JP2019009399A - Electronic apparatus - Google Patents
Electronic apparatus Download PDFInfo
- Publication number
- JP2019009399A JP2019009399A JP2017126732A JP2017126732A JP2019009399A JP 2019009399 A JP2019009399 A JP 2019009399A JP 2017126732 A JP2017126732 A JP 2017126732A JP 2017126732 A JP2017126732 A JP 2017126732A JP 2019009399 A JP2019009399 A JP 2019009399A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat
- generating component
- heat generating
- base member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本発明は、電子機器における冷却部品の実装の技術に関するものである。 The present invention relates to a technique for mounting a cooling component in an electronic device.
電子機器における冷却部品の実装の技術としては、電子回路基板上に搭載されたCPUやSoC(System on a Chip)などの発熱部品の上面（電子回路基板と反対側の面）に、受熱板を密着配置し、受熱板に連結したヒートパイプで、発熱部品から受熱板に伝導した熱を放熱フィンに輸送して放熱することにより、発熱部品の冷却を行う技術が知られている（たとえば、特許文献１）。 As a technology for mounting cooling components in electronic equipment, a heat receiving plate is placed on the upper surface (surface opposite to the electronic circuit board) of the heat generating parts such as CPU and SoC (System on a Chip) mounted on the electronic circuit board. There is a known technology for cooling a heat-generating component by transporting heat conducted from the heat-generating component to the heat-receiving plate to a heat-dissipating fin and dissipating it with a heat pipe that is closely attached and connected to the heat-receiving plate (for example, a patent Reference 1).
ここで、この技術では、受熱板を発熱部品の上面に押圧する押圧部材を、電子回路基板の裏側（発熱部品が搭載されている面と反対側の面）に配置した部材に、発熱部品の近傍の位置に設けた電子回路基板の複数の孔を利用して、当該部材と押圧部材との間に電子回路基板と発熱部品と受熱板を挟み込むように連結することにより、発熱部品の上面への受熱板の密着配置を実現している。 Here, in this technique, the pressing member that presses the heat receiving plate against the upper surface of the heat generating component is disposed on the member disposed on the back side of the electronic circuit board (the surface opposite to the surface on which the heat generating component is mounted). By utilizing a plurality of holes in the electronic circuit board provided in the vicinity, and connecting the electronic circuit board, the heat generating component, and the heat receiving plate between the member and the pressing member, the upper surface of the heat generating component can be obtained. The heat receiving plate is closely attached.
また、このような発熱部品の近傍の位置に設けた電子回路基板の複数の孔を利用して、発熱部品の上面への受熱板の密着配置を行う技術としては、発熱部品を搭載した電子回路基板が、発熱部品のサイズがほぼ同様であるサブ基板である場合に、サブ基板をメイン基板に固定するための孔を共用して、受熱板を発熱部品の上面に押圧する押圧部材をサブ基板に固定し、サブ基板に固定した押圧部材で当該孔の位置を支点として発熱部品を押圧して、発熱部品の上面への受熱板の密着配置を実現する技術も知られている（たとえば、特許文献２）。 In addition, as a technique for arranging the heat receiving plate in close contact with the upper surface of the heat generating component using a plurality of holes of the electronic circuit board provided in the vicinity of such a heat generating component, an electronic circuit having the heat generating component mounted thereon is used. When the substrate is a sub-substrate having substantially the same size of the heat-generating component, the sub-substrate has a pressing member that presses the heat receiving plate against the upper surface of the heat-generating component by sharing a hole for fixing the sub-substrate to the main substrate. A technique is also known in which the heat-receiving component is pressed to the upper surface of the heat-generating component by pressing the heat-generating component with a pressing member fixed to the sub-board as a fulcrum (for example, a patent) Reference 2).
上述した発熱部品の近傍の位置に設けた電子回路基板の複数の孔を利用して、発熱部品の上面への受熱板の密着配置を行う技術によれば、当該孔の存在のために、発熱部品の周辺に電子部品の搭載や回路パターンの形成に用いることのできない領域が発生するために、電子部品や回路パターンの実装効率が低下する。 According to the technique in which the heat receiving plate is disposed in close contact with the upper surface of the heat generating component using the plurality of holes of the electronic circuit board provided in the vicinity of the heat generating component described above, heat is generated due to the presence of the hole. Since an area that cannot be used for mounting an electronic component or forming a circuit pattern is generated around the component, the mounting efficiency of the electronic component or the circuit pattern is lowered.
なお、上掲した押圧部材のサブ基板に対する固定に用いる発熱部品の近傍の位置の孔として、サブ基板をメイン基板に固定するための孔を共用する技術によれば、電子部品や回路パターンの実装効率の低下は生じないが、この技術は、発熱部品と発熱部品を搭載した電子回路基板のサイズがほぼ同様である場合にのみ適用可能であり、発熱部品と発熱部品を搭載した電子回路基板のサイズの差が大きい場合には、押圧部材の電子回路基板に対する固定に用いる発熱部品の近傍の位置の孔の他に、安定的な電子回路基板の固定のための孔が別途必要となり、電子部品や回路パターンの実装効率が低下する。 In addition, according to the technology that shares the hole for fixing the sub board to the main board as the hole in the vicinity of the heat generating part used for fixing the pressing member to the sub board, the mounting of the electronic component and the circuit pattern is performed. Although the efficiency does not decrease, this technology can be applied only when the size of the heat generating component and the electronic circuit board on which the heat generating component is mounted is substantially the same. When the difference in size is large, in addition to the hole in the vicinity of the heat generating component used for fixing the pressing member to the electronic circuit board, an additional hole for stable fixing of the electronic circuit board is necessary. And circuit pattern mounting efficiency decreases.
