JP2019029608A - Imprint method, imprint apparatus, program, foreign matter removal method and foreign matter removal determination method - Google Patents

Abstract

To provide an imprint method that is advantageous in terms of suppression of a pattern defect.SOLUTION: An imprint method that fills an imprint material on a pattern by contacting a pattern of a mold with an imprint material of a plurality of shot regions on a substrate and forming the pattern of the imprint material on the substrate repeats a series of steps comprising: a contact step that contacts an imprint material of one shot region of the plurality of shot regions with the mold; an imaging step that images the one shot region to acquire an image in a state in which the mold and the imprint material contacts each other; a determination step that determines whether a foreign matter is included in the imprint material on the basis of the image; a removal step that removes the foreign matter when it is determined that the foreign matter is included in the determination step; and an alignment step that aligns a shot region being different from the one shot region with the pattern after the removal step, until it is determined that the foreign matter is not included in the determination step.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an imprint method, an imprint apparatus, a program, a foreign matter removal method, and a foreign matter removal determination method.

  The imprint technique is a technique for forming a nanoscale fine pattern, and is attracting attention as one of nanolithography techniques for mass production of semiconductor devices and magnetic storage media. An imprint apparatus using imprint technology cures the resin in a state where the pattern-formed mold and the resin (imprint material) on the substrate are in contact with each other, and pulls the mold away from the cured imprint material. An imprint material pattern is formed on the substrate.

  When the mold and the imprint material on the substrate are brought into contact with each other, if there is a foreign object between the mold and the substrate, or if a foreign object adheres to the mold, the pattern of the imprint material formed on the substrate Defects can occur. The imprint method described in Patent Document 1 includes a step of removing particles attached to a template using a dummy wafer having a particle removal film formed on the surface thereof.

JP 2009-266841 A

  However, in the imprint method of Patent Document 1, it may not be confirmed whether or not the particles are removed after the step of removing the particles, and the particles may remain attached to the template.

  An object of the present invention is to provide an imprint method that is advantageous in suppressing pattern defects, for example.

  In order to solve the above-described problem, the present invention makes a pattern filled with an imprint material by bringing a pattern formed on a mold into contact with an imprint material supplied to a plurality of shot regions on the substrate. An imprint method for forming an imprint material pattern on a mold, a contact step in which an imprint material in one shot area out of a plurality of shot areas is brought into contact, a mold and an imprint material, An imaging process for capturing an image by capturing a single shot area, and a determination process for determining whether or not a foreign substance is included in the imprint material, based on the acquired image; In the determination step, when it is determined that foreign matter is included, a removal step for removing the foreign matter, and a shot region and a pattern different from one shot region after the removal step An alignment step of aligning a series of steps including repeated until it is determined that the information does not include a foreign substance in the determination step, characterized in that.

  An object of the present invention is to provide an imprint method that is advantageous in suppressing pattern defects, for example.

It is a figure which illustrates the structure of an imprint apparatus. It is a figure which illustrates a normal imprint processing process. It is a figure which illustrates the abnormal imprint process containing a foreign material. It is a flowchart which shows the imprint method which concerns on 1st Embodiment. It is a figure explaining the imprint method which concerns on 1st Embodiment. It is a figure explaining an example of the foreign material processing concerning a 1st embodiment. It is a figure explaining the imprint method which concerns on 3rd Embodiment.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a diagram illustrating a typical apparatus configuration of an imprint apparatus. The imprint apparatus 100 is a lithography apparatus that forms a pattern on an imprint material on a substrate using a mold. The imprint apparatus 100 cures the imprint material in a state where the mold and the imprint material on the substrate are in contact with each other, and performs an imprint process for forming a pattern on the substrate by pulling the mold away from the cured imprint material. Do. Here, as an example, an ultraviolet curable imprint apparatus that cures an uncured imprint material on a substrate by irradiation with ultraviolet rays was used as an imprint apparatus using a photocuring method. However, as a method for curing the imprint material, a method using light irradiation in another wavelength region or a method using other energy (for example, heat) may be used.

  The imprint apparatus 100 includes a mold holding unit 110, a substrate holding unit 120, an off-axis alignment scope 130, an on-axis alignment scope 140, a light source 150, a supply unit 160 (dispenser), an imaging unit 170, and a storage. Part 180 and control part 190. In the following drawings, the X axis and the Y axis are parallel to the optical axis of the ultraviolet light applied to the imprint material on the substrate W and are orthogonal to each other in a plane perpendicular to the Z axis. Is taking.

