JP2014194505A - Projector and head-up display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a projector having a heat dissipation unit which suppresses mutual heat interference among a plurality of heat-generating components and readily offers good handleability and mechanical strength.SOLUTION: A projector has a heat dissipation unit 30 on which a plurality of heat-generating components 142a-142c are mounted. The heat dissipation unit 30 is divided into a plurality of regions 31a-31c for thermally isolating the plurality of heat-generating components 142a-142c from each other. Each boundary section B1-B3 of the plurality of regions 31a-31c has a heat insulation space section 32a-32c formed therein to thermally isolate adjacent regions from each other. Each of the plurality of regions 31a-31c is partially connected with at least one of adjacent regions.

Description

  The present invention relates to a projector and a head-up display (HUD) device.

  Conventionally, solid-state light sources such as LEDs (Light Emitting Diodes) and LDs (Laser Diodes) have been used as light sources for projectors. In a projector using a solid-state light source, a Peltier element is attached to each light source module in order to suppress the temperature rise of a plurality of light sources, and a radiation fin is disposed on the opposite side of the light source module of the Peltier element. (See, for example, Patent Document 1).

  Patent Document 1 discloses a configuration in which a radiation fin is common to each light source module and a configuration in which a radiation fin is provided separately for each light source module (provided as a separate member).

JP 2010-169754 A

  For example, the output of a solid light source such as an LD varies depending on the temperature. For this reason, in a projector, for example, if an attempt is made to accurately reproduce a color without causing a white balance shift, it is desirable to control the temperature of each color (for example, RGB) solid light source independently. In this case, it is preferable that the radiation fin for radiating the heat generated from the Peltier element (heat generating component) is provided separately for each solid light source (light source module).

  However, if a radiation fin is provided separately for each light source module, there is a problem that handling of the radiation fin (for example, handling during assembly) becomes complicated. In order to eliminate the complexity, it is conceivable that the plurality of heat dissipating fins are gathered together using a fixing member having high heat insulating performance. However, a fixing member (for example, resin) having high heat insulation performance often has a property of being easily deformed by heat, and there is a problem that the mechanical strength of the structure including the radiation fins becomes insufficient.

  In view of the above points, an object of the present invention is to provide a projector including a heat radiating section that can suppress mutual interference of heat between a plurality of heat generating components and can ensure good handling properties and mechanical strength. . Another object of the present invention is to provide a HUD device that can provide accurate color reproducibility of a projected image by providing such a projector.

  In order to achieve the above object, a projector according to an aspect of the present invention is a projector including a heat radiating unit on which a plurality of heat generating components are mounted. The heat radiating unit includes a plurality of heat generating components that are thermally separated from each other. A plurality of regions are formed, and each boundary portion of the plurality of regions is provided with a heat insulating space that thermally separates the adjacent regions, and each of the plurality of regions includes at least one of the adjacent regions It is the structure (1st structure) partially connected with one.

  According to this configuration, the heat radiating portion is formed with a plurality of regions, and the heat insulating space is provided at each boundary portion of the plurality of regions. For this reason, the heat-generating components mounted in each of the plurality of regions are unlikely to cause thermal interference with each other. On the other hand, since the several area | region formed in a thermal radiation part is partially connected with at least 1 of the adjacent area | regions, a thermal radiation part can be handled as an integrated object. For this reason, the heat dissipating part provided in the projector having this configuration is easy to handle and easily secures mechanical strength.

  In the projector having the first configuration, the plurality of heat generating components are arranged close to each other, the heat insulating space is a slit, and each boundary portion of the plurality of regions is separated by the slit at least in the vicinity of the heat generating component. (The second configuration). According to this configuration, at least in the vicinity of the heat-generating component, each region is thermally separated by the slit. For this reason, the thermal interference between the heat-emitting components mounted in each of the plurality of regions can be suppressed. Note that the temperature on the outer peripheral side away from the heat generating component is sufficiently lower than the position where the heat generating component is present. For this reason, even if adjacent regions are connected on the outer peripheral side, there is little influence on thermal interference between the heat generating components.

  In the projector having the second configuration, it is preferable that the slit has a configuration (third configuration) in which a width is increased toward an outer peripheral side away from the heat generating component. According to this structure, since the heat insulation space provided between several area | regions can be enlarged as much as possible, the thermal interference between each heat-emitting components can further be suppressed.

  In the projector having the second or third configuration, a configuration (fourth configuration) in which corner portions included in the plurality of regions are provided in a substantially arc shape in the vicinity of the heat generating component is employed. preferable. According to this structure, the space | interval between each area | region can be enlarged, reducing the heat receiving area of each area | region which mounts a heat-emitting component in the vicinity of a heat-emitting component. For this reason, the thermal interference between heat-emitting components can be further suppressed.

  In the projector having the first configuration, the heat insulating space portion is a through hole that penetrates a mounting surface on which the heat generating component is mounted and a side surface opposite to the mounting surface, and the boundary portion includes the through hole. A configuration (fifth configuration) in which a plurality of lines are arranged may be employed. Also with this configuration, it is possible to ensure good handling and strength of the heat radiating portion while suppressing thermal interference between the heat-generating components.