なお、押圧部材を電子回路基板に対して固定するための孔を、電子回路基板の周縁部などの電子部品や回路パターンの実装に用いられない領域に設ければ、電子部品や回路パターンの実装効率の低下は抑制されるが、押圧部材を電子回路基板に対して固定するための孔を発熱部品から遠い位置に配置することとなり、押圧部材を大型化する必要が生じたり、受熱板を発熱部品に押しつける方向と垂直な方向に、発熱部品から遠い位置を支点として受熱板を発熱部品の上面に充分な力をもって押さえつけるための特別な構造が押圧部材に必要となるなど、発熱部品の上面へ受熱板の密着配置するための構造の規模の増大や複雑化を招いてしまう。 In addition, if a hole for fixing the pressing member to the electronic circuit board is provided in an area that is not used for mounting an electronic component or a circuit pattern such as a peripheral portion of the electronic circuit board, the electronic component or the circuit pattern is mounted. Although a decrease in efficiency is suppressed, a hole for fixing the pressing member to the electronic circuit board is arranged at a position far from the heat generating component, so that the pressing member needs to be enlarged or the heat receiving plate generates heat. To the upper surface of the heat generating component, a special structure is required for the pressing member to press the heat receiving plate against the upper surface of the heat generating component with sufficient force in a direction perpendicular to the direction of pressing against the heat generating component. This increases the scale and complexity of the structure for closely arranging the heat receiving plates.
また、このことは、発熱部品と発熱部品を搭載した電子回路基板のサイズの差が大きい場合に、押圧部材を電子回路基板に対して固定するための孔として、通常、電子回路基板の周縁部に設けられる電子回路基板固定用の孔を共用する場合も同様である。 This also means that when the size difference between the heat generating component and the electronic circuit board on which the heat generating component is mounted is large, the peripheral portion of the electronic circuit board is usually used as a hole for fixing the pressing member to the electronic circuit board. The same applies to the case where the electronic circuit board fixing holes provided in the are shared.
そこで、本発明は、電子回路基板に、発熱部品の近傍の位置の孔を設けることなく、比較的簡易な構造によって、受熱板を発熱部品に良好に密着させて配置することを課題とする。 Accordingly, an object of the present invention is to dispose the heat receiving plate in good contact with the heat generating component with a relatively simple structure without providing a hole in the vicinity of the heat generating component on the electronic circuit board.
前記課題達成のために、本発明は、発熱部品が実装された基板および前記基板よりも大型で前記基板を内部に収納するフレームを備えた電子機器として、当該フレームの一部であるもしくは当該フレームに対して前記基板を介さずに固定された部材である第１のベース部材と、前記フレームの一部であるもしくは当該フレームに対して前記基板を介さずに固定された部材である第２のベース部材と、排熱を行う排熱部と、前記排熱部に熱的に接続された受熱部材と、前記第１のベース部材に前記基板を介さずに直接固定された押圧部材と、前記第２のベース部材に固定された支持部材とを備えた電子機器を提供する。ここで、前記基板の発熱部品が実装された面を第１面、前記基板の前記第１面と反対側の面を第２面として、前記基板は、前記発熱部品の前記第１面と反対側の面である当該発熱部品の上面と前記第１のベース部材と間に間隙がある形態で、前記基板の第１面が前記第１のベース部材に対向する配置で、前記フレームに対して固定されており、前記第２のベース部材は、前記基板の第２面との間に間隙がある形態で当該第２面と対向するように配置されており、前記受熱部材は、前記発熱部品の上面と前記第１のベース部材の間の間隙中に、前記基板の面の法線方向に見て、前記発熱部品の上面と重なるように配置されている。そして、前記第１のベース部材に固定された前記押圧部材は、前記受熱部材を、前記発熱部品の上面に向かう方向に押圧して、前記受熱部材を前記発熱部品の前記上面に当接させ、前記第２のベース部材に固定された支持部材は、前記基板の第２面の、前記基板の面の法線方向に見て、前記発熱部品と重なる部分もしくは当該部分周辺に当接して前記基板の第２面を支持している。 In order to achieve the above object, the present invention is a part of the frame or the frame as an electronic device including a substrate on which a heat generating component is mounted and a frame that is larger than the substrate and accommodates the substrate inside. A first base member that is a member fixed without the substrate interposed therebetween, and a second member that is a part of the frame or a member fixed to the frame without the substrate interposed therebetween. A base member, a heat exhaust part for exhausting heat, a heat receiving member thermally connected to the heat exhaust part, a pressing member fixed directly to the first base member without the substrate, and Provided is an electronic device including a support member fixed to a second base member. Here, the surface on which the heat generating component of the substrate is mounted is the first surface, the surface opposite to the first surface of the substrate is the second surface, and the substrate is opposite to the first surface of the heat generating component. In a form in which there is a gap between the upper surface of the heat generating component, which is a side surface, and the first base member, the first surface of the substrate faces the first base member, The second base member is disposed so as to face the second surface in a form having a gap between the second base member and the heat receiving component. In the gap between the upper surface of the first base member and the first base member, the upper surface of the heat generating component is disposed so as to overlap with the surface of the substrate when viewed in the normal direction. The pressing member fixed to the first base member presses the heat receiving member in a direction toward the upper surface of the heat generating component to bring the heat receiving member into contact with the upper surface of the heat generating component, The support member fixed to the second base member is in contact with a portion of the second surface of the substrate that overlaps the heat generating component or the periphery of the substrate when viewed in the normal direction of the surface of the substrate. The second surface is supported.
ここで、このような電子機器は、前記受熱部材を、前記基板の面の法線方向に見て前記発熱部品と重ならない周縁部分と、当該周縁部分に設けた前記基板の面の法線方向に当該受熱部材を貫通する孔を有するものとし、前記押圧部材を、前記受熱部材の孔に通した、前記基板の面の法線方向に、前記第１のベース部材の前記基板の第１面に対向する位置から前記基板の第１面に向けて起立した柱体と、前記受熱部材と前記第１のベース部材との間に、前記柱体が内孔に挿入され形態で配置された、前記発熱部品の上面に向かう方向に受熱部材を付勢するスプリングコイルとを有するものとして構成してもよい。 Here, in such an electronic device, the heat receiving member is viewed in the normal direction of the surface of the substrate, the peripheral portion not overlapping the heat generating component, and the normal direction of the surface of the substrate provided in the peripheral portion The first surface of the substrate of the first base member in the direction normal to the surface of the substrate, the hole passing through the hole of the heat receiving member. Between the column body standing from the position facing the first surface of the substrate and the heat receiving member and the first base member, the column body is inserted into the inner hole and arranged in a form, You may comprise as a thing which has a spring coil which urges | biases a heat receiving member in the direction which goes to the upper surface of the said heat-emitting component.
