JP6898785B2 - Imprint equipment and article manufacturing method - Google Patents

Description

The present invention relates to an imprinting apparatus and a method for manufacturing an article.

The imprinting apparatus forms a pattern made of a cured product of the imprint material on the substrate by bringing the mold into contact with the imprint material arranged on the substrate and curing the imprint material. As a method of arranging the imprint material on the substrate, there is a method of discharging the imprint material from the discharge port while moving the substrate so that the imprint material is arranged at a target position on the substrate. When the imprint material is discharged from the discharge port, fine droplets called mist may be generated. The mist can solidify into particles.

Patent Document 1 describes an imprint device including an exhaust unit that removes volatile components and mist from droplets of resin ejected from an inkjet head.

Japanese Unexamined Patent Publication No. 2016-76695

Inside the imprint device, there may be various flows such as a gas flow from the outlet of the temperature control device and a gas flow generated by driving the substrate by the substrate drive mechanism. If an exhaust unit as described in Patent Document 1 is provided, a flow may be generated by suction of gas by the exhaust unit. In the configuration in which the imprint material is arranged on the substrate by discharging the imprint material from the dispenser toward the target position of the substrate, the trajectory of the imprint material discharged from the dispenser can be changed by the gas flow. As a result, the position of the imprint material placed on the substrate can be shifted from the target position. If the amount of this shift is constant, the imprint material can be arranged at the target position of the substrate by correcting the timing of discharging the imprint material from the dispenser. However, the presence of spatial and / or temporal non-uniformity in the gas flow makes it difficult to place the imprint material at the target position on the substrate.

Therefore, when mounting the configuration for sucking mist on the imprint device, the flow of gas generated by driving the substrate by the board driving mechanism and the flow of gas caused by sucking mist should be taken into consideration.

An object of the present invention is to provide an advantageous technique for removing mist while arranging an imprint material at a target position of a substrate.

One aspect of the present invention relates to an imprinting apparatus that uses a mold to form a pattern of a cured product of an imprinting material on a substrate, wherein the imprinting apparatus has a first axis and the substrate orthogonal to each other. On the substrate in a state where the substrate is driven in a direction parallel to the first axis by the substrate driving mechanism for driving the second axis, the mold holding mechanism for holding the mold, and the substrate driving mechanism. A dispenser having a discharge port for discharging the imprint material so that the imprint material is arranged, and a dispenser arranged so as to sandwich the discharge port so as to be separated from each other in a direction parallel to the first axis and sucking gas. A suction port and a second suction port are provided, and the first suction port is arranged on the side in the first direction parallel to the first axis with the second suction port as a reference, and is provided by the substrate drive mechanism. In a state where the imprint material is discharged from the dispenser while the substrate is driven in the first direction, the amount of gas sucked by the first suction port is larger than the amount of gas sucked by the second suction port.

INDUSTRIAL APPLICABILITY According to the present invention, an advantageous technique for removing mist while arranging an imprint material at a target position on a substrate is provided.

The figure which shows the structure of the imprinting apparatus of one Embodiment of this invention. The figure which illustrates the structure of the drive | substrate drive by the substrate drive mechanism, and the discharge port of a dispenser when arranging an imprint material with respect to a substrate. The figure which illustrates the arrangement of the imprint material on the substrate by the dispenser, and the suction of gas by the 1st suction port and the 2nd suction port. The figure which illustrates the suction of the gas by the 1st suction port and the 2nd suction port in the maintenance mode. The figure which illustrates the article manufacturing method.

Hereinafter, the present invention will be described through its exemplary embodiments with reference to the accompanying drawings.

FIG. 1 shows the configuration of the imprinting apparatus IMP according to one embodiment of the present invention. The imprinting apparatus IMP uses a mold M to form a pattern made of a cured product of the imprinting material IM on the substrate S. As the imprint material, a curable composition (sometimes referred to as an uncured resin) that cures when energy for curing is applied is used. Electromagnetic waves, heat, etc. can be used as the energy for curing. The electromagnetic wave may be, for example, light whose wavelength is selected from the range of 10 nm or more and 1 mm or less, for example, infrared rays, visible rays, ultraviolet rays, and the like.