  In the projector having the fifth configuration, at least one of the plurality of through holes is a tapered through hole in which an opening area of a surface opposite to the mounting surface is larger than an opening area of the mounting surface. It is preferable that this is the configuration (sixth configuration). According to this configuration, it is possible to effectively achieve thermal separation between heat-generating components mounted between adjacent regions using the venturi effect.

  In the projector having the fifth or sixth configuration, the plurality of heat generating parts are arranged close to each other, and the plurality of through holes are arranged in a place farther than a place close to the heat generating parts. It is preferable that the configuration is large (seventh configuration). According to this structure, since the heat insulation space provided between several area | regions can be enlarged as much as possible, the thermal interference between each heat-emitting components can further be suppressed. As an example of this configuration, the plurality of through holes may have a configuration in which the size gradually increases in a direction away from the heat-generating component, or a configuration in which the size gradually increases.

  In the projector having any one of the first to seventh configurations, the plurality of regions have a configuration (eighth configuration) having a different size according to a heat generation amount of the heat generating component. preferable. According to this structure, it is easy to perform heat dissipation of each heat-emitting component appropriately.

  In the projector having any one of the first to eighth configurations, the heat generating component may have a configuration (9th configuration) which is a Peltier element used for cooling the light emitting element. The heat generating component is not limited to the Peltier element, and may be a light emitting element, for example.

  In order to achieve the above object, a head-up display (HUD) device of the present invention has a configuration (tenth configuration) including the projector having any one of the first to ninth configurations. The HUD device of this configuration is configured so that the projector included in the device can easily control the temperature of a plurality of light sources independently, so that, for example, accurate color reproducibility is realized for a projection image projected from the projector. Easy to do.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to suppress the mutual interference of the heat between several heat-emitting components, a projector provided with the thermal radiation part which can ensure the favorable handleability and mechanical strength can be provided. Further, according to the present invention, by providing such a projector, it is possible to provide a HUD device in which the color reproducibility of the projected image is accurate.

Schematic of the HUD device according to an embodiment of the present invention 1 is a block diagram showing a configuration of a projector according to an embodiment of the invention 1 is an exploded perspective view of a housing included in a projector according to an embodiment of the invention. 1 is a schematic plan view showing a state in which an optical module is housed in a case in a projector according to an embodiment of the invention. 1 is a schematic cross-sectional perspective view showing a housing provided in a projector according to an embodiment of the invention and a configuration around the housing. FIG. 1 is a schematic plan view showing a configuration of a first form of heat sink provided in a projector according to an embodiment of the invention. Schematic top view which shows the structure of the heat sink of the 2nd form with which the projector which concerns on embodiment of this invention is provided. Schematic top view which shows the structure of the heat sink of the 3rd form with which the projector which concerns on embodiment of this invention is provided. The schematic diagram for demonstrating the structure of the through-hole provided in the heat sink of a 3rd form The schematic diagram for demonstrating the modification of the shape of the through-hole provided in the heat sink of a 3rd form

Hereinafter, embodiments of a projector and a HUD device according to the present invention will be described in detail with reference to the drawings.
<Schematic configuration of HUD device>

  FIG. 1 is a schematic diagram of a HUD device 100 according to an embodiment of the present invention. The HUD device 100 of this embodiment is mounted on a vehicle 8. Note that the HUD device 100 is not limited to a vehicle, and may be mounted on another vehicle (for example, an aircraft). The HUD device 100 is a display device that projects the scanning laser light 7 (projection light) from the projector 1 toward the windshield 81 and displays the projected image in the user's field of view. In FIG. 1, an alternate long and short dash line arrow 6 indicates the line of sight of the user sitting in the driver's seat of the vehicle 8.

As shown in FIG. 1, a combiner 82 formed using, for example, a semi-transmissive reflective material is attached to the inner surface of the windshield 81. By projecting the scanning laser beam 7 from the projector 1 onto the combiner 82, a virtual image is formed. As a result, the user who is looking in front of the vehicle (that is, in the direction of the line of sight 6) can view the external image in front of the vehicle 8 and the projection image projected from the projector 1 at the same time.
<Schematic configuration of projector>

  Next, the configuration of the projector 1 will be described. FIG. 2 is a block diagram showing a configuration of the projector 1 according to the embodiment of the present invention. Note that FIG. 2 also shows a windshield or the like to which a combiner 82 is attached for easy understanding.

  As shown in FIG. 2, the projector 1 includes a main body housing 15 that houses various components constituting the projector 1. The main body casing 15 is formed with a light emitting portion 15a from which the scanning laser light 7 is emitted. The light emitting portion 15a may be an opening, but is preferably formed using, for example, glass or a translucent resin material. By so doing, it is possible to prevent the intrusion of dust and moisture (for example, water containing water or air) into the main body housing 15.