また、以上の各電子機器は、前記支持部材を、前記基板の第２面の当該支持部材が当接している部分を、前記基板の第１面に向かう方向に押圧するものとしてもよい。
また、以上の各電子機器は、前記基板を、当該基板の周縁部が前記第１のベース部材に固定されることにより、前記フレームに対して固定されているものとしてもよい。
また、以上の各電子機器は、前記排熱部は、放熱フィンと、前記放熱フィンと前記受熱部材を連結するヒートパイプとを有するものとしてもよい。
以上のような電子機器によれば、フレームの一部であるもしくは当該フレームに対して基板を介さずに固定された部材である第１のベース部材に固定した押圧部材によって、受熱部材を、前記フレームに対して固定された基板に実装された発熱部品の上面に向かう方向に押圧することにより、受熱部材を発熱部品の上面に当接させると共に、フレームの一部であるもしくは当該フレームに対して前記基板を介さずに固定された部材である第２のベース部材に固定した支持部材によって、発熱部品が実装された面の裏側の面の、前記基板の前記発熱部品が実装された部分もしくは当該部分周辺に対応する部分を支持することにより、受熱部材を発熱部品に密着させる。したがって、本電子機器においては、受熱部材を発熱部品の上面に密着させて配置するために基板の孔を用いる必要がない。また、発熱部品の上面と対向する第１のベース部材上の位置やその周辺を支点として、受熱部材に発熱部品の上面に向かう方向の力を加えることができ、また、前記発熱部品が実装された面の裏側の面の、前記基板の前記発熱部品が実装された部分もしくは当該部分周辺に対応する部分に対向する、第２のベース部材上の位置やその周辺を支点として、当該部分を支持することができるので、比較的簡易な構成によって、発熱部品に良好に密接させることができる。
Each of the electronic devices described above may be configured such that the support member is pressed in a direction toward the first surface of the substrate by a portion of the second surface of the substrate that is in contact with the support member.
In each of the electronic apparatuses described above, the substrate may be fixed to the frame by fixing a peripheral portion of the substrate to the first base member.
Further, in each of the electronic devices described above, the exhaust heat unit may include a heat radiation fin and a heat pipe that connects the heat radiation fin and the heat receiving member.
According to the electronic apparatus as described above, the heat receiving member is formed by the pressing member fixed to the first base member that is a part of the frame or a member fixed to the frame without a substrate. By pressing in the direction toward the upper surface of the heat generating component mounted on the substrate fixed to the frame, the heat receiving member is brought into contact with the upper surface of the heat generating component, and is a part of the frame or against the frame. A portion of the substrate on which the heat generating component is mounted or a portion of the back surface of the surface on which the heat generating component is mounted by the support member fixed to the second base member which is a member fixed without the substrate interposed By supporting the portion corresponding to the periphery of the portion, the heat receiving member is brought into close contact with the heat generating component. Therefore, in this electronic apparatus, it is not necessary to use the hole of the substrate in order to arrange the heat receiving member in close contact with the upper surface of the heat generating component. Further, a force in the direction toward the upper surface of the heat generating component can be applied to the heat receiving member with the position on the first base member facing the upper surface of the heat generating component and the periphery thereof as a fulcrum, and the heat generating component is mounted. The portion on the back side of the back surface is supported by the position on the second base member facing the portion where the heat generating component of the substrate is mounted or the portion corresponding to the periphery of the portion, and its periphery as a fulcrum. Therefore, the heat generating component can be satisfactorily brought into close contact with a relatively simple configuration.
また、前記課題達成のために、本発明は、発熱部品が実装された基板および前記基板よりも大型で前記基板を内部に収納するフレームを備えた電子機器として、当該フレームの一部であるもしくは当該フレームに対して前記基板を介さずに固定された部材であるベース部材と、排熱を行う排熱部と、前記排熱部に熱的に接続された受熱部材と、前記ベース部材に前記基板を介さずに直接固定された押圧部材とを備えた電子機器を提供する。ここで、前記基板の発熱部品が実装された面を第１面、前記基板の前記第１面と反対側の面を第２面として、前記基板は、前記発熱部品の前記第１面と反対側の面である当該発熱部品の上面と前記ベース部材と間に間隙がある形態で、前記基板の第１面が前記ベース部材に対向する配置で、前記フレームに対して固定されており、前記受熱部材は、前記発熱部品の上面と前記ベース部材の間の間隙中に、前記基板の面の法線方向に見て、前記発熱部品の上面と重なるように配置されている。そして、前記ベース部材に固定された前記押圧部材は、前記受熱部材が前記発熱部品の前記上面に密着するように、前記受熱部材を、前記発熱部品の上面に向かう方向に押圧している。 In order to achieve the above object, the present invention is a part of the frame as an electronic device including a board on which a heat-generating component is mounted and a frame that is larger than the board and accommodates the board inside. A base member that is a member fixed to the frame without the substrate, a heat exhaust unit that exhausts heat, a heat receiving member that is thermally connected to the heat exhaust unit, and the base member Provided is an electronic device including a pressing member that is directly fixed without using a substrate. Here, the surface on which the heat generating component of the substrate is mounted is the first surface, the surface opposite to the first surface of the substrate is the second surface, and the substrate is opposite to the first surface of the heat generating component. The first surface of the substrate is fixed to the frame in a form in which there is a gap between the upper surface of the heat generating component that is a side surface and the base member, The heat receiving member is disposed in the gap between the upper surface of the heat generating component and the base member so as to overlap the upper surface of the heat generating component when viewed in the normal direction of the surface of the substrate. The pressing member fixed to the base member presses the heat receiving member in a direction toward the upper surface of the heat generating component so that the heat receiving member is in close contact with the upper surface of the heat generating component.
以上のような電子機器によれば、フレームの一部であるもしくは当該フレームに対して基板を介さずに固定された部材であるベース部材に固定した押圧部材によって、受熱部材を、前記フレームに対して固定された基板に実装された発熱部品の上面に向かう方向に押圧することにより、受熱部材を発熱部品の上面に密着させて配置する。したがって、本電子機器においては、受熱部材を発熱部品の上面に密着させて配置するために基板の孔を用いる必要がない。また、発熱部品の上面と対向するベース部材上の位置を支点として、受熱部材に発熱部品の上面に向かう方向の力を加えることができるので、比較的簡易な構成によって、受熱部材を発熱部品に良好に密接させることができる。 According to the electronic apparatus as described above, the heat receiving member is attached to the frame by the pressing member fixed to the base member that is a part of the frame or a member fixed to the frame without a substrate. The heat receiving member is placed in close contact with the upper surface of the heat generating component by pressing in a direction toward the upper surface of the heat generating component mounted on the fixed substrate. Therefore, in this electronic apparatus, it is not necessary to use the hole of the substrate in order to arrange the heat receiving member in close contact with the upper surface of the heat generating component. In addition, since the force in the direction toward the upper surface of the heat generating component can be applied to the heat receiving member with the position on the base member facing the upper surface of the heat generating component as a fulcrum, the heat receiving member can be made into the heat generating component with a relatively simple configuration. Can be in close contact.
