JP2019021856A - module - Google Patents

Abstract

To provide a module which achieves improvement of heat radiation efficiency and reduction of its height.SOLUTION: A module 1 includes: a substrate 2; a component 3 which is mounted on an upper surface 2a of the substrate 2 and generates heat; a metal block 4 provided at an upper part of the component 3; and a sealing resin layer 5 which seals the upper surface 2a of the substrate 2, the component 3, and the metal block 4. The metal block 4 releases heat from the component 3 to the exterior of the module 1 to prevent the module 1 from generating heat. Further, since the metal block 4 is provided in the sealing resin layer 5, reduction of a height of the module 1 is easily achieved.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a module in which a component that generates heat is mounted on a substrate and has a heat dissipation structure.

  In a module in which a component that generates heat is mounted on the mounting surface of the wiring board, a heat dissipation measure may be taken to prevent damage to the component due to heating. An example of a module with such a heat dissipation measure is the semiconductor device 100 described in Patent Document 1 shown in FIG.

  The semiconductor device 100 includes a multilayer wiring board 101, a conductive lead 102, and a semiconductor having a circuit formation surface 103a and an anti-circuit formation surface 103b held on the semiconductor element mounting surface 101a of the multilayer wiring substrate 101 by the conductive lead 102. The element 103, the resin 104 provided so as to seal the conductive lead 102 and the semiconductor element 103 except for the anti-circuit formation surface 103b of the semiconductor element 103, and the anti-circuit formation surface 103b of the semiconductor element 103 are joined. And fins 105 for heat dissipation. The heat dissipation efficiency of the semiconductor device 100 is improved by the heat dissipation fin 105.

Japanese Patent Laid-Open No. 5-206320 (see paragraphs 0008 and 0011, FIG. 1)

  However, in the semiconductor device 100 described above, depending on the amount of heat generated by the semiconductor device 100, the heat dissipation efficiency may not be sufficient even if the heat dissipation fin 105 is used. Further, since the heat dissipating fins 105 are provided outside the resin 104, there is a problem that it is difficult to reduce the height.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a module capable of realizing a low profile while improving the heat dissipation effect.

  In order to achieve the above-described object, a module of the present invention includes a substrate, a heat generating component mounted on one main surface of the substrate, a heat radiating member disposed on the one main surface side of the substrate, A sealing resin layer that seals the one main surface of the substrate, the component, and the heat transfer member, and the heat dissipation member has a thickness in a direction perpendicular to the one main surface of the substrate of 100 μm or more, When viewed from a direction perpendicular to the one main surface of the substrate, the area of the heat dissipation member is equal to or larger than the area of the component, and the component is between the one main surface of the substrate and the heat dissipation member. The height of the heat dissipation member from the one main surface of the substrate is lower than the height of the sealing resin layer from the one main surface of the substrate.

  According to this configuration, since the area of the heat radiating member is larger than the area of the component when viewed from the direction perpendicular to the one main surface of the board, the heat radiating efficiency can be improved as compared with the case where a conductive post or the like is used. Can do. Moreover, since the heat radiating member is arrange | positioned inside the sealing resin layer, compared with a heat sink structure, low profile is easy. Furthermore, since the heat radiation member is not exposed from the surface of the sealing resin layer, it is not necessary to polish the surface of the sealing resin layer, and the manufacturing process can be reduced.

  Moreover, since the thickness of the heat dissipation member in the direction perpendicular to the one main surface of the substrate is 100 μm or more, the heat dissipation efficiency can be improved as compared with the case where plating or metal foil is used.

  Moreover, the said heat radiating member and the said component do not need to contact | connect. According to this structure, since the heat radiating member is arrange | positioned inside the sealing resin layer, reduction in height is easy. Moreover, since it is not necessary to polish the surface of the sealing resin layer, the manufacturing process can be reduced.

  Further, the heat dissipation member and the component may be in contact with each other. According to this configuration, the heat in the component can be diffused in the surface direction, so that local heat generation can be suppressed.

  Moreover, the edge part of the said heat radiating component may be exposed from the side surface of the said sealing resin layer. According to this configuration, heat can be released to the outside of the module from the end portion of the heat dissipation member exposed from the side surface of the sealing resin layer, and the heat dissipation efficiency can be further improved.

  Moreover, you may further provide the shield layer which coat | covers the surface of the said sealing resin layer, and the side surface of the said board | substrate. According to this configuration, the heat generated from the component can be released from the shield layer to the substrate, and the heat dissipation efficiency can be further improved.

  The heat dissipation member may be formed of a metal block. According to this configuration, it is possible to improve the heat dissipation efficiency as compared with the case of using plating or metal foil.

