JP7320923B2 - module - Google Patents

Description

The present invention relates to a module with a heat dissipation member.

Various modules are mounted on a mother board of an electronic device such as a communication terminal device. In this type of module, various chip parts are mounted on a wiring board, and these chip parts are sealed with resin. Chip parts include parts that generate heat when the module is used, such as semiconductor elements such as ICs. If heat accumulates in the module, the characteristics of the module may deteriorate. Therefore, modules capable of dissipating heat generated from mounted components have been proposed. For example, as shown in FIG. 8 , a module 100 described in Patent Document 1 has a plurality of components 102 mounted on an upper surface 101 a of a wiring board 101 . Each component 102 is sealed with a sealing resin layer 103 and the sealing resin layer 103 is covered with an electromagnetic shield 104 . Furthermore, a heat dissipation layer 105 is laminated on the electromagnetic shield 104 on the upper surface 103 a of the sealing resin layer 103 .

Japanese Patent Application Laid-Open No. 2017-45932 (paragraphs 0051 to 0053, 0059 to 0061, see FIG. 12, etc.)

However, in the conventional module 100, the heat dissipation layer 105 is laminated over the entire upper surface 103a of the sealing resin layer 103, so that the heat generated from some of the components 102 with high heat generation is transmitted through the heat dissipation layer 105. Other parts may be affected.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems. It is intended to be less influential.

In order to achieve the above object, the module of the present invention comprises a wiring substrate, first and second components mounted on the main surface of the wiring substrate, abutment surfaces abutting on the wiring substrate, and corresponding a sealing resin layer having a facing surface facing a contact surface and sealing the first component and the second component; and a heat dissipation member provided on the facing surface of the sealing resin layer, When viewed from a direction perpendicular to the main surface of the wiring board, the heat dissipation member is arranged between the first component, the second component, and between the first component and the second component. A slit is formed in a region overlapping between the first part and the second part of the heat radiating member , and the slit does not divide the heat radiating member. and

According to this configuration, the heat dissipation member is arranged so as to overlap the first part, the second part, and between the first part and the second part, so that the heat dissipation characteristic of the module is improved. Furthermore, since the slit is formed in the overlapping region between the first component and the second component of the heat radiating member, for example, when one of the first component and the second component is a heat generating component, It is possible to suppress the heat from the other component from affecting the other component via the heat radiating member.

Further, the first component may be a component that generates a large amount of heat, the second component may be a component whose characteristics change due to the influence of heat, and the slit may be formed closer to the first component. According to this configuration , when the first component and the second component are close to each other, it is possible to prevent the heat generated from the first component from affecting the second component via the heat dissipation member.

Further, the first component may be a component that generates a large amount of heat, the second component may be a component whose characteristics change under the influence of heat, and the slit may be formed near the second component. According to this configuration , regardless of the distance between the first component and the second component, it is possible to suppress the heat generated from the first component from affecting the second component via the heat dissipation member.

Moreover, the slit may be formed along the periphery of the first component when viewed from a direction perpendicular to the main surface of the wiring board. According to this configuration, for example, when the first component is a heat-generating component, it is possible to make it difficult for the heat generated from the first component to be transmitted to the second component via the heat radiation member.

Moreover, the slit may be formed so as to surround the periphery of the first component. According to this configuration, for example, when the first component is a heat-generating component, it is possible to make it difficult for the heat generated from the first component to be transmitted to the second component via the heat radiation member.

Moreover, the slit may be formed along the periphery of the second component when viewed from a direction perpendicular to the main surface of the wiring board. According to this configuration, for example, when the first component is a heat-generating component, it is possible to make it difficult for the heat generated from the first component to be transmitted to the second component via the heat radiation member.

Moreover, the slit may be formed so as to surround the second component. According to this configuration, for example, when the first component is a heat-generating component, it is possible to make it difficult for the heat generated from the first component to be transmitted to the second component via the heat radiation member.

Moreover, the slit may have a first slit formed near the first component and a second slit formed near the second component. According to this configuration, regardless of the distance between the first part and the second part, the heat generated from one of the first part and the second part is prevented from being transmitted to the other part through the heat dissipation member. can be suppressed with certainty.

The sealing resin layer may further include a shield film covering at least the facing surface of the sealing resin layer and a side surface connecting edges of the facing surface and the contact surface, and the heat dissipation member may be disposed on the shield film. may be set. According to this configuration, since the surface of the sealing resin layer is covered with the shielding film, the shielding characteristics for the first component and the second component are improved.

According to the present invention, the heat dissipation member is arranged so as to overlap the first part, the second part, and between the first part and the second part, so that the heat dissipation characteristics of the module are improved. Furthermore, since the slit is formed in the overlapping region between the first component and the second component of the heat radiating member, for example, when one of the first component and the second component is a heat generating component, It is possible to suppress the heat from the other component from affecting the other component via the heat radiating member.