以上のように、本発明によれば、電子回路基板に、発熱部品の近傍の位置の孔を設けることなく、比較的簡易な構造によって、受熱板を発熱部品に良好に密着させて配置することができる。 As described above, according to the present invention, the heat receiving plate is disposed in the electronic circuit board in good contact with the heat-generating component with a relatively simple structure without providing a hole near the heat-generating component. Can do.
以下、本発明の実施形態について説明する。
図１に本実施形態に係る電子機器の構成を示す。
図１中、図１ａは電子機器の斜視図を示し、図１ｂは図１ａの面Ａによる断面によって電子機器の構造を示したものである。
図示するように、電子機器は、電子機器のフレームを形成するベースフレーム１と、ベースフレーム１に固定されたトップフレーム２とを有し、ベースフレーム１とトップフレーム２により囲まれた直方体の外形を有する。
Hereinafter, embodiments of the present invention will be described.
FIG. 1 shows the configuration of an electronic apparatus according to this embodiment.
In FIG. 1, FIG. 1a shows a perspective view of an electronic device, and FIG. 1b shows the structure of the electronic device by a section taken along plane A of FIG. 1a.
As shown in the figure, the electronic device has a base frame 1 forming a frame of the electronic device, and a top frame 2 fixed to the base frame 1, and a rectangular parallelepiped outer shape surrounded by the base frame 1 and the top frame 2. Have
ここで、以下では、便宜上、図１ａに示した上下前後左右の方向を、電子機器の上下前後左右方向として説明を行う。
さて、ベースフレーム１は概略平板形状の下板部１１と、下板部１１の周縁から上方に起立した側板部１２とよりなり、全体として概略上方が開口した箱の形状を備えている。そして、トップフレーム２は、平板形状を有し、その四隅がベースフレーム１の側板部１２の上部にネジ止され、ベースフレーム１とトップフレーム２により囲まれた概略直方体の、電子機器の内部空間を形成する。
Here, in the following, for the sake of convenience, the up / down / front / rear / left / right directions shown in FIG.
The base frame 1 is composed of a lower plate portion 11 having a substantially flat plate shape and a side plate portion 12 erected upward from the peripheral edge of the lower plate portion 11, and has a box shape whose upper portion is opened as a whole. The top frame 2 has a flat plate shape, and has four corners screwed to the upper part of the side plate portion 12 of the base frame 1, and a substantially rectangular parallelepiped internal space surrounded by the base frame 1 and the top frame 2. Form.
そして、電子機器の内部空間には、SoC (System on a Chip) ３が実装された電子回路基板４、受熱板５、サポート部材６、放熱フィン７、ヒートパイプ８などが収容されている。 An electronic circuit board 4 on which an SoC (System on a Chip) 3 is mounted, a heat receiving plate 5, a support member 6, a heat radiating fin 7, a heat pipe 8, and the like are accommodated in the internal space of the electronic device.
ベースフレーム１の下板部１１の上面上には、下板部１１から電子機器の内部空間中に上方に起立した基板固定柱１１１が形成されており、電子回路基板４は、SoC３を実装した面を下方に向けた姿勢で、電子回路基板４の周縁部において、基板固定柱１１１の上端に、SoC３の電子回路基板４と反対側の面と下板部１１の上面と間に間隙が生じる配置で、ネジ止により固定されている。 On the upper surface of the lower plate portion 11 of the base frame 1, a substrate fixing column 111 is formed so as to stand upward from the lower plate portion 11 into the internal space of the electronic device. The electronic circuit board 4 has the SoC 3 mounted thereon. With the surface facing downward, a gap is formed between the surface of the SoC 3 opposite to the electronic circuit board 4 and the upper surface of the lower plate 11 at the upper end of the substrate fixing column 111 at the periphery of the electronic circuit board 4. In the arrangement, it is fixed by screwing.
次に、サポート部材６は、トップフレーム２の下面にネジ止により固定される板バネ部６１と、サポート部材６に下部に固定された絶縁性の基板当接部６２とよりなる。そして、板バネ部６１により下方に付勢された状態で、基板当接部６２は、電子回路基板４のSoC３を実装した面の反対側の面に当接している。 Next, the support member 6 includes a leaf spring portion 61 fixed to the lower surface of the top frame 2 by screws and an insulating substrate contact portion 62 fixed to the lower portion of the support member 6. The substrate contact portion 62 is in contact with the surface of the electronic circuit board 4 opposite to the surface on which the SoC 3 is mounted while being urged downward by the leaf spring portion 61.
ここで、図１ｃに、ベースフレーム１とトップフレーム２を透視して、電子機器の内部空間を上方から見たようすを、図１ｄにベースフレーム１とトップフレーム２を透視して、電子機器の内部空間を下方から見たようすを示す。 Here, in FIG. 1c, the base frame 1 and the top frame 2 are seen through, and the internal space of the electronic device is seen from above, and in FIG. 1d, the base frame 1 and the top frame 2 are seen through, The interior space is seen from below.
図１ｃに示すように、基板当接部６２は上下方向を法線とする面による断面が中空の四角形の形状（ロの字形状）を有しており、図１ｃ、ｄに示すように、基板当接部６２は、電子回路基板４のSoC３を実装した面の反対側の面の、上下方向に見て電子回路基板４に搭載されたSoC３の周縁部と重なる部分に当接し、当該部分を板バネ部６１の付勢力により押圧している。 As shown in FIG. 1c, the substrate abutting portion 62 has a hollow quadrangular shape (b-shaped) with a cross section taken as a normal line in the vertical direction, as shown in FIGS. The substrate abutting portion 62 abuts on a portion of the surface opposite to the surface on which the SoC 3 is mounted of the electronic circuit board 4 that overlaps with the peripheral portion of the SoC 3 mounted on the electronic circuit substrate 4 when viewed in the vertical direction. Is pressed by the urging force of the leaf spring portion 61.
