JP2019046950A - 発光装置の製造方法 - Google Patents
発光装置の製造方法 Download PDFInfo
- Publication number
- JP2019046950A JP2019046950A JP2017168077A JP2017168077A JP2019046950A JP 2019046950 A JP2019046950 A JP 2019046950A JP 2017168077 A JP2017168077 A JP 2017168077A JP 2017168077 A JP2017168077 A JP 2017168077A JP 2019046950 A JP2019046950 A JP 2019046950A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- metal layer
- layer
- emitting device
- dielectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 101
- 239000002184 metal Substances 0.000 claims abstract description 101
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000000227 grinding Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000007740 vapor deposition Methods 0.000 abstract description 9
- 238000004544 sputter deposition Methods 0.000 abstract description 7
- 238000005229 chemical vapour deposition Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 135
- 239000000463 material Substances 0.000 description 7
- 238000007639 printing Methods 0.000 description 7
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 229910010413 TiO 2 Inorganic materials 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
2:発光素子
10:基板
11:金属層
12、22:誘電体層
13:電極層
25:反射誘電体層
Claims (7)
- セラミックからなる実装基板上に発光素子が実装された発光装置の製造方法において、
前記実装基板の製造工程は、
セラミックからなる基板上に、金属層を形成する金属層形成工程と、
前記金属層表面を研削して平坦化する研削工程と、
前記金属層上に、誘電体層を形成する誘電体層形成工程と、
前記誘電体層上に、前記発光素子と接続する電極層を形成する電極層形成工程と、
を有することを特徴とする発光装置の製造方法。 - 前記電極層の形成後、前記誘電体層上および前記電極層上であって前記発光素子と接続する領域を除いて、干渉によって前記発光素子からの光を反射するように厚さが設定された反射誘電体層を形成する反射誘電体層形成工程をさらに有する、
ことを特徴とする請求項1に記載の発光装置の製造方法。 - 前記金属層と前記誘電体層の間に、高反射な金属からなる反射金属層を設ける工程をさらに有する、ことを特徴とする請求項1または請求項2に記載の発光装置の製造方法。
- 前記金属層は、高反射な金属からなることを特徴とする請求項1または請求項2に記載の発光装置の製造方法。
- 前記研削工程は、前記金属層表面の算術平均粗さRaが30nm以下となるように研削する工程である、ことを特徴とする請求項1ないし請求項4のいずれか1項に記載の発光装置の製造方法。
- 前記誘電体層は、干渉によって前記発光素子からの光を反射するように厚さが設定されている、ことを特徴とする請求項1ないし請求項5のいずれか1項に記載の発光装置の製造方法。
- 前記基板は、表面の算術平均粗さRaが100nm以上である、ことを特徴とする請求項1ないし請求項6のいずれか1項に記載の発光装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017168077A JP6798455B2 (ja) | 2017-08-31 | 2017-08-31 | 発光装置の製造方法 |
US16/041,551 US10672947B2 (en) | 2017-08-31 | 2018-07-20 | Method for producing light-emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017168077A JP6798455B2 (ja) | 2017-08-31 | 2017-08-31 | 発光装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019046950A true JP2019046950A (ja) | 2019-03-22 |
JP6798455B2 JP6798455B2 (ja) | 2020-12-09 |
Family
ID=65435596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017168077A Active JP6798455B2 (ja) | 2017-08-31 | 2017-08-31 | 発光装置の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10672947B2 (ja) |
JP (1) | JP6798455B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109951947B (zh) * | 2019-03-07 | 2023-10-20 | 珠海市航达科技有限公司 | 一种反射陶瓷电路板及其加工方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006100444A (ja) * | 2004-09-28 | 2006-04-13 | Kyocera Corp | 発光素子搭載基板およびそれを用いた発光装置 |
JP2006245210A (ja) * | 2005-03-02 | 2006-09-14 | Oki Data Corp | 半導体複合装置、led装置、ledヘッド、及び画像形成装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100442551C (zh) | 2003-09-30 | 2008-12-10 | 株式会社东芝 | 发光装置 |
