JP2019035754A - 計量装置 - Google Patents
計量装置 Download PDFInfo
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- JP2019035754A JP2019035754A JP2018153136A JP2018153136A JP2019035754A JP 2019035754 A JP2019035754 A JP 2019035754A JP 2018153136 A JP2018153136 A JP 2018153136A JP 2018153136 A JP2018153136 A JP 2018153136A JP 2019035754 A JP2019035754 A JP 2019035754A
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- 238000005303 weighing Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract description 15
- 229910000679 solder Inorganic materials 0.000 description 9
- 230000001133 acceleration Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
- B05C5/0229—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet the valve being a gate valve or a sliding valve
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F13/00—Apparatus for measuring by volume and delivering fluids or fluent solid materials, not provided for in the preceding groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
- H02N2/021—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors using intermittent driving, e.g. step motors, piezoleg motors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
- H02N2/028—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors along multiple or arbitrary translation directions, e.g. XYZ stages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
- B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
- H01L2224/2731—Manufacturing methods by local deposition of the material of the layer connector in liquid form
- H01L2224/27318—Manufacturing methods by local deposition of the material of the layer connector in liquid form by dispensing droplets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/756—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/75611—Feeding means
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
- Electrically Driven Valve-Operating Means (AREA)
Abstract
【解決手段】本発明は、ロボットに固定するために設けられたベース要素と、ベース要素に移動可能に支持された計量弁と、計量弁がベース要素に対して可動となるための少なくとも1つのピエゾアクチュエータとを含む媒体を計量する装置に関する。
【選択図】図1
Description
12 ベース要素
14 穴
16 カートリッジ
18 接続要素
20 中間要素
22 ピエゾアクチュエータ
24 ピエゾ素子
26 片持ちアーム
28 接続ロッド
30 弁キャリア
32 板バネ
34 計量弁
36 ピエゾアクチュエータ
38 ピエゾ素子
40 片持ちアーム
41 接続ロッド
42 計量針
44 ライン
45 チューブピース
46 ブラケット
48 スライダー
49 板バネ
50 ピエゾアクチュエータ
52 ピエゾ素子
54 片持ちアーム
56 接続ロッド
58 センサ
60 論理モジュール
100 ロボット
110 基板
Claims (17)
- ロボット(100)に固定するために設けられたベース要素(12)と、前記ベース要素(12)に移動可能に支持される計量弁(34)と、少なくとも1つのピエゾアクチュエータ(22,36)であって、前記少なくとも1つのピエゾアクチュエータ(22,36)によって、前記計量弁(34)が前記ベース要素(12)に対して移動可能となる、少なくとも1つのピエゾアクチュエータ(22,36)と、を備える媒体の計量装置(10)。
- 第1のピエゾアクチュエータ(22)によって、前記計量弁(34)が前記ベース要素(12)に対して第1方向に移動可能となり、かつ第2のピエゾアクチュエータ(36)によって、前記計量弁(34)が前記ベース要素(12)に対して第2方向に移動可能となることを特徴とする、請求項1に記載の計量装置(10)。
- 前記第1および第2方向は、少なくとも互いに略直角であり、および/または前記第1方向が垂直に配向され、および前記第2方向が水平に配向されることを特徴とする、請求項2に記載の計量装置(10)。
- 前記計量弁(34)が、少なくとも1つの第1の可撓性要素(18)、特に少なくとも1つの第1の板バネによって前記ベース要素(12)に接続された中間要素(20)で保持されることを特徴とする、請求項1〜3のいずれか一項に記載の計量装置(10)。
- 2つの第1の可撓性要素(18)が設けられ、平行四辺形のバネ構成を形成することを特徴とする、請求項4に記載の計量装置(10)。
- 第1のピエゾアクチュエータ(22)が前記ベース要素(12)および前記中間要素(20)の間に接続されることを特徴とする、請求項4または請求項5に記載の計量装置(10)。
- 前記計量弁(34)が、少なくとも1つの第2の可撓性要素(32)、特に少なくとも1つの第2の板バネによって前記中間要素(20)に接続されていることを特徴とする、請求項4〜6のいずれか一項に記載の計量装置(10)。
- 第2のピエゾアクチュエータ(36)が前記中間要素(20)および前記計量弁(34)の間に接続されていることを特徴とする、請求項4〜7のいずれか一項に記載の計量装置(10)。
- 前記計量弁(34)がスライダー弁であることを特徴とする、請求項1〜8のいずれか一項に記載の計量装置(10)。
- 前記計量弁(34)のスライダーが第3のピエゾアクチュエータ(50)によって作動可能であることを特徴とする請求項1〜9のいずれか一項に記載の計量装置(10)。
- 前記第3のピエゾアクチュエータ(50)の動作方向が前記計量弁(34)を動かすためのピエゾアクチュエータ(22)の動作方向に一致することを特徴とする請求項10に記載の計量装置(10)。
- 前記少なくとも1つのピエゾアクチュエータ(22,36,50)のたわみを検出するために少なくとも1つのセンサ(58)が設けられることを特徴とする、請求項1〜11のいずれか一項に記載の計量装置(10)。
- 計量されるべき媒体のためのカートリッジ(16)が前記ベース要素(12)内に保持されていることを特徴とする、請求項1〜12のいずれか一項に記載の計量装置(10)。
- 前記カートリッジ(16)が計量されるべき媒体のためのライン(44)によって前記計量弁(34)に流体的に接続され、前記ライン(44)は、可撓性のチューブ(45)によって少なくとも部分的に形成されていることを特徴とする、請求項13に記載の計量装置(10)。
