JP2019026926A - Vapor deposition mask - Google Patents

Abstract

To provide a vapor deposition mask capable of improving an accuracy relating to vapor deposition by optimizing strength setting based on a cross-sectional profile of a frame to suppress deformation of a mask body by the frame and prevent shift of the mask body from a correct position.SOLUTION: A cross sectional profile of a minimum width part in an inner frame part of a frame 3 is optimized to make a relation of its width and thickness suitable. A flexure rigidity at the minimum width part is appropriately provided, so that a sufficient strength against force form a mask body 2 side is provided. Together with another part of the frame 3 which is wider and has strength higher than that of the minimum width part, a deviation in position of each part of the mask body 2 as a whole frame 3 from a proper position is suppressed, so that an alignment status between a mask in a vapor deposition process and a substrate to be deposited is secured, resulting in a precise vapor deposition on a proper position of the substrate to be deposited.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a vapor deposition mask used, for example, when forming a light emitting layer of an organic EL element by a vapor deposition mask method.

  As a method for forming a light emitting layer of an organic EL (Electroluminescence) element, a vapor deposition mask method is often used. In this vapor deposition mask method, a vapor deposition mask in which a portion corresponding to the vapor deposition portion of the substrate is removed and perforated is used in order to vapor-deposit and form an organic light emitting material on a substrate made of a transparent material such as glass.

  In a vapor deposition apparatus that performs vapor deposition, the vapor deposition mask is installed in a state where the vapor deposition mask is correctly aligned with respect to the substrate to be vapor deposited, and vapor deposition is performed. However, during vapor deposition, heating is generally performed in order to make the inside of the vapor deposition apparatus capable of vapor deposition. Therefore, when the thermal deformation state of the vapor deposition mask and the glass substrate is different, the relative positional relationship between the vapor deposition mask and the substrate changes. There is a problem that the required accuracy of the light emitting layer to be formed cannot be satisfied.

In recent years, by adopting a mask structure in which a reinforcing frame made of a material having a thermal expansion coefficient equivalent to that of a deposition target substrate such as glass or a low thermal expansion coefficient is attached to the outer peripheral edge of a thin mask body, Even if a mask body made of a material having a different thermal expansion coefficient from that of the deposition substrate is used, the shape of the mask body changes following the expansion of the frame having the same thermal expansion coefficient as the deposition substrate, or a low thermal expansion coefficient. Vapor deposition that can be controlled by a frame body having no change in shape, can ensure the alignment accuracy of the mask body with the substrate to be deposited at the time of temperature rise in the deposition apparatus, and can form a light emitting layer on the substrate to be deposited with high accuracy. Masks have been proposed.
An example of such a conventional vapor deposition mask is disclosed in Japanese Patent Application Laid-Open No. 2005-15908.

JP 2005-15908 A

The conventional vapor deposition mask has a configuration shown in Patent Document 1 described above, and can suppress relative deformation of the mask and the substrate due to a difference in thermal expansion coefficient, thereby preventing a significant deterioration in the positional accuracy of the vapor deposition product.
However, in the market, there is a demand for higher accuracy of the deposited product, and it is required to further suppress the occurrence of displacement due to the displacement of the mask.

  As for the conventional combined structure of the mask body and the frame, it is easy to increase the thickness of the frame in order to ensure the strength of the frame that can resist the mask body to be displaced. If the body becomes too thick, the thickness is simply increased because the frame prevents the deposition material, such as organic light-emitting substances, from propagating to the through holes of the mask body. I couldn't make it. Also, if the frame becomes thick to some extent, the weight of the frame also increases, causing problems such as bending due to the weight of the frame itself, which in turn affects the mask body and deteriorates the positional accuracy. It was. For this reason, it is realistic to increase the strength by increasing the thickness of the frame to increase the accuracy of the mask, and there is a limit value for the thickness that can be applied. That wasn't true.

  In addition, when forming a frame from a metal plate material that is generally distributed and easily available, since such a plate material is manufactured through a process such as rolling, a considerable amount of distortion due to the processing remains in the plate material. It is in the state. The influence of the internal strain of the plate material generated in the manufacturing process becomes more prominent as the plate thickness increases. Therefore, as the plate thickness of the frame is increased, that is, the thickness of the plate material used for the frame is increased, the distortion is reduced when the frame is finally obtained from the plate material by further processing such as cutting. Appearing as a slight warp of the body, the shape of the frame should not be exactly realized, and the accuracy of the mask is adversely affected. From these points, it can be said that it is difficult to increase the strength by simply increasing the thickness of the frame.

  In addition, as a metal plate material used for the frame body, a plate material without distortion produced by special processing or a plate material that has been subjected to internal stress relief processing in advance is used so that the frame body is not affected by distortion. However, it is not possible to obtain a frame economically because the plate material without stress and the stress removal treatment are expensive.

  As described above, in the conventional mask structure, it is difficult in terms of the strength of the frame body to keep the displacement of the mask body within an allowable range that becomes severe as accuracy increases, and the yield is not deteriorated due to the misalignment of the deposited product. It had the problem that it was not possible.

  The present invention has been made to solve the above-mentioned problems, and by optimizing the strength setting based on the cross-sectional shape of the frame body, the frame body can appropriately suppress the deformation of the mask body, and the mask body can be moved from the correct position. An object of the present invention is to provide a vapor deposition mask that prevents deviation and improves the accuracy of vapor deposition.

  A vapor deposition mask according to the present disclosure includes a plurality of mask main bodies provided with a plurality of independent vapor deposition through holes in a predetermined pattern, and a frame disposed around the mask main body. The mask body having a rectangular or rectangular outer frame located on the outermost periphery and an inner frame that divides the inside of the outer frame into a plurality of opening regions, and is formed in a lattice shape as a whole. Are located in a plurality of opening regions in the frame body and integrated with the frame body, and the cross-sectional shape of the narrowest portion of the inner frame portion of the frame body is the thickness with respect to the width dimension. A rectangular cross section having a dimensional ratio of 0.8 / 5 to 2/5.