  The mold holding unit 110 moves while holding the mold M carried in by a mold conveyance device (not shown). For example, the mold holding unit 110 presses the mold M from the outer peripheral direction by driving a mold chuck (not illustrated) that holds the mold M, a driving unit (not illustrated) that moves the mold M by driving the mold chuck. Thus, a mold deformation portion (not shown) that deforms the shape of the mold M is included.

  The holding of the mold M by the mold chuck is performed by, for example, a vacuum suction force or an electrostatic force. The drive unit controls the position of the mold M with respect to the six axes, brings the mold M into contact with the imprint material on the substrate, and peels (releases) the mold M from the cured imprint material. Here, the six axes are rotations around the X axis, Y axis, Z axis and their respective axes in the XYZ coordinate system. The mold holding unit 110 can deform the shape of the mold M using a cylinder (actuator) that operates with a fluid such as air or oil. The substrate W can be deformed (typically expanded or contracted) through a process such as heat treatment. The mold deforming unit corrects the shape of the mold M so that the positions of the substrate W and the mold M are matched in accordance with the deformation of the substrate W.

  The mold M includes, for example, a pattern portion P that has a rectangular outer periphery and has a three-dimensionally formed uneven pattern such as a circuit pattern on the surface facing the substrate W. The material of the mold M is a material that can transmit ultraviolet light, and in this embodiment, quartz is used as an example.

  The substrate holding unit 120 holds and moves the substrate W carried by a substrate transfer device (not shown). The substrate holding unit 120 can include a stage 121, a substrate chuck 122, a substrate deformation unit (not shown), and a reference plate 123. The substrate chuck 122 holds the substrate W by a vacuum suction pad or the like, for example. The stage 121 holds the substrate chuck 122 and is driven by a drive mechanism (not shown) to move the substrate W to six axes on the surface plate 1. The substrate deforming portion deforms the shape of the substrate W by pressing the substrate W from the outer peripheral direction, and matches the shape of the pattern forming region (shot region) formed on the substrate W with the shape of the pattern portion P formed on the mold M. . The reference plate 123 is used for alignment of a substrate W and a substrate holding unit 120 described later.

  The substrate W is a substrate on which the pattern of the imprint material is formed by the mold M, and includes, for example, a single crystal silicon substrate, an SOI (SILICON ON INSULATOR) substrate, or the like. A plurality of shot regions are formed on the substrate W.

  The off-axis alignment scope 130 detects a mark (not shown) provided on the substrate W and a mark provided on the reference plate 123, obtains a position / shape deviation amount between the substrate W and the substrate holding unit 120, and determines the substrate. Position alignment between W and the substrate holding unit 120 is performed.

  The on-axis alignment scope 140 detects a mark (not shown) provided on the mold M and a mark provided on the reference plate 123 to obtain a relative position between the mold M and the substrate holding unit 120, and The alignment between M and the substrate holding unit 120 is performed.

  The light source 150 irradiates the imprint material with light through the mold M to cure the imprint material, and is, for example, a halogen lamp that generates ultraviolet light (for example, i-line or g-line). In this embodiment, the imprint material is an ultraviolet light curable resin.

  The supply unit 160 includes, for example, a tank 161 that stores the imprint material, a discharge port 162 that discharges the imprint material supplied from the tank through the supply path to the substrate, and a valve ( (Not shown) and a supply amount control unit (not shown). The supply unit 160 supplies the imprint material to the shot area provided on the substrate. The supply amount control unit controls the supply amount of the imprint material to the substrate W by controlling the valve.

  The imaging unit 170 includes an imaging light source 171 and an imaging element 172, and acquires an image by imaging a shot region of the substrate W through the mold M or without the mold M. The imaging light source 171 illuminates the substrate W (shot region) with light having a wavelength different from that of ultraviolet light, that is, light having a wavelength different from light having a wavelength for curing the imprint material (for example, visible light). The image sensor 172 includes, for example, a CCD image sensor or a CMOS image sensor, and detects light reflected by the pattern surface of the mold M or the surface of the substrate W. In addition, the image sensor 172 can also detect interference light (interference pattern formed by) between the light reflected by the mold M and the light reflected by the substrate W. The image sensor 172 can detect a region where the imprint material on the substrate and the mold (pattern part) are in contact with each other.

