JP7043199B2 - Imprint method, program, imprint device and manufacturing method of goods - Google Patents

Description

The present invention relates to an imprint method , a program , an imprint device, and a method for manufacturing an article .

Imprint technology is a technology for forming fine patterns on a nanoscale, and is attracting attention as one of the nanolithography technologies for mass production of semiconductor devices and magnetic storage media. An imprint device using imprint technology cures the resin in a state where the mold on which the pattern is formed and the resin (imprint material) on the substrate are in contact, and pulls the mold away from the cured imprint material. A pattern of imprint material is formed on the substrate.

When foreign matter exists between the mold and the substrate when the mold and the imprint material on the substrate are brought into contact with each other, or if foreign matter adheres to the mold, the imprint material pattern formed on the substrate. Can be defective. The imprint method described in Patent Document 1 includes a step of removing particles adhering to a template using a dummy wafer having a particle removing film formed on the surface thereof.

JP-A-2009-266841

However, in the imprint method of Patent Document 1, it is not confirmed whether or not the particles have been removed after the step of removing the particles, and the particles may remain attached to the template.

It is an object of the present invention to provide, for example, an imprinting method that is advantageous in terms of suppressing pattern defects.

In order to solve the above problems, the present invention is an imprint method for forming a pattern of an imprint material in a plurality of pattern forming regions on a substrate by using a mold, wherein the mold and the plurality of pattern forming regions are formed. The imprint process of performing the first imprint process for forming a pattern, including contacting the imprint material supplied to one of the pattern forming regions, and the mold and the imprint material come into contact with each other. An imaging step of capturing an image of one pattern forming region and acquiring an image, and a determination step of determining whether or not a foreign substance is contained between the substrate and the mold based on the acquired image. When it is determined in the determination step that foreign matter is contained, a removal step of performing a second imprint process to remove the foreign matter is included, and in the removal step , the holding force of the mold holding portion for holding the mold, Alternatively, the holding force of the substrate holding portion that holds the substrate is changed from the imprint process, and the second imprint process is performed under the second imprint condition different from the first imprint condition when the first imprint process is performed. It is characterized by that.

It is an object of the present invention to provide, for example, an imprinting method that is advantageous in terms of suppressing pattern defects.

It is a figure which illustrates the structure of the imprint apparatus. It is a figure which illustrates the normal imprint processing process. It is a figure which illustrates the abnormal imprint processing including foreign matter. It is a flow figure which shows the imprint method which concerns on 1st Embodiment. It is a figure explaining the imprint method which concerns on 1st Embodiment. It is a figure explaining an example of the foreign matter processing which concerns on 1st Embodiment. It is a figure explaining the imprint method which concerns on 3rd Embodiment.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings and the like.

(First Embodiment)
FIG. 1 is a diagram illustrating a typical device configuration of an imprint device. The imprint device 100 is a lithography device that forms a pattern on an imprint material on a substrate by using a mold. The imprint device 100 cures the imprint material in a state where the mold and the imprint material on the substrate are in contact with each other, and pulls the mold away from the cured imprint material to form an imprint process on the substrate. conduct. Here, as an example, as an imprint device using a photocuring method, an ultraviolet curable imprint device that cures an uncured imprint material on a substrate by irradiation with ultraviolet rays is used. However, as a method for curing the imprint material, a method by irradiating light in another wavelength range or a method using other energy (for example, heat) may be used.

The imprint device 100 includes a mold holding unit 110, a substrate holding unit 120, an off-axis alignment scope 130, an on-axis alignment scope 140, a light source 150, a supply unit 160 (dispenser), an imaging unit 170, and storage. A unit 180 and a control unit 190 are included. Further, in the following figure, the Z-axis is taken parallel to the optical axis of the ultraviolet light applied to the imprint material on the substrate W, and the X-axis and the Y-axis are orthogonal to each other in a plane perpendicular to the Z-axis. Is taking.

The mold holding unit 110 holds and moves the mold M carried in by a mold transfer device (not shown). The mold holding portion 110 pressurizes, for example, a mold chuck (not shown) for holding the mold M, a driving portion (not shown) for moving the mold M by driving the mold chuck, and the mold M from the outer peripheral direction. Includes a mold deforming portion (not shown) that deforms the shape of the mold M thereby.