  A housing 10, laser diodes 11 a to 11 c, an optical system 12, a thermistor 13, and heating and cooling units 14 a to 14 c are mounted in the main body housing 15. Hereinafter, the laser diode is referred to as LD. Further, in the main body casing 15, an LD driver 16, a mirror servo unit 17, a Peltier element driver 18, a power source unit 19, an input / output I / F 22, an operation unit 23, a storage unit 24, and a CPU 25. And. In addition, the projector 1 may further include an audio output unit such as a speaker.

  The housing 10 is an airtight casing that mounts the LDs 11a to 11c, the optical system 12, the thermistor 13, and the heating and cooling units 14a to 14c. Further, the housing 10 has a window 10a for emitting the scanning laser light 7 emitted from the optical system 12 to the outside, and an opening (not shown) in which heat conductive members 141a to 141c described later are disposed. , Is formed.

  The LD 11a is a light emitting element that emits blue laser light. The LD 11b is a light emitting element that emits green laser light. The LD 11c is a light emitting element that emits red laser light. In some cases, different light emitting elements such as LEDs may be used as the light source instead of the LD.

  The optical system 12 includes collimator lenses 121a to 121c, beam splitters 122a and 122b, and a MEMS (Micro Electro Mechanical System) mirror 124. In the optical system 12, other optical elements such as a prism and a condenser lens may be appropriately disposed.

  The collimator lenses 121a to 121c are optical elements that convert laser beams emitted from the LDs 11a to 11c into parallel beams. Further, the beam splitters 122a and 122b may be constituted by, for example, a dichroic mirror or a dichroic prism. In this case, the beam splitters 122a and 122b are optical elements that reflect light of a specific wavelength and transmit light of other wavelengths. The beam splitter 122a reflects blue laser light and transmits red and green laser light. The beam splitter 122b reflects green laser light and transmits red laser light. However, the beam splitters 122a and 122b are not limited to a dichroic mirror or the like, and may be formed of, for example, a half mirror. The MEMS mirror 124 includes an optical reflection element that reflects the incident laser light of each color.

  The MEMS mirror 124 can change the reflection direction of the laser light in the biaxial direction. The scanning laser beam 7 is emitted from the optical system 12 by the MEMS mirror 124 changing the reflection direction of the laser beam. The scanning laser light 7 passes through the window portion 10 a of the housing 10 and the light emitting portion 15 a of the main body housing 15, is emitted to the outside of the main body housing 15, and is projected on the combiner 82 on the windshield 81. .

  The thermistor 13 is a temperature detector provided inside the housing 10 in order to measure the environmental temperature of each of the LDs 11a to 11c. That is, the temperatures of the LDs 11a to 11c can be estimated from the temperatures detected by the thermistor 13. In FIG. 2, the operating temperature of each of the LDs 11a to 11c is measured using one thermistor 13, but the operating temperature of each of the LDs 11a to 11c may be individually measured using a plurality of thermistors 13. Good.

  The heating / cooling units 14 a to 14 c heat or cool the LDs 11 a to 11 c according to the temperature detected by the thermistor 13. The heating / cooling units 14a to 14c are configured to include heat conducting members 141a to 141c and Peltier elements 142a to 142c, respectively. The heat conducting members 141a to 141c are made of a material having a high thermal conductivity. For example, a metal material such as Cu, Al, Au, or an alloy containing at least one of them, a ceramic material having a high thermal conductivity, or the like. It is formed using. The heat conducting members 141a to 141c conduct heat between the LDs 11a to 11c and the Peltier elements 142a to 142c. The Peltier elements 142a to 142c are thermoelectric elements using the Peltier effect, and are elements that enable heating and cooling of the LDs 11a to 11c. The projector 1 includes a heat radiating portion for radiating heat generated from the Peltier elements 142a to 142b, and details thereof will be described later.

  The LD driver 16 performs drive control of the LDs 11a to 11c. The LD driver 16 is provided so that drive control regarding light emission, light output, and the like can be performed for each of the LDs 11a to 11c.

  The mirror servo unit 17 is a drive control unit that controls the MEMS mirror 124. For example, the mirror servo unit 17 drives the MEMS mirror 124 according to the horizontal synchronization signal from the CPU 25, and thereby the horizontal reflection direction on the MEMS mirror 124 is scanned. Further, the mirror servo unit 17 drives the MEMS mirror 124 in accordance with the vertical synchronization signal from the CPU 25, and thereby the vertical reflection direction on the MEMS mirror 124 is scanned.

  The Peltier element driver 18 performs drive control of each Peltier element 142a-142c. The Peltier element driver 18 is provided so as to be able to perform drive control of the heating operation and the cooling operation for each of the Peltier elements 142a to 142c. Note that the Peltier element driver 18 includes a switching unit for switching operations (heating operation, cooling operation, operation stop, etc.) of the Peltier elements 142a to 142c. For example, an FET (Field Effect Transistor) or the like is used for the switching unit.