As described above, according to the disclosure of the present invention, the cross-sectional shape of the minimum width portion in the inner frame portion of the frame body is set so that the relationship between the width and the thickness is appropriate, and the bending rigidity ( By giving the resistance to bending deformation) properly, the necessary and sufficient strength against the force from the mask body side is given, and the frame is combined with the other part of the frame wider and stronger than this minimum width part. The entire body can be prevented from being displaced from the original position of each part of the mask body, the alignment state of the mask and the deposition substrate in the deposition process can be secured, and the deposition can be accurately performed at an appropriate position of the deposition substrate.
Further, due to the difficulty of bending deformation of the minimum width portion, bending due to the weight of the minimum width portion can be suppressed, and deformation of the frame body and its influence on the mask body can be suppressed.

  In addition, in the vapor deposition mask according to the disclosure of the present invention, as necessary, each cross-sectional shape in a portion other than the narrowest portion of the outer frame portion and the inner frame portion in the frame body has a thickness with respect to the width dimension. The ratio of the dimension is 0.8 / 90 or more, and the rectangular cross section is made smaller than the ratio of the thickness dimension to the width dimension at the narrowest portion of the inner frame portion.

  As described above, according to the disclosure of the present invention, each part other than the minimum width part in the frame body has an appropriate cross-sectional shape, and a thickness dimension of a certain degree or more with respect to the width dimension is set in each part of the frame body so that it is difficult to bend. By providing the necessary minimum bending rigidity, the frame body can sufficiently secure the strength against the force from the mask body side, suppressing the deformation of the frame body and the effect on the mask body, and the through hole of the mask body The accuracy related to the position is increased, and highly accurate vapor deposition for the vapor deposition target is enabled.

  Moreover, the vapor deposition mask which concerns on this indication is formed so that the said frame may be 0.8 mm or more and 2 mm or less in thickness as needed.

  As described above, according to the disclosure of the present invention, by setting the thickness dimension of the cross-sectional shape so as not to become too large in the range of the practical width dimension in which the cross-sectional shape which is difficult to bend in each part of the frame body is obtained. In addition, it is possible to obtain a highly accurate frame body by suppressing the occurrence of bending due to its own weight and deformation of internal strain at each part of the frame body, and it is possible to perform vapor deposition with high accuracy. In addition, by not increasing the thickness more than necessary, it is possible to suppress an increase in the weight of the frame body and to prevent deterioration of the handleability of the vapor deposition mask.

  Further, the vapor deposition mask according to the disclosure of the present invention has a laminated structure in which the frame body is integrated by overlapping the first frame member and the second frame member as necessary, and the first frame member and the first frame member The two-frame member is a warped frame member formed from a metal thin plate material, and each warp direction is reversed.

  Thus, according to the disclosure of the present invention, the frame has a laminated structure in which the first frame member and the second frame member made of a thin metal plate material are joined and integrated, and the first frame member having warpage. And the second frame member are stacked and arranged so that their warping directions are opposite to each other to form a frame, so that the warpage is offset in the frame and a flat state is obtained, improving the flatness. The obtained frame can be obtained at a lower cost, and the vapor deposition can be efficiently performed while improving the shape accuracy of the mask. In addition, since the frame body has a configuration in which the first frame member and the second frame member are combined, the frame body has a thickness that may cause warping when a single thin plate material is used. Even when it has reached, it is possible to prevent unnecessary deformation such as warpage, and it is possible to obtain a mask structure with increased strength without adversely affecting the positional accuracy of the mask body. Can be executed with accuracy.

  Further, in the vapor deposition mask according to the disclosure of the present invention, the frame body is formed by changing the material of the inner frame portion and the material of the outer frame portion as necessary.

  Thus, according to the disclosure of the present invention, the inner frame portion and the outer frame portion of the frame body are made of different materials, and different properties are given to the inner frame portion and the outer frame portion, for example, the outer frame portion. When a material with higher specific strength than the inner frame is used for the part, the mask body can be reinforced efficiently by suppressing deformation based on the force from the mask body mainly at the outer frame. Accuracy can be increased. In addition, for example, when a material having a smaller linear expansion coefficient than the outer frame portion is used for the inner frame portion of the frame body, the displacement of each position of the mask due to the thermal deformation of the mask body in the temperature rising state in the vapor deposition process etc. The inner frame portion adjacent to the main body can be efficiently suppressed, and the positional relationship between the mask and the deposition target substrate in the normal temperature state can be reliably maintained even in the elevated temperature state, and the deposition can be performed with high accuracy.

It is a schematic plan view of the vapor deposition mask which concerns on one Embodiment of this invention. It is principal part structure explanatory drawing of the vapor deposition mask which concerns on one Embodiment of this invention. It is a principal part schematic sectional drawing of the vapor deposition mask which concerns on one Embodiment of this invention. It is a top view of the frame in the vapor deposition mask which concerns on one Embodiment of this invention. It is forming process explanatory drawing of the frame in the vapor deposition mask which concerns on one Embodiment of this invention. It is primary pattern resist formation process explanatory drawing in manufacture of the vapor deposition mask which concerns on one Embodiment of this invention. It is primary electrodeposition layer formation process explanatory drawing in manufacture of the vapor deposition mask which concerns on one Embodiment of this invention. It is explanatory drawing of the first half of the secondary pattern resist formation process in manufacture of the vapor deposition mask which concerns on one Embodiment of this invention. It is a latter half explanatory drawing of the secondary pattern resist formation process in manufacture of the vapor deposition mask which concerns on one Embodiment of this invention. It is pressure-bonding process explanatory drawing of the frame in manufacture of the vapor deposition mask which concerns on one Embodiment of this invention. It is a metal layer formation process in manufacture of the vapor deposition mask which concerns on one Embodiment of this invention, and the isolation | separation state explanatory drawing of a vapor deposition mask and a mother mold. It is a schematic plan view of the other example of the vapor deposition mask which concerns on one Embodiment of this invention. It is the top view and schematic sectional drawing of the other frame in the vapor deposition mask which concerns on one Embodiment of this invention.

Hereinafter, a vapor deposition mask according to an embodiment of the present invention will be described with reference to FIGS. In this embodiment, an example applied to a vapor deposition mask for organic EL elements will be described.
In each of the drawings, the vapor deposition mask 1 according to the present embodiment is configured to include a plurality of mask bodies 2 provided with a plurality of vapor deposition through holes 8 in a predetermined pattern, and a frame body 3 arranged around the mask body 2. is there.