  According to the present invention, since the heat radiating member has a large surface area, heat dissipation is high, and since the heat radiating member is arranged inside the sealing resin layer, it is easy to reduce the height. Moreover, since it is not necessary to expose the heat radiating member from the sealing resin layer, it is not necessary to polish or remove the sealing resin layer, and it can be manufactured at low cost.

It is sectional drawing of the module which concerns on 1st Embodiment of this invention. It is a graph showing the relationship between the thickness of a metal block, a magnitude | size, and the temperature change of a module. It is sectional drawing of the module which concerns on 2nd Embodiment of this invention. It is sectional drawing of the module which concerns on 3rd Embodiment of this invention. It is sectional drawing of the module which concerns on 4th Embodiment of this invention. It is sectional drawing of the conventional module.

<First Embodiment>
A module 1 according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a cross-sectional view of the module 1 according to the first embodiment.

  The module 1 according to the first embodiment is mounted on, for example, a mother board of an electronic device. As shown in FIG. 1, the module 1 includes a substrate 2 having a land electrode 6 formed on an upper surface 2 a (corresponding to “one main surface” of the present invention) and a connection terminal connected to the land electrode 6 by solder 7. The component 3 mounted on the upper surface 2a, the metal block 4 for radiating heat generated from the component 3, and the sealing resin layer for sealing the upper surface 2a of the substrate 2, the component 3 and the metal block 4 5.

  The substrate 2 is formed of, for example, low temperature co-fired ceramics or glass epoxy resin. A plurality of land electrodes 6 are formed on the upper surface 2a of the substrate 2, a plurality of external electrodes (not shown) are formed on the lower surface 2b, and a plurality of ground electrodes, a plurality of wiring electrodes, In addition, a plurality of via conductors are formed. Each ground electrode is formed so as to be exposed from the side surface of the substrate 2, for example.

  Each land electrode 6, each external electrode, each ground electrode, and each wiring electrode are each formed of a metal generally employed as an electrode such as Cu, Ag, or Al. Each via conductor is formed of a metal such as Ag or Cu.

  The component 3 is a component that generates heat. Examples of the component 3 include active components such as an IC and a power amplifier. The component 3 is mounted on the upper surface 2 a of the substrate 2 by connecting the connection terminals to the land electrodes 6 formed on the upper surface 2 a of the substrate 2 using the solder 7.

  The metal block 4 (corresponding to the “heat dissipating member” of the present invention) is arranged so as not to contact the upper surface 3 a of the component 3. That is, resin is disposed between the component 3 and the metal block 4. In addition, the upper surface 4 a of the metal block 4 is not exposed from the surface of the sealing resin layer 5 and is embedded in the sealing resin layer 5. Further, the metal block 4 is arranged so that a part or all of the metal block 4 overlaps the upper surface 3a of the component 3 when viewed from the direction perpendicular to the upper surface 2a of the substrate 2, and from the direction perpendicular to the upper surface 2a of the substrate 2. The area of the metal block 4 when viewed is formed to be equal to or larger than the area of the component 3. The metal block 4 is a metal plate having a thickness of 100 μm or more, such as a plate-like copper plate, and conducts heat. In addition to the metal, a material having high thermal conductivity such as AIN may be used as the heat radiating member forming the metal block 4. By adopting a structure in which the component 3 is sandwiched between the metal block 4 and the substrate 2, heat generated from the component 3 can be released to the outside of the module 1.

  The sealing resin layer 5 is provided on the substrate 2 so as to cover the upper surface 2 a of the substrate 2, the component 3 and the metal block 4. The sealing resin layer 5 can be formed of a resin generally employed as a sealing resin such as an epoxy resin containing a silica filler. Moreover, you may use a filler with high heat conductivity, such as an alumina filler, for high heat conduction.

(Module manufacturing method)
Next, a method for manufacturing the module 1 will be described. In this 1st Embodiment, after forming the aggregate | assembly of the several module 1, the module 1 is manufactured by dividing into pieces.

  First, a plurality of land electrodes 6 are formed on the upper surface 2a, a plurality of external electrodes are formed on the lower surface 2b, and a plurality of ground electrodes, a plurality of wiring electrodes, a plurality of ground electrodes, and a plurality of via conductors are formed on the surface layer or the inner layer. An assembly of the substrates 2 on which etc. are formed is prepared. Each land electrode 6, each external electrode, each ground electrode, and each wiring electrode can be formed by screen printing a conductive paste containing a metal such as Cu, Ag, or Al. Each via conductor can be formed by a well-known method after forming a via hole using a laser or the like.

