WO2016059745A1

WO2016059745A1 - Imprint apparatus, imprint method, and article manufacturing method

Info

Publication number: WO2016059745A1
Application number: PCT/JP2015/004323
Authority: WO
Inventors: Kenji Yaegashi
Original assignee: Canon Kabushiki Kaisha
Priority date: 2014-10-16
Filing date: 2015-08-27
Publication date: 2016-04-21
Also published as: KR20170054455A; JP2016082045A

Abstract

An imprint apparatus includes a substrate holding unit (4) configured to hold a substrate (6) and to be movable, a coating unit (7) configured to apply an imprint material (8) to the substrate (6), and a mold foreign matter removal unit (3) provided in the substrate holding unit (4) and configured to remove a foreign matter on a surface of the mold (2). The mold foreign matter removal unit (3) removes the foreign matter on the surface of the mold (2) by ejecting an ejection material toward the mold (2) after the imprint material (8) is applied to the substrate (6) by the coating unit (7) and before the mold (2) is brought into contact with the imprint material (8) applied to the substrate (6).

Description

IMPRINT APPARATUS, IMPRINT METHOD, AND ARTICLE MANUFACTURING METHOD

The present invention relates to an imprint apparatus, an imprint method, and an article manufacturing method.

With requirements for miniaturization of semiconductor devices or MEMSs, fine processing technologies for forming patterns of resins on substrates using molds have been attracting attention in addition to conventional photography technologies. The technologies are also called imprint technologies, and enable miniature patterns in a nanometer order to be formed on substrates. For example, as one of the imprint technologies, there is a photocuring method. In imprint apparatuses adopting the photocuring method, ultraviolet curing resins (imprint materials or photocurable resins) are first applied to shot regions which are imprint regions on substrates (wafers). Next, the uncured ultraviolet curable resins are brought into contact with molds. Then, the patterns of the resins are formed on the substrates by radiating ultraviolet light to cure the resins and detaching the molds from the cured resins.

Thus, in imprint apparatuses forming patterns of resins on substrates using molds, there is concern of pattern defects occurring when there are foreign matters such as particles on substrates, in resins, or on the surfaces of the molds. For this reason, Patent Literature 1 discloses an imprint apparatus in which particles are removed by performing air conditioning in a process space using clean air through a filter. Patent Literature 2 discloses a proximity exposure apparatus that includes a mask cleaning mechanism cleaning a mask (original) in a support unit supporting a substrate.

Patent Literature 1: Japanese Unexamined Patent Application Publication No. 2013-026474
Patent Literature 2: Japanese Unexamined Patent Application Publication No. 2013-205709

In imprint apparatuses, however, an imprint cycle (an imprint process) in which patterns are formed on substrates by applying resins to shot regions and bringing molds into contact with the resins is repeated. Therefore, it is necessary to remove foreign matters attached to the molds and the substrates at each imprint cycle. In imprint apparatuses, foreign matters on substrates are preferably removed before resins are applied to substrates. Further, foreign matters on the surfaces of molds are preferably removed before the molds are brought into contact with the resins on the substrates. In the methods described in Patent Literature 1 and Patent Literature 2, however, there is a possibility of foreign matters being attached to molds, substrates, or the peripheries of the molds and substrates during an imprint cycle even when foreign matters are removed from the molds and the substrates once.

The present invention provides an imprint apparatus that is advantageous for removing foreign matters attached to a mold and a substrate, for example.

To resolve the foregoing problems, the invention provides an imprint apparatus forming a pattern in an imprint material on a substrate using a mold. The imprint apparatus includes: a substrate holding unit configured to hold the substrate and to be movable; a coating unit configured to apply the imprint material to the substrate; and a mold foreign matter removal unit provided in the substrate holding unit and configured to remove a foreign matter on a surface of the mold. The mold foreign matter removal unit removes the foreign matter on the surface of the mold by ejecting an ejection material toward the mold after the imprint material is applied to the substrate by the coating unit and before the imprint material applied to the substrate is brought into contact with the mold.

According to the present invention, it is possible to provide an imprint apparatus that is advantageous for removing foreign matters attached to a mold or a substrate, for example.

Further features of the present invention will become apparent from the following description of exemplary embodiments (with reference to the attached drawings).