  The storage unit 180 includes, for example, a memory and a hard disk (HDD), and stores an image acquired by the imaging unit 170 and an image in an imprint processing process described later. The storage unit 180 can also store various programs, data, information, and the like used in the imprint apparatus 100.

  The control unit 190 includes, for example, a CPU and a memory, and controls each unit of the imprint apparatus 100 to perform imprint processing. In addition, the control unit 190 determines whether or not a foreign matter is included in the imprint material based on the image acquired by the imaging unit 170. The control unit 190 is configured by, for example, a computer having a storage unit such as a magnetic storage medium connected to each component of the imprint apparatus via a line, a sequencer, or the like (not shown). The method according to the present embodiment can be executed by a computer as a program. The control unit 190 may be provided in the imprint apparatus 100, or may be installed at a location different from the imprint apparatus 100 and controlled remotely.

  FIG. 2 is a diagram illustrating an imprint process according to the first embodiment. Prior to supplying the imprint material R onto the substrate W shown in FIG. Next, the mark provided on the substrate W and the mark provided on the reference plate 123 are detected by the off-axis alignment scope 130, and the position and shape shift amount between the substrate W and the stage 121 are obtained.

  Next, a mark provided on the mold M and a mark provided on the reference plate 123 are detected by the on-axis alignment scope 140, and a position and shape shift amount between the mold M and the stage 121 are obtained. Based on the position and shape deviation amounts thus obtained, the position and shape deviation between the mold M and the substrate W is corrected (that is, the alignment between the mold M and the substrate W (alignment process) is performed). .

  When the position and shape deviation between the mold M and the substrate W are corrected, the imprint material R is supplied to the shot area on the substrate W by the supply unit 160 (FIG. 2A). After the imprint material is supplied to the substrate W under the supply unit 160, the shot area to which the imprint material R is supplied is disposed under the mold M. Next, the mold holding unit 110 that holds the mold M is moved to bring the mold M into contact with the imprint material on the substrate (shot region) (contact process) (FIG. 2B). When resin is filled in the concave portion of the pattern portion P of the mold M, the light source 150 irradiates the imprint material R on the substrate with the light 201 through the mold M to cure the imprint material R (FIG. 2). (C)). Next, the mold holding unit 110 is moved, and the mold M is peeled from the cured imprint material on the substrate (FIG. 2D). As a result, a pattern is formed on the substrate (shot region). The above process is the imprint process.

  Here, the imaging unit 170 performs the imprint process. Specifically, while the mold M and the resin on the substrate are in contact with each other, the imprint material R on the substrate is transferred between the mold M and the substrate W. The process of filling the concave portion of the pattern surface while imaging between the two is taken (imaging process). In this way, the image acquired by the imaging unit 170 is stored in the storage unit 180 as described above.

  However, as shown in FIG. 3, when there is a foreign substance 301 on the substrate W (FIG. 3A), even if the mold M and the substrate W are brought into contact with each other and the pattern portion P is filled with the imprint material R, The foreign matter 301 causes an unfilled space 302 between the mold M and the substrate W (FIG. 3C). Even if the light 201 is irradiated with the light source in this state, the imprint material R is not filled in the vicinity of the foreign material 301 and a defect is generated in the pattern formed (FIG. 3D). Further, the foreign object 301 can move to the mold M.

  Thereby, in the subsequent imprint process, since the foreign matter is attached to the mold M, the defect is recurred at the same coordinates in the shot. In the present embodiment, this is referred to as a repeat defect. With this repeat defect, a normal pattern cannot be formed unless the foreign material of the mold M is removed.

  In the present embodiment, foreign matter is detected from a filled image in a normal imprint process, which is an imprint process for forming a pattern in a shot area on a substrate. When an abnormality such as a defect due to foreign matter is detected, the imprint condition is switched to the setting of foreign matter removal processing which is imprint processing for removing foreign matter, and foreign matter removal processing is started for the mold M. Detection is also performed from the filled image during the foreign matter removal process, and it is determined whether the defect has been eliminated by the foreign matter removal process. When it is determined that there is no defect such as unfilling, the imprint setting is restored and the normal imprint process is resumed.