The mold M is held by the mold chuck by, for example, a vacuum suction force, an electrostatic force, or the like. The drive unit controls the position of the mold M with respect to the six axes, brings the mold M into contact with the imprint material on the substrate, and peels (releases) the mold M from the cured imprint material. Here, the six axes are the X-axis, the Y-axis, the Z-axis, and the rotation around each of these axes in the XYZ coordinate system. The mold holding portion 110 can deform the shape of the mold M by using a cylinder (actuator) operated by a fluid such as air or oil. The substrate W can be deformed (typically expanded or contracted) by undergoing a process such as heat treatment. The mold deformation portion corrects the shape of the mold M so that the positions of the substrate W and the mold M match in accordance with such deformation of the substrate W.

The mold M includes, for example, a pattern portion P having a rectangular outer peripheral shape and having a three-dimensional uneven pattern such as a circuit pattern formed on a surface facing the substrate W. Further, the material of the mold M is a material capable of transmitting ultraviolet light, and in this embodiment, quartz is used as an example.

The substrate holding unit 120 holds and moves the substrate W carried in by a substrate transporting device (not shown). The substrate holding portion 120 may include a stage 121, a substrate chuck 122, a substrate deforming portion (not shown), and a reference plate 123. The substrate chuck 122 holds the substrate W by, for example, a vacuum suction pad or the like. The stage 121 holds the substrate chuck 122 and is driven by a drive mechanism (not shown) to move the substrate W on the surface plate 1 to 6 axes. The substrate deforming portion deforms the shape of the substrate W by pressurizing the substrate W from the outer peripheral direction, and matches the shape of the pattern forming region (shot region) formed on the substrate W with the shape of the pattern portion P formed on the mold M. .. The reference plate 123 is used for aligning the substrate W and the substrate holding portion 120, which will be described later.

The substrate W is a substrate on which a pattern of an imprint material is formed by a mold M, and includes, for example, a single crystal silicon substrate, an SOI (SILION ON INSULATOR) substrate, and the like. A plurality of shot regions are formed on the substrate W.

The off-axis alignment scope 130 detects a mark (not shown) provided on the substrate W and a mark provided on the reference plate 123, determines the amount of position / shape deviation between the substrate W and the substrate holding portion 120, and determines the amount of positional deviation between the substrate W and the substrate holding portion 120. The position of W and the substrate holding portion 120 is aligned.

The on-axis alignment scope 140 obtains the relative position between the mold M and the substrate holding portion 120 by detecting the mark (not shown) provided on the mold M and the mark provided on the reference plate 123, and the mold The position of M and the substrate holding portion 120 is aligned.

The light source 150 irradiates the imprint material with light through the mold M to cure the imprint material, and is, for example, a halogen lamp that generates ultraviolet light (for example, i-line or g-line). The imprint material is, in this embodiment, an ultraviolet photocurable resin.

The supply unit 160 includes, for example, a tank 161 for accommodating the imprint material, a discharge port 162 for discharging the imprint material supplied from the tank through the supply path to the substrate, and a valve (valve) provided in the supply path. (Not shown) and a supply amount control unit (not shown) may be included. The supply unit 160 supplies the imprint material to the shot region provided on the substrate. The supply amount control unit controls the valve to control the supply amount of the imprint material to the substrate W.

The image pickup unit 170 includes an image pickup light source 171 and an image pickup element 172, and takes an image of a shot region of the substrate W with or without the mold M to acquire an image. The image pickup light source 171 illuminates the substrate W (shot region) with light having a wavelength different from that of ultraviolet rays, that is, light having a wavelength different from the light having a wavelength that cures the imprint material (for example, visible light). The image pickup device 172 includes, for example, a CCD image sensor or a CMOS image sensor, and detects light reflected on the pattern surface of the mold M or the surface of the substrate W. Further, the image pickup device 172 can also detect interference light (an interference pattern formed by) between the light reflected by the mold M and the light reflected by the substrate W. The image pickup device 172 can detect a region where the imprint material on the substrate and the mold (pattern portion) are in contact with each other.

The storage unit 180 includes, for example, a memory and a hard disk (HDD), and stores an image acquired by the image pickup unit 170 and an image of an imprint processing process described later. Further, the storage unit 180 can also store various programs, data, information and the like used in the imprint device 100.