  The mask body 2 is formed into a sheet by electroforming using a nickel alloy such as nickel or nickel cobalt, or other electrodeposited metal, and has a large number of independent vapor deposition through holes 8 through which the vapor deposition material passes. It is the structure which is made.

The mask body 2 includes an internal pattern forming region 2a provided with a large number of vapor deposition through holes 8, and an outer peripheral edge 2b joined integrally with the frame body 3 through a metal layer 7 formed by plating. In the pattern formation region 2a, a large number of vapor deposition through holes 8 are used for forming a light emitting layer, and a plurality of through hole groups arranged linearly in the front-rear direction are arranged in rows, and the plurality of rows are arranged in parallel in the left-right direction. A matrix-shaped vapor deposition pattern 9 is formed.
The thickness of the mask body 2 is preferably in the range of 5 to 20 μm, and is set to 8 μm in this embodiment.

  The frame body 3 is a plate-like body that is thicker than the mask body 2 and has a rectangular frame shape. The frame body 3 is disposed around the outside of the mask body 2 to reinforce the mask body 2 and is connected to the mask body 2. It is the structure integrated. Specifically, the frame body 3 includes a rectangular outer frame portion 4 positioned on the outermost periphery and an inner frame portion 5 that partitions the inside of the outer frame portion 4 into a plurality of opening regions 6. Are formed in a lattice shape. The mask body 2 is positioned in each opening region 6 partitioned by the inner frame portion 5 of the frame body 3 and is integrated with the frame body 3 via the metal layer 7.

This frame 3 has a cross-sectional shape of the narrowest portion of the inner frame portion 5 with a ratio of the thickness dimension T to the width dimension W (aspect ratio) of not less than 0.8 / 4. It is the structure made into the following rectangular cross section.
On the other hand, in each of the cross-sectional shapes other than the narrowest portion of the outer frame portion 4 and the inner frame portion 5 of the frame body 3, the ratio (aspect ratio) of the thickness dimension T to the width dimension W is 0.8. The rectangular cross section is / 90 or more.

  And the outer frame part 4 and the inner frame part 5 in the frame 3 are made into uniform thickness, and the thickness dimension is 0.2 mm or more and 6 mm or less, preferably 0.8 mm or more and 3 mm or less, more preferably 2 mm. , And so on. Here, the thickness dimension is preferably 0.8 mm or more. When the thickness dimension of each part of the frame is less than 0.8 mm, the strength of the frame is determined by the tension (tensile stress) inherent in the mask body. This is because there is a risk of deformation without being able to compete.

  On the other hand, if the thickness of each part of the frame exceeds 2 mm, a so-called shadow problem may occur during vapor deposition (the frame may become an obstacle that prevents the progress of the vapor deposition material). Since the thickness of the matrix is usually 1 mm, it is difficult to handle the frame body after pressure bonding, and therefore the thickness dimension is preferably 2 mm or less.

In the present embodiment, the width dimension W ₁ of the narrowest part (minimum width part) of the inner frame part 5 is 4 mm, and the width dimension W ₂ of the widest part (maximum width part) is about 90 mm. . If the width dimension of the minimum width portion is less than 4 mm, the width dimension is preferably set to 4 mm or more because the strength of the frame cannot cope with the tension (tensile stress) inherent in the mask body. .

  In addition, when the width dimension of the maximum width portion exceeds 90 mm, the number of mask bodies (number of pieces) that can be formed on one matrix is excessively reduced, and the mask manufacturing efficiency is lowered. 90 mm or less is preferable.

  Thus, the frame 3 is formed in a shape that satisfies the condition that the ratio of the thickness dimension T to the width dimension W of the minimum width part is a value within the above range. . In this way, the aspect ratio of the cross-sectional shape of the minimum width portion is set within a predetermined range so that an appropriate thickness that is not excessive with respect to the width is ensured, and the resistance to deformation due to bending of the minimum width portion based on the cross-sectional shape ( (Rigidity) is appropriately given to make it difficult for the minimum width portion to be bent due to its own weight, and to ensure the strength against the force of deforming the frame body 3 from the mask body side. This suppresses the influence on the mask main body 2 and increases the accuracy related to the through-hole position of the mask main body 2, thereby enabling highly accurate vapor deposition on the vapor deposition target.

  Moreover, in each part other than the minimum width part of the frame 3, as a cross-sectional shape capable of providing the necessary bending rigidity, the thickness with respect to the width dimension is appropriately secured while sufficiently securing the strength against the force from the mask body side. By setting to, an increase in the weight of the frame body 3 due to an unnecessarily large thickness (cross-sectional area) is suppressed, and the deflection due to the weight of the entire deposition mask and its own weight is prevented.

  On the other hand, the frame 3 is configured to have a laminated structure in which the first frame member 3a and the second frame member 3b having the same shape are stacked and joined together with an adhesive interposed therebetween. The 1st frame member 3a and the 2nd frame member 3b are the frame members formed from the metal thin plate raw material manufactured through the same thin plate manufacturing process, and the curvature based on the internal distortion of the metal thin plate raw material derived from a thin plate manufacturing process And has a laminated structure as the frame 3 with the respective warping directions reversed.

  Thus, the first frame member 3a and the second frame member 3b having the same shape formed by processing such as cutting from a thin metal plate material manufactured through the same thin plate manufacturing process, specifically, a rolling process, are respectively warped. In the opposite direction, the warping is canceled out in the frame body 3 obtained by joining and integrating with an adhesive, and a flat state is obtained (see FIG. 5). In FIG. 5, the magnitude of warpage in the first frame member 3 a and the second frame member 3 b is exaggerated for easy understanding, and the actual warpage is extremely small. However, if these warpages appear in the frame 3 as they are, they affect the mask body 2 and deteriorate the accuracy related to the position, and this is a size that can hinder the accuracy of the vapor deposition mask. Warp is eliminated by the above laminated structure.

  In the present embodiment, as the adhesive, a sheet-like uncured photosensitive dry film resist is used between the first frame member 3a and the second frame member 3b. After joining the first frame member 3a and the second frame member 3b, the resist unnecessary portions other than the portion that becomes the adhesive layer 3c between the first frame member 3a and the second frame member 3b are removed. In addition to this, various commonly available adhesives can be used as the adhesive. In addition, if the flat state in which the warpage is canceled by the joining, that is, the flatness and parallelism of the front and back surfaces of the frame body at the stage of becoming the frame body 3 can be within an allowable range, the first frame member 3a and the first frame member 3a The two-frame member 3b may have different planar shapes, cross-sectional shapes, and warpage sizes.