  The power supply unit 19 receives supply of power from a power source such as a storage battery (not shown) of the vehicle 8, for example, converts the voltage into voltage according to each component of the projector 1, and converts the converted power into each component Supply to the department. The input / output I / F 22 is a communication interface for wired communication or wireless communication with an external device. The operation unit 23 is an input unit that receives a user operation input.

  The storage unit 24 is a non-volatile storage medium, and stores programs and control information used by each component (for example, the CPU 25) of the projector 1. In addition, the storage unit 24 stores, for example, video information to be projected on the combiner 82. In FIG. 2, the storage unit 24 is a configuration unit different from the CPU 25, but is not limited to this example, and may be included in the CPU 25.

  The CPU 25 is a control unit that controls each component of the projector 1 using a program and control information stored in the storage unit 24. The CPU 25 includes a video processing unit 251, an LD control unit 252, a mirror control unit 256, and a heating / cooling control unit 253.

  The video processing unit 251 executes processing related to a program stored in the storage unit 24, information input from the input / output I / F 22, information stored in the storage unit 24, and the like. The video processing unit 251 converts the generated video information into video data of three colors of red (R), green (G), and blue (B). The converted three-color video data is output to the LD control unit 252. The LD control unit 252 generates a light control signal for each of the LDs 11 a to 11 c based on the three-color video data, and outputs the light control signal to the LD driver 16. Further, the mirror control unit 256 generates a control signal for controlling the direction of the MEMS mirror 124 based on the video information, and outputs the control signal to the mirror servo unit 17.

  The heating / cooling control unit 253 generates a control signal for performing drive control of each of the Peltier elements 142 a to 142 c based on, for example, information obtained from the thermistor 13 and outputs the control signal to the Peltier element driver 18.

  In the above, the video processing unit 251, the LD control unit 252, the heating / cooling control unit 253, and the mirror control unit 256 are realized as functional units of the CPU 25, but at least a part or all of them are physically It may be realized by a typical component (for example, an electric circuit).

  Next, the housing 10 provided in the projector 1 and the surrounding structure will be described in detail. FIG. 3 is an exploded perspective view of the housing 10 included in the projector 1 according to the embodiment of the invention. As shown in FIG. 3, the housing 10 generally includes a case 101 and a cover 111.

  The case 101 is a box-shaped member whose outer shape is a substantially rectangular parallelepiped shape. The case 101 is made of, for example, a resin having low thermal conductivity. A first opening 101a having a substantially rectangular shape in plan view is formed in one of the two substantially parallel side walls in the longitudinal direction (X direction in FIG. 3) of the case 101. A plurality of electrical connection terminals 102a provided in the electrical connection terminal portion 102 are fitted into the first opening 101a. As a result, the electrical connection terminals 102a are exposed to the outside and the inside of the case 101, and the electrical circuit inside the case 101 can be electrically connected to the outside. The electrical connection terminal portion 102 has an outer peripheral side (the electrical connection terminal 102a is not provided) in a state where a seal member 103 (for example, an O-ring) for ensuring airtightness in the housing 10 is sandwiched therebetween. Part) is screwed to the side wall of the case 101.

  In addition, a second opening 101b having a substantially rectangular shape in plan view is formed in one of the substantially central portions of two side walls parallel to the short side direction (Y direction in FIG. 3) of the case 101. Further, a wall 101c is erected so as to surround the second opening 101b on the outer surface side of the side wall where the second opening 101b is formed, and a recessed space is formed. A glass window 104 is fitted into the recessed space so as to cover the second opening 101b. Note that the window 104 only needs to be made of a material having a high visible light transmittance, and the constituent material is not limited to glass. The window 104 is fixed by a window frame 106 in which an opening 106 a for transmitting light is formed, together with a seal member 105 (for example, an O-ring) for ensuring airtightness in the housing 10. The window frame 106 is fixed to the side wall of the case 101 by screws. Using the window 104 and the window frame 106, the above-described window portion 10a (see FIG. 2) is formed.

  In addition, three third openings 101d into which the three heat conducting members 141a to 141c are fitted are formed in the bottom wall of the case 101. In FIG. 3, only two third openings 101d are shown. The third opening 101d is provided near one end in the longitudinal direction (X direction) of the case 101 (opposite the side where the window 104 is provided). Each of the three heat conducting members 141a to 141c has a constricted shape at the center, and is attached to the case 101 in a state where a seal member 107 (for example, an O-ring or the like) is fitted in this portion. For this reason, airtightness inside the housing 10 is ensured despite the presence of the third opening 101d.

  In the case 101, an optical module 108 on which the three LDs 11a to 11c and the optical system 12 are mounted is accommodated. The optical module 108 is fixed in the case 101 by, for example, screwing. FIG. 4 is a schematic plan view showing a state in which the optical module 108 is housed in the case 101 in the projector 1 according to the embodiment of the present invention. In FIG. 4, an electrical connection terminal portion 102 and a window 104 are also attached. In FIG. 4, the laser beam L is also illustrated for easy understanding. 3 and 4, the left and right orientations of the housing 10 are opposite.