The control unit 190 includes, for example, a CPU and a memory, and controls each unit of the imprint device 100 to perform imprint processing. Further, the control unit 190 determines whether or not the imprint material contains foreign matter based on the image acquired by the image pickup unit 170. The control unit 190 is composed of, for example, a computer having a storage means such as a magnetic storage medium, a sequencer or the like (not shown) connected to each component of the imprint device by a line. The method according to this embodiment can be executed on a computer as a program. The control unit 190 may be provided in the imprint device 100, or may be installed in a place different from the imprint device 100 and controlled remotely.

FIG. 2 is a diagram illustrating an imprint processing process according to the first embodiment. Before supplying the imprint material R onto the substrate W as shown in FIG. 2A, the substrate W is held by the substrate holding portion 120. Next, the mark provided on the substrate W and the mark provided on the reference plate 123 are detected by the off-axis alignment scope 130 to determine the amount of deviation in the position and shape between the substrate W and the stage 121.

Next, the mark provided on the mold M and the mark provided on the reference plate 123 are detected by the on-axis alignment scope 140 to determine the amount of deviation in the position and shape between the mold M and the stage 121. Based on the amount of misalignment of the position and shape obtained in this way, the misalignment of the position and shape between the mold M and the substrate W is corrected (that is, the alignment (alignment step) between the mold M and the substrate W is performed). ..

After correcting the position and shape deviation between the mold M and the substrate W, the imprint material R is supplied to the shot region on the substrate W by the supply unit 160 (FIG. 2A). After supplying the imprint material to the substrate W under the supply unit 160, the shot region to which the imprint material R is supplied is arranged under the mold M. Next, the mold holding portion 110 holding the mold M is moved to bring the mold M into contact with the imprint material on the substrate (shot region) (contact step) (FIG. 2B). After the recess of the pattern portion P of the mold M is filled with the resin, the imprint material R on the substrate is irradiated with light 201 by the light source 150 via the mold M to cure the imprint material R (FIG. 2). (C)). Next, the mold holding portion 110 is moved to peel the mold M from the cured imprint material on the substrate (FIG. 2 (D)). As a result, a pattern is formed on the substrate (shot region). The above process is the imprint process.

Here, in the image pickup unit 170, while the imprint process is being performed, more specifically, while the mold M and the resin on the substrate are in contact with each other, the imprint material R on the substrate is the mold M and the substrate W. The process of filling the recesses of the pattern surface while spreading between the and is imaged (imprinting process). In this way, the image acquired by the image pickup unit 170 is stored in the storage unit 180 as described above.

However, as shown in FIG. 3, when the foreign matter 301 is present on the substrate W (FIG. 3A), even if the mold M and the substrate W are brought into contact with each other and the pattern portion P is filled with the imprint material R, the imprint material R may be filled. The foreign matter 301 creates an unfilled space 302 between the mold M and the substrate W (FIG. 3 (C)). Even if the light 201 is irradiated with the light source in this state, the imprint material R is not filled in the vicinity of the foreign matter 301, and a defect occurs in the formed pattern (FIG. 3 (D)). Further, the foreign matter 301 can move to the mold M.

As a result, in the subsequent imprint processing, since foreign matter is attached to the mold M, the defect is recurred at the same coordinates in the shot. In this embodiment, this is referred to as a repeat defect. This repeat defect cannot form a normal pattern unless the foreign matter of the mold M is removed.

In the present embodiment, foreign matter is detected from the filled image in the normal imprint process, which is the imprint process for forming a pattern in the shot region on the substrate. When an abnormality such as a defect due to a foreign substance is detected, the imprint condition is switched to the setting of the foreign substance removal process, which is an imprint process for removing the foreign substance, and the foreign substance removal process is started for the mold M. Detection is also performed from the filling image during the foreign matter removal process, and it is determined whether or not the defect has disappeared by the foreign matter removal process. If it is determined that there are no defects such as unfilled, the imprint setting is restored and the normal imprint process is restarted.

FIG. 4 is a flow chart showing an imprint method according to the first embodiment. Each flow is mainly executed by the control of each unit by the control unit 190. The present embodiment usually includes an imprint process and a foreign matter removal process.

In step S400, the substrate W is carried into the substrate chuck 122 by a substrate transfer device (not shown). After carrying in the substrate W, an imprint process is performed in step S411.