  The first frame member 3a and the second frame member 3b are joined and integrated with their respective warping directions reversed to form a flat frame body 3, so that the thickness of the frame body 3 is a single thin sheet. Even when the thickness has reached a thickness that may cause warpage when using a plate material, unnecessary deformation such as warpage can be prevented from appearing, and the mask body position accuracy is not adversely affected. It is possible to perform vapor deposition with high accuracy.

  The frame 3 is formed of a material having a low thermal expansion coefficient, for example, a material such as an invar material that is a nickel-iron alloy or a super invar material that is a nickel-iron-cobalt alloy. The frame 3 is connected and integrated with the outer peripheral edge 2b of the pattern forming region 2a of the mask body 2 by a metal layer 7 formed by electroforming so as not to be separated from each other.

  When an invar material or a super invar material is employed as the material of the frame body 3, the dimensional change of the mask body 2 due to the thermal influence in the vapor deposition process can be satisfactorily suppressed because the coefficient of thermal expansion is extremely small. That is, even if the mask body 2 has a larger coefficient of thermal expansion than that of general glass which is a substrate to be deposited (not shown), such as nickel, the coefficient of thermal expansion due to the high temperature during vapor deposition. Because of this difference, there is no deviation between the position of the through hole in the substrate when the deposition mask 1 is aligned with the substrate to be deposited at room temperature and the deposition position of the deposition material during the actual deposition. Due to the small thermal expansion coefficient of the frame 3 that holds the main body 2, the dimensional change and shape change caused by the expansion of the mask main body 2 at the time of temperature rise are well suppressed, and the alignment accuracy at room temperature is increased during the deposition. Sometimes it can be kept good.

  In addition, the material of the frame 3 can also use the material of the low thermal expansion coefficient close | similar to the glass etc. which are vapor deposition substrates, for example, things, such as glass and a ceramic. In this case, conductivity is imparted to at least the surface of these materials.

  The vapor deposition mask 1 has a primary pattern resist 14 provided on the surface of the mother die 10 so as to correspond to the non-arranged portions of the primary electrodeposition layer 15, and then the primary electrode is electroplated on the mother die 10 by electroforming metal. After the deposition layer 15 is formed, the secondary pattern resist 18 covering the portion corresponding to the pattern formation region 2 a of the primary electrodeposition layer 15 is formed, and the frame body 3 is disposed so as to surround the primary electrodeposition layer 15. The metal layer 7 is formed by electroforming so as to cover the surface of the frame body 3 and the surface of the outer peripheral edge 2b of the primary electrodeposition layer 15, and the primary electrodeposition layer 15 and the frame body 3 are formed through the metal layer 7. The integrated primary electrodeposition layer 15, the frame body 3, the metal layer 7, and the mother die 10 are manufactured in a state where they are integrally connected so as not to be separated from each other.

  The mother die 10 used in the manufacturing process of the vapor deposition mask 1 according to the present embodiment is formed of a conductive material such as stainless steel, brass, steel, etc., and until the mask body is separated in the vapor deposition mask manufacturing process. The primary pattern resist 14, the primary electrodeposition layer 15, the secondary pattern resist 18, and the metal layer 7 are formed on the surface side at each stage of the deposition mask manufacturing process. It is formed. When the primary electrodeposition layer 15 and the metal layer 7 are formed, the energization through the mother die 10 is performed, so that electroconductive (plating) is performed on the energizable portion that is not covered with the resist on the surface of the mother die 10. Thus, the primary electrodeposition layer 15 or the metal layer 7 is formed.

  The mother die 10 can be made of a material having a low thermal expansion coefficient such as 42 alloy (42% nickel-iron alloy), Invar (36% nickel-iron alloy), SUS430, or the like. In addition, the mother die may be a metal plate made of a conductive metal such as chromium or titanium on the surface of an insulating substrate such as a glass plate or a resin plate.

  In the manufacturing process of the vapor deposition mask 1, when the metal layer 7 is formed on the mother die 10 by plating (see FIG. 11B), the mother die 10 is separated and removed from these (see FIG. 11C). In the case where the mother die 10 is made of stainless steel, it is preferable to use a method in which force is applied and physically peeled off from the vapor deposition mask side, and when the mother die 10 is other metal material, a chemical solution is used. It is preferable to use an etching method that dissolves and removes. In the case of etching, an etching solution having a selective etching property is used so that the matrix 10 is dissolved but the material forming the primary electrodeposition layer 15, the frame 3, and the metal layer 7 is not affected.

  The primary electrodeposition layer 15 is made of a nickel alloy such as nickel or nickel-cobalt suitable for electroforming, and is formed by electroforming on a portion of the matrix 10 where the primary pattern resist 14 is not present. In the vapor deposition mask 1, the primary electrodeposition layer 15 is formed as a mask main body 2 that covers the surface of the vapor deposition substrate excluding the vapor deposition through holes 8 corresponding to vapor deposition target portions such as a light emitting layer in the vapor deposition substrate. The Rukoto.

  The primary pattern resist 14 is formed of an insulating material having resistance to dissolution with respect to an electrolytic solution used for electroforming the primary electrodeposition layer 15, and the primary electrodeposition layer 15 that is preset on the mother die 10 is not formed. It is arranged corresponding to the arrangement part and is removed after the formation of the primary electrodeposition layer 15 (see FIGS. 6 and 7).

  The primary pattern resist 14 is disposed prior to the formation of the primary electrodeposition layer 15 on the mother die 10, and a photosensitive resist, for example, a negative photosensitive dry film resist is applied to the mother die 10 with a predetermined thickness, For example, it is disposed so as to have a thickness of about 20 μm, and ultraviolet irradiation is performed with a mask film 12 having a predetermined pattern corresponding to the position of the mask body 2 of the vapor deposition mask 1, that is, the position of the primary electrodeposition layer 15. The film is formed in a shape corresponding to the non-arranged portion of the primary electrodeposition layer 15 through processing such as curing by exposure and development for removing the resist in the non-irradiated portion.