Fig. 1A is a diagram illustrating the configuration of an imprint apparatus according to a first embodiment. Fig. 1B is a diagram illustrating the imprint apparatus when a wafer stage is moved to a contact position. Fig. 2 is a flowchart illustrating the flow of a process of the imprint apparatus according to the embodiment. Fig. 3A is a diagram illustrating the configuration of an imprint apparatus according to a second embodiment. Fig. 3B is a diagram illustrating the configuration of an imprint apparatus according to a third embodiment.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
(First embodiment)

First, an imprint apparatus according to a first embodiment of the present invention will be described. Fig. 1 is a schematic diagram illustrating the configuration of an imprint apparatus 1 according to the embodiment. The imprint apparatus 1 is an apparatus that is used to manufacture a device such as a semiconductor device which is an article and forms a pattern in an uncured resin (imprint material) 8 on a wafer 6 (substrate), which is a processed body, using a mold 2. Here, an imprint apparatus adopting a photocuring method will be exemplified, but an apparatus adopting a thermal curing method may be used. The imprint apparatus 1 sequentially forms a pattern in a plurality of shot regions (pattern-formed regions) formed on the wafer 6 by repeating an imprint cycle. Here, the imprint cycle refers to a cycle at which a pattern is formed on the wafer 6 by applying the resin 8 to the wafer 6 and curing the resin 8 when the resin 8 is pressed (in a contact state) by the mold 2. In the following drawings, the Z axis is formed in parallel to a direction in which a resin coating unit (resin application unit or dispenser) 7 drops the resin 8 onto the wafer 6, and the X and Y axes are formed to be mutually orthogonal in a plane perpendicular to the Z axis. The imprint apparatus 1 includes a mold holding mechanism 12, a wafer stage 4, a resin coating unit 7, a wafer foreign matter removal unit 5, a mold foreign matter removal unit 3, and a control unit 16.

For example, an uneven pattern such as a circuit pattern to be transferred is formed 3-dimensionally on the surface of the mold 2 facing the wafer 6. A material of the mold 2 is a material capable of transmitting ultraviolet light and is assumed to be, for example, quartz in the embodiment. In the mold 2, a planar shape of the surface irradiated with ultraviolet light from a light radiation unit (not illustrated) has a circular shape and a cavity (concave portion) with a depth to some extent in some cases.

Although not illustrated, the mold holding mechanism (mold holding unit) 12 includes a mold chuck holding the mold 2 by a vacuum adsorption force or an electrostatic force and a mold driving mechanism. For example, the mold chuck is connected to a vacuum discharging apparatus (not illustrated) installed outside, and thus an adsorption pressure is adjusted by the vacuum discharging apparatus so that ON/OFF of adsorption of the mold 2 is switched. Specifically, the mold driving mechanism is a mechanism that moves the mold 2 in the Z axis direction to selectively press the mold 2 and the resin on the wafer 6 or separate the mold 2 from the resin. As an actuator adopted in the mold driving mechanism, for example, a linear motor or an air cylinder can be adopted. The pressing and separating operations in the imprint apparatus 1 may be realized by moving the mold 2 in the Z axis direction, as described above, or may be realized by moving the wafer stage 4 in the Z axis direction, as will be described below. The pressing and separating operations in the imprint apparatus 1 may be realized by relatively moving both of the mold 2 and the wafer stage 4 in the Z axis direction. The mold holding mechanism 12 may change a posture so that the pattern of the mold 2 and the uncured resin 8 on the wafer 6 are brought into close contact with each other. The mold holding mechanism 12 may include a shape correction mechanism that deforms the shape of a pattern region of the mold 2 in accordance with a shot region. The mold holding mechanism 12 may include, for example, a deformation mechanism that bends the mold 2 in a convex shape toward the wafer 6 when the mold 2 is brought into contact with the resin 8 or the mold 2 is separated from the resin 8.

The wafer 6 is a processed body formed of, for example, monocrystalline silicon. An ultraviolet curable resin (hereinafter also referred to as a “resin”) 8 formed by a pattern formed in the mold 2 is applied to the processed surface. The wafer stage (substrate holding unit) 4 holds the wafer 6 by, for example, vacuum adsorption and is assumed to be movable at least in the XY plane. The movement also includes accurate positioning in the X and Y axis directions and posture control of the surface of the wafer 6. As an actuator driving the wafer stage 4, for example, a linear motor can be adopted. The wafer stage 4 is driven based on a measurement value of a measurement device (not illustrated), for example, a laser interferometer or a linear encoder.