The curable composition can be a composition that is cured by irradiation with light or by heating. Of these, the photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent, if necessary. The non-polymerizable compound is at least one selected from the group of sensitizers, hydrogen donors, internal release mold release agents, surfactants, antioxidants, polymer components and the like. The imprint material can be arranged on the substrate in the form of droplets or in the form of islands or films formed by connecting a plurality of droplets. The viscosity of the imprint material (viscosity at 25 ° C.) can be, for example, 1 mPa · s or more and 100 mPa · s or less.

As the material of the substrate, for example, glass, ceramics, metal, semiconductor, resin and the like can be used. If necessary, a member made of a material different from the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

In the present specification and the accompanying drawings, the direction is shown in the XYZ coordinate system in which the direction parallel to the surface of the substrate S is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the ± X-direction, ± Y-direction, and ± Z-direction, respectively. The + X direction and the −X direction are opposite directions, the + Y direction and the −Y direction are opposite directions, and the + Z direction and the −Z direction are opposite directions. Further, in the present specification, the rotation around the X-axis, the rotation around the Y-axis, and the rotation around the Z-axis are referred to as θX, θY, and θZ, respectively. Control or drive with respect to the X-axis, Y-axis and Z-axis means control or drive with respect to a direction parallel to the X-axis, a direction parallel to the Y-axis and a direction parallel to the Z-axis, respectively. Further, the control or drive regarding the θX axis, the θY axis, and the θZ axis relates to the rotation around the axis parallel to the X axis, the rotation around the axis parallel to the Y axis, and the rotation about the axis parallel to the Z axis, respectively. Means control or drive. The position is information that can be specified based on the coordinates of the X-axis, Y-axis, and Z-axis, and the posture is information that can be specified by the values of the θX-axis, θY-axis, and θZ-axis. Positioning means controlling position and / or posture. Alignment can include controlling the position and / or orientation of at least one of the substrate and the mold.

The imprint device IMP includes a substrate driving mechanism 10 that drives the substrate S with respect to at least the X-axis (first axis) and the Y-axis (second axis) that are orthogonal to each other, and a mold holding mechanism 30 that holds the mold M. There is. The substrate driving mechanism 10 has a substrate holding portion 11 that holds the substrate S, and a driving mechanism 12 that drives the substrate S with respect to at least the X-axis and the Y-axis by driving the substrate holding portion 11 with respect to at least the X-axis and the Y-axis. Can include. The drive mechanism 12 may further include a mechanism that drives the substrate holding portion 11 with respect to at least one of the θZ axis, the Z axis, the θX axis, and the θY axis. The mold holding mechanism 30 has a plurality of axes (for example, three axes of Z-axis, θX-axis, and θY-axis, preferably six axes of X-axis, Y-axis, Z-axis, θX-axis, θY-axis, and θZ-axis). ) Can be configured to drive. In this case, the mold holding mechanism 30 can be understood as a mold driving mechanism.

The substrate driving mechanism 10 and the mold holding mechanism 30 may form a relative driving mechanism 60 that drives at least one of the substrate S and the mold M so that the relative positions of the substrate S and the mold M are adjusted. The adjustment of the relative position by the relative drive mechanism 60 includes the contact of the mold M with the imprint material IM on the substrate S and the drive for separating the mold M from the cured product of the imprint material.

The imprint device IMP includes a dispenser (arrangement mechanism) 20 for arranging the imprint material IM on the substrate S. The dispenser 20 includes a discharge port for discharging the imprint material IM. The dispenser 20 is driven from the discharge port in a state in which the substrate S is driven in the direction parallel to the X axis (± X direction) by the substrate drive mechanism 10 so that the imprint material IM is arranged at the target position of the substrate S. Discharge the imprint material IM.