  The secondary pattern resist 18 is formed of an insulating material having a resistance to dissolution with respect to an electrolytic solution used for plating of the metal layer 7, and preferably has a thickness in the range of 100 to 120 μm, and is formed on the primary electrodeposition layer 15. The metal layer 7 is disposed prior to the formation of the metal layer 7 so as to correspond to the non-arranged portion of the metal layer 7, and is removed after the formation of the metal layer 7 (see FIGS. 8 and 9).

  The secondary pattern resist 18 is formed by sticking a photosensitive resist, for example, a negative photosensitive dry film resist, on the master 10 and the primary electrodeposition layer 15 that has already been arranged, and at the same time, the metal layer of the vapor deposition mask 1. 7 and a series of steps of performing exposure by ultraviolet irradiation in a state where a mask film 17 having a predetermined pattern corresponding to the position of the frame 3 is placed is repeated once or plural times to obtain a required resist thickness, and then exposed. Through a process such as development for removing the photosensitive material in the non-irradiated portion, the metal layer 7 is formed in a shape corresponding to the non-arranged portion (pattern forming region 2a of the mask body 2).

  The metal layer 7 is formed by plating, and is made of nickel, a nickel-cobalt alloy, or the like, and the secondary pattern resist 18 on the matrix 10, the primary electrodeposition layer 15 and the frame 3 that have already been arranged. In this configuration, the exposed portion is not plated and is formed by plating.

  The metal layer 7 joins the outer peripheral edge 2b of the pattern formation region 2a of the mask body 2 and the frame body 3. The metal layer 7 is laminated by plating on the upper surface of the mask body 2 related to the outer peripheral edge 2b of the pattern formation region. Specifically, the metal layer 7 is formed on the upper surface of the outer peripheral edge 2b of the pattern formation region 2a, the upper surface of the frame body 3 and the side surface on the pattern formation region 2a side, and the gap portion between the mask body 2 and the frame body 3. Thus, the outer peripheral edge 2b of the pattern forming region 2a and the opening peripheral edge of the frame body 3 are integrally connected so as not to leave.

Next, a frame forming process in the vapor deposition mask according to the present embodiment and a manufacturing process of the entire vapor deposition mask including the frame will be described.
First, a process for forming the frame 3 used for reinforcing the mask body 2 will be described.

  First, the first frame member 3a and the second frame member 3b having the same shape are formed by a cutting process by electric discharge machining, laser machining, or the like from a general metal thin plate material that has undergone rolling or the like. When cutting the second frame member 3b from the metal thin plate material, the portion set as the second frame member 3b on the metal thin plate material is provided so that the direction is reversed with respect to the portion of the first frame member 3a, The first frame member 3a and the second frame member 3b are warped due to distortion in opposite directions.

  After cutting, an opening region 6 is provided for each cut out member by etching, laser processing, or the like to complete the first frame member 3a and the second frame member 3b. By interposing an adhesive serving as an adhesive layer 3c between the obtained first frame member 3a and the second frame member 3b and joining and integrating them in a state in which the direction of warping is reversed, each part has a predetermined cross section. A frame 3 having a shape is obtained.

  As an adhesive for integrating the first frame member 3a and the second frame member 3b, for example, a sheet-like photosensitive dry film resist having adhesiveness in an uncured state is used, and a material used in a subsequent process By making it the same, it can be prepared in a form that can be partially diverted from the preparation and replenishment, and there is no need to separately prepare a commercially available adhesive etc. just to make an adhesive layer, such a dedicated adhesion This is preferable because the cost associated with the agent does not occur and the manufacturing cost of the vapor deposition mask can be reduced accordingly.

  If necessary, the bonded first and second frame members 3a and 3b are passed through a device capable of applying a clamping force to the stacked members, such as a pair of pressure rollers, to fix the bonded state. You may make it perform the process to plan.

  After joining, the frame body 3 is completed by removing unnecessary portions of the adhesive layer 3c, that is, portions located outside the opening region 6 and the outer frame portion 4. In addition, when an adhesive agent is a film resist, it will remove by the image development process.

  For the completed frame 3, another adhesive layer 19 for adhering it to the mother die 10 is provided. As the adhesive layer 19, for example, a photosensitive dry film resist having adhesiveness in an uncured state can be attached and used. After the film resist is attached to the frame 3, the opening region of the frame 3 is used. The adhesive layer 19 is obtained by removing the film resist of the portion located at 6 and the portion protruding from the outer frame portion 4.

  On the other hand, as for the manufacturing process of the vapor deposition mask, first, the matrix 10 is set in correspondence with the vapor deposition through holes 8 of the mask body 2, that is, the non-arranged portions of the primary electrodeposition layer 15 set in advance on the matrix 10. A resist layer 11 is disposed on the substrate (see FIG. 6). Specifically, one or several negative photosensitive dry film resists, for example, are laminated on the surface side of the mother die 10 in accordance with a predetermined thickness (for example, about 20 μm) necessary for forming the primary electrodeposition layer 15. Then, the resist layer 11 is formed by thermocompression bonding (see FIG. 6A).

Then, a mask film (glass mask) 12 having a predetermined pattern corresponding to the arrangement position of the primary electrodeposition layer 15 is adhered to the surface of the resist layer 11 such as having a light transmitting hole 12a corresponding to the vapor deposition through hole 8. Then, each process of hardening by exposure by ultraviolet irradiation (refer FIG. 6 (B), (C)), the development which removes the resist of the non-irradiated part masked, and drying is performed. In this way, the primary pattern resist 14 corresponding to the non-arranged portion of the primary electrodeposition layer 15 is formed on the mother die 10 (see FIG. 7A).
The primary pattern resist 14 can be formed by a lithography method using a photoresist or the like or any other method, and the formation method is not limited to the above.

  The mother die 10 having the primary pattern resist 14 is put in an electroforming tank bathed under a predetermined condition, and is not covered with the primary pattern resist 14 in the thickness range of the primary pattern resist 14. On the surface (exposed region), a primary electrodeposition layer 15 to be the mask body 2 having a thickness of, for example, 8 μm is formed by electroforming of an electrodeposited metal such as a nickel alloy (see FIG. 7B).

