball-screw；
41: motor；42: guide rail；43: lifter plate；5: cooling water circulating device；6: the first screws；7: the second screws；8: cooling water.
Specific embodiment
Processing unit (plant) 1 shown in FIG. 1 is one to the processing unit (plant) of the wafer W progress grinding as machined object
Example.Processing unit (plant) 1 has the device base station 10 extended in the Y-axis direction.Processing unit (plant) 1 includes holding unit 2, to wafer W
It is kept；Unit 3 is processed, the wafer W kept to holding unit 2 is ground；And lifting unit 4, make to process
Unit 3 relative to holding unit 2 closer and farther from grinding and feeding direction (Z-direction) on go up and down.
The Y direction rear portion side setting of device base station 10 is provided with column 11.Processing unit 3 is gone up and down in the front of column 11
The bearing of unit 4 is that can go up and down.Processing unit 3 includes main shaft 30, the axle center with Z-direction；Main shaft housing 31, encloses
Around the periphery of main shaft 30；Motor 32 is installed on one end of main shaft 30；Rest 33 keeps main shaft housing 31；Mill
Skiving wheel 35 is installed on the lower end of main shaft 30 by mounting base 34；And multiple grinding grinding tools 36, their cementations annular in shape
In the lower part of grinding emery wheel 35.Motor 32 rotates main shaft 30, thus it enables that rotation speed of the grinding emery wheel 35 according to regulation
Degree rotation.
Lifting unit 4 includes ball-screw 40, extends in the Z-axis direction；Motor 41, with ball-screw 40
One end connection；A pair of guide rails 42, they are extended parallel to ball-screw 40；And lifter plate 43, spiral shell possessed by inside
Mother screws togather with ball-screw 40, and the side of lifter plate 43 and 42 sliding contact of guide rail.Rest 33 is fixed on lifter plate 43.And
And ball-screw 40 is rotated by motor 41, processing unit 3 can be made to exist together along a pair of guide rails 42 with lifter plate 43
It is gone up and down in Z-direction.
Holding unit 2, which includes, keeps workbench 20, keeps to wafer W；Rotary shaft 21, to keep workbench
20 center is that axis is rotated；Holding pedestal 22 shown in Fig. 2, is supported in device base station 10, rotary shaft 21 is supported
To rotate freely；The motor 24 of the rotating power source of rotary shaft 21 is disposed in holding pedestal by motor bracket 26
22 or device base station 10；The rotary force of motor 24 is transferred to rotary shaft 21 by transfer unit 25；And coolant jacket 27,
Motor bracket 26 is cooled down.
The upper surface of workbench 20 is kept to become the retaining surface 20a for carrying out attracting holding to wafer W.With holding workbench 20
It is connected with attraction source (not shown), so as to make the attraction in attraction source act on retaining surface 20a.Kept for the week of workbench 20
Enclose the covering of quilt cover 12.As shown in Fig. 2, workbench 20 is kept to be configured to detachably be installed on holding pedestal 22.Keep pedestal
22 be straightened be set to device base station 10 pillar 23 bearing for level.
Axis 240 is connected in the front end of motor 24.The inside of device base station 10 shown in present embodiment is formed with
Mounting hole 100, the stationary plane 101 that device base station 10 has electric motor bracket 26 fixed.It is formed on stationary plane 101: axis
Through hole 102 is penetrated through for axis 240；First internal screw thread 103 screws togather around axis through hole 102 for the first screw 6；With
And second internal screw thread 104, it is screwed togather for the second screw 7.
As shown in figure 3, transfer unit 25 includes: driven pulley 250 is connect with rotary shaft 21；Driving pulley 251,
It is connect by motor bracket 26 with motor 24；And band 252, wound on driven pulley 250 and driving pulley 251
On.Driving pulley 251 is connected to the upper end of the axis 240 of motor 24.When motor 24 drives driving pulley 251, band 252
Keep driven pulley 250 driven and rotary force is transferred to rotary shaft 21, so as to make to keep workbench 20 and rotary shaft 21 1
Play rotation.As the transfer unit 25 that rotary force is transferred to rotary shaft 21, however it is not limited to band transmitting shown in present embodiment
The structure of mechanism can be made up of transfer unit 25 gear transmission mechanism.