The resin coating unit (coating unit) 7 applies the resin (uncured resin) 8 to the wafer 6. The resin coating unit 7 includes a tank storing the uncured resin and a nozzle ejecting the uncured resin supplied from the tank. In particular, the resin adopted in the embodiment is photo curable resin (imprint material) having a property of being cured by radiation of ultraviolet light. The resin used in an imprint technology is not limited to a resin cured by radiation of ultraviolet light, but is appropriately selected under various conditions such as semiconductor device manufacturing processes.

The wafer foreign matter removal unit (substrate foreign removal unit) 5 is a unit that is installed between the resin coating unit 7 and the mold holding mechanism 12 of a frame 18 to be described below and removes foreign matters such as particles in the wafer 6 and the periphery of the wafer 6 by ejecting an ejection material (first ejection material) toward the wafer 6. The wafer foreign matter removal unit 5 is preferably installed to be separated from the resin coating unit 7 since foreign matters are easily attached to the resin 8 ejected from the resin coating unit 7. For the same reason, an ejection direction of the ejection material from the wafer foreign matter removal unit 5 is preferably a direction away from the resin coating unit 7. The wafer foreign matter removal unit 5 may not be disposed on a straight line connecting the mold holding mechanism 12 and the resin coating unit 7 and may be disposed on a path along which the wafer stage 4 is moved from the lower side of the mold holding mechanism 12 to the lower side of the resin coating unit 7.

The mold foreign matter removal unit (mold foreign matter removal unit) 3 is a unit that is supported by the wafer stage 4 and ejects an ejection material (second ejection material) toward the mold to remove foreign matters in the mold 2 and the periphery of the mold 2. As in the wafer foreign matter removal unit, an ejection direction of the ejection material from the mold foreign matter removal unit 3 is preferably a direction away from the resin coating unit 7 since foreign matters are easily attached to the resin 8.

The ejection materials ejected by the wafer foreign matter removal unit 5 and the mold foreign matter removal unit 3 are fluids and are, for example, pressurized air or gases such as helium or nitrogen. As the ejection material, minute CO₂ or the like in a solid state can also be adopted. The ejection materials ejected by the wafer foreign matter removal unit 5 and the mold foreign matter removal unit 3 may be the same or different. For example, the ejection materials may be changed based on various conditions such as kinds of resins to be used. The control unit 16 may variably control a temperature, a humidity, a pressure, and a flow rate of the ejection material.

The control unit 16 can control an operation, adjustment, and the like of each constituent element of the imprint apparatus 1. The control unit 16 is configured as, for example, a computer, is connected to each constituent element of the imprint apparatus 1 via a line, and controls each constituent element according to a program or the like. The control unit 16 according to the embodiment controls at least operations of the mold holding mechanism 12, the wafer stage 4, the wafer foreign matter removal unit 5, and the mold foreign matter removal unit 3. The control unit 16 may be integrated with the imprint apparatus 1 and may be installed at a different place from the imprint apparatus 1.

The imprint apparatus 1 includes a surface plate 17 that supports the entire apparatus and a frame 18 that holds the mold holding mechanism 12, the resin coating unit 7, and the wafer foreign matter removal unit 5, and the like. The frame 18 is supported by the surface plate 17 via a vibration suppression unit that removes vibration from a floor surface.

Next, an imprint process performed by the imprint apparatus 1 according to the embodiment will be described. Fig. 2 is a flowchart illustrating the flow of the imprint process of the imprint apparatus 1. First, the control unit 16 causes a substrate transport apparatus (not illustrated) to import the wafer 6 into the imprint apparatus 1 and places the wafer 6 on the wafer stage 4 and fix the wafer 6 (step S1: an import process). Then, the control unit 16 moves the wafer stage 4 on which the wafer 6 is mounted to a wafer cleaning position 10 illustrated in Fig. 1A. At the wafer cleaning position 10, the wafer foreign matter removal unit 5 ejects the ejection material toward the wafer 6 to remove foreign matters on the wafer 6 (step S2: a substrate foreign matter removal process). In the substrate foreign matter removal process, the foreign matters of the wafer 6 may be removed while the wafer stage 4 is moved, or the foreign matters of the wafer 6 may be removed without moving the wafer stage 4 at the wafer cleaning position 10. Fig. 1A illustrates a state in which the foreign matters of the wafer 6 are removed while the wafer stage 4 is moving in a direction (the X direction) in which the wafer stage 4 approaches the resin coating unit 7. However, a position to which the wafer stage 4 is moved so that the wafer 6 (shot region) is located immediately below the wafer foreign matter removal unit 5 may be set as the wafer cleaning position 10. Next, the control unit 16 moves the wafer stage 4 to a coating position 11 of the resin coating unit 7 illustrated in Fig. 1A. At the coating position 11, the resin coating unit 7 applies the resin 8 to a predetermined shot region (processed region) of the wafer 6 (step S3: an coating process). In the coating process, the resin 8 may be applied to the wafer 6 while the wafer stage 4 is moving toward the resin coating unit 7 or the resin may be applied to the wafer 6 without moving the wafer stage 4. Next, the control unit 16 moves the wafer stage 4 to a mold cleaning position 9 illustrated in Fig. 1A. At the mold cleaning position 9, the mold foreign matter removal unit 3 removes foreign matters on the surface of the mold 2 by ejecting the ejection material toward the mold 2 (step S4: a mold foreign matter removal process). In the mold foreign matter removal process, the foreign matters of the mold 2 may be moved while the wafer stage 4 is moving or the foreign matters of the mold 2 may be removed without moving the wafer stage 4 at the mold cleaning position 9. Fig. 1A illustrates a state in which the foreign matters of the mold 2 are removed while the wafer stage 4 is moving in a direction (-X direction) away from the resin coating unit 7. However, a position to which the wafer stage 4 is moved so that the mold foreign matter removal unit 3 is located immediately below the mold 2 may be set as the mold cleaning position 9.