  In a state where the optical module 108 is accommodated in the case 101, thermal connection between the LDs 11a to 11c and the corresponding heat conducting members 141a to 141c (see FIG. 2) is obtained. In order to obtain a thermal connection, thermally conductive grease or the like may be used as appropriate. In addition, the electric circuits constituting the LDs 11a to 11c and the MEMS mirror 124 are electrically connected to the electric connection terminal 102a.

  When the reinforcing member 109 is accommodated in the case 101 and the cover 111 is placed in a state where the optical module 108 is accommodated in the case 101, the housing 10 in which the optical module 108 and the like are accommodated is obtained. In addition, in order to ensure the airtightness in the housing 10, when the cover 111 is covered, the seal member 110 is sandwiched. The cover 111 may be configured to be screwed to the case 101, but in the present embodiment, as illustrated in FIG. 5 described later, the cover 111 is screwed to another member (frame member).

FIG. 5 is a schematic cross-sectional perspective view showing the housing 10 provided in the projector 1 according to the embodiment of the present invention and the surrounding configuration. 3 and 5, the left and right directions of the housing 10 are reversed. As shown in FIG. 5, on the lower side of the housing 10, a heat radiating plate 30 having a large number of fins 30 a provided on the lower surface side thereof is disposed. The heat radiating plate 30 is composed of a member having high thermal conductivity, and is composed of, for example, aluminum, copper, an alloy containing any of them. Three Peltier elements 142 a to 142 c are arranged on the heat sink 30. The three Peltier elements 142a to 142c are disposed so as to be thermally connected to the lower surfaces of the corresponding heat conducting members 141a to 141c (see FIG. 2).
<Details of cooling structure>

  In the projector 1 according to the present embodiment, the LD 11a to 11c can be heated and cooled using the Peltier elements 142a to 142c as described above in consideration of the performance guarantee range regarding the temperatures of the LDs 11a to 11c. In particular, the temperature upper limit value that guarantees the performance of each of the LDs 11a to 11c (for example, 50 ° C. for the red LD 11c, 60 ° C. for the green LD 11b, and 80 ° C. for the blue LD 11a) is severe, and the structure for cooling the LD 11a to 11c ( Cooling structure) becomes important. For example, in order to accurately reproduce the color without upsetting the white balance, it is preferable to control the temperatures of the LDs 11a to 11c independently. For this reason, in the projector 1 of the present embodiment, one Peltier element 142a to 142c is provided for each of the LDs 11a to 11c as described above.

  When cooling is performed by the Peltier elements 142a to 142c, it is necessary to dissipate heat generated from the Peltier elements 142a to 142c in order to obtain a desired cooling effect. For this reason, in the projector 1 of this embodiment, the heat sink 30 is arrange | positioned under the Peltier elements 142a-142c (refer FIG. 5). In the present embodiment, for example, in consideration of handleability, mechanical strength, and the like, instead of providing a heat sink independently for each Peltier element 142a to 142c (providing a plurality of heat sinks), the heat sink 30 Is one (one piece). When one heat sink 30 is used, there is usually a concern that it becomes difficult to control the temperature of each of the LDs 11a to 11c independently due to heat wraparound. However, the heat sink 30 according to the embodiment has a structure that wipes out this concern. Hereinafter, a plurality of forms of the heat sink 30 will be described.

In addition, LD11a-11c is an example of the light emitting element of this invention. The heat sink 30 is an example of a heat radiating portion of the present invention. The Peltier elements 142a to 142c are examples of the heat generating component of the present invention.
(First form)

  FIG. 6 is a schematic plan view showing the configuration of the first form of heat dissipation plate 30 provided in the projector 1 according to the embodiment of the present invention. FIG. 6 is a view of the heat sink 30 as viewed from the side (upper side) where the Peltier elements 142a to 142c are arranged. As shown in FIG. 6, the heat radiating plate 30 is formed with three regions 31 a to 31 c for thermally separating the three Peltier elements 142 a to 142 c from each other.

  A first Peltier element 142a for cooling the blue LD 11a is mounted in the first region 31a. A second Peltier element 142b for cooling the green LD 11b is mounted in the second region 31b. A third Peltier element 142c for cooling the red LD 11c is mounted in the third region 31c. The three Peltier elements 142a to 142c are arranged close to each other (closely arranged). This follows the fact that, for example, the three LDs 11a to 11c are arranged close to each other in order to satisfy the demand for miniaturization of the projector 1 and the like. Each Peltier element 142a to 142c applies heat to the heat radiating plate 30 disposed on the lower side when the LDs 11a to 11c are cooled (that is, behaves as a heat generating component).

  A first slit 32a obtained by cutting out the heat sink 30 is formed at a boundary portion B1 between the first region 31a and the second region 31b. The 1st slit 32a is extended toward the outer peripheral side from the inner peripheral side of the heat sink 30 with which Peltier device 142a-142c is arrange | positioned closely. However, the first slit 32a does not extend to the outer peripheral end but extends to the front of the outer peripheral end. In other words, the first slit 32a does not completely separate the first region 31a and the second region 31b, and the first region 31a and the second region 31b are the first connection portion 33a. It is in a connected state.