1 is a cross-sectional view of a module according to a first embodiment of the invention; FIG. Figure 2 is a plan view of the module of Figure 1; FIG. 2 shows a modification of the module of FIG. 1; FIG. 4 is a plan view of a module according to a second embodiment of the invention; 5 is a diagram showing a modification of the module of FIG. 4; FIG. FIG. 8 is a plan view of a module according to a third embodiment of the invention; FIG. 7 shows a modification of the module of FIG. 6; 1 is a cross-sectional view of a conventional module; FIG.

<First Embodiment>
A module 1a according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a cross-sectional view of the module 1a, taken along line AA in FIG. 2, and FIG. 2 is a plan view of the module 1a.

As shown in FIG. 1, a module 1a according to this embodiment includes a multilayer wiring board 2 (corresponding to the "wiring board" of the present invention) and a plurality of components 3a to 3a mounted on an upper surface 20a of the multilayer wiring board 2. 3d, a sealing resin layer 4 laminated on the upper surface 20a of the multilayer wiring board 2, a shield film 6 covering the surface of the sealing resin layer 4, and a heat sink provided on the upper surface 4a of the sealing resin layer 4. 5, and is mounted, for example, on a mother board or the like of an electronic device in which high-frequency signals are used.

The multilayer wiring board 2 is formed by laminating a plurality of insulating layers 2a to 2c formed of, for example, low-temperature co-fired ceramic, high-temperature co-fired ceramic, glass epoxy resin, or the like. Mounting electrodes 7 for mounting components 3a to 3d are formed on an upper surface 20a of the multilayer wiring board 2 (corresponding to the "main surface of the wiring board" of the present invention). A plurality of external electrodes 8 for external connection are formed on the lower surface 20 b of the multilayer wiring board 2 . Various internal wiring electrodes 9 are formed between the adjacent insulating layers 2a to 2c, and internal wiring electrodes 9 formed on different insulating layers 2a to 2c are arranged inside the multilayer wiring board 2. A plurality of via conductors 10 for connection are formed. The mounting electrodes 7, the external electrodes 8, and the internal wiring electrodes 9 are all made of a metal such as Cu, Ag, Al, or the like, which is generally used as a wiring electrode. Each via conductor 10 is made of metal such as Ag or Cu. Each mounting electrode 7 and each external electrode 8 may be plated with Ni/Au, Ni/Pd/Au, or Ni/Sn.

The parts 3a to 3d are composed of semiconductor elements such as ICs and PAs (power amplifiers) and chip parts such as chip inductors, chip capacitors and chip resistors, and are mounted on the multilayer wiring board 2 by general surface mounting techniques such as soldering. is implemented in In this embodiment, among the components 3a to 3d, the component 3a generates a large amount of heat when the module 1a is energized (corresponding to the "first component" of the present invention), and the components 3b and 3c generate heat. It is provided as a part (corresponding to the "second part" of the present invention) whose characteristics change depending on the influence.

The sealing resin layer 4 is made of resin such as epoxy resin which is generally used as sealing resin, and seals the components 3a to 3d. The sealing resin layer 4 has a lower surface 4b (corresponding to the "contact surface of the sealing resin layer" of the present invention) in contact with the multilayer wiring board 2, and an upper surface 4a (the "contact surface of the sealing resin layer" of the present invention) facing the lower surface 4b. and a side surface 4c.

The shield film 6 covers the surfaces (upper surface 4a and side surfaces 4c) of the sealing resin layer 4 and the side surfaces 20c of the multilayer wiring board 2, and also covers the ground electrodes (not shown) exposed on the side surfaces 20c of the multilayer wiring board 2. Connected.

The shield film 6 can be formed with a multi-layer structure including an adhesion film laminated on the upper surface 4a of the sealing resin layer 4, a conductive film laminated on the adhesion film, and a protective film laminated on the conductive film. (not shown). Here, the adhesion film is provided to increase the adhesion strength between the conductive film and the sealing resin layer 4, and can be made of metal such as SUS, for example. The conductive film is a layer that performs a substantial shielding function of the shield film 6, and can be made of, for example, any one of Cu, Ag, and Al. The protective film is provided to prevent the conductive film from being corroded or scratched, and can be made of SUS, for example.