次に、受熱板５は、SoC３の電子回路基板４と反対側の面と下板部１１の上面と間の間隙内に、その上面がSoC３の電子回路基板４と反対側の面に密着するように配置されている。 Next, the heat receiving plate 5 is in close contact with the surface opposite to the electronic circuit board 4 of the SoC 3 in the gap between the surface of the SoC 3 opposite to the electronic circuit board 4 and the upper surface of the lower plate portion 11. Are arranged as follows.
図１ｄに示すように、受熱板５は、前後左右方向のサイズが、SoC３の前後左右方向のサイズよりも大きく、下方向から見てSoC３を覆っている。また、上下方向に見てSoC３と重ならない位置に孔が設けられている。 As shown in FIG. 1d, the heat receiving plate 5 is larger in size in the front / rear / right / left direction than the front / rear / left / right size of the SoC 3 and covers the SoC 3 when viewed from below. In addition, a hole is provided at a position that does not overlap with the SoC 3 when viewed in the vertical direction.
そして、この孔に上方から通したネジ５１の下部をベースフレーム１の下板部１１の上面に螺着することにより、受熱板５はネジ５１に沿って上下方向に移動可能に配置されている。また、受熱板５の下面側と下板部１１の上面との間に、ネジ５１を内孔に挿入したスプリングコイル５２が配置されており、このスプリングコイル５２によって、受熱板５は上方に付勢されている。そして、このスプリングコイル５２の上方への付勢力によって、受熱板５は上方に押圧され、受熱板５の上面がSoC３の電子回路基板４と反対側の面に密着する。 The heat receiving plate 5 is arranged so as to be movable in the vertical direction along the screw 51 by screwing the lower portion of the screw 51 passed through the hole from above into the upper surface of the lower plate portion 11 of the base frame 1. . Further, a spring coil 52 in which a screw 51 is inserted into the inner hole is disposed between the lower surface side of the heat receiving plate 5 and the upper surface of the lower plate portion 11, and the heat receiving plate 5 is attached upward by the spring coil 52. It is energized. The heat receiving plate 5 is pressed upward by the upward biasing force of the spring coil 52, and the upper surface of the heat receiving plate 5 is in close contact with the surface of the SoC 3 opposite to the electronic circuit board 4.
なお、SoC３の電子回路基板４と反対側の面には、受熱板５の上面との密着度を高めるために放熱グリスを塗布しておくことが好ましい。
次に、放熱フィン７はトップフレーム２にネジ止されることにより、トップフレーム２の下面側に配置される。そして、図１ｄに示すように、ヒートパイプ８は、一端が受熱板５の下面に連結し、他端が、放熱フィン７に連結している。
In addition, it is preferable to apply heat-dissipating grease on the surface of the SoC 3 opposite to the electronic circuit board 4 in order to increase the degree of adhesion with the upper surface of the heat receiving plate 5.
Next, the heat radiating fins 7 are arranged on the lower surface side of the top frame 2 by being screwed to the top frame 2. As shown in FIG. 1 d, the heat pipe 8 has one end connected to the lower surface of the heat receiving plate 5 and the other end connected to the radiation fin 7.
したがって、SoC３の熱は受熱板５に伝導し、ヒートパイプ８によって放熱フィン７に輸送され、放熱フィン７において排熱される。そして、この結果、SoC３が冷却される。
さて、このような構成において、上述した電子回路基板４のSoC３を実装した面の反対側の面を押圧するサポート部材６は、スプリングコイル５２から受熱板５、SoC３を介して電子回路基板４に加えられる上向きの力によって、電子回路基板４が変形等せずに、受熱板５の上面がSoC３の電子回路基板４と反対側の面に良好に密接するように設けられている。
Therefore, the heat of the SoC 3 is conducted to the heat receiving plate 5, transported to the heat radiating fins 7 by the heat pipes 8, and exhausted by the heat radiating fins 7. As a result, the SoC 3 is cooled.
In such a configuration, the support member 6 that presses the surface of the electronic circuit board 4 opposite to the surface on which the SoC 3 is mounted is applied from the spring coil 52 to the electronic circuit board 4 via the heat receiving plate 5 and the SoC 3. The upper surface of the heat receiving plate 5 is provided in good contact with the surface opposite to the electronic circuit board 4 of the SoC 3 without the electronic circuit board 4 being deformed by the upward force applied.
以上、本実施形態に係る電子機器の構成について説明した。
このように、本実施形態に係る電子機器によれば、電子回路基板４のSoC３の近傍に孔を設けることなく、ヒートパイプ８を介して放熱フィン７に連結している受熱板５を、SoC３の電子回路基板４と反対側の面に密着配置することができる。
The configuration of the electronic device according to the present embodiment has been described above.
Thus, according to the electronic apparatus according to the present embodiment, the heat receiving plate 5 connected to the heat radiating fins 7 via the heat pipes 8 is provided without providing a hole in the vicinity of the SoC 3 of the electronic circuit board 4. The electronic circuit board 4 can be disposed in close contact with the surface opposite to the electronic circuit board 4.
また、図２に、本実施形態に係る電子機器の分解図を示すように、電子機器は、放熱フィン７とヒートパイプ８と受熱板５のアッセンブリ、SoC３を実装した電子回路基板４、サポート部材６を取り付けたトップフレーム２を、順次、上方よりネジ止していくだけの簡易な作業で、その組み立てを行うことができる。 In addition, as shown in an exploded view of the electronic device according to the present embodiment in FIG. 2, the electronic device includes an assembly of heat radiation fins 7, heat pipes 8 and a heat receiving plate 5, an electronic circuit board 4 on which the SoC 3 is mounted, a support member. The top frame 2 to which the frame 6 is attached can be assembled by a simple operation by simply screwing the top frame 2 from above.
