JP2019036620A - インプリント装置、および物品製造方法 - Google Patents

インプリント装置、および物品製造方法 Download PDF

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Publication number
JP2019036620A
JP2019036620A JP2017156641A JP2017156641A JP2019036620A JP 2019036620 A JP2019036620 A JP 2019036620A JP 2017156641 A JP2017156641 A JP 2017156641A JP 2017156641 A JP2017156641 A JP 2017156641A JP 2019036620 A JP2019036620 A JP 2019036620A
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JP
Japan
Prior art keywords
mold
electrodes
substrate
pattern
imprint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2017156641A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019036620A5 (enrdf_load_stackoverflow
Inventor
裕郎 法兼
Hiroo Norikane
裕郎 法兼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2017156641A priority Critical patent/JP2019036620A/ja
Priority to KR1020180091213A priority patent/KR20190018391A/ko
Publication of JP2019036620A publication Critical patent/JP2019036620A/ja
Publication of JP2019036620A5 publication Critical patent/JP2019036620A5/ja
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017156641A 2017-08-14 2017-08-14 インプリント装置、および物品製造方法 Withdrawn JP2019036620A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017156641A JP2019036620A (ja) 2017-08-14 2017-08-14 インプリント装置、および物品製造方法
KR1020180091213A KR20190018391A (ko) 2017-08-14 2018-08-06 임프린트 장치 및 물품 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017156641A JP2019036620A (ja) 2017-08-14 2017-08-14 インプリント装置、および物品製造方法

Publications (2)

Publication Number Publication Date
JP2019036620A true JP2019036620A (ja) 2019-03-07
JP2019036620A5 JP2019036620A5 (enrdf_load_stackoverflow) 2020-08-20

Family

ID=65584815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017156641A Withdrawn JP2019036620A (ja) 2017-08-14 2017-08-14 インプリント装置、および物品製造方法

Country Status (2)

Country Link
JP (1) JP2019036620A (enrdf_load_stackoverflow)
KR (1) KR20190018391A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102244514B1 (ko) * 2019-11-28 2021-04-26 연세대학교 산학협력단 외부 전기장 및 적외선 대역 레이저 투과형 몰드를 이용하는 금속 임프린팅 성형 장치 및 성형 방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015149390A (ja) 2014-02-06 2015-08-20 キヤノン株式会社 インプリント装置、型、および物品の製造方法

Also Published As

Publication number Publication date
KR20190018391A (ko) 2019-02-22

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