A heat dissipation plate 5 (corresponding to a “heat dissipation member” of the present invention) is arranged on a portion of the shield film 6 that covers the upper surface 4 a of the sealing resin layer 4 . Further, in this embodiment, the area of the main surface of the heat sink 5 is substantially the same as the area of the upper surface 4a of the sealing resin layer 4, and the plane viewed from the direction perpendicular to the upper surface 20a of the multilayer wiring board 2 It has an area that visually overlaps with all the parts 3a to 3d. Also, the heat sink 5 is formed with three slits 11a to 11c penetrating through the heat sink 5 in the thickness direction. The first slit 11a is formed along the periphery of the component 3a (heat-generating component) in plan view, and surrounds the periphery of the component 3a. The second slit 11b is formed along the periphery of the component 3b in plan view and surrounds the periphery of the component 3b. The third slit 11c is formed along the periphery of the component 3c in a plan view and surrounds the component 3c. Therefore, in a plan view, slits 11a and 11b are formed in regions between the parts 3a (heat generating component) and the parts 3b of the heat sink 5, and the parts 3a (heat generating component) and the parts 3c of the heat sink 5 are separated from each other. Slits 11a and 11c are formed in the region between .

The radiator plate 5 is made of metal such as Cu or Al. As a method of forming the heat sink 5, for example, there is a method of placing and fixing a metal plate or metal foil on the shield film 6 and forming the slits 11a to 11c by laser processing. As another forming method, the heat sink 5 is formed by plating on the portion of the shield film 6 that covers the upper surface 4a of the sealing resin layer 4, and then the slits 11a to 11c are formed by laser processing, photolithography, or the like. There is also a way to form Alternatively, after attaching a metal plate or metal foil to the top surface of the module 1a after the formation of the shield film 6 (the portion of the shield film 6 covering the upper surface 4a of the sealing resin layer 4), the slits 11a to 11c are formed. A resist may be formed on a portion other than the intended position to be formed, the slit portion may be etched, and then the resist may be removed. Alternatively, as shown in FIGS. 3, 5, and 7, in a structure in which the heat sink 5 is connected (a structure in which a part is not separated), the heat sink 5 having the slits 11a to 11c formed in advance is attached. good too.

Therefore, according to the above-described embodiment, when viewed from the direction perpendicular to the upper surface 20a of the multilayer wiring board 2, the heat sink 5 has a large area having a region overlapping all the mounted components (components 3a to 3d). , the heat dissipation characteristics of the module 1a are improved. Slits 11a and 11b are formed in the area between the component 3a (heat generating component) and the component 3b of the heat sink 5, and the area between the component 3a (heat generating component) and the component 3c of the heat sink 5 are formed. Since the slits 11a and 11c are formed in , it is possible to suppress the heat from the component 3a, which is a heat-generating component, from affecting the other components 3b and 3c through the radiator plate 5. FIG.

Further, since the slit 11a is formed along the peripheral edge of the component 3a, heat generated from the component 3a can be made difficult to be transmitted to the other components 3b to 3d via the radiator plate 5. FIG. Furthermore, the slit 11b is formed along the peripheral edge of the component 3b, and the slit 11c is formed along the peripheral edge of the component 3c. By doing so, the heat generated from the component 3a can be made more difficult to be transmitted to the components 3b and 3c. In addition, the slits 11a to 11c completely separate the parts of the radiator plate 5 placed on the parts 3a to 3c from the other parts, so that the heat from the part 3a is transferred to the other parts 3b to 3d. The effect of making it difficult to transmit is further improved.

(Modified example of module 1a)
In the first embodiment described above, each of the slits 11a to 11c is formed in a shape surrounding the entire circumference of the target parts 3a to 3c. The target parts 3a to 3c may not be completely surrounded, but may be partially discontinued. At this time, it is preferable not to place the discontinuous portion in the region between the component 3a (heat generating component) and the component 3b, or in the region between the component 3a and the component 3c. Even if it does in this way, the effect equivalent to 1st Embodiment can be acquired. Also, in this case, the slits 11a to 11c may be formed before the radiator plate 5 is arranged on the shield film 6. FIG.

<Second embodiment>
A module 1b according to a second embodiment of the present invention will be described with reference to FIG. 4 is a plan view of the module 1b, corresponding to FIG. 2 of the first embodiment.

The module 1b according to this embodiment differs from the module 1a according to the first embodiment described with reference to FIGS. 1 and 2 in that the configuration of the heat sink 5 is different, as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the same reference numerals are given to omit the description.

In this case, in the first embodiment, the slits 11a to 11c (three in total) are provided along the peripheries of the components 3a to 3c, respectively. Only the slits 11a formed in this manner are formed. In other words, among the three slits 11a to 11c arranged in the area between the parts 3a and 3b and the area between the parts 3a and 3c in the first embodiment, the heat generating parts Only the slit 11a arranged near the part 3a is formed.

This configuration is suitable for making it difficult for the heat from the component 3a to be transmitted to the components 3b and 3c when the component 3a, which is a heat-generating component, and the components 3b and 3c that should be protected from the influence of heat are close to each other. there is

(Modified example of module 1b)
In the above-described second embodiment, the slit 11a is formed in a shape that surrounds the entire periphery of the component 3a, but as shown in FIG. You may make it enclose in the state which was interrupted. At this time, it is preferable not to place the discontinuous portion in the region between the component 3a (heat generating component) and the component 3b, or in the region between the component 3a and the component 3c. Even in this way, an effect equivalent to that of the second embodiment can be obtained. In this case, the slits 11a may be formed before the radiator plate 5 is arranged on the shield film 6. FIG.