The imprint device IMP further includes a first suction port 51 and a second suction port 52 for sucking gas. The first suction port 51 and the second suction port 52 may be provided in a structure integrated with the dispenser 20, or may be provided in a structure separate from the dispenser 20. The first suction port 51 and the second suction port 52 are arranged apart from each other in a direction parallel to the X axis so as to sandwich the dispenser 20 (the discharge port). The first suction port 51 is arranged on the side in the first direction (−X direction) parallel to the X axis with respect to the second suction port 52. The first suction port 51 is connected to a low pressure source (for example, a suction pump, a vacuum source, etc.) 50 via a first flow rate controller 53. The second suction port 52 is connected to the low pressure source 50 via the second flow rate controller 54.

The imprint device IMP may include a receiving portion 19 that receives the imprint material IM discharged from the dispenser 20. The receiving portion 19 receives the imprint material IM discharged from the dispenser 20 in the maintenance mode for maintaining the characteristics of the dispenser 20. The receiving portion 19 may be provided on the substrate holding portion 11, for example, may be mounted on the substrate holding portion 11 in the maintenance mode, or may be conveyed directly under the dispenser 20 by a conveying mechanism (not shown) in the maintenance mode. May be done.

The imprint device IMP includes a curing portion 40 that cures the imprint material IM by irradiating the imprint material IM between the substrate S and the mold M with energy for curing (for example, light such as ultraviolet light). .. Further, the imprint device IMP includes a substrate drive mechanism 10, a mold holding mechanism 30, a dispenser 20, a first flow rate controller 53, a second flow rate controller 54, and a control unit 70 that controls a curing unit 40. The control unit 70 is, for example, a PLD (abbreviation for Programmable Logic Device) such as FPGA (abbreviation for Field Programmable Gate Array), or an ASIC (application specific specialized integrated circuit) or an abbreviation for an ASIC (application specific integrated circuit) integrated circuit. It may consist of a computer or a combination of all or part of these.

Here, the pattern forming operation by the imprint device IMP will be described. First, the imprint material IM is arranged by the dispenser 20 in the shot region to be patterned among the plurality of shot regions of the substrate S. In this operation, the imprint material is discharged from the dispenser 20 while driving the substrate S by the substrate drive mechanism 10 so that the imprint material is arranged at the position specified by the map showing the arrangement of the imprint material in the shot area. It is done by doing. This map is also called a drop recipe.

Next, the shot region to be patterned on the substrate S and the mold M are aligned by the relative drive mechanism 60 composed of the substrate drive mechanism 10 and the mold holding mechanism 30. Next, the relative position of the substrate S and the mold M is adjusted by the relative drive mechanism 60 so that the imprint material IM on the shot region to be patterned and the pattern region of the mold M come into contact with each other. Next, while the relative position between the shot region to be patterned and the mold M is measured by an alignment scope (not shown), the shot region and the mold M are aligned by the relative drive mechanism 60. In parallel with this, the imprint material IM is filled in the recesses forming the pattern arranged in the pattern region of the mold M by the capillary phenomenon.

Next, the imprint material IM is cured by the cured portion 40. As a result, a pattern consisting of the cured portion of the imprint material IM is formed on the shot region of the substrate. Next, the relative positions of the substrate S and the mold M are adjusted by the relative drive mechanism 60 so that the pattern formed by the cured portion of the imprint material IM and the mold M are separated. The above operation is performed on a plurality of shot regions of the substrate S.

FIG. 2 illustrates the configuration of the substrate S driven by the substrate driving mechanism 10 and the discharge port of the dispenser 20 when the imprint material IM is arranged with respect to the shot region of the substrate S to be patterned. The shot area with reference numeral 3 (shot area with cross-hatching) indicates a shot area that has already undergone pattern formation processing. The shot area with reference numeral 4 (the shot area with hatching) indicates the shot area to be patterned. The shot area with reference numeral 5 (the shot area indicated by the white rectangle) indicates the shot area in which the pattern should be formed thereafter.