Motor bracket 26 includes through hole 260 for example formed as rectangular plate-like, and the axis 240 of electric motor 24 passes through
It is logical；And multiple (such as two) first are inserted into hole 261 and multiple (such as two) second are inserted into hole 262, they, which are formed in, passes through
Around through-hole 260.First insertion hole 261 is corresponding with the position of the first internal screw thread 103 shown in Fig. 2.In addition, the second insertion hole
262 is corresponding with the position of the second internal screw thread 104.
Here, in the case where motor 24 is installed on the inside of device base station 10 by motor bracket 26, make axis
240 penetrate through the through hole 260 of motor brackets 26 and axis through hole 102 and protrude from the upper surface of device base station 10, and make
Motor bracket 26 is abutted with stationary plane 101.In this state, by the first screw 6 from the first insertion hole 261 insertion and with first
Internal screw thread 103 screws togather, so that motor bracket 26 is fixed on stationary plane 101.What motor 24 was removed from stationary plane 101
In the case of, carry out the movement opposite with above-mentioned installation action.
Coolant jacket 27 has opening 270 for example formed as U-shaped on the inside of it.In end 27a, 27b of coolant jacket 27
It is respectively formed with the insertion hole 271 for the insertion of the second screw 7.It is inserted into the position in hole 271 and the second insertion of motor bracket 26
The position in hole 262 is corresponding.Coolant jacket 27 shown in present embodiment is made of U-shaped, thus can prevent motor 24 with
The side of coolant jacket 27 contacts.As long as being not particularly limited in addition, coolant jacket 27 can surround the shape of motor 24
It for U-shaped, such as can be "U" word shape.
As shown in figure 4, being formed with the cooling water channel 272 of circulation cooling water 8 in the inside of coolant jacket 27.In coolant jacket 27
The connection of cooling water channel 272 of the end side 27a is provided with pipe 28, and the offer pipe 28 is by the adjusted cooling water 8 for defined temperature
Cooling water channel 272 is provided to from cooling water circulating device 5.In addition, the cooling water channel 272 in the end side 27b of coolant jacket 27 connects
It is connected to drainpipe 29, which cooling water 8 is discharged from cooling water channel 272.When make cooling water 8 from cooling water circulating device
5 by provide pipe 28 flow into cooling water channel 272 when, cooling water 8 along cooling water channel 272 flow, from drainpipe 29 be discharged.
When the cooling water 8 being discharged flows into cooling water circulating device 5, it is adjusted to defined temperature again then towards offer pipe 28
It sends out.The coolant jacket 27 is configured to the recirculated cooling water 8 in cooling water channel 272 always.
In the case where coolant jacket 27 is installed on motor bracket 26, as shown in figure 5, making the insertion hole of coolant jacket 27
271 is consistent with the second insertion hole 262 of motor bracket 26, and makes the following table face contact of coolant jacket 27 Yu motor bracket 26.
Then, the second screw 7 is inserted into insertion hole 271 and the second insertion hole 262, with the second of device base station 10 shown in Fig. 2
Screw thread 104 is screwed togather and is tightened, so that coolant jacket 27 is fixed on motor bracket 26.Motor 24 is positioned at opening as a result,
270 and become using coolant jacket 27 around motor 24 side state.Coolant jacket 27 is being removed from motor bracket 26
In the case where, it, just can be easily by coolant jacket only by removing the second screw 7 from insertion hole 271 and the second insertion hole 262
27 remove from motor bracket 26.In addition, the medial surface of U-shaped is outer with columned motor 24 in coolant jacket 27
Side contact, so as to cool down to motor bracket 26, and can cool down motor 24.
Then, the action example of processing unit (plant) 1 shown in FIG. 1 is illustrated.Wafer W is the machined object of circular plate
Material etc. is not particularly limited in an example.When carrying out grinding to wafer W, using by attraction source (not shown)
The retaining surface 20a of effect carries out attracting holding to wafer W, makes the lower section for keeping workbench 20 to be moved to processing unit 3.Then,
So that motor 24 is driven and rotary force is transferred to rotary shaft 21 by transfer unit 25, makes to keep workbench 20 in defined side
Rotation upwards.Processing unit 3 on one side rotates main shaft 30 and rotates grinding emery wheel 35 in specified directions, passes through liter on one side
Drop unit 4 makes to process unit 3 to the direction decline close relative to the retaining surface 20a of workbench 20 is kept, and is rotated using one side
Grinding to chip is carried out while pressing wafer W on one side the grinding grinding tool 36 declined reaches defined thickness.