In step S412, as described above, while the step S411 is being performed, the image pickup unit 170 takes an image of the process in which the imprint material R supplied on the substrate W is filled in the concave portion of the pattern surface of the mold M (imaging). Process). The image acquired by the image pickup unit 170 is stored in the storage unit 180 as described above.

In step S413, it is determined whether or not the imprint material R contains a foreign substance (determination step). For example, first, a reference image obtained by the image pickup unit 170 in a state where the mold M and the substrate W are in contact with each other without sandwiching a foreign object is stored in the storage unit 180. Next, in step S412, the image captured by the imaging unit 170 in parallel with step S411 is compared with the stored reference image, and the defect is detected from the difference. Here, the image pickup unit 170 uses the image acquired at the time of imprint processing as the reference image, but the reference image may be stored in the storage unit 180 in advance. Further, for example, a reference image corresponding to each of the shot areas may be stored in the storage unit 180.

When it is determined in step S413 that no foreign matter is contained (NO), in step S414, the control unit 190 determines whether or not the imprint process has been completed for the entire shot area on the substrate W. .. If it is not completed (NO), steps S411 to S413 are repeated. When completed (YES), in step S415, the control unit 190 controls a transfer device (not shown) to carry out the substrate W.

When it is determined in step S413 that foreign matter is contained (YES), in step S420, the control unit 190 switches, for example, the imprint condition of the imprint device 100 to the setting of the foreign matter removal process.

In step S431, the imprint process is performed under the imprint conditions set in step S420. Thereby, for example, the foreign matter adhering to the mold M is moved to the substrate W side by the imprint material R on the substrate W and removed from the mold M. In this embodiment, this step is referred to as a removal step. In step S432, similarly to step S412, while the foreign matter removal S431 is being performed, the image pickup unit 170 takes an image of the process in which the imprint material R supplied on the substrate W is filled in the concave portion of the pattern surface of the mold M. do. In step S433, the control unit 190 compares the image captured by the imaging unit with the reference image in step S432, and determines whether or not the imprint material R contains a foreign substance based on the difference.

If no foreign matter is detected in step S433 (NO), in step S440, the control unit 190 returns the imprint condition to the imprint setting of step S411 and restarts step S411. When a foreign substance is detected (YES), in step S434, the control unit 190 determines whether or not the removal step has been repeated a preset number of times. If the repetition is not completed (NO), the process returns to step S431, the alignment step is performed again, and steps S431 to S433 are repeated. When the repetition is completed (YES), in step S450, the mold M is replaced with a new mold different from the mold M, and steps S431 to S433 are performed again. Normally, the foreign matter is removed by several removal treatments, but in rare cases, the defect may not be eliminated even if the foreign matter is removed by, for example, 10 shots or more. Therefore, if the defect is not resolved by setting a predetermined maximum number of times (threshold value) to repeat a series of foreign matter removal steps including foreign matter detection and foreign matter removal in advance, replace it with a new mold and use unnecessary foreign matter. It is possible to prevent repeated removal.

FIG. 5 is a diagram illustrating an imprint method according to the first embodiment. It is assumed that the imprint processing is performed in order from the shot 501 to the left side of the paper surface, and in this figure, the defect 510 is detected in the shot 502. Then, in the next shot 503, the imprint condition is switched to the setting of the foreign matter removal process, and the imprint process (removal process) is performed. By the removal treatment, the size of the defect 510 gradually decreased to shots 504 and 505, and it was confirmed that the defect disappeared in the shot 506 in which the foreign matter was removed for the fourth time. Therefore, the imprint condition is returned to the setting of the normal imprint process, and the normal imprint process is restarted from the shot 507.

According to the present embodiment, since the defect detection is determined after the foreign matter is removed, the repeat defect does not occur again when the normal imprint process is restarted.

異物除去処理用のインプリント条件（パラメータ）は、予め設定しておいても良いし、例えば、検出された異物の大きさに応じて設定しても良い。 FIG. 6 is a diagram illustrating an example of the foreign matter removing process according to the first embodiment. The imprint condition switching (FIG. 4, S420) is performed, for example, by the control unit 190 setting the following parameters 1 to 7 of the imprint device 100 to values advantageous for removing foreign matter.

The imprint condition (parameter) for the foreign matter removal process may be set in advance, or may be set according to the size of the detected foreign matter, for example.