Subsequently, the control unit 16 moves the wafer stage 4 to a contact position 19 at which the shot region (resin-applied region) of an imprint processing target is located immediately below the mold 2 (see Fig. 1B). Next, the control unit 16 performs alignment of the shot region and the mold 2 and shape correction of the pattern region of the mold 2 by a shape correction mechanism (not illustrated). The control unit 16 drives the mold driving mechanism to bring the mold 2 into contact with the resin 8 on the wafer 6 (step S5: a contact process). In the contact process, the pattern formed in the mold 2 is filled with the resin 8. When the mold 2 is brought into contact with the resin 8, ultraviolet light (curing light) is radiated from the rear surface (top surface) of the mold 2 and the resin 8 is cured with the ultraviolet light transmitted through the mold 2 (step S6: a curing process). Then, after the resin 8 is cured, the control unit 16 drives the mold driving mechanism to widen the space between the wafer 6 and the mold 2 and separate the mold 2 from the cured resin 8 (step S7: a mold separation process).

Thus, a layer of a 3-dimensional resin copied from the pattern of the mold 2 is formed on the wafer 6. After the mold separation process, the control unit 16 determines whether the forming of the pattern on the wafer 6 is completed (step S8: a determination process). When the control unit 16 determines that the forming of the pattern on the wafer 6 is not completed in the determination process, the process proceeds to the substrate foreign matter removal process of step S2 to remove the foreign matters on the shot region at which the pattern is subsequently formed. The imprint apparatus 1 performs the imprint process at all of the shot regions sequentially according to a step-and-repeat scheme. When the control unit 16 determines that the forming of the pattern on the wafer 6 is completed in the determination process, the control unit 16 exports the wafer 6 from the imprint apparatus 1 (step S9: an export process). When there is a wafer 6 to be subsequently processed, the wafer 6 is imported into the imprint apparatus 1 and the above-described imprint cycle is repeated.

In such a configuration, the imprint apparatus 1 according to the embodiment can remove the foreign matters on the wafer 6 before the resin 8 is applied to the wafer 6, and can remove the foreign matters on the surface of the mold 2 before the mold 2 is brought into contact with the resin 8 on the wafer 6. Therefore, it is possible to reduce occurrence of pattern defects caused due to foreign matters attached to the mold 2 or the wafer 6 during the imprint cycle. Since the imprint apparatus 1 according to the embodiment is configured such that the removal unit is provided inside the apparatus, it is possible to reduce occurrence of pattern defects without increasing movable strokes of the wafer stage 4.
(Second embodiment)

Next, an imprint apparatus according to a second embodiment of the present invention will be described. The characteristics of the imprint apparatus according to the embodiment are that louvers and a foreign matter detection unit are further provided. Fig. 3A is a diagram illustrating a configuration near the mold holding mechanism 12 of the imprint apparatus 1 according to the embodiment. Therefore, in the imprint apparatus in Fig. 3A, for example, the resin coating unit 7, the control unit 16, etc. are omitted. In Fig. 3A, the same reference numerals are given to elements having the same configuration as the imprint apparatus 1 according to the first embodiment illustrated in Fig. 1, and the description thereof will be omitted.