WO2007074720A1 (ja) * | 2005-12-28 | 2007-07-05 | A. L. M. T. Corp. | 半導体素子実装用基板とそれを用いた半導体装置および半導体素子実装用基板の製造方法 |
US8304660B2 (en) * | 2008-02-07 | 2012-11-06 | National Taiwan University | Fully reflective and highly thermoconductive electronic module and method of manufacturing the same |
CN105874619B (zh) * | 2014-01-10 | 2019-08-20 | 夏普株式会社 | 发光装置用基板、发光装置及发光装置用基板的制造方法 |
US10797188B2 (en) * | 2014-05-24 | 2020-10-06 | Hiphoton Co., Ltd | Optical semiconductor structure for emitting light through aperture |
JP6398323B2 (ja) * | 2014-05-25 | 2018-10-03 | 日亜化学工業株式会社 | 半導体発光素子の製造方法 |
CN111525007B (zh) * | 2017-02-17 | 2023-07-25 | 首尔伟傲世有限公司 | 具有侧面反射层的发光二极管 |
-
2017
- 2017-08-31 JP JP2017168077A patent/JP6798455B2/ja active Active
-
2018
- 2018-07-20 US US16/041,551 patent/US10672947B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006100444A (ja) * | 2004-09-28 | 2006-04-13 | Kyocera Corp | 発光素子搭載基板およびそれを用いた発光装置 |
JP2006245210A (ja) * | 2005-03-02 | 2006-09-14 | Oki Data Corp | 半導体複合装置、led装置、ledヘッド、及び画像形成装置 |
Also Published As
Publication number | Publication date |
---|---|
US10672947B2 (en) | 2020-06-02 |
JP6798455B2 (ja) | 2020-12-09 |
US20190067513A1 (en) | 2019-02-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6674978B2 (ja) | 発光ダイオードパッケージ | |
KR102393853B1 (ko) | 광학적으로 강화된 고체-상태 광 컨버터 | |
JP6699634B2 (ja) | 発光装置の製造方法 | |
US9362465B2 (en) | Method of manufacturing light emitting device | |
US9728678B2 (en) | Light emitting element and method of manufacturing the same | |
TWI819258B (zh) | 發光二極體晶片 | |
KR101008086B1 (ko) | 광손실이 적은 발광다이오드용 전극 구조체와 그 형성 방법 | |
JP6371201B2 (ja) | 発光モジュール及びそれを用いた発光装置 | |
JP2011109094A (ja) | 分布ブラッグ反射器を有する発光ダイオードチップ、その製造方法及び分布ブラッグ反射器を有する発光ダイオードパッケージ | |
TW201126211A (en) | Improved high reflectivity mirrors and method for making same | |
US11043615B2 (en) | Light-emitting device having a dielectric multilayer film arranged on the side surface of the light-emitting element | |
JP2005209852A5 (ja) | ||
TWI550909B (zh) | A flip chip type light emitting diode and a method for manufacturing the same, and a flip chip type structure thereof | |
JPWO2010021089A1 (ja) | 照明用光源 | |
TWI627767B (zh) | 具有分佈式布拉格反射鏡的發光二極體以及其製造方法 | |
TW201312797A (zh) | 基板 | |
JP2016058689A (ja) | 半導体発光装置 | |
US20150138643A1 (en) | Optical component | |
JP2009123908A (ja) | 発光装置 | |
JP2014017415A (ja) | Led搭載用基板及びその製造方法 | |
JP2019046950A (ja) | 発光装置の製造方法 | |
JP6642552B2 (ja) | 発光装置 | |
KR20110085961A (ko) | 분포 브래그 반사기를 갖는 발광 다이오드 칩 및 발광 다이오드 패키지 | |
JP2009123909A (ja) | 発光装置、発光装置の製造方法、サブマウントおよびサブマウントの製造方法 | |
JP2019046949A (ja) | 発光素子の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190924 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200923 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20201020 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201102 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6798455 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |