JP2018533221A5 - - Google Patents

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Publication number
JP2018533221A5
JP2018533221A5 JP2018521509A JP2018521509A JP2018533221A5 JP 2018533221 A5 JP2018533221 A5 JP 2018533221A5 JP 2018521509 A JP2018521509 A JP 2018521509A JP 2018521509 A JP2018521509 A JP 2018521509A JP 2018533221 A5 JP2018533221 A5 JP 2018533221A5
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JP
Japan
Prior art keywords
substrate
wire
peeling
leading edge
moving
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JP2018521509A
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English (en)
Japanese (ja)
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JP2018533221A (ja
JP6873986B2 (ja
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Priority claimed from PCT/US2016/059014 external-priority patent/WO2017075151A1/en
Publication of JP2018533221A publication Critical patent/JP2018533221A/ja
Publication of JP2018533221A5 publication Critical patent/JP2018533221A5/ja
Application granted granted Critical
Publication of JP6873986B2 publication Critical patent/JP6873986B2/ja
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JP2018521509A 2015-10-30 2016-10-27 第２基板に接合された第１基板を加工する方法 Active JP6873986B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562248823P 2015-10-30 2015-10-30
US62/248,823 2015-10-30
PCT/US2016/059014 WO2017075151A1 (en) 2015-10-30 2016-10-27 Methods for processing a first substrate bonded to a second substrate

Publications (3)

Publication Number Publication Date
JP2018533221A JP2018533221A (ja) 2018-11-08
JP2018533221A5 true JP2018533221A5 (https=) 2019-12-05
JP6873986B2 JP6873986B2 (ja) 2021-05-19

Family

ID=58631130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018521509A Active JP6873986B2 (ja) 2015-10-30 2016-10-27 第２基板に接合された第１基板を加工する方法

Country Status (6)

Country Link
US (1) US10814603B2 (https=)
JP (1) JP6873986B2 (https=)
KR (1) KR102622227B1 (https=)
CN (1) CN108353507B (https=)
TW (1) TWI688315B (https=)
WO (1) WO2017075151A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108155086A (zh) * 2017-12-13 2018-06-12 武汉华星光电半导体显示技术有限公司 一种分离玻璃基板与柔性oled显示面板的方法及设备
US11007765B2 (en) 2018-03-02 2021-05-18 The Boeing Company Edge delamination methods and systems
KR102476313B1 (ko) * 2021-02-04 2022-12-13 (주)미래컴퍼니 보호 필름 박리 장치 및 이를 이용한 박리 방법
JPWO2024053565A1 (https=) 2022-09-05 2024-03-14
CN119092421B (zh) * 2024-08-09 2025-12-19 东莞触点智能装备有限公司 非破坏性测量晶圆键合强度的方法

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JP2001210998A (ja) * 2000-01-21 2001-08-03 Denso Corp フレキシブル基板の実装方法とそれに使用する補強板
JP2003288028A (ja) * 2001-12-25 2003-10-10 Canon Inc 画像表示装置の分解方法、画像表示装置の製造方法、支持体の製造方法、画像表示部の製造方法、加工材料の製造方法、および画像表示装置
US8118075B2 (en) * 2008-01-18 2012-02-21 Rockwell Collins, Inc. System and method for disassembling laminated substrates
KR100891384B1 (ko) 2007-06-14 2009-04-02 삼성모바일디스플레이주식회사 플렉서블 기판 접합 및 탈착장치
JP2009186962A (ja) * 2007-07-17 2009-08-20 Sony Chemical & Information Device Corp 表示装置の製造方法
EP2268489A1 (en) * 2008-04-11 2011-01-05 The Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University Method and apparatus for debonding a submounted substrate
TWI381919B (zh) * 2008-11-04 2013-01-11 Htc Corp 分離裝置及分離方法
JP2012509513A (ja) * 2008-11-20 2012-04-19 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー ディスプレイを剥離するための半自動化再生法
TWI350790B (en) * 2009-02-10 2011-10-21 Htc Corp Cutting apparatus
JP5070360B2 (ja) * 2009-09-14 2012-11-14 シャープ株式会社 粘着フィルムの剥離装置及び剥離方法
WO2011045862A1 (ja) * 2009-10-16 2011-04-21 ソニーケミカル＆インフォメーションデバイス株式会社 表示装置及びその製造方法、並びに透明樹脂充填剤
US8852391B2 (en) 2010-06-21 2014-10-07 Brewer Science Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
KR101949561B1 (ko) 2012-10-12 2019-02-18 코닝 인코포레이티드 잔류 강도를 갖는 제품
US10220537B2 (en) * 2012-10-17 2019-03-05 Saxum, Llc Method and apparatus for display screen shield replacement
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
TW201429708A (zh) 2012-12-13 2014-08-01 Corning Inc 玻璃及製造玻璃物品的方法
JP6016108B2 (ja) 2012-12-18 2016-10-26 旭硝子株式会社 基板の剥離装置及び剥離方法並びに電子デバイスの製造方法
CN103921531B (zh) * 2013-01-14 2016-03-02 元太科技工业股份有限公司 分离设备
JP6003675B2 (ja) 2013-01-25 2016-10-05 旭硝子株式会社 基板の剥離装置及び剥離方法並びに電子デバイスの製造方法
CN103384447B (zh) 2013-06-26 2016-06-29 友达光电股份有限公司 软性电子装置
WO2015012261A1 (ja) 2013-07-23 2015-01-29 日本電気硝子株式会社 ガラスフィルムの製造方法およびガラスフィルムの剥離方法
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CN103676282A (zh) * 2013-12-23 2014-03-26 合肥京东方光电科技有限公司 触摸屏和显示屏分离装置及分离方法
EP3099484A1 (en) 2014-01-27 2016-12-07 Corning Incorporated Treatment of a surface modification layer for controlled bonding of thin sheets with carriers
SG11201606059WA (en) 2014-01-27 2016-08-30 Corning Inc Articles and methods for controlled bonding of polymer surfaces with carriers
WO2015112958A1 (en) 2014-01-27 2015-07-30 Corning Incorporated Articles and methods for controlled bonding of thin sheets with carriers
KR20150117769A (ko) 2014-04-10 2015-10-21 삼성디스플레이 주식회사 소자 기판 제조 방법
CN104503623A (zh) * 2015-01-06 2015-04-08 合肥鑫晟光电科技有限公司 触摸面板与显示模组的分离方法及系统
US9517615B2 (en) * 2015-04-21 2016-12-13 The Boeing Company System and method for automated backing film removal
CN107635769B (zh) 2015-05-19 2020-09-15 康宁股份有限公司 使片材与载体粘结的制品和方法
KR102344731B1 (ko) * 2015-06-26 2021-12-30 엘지디스플레이 주식회사 액정표시장치의 분리장치
JP7106276B2 (ja) 2015-06-26 2022-07-26 コーニング インコーポレイテッド シート及び担体を有する物品及び方法

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