In one example, the imprint material IM can be discharged from the dispenser 20 according to the map while the substrate S is driven in the first direction (−X direction) by the substrate drive mechanism 10. This operation is called the first operation. After that, the imprint material IM is discharged from the dispenser 20 according to the map while the substrate S is driven in the second direction (+ X direction) opposite to the first direction by the substrate drive mechanism 10. This operation is called a second operation. The placement of the imprint material with respect to one shot region of the substrate S can be completed by one first operation and one second operation.

The dispenser 20 may have a first discharge port row 21 and a second discharge port row 22. The first discharge port row 21 is composed of a plurality of first discharge ports that discharge the imprint material IM when the substrate S is driven in the first direction (−X direction). The second discharge port row 22 may be composed of a plurality of second discharge ports that discharge the imprint material IM when the substrate S is driven in the second direction (+ X direction). In this example, the plurality of first discharge ports forming the first discharge port row 21 are arranged in a direction parallel to the Y axis (second axis), and the plurality of second discharge ports forming the second discharge port row 22 are arranged. Are lined up in a direction parallel to the Y axis. The length of the first discharge port row 21 and the second discharge port row 22 in the direction parallel to the Y axis is the length of the shot area in the direction parallel to the Y axis (shot area specified by the specifications of the imprint device IMP). Can be set longer than the maximum length of).

In the example shown in FIG. 2, the first discharge port row 21 is arranged between the second discharge port row 22 and the first suction port 51. Instead of such a configuration, a configuration in which the first discharge port row 21 is arranged between the second discharge port row 22 and the second suction port 52 may be adopted.

Of the plurality of shot regions of the substrate S, the shot regions arranged in the direction parallel to the X axis (first axis) are from the shot regions arranged in the second direction (+ X direction) (first direction (−X direction)). ) In order, a pattern consisting of a cured product of the imprint material can be formed. This is advantageous for preventing the imprint material IM from adhering to the pattern in the shot region where the pattern has already been formed.

FIG. 3A schematically shows the first operation, that is, the operation in which the imprint material is discharged from the dispenser 20 while the substrate S is driven in the first direction (−X direction) by the substrate drive mechanism 10. Has been done. Further, FIG. 3A schematically shows the amount of gas sucked by the first suction port 51 and the second suction port 52. Typically, the imprint material can be discharged from the dispenser 20 while the substrate S is driven in the first direction (−X direction) DIR1 at a constant velocity by the substrate drive mechanism 10. The main drop D1 is discharged as the imprint material IM from the discharge port of the dispenser 20. At this time, mist D2 of the imprint material IM may be generated. Since the substrate holding portion 11 holding the substrate S moves in the first direction (−X direction), a gas flow F1 along the first direction DIR1 is generated on the substrate S.

Therefore, in a state where the substrate S is driven in the first direction by the substrate drive mechanism 10 and the imprint material IM is discharged from the dispenser 20, the first suction port 51 and the second suction port 51 and the second suction port 51 are not obstructed so as not to obstruct the gas flow F1. The amount of gas sucked by the suction port 52 can be controlled. Specifically, the first flow rate controller 53 and the second flow rate controller 54 are operated by the control unit 70 so that the amount of gas sucked by the first suction port 51 is larger than the amount of gas sucked by the second suction port 52. Can be controlled. Such an operation also has an aspect of assisting the gas flow F1 formed by driving the substrate S by the substrate driving mechanism 10.

Here, in the first operation, the gas can also be sucked by the second suction port 52. That is, the amount of gas sucked by the second suction port 52 in the first operation can be set to be larger than 0. Therefore, in a state where the imprint material IM is discharged from the dispenser 20, gas can be sucked by both the first suction port 51 and the second suction port 52. This is effective in preventing the mist and / or particles captured by the second suction port 52 from falling out of the second suction port 52.