  Similarly, a second slit 32b is formed at a boundary portion B2 between the second region 31b and the third region 31c. The second slit 32b extends from the inner peripheral side of the heat radiating plate 30 to the front of the outer peripheral end. The second region 31b and the third region 31c are in a state of being connected by the second connection portion 33b. Similarly, a third slit 32c is formed at a boundary portion B3 between the third region 31c and the first region 31a. The third slit 32c extends from the inner peripheral side of the heat radiating plate 30 to the front of the outer peripheral end. The third region 31c and the first region 31a are in a state of being connected by the third connection portion 33c.

  The ends of the slits 32a to 32c on the inner peripheral side (that is, in the vicinity of the Peltier elements 142a to 142c) are connected. Therefore, the regions 31a to 31c are separated from each other by slits 32a to 32c in the vicinity of the Peltier elements 142a to 142c. On the other hand, since each of the regions 31a to 31c has three connection portions 33a to 33c on the outer peripheral side, the regions 31a to 31c are partially connected to the adjacent regions, and the heat dissipation plate 30 is an integrated object. .

  When the heat sink 30 is configured in this manner, slits 32a to 32c functioning as heat insulating spaces exist in the vicinity of the Peltier elements 142a to 142c. For this reason, it can suppress that the heat_generation | fever in each Peltier element 142a-142c interferes with another Peltier element (thermal interference).

  Each of the regions 31a to 31c is connected to an adjacent region on the outer peripheral side, but on the outer peripheral side, the temperature is sufficiently lowered as compared with the position near the Peltier elements 142a to 142c. For this reason, even if the outer peripheral side is connected, the influence (thermal interference) exerted on the other Peltier elements by the heat generated in the Peltier elements 142a to 142c is small. In this sense, the area (width) of each of the connection portions 33a to 33c is preferably as small as possible. However, if the width of each of the connection portions 33a to 33c is too narrow, the mechanical strength is lowered. The area of each connection part 33a-33c should just be determined suitably by the balance of these both.

  As can be seen from the above, in this embodiment, the temperature control of each of the LDs 11a to 11c can be easily performed independently, and accurate color reproducibility can be realized for the projection image of the projector 1. In the present embodiment, the area of the third region 31c (the same applies to the second region 31b) on which the third Peltier element 142c is mounted (for example, because the temperature guarantee range is narrow) is likely to increase. Is made larger than the area of the first region 31a on which the first Peltier element 142a having a relatively small amount of heat generation is mounted. By such a device, it is easy to perform appropriate heat dissipation, and as a result, temperature control of each of the LDs 11a to 11c can be easily performed independently. In the present embodiment, as an example, the first Peltier element 142a is 6 mm square, but the second and third Peltier elements 142b and 142c are 12 mm square.

  Moreover, in this embodiment, since the heat sink 30 is an integral object, its handleability is good and it is easy to assemble the apparatus. Furthermore, since the heat radiating plate 30 is an integrated object, it is easier to ensure mechanical strength than when the heat radiating plates are provided separately (as separate members) for the Peltier elements 142a to 142c. In addition, in this embodiment, each area | region 31a-31c is a structure connected partially with all the adjacent areas, However, It is not the meaning limited to this structure. In some cases, each of the regions 31a to 31c may be configured to be partially connected only to any one of the adjacent regions. Also in this case, the heat sink 30 can be handled as an integral object.

  Further, in the present embodiment, as a desirable configuration, the slits 32a to 32c are configured to increase in width from the inner peripheral side toward the outer peripheral side. This is because the width of the slits 32a to 32c cannot be increased on the inner peripheral side where the three Peltier elements 142a to 142c are dense, but the width of the slits 32a to 32c can be increased on the outer peripheral side. With this configuration, the gap (heat insulating space) between the regions 31a to 31c can be increased as much as possible, so that thermal interference between the Peltier elements 142a to 142c can be further suppressed. Note that the present invention is not limited to this, and includes a configuration in which the widths of the slits 32a to 32c are constant.

Moreover, according to the structure of this embodiment, each area | region 31a-31c will be in the state which supports each Peltier element 142a-142c by a cantilever structure. For this reason, even when the heights of the Peltier elements 142a to 142c are not aligned, the Peltier elements 142a to 142c are in contact with the heat conducting members 141a to 141c (see FIGS. 3 and 5) without fail. Easy to get.
(Second form)

  FIG. 7 is a schematic plan view showing the configuration of the second form of heat sink 30 provided in the projector 1 according to the embodiment of the present invention. FIG. 7 is a view of the heat dissipation plate 30 as viewed from the side (upper side) where the Peltier elements 142a to 142c are arranged. The structure of the heat sink 30 of the second form is substantially the same as the structure of the heat sink 30 of the first form described above. For this reason, the following description will focus on different parts.