  Thereafter, the primary pattern resist 14 is dissolved and removed to obtain a primary electrodeposition layer 15 to be the mask body 2 provided with a large number of independent vapor deposition holes 8 forming a predetermined vapor deposition pattern 9 (FIG. 7 ( C)).

  After the primary electrodeposition layer 15 is obtained, a resist layer 16 having a thickness preferably in the range of 50 to 60 μm is disposed on the entire surface of the mother die 10 including the portion where the primary electrodeposition layer 15 is formed. Specifically, for example, a negative type photosensitive dry film resist having a thickness of 56 μm is pasted on the surface side of the mother die 10, and the main part is cured by exposure. These steps are repeated a plurality of times as necessary so that the secondary pattern resist 18 finally obtained from the resist layer 16 has a predetermined thickness, and a single layer or a single film resist or a plurality of film resists. A resist layer 16 having a laminated structure is formed.

The exposure of the film resist is performed every time one sheet is applied. Specifically, as a step of making the mask film 17 having the light transmitting holes 17a corresponding to the pattern formation region 2a of the mask body 2 adhere to the surface of the newly applied film resist, and then curing by exposure by ultraviolet irradiation. Is performed (see FIG. 8B and FIG. 9A).
This is repeated as necessary to obtain a resist layer 16a cured by exposure at a portion corresponding to the pattern formation region 2a and an unexposed resist layer 16b at a predetermined thickness set in other portions. It becomes.

In this embodiment, the process of attaching a film resist and performing exposure is repeated twice to form two resist layers 16 each having a thickness of 56 μm.
Thereafter, a process of dissolving and removing the unexposed resist layer 16b exposed on the surface is performed to form a secondary pattern resist 18 having a thickness of 112 μm covering the pattern formation region 2a (see FIG. 9C). .

After the secondary pattern resist 18 is formed in this way, a predetermined position on the primary electrodeposition layer 15 is obtained by arranging the adhesive layer 19 in advance on the lower surface side of the frame 3 that has been formed through the frame forming step. (See FIG. 9C).
The frame 3 in this state can be temporarily fixed so as not to move easily on the primary electrodeposition layer 15 due to the adhesiveness of the adhesive layer 19.

  For the temporarily fixed frame 3, a process of applying a load from above the frame 3 and performing pressure bonding is performed so that the frame 3 is not easily separated from the primary electrodeposition layer 15 (see FIG. 10). . Specifically, first, as a temporary pressure bonding, a static load is applied to the frame 3 to press it against the mother die for a predetermined time. That is, a glass plate of 50 kg or more, for example, 105 kg, is placed on the frame 3 and left for 1 hour or more, for example, 4 hours. In addition, in this temporary crimping | bonding, things other than a glass plate can also be used if it is an object which can be mounted on the frame 3 as a static load.

  Subsequently, as the main pressure bonding, each part of the frame body 3 is pressed evenly to be surely fixed to the primary electrodeposition layer 15. As a specific example, after removing the glass plate or the like, a pressure roller (laminator) that presses with a pressure of 0.1 MPa or more, for example, 0.6 MPa while moving relative to the frame 3 is reciprocated once on the frame 3. As described above, the pressing is performed so as to reciprocate three times, for example.

  When pressing with a pressure roller as the main pressure bonding, a highly rigid plate that is not easily deformed, for example, a plate made of SUS material, is interposed between the frame 3 and the roller, and the roller is interposed through this plate. If the pressing is performed, the force from the roller is dispersed by the plate and transmitted to the frame 3, and it is preferable that the pressing force is less biased than when the pressing is directly performed by the roller.

  In addition, a laminate of a highly rigid plate and an elastic sheet such as rubber is interposed between the frame 3 and the roller with the sheet side facing the frame 3, and the plate and the sheet. It is also possible to perform the pressing with the roller via the. In this case, the uneven state of the gap between the plate body and the frame body due to slight inclination, distortion, unevenness, etc. on the plate body surface can be absorbed by the elastic deformation of the sheet interposed between the plate body and the frame body. The force is uniformly transmitted to the frame body 3 through the sheet that is in close contact with the frame body 3, and the frame body 3 can be more uniformly and uniformly bonded to the primary electrodeposition layer 15. The frame body 3 and the primary electrodeposition layer It is possible to suppress the generation of a gap between the first and second layers, and to prevent adverse effects such as abnormal growth of plating in the gap when the metal layer 7 is formed.

  In addition to pressing the frame 3 as a main press using a pressure roller (laminator), a press type capable of pressing the frame 3 by operating the pressing portion only in the thickness direction of the frame 3. As in the case of using a roller for pressing, there is no possibility that a roller tangential direction (lateral direction) force is applied to the frame body by mistake from the rolling roller, causing a lateral displacement of the frame body, preferable.

  After such a crimping step, the upper surface of the primary electrodeposition layer 15 that is not covered with the secondary pattern resist 18 and is exposed on the surface of the outer peripheral edge 2b of the pattern formation region 2a, the primary electrodeposition layer 15a on the lower side of the frame 3 and A metal layer 7 is formed by plating with an electrodeposited metal on each exposed surface of the mother die 10 exposed on the side and on the surface of the frame body 3 (see FIG. 11B). By this metal layer 7, the primary electrodeposition layer 15 and the frame 3 can be integrally connected so as not to leave.

  In this case, the metal layer 7 is an upper surface of the primary electrodeposition layer 15 exposed on the surface related to the outer peripheral edge 2b of the pattern formation region 2a, or a matrix exposed on the surface between the primary electrodeposition layer 15 and the frame 3. The thickness of the metal layer 7 on the surface of the frame 3 is formed thinner than the thickness on the surface 10. The difference in thickness is that the metal layer 7 is sequentially laminated from the surface of the mother die 10 and the primary electrodeposition layer 15 and reaches the frame body 3 beyond the height dimension of the adhesive layer 19. This is because the metal mold 7 is brought into conduction with the matrix 10 and the primary electrodeposition layer 15 and the formation of the metal layer 7 on the surface of the frame 3 is started.

  When the formation of the metal layer 7 is completed, the integrated primary electrodeposition layer 15, the frame body 3, and the metal layer 7 are peeled from the mother die 10 as a final step (see FIG. 11C). Further, the primary electrodeposition layer 15a existing on the lower side of the frame 3 is removed together with the adhesive layer 19, and then the secondary pattern resist 18 is removed, whereby the production of the vapor deposition mask 1 is completed. If the adhesive layer 19 remains on the lower side of the frame 3, it is removed when the secondary pattern resist 18 is removed.