  Next, the component 3 is mounted on the upper surface 2a of the substrate 2 using a known surface mounting technique. For example, solder 7 is formed on a desired land electrode 6 among the land electrodes 6 of the substrate 2, and the component 3 is mounted on the corresponding land electrode 6 among the land electrodes 6 on which the solder 7 is formed. Then, reflow processing is performed. Note that the assembly of the substrates 2 is cleaned as necessary after the reflow process.

  Next, a lower portion 5 a of the sealing resin layer 5 is formed on the upper surface 2 a of the substrate 2 so as to cover the upper surface 2 a of the substrate 2 and the component 3. Thereafter, the metal block 4 is disposed on the lower portion 5 a of the sealing resin layer 5, and the upper portion 5 b of the sealing resin layer 5 is formed so as to cover the metal block 4. Thus, by forming the sealing resin layer 5 in two steps of the lower part 5a and the upper part 5b, the resin is arranged between the upper surface 3a of the component 3 and the lower surface 4b of the metal block 4, and the module 1 is The metal block 4 is disposed so as to float inside the sealing resin layer 5 when viewed from a direction horizontal to the upper surface 2 a of the substrate 2.

  The sealing resin layer 5 can use, for example, a transfer mold method, a compression mold method, a liquid resin method, a sheet resin method, or the like. The sealing resin layer 5 can be made of a general epoxy resin containing silica filler. In addition, in order to give the sealing resin layer 5 high thermal conductivity, an epoxy resin containing a filler having high thermal conductivity such as an alumina filler can be used. In addition, you may perform the plasma cleaning of the board | substrate 2 as needed after formation of the sealing resin layer 5. FIG.

  After the sealing resin layer 5 is formed, the module 1 is separated into pieces by a known method such as dicer or laser processing.

  According to the above-described embodiment, the metal block 4 has an area larger than the area of the component 3 when viewed from the direction perpendicular to the upper surface 2a of the substrate 2, so that the heat dissipation efficiency can be improved. Moreover, since the metal block 4 is embedded in the sealing resin layer 5, it is easy to reduce the height. Furthermore, since it is not necessary to polish the surface of the sealing resin layer 5 in order to expose the metal block 4 from the surface of the sealing resin layer 5, the manufacturing process can be reduced.

  FIG. 2 shows the size of the metal block 4 in the horizontal direction with respect to the upper surface 2a of the substrate 2 of the metal block 4 when the thickness in the direction perpendicular to the upper surface 2a of the substrate 2 is 100 μm and 50 μm. It is the graph showing the temperature change (DELTA) T (vertical axis) of the module 1 by arrangement | positioning (horizontal axis). As shown in FIG. 2, when the thickness of the metal block 4 as a heat radiating member is 100 μm, the temperature change of the module 1 is large compared to the case where the metal block 4 is 50 μm. It can be seen that when the thickness is 100 μm, the heat dissipation efficiency is higher. Therefore, when using a metal member whose thickness in the direction perpendicular to the upper surface 2a of the substrate 2 of the metal block 4 is 100 μm or more as in the above-described embodiment, the thickness of the plating or metal foil is 100 μm. The heat radiation efficiency can be improved as compared with the case of a heat radiation member that is less than. In general electronic parts, a life extension of several months (about 4 years at 10 ° C.) can be expected even with a heat dissipation effect of several degrees C.

  In addition, the warpage of the module 1 due to heat shock or the like occurs due to the difference in the linear expansion coefficient between the substrate 2 and the component 3, but a thick metal block 4 is disposed inside the sealing resin layer 5. Thus, the difference in the coefficient of linear expansion between the substrate 2 and the component 3 can be reduced, and the warpage of the module 1 can be suppressed.

Second Embodiment
A module according to a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a cross-sectional view of the module 1a according to the second embodiment.

  The module 1a according to the second embodiment is different from the module 1 according to the first embodiment described with reference to FIG. 1 in that the metal block 4 is in contact with the component 3 as shown in FIG. Since other configurations are the same as those of the module 1 according to the first embodiment, the description thereof is omitted by giving the same reference numerals.

  The metal block 4 is disposed on the upper surface 3 a of the component 3 by being bonded to the upper surface 3 a of the component 3 by the adhesive member 8. For the adhesive member 8, for example, a heat conductive adhesive or solder that conducts heat can be used. Further, the metal block 4 may be directly disposed on the upper surface 3 a of the component 3 without using the adhesive member 8.

  In the module 1a of this embodiment, after mounting the component 3 on the upper surface 2a of the substrate 2, the metal block 4 is bonded to the upper surface 3a of the component 3 with the adhesive member 8, and then the upper surface 2a of the substrate 2 and the component 3 are bonded. , And by laminating the sealing resin layer 5 so as to cover the metal block 4.