ところで、以上の実施形態に係る電子機器は、図３ａに示すように受熱板５の形状を、受熱板５の上下方向に見てSoC３の電子回路基板４と反対側の面と重ならない周縁の部分を下方に折り曲げた形状として、スプリングコイル５２からの力が、より効率良く、受熱板５の上面をSoC３の電子回路基板４と反対側の面に密着させる力として受熱板５に加わるようにしてもよい。 By the way, the electronic device according to the above embodiment has a peripheral edge that does not overlap the surface of the SoC 3 opposite to the electronic circuit board 4 when the shape of the heat receiving plate 5 is viewed in the vertical direction of the heat receiving plate 5 as shown in FIG. As the portion is bent downward, the force from the spring coil 52 is applied to the heat receiving plate 5 as a force that makes the upper surface of the heat receiving plate 5 closely contact the surface of the SoC 3 opposite to the electronic circuit board 4. May be.
また、実施形態に係る電子機器は、ＥＭＣ対策のために、図３ｂに示すように、ネジ５１のヘッドと電子回路基板４のSoC３を搭載した面とで挟み込むように、導電性の弾性体１００を設けると共に、電子回路基板４の弾性体１００が当接する部分にＧＮＤパターンを形成することにより、受熱板５と電子回路基板４のＧＮＤを導通するようにしてもよい。 In addition, as shown in FIG. 3B, the electronic device according to the embodiment has a conductive elastic body 100 sandwiched between the head of the screw 51 and the surface on which the SoC 3 of the electronic circuit board 4 is mounted, as shown in FIG. In addition, a GND pattern may be formed in a portion where the elastic body 100 of the electronic circuit board 4 abuts to make the heat receiving plate 5 and the GND of the electronic circuit board 4 conductive.
なお、この場合、ネジ５１、スプリングコイル５２としては導電性のものを用い、ベースフレーム１が絶縁性の部材である場合には、さらに、図示するように、ネジ５１にスプリングコイル５２と当接するフランジを設ける。このようにすることにより、弾性体１００とネジ５１を介して、もしくは、弾性体１００とネジ５１とスプリングコイル５２を介して、受熱板５と電子回路基板４のＧＮＤパターンとが電気的に接続する。 In this case, conductive materials are used as the screws 51 and the spring coils 52, and when the base frame 1 is an insulating member, the springs 52 are brought into contact with the screws 51 as shown in the drawing. Provide a flange. By doing so, the heat receiving plate 5 and the GND pattern of the electronic circuit board 4 are electrically connected via the elastic body 100 and the screw 51, or via the elastic body 100, the screw 51 and the spring coil 52. To do.
また、実施形態に係る電子機器は、電子回路基板４が充分な剛性を備えている場合には、図３ｃに示すようにサポート部材６を省略して構成するようにしてもよい。
また、以上の実施形態では、スプリングコイル５２を用いて、受熱板５にSoC３の電子回路基板４と反対側の面に密着させる力を加えたが、スプリングコイル５２に代えて板バネや、その他の付勢部材や弾性体を用いて、受熱板５にSoC３の電子回路基板４と反対側の面に密着させる力を加えるようにしてもよい。同様に、サポート部材６を、板バネ部６１によって絶縁性の基板当接部６２に、電子回路基板４のSoC３を実装した面の反対側の面を押圧する力を加えたが、板バネ部６１に代えて、スプリングコイルや、その他の付勢部材や弾性体を用いて基板当接部６２に電子回路基板４のSoC３を実装した面の反対側の面を押圧する力を加えるようにしてもよい。
In addition, when the electronic circuit board 4 has sufficient rigidity, the electronic device according to the embodiment may be configured by omitting the support member 6 as shown in FIG.
In the above embodiment, the spring coil 52 is used to apply a force to the heat receiving plate 5 to be in close contact with the surface of the SoC 3 opposite to the electronic circuit board 4. A force for bringing the heat receiving plate 5 into close contact with the surface of the SoC 3 opposite to the electronic circuit board 4 may be applied using an urging member or an elastic body. Similarly, a force is applied to the support member 6 to press the surface opposite to the surface on which the SoC 3 of the electronic circuit board 4 is mounted on the insulating substrate contact portion 62 by the leaf spring portion 61. Instead of 61, a force that presses the surface of the electronic circuit board 4 opposite to the surface on which the SoC 3 is mounted is applied to the board contact portion 62 using a spring coil, other urging members, or an elastic body. Also good.
また、以上の実施形態では、SoC３に対して受熱板５を密着配置し、SoC３の冷却を行う場合について示したが、SoC３に代えてCPUなどのICや、その他の任意の発熱部品に対して受熱板５を密着配置して冷却を行うようにしてもよい。 In the above embodiment, the heat receiving plate 5 is disposed in close contact with the SoC 3 and the SoC 3 is cooled. However, in place of the SoC 3, an IC such as a CPU or any other heat generating component is used. The heat receiving plate 5 may be arranged in close contact to perform cooling.
また、以上の実施形態では、電子回路基板４とネジ５１をフレームを形成するベースフレーム１に固定したが、電子回路基板４とネジ５１は、ベースフレーム１に代えて、電子回路基板４との配置関係が、以上で示した下板部１１と電子回路基板４と同様の配置関係にある、ベースフレーム１に対して電子回路基板４を介さずに固定された他の部材に固定してもよい。また、同様に、以上の実施形態では、サポート部材６をフレームを形成するトップフレーム２に固定したが、サポート部材６は、トップフレーム２に代えて、電子回路基板４との配置関係が、以上で示したトップフレーム２と電子回路基板４と同様の配置関係にある、ベースフレーム１に対して電子回路基板４を介さずに固定された他の部材に固定するようにしてもよい。 In the above embodiment, the electronic circuit board 4 and the screw 51 are fixed to the base frame 1 forming the frame. However, the electronic circuit board 4 and the screw 51 are connected to the electronic circuit board 4 instead of the base frame 1. Even if the arrangement relationship is fixed to another member fixed to the base frame 1 without the electronic circuit board 4 having the same arrangement relation as the lower plate portion 11 and the electronic circuit board 4 described above. Good. Similarly, in the above embodiment, the support member 6 is fixed to the top frame 2 forming the frame. However, the support member 6 has an arrangement relationship with the electronic circuit board 4 instead of the top frame 2. The top frame 2 and the electronic circuit board 4 shown in FIG. 5 may be fixed to another member fixed to the base frame 1 without the electronic circuit board 4 interposed therebetween.