  As described above, the vapor deposition mask according to the present embodiment is configured so that the cross-sectional shape of the minimum width portion of the inner frame portion 5 of the frame body 3 has an appropriate relationship between the width and thickness, and the minimum width portion. Therefore, the frame body 3 is provided with necessary and sufficient strength against the force from the mask body 2 side, and is combined with the other part of the frame body 3 wider and stronger than the minimum width portion. As a whole, the displacement of each part of the mask main body 2 from the proper position can be suppressed, the alignment state between the mask and the deposition target substrate in the deposition process can be secured, and the deposition can be performed accurately at an appropriate position of the deposition target substrate. Further, due to the difficulty of bending deformation of the minimum width portion, bending due to its own weight of the minimum width portion can be suppressed, and deformation of the frame body 3 and its influence on the mask body 2 can be suppressed.

  In the vapor deposition mask according to the embodiment, the mask main body 2 is disposed so as to be positioned in each opening region 6 of the frame 3, and has a pattern forming region 2 a provided with a large number of vapor deposition through holes 8. However, the present invention is not limited to this, and the mask body 2 may have a plurality of pattern formation regions 2a as shown in FIG. In this case, in order to reliably suppress the displacement of the mask main body 2, the width of each part of the frame around the mask main body is formed larger than the width dimension allowed as the minimum width portion to ensure sufficient rigidity. Is desirable. In addition, instead of a configuration in which only one mask main body 2 is located in each opening region 6 of the frame 3, a plurality of mask main bodies 2 may be arranged side by side in one opening region 6. In that case, the outer peripheral edge of the mask main body 2 is divided into a part adjacent to the frame body 3 and a part adjacent to the mask main body. In the part adjacent to the mask main body, the mask main body 2 and the frame body 3 As in the case of integrally joining the mask bodies, the mask bodies are joined together with a metal layer formed by plating.

  Moreover, in the vapor deposition mask which concerns on the said embodiment, although the frame 3 is set as the structure formed by joining and integrating the 1st frame member 3a and the 2nd frame member 3b of the same shape, it is not restricted to this. The shapes of the first frame member 3a and the second frame member 3b are made different. For example, as shown in FIG. 13, the side farther from the mask body 2 with respect to the opening of the second frame member 3b closer to the mask body 2 The first frame member 3a and the second frame member 3b are formed so that the opening of the first frame member 3a is made larger and the width of each part in the second frame member 3b is made larger than that of the first frame member 3a. And the frame 3 can be formed by joining and integrating. In this case, the opening region 6 of the frame 3 spreads in a portion far from the mask main body 2 and the peripheral portion surrounding the opening region 6 is retracted. With respect to the vapor deposition material directed to the vapor deposition target substrate through the vapor deposition through hole 8 of the main body 2, the peripheral portion around the opening region 6 in the frame body 3 is unlikely to become an obstacle that hinders the progress of the vapor deposition material. The influence of the body 3 can be eliminated and the vapor deposition material can be allowed to proceed without problems, and vapor deposition can be performed more appropriately.

  Further, in the manufacture of the vapor deposition mask according to the embodiment, the metal layer 7 is formed so as to be in contact with the primary electrodeposition layer 15 and the frame body 3, and the primary electrodeposition layer 15 and the frame body 3 are formed of the metal layer 7. However, the present invention is not limited to this, and the frame 3 is placed on the lower primary electrodeposition layer 15 with a stronger adhesive than the uncured film resist interposed therebetween, thereby The adhesion layer 15 and the frame 3 can be integrated by bonding, and the primary electrodeposition layer, that is, the mask body 2 and the frame 3 can be simply integrated, and the mask manufacturing efficiency can be improved. Improvement can be achieved. In this case, by further forming a metal layer so as to cover the surface of the mask body 2 and the surface of the frame body 3, the bonding state of the mask body 2 and the frame body 3 can be made more preferable. In particular, by covering the surface (side part) of the adhesive with a metal layer, it is possible to effectively prevent the deterioration of the adhesive due to the cleaning process and the temperature rise, and the bonding state of the mask body 2 and the frame 3 Can be maintained for a long time.

  Moreover, in the manufacture of the vapor deposition mask according to the embodiment, the metal layer 7 is formed on the surface of the frame body 3 after the frame body 3 is arranged on the mother die 10. Before forming the metal layer 7, a resist is disposed on a part or all of the upper surface of the frame body, and the metal layer 7 is not formed on the entire upper surface of the frame body. It is also possible to adopt a configuration in which a stress relaxation portion is provided on the surface of the frame 3 by providing or omitting only on a part of the upper surface of the body.

  In this case, the metal layer 7 is not uniformly continuous on the upper surface of the frame 3 and is partially and fragmented, so that even if internal stress is generated in the metal layer, it is not the entire frame 3. Thus, the frame body 3 acts in a fragmentary manner, and the frame body 3 is less susceptible to adverse effects such as deformation, and a planar shape can be secured.

  Moreover, in the manufacture of the vapor deposition mask according to the embodiment, after the primary electrodeposition layer 15 is formed, the metal layer 7 is formed on the primary electrodeposition layer without any particular surface treatment. Not limited to this, after the primary electrodeposition layer 15 is formed and before the formation of the metal layer 7, the metal layer in the primary electrodeposition layer 15 is acidified with respect to a predetermined range to be disposed. An activation treatment such as immersion or electrolytic treatment can also be performed.

  In this case, the bonding strength between the activation treatment portion of the primary electrodeposition layer 15 and the metal layer 7 thereon can be greatly improved as compared with the case of no treatment. Further, instead of the activation treatment, a thin layer such as strike nickel or matte nickel may be formed on a predetermined range of the primary electrodeposition layer 15. Also by this, the joint strength between the thin layer forming portion of the primary electrodeposition layer 15 and the metal layer 7 thereon can be improved.