- 前記または各ピエゾアクチュエータ(22,36,50)が、電圧の印加によって変形する、特に反るピエゾ素子(24,38,52)と、前記ピエゾ素子に取り付けられた片持ちアーム(26,40,54)とを備えることを特徴とする、請求項1〜14のいずれか一項に記載の計量装置(10)。
- ロボット(100)と、前記ロボットに固定された、請求項1〜15のいずれか一項に記載の計量装置(10)とを備える計量システム。
- 計量システムによって媒体を計量する方法であって、前記計量システムは、ロボット(100)と、前記ロボット(100)に移動可能に支持される計量弁(34)とを備え、前記計量弁(34)は、前記ロボット(100)によって第1方向に移動し、同時に前記ロボット(100)に対して少なくとも1つの第1のピエゾアクチュエータ(22)によって前記第1方向、および前記第1方向に略垂直の第2方向に移動することによって、前記計量弁(34)の計量針(42)は、前記第1および第2方向によって広がる平面にサイクロイドを描く、方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE102017118836.3A DE102017118836B3 (de) | 2017-08-17 | 2017-08-17 | Dosiervorrichtung |
DE102017118836.3 | 2017-08-17 |
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JP2019035754A true JP2019035754A (ja) | 2019-03-07 |
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US (1) | US10946406B2 (ja) |
JP (1) | JP6577640B2 (ja) |
KR (1) | KR102113141B1 (ja) |
DE (1) | DE102017118836B3 (ja) |
TW (1) | TWI683705B (ja) |
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KR102476423B1 (ko) | 2017-04-21 | 2022-12-13 | 노드슨 코포레이션 | 분배 시스템 |
DE102022115323A1 (de) | 2022-06-20 | 2023-12-21 | Marco Systemanalyse Und Entwicklung Gmbh | Verfahren und vorrichtung zum aufbringen eines mediums |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004523906A (ja) * | 2000-10-12 | 2004-08-05 | ボード・オブ・リージエンツ,ザ・ユニバーシテイ・オブ・テキサス・システム | 室温かつ低圧マイクロおよびナノ転写リソグラフィのためのテンプレート |
JP3835449B2 (ja) * | 2003-10-29 | 2006-10-18 | セイコーエプソン株式会社 | 液滴塗布方法と液滴塗布装置及びデバイス並びに電子機器 |
JP2013197580A (ja) * | 2012-03-21 | 2013-09-30 | Samsung Electro-Mechanics Co Ltd | ナノパターニング装置、これを含むナノパターニングシステム、及びその制御方法 |
US20170021559A1 (en) * | 2015-07-21 | 2017-01-26 | Ford Global Technologies, Llc | Automated treatment process and apparatus |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5740782A (en) * | 1996-05-20 | 1998-04-21 | Lowi, Jr.; Alvin | Positive-displacement-metering, electro-hydraulic fuel injection system |
JPH1114816A (ja) * | 1997-06-19 | 1999-01-22 | Canon Inc | カラーフィルタ製造装置および方法ならびにカラーフィルタ |
US6699434B1 (en) * | 2000-09-08 | 2004-03-02 | Ethicon, Inc. | Metering valve to deliver liquid |
JP4940806B2 (ja) | 2006-07-24 | 2012-05-30 | 株式会社日立プラントテクノロジー | ペースト塗布機及びペースト塗布方法 |
US7923056B2 (en) | 2007-06-01 | 2011-04-12 | Illinois Tool Works Inc. | Method and apparatus for dispensing material on a substrate |
JP2011174907A (ja) | 2010-02-01 | 2011-09-08 | Applied Micro Systems Inc | 液状物吐出装置および方法 |
US9707584B2 (en) | 2014-07-09 | 2017-07-18 | Nordson Corporation | Dual applicator fluid dispensing methods and systems |
DE102015003159A1 (de) | 2015-03-13 | 2016-09-15 | LAMATOR GmbH Landwirtschaftliche Maschinenausrüstungen | Anordnung zur Befestigung eines Spiral-Federzinkens am Rahmenprofil eines Bodenbearbeitungswerkzeuges |
US10022744B2 (en) | 2015-05-22 | 2018-07-17 | Nordson Corporation | Piezoelectric jetting system with quick release jetting valve |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2004523906A (ja) * | 2000-10-12 | 2004-08-05 | ボード・オブ・リージエンツ,ザ・ユニバーシテイ・オブ・テキサス・システム | 室温かつ低圧マイクロおよびナノ転写リソグラフィのためのテンプレート |
JP3835449B2 (ja) * | 2003-10-29 | 2006-10-18 | セイコーエプソン株式会社 | 液滴塗布方法と液滴塗布装置及びデバイス並びに電子機器 |
JP2013197580A (ja) * | 2012-03-21 | 2013-09-30 | Samsung Electro-Mechanics Co Ltd | ナノパターニング装置、これを含むナノパターニングシステム、及びその制御方法 |
US20170021559A1 (en) * | 2015-07-21 | 2017-01-26 | Ford Global Technologies, Llc | Automated treatment process and apparatus |
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US20190054491A1 (en) | 2019-02-21 |
US10946406B2 (en) | 2021-03-16 |
TWI683705B (zh) | 2020-02-01 |
JP6577640B2 (ja) | 2019-09-18 |
KR20190019862A (ko) | 2019-02-27 |
DE102017118836B3 (de) | 2019-01-17 |
KR102113141B1 (ko) | 2020-05-20 |
TW201919767A (zh) | 2019-06-01 |
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