  FIG. 4 is a flowchart showing the imprint method according to the first embodiment. Each flow is executed mainly by control of each unit by the control unit 190. The present embodiment includes a normal imprint process and a foreign substance removal process.

  In step S400, the substrate W is carried into the substrate chuck 122 by a substrate transfer device (not shown). After carrying in the substrate W, imprint processing is performed in step S411.

  In step S412, as described above, while performing step S411, the imaging unit 170 captures an image of the process in which the imprint material R supplied onto the substrate W is filled in the recesses in the pattern surface of the mold M (imaging). Process). The image acquired by the imaging unit 170 is stored in the storage unit 180 as described above.

  In step S413, it is determined whether or not foreign matter is included in the imprint material R (determination step). For example, first, a reference image obtained by the imaging unit 170 in a state where the mold M and the substrate W are in contact with each other without a foreign object is stored in the storage unit 180. Next, in step S412, the image captured by the imaging unit 170 in parallel with step S411 is compared with the stored reference image, and a defect is detected from the difference. Here, the image acquired by the imaging unit 170 during the imprint process is used as the reference image, but the reference image may be stored in the storage unit 180 in advance. Further, for example, a reference image corresponding to each shot area may be stored in the storage unit 180.

  When it is determined in step S413 that no foreign matter is included (NO), in step S414, the control unit 190 determines whether the imprint process has been completed for all shot regions on the substrate W. . If not completed (NO), Steps S411 to S413 are repeated. If completed (YES), in step S415, the control unit 190 controls the transfer device (not shown) to unload the substrate W.

  If it is determined in step S413 that foreign matter is included (YES), in step S420, for example, the control unit 190 switches the imprint condition of the imprint apparatus 100 to the setting for foreign matter removal processing.

  In step S431, imprint processing is performed under the imprint conditions set in step S420. Thereby, for example, the foreign matter adhering to the mold M is moved to the substrate W side by the imprint material R on the substrate W and removed from the mold M. This step is referred to as a removal step in this embodiment. In step S432, as in step S412, the imaging unit 170 images the process in which the imprint material R supplied onto the substrate W is filled in the recesses on the pattern surface of the mold M while performing the foreign substance removal S431. To do. In step S433, the control unit 190 compares the image captured by the imaging unit with the reference image in step S432, and determines whether or not a foreign matter is included in the imprint material R from the difference.

  If no foreign matter is detected in step S433 (NO), in step S440, the control unit 190 returns the imprint condition to the imprint setting in step S411, and restarts step S411. If a foreign object is detected (YES), in step S434, control unit 190 determines whether the removal process has been repeated a preset number of times. If the repetition has not been completed (NO), the process returns to step S431, the alignment process is performed again, and steps S431 to S433 are repeated. If the repetition has been completed (YES), in step S450, the mold M is replaced with a new mold different from the mold M, and the processes in steps S431 to S433 are performed again. Normally, foreign matter is removed by several removal processes, but in rare cases, for example, even if foreign matter removal is performed for 10 shots or more, the defect may not be resolved. For this reason, if the predetermined maximum number of times (threshold) for repeating a series of foreign matter removal processes including foreign matter detection to foreign matter removal is set in advance, if the defect is not resolved, it is replaced with a new die and unnecessary foreign matter. Repeated removal can be prevented.

  FIG. 5 is a view for explaining the imprint method according to the first embodiment. It is assumed that imprint processing is performed in order from the shot 501 to the left in the drawing, and in this figure, the defect 510 is detected in the shot 502. Then, in the next shot 503, the imprint condition is switched to the setting of the foreign substance removal process, and the imprint process (removal process) is performed. As a result of the removal process, the size of the defect 510 gradually decreased to the shots 504 and 505, and it was confirmed that the defect was eliminated in the shot 506 after the fourth foreign substance removal. For this reason, the imprint condition is returned to the setting of the normal imprint process, and the normal imprint process is resumed from the shot 507.

  According to the present embodiment, since the defect detection is determined after removing the foreign matter, the repeat defect does not occur again when the normal imprint process is resumed.

異物除去処理用のインプリント条件（パラメータ）は、予め設定しておいても良いし、例えば、検出された異物の大きさに応じて設定しても良い。 FIG. 6 is a diagram illustrating an example of the foreign matter removal process according to the first embodiment. Switching of the imprint conditions (FIG. 4, S420) is performed, for example, when the control unit 190 sets the following parameters 1 to 7 of the imprint apparatus 100 to values advantageous for foreign matter removal.