  As shown in FIG. 7, in the heat radiation plate 30 of the second embodiment, the corner 311 a of the first region 31 a and the corner 311 c of the third region 31 c that exist in the vicinity of the Peltier elements 142 a to 142 c are substantially arc-shaped. As rounded. This point is different from the heat sink 30 of the first embodiment. In addition, in FIG. 7, the structure shown with a broken line corresponds to the structure of a 1st form. Moreover, in this embodiment, the corner | angular part which exists in the vicinity of the Peltier elements 142a-142c does not exist in the 2nd area | region 31b. When such a corner portion is also present in the second region 31b, the corner portion may also have a substantially arc shape.

  When the corners 311a and 311c are substantially arc-shaped like the heat radiation plate 30 of the second form, the heat receiving area is reduced for a part that is particularly susceptible to heat from Peltier elements mounted in other regions. can do. Moreover, if comprised in this way, heat insulation space can be enlarged in the Peltier element 142a-142c vicinity. Therefore, the effect of further suppressing the possibility that the heat generated in each of the Peltier elements 142a to 142c interferes with other Peltier elements (thermal interference) can be expected as compared with the case of the first embodiment.

In addition, although the effect similar to the heat sink 30 of the 1st form mentioned above is acquired also in the heat sink 30 of a 2nd form, description of this point is abbreviate | omitted. Moreover, although the heat sink 30 of a 2nd form can perform the deformation | transformation similar to the heat sink 30 of a 1st form, description of this point is also abbreviate | omitted.
(Third form)

  FIG. 8 is a schematic plan view showing the configuration of the third heat dissipation plate 30 provided in the projector 1 according to the embodiment of the present invention. FIG. 8 is a view of the heat dissipation plate 30 as viewed from the side (upper side) where the Peltier elements 142a to 142c are arranged. As shown in FIG. 8, the heat radiating plate 30 is formed with three regions 31 a to 31 c for thermally separating the three Peltier elements 142 a to 142 c from each other. However, the structure of the heat sink 30 of the third form is different from the structure of the heat sink 30 of the first form or the second form in the structure of thermally separating the Peltier elements 142a to 142c mounted in the regions 31a to 31b. . Hereinafter, description overlapping with the heat dissipation plate 30 of the first and second embodiments will be omitted as much as possible, and description will be made focusing on different portions.

  In each of the boundary portions B1 to B3 of the three regions 31a to 31c, a plurality (a large number) of through holes 34 are arranged at intervals. Each through-hole 34 includes a mounting surface (upper surface of the heat dissipation plate 30) on which the Peltier elements 142a to 142c are mounted, and a side surface opposite to the mounting surface (lower surface of the heat dissipation plate 30: a portion having the fins 30a is a lower surface of the fin 30a). Is a hole having a substantially circular shape in plan view. Moreover, as shown in FIG. 9, each through-hole 34 has a tapered shape. The through hole 34 has a shape in which the opening area on the lower surface side is larger than the opening area on the upper surface side, and the width becomes narrower from the lower surface side toward the upper surface side.

  In addition, about the size and number of the through-holes 34, and the space | interval between the through-holes 34, the structure shown in FIG. 8 is only an example, These may be changed suitably. Moreover, although the broken-line circle is shown in FIG. 8, this indicates that the through hole 34 has a tapered shape. In some cases, not all the through holes 34 are tapered, but some of the through holes 34 may be tapered. FIG. 9 is a schematic view for explaining the structure of the through hole 34 provided in the heat dissipation plate 30 of the third embodiment.

  As described above, the plurality of through holes 34 provided in the boundary portions B1 to B3 are arranged at intervals. For this reason, each of the three regions 31a to 31c is partially connected to the adjacent region. In other words, there are a plurality of connecting portions (portions connecting regions) in each of the boundary portions B1 to B3. Therefore, the heat sink 30 is a single piece.

  Thus, when the heat sink 30 is comprised, each through-hole 34 arrange | positioned at each boundary part B1-B3 becomes heat insulation space. In particular, the through hole 34 is provided in a tapered shape. For this reason, the warm air (easy to rise) sucked into the through holes 34 on the fin 30a side escapes to the upper surface of the heat radiating plate 30 while being accelerated by the venturi effect. Due to this air flow, the temperature around the through hole 34 tends to decrease (heat dissipation is promoted), and as a result, thermal separation between the Peltier elements 142a to 142c mounted between adjacent regions can be achieved. . Note that there is a space between the heat sink 30 and the bottom surface of the housing 10, and such an air flow can be expected (see FIG. 5).

  As can be seen from the above, even in the configuration using the heat radiation plate 30 of the third embodiment, the heat generated in the Peltier elements 142a to 142c mounted in the regions 31a to 31c interferes with other Peltier elements (thermal interference). This can be suppressed. Therefore, the temperature control of each of the LDs 11a to 11c can be easily performed independently, and accurate color reproducibility can be realized for the projection image of the projector 1.