For example, in FIG. 6, parameters other than 2 in Table 1 are changed to numerical values different from the normal imprint processing, and the imprint processing (foreign matter removal) is performed. First, the imprint material R is supplied thicker than in the normal imprint process, the cavity pressure that deforms the mold is also changed more slowly than in the normal imprint process, and the mold and the substrate are pressed at a lower speed than in the normal imprint process. Make contact (FIG. 6 (A)). Further, the filling time is extended to improve the filling property of the imprint material R into the mold M (FIG. 6 (B)). Subsequently, the imprint material is irradiated with light for a longer time than usual to increase the shrinkage of the imprint material (FIG. 6 (C)). Finally, the mold and the substrate are peeled off at a lower speed than the normal imprint process, and the mold release force applied to the mold M is suppressed (FIG. 6 (D)). Under this condition, the mold release force may be higher than that of the normal imprint process. Therefore, in order to prevent the substrate W from coming off the substrate holding portion 120 and the mold M from coming off from the mold holding portion 110, the suction pressure (holding force) of the mold holding portion 110 and the substrate holding portion 120 is also usually imprinted. Make it higher than processing.

As described above, by performing imprinting under imprinting conditions different from the normal imprinting process, foreign matter adhering to the mold M stays in the imprinting material on the substrate and is removed from the mold M. In this embodiment, the case where the above-mentioned parameters are combined and changed has been described as an example, but the present invention is not limited to the above-mentioned combinations, and only a single parameter may be changed.

また、インプリント材を物性値の異なるものに変更しても良い。 In the present embodiment, the foreign matter adhering to the mold M is removed by using the same substrate W as in the normal imprint processing, but for example, the foreign matter is removed by using a dummy substrate which is a different substrate from the normal imprint processing. The removal process may be performed. In this case, for example, the following imprint conditions can be changed.

Further, the imprint material may be changed to one having a different physical property value.

(Second Embodiment)
FIG. 7 is a diagram illustrating an imprint method according to the second embodiment. The same steps and configurations as those of the first embodiment are indicated by the same reference numerals, and the description thereof will be omitted. In this embodiment, for example, an operation when a defect is detected on the contour of a shot will be described.

In the imprint process of the shot 701, for example, consider the case where the foreign matter 702 adhering to the contour of the shot protrudes into the adjacent shot and is detected as a defect. In this case, the normal imprint process or the foreign matter removal process may be restarted from the shot 704 without performing the imprint process on the adjacent shot 703.

As a result, it is possible to reduce the risk that the foreign matter 702 protruding from the adjacent shot 703 adheres to the mold M when the adjacent shot 703 is imprinted and causes a new defect.

(Third Embodiment)
In this embodiment, an imprint method for storing the position coordinates of defects detected by a normal imprint process will be described. As a condition for switching from the normal imprint process to the imprint condition of the foreign matter removal process, the position coordinates of the defect when the defect is detected in the normal imprint process are stored in the storage unit 180 together with the setting of the foreign matter removal process, for example. do. If a defect is detected at the same position coordinates in the subsequent shot imprint processing, the setting may be switched to the foreign matter removal processing setting in which the imprint condition is stored.

This makes it possible to remove foreign matter specialized for repeat defects caused by defective molds, such as defects caused by foreign matter adhering to the mold, and is unnecessary for defects not caused by foreign matter such as air traps and defects that do not repeat. It is possible to avoid performing a foreign matter removal process.

(Manufacturing method of goods)
The method for manufacturing a device as an article (semiconductor integrated circuit element, liquid crystal display element, etc.) includes a step of forming a pattern on a substrate (wafer, glass plate, film-like substrate) by an imprint device using the above-mentioned method. .. Further, the manufacturing method may include a step of etching a patterned substrate. When manufacturing other articles such as patterned media (recording media) and optical elements, the manufacturing method may include other processing for processing a patterned substrate instead of etching. The method for manufacturing an article of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

100 Imprint device 110 type holder M type 120 board holder W board 150 light source 170 image pickup unit 180 storage unit 190 control unit

Claims (13)