As described above, in the first operation, in the state where the substrate S is driven in the first direction by the substrate driving mechanism 10, the amount of gas sucked by the first suction port 51 is increased so as not to obstruct the gas flow F1. The amount is larger than the amount of gas sucked by the second suction port 52. As a result, in the first operation, the influence of the gas flow on the imprint material discharged from the dispenser 20 is kept constant. Therefore, the position of the imprint material arranged on the substrate S can be accurately controlled. For example, if the placement error of the imprint material (shift amount with respect to the target position) caused by the gas flow F1 is ΔX, the timing of discharging the imprint material from the dispenser 20 may be corrected based on ΔX.

When the substrate S is driven in the first direction by the substrate driving mechanism 10, if the amount of gas sucked by the first suction port 51 is smaller than the amount of gas sucked by the second suction port 52, gas stagnation or stagnation occurs. Turbulence can occur. In this case, it is difficult to keep the influence of the gas flow on the imprint material constant.

FIG. 3B schematically shows a second operation, that is, an operation in which the imprint material is discharged from the dispenser 20 while the substrate S is driven in the second direction (+ X direction) by the substrate drive mechanism 10. ing. Further, FIG. 3B schematically shows the amount of gas sucked by the first suction port 51 and the second suction port 52. Typically, the imprint material can be discharged from the dispenser 20 while the substrate S is driven in the second direction (+ X direction) DIR2 at a constant velocity by the substrate drive mechanism 10. As described above, the main drop D1 is discharged as the imprint material IM from the discharge port of the dispenser 20. At this time, mist D2 of the imprint material IM may be generated. Since the substrate holding portion 11 holding the substrate S moves in the second direction (+ X direction), a gas flow F2 along the second direction DIR2 is generated on the substrate S.

Therefore, in a state where the imprint material IM is discharged from the dispenser 20 while the substrate S is driven in the second direction by the substrate drive mechanism 10, the first suction port 51 and the second suction port 51 and the second are not obstructed by the gas flow F2. The amount of gas sucked by the suction port 52 can be controlled. Specifically, the first flow rate controller 53 and the second flow rate controller 54 are operated by the control unit 70 so that the amount of gas sucked by the second suction port 52 is larger than the amount of gas sucked by the first suction port 51. Can be controlled. Such an operation also has an aspect of assisting the gas flow F2 formed by driving the substrate S by the substrate driving mechanism 10.

Here, in the second operation, the gas can also be sucked by the first suction port 51. That is, the amount of gas sucked by the first suction port 51 in the second operation can be set to be larger than 0. Therefore, in a state where the imprint material IM is discharged from the dispenser 20, gas can be sucked by both the first suction port 51 and the second suction port 52. This is effective in preventing the mist and / or particles captured by the first suction port 51 from falling off from the first suction port 51.

As described above, in the second operation, in the state where the substrate S is driven in the second direction by the substrate driving mechanism 10, the amount of gas sucked by the second suction port 52 is increased so as not to obstruct the gas flow F2. The amount is larger than the amount of gas sucked by the first suction port 51. As a result, in the second operation, the influence of the gas flow on the imprint material discharged from the dispenser 20 is kept constant. Therefore, the position of the imprint material arranged on the substrate S can be accurately controlled. For example, if the placement error of the imprint material (shift amount with respect to the target position) caused by the gas flow F2 is ΔX, the timing of discharging the imprint material from the dispenser 20 may be corrected based on ΔX.

When the substrate S is driven in the second direction by the substrate driving mechanism 10, if the amount of gas sucked by the second suction port 52 is smaller than the amount of gas sucked by the second suction port 51, gas stagnation or stagnation occurs. Turbulence can occur. In this case, it is difficult to keep the influence of the gas flow on the imprint material constant.