１…ベースフレーム、２…トップフレーム、３…SoC、４…電子回路基板、５…受熱板、６…サポート部材、７…放熱フィン、８…ヒートパイプ、１１…下板部、１２…側板部、５１…ネジ、５２…スプリングコイル、６１…板バネ部、６２…基板当接部、１００…弾性体、１１１…基板固定柱。 DESCRIPTION OF SYMBOLS 1 ... Base frame, 2 ... Top frame, 3 ... SoC, 4 ... Electronic circuit board, 5 ... Heat receiving plate, 6 ... Support member, 7 ... Radiation fin, 8 ... Heat pipe, 11 ... Lower plate part, 12 ... Side plate part , 51, screws, 52, spring coils, 61, leaf springs, 62, substrate contact portions, 100, elastic bodies, 111, substrate fixing columns.
Claims (6)
当該フレームの一部であるもしくは当該フレームに対して前記基板を介さずに固定された部材である第１のベース部材と、前記フレームの一部であるもしくは当該フレームに対して前記基板を介さずに固定された部材である第２のベース部材と、排熱を行う排熱部と、前記排熱部に熱的に接続された受熱部材と、前記第１のベース部材に前記基板を介さずに直接固定された押圧部材と、前記第２のベース部材に固定された支持部材とを有し、
前記基板の発熱部品が実装された面を第１面、前記基板の前記第１面と反対側の面を第２面として、前記基板は、前記発熱部品の前記第１面と反対側の面である当該発熱部品の上面と前記第１のベース部材と間に間隙がある形態で、前記基板の第１面が前記第１のベース部材に対向する配置で、前記フレームに対して固定されており、
前記第２のベース部材は、前記基板の第２面との間に間隙がある形態で当該第２面と対向するように配置されており、
前記受熱部材は、前記発熱部品の上面と前記第１のベース部材の間の間隙中に、前記基板の面の法線方向に見て、前記発熱部品の上面と重なるように配置されており
前記第１のベース部材に固定された前記押圧部材は、前記受熱部材を、前記発熱部品の上面に向かう方向に押圧して、前記受熱部材を前記発熱部品の前記上面に当接させ、
前記第２のベース部材に固定された支持部材は、前記基板の第２面の、前記基板の面の法線方向に見て、前記発熱部品と重なる部分もしくは当該部分周辺に当接して前記基板の第２面を支持していることを有することを特徴とする電子機器。 An electronic device including a board on which a heat generating component is mounted and a frame that is larger than the board and accommodates the board therein,
A first base member that is a part of the frame or a member fixed to the frame without the substrate, and a first base member that is a part of the frame or the frame without the substrate A second base member that is fixed to the heat sink, a heat exhaust portion that performs exhaust heat, a heat receiving member that is thermally connected to the heat exhaust portion, and the first base member without the substrate interposed therebetween. A pressing member fixed directly to the second base member, and a supporting member fixed to the second base member,
The surface of the substrate on which the heat generating component is mounted is the first surface, the surface opposite to the first surface of the substrate is the second surface, and the substrate is the surface opposite to the first surface of the heat generating component. The first surface of the substrate is fixed to the frame in such a manner that there is a gap between the upper surface of the heat generating component and the first base member, and the first surface of the substrate is opposed to the first base member. And
The second base member is disposed to face the second surface in a form having a gap between the second surface of the substrate,
The heat receiving member is disposed in a gap between the upper surface of the heat generating component and the first base member so as to overlap the upper surface of the heat generating component when viewed in the normal direction of the surface of the substrate. The pressing member fixed to the first base member presses the heat receiving member in a direction toward the upper surface of the heat generating component to bring the heat receiving member into contact with the upper surface of the heat generating component,
The support member fixed to the second base member is in contact with a portion of the second surface of the substrate that overlaps the heat generating component or the periphery of the substrate when viewed in the normal direction of the surface of the substrate. An electronic apparatus comprising supporting the second surface of the electronic device.
前記受熱部材は、前記基板の面の法線方向に見て前記発熱部品と重ならない周縁部分と、当該周縁部分に設けた前記基板の面の法線方向に当該受熱部材を貫通する孔を有し、
前記押圧部材は、前記受熱部材の孔に通した、前記基板の面の法線方向に、前記第１のベース部材の前記基板の第１面に対向する位置から前記基板の第１面に向けて起立した柱体と、前記受熱部材と前記第１のベース部材との間に、前記柱体が内孔に挿入され形態で配置された、前記発熱部品の上面に向かう方向に受熱部材を付勢するスプリングコイルとを有することを特徴とする電子機器。 The electronic device according to claim 1,
The heat receiving member has a peripheral portion that does not overlap the heat generating component when viewed in the normal direction of the surface of the substrate, and a hole that penetrates the heat receiving member in the normal direction of the surface of the substrate provided in the peripheral portion. And
The pressing member is directed from the position facing the first surface of the substrate of the first base member toward the first surface of the substrate in the normal direction of the surface of the substrate that has passed through the hole of the heat receiving member. The heat receiving member is attached in a direction toward the upper surface of the heat generating component, in which the pillar is inserted and inserted into an inner hole between the heat rising member, the heat receiving member, and the first base member. An electronic device comprising a spring coil for biasing.
前記支持部材は、前記基板の第２面の当該支持部材が当接している部分を、前記基板の第１面に向かう方向に押圧していることを特徴とする電子機器。 The electronic device according to claim 1 or 2,
The electronic device according to claim 1, wherein the support member presses a portion of the second surface of the substrate that is in contact with the support member in a direction toward the first surface of the substrate.
前記基板は、当該基板の周縁部が前記第１のベース部材に固定されることにより、前記フレームに対して固定されていることを特徴とする電子機器。 The electronic device according to claim 1, 2, or 3,
The electronic device is characterized in that the substrate is fixed to the frame by fixing a peripheral portion of the substrate to the first base member.
前記排熱部は、放熱フィンと、前記放熱フィンと前記受熱部材を連結するヒートパイプとを有することを特徴とする電子機器。 The electronic device according to claim 1, 2, 3 or 4,
The said heat exhaust part has a heat radiating fin, and the heat pipe which connects the said heat radiating fin and the said heat receiving member, The electronic device characterized by the above-mentioned.