<Third Embodiment>
A module 1c according to a third embodiment of the present invention will be described with reference to FIG. 6 is a plan view of the module 1c, corresponding to FIG. 2 of the first embodiment.

The module 1c according to this embodiment differs from the module 1a according to the first embodiment described with reference to FIGS. 1 and 2 in that the configuration of the radiator plate 5 is different, as shown in FIG. Since other configurations are the same as those of the module 1a of the first embodiment, the same reference numerals are given to omit the description.

In the first embodiment, slits 11a-11c (three in total) are provided along the periphery of each of the parts 3a-3c. On the other hand, in this embodiment, the slit 11b formed along the periphery of the component 3b and the slit 11c formed along the periphery of the component 3c are formed. A formed slit 11a is not provided. In other words, among the three slits 11a to 11c arranged in the area between the parts 3a and 3b and the area between the parts 3a and 3c in the first embodiment, none of them are heat generating parts. Only two slits 11b and 11c arranged near the parts 3b and 3c are formed.

According to this configuration, regardless of the distance between the component 3a, which is a heat-generating component, and the components 3b, 3c to avoid the influence of heat, it is possible to make it difficult for the heat from the component 3a to be transmitted to the components 3b, 3c.

(Modified example of module 1c)
In the above-described third embodiment, the slits 11b and 11c are formed in a shape surrounding the entire periphery of the parts 3b and 3c. For example, as shown in FIG. 3b and 3c may not be completely surrounded, but may be partially surrounded. At this time, it is preferable that the discontinuous portion is not arranged in the region between the component 3a (heat generating component) and the component 3b and the region between the component 3a and the component 3c. Even in this way, an effect equivalent to that of the third embodiment can be obtained. In this case, the slits 11b and 11c may be formed before the radiator plate 5 is arranged on the shield film 6. FIG.

The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, the configurations of the embodiments and modifications described above may be combined.

Further, in each of the above-described embodiments, the case where the heat-generating component (component 3a) and the components (components 3b, 3c) susceptible to heat are adjacent to each other has been described. The present invention can also be applied when is intervening. In this case, slits may be provided at desired locations in the area between the heat-generating component (component 3a) and the component 3b and between the heat-generating component (component 3a) and the component 3c in plan view. good.

Moreover, in each of the above-described embodiments, the heat sink 5 was described as an example of the heat sink, but the heat sink does not necessarily have a plate shape.

Moreover, in each of the above-described embodiments, the shield film 6 may be omitted.

Further, the present invention can be applied to various modules provided with a heat dissipation member for dissipating heat generated from components mounted on a wiring board.

1a to 1c module 2 multilayer wiring board (wiring board)
3a part (first part)
3b, 3c parts (second part)
4 Sealing resin layer 5 Heat sink (heat sink member)
11a-11c (slits)

Claims (9)

a wiring board;
a first component and a second component mounted on the main surface of the wiring board;
a sealing resin layer that has a contact surface that contacts the wiring board and a facing surface that faces the contact surface, and that seals the first component and the second component;
a heat dissipation member provided on the facing surface of the sealing resin layer,
When viewed from a direction perpendicular to the main surface of the wiring board, the heat dissipation member is arranged between the first component, the second component, and between the first component and the second component. have regions that overlap each other,
a slit is formed in a region of the heat radiating member that overlaps between the first component and the second component ;
The slit does not divide the heat dissipation member
A module characterized by The first component is a component that generates a large amount of heat,
The second part is a part whose characteristics change due to the influence of heat,
2. The module according to claim 1, wherein said slit is formed closer to said first component. The first component is a component that generates a large amount of heat,
The second part is a part whose characteristics change due to the influence of heat,
2. The module according to claim 1, wherein said slit is formed closer to said second component. 3. The module according to claim 2, wherein the slit is formed along the periphery of the first component when viewed from a direction perpendicular to the main surface of the wiring board. 5. The module according to claim 4, wherein said slit is formed so as to surround said first component. 4. The module according to claim 3, wherein the slit is formed along the periphery of the second component when viewed from a direction perpendicular to the main surface of the wiring board. 7. The module according to claim 6, wherein said slit is formed so as to surround said second part. 2. The module according to claim 1, wherein said slit has a first slit formed near said first component and a second slit formed near said second component. further comprising a shield film covering at least the facing surface of the sealing resin layer and a side surface connecting edges of the facing surface and the contact surface;
9. The module according to any one of claims 1 to 8, wherein said heat radiating member is arranged on said shield film.

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