An imprint method for forming a pattern of an imprint material in a plurality of pattern forming regions on a substrate using a mold.
An imprint that includes contacting the mold with the imprint material supplied to the pattern forming region of one of the plurality of pattern forming regions, and performing a first imprint process for forming the pattern. Process and
An imaging step of capturing an image of the one pattern forming region and acquiring an image in a state where the mold and the imprint material are in contact with each other.
Based on the acquired image, a determination step of determining whether or not a foreign substance is contained between the substrate and the mold, and a determination step.
The determination step includes a removal step of performing a second imprint process to remove the foreign matter when it is determined that the foreign matter is contained.
In the removal step , when the holding force of the mold holding portion for holding the mold or the holding force of the substrate holding portion for holding the substrate is changed from the imprinting step and the first imprinting process is performed. The second imprint process is performed under the second imprint condition different from the first imprint condition.
An imprint method characterized by that. The first imprint condition and the second imprint condition are the thickness of the imprint material, the speed at which the mold and the substrate are brought into contact with each other, the filling time of the imprint material, and the curing of the imprint material. The imprint method according to claim 1, wherein at least one of the conditions of the irradiation amount of the curing light to be irradiated to the mold and the speed at which the mold is separated from the substrate is different. The imprint method according to claim 1, wherein the removal step is performed using the same substrate as the substrate on which the determination step is performed. The imprint method according to claim 1, wherein the removal step is performed using a substrate different from the substrate on which the determination step is performed. The imprint method according to any one of claims 1 to 4 , wherein in the removal step, the force for deforming the mold or the force for deforming the substrate is changed from the imprint step. The removal step is repeated until it is determined in the determination step that the foreign matter is not contained.
The imprint method according to any one of claims 1 to 5 , wherein when the number of times of repeating the series of steps exceeds a predetermined threshold value, the mold is replaced with another mold. When it is determined in the determination step that the foreign matter is contained in the pattern forming region adjacent to the one pattern forming region, the claim is characterized in that the pattern is not formed on the adjacent pattern forming region. Item 6. The imprint method according to any one of Items 1 to 6 . The imprint method according to any one of claims 1 to 7 , wherein in the determination step, the position coordinates where the foreign matter is present are stored. An imprint method for forming a pattern of an imprint material in a plurality of pattern forming regions on a substrate using a mold.
A contact step of bringing the mold into contact with the imprint material supplied to one of the plurality of pattern forming regions.
An imaging step of capturing an image of the one pattern forming region and acquiring an image in a state where the mold and the imprint material are in contact with each other.
Based on the acquired image, a determination step of determining whether or not a foreign substance is contained between the substrate and the mold, and a determination step.
When it is determined that the foreign matter is contained in the determination step, the holding force of the mold holding portion for holding the mold or the holding force of the substrate holding portion for holding the substrate is changed from the contact step. Has a removal step of removing foreign matter,
An imprint method characterized by that. An imprint method for forming a pattern of an imprint material in a plurality of pattern forming regions on a substrate using a mold.
A contact step of bringing the mold into contact with the imprint material supplied to one of the plurality of pattern forming regions.
An imaging step of capturing an image of the one pattern forming region and acquiring an image in a state where the mold and the imprint material are in contact with each other.
Based on the acquired image, a determination step of determining whether or not a foreign substance is contained between the substrate and the mold, and a determination step.
When it is determined that the foreign matter is contained in the determination step, the present invention includes a force for deforming the mold or a removal step for changing the force for deforming the substrate from the contact step to remove the foreign matter. ,
An imprint method characterized by that. A program comprising causing a computer to execute the method according to any one of claims 1 to 10. An imprinting device that forms a pattern of an imprint material in a plurality of pattern forming regions on a substrate using a mold.
A mold holder that holds the mold and
A substrate holding portion that holds the substrate and
Based on the image pickup unit that captures the pattern forming region and the image of the pattern formation region captured by the imaging unit, it is determined whether or not foreign matter is contained between the substrate and the mold, and the foreign matter is present. When it is determined that it is contained, the second imprint process is performed under the second imprint condition different from the first imprint condition when the first imprint process is performed to form a pattern on the substrate. With a control unit that controls at least one of the mold holding unit and the substrate holding unit so as to remove the foreign matter.
In the second imprint process, the control unit changes the holding force of the mold holding unit or the holding force of the substrate holding unit from the first imprint process, and the control unit is used between the substrate and the mold. Controlling at least one of the mold holder or the substrate holder to remove the foreign matter until it is determined that no foreign matter is contained.
An imprint device characterized by that. A step of forming a pattern on a substrate by using the imprint method according to any one of claims 1 to 10.
The process of processing the substrate on which the pattern was formed in the above process and the process of processing the substrate.
A method of manufacturing an article comprising.

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