In the embodiment, the imprint apparatus 1 includes louvers (vane units) 14 that are provided in the mold foreign matter removal unit 3 and the wafer foreign matter removal unit 5, and a wafer foreign matter detection unit 13 and mold foreign matter detection unit (not illustrated) serving as a foreign matter detection unit (foreign matter detection unit). The louvers 14 change the angle of an ejection direction so that the ejection direction of an ejection material of each of the mold foreign matter removal unit 3 and the wafer foreign matter removal unit 5 can be changed. The wafer foreign matter detection unit 13 is provided in the frame 18 in the vicinity of the wafer foreign matter removal unit 5 and the mold foreign matter detection unit is provided near the mold foreign matter removal unit 3. The wafer foreign matter detection unit 13 and the mold foreign matter detection unit detects the positions amounts sizes or the like of the foreign matters of each of the wafer 6 and the mold 2. In the embodiment, the control unit 16 detects the foreign matters attached to the wafer 6 using the wafer foreign matter detection unit 13 and changes the angles of the louvers 14 provided in the wafer foreign matter removal unit 5 based on the detection result. When the angles of the louvers 14 are changed, the wafer foreign matter removal unit 5 can change an angle at which the ejection material is ejected toward the wafer 6 or a region on the wafer 6. Similarly, the control unit 16 detects the foreign matters attached to the surface of the mold 2 using the mold foreign matter detection unit and changes the angles of the louvers 14 provided in the mold foreign matter removal unit 3 based on the detection result. When the angles of the louvers 14 are changed, the mold foreign matter removal unit 3 can change an angle at which the ejection material is ejected toward the mold 2 or a region on the mold 2. In the embodiment, the louvers and the foreign matter detection unit are provided in each of the mold 2 and the wafer 6, but the present invention is not limited to this configuration. The louvers and the foreign matter detection unit may be provided in one of the mold 2 and the wafer 6.

In such a configuration, the imprint apparatus 1 according to the embodiment can change the angles of the louvers 14 according to the positions, amounts, and sizes of the foreign matters actually attached to the mold 2 and the wafer 6 and can variably control the ejection direction of the ejection material. Therefore, it is possible to efficiently remove the foreign matters attached to the mold 2 and the wafer 6.
(Third embodiment)

Next, an imprint apparatus according to a third embodiment of the present invention will be described. The imprint apparatus according to the embodiment is characterized in that a fluid discharging unit is further provided. Fig. 3B is a diagram illustrating a configuration near the mold holding mechanism 12 of the imprint apparatus 1 according to the embodiment. Therefore, in the imprint apparatus in Fig. 3B, for example, the resin coating unit 7, the control unit 16, etc. are omitted. In Fig. 3B, the same reference numerals are given to elements having the same configuration as in the imprint apparatus 1 according to the first embodiment illustrated in Fig. 1, and the description thereof will be omitted.

In the embodiment, the imprint apparatus 1 includes a fluid discharging unit 15 that discharges a fluid between the mold holding mechanism 12 and the wafer stage 4. The fluid discharging unit 15 is provided, for example, between the wafer foreign matter removal unit 5 and the resin coating unit 7 of the frame 18 and discharges a fluid in a direction (-X direction) substantially parallel to the wafer 6 and the mold 2 or away from the resin coating unit 7 to move the foreign matters in the direction away from the resin coating unit 7. The fluid discharging unit 15 may discharge the fluid toward the wafer foreign matter removal unit 5 and the mold holding mechanism 12 from a Y direction (a direction intersecting the movement of the wafer stage 4). As the fluid discharged by the fluid discharging unit 15, for example, pressurized air, helium, or minute CO₂ in a solid state is adopted. A timing at which the fluid is ejected by the fluid discharging unit 15 may be simultaneous with ejection timings of the two foreign

matter removal units

3 and 5 or the fluid may be continuously ejected.

In such a configuration, the imprint apparatus 1 according to the embodiment can use the fluid discharging unit 15 to move the foreign matters removed from the mold 2 and the wafer 6 through the ejection of the ejection material by the two foreign

matter removal units

3 and 5 in one direction without diffusing the foreign matters inside the apparatus.
(Article manufacturing method)

A method of manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice (for example, a semiconductor device) or an element having a microstructure. This manufacturing method can include a step of forming a latent image pattern on a photosensitive agent of a substrate onto which the photosensitive agent is applied by using the above-described drawing apparatus (drawing step on the substrate), and a step of developing the substrate on which the latent image pattern is formed. Further, this manufacturing method includes other well-known steps (for example, oxidization, deposition, vapor deposition, doping, planarization, etching, resist removal, dicing, bonding, packaging and the like). The method of manufacturing an article according to the embodiment is superior to a conventional method in at least one of the performance, quality, productivity, and production cost of the article.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

This application claims the benefit of Japanese Patent Application No. 2014-211332 filed October 16, 2014, which is hereby incorporated by reference herein in its entirety.