The imprint conditions (parameters) for the foreign matter removal process may be set in advance, or may be set according to the size of the detected foreign matter, for example.

  For example, in FIG. 6, parameters other than 2 in Table 1 are changed to values different from the normal imprint process, and the imprint process (foreign matter removal) is performed. First, the imprint material R is supplied thicker than the normal imprint process, and the cavity pressure, which is a force for deforming the mold, is changed more slowly than the normal imprint process, and the mold and the substrate are moved at a lower speed than the normal imprint process. Contact is made (FIG. 6A). Further, the filling time is extended, and the filling property of the imprint material R into the mold M is improved (FIG. 6B). Subsequently, light is irradiated for a longer time than the normal imprint process, and the shrinkage of the imprint material is increased more than usual (FIG. 6C). Finally, the mold and the substrate are peeled off at a lower speed than the normal imprint process, and the mold release force applied to the mold M is suppressed (FIG. 6D). Under this condition, the release force can be higher than that of the normal imprint process. Therefore, in order to prevent the substrate W from being detached from the substrate holding unit 120 and the mold M from being detached from the mold holding unit 110, the suction pressure (holding force) of the mold holding unit 110 and the substrate holding unit 120 is also normally imprinted. Higher than processing.

  In this way, by performing imprinting under imprint conditions different from the normal imprinting process, the foreign matter attached to the mold M remains in the imprint material on the substrate and is removed from the mold M. In the present embodiment, the case where the above parameters are changed in combination has been described as an example. However, the present embodiment is not limited to the above combination, and only a single parameter may be changed.

また、インプリント材を物性値の異なるものに変更しても良い。 In the present embodiment, the same substrate W as that used in the normal imprint process is used to remove the foreign matter adhering to the mold M. For example, a foreign substance using a dummy substrate that is a different substrate from that used in the normal imprint process A removal process may be performed. In this case, for example, the following imprint conditions can be changed.

Further, the imprint material may be changed to one having different physical property values.

(Second Embodiment)
FIG. 7 is a diagram for explaining an imprint method according to the second embodiment. Steps and configurations similar to those of the first embodiment are denoted by the same reference numerals, and description thereof is omitted. In the present embodiment, for example, an operation when a defect is detected on the outline of a shot will be described.

  In the imprint process of the shot 701, for example, a case is considered where the foreign matter 702 adhering to the shot outline protrudes into an adjacent shot and is detected as a defect. In this case, the normal imprint process or the foreign substance removal process may be resumed from the shot 704 without performing the imprint process on the adjacent shot 703.

  As a result, it is possible to reduce the risk that the foreign matter 702 that protrudes from the adjacent shot 703 adheres to the mold M when imprint processing is performed on the adjacent shot 703 and causes a new defect.

(Third embodiment)
In the present embodiment, an imprint method for storing position coordinates of defects detected by a normal imprint process will be described. As a condition for switching from the normal imprint process to the imprint condition for the foreign substance removal process, for example, the position coordinates of the defect when the defect is detected in the normal imprint process are stored in the storage unit 180 together with the setting of the foreign substance removal process. To do. When a defect is detected at the same position coordinate in the subsequent shot imprint processing, the setting may be switched to the setting of the foreign matter removal processing in which the imprint conditions are stored.

  This makes it possible to remove foreign substances specialized for repeat defects caused by mold defects, such as defects caused by foreign substances attached to the mold, and is unnecessary for defects not caused by foreign substances such as air traps and defects that do not repeat. It is possible to avoid performing the foreign matter removal process.

(Product manufacturing method)
A method for manufacturing a device (semiconductor integrated circuit element, liquid crystal display element, etc.) as an article includes a step of forming a pattern on a substrate (wafer, glass plate, film-like substrate) by an imprint apparatus using the method described above. . Furthermore, the manufacturing method may include a step of etching the substrate on which the pattern is formed. When manufacturing other articles such as patterned media (recording media) and optical elements, the manufacturing method may include other processes for processing a substrate on which a pattern is formed instead of etching. The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

DESCRIPTION OF SYMBOLS 100 Imprint apparatus 110 Type | mold holding part M type | mold 120 Board | substrate holding part W board | substrate 150 Light source 170 Imaging part 180 Storage part 190 Control part