In the grinding of wafer W, make that workbench 20 is kept persistently to rotate, therefore motor 24 can generate heat.Therefore, such as Fig. 4
It is shown, cooling water circulating device 5 always in the cooling water channel 272 of coolant jacket 27 circulate cooling water 8, thus to motor 24 into
Row cooling.That is, always by the cooling effect of the cooling water 8 recycled in cooling water channel 272 to being carried out around motor 24
It is cooling, so that the heat of motor 24 be removed, heat affecting will not be brought to holding workbench 20.In addition, as cooling water 8, example
Such as use pure water.
In this way, processing unit (plant) 1 of the invention includes the holding unit 2 kept to wafer W；And wafer W is carried out
The processing unit 3 of processing, holding unit 2, which includes, keeps workbench 20, keeps to wafer W；Rotary shaft 21, to protect
The center for holding workbench 20 is that axis is rotated；Pedestal 22 is kept, device base station 10 is supported in, is by the bearing of rotary shaft 21
It rotates freely；The motor 24 of rotating power source as rotary shaft 21 is disposed in by the motor bracket 26 of plate
Keep pedestal 22 or device base station 10；The rotary force of motor 24 is transferred to rotary shaft 21 by transfer unit 25；And it is cooling
Set 27, cools down motor bracket 26, and coolant jacket 27 contacts with motor bracket 26 and has circulation cooling in inside
The cooling water channel 272 of water 8, therefore motor bracket 26 is not removed from such as device base station 10 together with motor 24 and just can
It is easy to carry out handling of the coolant jacket 27 relative to motor bracket 26.Just can as a result, without the adjustment with tension of band 252
The replacement and addition for enough carrying out coolant jacket 27, can shorten the activity duration.In addition, in transfer unit 25 by gear transmission mechanism structure
In the case where, without the engagement of adjustment gear, the activity duration can be shortened.
Processing unit (plant) 1 shown in above embodiment is illustrated as grinding attachment, but is not limited to the structure, as long as
It is with the motor 24 as the rotary driving source for keeping workbench 20 and to need to utilize 27 pairs of the coolant jacket motor to generate heat
24 carry out cooling processing unit (plant).Thus, for example also the present invention can be applied to grinding devices etc..
Claims (1)
1. a kind of processing unit (plant), includes
The holding unit that chip is kept；And
To the processing unit that the chip is processed,
Wherein,
The holding unit includes
Workbench is kept, chip is kept；
Rotary shaft is rotated using the center of the holding workbench as axis；
Pedestal is kept, device base station is supported in, which is rotatably supported；
The motor of rotating power source as the rotary shaft is disposed in the holding pedestal by the motor bracket of plate
Or device base station；
The rotary force of the motor is transferred to the rotary shaft by transfer unit；And
Coolant jacket cools down the motor bracket,
The coolant jacket contacts with the motor bracket and in the internal cooling water channel with circulation cooling water.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017181135A JP6994334B2 (en) | 2017-09-21 | 2017-09-21 | Processing equipment |
| JP2017-181135 | 2017-09-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109531428A true CN109531428A (en) | 2019-03-29 |
| CN109531428B CN109531428B (en) | 2022-06-24 |
Family
ID=65841242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811079560.5A Active CN109531428B (en) | 2017-09-21 | 2018-09-17 | Processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6994334B2 (en) |
| KR (1) | KR102541671B1 (en) |
| CN (1) | CN109531428B (en) |
| TW (1) | TWI767058B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111734799B (en) * | 2020-07-20 | 2020-12-08 | 上海陛通半导体能源科技股份有限公司 | Rotary device capable of removing radial force, heater rotary system and semiconductor equipment |
| JP2023145215A (en) * | 2022-03-28 | 2023-10-11 | 株式会社東京精密 | Wafer processing device |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201914751A (en) | 2019-04-16 |
| TWI767058B (en) | 2022-06-11 |
| CN109531428B (en) | 2022-06-24 |
| JP2019055450A (en) | 2019-04-11 |
| KR102541671B1 (en) | 2023-06-08 |
| KR20190033423A (en) | 2019-03-29 |
| JP6994334B2 (en) | 2022-01-14 |
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