Claims

An imprint apparatus forming a pattern of an imprint material on a substrate by using a mold, the imprint apparatus comprising:
a substrate holding unit configured to hold the substrate and to be movable;
a coating unit configured to apply the imprint material to the substrate; and
a mold foreign matter removal unit provided in the substrate holding unit and configured to remove a foreign matter on a surface of the mold,
wherein the mold foreign matter removal unit removes the foreign matter on the surface of the mold by ejecting an ejection material toward the mold after the imprint material is applied to the substrate by the coating unit and before the imprint material applied to the substrate is brought into contact with the mold.
An imprint apparatus forming a pattern of an imprint material on a substrate by using a mold, the imprint apparatus comprising:
a substrate holding unit configured to hold the substrate and to be movable;
a coating unit configured to apply the imprint material to the substrate; and
a substrate foreign matter removal unit configured to remove a foreign matter on the substrate held by the substrate holding unit,
wherein the substrate foreign matter removal unit removes the foreign matter on a surface of the substrate by ejecting an ejection material toward the substrate after the cured imprint material is away from the mold and before the uncured imprint material is applied to the substrate.
An imprint apparatus forming a pattern of an imprint material on a substrate by using a mold, the imprint apparatus comprising:
a substrate holding unit configured to hold the substrate and to be movable;
a coating unit configured to apply the imprint material to the substrate; and
a mold foreign matter removal unit provided in the substrate holding unit and configured to remove a foreign matter on a surface of the mold,
wherein the mold foreign matter removal unit removes the foreign matter of the mold by ejecting an ejection material toward the mold in a direction away from the coating unit and the substrate holding unit.
An imprint apparatus forming a pattern of an imprint material on a substrate by using a mold, the imprint apparatus comprising:
a substrate holding unit configured to hold the substrate and to be movable;
a mold holding unit configured to hold the mold;
an coating unit configured to apply the imprint material to the substrate; and
a substrate foreign matter removal unit configured to remove a foreign matter on the substrate held by the substrate holding unit,
wherein the substrate foreign matter removal unit is disposed on a path along which the substrate holding unit is moved from below the mold holding unit to below the coating unit, and removes the foreign matter on a surface of the substrate by ejecting an ejection material toward the substrate in a direction away from the coating unit.
The imprint apparatus according to claim 1, further comprising:
a foreign matter detection unit configured to detect a foreign matter attached to the mold; and
a vane unit provided in the mold foreign matter removal unit and configured to able to change an ejection direction of the ejection material,
wherein the mold foreign matter removal unit changes the ejection direction of the ejection material using the vane unit based on a detection result of the foreign matter detection unit.
The imprint apparatus according to claim 1, further comprising:
a fluid discharging unit configured to discharge a fluid between the mold holding unit holding the mold and the substrate holding unit.
The imprint apparatus according to claim 6, wherein the fluid discharging unit is provided between the substrate foreign matter removal unit and the coating unit and discharges the fluid in a direction away from the coating unit.
The imprint apparatus according to claim 4, wherein the substrate foreign matter removal unit is provided between the mold holding unit and the coating unit and removes the foreign matter on the substrate when the substrate holding unit is moved from below the mold holding unit to below the coating unit.
An imprint method of forming a pattern in an imprint material on a substrate using a mold, the imprint method comprising:
applying the imprint material to the substrate; and
removing a foreign matter on a surface of the mold before the imprint material applied to the substrate is brought into contact with the mold after the applying of the imprint material.
An imprint method of forming a pattern in an imprint material on a substrate using a mold, the imprint method comprising:
bringing the mold into contact with the imprint material on the substrate;
removing a foreign matter on a surface of the substrate before the imprint material is applied to the substrate after the bringing of the mold into contact with the imprint material; and
applying the imprint material to the substrate after the removing of the foreign matter.
An article manufacturing method comprising:
forming a pattern of an imprint material on a substrate using the imprint apparatus according to claim 1; and
processing the substrate on which the pattern is formed in the forming of the pattern.