The amount of gas sucked by the first suction port 51 and the amount of gas sucked by the second suction port 52 can be changed during a period different from the period during which the imprint material IM is discharged from the dispenser 20 while the substrate S is being driven. .. Specifically, first, the first flow rate controller 53 and the second flow rate controller 54 control units so that the amount of gas sucked by the first suction port 51 is larger than the amount of gas sucked by the second suction port 52. Can be controlled by 70. Then, the first operation can be carried out. Next, the first flow rate controller 53 and the second flow rate controller 54 can be controlled by the control unit 70 so that the amount of gas sucked by the second suction port 52 is larger than the amount of gas sucked by the first suction port 51. .. Then, the second operation can be carried out.

FIG. 4 schematically shows the operation in the maintenance mode. In the maintenance mode, the imprint material IM is discharged from the dispenser 20 in a state where the receiving portion 19 is arranged directly under the dispenser 20. In the maintenance mode, the substrate holding portion 11 holding the substrate S is stationary. As described above, the main drop D1 is discharged as the imprint material IM from the discharge port of the dispenser 20. At this time, mist D2 of the imprint material may be generated. In the maintenance mode, since the substrate holding portion 11 holding the substrate S is stationary, no gas flow is generated due to the movement of the substrate holding portion 11.

Therefore, in the maintenance mode, the amount of gas sucked by the first suction port 51 and the second suction port 52 can be controlled so as not to generate a gas flow. Specifically, it is preferably 0.95 or more so that the ratio of the gas suction amount by the second suction port 52 to the gas suction amount by the first suction port 51 is 0.8 or more and 1.2 or less. The first flow rate controller 53 and the second flow rate controller 54 can be controlled by the control unit 70 so as to be 1.05 or less, more preferably 1.

The amount of gas sucked by the first suction port 51 and the second suction port 52 in the maintenance mode is less than the amount of gas sucked by the first suction port 51 in the first operation, and the amount of gas sucked by the second suction port 52 in the first operation. It can be set more than the suction amount. Alternatively, the amount of gas sucked by the first suction port 51 and the second suction port 52 in the maintenance mode is smaller than the amount of gas sucked by the second suction port 52 in the second operation, and is by the first suction port 51 in the second operation. It can be set more than the suction amount of gas. The pattern of the cured product formed by using the imprint device is used permanently for at least a part of various articles or temporarily in manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting.

The pattern of the cured product is used as it is as a constituent member of at least a part of the above-mentioned article, or is temporarily used as a resist mask. The resist mask is removed after etching, ion implantation, or the like in the substrate processing process.

Next, an article manufacturing method in which a pattern is formed on a substrate by an imprinting apparatus, the substrate on which the pattern is formed is processed, and an article is produced from the processed substrate will be described. As shown in FIG. 5A, a substrate 1z such as a silicon wafer on which a work material 2z such as an insulator is formed on the surface is prepared, and subsequently, the substrate 1z such as a silicon wafer is inserted into the surface of the work material 2z by an inkjet method or the like. The printing material 3z is applied. Here, a state in which a plurality of droplet-shaped imprint materials 3z are applied onto the substrate is shown.

As shown in FIG. 5B, the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side on which the uneven pattern is formed facing. As shown in FIG. 5C, the substrate 1 to which the imprint material 3z is applied is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the work material 2z. In this state, when light is irradiated through the mold 4z as energy for curing, the imprint material 3z is cured.

As shown in FIG. 5D, when the mold 4z and the substrate 1z are separated from each other after the imprint material 3z is cured, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. The pattern of the cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the concave-convex pattern of the mold 4z is transferred to the imprint material 3z. It will be done.

As shown in FIG. 5E, when etching is performed using the pattern of the cured product as an etching resistant mask, the portion of the surface of the work material 2z that has no cured product or remains thin is removed, and the groove 5z is formed. Become. As shown in FIG. 5 (f), when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the work material 2z can be obtained. Here, the pattern of the cured product is removed, but it may not be removed even after processing, and may be used, for example, as a film for interlayer insulation contained in a semiconductor element or the like, that is, as a constituent member of an article.