Claims (13)

A pattern formed on a mold and an imprint material supplied to a plurality of shot areas on the substrate are brought into contact with each other to fill the imprint material in the pattern, and the pattern of the imprint material is formed on the substrate. An imprint method for forming,
A contact step of bringing the mold into contact with the imprint material of one shot region among the plurality of shot regions;
In a state where the mold and the imprint material are in contact with each other, an imaging step of acquiring an image by imaging the one shot region;
Based on the acquired image, a determination step of determining whether or not foreign matter is included in the imprint material,
In the determination step, when it is determined that the foreign matter is included, a removal step of removing the foreign matter,
After the removing step, a series of steps including an alignment step of aligning the shot region different from the one shot region and the pattern,
Repeat until it is determined in the determination step that the foreign matter is not included,
An imprint method characterized by the above.   The imprint method according to claim 1, wherein the removing step is performed using the same substrate as the substrate on which the determination step has been performed.   The imprint method according to claim 1, wherein the removing step is performed using a substrate different from the substrate on which the determination step is performed.   4. The method according to claim 1, wherein in the removing step, the holding force of the mold holding unit that holds the die or the holding force of the substrate holding unit that holds the substrate is changed from the contact step. 5. 2. The imprint method according to item 1.   5. The imprint method according to claim 1, wherein in the removing step, a force that deforms the mold or a force that deforms the substrate is changed from the contact step. 6.   The imprint method according to claim 1, wherein when the number of repetitions of the series of steps exceeds a predetermined threshold, the mold is replaced with another mold.   The pattern is not formed in the adjacent shot area when it is determined in the determining step that the foreign substance is included in a shot area adjacent to the one shot area. 7. The imprint method according to any one of 6 above.   The imprint method according to claim 1, wherein in the determination step, position coordinates where the foreign matter exists are stored. A pattern formed on a mold and an imprint material supplied to a plurality of shot areas on the substrate are brought into contact with each other to fill the imprint material in the pattern, and the pattern of the imprint material is formed on the substrate. An imprint method for forming,
A contact step of bringing the mold into contact with the imprint material of one shot region among the plurality of shot regions;
In a state where the mold and the imprint material are in contact with each other, an imaging step of acquiring an image by imaging the one shot region;
Based on the acquired image, a determination step of determining whether or not foreign matter is included in the imprint material,
If it is determined in the determination step that the foreign matter is included, the holding force of the mold holding unit that holds the die or the holding force of the substrate holding unit that holds the substrate is changed from the contact step. Removing the foreign matter, and
An imprint method characterized by the above. A pattern formed on a mold and an imprint material supplied to a plurality of shot areas on the substrate are brought into contact with each other to fill the imprint material in the pattern, and the pattern of the imprint material is formed on the substrate. An imprint method for forming,
A contact step of bringing the mold into contact with the imprint material of one shot region among the plurality of shot regions;
In a state where the mold and the imprint material are in contact with each other, an imaging step of acquiring an image by imaging the one shot region;
Based on the acquired image, a determination step of determining whether or not foreign matter is included in the imprint material,
In the determination step, when it is determined that the foreign matter is included, a removal step of removing the foreign matter by changing a force for deforming the mold or a force for deforming the substrate from the contact step. Have
An imprint method characterized by the above.   A program for causing a computer to execute the method according to any one of claims 1 to 10. A pattern formed on a mold and an imprint material supplied to a plurality of shot areas on the substrate are brought into contact with each other to fill the imprint material in the pattern, and the pattern of the imprint material is formed on the substrate. An imprint apparatus for forming,
A mold holding unit for holding the mold;
A substrate holder for holding the substrate;
Based on an image capturing unit that captures the shot region and an image of the shot region captured by the image capturing unit, it is determined whether or not the imprint material includes foreign matter, and the foreign matter is included in the imprint material. A control unit that controls the mold holding unit or the substrate holding unit so as to remove the foreign matter when it is determined that it is included, and
The control unit controls the mold holding unit or the substrate holding unit to remove the foreign matter until it is determined that the foreign matter is not included in the imprint material.
An imprint apparatus characterized by that. Forming a pattern on a substrate using the imprint method according to claim 1;
Processing the substrate on which the pattern has been formed in the step;
A method for producing an article comprising:

Images