  According to the above-described embodiment, the heat in the component is diffused in the surface direction, so that local heat generation of the component can be suppressed, and as shown in FIG. 2, the heat dissipation efficiency is higher than in the case of the first embodiment. Can be improved.

<Third Embodiment>
A module 1b according to a third embodiment of the present invention will be described with reference to FIG. FIG. 4 is a cross-sectional view of the module 1b according to the third embodiment.

  The module 1b according to the third embodiment is different from the module 1 according to the first embodiment described with reference to FIG. 1 in that the metal block 4 is in contact with the component 3 as shown in FIG. That is, the end 4 c of the block 4 is exposed from the side surface of the sealing resin layer 5. Since other configurations are the same as those of the module 1 according to the first embodiment, the description thereof is omitted by giving the same reference numerals.

  In the module 1b of this embodiment, for example, one plate-like metal is arranged on the assembly of the modules 1b before being separated into pieces, and is covered with a resin to form the sealing resin layer 5, and then the pieces are separated. Can be formed. The end 4c of the metal block 4 is exposed from the side surface of the sealing resin layer 5 by dividing into pieces by a method such as dicer or laser processing.

  According to the above-described embodiment, since the end portion 4c of the metal block 4 is exposed from the side surface of the sealing resin layer 5, heat can be released to the outside from the exposed portion, and as shown in FIG. Compared to the case of the first embodiment, the heat dissipation effect can be further improved.

<Fourth embodiment>
A module according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view of the module 1c according to the fourth embodiment.

  The module 1c according to the fourth embodiment is different from the module 1 according to the first embodiment described with reference to FIG. 1 in that the surface of the sealing resin layer 5 and the side surface of the substrate 2 are as shown in FIG. The shield layer 9 is provided so as to cover it. Since other configurations are the same as those of the module 1 according to the first embodiment, the description thereof is omitted by giving the same reference numerals.

  The shield layer 9 is, for example, a multilayer structure having an adhesion layer laminated on the surface of the sealing resin layer 5 and the side surface of the substrate 2, a conductive layer laminated on the adhesion layer, and a corrosion-resistant layer laminated on the conductive layer. Can be formed. The adhesion layer is provided to increase the adhesion strength between the conductive layer and the sealing resin layer 5, and can be formed of a metal such as SUS, for example. The conductive layer is a layer that bears the substantial shielding function of the shield layer 9 and can be formed of any one of Cu, Ag, and Al, for example. The conductive layer itself is not limited to a single material, and may have a multilayer structure in which a plurality of materials are stacked. The corrosion resistant layer is provided to prevent the conductive layer from being corroded or scratched, and can be formed of, for example, SUS. For forming the shield layer 9, for example, a sputtering method, a vapor deposition method, a paste coating method, or the like can be used.

  According to the above-described embodiment, the same effect as that of the module 1 of the first embodiment can be obtained, and the heat generated from the component 3 can be released from the shield layer 9 to the substrate 2 to further improve the heat dissipation effect. Is planned.

  The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention.

  In addition, the present invention can be applied to a module having a heat dissipation structure while a component that generates heat is mounted on a substrate.

1-1c Module 2 Substrate 2a Upper surface (one main surface)
3 Parts 4 Metal block (heat radiating member)
5 Sealing resin layer 9 Shield layer

Claims (6)

A substrate,
A heat-generating component mounted on one main surface of the substrate;
A heat dissipating member disposed on the one main surface side of the substrate;
A sealing resin layer for sealing the one main surface of the substrate, the component and the heat transfer member;
The heat dissipation member has a thickness in a direction perpendicular to the one main surface of the substrate of 100 μm or more,
When viewed from a direction perpendicular to the one main surface of the substrate, the area of the heat dissipation member is equal to or greater than the area of the component,
The component is located between the one main surface of the substrate and the heat dissipation member,
The module is characterized in that a height of the heat dissipation member from the one main surface of the substrate is lower than a height of the sealing resin layer from the one main surface of the substrate.   The module according to claim 1, wherein the heat radiating member and the component are not in contact with each other.   The module according to claim 1, wherein the heat dissipation member and the component are in contact with each other.   The module according to any one of claims 1 to 3, wherein an end portion of the heat dissipation component is exposed from a side surface of the sealing resin layer.   The module according to any one of claims 1 to 4, further comprising a shield layer that covers a surface of the sealing resin layer and a side surface of the substrate.   The module according to claim 1, wherein the heat radiating member is formed of a metal block.

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