  In addition, in the manufacture of the vapor deposition mask according to the embodiment, the primary electrodeposition layer 15 and the portion where the frame 3 and the metal layer 7 overlap each other are simply configured to contact each other on the plane. Regarding the metal layer 7 formed on the outer peripheral edge 2b of the primary electrodeposition layer 15 by providing a large number of through holes or recesses over the entire periphery of the outer peripheral edge 2b of the pattern formation region 2a in the electrodeposition layer 15 (mask body 2). Can be configured to fill the through-hole or recess and form the metal layer 7 partially biting into the outer peripheral edge 2b.

  In this case, the metal layer 7 is present in each through hole or recess of the outer peripheral edge 2b in addition to the upper surface of the outer peripheral edge 2b of the pattern formation region 2a with respect to the primary electrodeposition layer 15, and the primary electrodeposition layer 15 The bonding strength with the outer peripheral edge 2b is made larger. As a result, the mask body 2 and the frame body 3 can be more firmly connected and integrated via the metal layer 7, and the inadvertent dropping and misalignment of the mask body 2 with respect to the frame body 3 can be reliably suppressed, and vapor deposition is performed. It is possible to further improve the accuracy and the reproduction accuracy of the deposited product.

  In the manufacturing of the vapor deposition mask according to the embodiment, the structure of the primary electrodeposition layer 15 to be the mask body 2 formed on the surface not covered with the primary pattern resist 14 of the mother die 10 will be described in detail. However, the primary electrodeposition layer 15 can also have a two-layer structure of a matte nickel layer formed on the matrix 10 side and a glossy nickel layer formed on the matte nickel layer. Specifically, an electrodeposition layer made of matte nickel is formed by electroforming on the surface not covered with the primary pattern resist 14 of the mother die 10, and then an electrodeposition layer made of bright nickel is formed thereon by electroforming. Thus, the primary electrodeposition layer 15 is formed. Regarding the relationship between the thickness of the matte nickel layer and the glossy nickel layer, if the matte nickel layer is made too thick, the tension generated in the completed mask body 2 becomes excessively large, and the frame 3 may be deformed. Therefore, the ratio of the thickness of the bright nickel layer to the non-glossy nickel layer is preferably about 5/7.

  The formation order of the matte nickel layer and the glossy nickel layer can be reversed to form a two-layer structure in which the matte nickel layer is formed on the glossy nickel layer. However, in the case of a two-layer structure in which a matte nickel layer is formed on the latter glossy nickel layer, it is considered that the probability of delamination is higher than in the former two-layer structure. It is preferable to adopt a two-layer structure in which a bright nickel layer is formed on the layer.

  As described above, the two-layer structure in which the bright nickel layer is disposed on the upper side of the matte nickel layer and the matte nickel layer is appropriately thicker than the bright nickel layer, the inner mask layer 2 in the completed mask body 2 The vapor deposition mask 1 having excellent heat resistance can be obtained in which the tension (tensile stress) to be shrunk can be increased and the mask main body 2 is not deformed even under the influence of expansion of each part due to heat.

  In addition, when the primary electrodeposition layer is formed only of matte nickel, the tension generated in the mask body 2 after completion becomes excessively large, which may cause deformation of the frame 3, and this primary electrodeposition. Since the surface of the matte nickel layer forming the layer is rough, there is a problem that the bonding force such as plating on the surface is increased and the primary electrodeposition layer 15a and the metal layer 7 cannot be separated in the mask manufacturing process. Prone to occur. The primary electrodeposition layer having a two-layer structure in which a bright nickel layer is formed on the non-glossy nickel layer can avoid such problems. In the case of the two-layer structure in which the bright nickel layer is formed on the matte nickel layer, the primary electrodeposition layer 15 and the metal are reduced in the bright nickel layer portion of the primary electrodeposition layer because the bonding force is smaller than that of the matte nickel layer. Although it is easy to separate from the layer 7, sufficient bonding strength with the metal layer is ensured by forming a through hole in the primary electrodeposition layer, activation treatment, or forming a thin layer such as strike nickel or matte nickel. can do.

DESCRIPTION OF SYMBOLS 1 Deposition mask 2 Mask main body 2a Pattern formation area 2b Outer periphery 3 Frame 3a First frame member 3b Second frame member 3c Adhesion layer 4 Outer frame part 5 Inner frame part 6 Opening area 7 Metal layer 8 Deposition through hole 9 Deposition pattern DESCRIPTION OF SYMBOLS 10 Matrix 11 Resist layer 12 Mask film 12a Light transmission hole 14 Primary pattern resist 15, 15a Primary electrodeposition layer 16 Resist layer 16a, 16b Resist layer 17 Mask film 17a Light transmission hole 18 Secondary pattern resist 19 Adhesive layer

Claims (5)

In a vapor deposition mask comprising a plurality of mask main bodies provided with a plurality of independent vapor deposition through holes in a predetermined pattern, and a frame disposed around the mask main body,
The frame body has a rectangular or rectangular outer frame portion located on the outermost periphery and an inner frame portion that divides the inside of the outer frame portion into a plurality of opening regions, and is formed in a lattice shape as a whole. ,
The mask body is located in each of a plurality of opening regions in the frame, and is integrated with the frame;
The cross-sectional shape of the narrowest portion of the inner frame portion of the frame is a rectangular cross-section in which the ratio of the thickness dimension to the width dimension is 0.8 / 5 or more and 2/5 or less. Vapor deposition mask. The vapor deposition mask according to claim 1,
Each cross-sectional shape in a portion other than the narrowest portion of the outer frame portion and the inner frame portion in the frame body has a ratio of a thickness dimension to a width dimension of 0.8 / 90 or more, and the inner frame The vapor deposition mask characterized by being made into the rectangular cross section made smaller than the ratio of the thickness dimension with respect to the width dimension in the location which becomes the narrowest part of a part. In the vapor deposition mask according to claim 1 or 2,
The vapor deposition mask, wherein the frame is formed so that a thickness dimension of each part is 0.8 mm or more and 2 mm or less. In the vapor deposition mask according to any one of claims 1 to 3,
The frame body has a laminated structure in which the first frame member and the second frame member are stacked and integrated,
The vapor deposition mask characterized in that the first frame member and the second frame member are warped frame members formed of a thin metal plate material, and the respective warp directions are reversed. In the vapor deposition mask according to any one of claims 1 to 3,
The vapor deposition mask, wherein the frame body is formed by different materials of an inner frame portion and a material of an outer frame portion.

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