当該フレームの一部であるもしくは当該フレームに対して前記基板を介さずに固定された部材であるベース部材と、排熱を行う排熱部と、前記排熱部に熱的に接続された受熱部材と、前記ベース部材に前記基板を介さずに直接固定された押圧部材とを有し、
前記基板の発熱部品が実装された面を第１面、前記基板の前記第１面と反対側の面を第２面として、前記基板は、前記発熱部品の前記第１面と反対側の面である当該発熱部品の上面と前記ベース部材と間に間隙がある形態で、前記基板の第１面が前記ベース部材に対向する配置で、前記フレームに対して固定されており、
前記受熱部材は、前記発熱部品の上面と前記ベース部材の間の間隙中に、前記基板の面の法線方向に見て、前記発熱部品の上面と重なるように配置されており
前記ベース部材に固定された前記押圧部材は、前記受熱部材が前記発熱部品の前記上面に密着するように、前記受熱部材を、前記発熱部品の上面に向かう方向に押圧していることを特徴とする電子機器。 An electronic device including a board on which a heat generating component is mounted and a frame that is larger than the board and accommodates the board therein,
A base member that is a part of the frame or is a member fixed to the frame without the substrate interposed therebetween, a heat exhaust unit that exhausts heat, and a heat receiver that is thermally connected to the heat exhaust unit A member, and a pressing member fixed directly to the base member without the substrate,
The surface of the substrate on which the heat generating component is mounted is the first surface, the surface opposite to the first surface of the substrate is the second surface, and the substrate is the surface opposite to the first surface of the heat generating component. The first surface of the substrate is fixed with respect to the frame in a form in which there is a gap between the upper surface of the heat generating component and the base member,
The heat receiving member is disposed in a gap between the upper surface of the heat generating component and the base member so as to overlap the upper surface of the heat generating component when viewed in the normal direction of the surface of the substrate. The electronic device according to claim 1, wherein the fixed pressing member presses the heat receiving member in a direction toward the upper surface of the heat generating component such that the heat receiving member is in close contact with the upper surface of the heat generating component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017126732A JP2019009399A (en) | 2017-06-28 | 2017-06-28 | Electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017126732A JP2019009399A (en) | 2017-06-28 | 2017-06-28 | Electronic apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2019009399A true JP2019009399A (en) | 2019-01-17 |
Family
ID=65029712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017126732A Pending JP2019009399A (en) | 2017-06-28 | 2017-06-28 | Electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2019009399A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111669932A (en) * | 2020-07-10 | 2020-09-15 | Oppo广东移动通信有限公司 | Circuit board assembly and electronic equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004186294A (en) * | 2002-12-02 | 2004-07-02 | Denso Corp | Electronic apparatus |
| JP2005057070A (en) * | 2003-08-05 | 2005-03-03 | Matsushita Electric Ind Co Ltd | Heat radiating structure of electronic equipment |
| JP2006310668A (en) * | 2005-04-28 | 2006-11-09 | Sharp Corp | Structure and method for fixing radiating board on electronic device |
| JP2007201351A (en) * | 2006-01-30 | 2007-08-09 | Toshiba Corp | Electronic appliance |
| JP2010086071A (en) * | 2008-09-29 | 2010-04-15 | Toshiba Corp | Electronic apparatus |
| JP2010225949A (en) * | 2009-03-25 | 2010-10-07 | Kyocera Corp | Heat radiation structure of heating element |
| WO2011158615A1 (en) * | 2010-06-18 | 2011-12-22 | シャープ株式会社 | Heat dissipation structure for electronic device |
| JP2016184659A (en) * | 2015-03-26 | 2016-10-20 | 日本電気株式会社 | Cooling device, and device |
-
2017
- 2017-06-28 JP JP2017126732A patent/JP2019009399A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004186294A (en) * | 2002-12-02 | 2004-07-02 | Denso Corp | Electronic apparatus |
| JP2005057070A (en) * | 2003-08-05 | 2005-03-03 | Matsushita Electric Ind Co Ltd | Heat radiating structure of electronic equipment |
| JP2006310668A (en) * | 2005-04-28 | 2006-11-09 | Sharp Corp | Structure and method for fixing radiating board on electronic device |
| JP2007201351A (en) * | 2006-01-30 | 2007-08-09 | Toshiba Corp | Electronic appliance |
| JP2010086071A (en) * | 2008-09-29 | 2010-04-15 | Toshiba Corp | Electronic apparatus |
| JP2010225949A (en) * | 2009-03-25 | 2010-10-07 | Kyocera Corp | Heat radiation structure of heating element |
| WO2011158615A1 (en) * | 2010-06-18 | 2011-12-22 | シャープ株式会社 | Heat dissipation structure for electronic device |
| JP2016184659A (en) * | 2015-03-26 | 2016-10-20 | 日本電気株式会社 | Cooling device, and device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111669932A (en) * | 2020-07-10 | 2020-09-15 | Oppo广东移动通信有限公司 | Circuit board assembly and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4799296B2 (en) | Electronics | |
| JP6722540B2 (en) | Heat dissipation structure and electronic equipment | |
| TWI495423B (en) | Thermal module and electronic device incorporating the same | |
| JP5473261B2 (en) | Imaging device | |
| JP4438526B2 (en) | Power component cooling system | |
| JP2011009522A (en) | Electronic unit | |
| JP4656047B2 (en) | Electronic device casing structure and power supply device | |
| JP2019009399A (en) | Electronic apparatus | |
| JP2013201233A (en) | Power supply device | |
| JP2017108007A (en) | Heat radiation structure for heat evolution electronic component and manufacturing method for the same | |
| JP2006286757A (en) | Heat dissipation structure of electronic apparatus | |
| JP7115032B2 (en) | substrate | |
| JP6265260B2 (en) | Power module | |
| JP6895065B2 (en) | Electronic component mounts and power supplies | |
| JP2020053649A (en) | Electronic apparatus | |
| JP4845914B2 (en) | Electronic equipment cooling structure | |
| TW201633891A (en) | Motor control device | |
| JP2009295626A (en) | Heat radiation structure of electronic device | |
| JP4460057B2 (en) | Heat dissipation structure | |
| JP6570149B2 (en) | Electronics | |
| JP2016131218A (en) | Heat radiation device | |
| JP6982776B2 (en) | Heat dissipation devices for heat-generating electronic components, in-vehicle chargers, and vehicles | |
| TWI413889B (en) | Heat dissipation device | |
| JPH11233979A (en) | Heat radiating structure for electronic equipment and power unit using the same | |
| WO2013153667A1 (en) | Heat dissipation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200306 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210114 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210209 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20210817 |