  Also in the third embodiment, since the heat radiating plate 30 is a unitary object, its handleability is good and it is easy to assemble the apparatus. Furthermore, since the heat radiating plate 30 is an integrated object, it is easier to ensure mechanical strength than when the heat radiating plates are provided separately (as separate members) for the Peltier elements 142a to 142c.

  Moreover, as for the heat sink 30 of 3rd form, the size of the through-hole 34 of the outer peripheral side is larger than the through-hole 34 of inner peripheral side (Peltier element 142a-142c vicinity) as a desirable structure. . This is because the size of the through hole 34 cannot be increased on the inner peripheral side where the three Peltier elements 142a to 142c are dense, but the size of the through hole 34 can be increased on the outer peripheral side. With this configuration, the thermal separation between the regions 31a to 31c can be made as great as possible, and the thermal interference between the Peltier elements 142a to 142c can be further suppressed. The size of the through hole 34 may be gradually increased toward the outer periphery, or may be increased stepwise. In some cases, all the sizes of the through holes 34 may be the same.

In the third embodiment, the shape of the through hole 34 is substantially circular in plan view, but the shape of the through hole 34 is not limited to this shape. For example, a plan view substantially oval shape or a plan view substantially teardrop shape (see FIG. 10) may be used. In the case of such a shape, it is possible to promote thermal separation between the regions 31a to 31c by changing the flow velocity in the direction parallel to the mounting surface of the radiator plate 30 (by the Venturi effect). In this case, the tapered shape in the vertical direction may be eliminated. FIG. 10 is a schematic diagram for explaining a modified example of the shape of the through hole 34 provided in the heat dissipation plate 30 of the third embodiment. In FIG. 10, the direction of the through hole 34 may be changed as appropriate.
<Others>

  The embodiment described above is an exemplification of the present invention, and the scope of application of the present invention is not limited to the configuration of the embodiment described above. Of course, the above embodiments may be modified as appropriate without departing from the technical idea of the present invention. Moreover, each embodiment may be suitably combined within a possible range.

  For example, in the embodiment described above, an example in which the heat generating component is a Peltier element has been described. However, the present invention is not limited to this, and in some cases, the heat generating component may be a light emitting element such as an LED or an LD. I do not care.

  Further, in the embodiment described above, the case where the number of regions in which the heat-generating components (Peltier elements) are thermally separated from each other is three is shown in the present invention. Of course, the number may be different from the number of the embodiments.

  Moreover, in embodiment shown above, although heat conductive member 141a-141c is arrange | positioned between LD11a-11c and Peltier element 142a-142c, depending on the case, heat conductive member 141a-141c is not arrange | positioned. It is good also as a structure.

  Moreover, you may employ | adopt a taper shape similarly to the 3rd form about the slits 32a-32c provided in the thermal radiation part 30 of a 1st form or a 2nd form. The taper shape may be provided partially (for example, only on the inner peripheral side) instead of the whole. If comprised in this way, the effect which enlarges the clearance gap (heat insulation space) between each area | region 31a-31c can be acquired.

1 projector 11a-11c LD (light emitting element)
30 heat-radiating part 31a 1st area | region 31b 2nd area | region 31c 3rd area | region 32a-32c Slit (heat insulation space part)
34 Through hole (heat insulation space)
100 HUD device 142a-142c Peltier element (heat generating component)
311a, 311c Corner part B1-B3 Boundary part

Claims (10)

A projector including a heat radiating portion on which a plurality of heat generating components are mounted,
A plurality of regions for thermally separating the plurality of heat generating components from each other are formed in the heat dissipation portion,
Each boundary portion of the plurality of regions is provided with a heat insulating space portion that thermally separates the adjacent regions,
Each of the plurality of regions is partially connected to at least one of the adjacent regions. The plurality of heat generating components are arranged close to each other,
The heat insulating space is a slit,
2. The projector according to claim 1, wherein each boundary portion of the plurality of regions is separated by the slit at least in the vicinity of the heat generating component.   The projector according to claim 2, wherein the slit is widened toward an outer peripheral side away from the heat generating component.   4. The projector according to claim 2, wherein corners included in the plurality of regions are provided in a substantially arc shape in the vicinity of the heat generating component. 5. The heat insulation space is a through-hole penetrating a mounting surface on which the heat generating component is mounted and a side surface opposite to the mounting surface.
The projector according to claim 1, wherein a plurality of the through holes are arranged in the boundary portion.   At least one of the plurality of through holes is a tapered through hole that has a larger opening area on the surface opposite to the mounting surface than the opening area of the mounting surface. The projector according to claim 5. The plurality of heat generating components are arranged close to each other,
7. The projector according to claim 5, wherein the plurality of through-holes are larger in size when they are arranged at a location farther than a location near the heat-generating component.   The projector according to claim 1, wherein the plurality of regions have different sizes according to the amount of heat generated by the heat-generating component.   The projector according to claim 1, wherein the heat generating component is a Peltier element used to cool the light emitting element.   A head-up display device comprising the projector according to claim 1.

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