IMP: Imprint device, S: Substrate, M: Mold, 10: Substrate drive mechanism, 11: Substrate holder, 12: Drive mechanism, 19: Receiver, 20: Dispenser, 21: First discharge port row, 22: 2nd discharge port row, 30: mold holding mechanism, 40: hardened part, 50: low pressure source, 51: 1st suction port, 52: 2nd suction port, 53: 1st flow controller, 54: 2nd flow control Vessel, 70: Control unit

Claims (12)

An imprinting device that uses a mold to form a pattern consisting of a cured product of an imprinting material on a substrate.
A substrate drive mechanism that drives the substrates with respect to the first and second axes that are orthogonal to each other.
A mold holding mechanism for holding the mold and
A dispenser having a discharge port for discharging the imprint material so that the imprint material is arranged on the substrate in a state where the substrate is driven in a direction parallel to the first axis by the substrate drive mechanism. ,
It is provided with a first suction port and a second suction port which are arranged apart from each other in a direction parallel to the first axis so as to sandwich the discharge port and suck gas.
The first suction port is arranged on the side in the first direction parallel to the first axis with reference to the second suction port.
In a state where the imprint material is discharged from the dispenser while the substrate is driven in the first direction by the substrate driving mechanism, the amount of gas sucked by the first suction port is the suction of gas by the second suction port. More than the amount,
An imprinting device characterized by this. In a state where the substrate is driven in the second direction opposite to the first direction while being parallel to the first axis by the substrate driving mechanism and the imprint material is discharged from the dispenser, the second suction port is used. The amount of gas sucked is larger than the amount of gas sucked by the first suction port.
The imprinting apparatus according to claim 1. The arrangement of the imprint material with respect to one shot region of the substrate includes one first operation in which the imprint material is discharged from the dispenser while the substrate is driven in the first direction by the substrate drive mechanism. It is completed by one second operation in which the imprint material is discharged from the dispenser while the substrate is driven in the second direction by the substrate drive mechanism.
The imprinting apparatus according to claim 2. The dispenser has, as a plurality of discharge ports including the discharge port, a first discharge port row including a plurality of first discharge ports for discharging the imprint material when the substrate is driven in the first direction. It has a second discharge port row including a plurality of second discharge ports for discharging the imprint material when the substrate is driven in the second direction.
The imprinting apparatus according to claim 2 or 3. The plurality of first discharge ports forming the first discharge port row are arranged in a direction parallel to the second axis, and the plurality of second discharge ports forming the second discharge port row are the second. Lined up in a direction parallel to the axis,
The imprinting apparatus according to claim 4. The lengths of the first discharge port row and the second discharge port row in the direction parallel to the second axis are longer than the length of the shot region of the substrate in the direction parallel to the second axis.
The imprinting apparatus according to claim 5. The first discharge port row is arranged between the second discharge port row and the first suction port.
The imprinting apparatus according to claim 5 or 6. The first discharge port row is arranged between the second discharge port row and the second suction port.
The imprinting apparatus according to claim 5 or 6. In a state where the imprint material is discharged from the dispenser, gas is sucked by both the first suction port and the second suction port.
The imprinting apparatus according to any one of claims 1 to 8. Further provided with a receiving portion for receiving the imprint material discharged from the dispenser,
In a state where the imprint material is discharged from the dispenser toward the receiving portion, the ratio of the suction amount of gas by the second suction port to the suction amount of gas by the first suction port is 0.8 or more. 1.2 or less,
The imprinting apparatus according to any one of claims 1 to 9. Of the plurality of shot regions of the substrate, the shot regions arranged in the direction parallel to the first axis are from the shot regions arranged in the second direction parallel to the first axis and opposite to the first direction. In order, a pattern made of a cured product of the imprint material is formed.
The imprinting apparatus according to any one of claims 1 to 10. A step of forming a pattern on a substrate using the imprinting apparatus according to any one of claims 1 to 11.
A step of processing the substrate on which the pattern is formed in the step and a step of processing the substrate.
A method for producing an article, which comprises the present invention and comprises producing an article from a substrate on which the treatment has been performed.

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